CN113488282A - Cable with cooling function, current transmission equipment and electric automobile - Google Patents
Cable with cooling function, current transmission equipment and electric automobile Download PDFInfo
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- CN113488282A CN113488282A CN202110821578.3A CN202110821578A CN113488282A CN 113488282 A CN113488282 A CN 113488282A CN 202110821578 A CN202110821578 A CN 202110821578A CN 113488282 A CN113488282 A CN 113488282A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/42—Insulated conductors or cables characterised by their form with arrangements for heat dissipation or conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/32—Insulated conductors or cables characterised by their form with arrangements for indicating defects, e.g. breaks or leaks
- H01B7/324—Insulated conductors or cables characterised by their form with arrangements for indicating defects, e.g. breaks or leaks comprising temperature sensing means
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
This paper provides a cable, current transmission equipment and electric automobile with cooling function, belongs to the current transmission field, and wherein, the cable that has cooling function includes: the semiconductor cooling module, the conductor and the control module; the cooling end of the semiconductor cooling module is arranged on at least one side surface of the conductor and used for absorbing the heat dissipation of the conductor; the semiconductor cooling module is electrically connected with the control module, and the control module is used for controlling the electric signal supplied to the semiconductor cooling module. The cable with the cooling function has the advantages of simple structure, flexible size, reliable performance, no noise generation and no refrigerant pollution.
Description
Technical Field
This paper relates to the current transmission field, especially relates to a cable, current transmission equipment and electric automobile with cooling function.
Background
With the influence of energy crisis in the world and increasingly severe weather warming, the new energy automobile industry is vigorously developed in various countries, and the electric automobile industry is vigorously developed in China at present, but the charging time of the electric automobile is long at present, so that the bottleneck for limiting the universal use of the electric automobile is formed. At present, the current for rapidly charging the electric automobile reaches 150-400A, and the high heat productivity of the charging cable is brought by the large current, and the high heat productivity is also the main reason for limiting the charging current of the electric automobile.
In order to solve this problem, it is first necessary to increase the cross-sectional area of the cable and reduce the heat generation of the cable, but the cost of the cable is greatly increased. And secondly, cooling the cable by adopting a cooling technology.
At present, liquid cooling and air cooling technologies are mostly adopted for cooling the large-current charging cable. Although the liquid cooling technology has a good cooling effect, a cooling pipeline, a water pump, a heat dissipation device and the like need to be additionally arranged, and the problems of complex system structure, extremely high requirements on safety and stability and cost increase are also caused. The air cooling technology is limited by the installation size space, and has the problems of low cooling efficiency, additional Noise generation and influence on the NVH (Noise, Vibration and Harshness) of the whole vehicle.
Therefore, in the field of current transmission, a cable with a cooling function, which can quickly cool the cable, improve the charging current and reduce the sectional area of the cable, is urgently needed.
Disclosure of Invention
The liquid cooling device is used for solving the problems of complex structure and high cost of the liquid cooling technology for cooling the conductor in the prior art, and the problems of low cooling efficiency and high noise of the air cooling technology for cooling the conductor.
In order to solve the above technical problem, a first aspect herein provides a cable having a cooling function, including: a semiconductor cooling module 101, a conductor 102, and a control module 103;
the cooling end of the semiconductor cooling module 101 is arranged on at least one side surface of the conductor 102 and used for absorbing heat dissipation of the conductor 102;
the semiconductor cooling module 101 is electrically connected to the control module 103, and the control module 103 is used for controlling the electric signal supplied to the semiconductor cooling module 101.
As a further embodiment herein, the semiconductor cooling module 101 comprises a plurality of semiconductor cooling modules 101, and the plurality of semiconductor cooling modules 101 are connected to the control module 103 in parallel.
As a further embodiment herein, the semiconductor cooling module 101 comprises a plurality of semiconductor cooling modules 101, and the plurality of semiconductor cooling modules 101 are connected in series with the control module 103.
As a further embodiment herein, a plurality of said semiconductor cooling modules 101 are arranged at intervals of a predetermined distance on at least one side of said conductor 102.
In a further embodiment, the proportion of the total cooling end area of the semiconductor cooling module 101 to the conductor 102 area is in the range of 3% to 95%.
As a further embodiment herein, the cable with cooling function further comprises: and the rectifying module 104 is electrically connected between the control module 103 and the conductor 102 and is used for rectifying the electric energy obtained from the conductor 102.
As a further embodiment herein, the cable with cooling function further comprises: at least one temperature detector 105, disposed on the conductor 102, for detecting a temperature value of the conductor 102;
the control module 103 is electrically connected to the temperature detector 105, and is configured to adjust an electrical signal supplied to the semiconductor cooling module 101 according to a temperature value detected by the temperature detector 105.
As a further embodiment herein, when the temperature detector 105 is plural, adjusting the electric signal supplied to the semiconductor cooling module 101 according to the temperature value detected by the temperature detector 105 includes:
calculating the temperature distribution of the conductor 102 according to the temperature value detected by the temperature detector 105;
determining a power supply signal of each semiconductor cooling module 101 on the conductor 102 according to the temperature distribution of the conductor 102;
the power is supplied to each of the semiconductor cooling modules 101 in accordance with the power supply signal of each of the semiconductor cooling modules 101.
In a further embodiment of the present disclosure, the control module 103 is further electrically connected to the charging module 200 connected to the conductor 102, and is configured to obtain a charging/discharging current value and a charging duration, and adjust the electrical signal supplied to the semiconductor cooling module 101 according to the charging/discharging current value, the charging duration, and the temperature value detected by the temperature detector 105.
