CN113484950A - Mixed packaging device based on spot-size conversion and grating coupling - Google Patents
Mixed packaging device based on spot-size conversion and grating coupling Download PDFInfo
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- CN113484950A CN113484950A CN202110754204.4A CN202110754204A CN113484950A CN 113484950 A CN113484950 A CN 113484950A CN 202110754204 A CN202110754204 A CN 202110754204A CN 113484950 A CN113484950 A CN 113484950A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12004—Combinations of two or more optical elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12002—Three-dimensional structures
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1228—Tapered waveguides, e.g. integrated spot-size transformers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/124—Geodesic lenses or integrated gratings
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12085—Integrated
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12107—Grating
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/12142—Modulator
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/12152—Mode converter
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Optical Integrated Circuits (AREA)
Abstract
The present disclosure provides a hybrid packaging apparatus based on spot-size conversion and grating coupling, comprising: a silicon-based chip; the spot size converter is integrated on the silicon-based chip and used for realizing optical mode conversion and coupling of optical signals; the optical modulator is integrated on the silicon optical chip, connected with the spot size converter and the grating coupler and used for realizing the modulation of optical signals; the grating coupler is integrated on the silicon substrate chip and used for realizing the coupling of optical signals and converting the optical direction, wherein the grating coupler comprises a waveguide structure and a grating structure, and the tapered waveguide structure is connected with the spot size converter.
Description
Technical Field
The invention relates to the technical field of photoelectron integration, in particular to a hybrid packaging device based on spot-size conversion and grating coupling.
Background
In the backbone network and the next generation data center, the electronic chip encounters a rate bottleneck, and the optoelectronic chip becomes a development key point due to the characteristics of low power consumption and high bandwidth. For large-scale multi-channel photonic integrated chips, silicon-based optoelectronic chips have significant advantages, and the mature process using the silicon-based chips is a necessary trend in terms of monolithic integration and volume reduction. The efficiency of optical coupling directly determines the performance of a silicon-based chip, and the current mature optical coupling mode has smaller alignment tolerance, lower coupling efficiency and larger packaging device size. Finding efficient optical coupling structures is therefore an important development in silicon-based optoelectronic integration.
Disclosure of Invention
In view of the above, the present disclosure provides a hybrid package device based on spot-size conversion and grating coupling, so as to at least partially solve the problems of the coupling manner, such as small alignment tolerance, low coupling efficiency, and large package device size.
According to an embodiment of the present disclosure, there is provided a hybrid package device coupled with a grating based on a speckle transformation, including: a silicon-based chip; the spot size converter is integrated on the silicon-based chip and used for realizing optical mode conversion and coupling of optical signals; the optical modulator is integrated on the silicon substrate chip, connected with the spot size converter and the grating coupler and used for realizing the modulation of optical signals; the grating coupler is integrated on the silicon-based chip and used for realizing the coupling of optical signals and converting the optical direction, wherein the grating coupler comprises a waveguide structure and a grating structure, and the tapered waveguide structure is connected with the spot size converter.
According to an embodiment of the present disclosure, the spot-size converter includes a stepped silicon-based waveguide.
According to the embodiment of the disclosure, the number of the steps of the stepped silicon-based waveguide is 2 or more.
According to an embodiment of the present disclosure, the growth material of the stepped silicon-based waveguide includes at least one of silicon, silicon carbide, silicon nitride, and organic matter.
According to the embodiment of the disclosure, the structure of the spot-size converter is a forward taper structure or a reverse taper structure.
According to the embodiment of the disclosure, the substrate of the spot-size converter is a silicon-on-insulator substrate.
According to an embodiment of the present disclosure, the structure of the optical modulator includes a micro-ring modulator structure and a mach-zehnder interferometer structure.
According to an embodiment of the present disclosure, the waveguide structure of the grating coupler includes a tapered waveguide structure.
According to an embodiment of the present disclosure, the apparatus further includes: and the laser is connected with the spot size converter and is used for providing a continuous optical signal.
According to the embodiment of the disclosure, the laser is directly connected with the silicon-based chip through matching fluid or matching glue.
According to the technical scheme, the embodiment of the disclosure has at least the following beneficial effects:
by using a hybrid package structure of spot-size conversion and grating coupling, the alignment tolerance is improved while the optical coupling efficiency is improved. And the monolithic integration of the spot-size converter, the grating coupler and the optical modulator has small overall size.
Drawings
The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure without limiting the disclosure. In the drawings:
fig. 1 schematically shows the structure of a hybrid packaging device coupled with a grating based on a spot-size transformation.
Figure 2 schematically shows the spot transformer configuration.
