CN113471080A - Method for manufacturing heat conduction member - Google Patents
Method for manufacturing heat conduction member Download PDFInfo
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- CN113471080A CN113471080A CN202010235516.XA CN202010235516A CN113471080A CN 113471080 A CN113471080 A CN 113471080A CN 202010235516 A CN202010235516 A CN 202010235516A CN 113471080 A CN113471080 A CN 113471080A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 264
- 229910052751 metal Inorganic materials 0.000 claims abstract description 264
- 238000005304 joining Methods 0.000 claims abstract description 32
- 230000002093 peripheral effect Effects 0.000 claims description 64
- 238000002347 injection Methods 0.000 claims description 31
- 239000007924 injection Substances 0.000 claims description 31
- 238000005520 cutting process Methods 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 14
- 238000004891 communication Methods 0.000 claims description 9
- 239000013256 coordination polymer Substances 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 238000007731 hot pressing Methods 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 7
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005555 metalworking Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention provides a method for manufacturing a heat conduction member, comprising the following steps: a placement step of placing the 1 st metal plate and the 2 nd metal plate in opposition to each other with the core structure for conveying the working medium interposed therebetween; a positioning step of bringing positioning pins into contact with at least one of a 1 st metal plate and a 2 nd metal plate disposed to face each other to perform relative positioning of the 1 st metal plate and the 2 nd metal plate; and a joining step of joining the positioned 1 st metal plate and 2 nd metal plate in a state in which the core structure is housed in the internal space to form a joint. The contact position of the positioning pin on at least one of the 1 st metal plate and the 2 nd metal plate is located at a position separated from the joint portion in a direction perpendicular to the facing direction of the 1 st metal plate and the 2 nd metal plate.
Description
Technical Field
The present invention relates to a method for manufacturing a heat conductive member.
Background
Conventionally, various joining apparatuses for joining two metal plates by pressure-bonding have been proposed (for example, see patent document 1).
Patent document 1: japanese patent laid-open publication No. 2018-18997
When two metal plates are arranged to face each other and pressure-bonded, the two metal plates are likely to be displaced relative to each other in a direction perpendicular to the facing direction, and the bonding position is likely to be displaced. This is because, when the pressure bonding is performed, no force is applied to the two metal plates in the direction perpendicular to the facing direction.
In order to reduce the deviation of the joining position, for example, a method of crimping two metal plates in a state where a positioning pin is brought into contact with a portion of the two metal plates which is a joining portion is considered. At this time, when the contact position of the positioning pin approaches the joint portion, a contact mark formed by contact with the positioning pin interferes with the joint portion, and damage due to the contact mark occurs in the joint portion. Therefore, when the above joining method is applied to, for example, joining of two metal plates in a heat conductive member containing a working medium therein, damage to the joined portion may affect the flow path of the working medium inside.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a method for manufacturing a heat conduction member capable of reducing the possibility that damage of a joint portion due to positioning of two metal plates affects a flow path of a working medium inside.
A method for manufacturing a heat conduction member according to an exemplary embodiment of the present invention includes the steps of: a configuration step; disposing the 1 st metal plate and the 2 nd metal plate opposite to each other with the core structure for transporting the working medium therebetween; a positioning step of bringing positioning pins into contact with at least one of the 1 st metal plate and the 2 nd metal plate disposed to face each other to perform relative positioning of the 1 st metal plate and the 2 nd metal plate; and a joining step of joining the 1 st metal plate and the 2 nd metal plate after being positioned with the core structure housed in an internal space thereof to form a joint, wherein a contact position of the positioning pin with respect to at least one of the 1 st metal plate and the 2 nd metal plate is located at a position separated from the joint in a direction perpendicular to a facing direction of the 1 st metal plate and the 2 nd metal plate.
According to the present invention, it is possible to reduce the possibility that damage to the joint portion due to the positioning of the two metal plates affects the flow path of the working medium inside.
Drawings
Fig. 1 is a plan view showing one configuration example of a vapor chamber according to an embodiment of the present invention.
Fig. 2 is a sectional view taken along line a-a' of fig. 1.
Fig. 3 is a flowchart showing a flow of the vapor chamber manufacturing process.
Fig. 4 is a plan view showing another configuration example of the vapor chamber.