As a further embodiment herein, the adjusting of the electrical signal supplied to the semiconductor cooling module by the control module 103 according to the charging and discharging current value, the charging time and the temperature value detected by the temperature detector includes:
calculating the heat productivity of the conductor according to the charge and discharge current value and the charge duration;
calculating a theoretical temperature rise value of the conductor 102 according to the conductor heating value and the material information of the conductor 102;
calculating an actual temperature rise value of the conductor 102 according to the temperature value detected by the temperature detector 105 and the theoretical temperature rise value of the conductor 102;
the electrical signal supplied to the semiconductor cooling module 101 is adjusted according to the actual temperature rise value of the conductor 102. As a further embodiment herein, adjusting the electrical signal supplied to the semiconductor cooling module 101 according to the actual temperature rise value of the conductor 102 comprises:
calculating a difference value between an actual temperature rise value of the conductor 102 and a preset temperature rise value of the conductor 102;
inputting the difference value into a PID control strategy to obtain an electric control signal of the semiconductor cooling module 101;
adjusting the electrical signal supplied to the semiconductor cooling module 101 according to the semiconductor cooling module 101 electrical control signal;
and the control parameters in the PID control strategy are adjusted in advance according to the PID control indexes.
In a further embodiment of the present disclosure, the control module 103 is further electrically connected to an environmental parameter detection module and the charging module 200 connected to the conductor 102, and is configured to obtain environmental parameter information from the environmental parameter detection module, and obtain a charging/discharging current value and a charging duration from the charging module 200; and adjusting the electric signal supplied to the semiconductor cooling module 101 according to the environmental parameter information, the charging and discharging current value and the charging duration.
As a further embodiment herein, the wires of the semiconductor cooling module 101 connected to the control module 103 are provided in a low voltage wire harness 106.
As a further embodiment herein, the semiconductor cooling module 101 comprises: an alumina substrate 1011, a waterproof protective layer 1012, a semiconductor P/N layer 1013, and a power interface 1014;
the aluminum oxide substrate 1011, the waterproof protective layer 1012 and the semiconductor P/N layer 1013 are arranged in sequence;
the power interface 1014 is electrically connected to the semiconductor P/N layer 1013.
As a further embodiment herein, the cooling rate of the semiconductor cooling module 101 is 0.05K/s to 5K/s.
As a further embodiment herein, the cable with cooling function further comprises: and an insulating protective layer 107 provided between the conductor 102 and the semiconductor cooling module 101 or provided on an outer surface of the semiconductor cooling module 101.
In a further embodiment, the material of the insulating protection layer 107 is one or more of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene.
As a further embodiment herein, the cross-section of the conductor 102 is circular, elliptical, rectangular, polygonal, E-shaped, F-shaped, H-shaped, K-shaped, L-shaped, T-shaped, U-shaped, V-shaped, W-shaped, X-shaped, Y-shaped, Z-shaped, arc-shaped, or wave-shaped.
In further embodiments, the material of the conductor 102 is one or more of a metal, a conductive ceramic, a carbon-containing conductor, a solid electrolyte, a mixed conductor, and a conductive polymer material.
In a further embodiment, the conductor 102 is made of copper or copper alloy or aluminum alloy.
As a further embodiment herein, the cable with cooling function further comprises: and a heat sink disposed outside the semiconductor cooling module 101.
A second aspect herein provides a current transfer device comprising: the cable 100, the charging module 200 and the battery module 300 with the cooling function according to any of the embodiments;
both ends of the cable 100 with a cooling function are respectively connected to the charging module 200 and the battery module 300, and are used for transmitting the electric energy obtained by the charging module 200 to the battery module 300.
As a further embodiment herein, the control module 103 is connected to a charging module 200, and the charging module 200 is used for providing electric energy to the control module 103.
A third aspect herein provides an electric vehicle comprising a current transfer device as described in any preceding embodiment.
According to the cable with the cooling function, the current transmission device and the electric automobile, the cooling layer structure made of the semiconductor cooling module is arranged on the side face of the conductor, the semiconductor cooling module is powered by the control module, heat generated by the conductor can be absorbed by the semiconductor cooling module when the conductor passes through high-voltage large current, the purpose of reducing conductor temperature rise is achieved, and when the size of the conductor is fixed, larger current can be borne and the requirement of temperature rise is met. The cable with the cooling function provided by the invention can realize the cooling of the conductor only by the semiconductor cooling module and the control module, and therefore, the cable has the advantage of simple structure. The cable with the cooling function provided herein only needs to dispose the semiconductor cooling pattern on the conductor side, and thus, has an advantage of dimensional flexibility. The cable with the cooling function provided by the invention has the advantages that the control module controls the electric signal supply of the semiconductor cooling module, so that the semiconductor cooling module cools the conductor, and the cable with the cooling function has reliable performance, generates no noise and is free from refrigerant pollution.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 illustrates a block diagram of a cable having a cooling function according to embodiments herein;
FIGS. 2A and 2B illustrate a cross-sectional view of a cable having cooling functionality according to embodiments herein;
FIG. 3 illustrates another cross-sectional view of a cable having a cooling function according to embodiments herein;
FIG. 4 illustrates a first circuit diagram of a cable having a cooling function according to embodiments herein;
FIG. 5 illustrates a second circuit diagram of a cable having a cooling function according to embodiments herein;
FIG. 6 shows an enlarged partial view of a cable having a cooling function according to embodiments herein;
FIG. 7 illustrates a first flowchart of a process for a control module to adjust an electrical signal of a semiconductor cooling module in accordance with an embodiment herein;
FIG. 8 illustrates a second flowchart of the process of the control module adjusting the electrical signal of the semiconductor cooling module according to embodiments herein;
FIG. 9 illustrates a third flowchart of the process of the control module adjusting the electrical signal of the semiconductor cooling module according to embodiments herein;
FIG. 10 shows a cross-sectional view of a current transfer device of embodiments herein;
FIG. 11 illustrates a block diagram of a semiconductor cooling module according to embodiments herein;
FIG. 12 is a block diagram illustrating a computer device according to an embodiment of the present disclosure.
Description of the symbols of the drawings:
100. a cable having a cooling function;
101. a semiconductor cooling module;
102. a conductor;
103. a control module;
104. a rectification module;
105. a temperature detector;
106. a low voltage wire harness;
107. an insulating protective layer;
200. a charging module;
300. a battery module;
1011. an alumina substrate;
1012. a waterproof protective layer;
1013. a semiconductor P/N layer;
1014. a power interface;
1302. a computer device;
1304. a processor;
1306. a memory;
1308. a drive mechanism;
1310. an input/output module;
1312. an input device;
1314. an output device;
1316. a presentation device;
1318. a graphical user interface;
1320. a network interface;
1322. a communication link;
1324. a communication bus.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments herein without making any creative effort, shall fall within the scope of protection.