Reference numerals:
1. a laser; 2. a spot size converter; 3. an optical modulator;
4. a grating coupler; 5. a silicon-based chip.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
Optical coupling is generally divided into two categories, direct coupling and indirect coupling, where indirect coupling is not conducive to large scale integration. In the direct coupling mode, it is mature to use the spot-size converter and the grating coupler, and although the spot-size converter has high coupling efficiency, its alignment tolerance is small, and at the same time, the grating coupler has very large alignment tolerance but low coupling efficiency.
In view of this, the embodiments of the present disclosure design the optical waveguide structure of the silicon-based optoelectronic chip, and combine the advantages of the spot size converter and the grating coupler together, and efficiently couple the light output by the laser into the silicon-based chip through the spot size converter, and then the light enters the grating coupler after being modulated by the optical modulator, and the grating structure is utilized to convert the direction of the optical coupling, thereby improving the alignment tolerance and realizing the optical coupling packaging structure with high efficiency and high alignment tolerance.
Fig. 1 schematically shows the structure of a hybrid packaging device coupled with a grating based on a spot-size transformation.
As shown in fig. 1, a hybrid package device based on spot-size transformation and grating coupling includes: a silicon-based chip 5; the spot size converter 2 is integrated on the silicon-based chip 5 and used for realizing optical mode conversion and coupling of optical signals; the optical modulator 3 is integrated on the silicon-based chip 5, connected with the spot size converter 2 and the grating coupler 4 and used for realizing the modulation of optical signals; and the grating coupler 4 is integrated on the silicon-based chip 5 and used for realizing the coupling of optical signals and converting the optical direction, wherein the grating coupler 4 comprises a waveguide structure and a grating structure, and the tapered waveguide structure is connected with the spot size converter 2.
According to an embodiment of the present disclosure, the hybrid packaging device further comprises: and the laser 1 is connected with the spot-size converter 2 and is used for providing a continuous optical signal.
According to the embodiment of the present disclosure, the laser 1 is directly connected to the silicon-based chip 5 through the matching fluid or the matching adhesive.
According to the embodiment of the disclosure, the alignment tolerance is improved while the optical coupling efficiency is improved by using the spot size conversion and grating coupling hybrid packaging structure. And because the single chip integrates the spot-size converter, the grating coupler and the optical modulator, the whole size is small, and the cost is saved.
Fig. 2 schematically shows the structure of the spot-size converter.
As shown in fig. 2, the spot-size converter 2 includes a step-type silicon-based waveguide.
According to the embodiment of the disclosure, the number of the steps of the stepped silicon-based waveguide is 2 or more.
According to the embodiment of the present disclosure, the structure of the spot transformer 2 is a forward tapered structure or a reverse tapered structure.
According to an embodiment of the present disclosure, the growth material of the stepped silicon-based waveguide includes at least one of silicon, silicon carbide, silicon nitride, and organic.
According to an embodiment of the present disclosure, the substrate of the spot-size converter 2 is a silicon-on-insulator substrate.
According to the embodiment of the disclosure, the template converter 2 is of a multilayer stepped silicon-based waveguide structure, the size of the lowermost silicon waveguide is the largest, and the size of the upper silicon waveguide is gradually reduced. By using the spot transformer 2, the light exiting the laser 1 is reduced to the size of the silica-based waveguide, which is about 220nm, so that the spot size of the light exiting the laser can be better compatible with the size of the silica-based waveguide.
According to the embodiment of the present disclosure, the spot transformer 2 is connected to the laser 1 at a first end face and to the grating coupler 4 at a second end face.
According to an embodiment of the present disclosure, the structure of the optical modulator 3 includes a micro-ring modulator structure and a mach-zehnder interferometer structure.
According to the embodiment of the disclosure, the spot size converter 2 emits light and enters the optical modulator 3, and the modulated optical signal enters the grating coupler 4.
According to an embodiment of the present disclosure, the waveguide structure of the grating coupler 4 comprises a tapered waveguide structure.
According to the embodiment of the disclosure, the grating structure of the grating coupler 4 is used for coupling the light emitted by the optical modulator 3, changing the transmission direction of the light, and changing the originally transversely transmitted light into longitudinally transmitted light, and meanwhile, the grating coupler 4 has higher alignment tolerance, which is beneficial for the integrated silicon-based chip 5 to couple the light after spot spreading with devices such as optical fibers and the like.