Fig. 5 is a plan view showing still another configuration example of the vapor chamber.
Fig. 6 is a plan view showing still another configuration example of the vapor chamber.
Fig. 7 is a plan view showing still another configuration example of the vapor chamber.
Fig. 8 is a cross-sectional view taken along line B-B' of fig. 7.
Fig. 9 is a plan view showing still another configuration example of the vapor chamber.
Fig. 10 is a cross-sectional view taken along line C-C' of fig. 9.
Fig. 11 is a cross-sectional view schematically showing a bonding process of the vapor chamber of fig. 9.
Description of the reference symbols
1 b: a space; 1 c: a communication path; 2: a working medium; 3: a core structure; 4: a 1 st metal plate; 5: a 2 nd metal plate; 6: a joint portion; 31: a storage section; 32: a positioning part; 33: an injection part; 33 a: an injection port; 41: positioning pins; 71: 1 st outer circumferential portion; 72: a 2 nd outer peripheral portion; 81: a block; and (3) CP: a contact position; PR: a pressurized region.
Detailed Description
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, an XYZ coordinate system is appropriately shown as a three-dimensional orthogonal coordinate system. In the XYZ coordinate system, the Z-axis direction represents the vertical direction (i.e., the vertical direction), + Z direction is the upper side (the opposite side to the direction of gravity), and-Z direction is the lower side (the direction of gravity). The Z-axis direction is also a facing direction of the 1 st metal plate 4 and the 2 nd metal plate 5 of the vapor chamber 1 described later. The X-axis direction is a direction perpendicular to the Z-axis direction, and one direction and the opposite direction thereof are referred to as the + X direction and the-X direction, respectively. The Y-axis direction is a direction perpendicular to both the Z-axis direction and the X-axis direction, and one direction and the opposite direction thereof are referred to as the + Y direction and the-Y direction, respectively.
(1. vapor chamber construction)
Fig. 1 is a plan view showing one configuration example of a vapor chamber 1 of the present embodiment. Fig. 2 is a sectional view taken along line a-a' of fig. 1. In fig. 1, the steam chamber 1 is shown before the later-described positioning portion 32 is cut, but the positioning portion 32 is cut in use, and the case 1a is used in a sealed state.
The steam chamber 1 is a heat conduction member for transferring heat of the heating element H. As the heat generating element H, for example, an electronic component that generates heat or a substrate on which the electronic component is mounted can be considered. The heating element H includes a CPU and the like. The heating element H is cooled by the transfer of heat from the steam chamber 1. Such a vapor chamber 1 is mounted on an electronic device having a heat generating element H, such as a smartphone or a notebook personal computer.
The vapor chamber 1 has a heated portion 101 and a heat radiating portion 102. The heated portion 101 is disposed in contact with the heating element H, for example, and is heated by heat generated by the heating element H. That is, the heated portion 101 is a portion that transmits heat emitted from the heating element H. The heat radiating section 102 radiates heat of the working medium 2, which will be described later, heated by the heating section 101 to the outside.
The steam chamber 1 has a casing 1 a. A part of the casing 1a is included in the heated portion 101. Another part of the case 1a is contained in the heat radiating portion 102. The case 1a includes a 1 st metal plate 4 described later and a 2 nd metal plate 5 joined to the 1 st metal plate 4.
The housing 1a has a space 1b therein. The space 1b is an internal space formed by disposing the 1 st metal plate 4 and the 2 nd metal plate 5 to face each other. That is, the case 1a has the 1 st metal plate 4 and the 2 nd metal plate 5 joined to the 1 st metal plate 4, and has the space 1b inside by the 1 st metal plate 4 and the 2 nd metal plate 5. The space 1b is maintained in a reduced pressure state in which the air pressure is lower than the atmospheric pressure, for example. Since the space 1b is in a depressurized state, the working medium 2 stored in the space 1b is easily evaporated. The thickness of the case 1a in the Z-axis direction is, for example, 100 μm or more and 1000 μm or less.
The working medium 2 and the core structure 3 are accommodated in the space 1b of the case 1 a. The working medium 2 is, for example, water, but may be other liquid such as alcohol. The core structure 3 is made of, for example, a porous sintered copper body that transports the working medium 2. The core structure 3 may be a structure of a copper mesh, or may be composed of a plurality of copper fibers.