The present specification provides method steps as described in the examples or flowcharts, but may include more or fewer steps based on routine or non-inventive labor. The order of steps recited in the embodiments is merely one manner of performing the steps in a multitude of orders and does not represent the only order of execution. When an actual system or apparatus product executes, it can execute sequentially or in parallel according to the method shown in the embodiment or the figures.
The illustrative embodiments and descriptions herein are presented for purposes of illustration and not of limitation. Additionally, the same or similar numbered elements/components used in the drawings and the embodiments are used to represent the same or similar parts.
In the prior art, the cooling of the large-current conductor is mainly realized by adopting a liquid cooling and air cooling technology. Wherein, the liquid cooling technique needs additionally to increase cooling pipeline, water pump and heat abstractor etc. and there is the system architecture complicacy, and is extremely high to safety and stability requirement, still can lead to the problem that the cost improves. The air cooling technology is limited by the installation size space, and the problems of low cooling efficiency, extra noise and influence on the NVH of the whole vehicle exist.
In order to solve the above technical problems, in an embodiment of the present disclosure, a novel cable with a cooling function is provided, and the cable with a cooling function provided herein has the advantages of simple structure, flexible size, reliable performance, no noise generation, and no refrigerant pollution.
Specifically, as shown in fig. 1 and 5, the cable having a cooling function includes: a semiconductor cooling module 101, a conductor 102, and a control module 103;
the cooling end of the semiconductor cooling module 101 is disposed on at least one side of the conductor 102 for absorbing heat dissipation of the conductor 102.
The semiconductor cooling module 101 is electrically connected to the control module 103, and the control module 103 is used for controlling the electric signal supplied to the semiconductor cooling module 101.
In detail, the semiconductor cooling module 101 is, in principle, a heat transfer tool. When a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. The semiconductor cooling module 101 described herein may include a hot end opposite to the cooling end in addition to the cooling end, the semiconductor cooling module 101 may be a semiconductor cooling module existing in the prior art, and may be customized according to the size of the conductor, and the semiconductor cooling module 101 may completely cover the conductor 102 or may partially cover the conductor 102.
The heat release or absorption of the semiconductor cooling module 101 is determined by the current, so that the semiconductor cooling module 101 described herein can be used to control the electrical signals (including the current signal and the voltage signal) supplied to the semiconductor cooling module 101 through the control module 103, thereby achieving the effect of controlling the temperature rise of the conductor 102, and enabling the cable with the cooling function to operate at a stable temperature.
The control module 103 supplies power (for example, low-voltage 12V dc power) to the semiconductor cooling module 101, and the control module 103 can realize access control of the semiconductor cooling module 101 by controlling conduction of a connection wire between the control module 103 and the semiconductor cooling module 101, and in specific implementation, a worker can set control logic of the semiconductor cooling module 101 according to actual requirements, for example, different semiconductor cooling modules 101 are accessed in different time periods, or different electrical signals of the conductor 102 are accessed in different semiconductor cooling modules 101, and herein, no limitation is made on the logic of electrical signals controlled by the control module 103 and supplied to the semiconductor cooling module, and any logic capable of realizing electrical signal control belongs to the scope of protection herein. Through the power supply and control mode, the structure of the cable with the cooling function can be simplified, the cooling efficiency is improved, and the energy waste is avoided.
The control module 103 may be a Central Processing Unit (CPU), or other programmable general purpose or special purpose Microprocessor (Microprocessor), Digital Signal Processor (DSP), programmable control module, Application Specific Integrated Circuit (ASIC), or other similar components or combinations thereof, and the type, model, etc. of the control module 103 is not limited herein.
In some embodiments, in order to enable the semiconductor cooling module 101 to be completely attached to the conductor 102, the semiconductor cooling module 101 may include a plurality of semiconductor cooling modules 101, and the sizes of the plurality of semiconductor cooling modules 101 may be the same or different, and are adjusted according to the size of the conductor.
In some embodiments, the maximum size of the semiconductor cooling module 101 may be 60mmX60mm or more, the thickness is 4.1mm or less, the maximum cooling power may reach 270W, and the maximum temperature difference of a single layer may reach 60 ℃ or more.
Further, in order to be able to accurately control the temperature of each semiconductor cooling module 101, a plurality of semiconductor cooling modules 101 are electrically connected to the control module 103 in parallel, so that the power supply signal of each semiconductor cooling module 101 can be individually controlled.
Further, when the models and powers of the plurality of semiconductor cooling modules 101 are completely identical, the plurality of semiconductor cooling modules 101 are electrically connected to the control module 103 in series, so that the power supply signals of each semiconductor cooling module 101 are identical.
The semiconductor cooling modules 101 may be disposed at regular intervals (e.g., 10cm as shown in fig. 1, and the specific interval may depend on the temperature rise of the semiconductor cooling modules 101), on the side of the conductor 102, or may be disposed next to (i.e., without a gap) the side of the conductor 102, and the specific arrangement may be determined according to the temperature rise of the conductor 102 in the operating state.
In order to ensure the cooling effect, the proportion of the total area of the cooling ends in the semiconductor cooling module 101 to the area of the conductor 102 is in the range of 3% to 95%.
In order to verify the influence of the proportion range of the total cooling end area in the semiconductor cooling module 101 to the conductor 102 area on the temperature rise of the conductor 102, 13 cables with the same cross section area, the same material and the same length are selected, the same current is applied, the area proportion of the cooling end covering the conductor 102 in different semiconductor cooling modules 101 is adopted, the temperature rise value of each cable is read, and the temperature rise value is recorded in table 1.
The experimental method is that in a closed environment, cables covering different semiconductor cooling modules 101, of which the total cooling end area accounts for the area of the conductor 102, are conducted with the same current, the temperature before energization and the temperature after energization are recorded when the temperature is stable, and the absolute value is obtained by taking the difference. In this embodiment, a temperature rise of less than 50k is a qualified value.