According to the embodiment of the disclosure, the optical modulator 3, the spot size converter 2 and the grating coupler 4 are monolithically integrated on the silicon-based chip 5, which is beneficial to realizing high optical coupling efficiency and high alignment tolerance, changing the optical path direction, being beneficial to large-scale photonic integration, and solving the problem that the optical coupling device is difficult to consider both the coupling efficiency and the alignment tolerance.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A hybrid packaging device based on spot-size transformation and grating coupling comprises:
a silicon-based chip;
the spot size converter is integrated on the silicon-based chip and used for realizing optical mode conversion and coupling of optical signals;
the optical modulator is integrated on the silicon substrate chip, connected with the spot size converter and the grating coupler and used for realizing the modulation of optical signals;
the grating coupler is integrated on the silicon substrate chip and used for realizing the coupling of optical signals and converting the optical direction, wherein the grating coupler comprises a waveguide structure and a grating structure, and the tapered waveguide structure is connected with the spot size converter.
2. The apparatus of claim 1, wherein the spot transformer comprises a stepped silicon-based waveguide.
3. The apparatus of claim 2, wherein the number of steps of the stepped silicon based waveguide is 2 or more.
4. The apparatus of claim 2 or 3, wherein the growth material of the step-wise silicon-based waveguide comprises at least one of silicon, silicon carbide, silicon nitride, and organic.
5. The apparatus of claim 1, wherein the structure of the spot-size transformer is a forward tapered structure or a reverse tapered structure.
6. The apparatus of claim 1, wherein the substrate of the spot-size transformer is a silicon-on-insulator substrate.
7. The apparatus of claim 1, wherein the structure of the optical modulator comprises a micro-ring modulator structure and a mach-zehnder interferometer structure.
8. The apparatus of claim 1, wherein the waveguide structure of the grating coupler comprises a tapered waveguide structure.
9. The apparatus of claim 1, further comprising:
and the laser is connected with the spot size converter and is used for providing a continuous optical signal.
10. The device of claim 9, wherein the laser is directly connected to the silicon-based chip through a matching fluid or a matching glue.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110754204.4A CN113484950A (en) | 2021-07-01 | 2021-07-01 | Mixed packaging device based on spot-size conversion and grating coupling |
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| CN202110754204.4A CN113484950A (en) | 2021-07-01 | 2021-07-01 | Mixed packaging device based on spot-size conversion and grating coupling |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114384632A (en) * | 2022-01-18 | 2022-04-22 | 北京邮电大学 | Array waveguide grating and waveguide type detector-based spot-size converter |
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| CN103688428A (en) * | 2011-03-30 | 2014-03-26 | 英特尔公司 | Efficient silicon-on-insulator grating coupler |
| CN107872005A (en) * | 2017-10-20 | 2018-04-03 | 中国科学院半导体研究所 | Silicon substrate hybrid integrated tunable laser and photon chip |
| CN208656776U (en) * | 2018-05-16 | 2019-03-26 | 苏州易缆微光电技术有限公司 | Silicon substrate integrating optical transmit-receive module chip |
| CN111399117A (en) * | 2020-04-30 | 2020-07-10 | 中国科学院半导体研究所 | Hybrid integrated silicon nitride micro-ring resonant cavity and preparation method thereof |
| US20210181426A1 (en) * | 2018-05-29 | 2021-06-17 | Nippon Telegraph And Telephone Corporation | Optical Inspection Circuit |
| CN113050303A (en) * | 2019-12-26 | 2021-06-29 | 中兴通讯股份有限公司 | Micro-ring modulator |
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2021
- 2021-07-01 CN CN202110754204.4A patent/CN113484950A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103688428A (en) * | 2011-03-30 | 2014-03-26 | 英特尔公司 | Efficient silicon-on-insulator grating coupler |
| CN107872005A (en) * | 2017-10-20 | 2018-04-03 | 中国科学院半导体研究所 | Silicon substrate hybrid integrated tunable laser and photon chip |
| CN208656776U (en) * | 2018-05-16 | 2019-03-26 | 苏州易缆微光电技术有限公司 | Silicon substrate integrating optical transmit-receive module chip |
| US20210181426A1 (en) * | 2018-05-29 | 2021-06-17 | Nippon Telegraph And Telephone Corporation | Optical Inspection Circuit |
| CN113050303A (en) * | 2019-12-26 | 2021-06-29 | 中兴通讯股份有限公司 | Micro-ring modulator |
| CN111399117A (en) * | 2020-04-30 | 2020-07-10 | 中国科学院半导体研究所 | Hybrid integrated silicon nitride micro-ring resonant cavity and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114384632A (en) * | 2022-01-18 | 2022-04-22 | 北京邮电大学 | Array waveguide grating and waveguide type detector-based spot-size converter |
| CN114384632B (en) * | 2022-01-18 | 2023-03-14 | 北京邮电大学 | Array waveguide grating and waveguide type detector-based spot size converter |
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