Table 1: influence of the ratio of the total cooling end area to the conductor 102 area in different semiconductor cooling modules 101 on cable temperature rise
As can be seen from table 1 above, when the ratio of the total cooling-end area in the semiconductor cooling module 101 to the area of the conductor 102 is less than 3%, the temperature rise value of the cable is less than the acceptable value. The larger the ratio of the covered area, the smaller the temperature rise value, but during the use of the cable, the joints at both ends and the middle turning area are inevitably present, which cannot cover the semiconductor cooling module 101, so the inventor set the ratio of the total area of the cooling ends in the semiconductor cooling module 101 to the area of the conductor 102 to 3% to 95%.
As shown in fig. 2A, the semiconductor cooling module 101 is fixed on the conductor 102 by a heat conducting adhesive, and in a specific implementation, the semiconductor cooling module 101 may also be fixed on the conductor 102 by other means, such as screw fixation, which is not limited herein. Under the working condition that the requirement on the vibration level is high, the semiconductor cooling module 101 can be fixed in a mode of additionally adding a fixing frame, so that the damping capacity is improved.
In order to improve heat dissipation efficiency, the semiconductor cooling modules 101 are provided on both sides of the conductor 102. In a further embodiment, according to the use condition of the conductor, when the cooling requirement is large, multi-stage refrigeration can be realized by adopting a mode of overlapping the multiple layers of semiconductor cooling modules 101, and the cooling capacity is further improved. As shown in fig. 3, a double-layer semiconductor cooling module 101 may also be provided on both sides of the conductor 102.
The cable 100 with the cooling function provided by the embodiment can absorb heat generated by the semiconductor cooling module 101 covered outside the conductor 102 when passing high voltage and large current, so as to achieve the purpose of reducing the temperature rise of the conductor, and can bear larger current and meet the temperature rise requirement when the size of the conductor 102 is fixed.
In a further embodiment herein, as shown in fig. 4, the cable with cooling function further comprises: and the rectifying module 104 is electrically connected between the control module 103 and the conductor 102, and is used for rectifying the electric energy obtained from the conductor 102 and converting the current in the conductor 102 into the supply current of the control module 103. Since neither the current nor the voltage transmitted by the conductor 102 necessarily satisfies the power supply requirements of the control module 103 and the semiconductor cooling module 101, in order to obtain the electric energy from the conductor 102, the current drawn from the conductor 102 needs to be converted into the current and the voltage that can be used by the control module 103 and the semiconductor cooling module 101 through the rectifier module.
In the embodiment, the power supply can be omitted, the conductor 102 supplies power to the control module, the circuit can be simplified, a plurality of circuits for supplying power to the control module 103 and the semiconductor cooling module 101 can be reduced, and the situation that the semiconductor cooling module 101 cannot work due to the fact that an external power supply is out of power can be avoided.
In a further embodiment herein, the cable with cooling function further comprises: the temperature detector is arranged on the conductor and used for detecting the temperature value of the conductor; the control module is electrically connected to the temperature detector, and is configured to adjust an electrical signal supplied to the semiconductor cooling module 101 according to a temperature value detected by the temperature detector.
In further embodiments herein, as shown in fig. 1, 5 and 6, the cable with cooling function further comprises: and a plurality of temperature detectors 105 distributed on the conductor 102 for detecting the temperature value of the conductor 102. In particular, the more the temperature detectors 105 are arranged and distributed more evenly, the more the detected temperature is consistent with the actual situation.
The control module 103 is electrically connected to the temperature detector 105, and adjusts an electric signal supplied to the semiconductor cooling module 101 according to a temperature value detected by the temperature detector 105.
In some embodiments, the process of the control module 103 adjusting the electrical signal supplied to the semiconductor cooling module 101 according to the temperature value detected by the temperature detector 105 includes: calculating the difference value between the temperature value detected by the temperature detector 105 and the preset temperature rise value of the conductor 102; inputting the difference value into a PID control strategy to obtain an electric control signal of the semiconductor cooling module 101; adjusting the electrical signal supplied to the semiconductor cooling module 101 according to the semiconductor cooling module 101 electrical control signal; and the control parameters in the PID control strategy are adjusted in advance according to the PID control indexes.
In specific implementation, the preset temperature rise value may be determined according to an application scenario of the conductor and a maximum temperature rise value that the conductor can bear, and specific values thereof are not limited herein.
The cable that has the cooling function that this embodiment provided can real-time detection temperature and control heat absorption behind the increase control by temperature change function, realizes closed-loop control. The temperature rise of the conductor can be controlled differently according to the current-carrying capacity of the conductor under different conditions.
In one embodiment, as shown in fig. 7, when there are a plurality of temperature detectors 105, the adjusting, by the control module 103, the electric signal supplied to the semiconductor cooling module 101 according to the temperature value detected by the temperature detectors 105 includes:
in step 701, the temperature distribution of the conductor 102 is calculated based on the temperature value detected by the temperature detector 105.
In specific implementation, the temperature distribution of the conductor 102 may be established by a B-spline interpolation method, and in specific implementation, the temperature distribution of the conductor 102 may also be established by other modeling methods, and the temperature distribution establishing process is not specifically limited herein.
In this step, the higher the temperature of the conductor 102, the larger the power supply signal of the semiconductor cooling module 101 corresponding to the higher the temperature. In particular, the control module 103 may determine the power supply signal of each semiconductor cooling module 101 on the conductor 102 according to a preset temperature adjustment strategy (as shown in table 2).
TABLE 2 temperature range of conductor detected by temperature detector and corresponding relation of control module supply current
| Temperature range (. degree.C.) | Current (A) |
| X1～X2 | Y1 |
| X2～X3 | Y2 |
| …… | …… |
And 703, supplying power to each semiconductor cooling module 101 according to the power supply signal of each semiconductor cooling module 101.
In one embodiment of the present invention, the step 702 of determining the supply current of each semiconductor cooling module 101 on the conductor 102 according to the temperature distribution of the conductor 102 includes:
step 7021, calculating a difference distribution according to the temperature distribution of the conductor 102 and a preset temperature rise value of the conductor 102;
step 7022, the electrical signal supplied to the semiconductor cooling module 101 is adjusted according to the difference distribution.
In specific implementation, step 7022 includes: inputting the difference distribution into a PID control strategy to obtain a control signal of the electric signal of the semiconductor cooling module 101; adjusting the electrical signal supplied to the semiconductor cooling module 101 according to the semiconductor cooling module 101 electrical control signal; and the control parameters in the PID control strategy are adjusted in advance according to the PID control indexes.
In a further embodiment of the present disclosure, in order to more precisely adjust the electrical signal of the semiconductor cooling module 101, the control module 103 is further electrically connected to the charging module 200 connected to the conductor 102 for obtaining the charging/discharging current value and the charging duration, and adjusting the electrical signal supplied to the semiconductor cooling module 101 according to the charging/discharging current value, the charging duration and the temperature value detected by the temperature detector.
Specifically, as shown in fig. 8, the adjusting of the electrical signal supplied to the semiconductor cooling module by the control module 103 according to the charging/discharging current value, the charging duration and the temperature value detected by the temperature detector includes:
In this step, Q ═ I can be used2And multiplying the conductor heating value by x R x t, wherein Q is the conductor heating value, I is the charging and discharging current value, t is the charging time length, and R is the conductor resistance.
And step 802, calculating a theoretical temperature rise value of the conductor according to the heat productivity of the conductor and the material information of the conductor.
The conductor heating value is the charging and discharging heating value. The theoretical temperature rise value of the conductor can be calculated through the following formula, and the following formula can be obtained through fitting of test data obtained through conductor temperature rise experiments:
wherein, tauwFor theoretical temperature rise, Q is conductor heating value, t is charging duration, A is effective heat dissipation area, and KTFor the comprehensive heat dissipation coefficient, A and K, of the conductor surfaceTIs the material information of the conductor.
The theoretical temperature rise value of the conductor can be calculated according to the heat productivity of the conductor and the material information of the conductor by referring to the prior art, and is not limited herein.
And 803, calculating an actual temperature rise value of the conductor according to the temperature value detected by the temperature detector and the theoretical temperature rise value of the conductor.
The execution process of the step comprises the following steps: firstly, determining a temperature rise correction coefficient according to the temperature value detected by the temperature detector, specifically, if the temperature detected by the temperature detector is greater than the temperature rise calculation standard temperature value, the temperature correction coefficient is greater than 1, and the coefficient is also large when the temperature detected by the temperature detector is higher. If the temperature detected by the temperature detector is smaller than the standard temperature value for temperature rise calculation, the temperature correction coefficient is smaller than 1, and the lower the temperature detected by the temperature detector is, the smaller the coefficient is. Calculating an actual temperature rise value of the conductor by the following formula:
τ＝Kw×τw；
wherein, tauwIs the theoretical temperature rise value, Kwτ is the actual temperature rise value for the temperature correction coefficient.
And step 804, adjusting the electric signal supplied to the semiconductor cooling module according to the actual temperature rise value of the conductor.
According to the embodiment, the temperature value detected by the temperature detector and the actual temperature rise value obtained by prediction in advance can be combined according to the charging and discharging information, and the electric signal of the semiconductor cooling module 101 is adjusted according to the actual temperature rise value, so that the temperature of the conductor can reach the working temperature as soon as possible, and the efficiency and the precision of temperature control can be improved.
In a further embodiment of this document, as shown in fig. 9, in order to make the semiconductor cooling module 101 with current adjustment capability, the step 804 adjusts the electrical signal supplied to the semiconductor cooling module 101 according to the actual temperature rise value of the conductor 102, and includes:
and step 902, inputting the difference value into a PID control strategy to obtain an electric control signal of the semiconductor cooling module 101.
When the actual temperature rise value of the conductor 102 is equal to the preset temperature rise value, the temperature of the conductor 102 can be controlled within the preset temperature rise value, the safety of the conductor 102 is ensured, and the electric control signal of the semiconductor cooling module 101 cannot be generated at the moment.
And the control parameters in the PID control strategy are adjusted in advance according to the PID control indexes. The PID control strategy includes: proportional control, integral control and differential control. The PID control indicators include: rise time, overshoot, settling time, and steady state error. The adjustment of the control parameters in the PID control strategy can be referred to in the prior art and will not be described in detail here.
In a further embodiment of the present disclosure, in order to improve the temperature control accuracy of the conductor and make the calculated value thereof more conform to the actual situation, the control module 103 is further electrically connected to the environment parameter detection module and the charging module 200 connected to the conductor, and is configured to obtain the environment parameter information from the environment parameter detection module, and obtain the charging and discharging current value and the charging duration from the charging module; and adjusting the electric signal supplied to the semiconductor cooling module according to the environmental parameter information, the charging and discharging current value and the charging duration.
In detail, the environmental parameter information includes, but is not limited to: ambient humidity, ambient temperature, ambient pressure, etc.
Adjusting the electrical signal supplied to the semiconductor cooling module according to the environmental parameter information, the charge-discharge current value and the charge duration comprises:
(1) and calculating the heat productivity of the conductor according to the charging and discharging current value and the charging time.
(2) The theoretical temperature rise value of the conductor 102 is calculated from the conductor heat generation amount and the material information of the conductor.
(3) The actual temperature rise value of the conductor 102 is calculated based on the environmental parameter information and the theoretical temperature rise value of the conductor 102.
In this step, the execution process of this step includes: firstly, determining a temperature rise correction coefficient according to environment parameter information, specifically, calculating a correction coefficient for each environment parameter information (the calculation process of each correction coefficient refers to the temperature correction coefficient described in the previous embodiment, and is not described in detail here), and performing weighted summation (shown in the following formula one) or multiplication (shown in the following formula two) on the correction coefficients corresponding to all the environment parameter information to obtain a final correction coefficient; the final correction factor is multiplied by the theoretical temperature rise value of the conductor 102 to calculate the actual temperature rise value of the conductor 102.
K＝a1×Kw1+……+an×Kwn(formula one);
K＝a1×Kw1×……×Kwn(formula two);
wherein K is the final correction coefficient; is a coefficient of1…anThe known quantity can be determined according to the importance degree of the environmental parameters; a is a known amount; i represents the ith environmental parameter; kw1…KwnIs an environmental parameter value.
(4) The electrical signal supplied to the semiconductor cooling module 101 is adjusted according to the actual temperature rise value of the conductor 102.
In further embodiments herein, as shown in fig. 1, 6 and 10, the wires of the semiconductor cooling module 101 connected to the control module 103 are disposed in the low voltage wire harness 106.
The wire connecting the semiconductor cooling module 101 with the control module 103 is arranged in the low-voltage wire harness 106, so that the circuit is clear, the semiconductor cooling module is convenient to adjust and replace, and meanwhile, the safety isolation of a high-voltage and low-voltage power supply system can be realized.
In a further embodiment herein, as shown in fig. 11, the semiconductor cooling module 101 comprises: an alumina substrate 1011, a waterproof protective layer 1012, a semiconductor P/N layer 1013, and a power interface 1014.
The alumina substrate 1011, the waterproof protective layer 1012, and the semiconductor P/N layer 1013 are sequentially provided. Power interface 1014 electrically connects semiconductor P/N layer 1013.
The alumina substrate 1011 constitutes a hot end, i.e., a heat radiation end, of the semiconductor cooling module 101. The semiconductor P/N layer 1013 constitutes a cooling end, i.e., a heat sink end, of the semiconductor cooling module 101.
This embodiment passes through aluminium oxide base board 1011 as the surface of semiconductor refrigeration module, can improve the heat conductivity for heat transfer rate is faster, and the refrigeration time is shorter, and the intensity that can bear is big, but and flexonics, can paste better and cover on the conductor, and the effective absorption conductor buckles the surface stress of department, is difficult broken in installation and use. The semiconductor cooling module core part adopts a P-N junction formed by special semiconductor materials, when a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material has current flowing through, heat transfer can be generated between two ends, the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end, namely, refrigeration control can be realized by controlling direct current.
The cooling rate of the semiconductor cooling module 101 is 0.05K/s to 5K/s.
In order to verify the influence of the cooling rate of the semiconductor cooling module 101 on the temperature rise of the conductor 102, the inventor selects 10 cables with the same cross section, the same material and the same length, applies the same current, adopts the semiconductor cooling modules 101 with different cooling rates, cools the cables, reads the temperature rise value of each cable, and records the temperature rise value in table 3.
In the experimental method, in a closed environment, the same current is conducted to the cables of the semiconductor cooling module 101 with different cooling rates, the temperature before the energization and the temperature after the energization are stable are recorded, and the absolute value of the difference is obtained. In this embodiment, a temperature rise of less than 50K is a qualified value.
Table 3: influence of semiconductor cooling modules 101 with different cooling rates on cable temperature rise
As can be seen from table 3 above, when the cooling rate of the semiconductor cooling module 101 is less than 0.05K/s, the temperature rise value of the cable is less than the qualified value, and the larger the cooling rate of the semiconductor cooling module 101, the smaller the temperature rise value. However, when the cooling rate of the semiconductor cooling module 101 is greater than 5K/s, the temperature rise value is not significantly reduced due to the heat generation of the cable itself and the power of the semiconductor cooling module 101 itself, but the power of the semiconductor cooling module 101 is increased, which is not economical. Therefore, the inventors set the cooling rate of the semiconductor cooling module 101 to 0.05K/s to 5K/s.
In a further embodiment herein, in order to ensure the safety of the conductor, an insulating protection layer 107 is disposed around the conductor 102, as shown in fig. 2A and 2B, the insulating protection layer 107 is disposed between the conductor 102 and the semiconductor cooling module 101, or disposed on the outer side of the semiconductor cooling module 101.
In further embodiments, the material of the insulating protection layer 107 is one or more of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene.
Furthermore, in order to avoid burning the conductor due to fire, a fire-resistant layer is arranged outside the insulating protective layer.
In further embodiments herein, the cross-section of the conductor 102 is in a circular or elliptical or rectangular or polygonal shape or an E-shape or an F-shape or an H-shape or a K-shape or an L-shape or a T-shape or a U-shape or a V-shape or a W-shape or an X-shape or a Y-shape or a Z-shape or an arc-shape or a wave-shape structure, wherein the arc-shape includes a semi-arc shape, an acute arc shape, an obtuse arc shape, and the like. The cross-sectional shape of the conductor 102 is designed into various shapes, so that designers can conveniently select the cross-sections of the conductors 102 with different shapes according to the actual arrangement environment, the volume of the cable is reduced, the cable assembly environment is optimized, and the safety of the cable is improved.
In further embodiments herein, the material of the conductor 102 described herein may be one or more of a metal, a conductive ceramic, a carbon-containing conductor, a solid electrolyte, a mixed conductor, and a conductive polymer material.
In specific implementation, the conductor 102 is made of copper or copper alloy or aluminum alloy, the cable of the electric vehicle needs to use a wire with a large wire diameter for conducting current due to high voltage and large current, and the copper conductor material has good conductivity and ductility, and is preferable as the cable conductor material. However, as copper prices have increased, the material cost for using copper materials as the conductive wires has become higher. For this reason, alternatives to metallic copper are being sought to reduce costs. The content of metal aluminum in the earth crust is about 7.73%, the price is relatively low after the refining technology is optimized, the weight of the aluminum is lighter than that of copper, the conductivity is only inferior to that of the copper, and the aluminum can replace part of the copper in the field of electrical connection. Therefore, aluminum is a trend in the field of automotive electrical connection to replace copper.
In a further embodiment herein, to further improve the heat dissipation effect, the cable with a cooling function further includes: the heat dissipation device is disposed outside the semiconductor cooling module 101, and in an implementation, the heat dissipation device may be close to the outer side surface of the semiconductor cooling module 101 or closely attached to the outer side surface of the semiconductor cooling module 101, depending on the type of the heat dissipation device.
The heat dissipation device described herein includes, but is not limited to, fans, heat exchangers, liquid cooling devices, and heat dissipating fins, which are preferably made of metal. Wherein, the major equipment such as fan, heat exchanger, liquid cooling device sets up in the position that is close to semiconductor cooling module 101, and the fin that dispels the heat is hugged closely semiconductor cooling module 101 and is set up. In a further embodiment herein, as shown in fig. 5, there is also provided a current transfer device comprising: the cable 100, the charging module 200 and the battery module 300 with the cooling function according to any of the embodiments described above.
Both ends of the cable 100 with a cooling function are respectively connected to the charging module 200 and the battery module 300, and are used for conducting the electric energy obtained by the charging module 200 to the battery module 300.
In some embodiments, the charging module 200 described herein is a cradle, and the battery module 300 is a bms (battery management system) battery management module.
In a further embodiment herein, the control module 103 is further connected to a charging module 200, and the charging module 200 is used for providing power to the control module 103.
In a further embodiment herein, there is also provided an electric vehicle comprising the current transfer apparatus of any of the preceding embodiments.
In further embodiments herein, the method performed by the control module may be performed in a computer device, e.g., a central control device, as shown in fig. 12, which may include one or more processors 1304, such as one or more Central Processing Units (CPUs), each of which may implement one or more hardware threads. Computer device 1302 may also include any memory 1306 for storing any kind of information, such as code, settings, data, etc. For example, without limitation, memory 1306 may include any one or more of the following in combination: any type of RAM, any type of ROM, flash memory devices, hard disks, optical disks, etc. More generally, any memory may use any technology to store information. Further, any memory may provide volatile or non-volatile retention of information. Further, any memory may represent fixed or removable components of computer device 1302. In one case, when processor 1304 executes associated instructions that are stored in any memory or combination of memories, computer device 1302 may perform any of the operations of the associated instructions. The computer device 1302 also includes one or more drive mechanisms 1308, such as a hard disk drive mechanism, an optical drive mechanism, etc., for interacting with any memory.
Corresponding to the methods in fig. 7-9, the embodiments herein also provide a computer-readable storage medium having stored thereon a computer program, which, when executed by a processor, performs the steps of the above-described method.
Embodiments herein also provide computer readable instructions, wherein when executed by a processor, a program thereof causes the processor to perform the method as shown in fig. 7-9.
It should be understood that, in various embodiments herein, the sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments herein.
It should also be understood that, in the embodiments herein, the term "and/or" is only one kind of association relation describing an associated object, meaning that three kinds of relations may exist. For example, a and/or B, may represent: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
Those of ordinary skill in the art will appreciate that the elements and algorithm steps of the examples described in connection with the embodiments disclosed herein may be embodied in electronic hardware, computer software, or combinations of both, and that the components and steps of the examples have been described in a functional general in the foregoing description for the purpose of illustrating clearly the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the several embodiments provided herein, it should be understood that the disclosed system, apparatus, and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may also be an electric, mechanical or other form of connection.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purposes of the embodiments herein.
In addition, functional units in the embodiments herein may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present invention may be implemented in a form of a software product, which is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the methods described in the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
The principles and embodiments of this document are explained herein using specific examples, which are presented only to aid in understanding the methods and their core concepts; meanwhile, for the general technical personnel in the field, according to the idea of this document, there may be changes in the concrete implementation and the application scope, in summary, this description should not be understood as the limitation of this document.
Claims (24)
1. A cable having a cooling function, comprising: a semiconductor cooling module (101), a conductor (102), and a control module (103);
the cooling end of the semiconductor cooling module (101) is arranged on at least one side surface of the conductor (102) and is used for absorbing heat dissipation of the conductor (102);
the semiconductor cooling module (101) is electrically connected with the control module (103), and the control module (103) is used for controlling the electric signal supplied to the semiconductor cooling module (101).
2. The cable with a cooling function according to claim 1, wherein the semiconductor cooling module (101) comprises a plurality of semiconductor cooling modules (101), and the plurality of semiconductor cooling modules (101) are connected to the control module (103) in parallel.
3. The cable with a cooling function according to claim 1, wherein the semiconductor cooling module (101) comprises a plurality of semiconductor cooling modules (101), and the plurality of semiconductor cooling modules (101) are connected in series to the control module (103).
4. A cable having a cooling function according to claim 2 or 3, wherein a plurality of said semiconductor cooling modules (101) are provided at intervals of a predetermined distance on at least one side of said conductor (102).
5. A cable with cooling function according to claim 1, characterized in that the proportion of the total cooling end area in the semiconductor cooling module (101) to the area of the conductor (102) ranges from 3% to 95%.
6. The cable having a cooling function according to claim 1, further comprising: and the rectifying module (104) is electrically connected between the control module (103) and the conductor (102) and is used for rectifying the electric energy obtained from the conductor (102).
7. The cable having a cooling function according to claim 1, further comprising: at least one temperature detector (105) arranged on the conductor (102) for detecting a temperature value of the conductor (102);
the control module (103) is electrically connected with the temperature detector (105) and is used for adjusting the electric signal supplied to the semiconductor cooling module (101) according to the temperature value detected by the temperature detector (105).
8. The cable with cooling function according to claim 7, wherein when the temperature detector (105) is plural, adjusting the electric signal supplied to the semiconductor cooling module (101) according to the temperature value detected by the temperature detector (105) comprises:
calculating a temperature distribution of the conductor (102) from the temperature values detected by the temperature detector (105);
determining a power supply signal of each semiconductor cooling module (101) on the conductor (102) according to the temperature distribution of the conductor (102);
and supplying power to each semiconductor cooling module (101) according to the power supply signal of each semiconductor cooling module (101).
9. The cable with cooling function according to claim 7, wherein said control module (103) is further electrically connected to a charging module (200) connected to said conductor (102) for obtaining a charging/discharging current value and a charging time period, and adjusting an electric signal supplied to said semiconductor cooling module (101) according to said charging/discharging current value, said charging time period and a temperature value detected by said temperature detector (105).
10. The cable with a cooling function according to claim 9, wherein the control module (103) adjusts the electric signal supplied to the semiconductor cooling module (101) according to the charge and discharge current value, the charging time period, and the temperature value detected by the temperature detector (105), and comprises:
calculating the heat productivity of the conductor according to the charge and discharge current value and the charge duration;
calculating a theoretical temperature rise value of the conductor (102) according to the conductor heating value and material information of the conductor (102);
calculating an actual temperature rise value of the conductor (102) according to the temperature value detected by the temperature detector (105) and the theoretical temperature rise value of the conductor (102);
the electrical signal supplied to the semiconductor cooling module (101) is adjusted according to the actual temperature rise value of the conductor (102).
11. Cable with cooling function according to claim 10, characterized in that adjusting the electrical signal supplied to the semiconductor cooling module (101) according to the actual temperature rise value of the conductor (102) comprises:
calculating a difference between an actual temperature rise value of the conductor (102) and a preset temperature rise value of the conductor (102);
inputting the difference value into a PID control strategy to obtain an electric control signal of the semiconductor cooling module (101);
adjusting an electrical signal supplied to the semiconductor cooling module (101) in accordance with the semiconductor cooling module (101) electrical control signal;
and the control parameters in the PID control strategy are adjusted in advance according to the PID control indexes.
12. The cable with cooling function according to claim 7, wherein the control module (103) is further electrically connected to an environmental parameter detection module and a charging module (200) connected to the conductor (102), and is configured to obtain environmental parameter information from the environmental parameter detection module, and obtain a charging/discharging current value and a charging duration from the charging module (200); and adjusting the electric signal supplied to the semiconductor cooling module (101) according to the environmental parameter information, the charging and discharging current value and the charging duration.
13. The cable with a cooling function according to claim 1, wherein a wire of the semiconductor cooling module (101) connected to the control module (103) is provided in a low voltage harness (106).
14. Cable with cooling according to claim 1, characterized in that the semiconductor cooling module (101) comprises: an alumina substrate (1011), a waterproof protective layer (1012), a semiconductor P/N layer (1013), and a power interface (1014);
the aluminum oxide substrate (1011), the waterproof protective layer (1012) and the semiconductor P/N layer (1013) are arranged in sequence;
the power interface (1014) is electrically connected to the semiconductor P/N layer (1013).
15. Cable with cooling according to claim 14, characterized in that the cooling rate of the semiconductor cooling module (101) is 0.05-5K/s.
16. The cable having a cooling function according to claim 1, further comprising: and an insulating protective layer (107) disposed between the conductor (102) and the semiconductor cooling module (101) or disposed on an outer surface of the semiconductor cooling module (101).
17. The cable with cooling function according to claim 16, wherein the material of the insulating protective layer (107) is one or more of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, and polyethylene.
18. Cable with cooling function according to claim 1, wherein the cross-section of the conductor (102) is in a circular or elliptical or rectangular or polygonal or E-shaped or F-shaped or H-shaped or K-shaped or L-shaped or T-shaped or U-shaped or V-shaped or W-shaped or X-shaped or Y-shaped or Z-shaped or arc-shaped or wave-shaped structure.
19. The cable with cooling function according to claim 1, wherein the material of the conductor (102) is one or more of metal, conductive ceramic, carbon-containing conductor, solid electrolyte, mixed conductor, and conductive polymer material.
20. The cable with cooling function according to claim 19, wherein the conductor (102) is made of copper or copper alloy or aluminum alloy.
21. The cable having a cooling function according to claim 1, further comprising: and a heat sink disposed outside the semiconductor cooling module (101).
22. An electric current transmission device, comprising: the cable (100) with a cooling function, the charging module (200), and the battery module (300) of any one of claims 1 to 21;
the two ends of the cable (100) with the cooling function are respectively connected with the charging module (200) and the battery module (300) and used for conducting the electric energy obtained by the charging module (200) to the battery module (300).
23. Current transfer device according to claim 22, characterized in that the control module (103) is connected to a charging module (200), the charging module (200) being adapted to provide the control module (103) with electrical energy.
24. An electric vehicle comprising the current transfer apparatus of claim 22 or 23.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110821578.3A CN113488282A (en) | 2021-07-20 | 2021-07-20 | Cable with cooling function, current transmission equipment and electric automobile |
| BR112024001184A BR112024001184A2 (en) | 2021-07-20 | 2022-07-18 | CABLE WITH COOLING FUNCTION, CURRENT TRANSMISSION DEVICE AND ELECTRIC VEHICLE |
| KR1020247001101A KR20240019348A (en) | 2021-07-20 | 2022-07-18 | Cables with cooling function, current transmission devices and electric vehicles |
| EP22845269.4A EP4376028A1 (en) | 2021-07-20 | 2022-07-18 | Cable having cooling function, current transmission device, and electric vehicle |
| PCT/CN2022/106259 WO2023001104A1 (en) | 2021-07-20 | 2022-07-18 | Cable having cooling function, current transmission device, and electric vehicle |
| CA3226481A CA3226481A1 (en) | 2021-07-20 | 2022-07-18 | Cable having cooling function, current transmission device, and electric vehicle |
| MX2024001061A MX2024001061A (en) | 2021-07-20 | 2022-07-18 | Cable having cooling function, current transmission device, and electric vehicle. |
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|---|---|---|---|
| CN202110821578.3A CN113488282A (en) | 2021-07-20 | 2021-07-20 | Cable with cooling function, current transmission equipment and electric automobile |
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| CN113488282A true CN113488282A (en) | 2021-10-08 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023001104A1 (en) * | 2021-07-20 | 2023-01-26 | 长春捷翼汽车零部件有限公司 | Cable having cooling function, current transmission device, and electric vehicle |
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| DE102018120932A1 (en) * | 2018-08-28 | 2020-03-05 | Volkswagen Aktiengesellschaft | Cable section |
| CN208781982U (en) * | 2018-09-20 | 2019-04-23 | 山东天瀚新能源科技有限公司 | A kind of Li-ion batteries piles with temperature detecting function |
| CN215911237U (en) * | 2021-07-20 | 2022-02-25 | 长春捷翼汽车零部件有限公司 | Cable with cooling function, current transmission equipment and electric automobile |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023001104A1 (en) * | 2021-07-20 | 2023-01-26 | 长春捷翼汽车零部件有限公司 | Cable having cooling function, current transmission device, and electric vehicle |
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