The case 1a has a 1 st metal plate 4. The 1 st metal plate 4 supports the core structure 3 from the-Z direction side. In the present embodiment, the 1 st metal plate 4 is copper. The 1 st metal plate 4 may be formed by plating copper on a surface of a metal other than copper. As a metal other than copper, for example, stainless steel is considered. The 1 st metal plate 4 is formed in a concave shape recessed in the-Z direction in fig. 1, but may be a flat plate without the concave shape.
The case 1a also has a 2 nd metal plate 5. The 2 nd metal plate 5 is located at a position facing the 1 st metal plate 4 in the Z-axis direction. More specifically, the 2 nd metal plate 5 is located on the + Z direction side with respect to the 1 st metal plate 4, and covers the core structure 3 on the 1 st metal plate 4 from the + Z direction side.
The 2 nd metal plate 5 is made of the same metal material as the 1 st metal plate 4. Therefore, when the 1 st metal plate 4 is made of copper, the 2 nd metal plate 5 is also made of copper. In addition, when the 1 st metal plate 4 is a metal plate plated with copper on the surface of stainless steel, the 2 nd metal plate 5 is also a metal plate plated with copper on the surface of stainless steel.
The 2 nd metal plate 5 has a plurality of pillar portions 5 a. The pillar portion 5a extends from the surface on the-Z direction side of the 2 nd metal plate 5 to the-Z direction side and contacts the core structure 3. Such a column portion 5a is formed of, for example, a circular column when viewed from the + Z direction. The pillar portions 5a are arranged two-dimensionally and regularly in the XY direction. The thickness of the case 1a in the Z-axis direction is kept constant by the contact of the column portion 5a with the core structure 3 in the Z-axis direction. The 2 nd metal plate 5 and the pillar portion 5a may be integrated, may be single, or may be separate.
The housing 1a also has an engagement portion 6. The joint 6 is a joint structure in which the 1 st metal plate 4 and the 2 nd metal plate 5 are joined at their outer edges. The joint 6 is located around the core structure 3 when viewed from the + Z direction side, and joins the 1 st metal plate 4 and the 2 nd metal plate 5. Therefore, the joint portions 6 are disposed so as to sandwich the core structure 3 in the X-axis direction and the Y-axis direction perpendicular to the Z-axis direction.
As a method for joining the 1 st metal plate 4 and the 2 nd metal plate 5, for example, a method called hot pressing is used.
Further, the hot pressing is the same as the diffusion bonding in the point of bonding two members by heating and pressing, but differs from each other in the following points. In diffusion bonding, for example, heating and pressing for several hours diffuse atoms or particles near a bonding interface between two members, thereby bonding the two members.
In contrast, in the hot press, only a part of atoms or particles in the vicinity of the bonding interface of the two members is diffused by heating and pressing at a lower temperature and in a shorter time than in the diffusion bonding, and the two members are bonded.
In diffusion bonding, the bonding interface itself disappears due to the difference in the degree of diffusion of atoms or particles. On the other hand, in the hot pressing, a part of the bonding interface disappears and a part of the interface remains as it is. In other words, a part of the interface does not disappear but remains in the hot pressing. Therefore, in the bonding portion 6 formed by diffusion bonding and the bonding portion 6 formed by hot pressing, the bonding structures in the vicinity of the bonding interface are different from each other. In addition, the hot pressing has a shorter tact time for manufacturing than the diffusion bonding due to the difference in time between heating and pressing.
The joint 6 may include a seal portion. The sealing portion is a portion for sealing an injection port for injecting the working medium 2 into the casing 1a by welding, for example, in the manufacturing process of the steam chamber 1. The joint portion 6 may include a portion where the 1 st metal plate 4 and the 2 nd metal plate 5 are joined by a brazing material or the like. That is, the 1 st metal plate 4 and the 2 nd metal plate 5 may be directly joined or may be indirectly joined via a brazing material or the like.
In the steam chamber 1 having the above-described configuration, the heated portion 101 is heated by heat generated by the heating element H. When the temperature of the heated portion 101 increases, the working medium 2 contained in the space 1b inside the casing 1a is vaporized. The vaporized steam moves toward the heat radiating portion 102 in the steam chamber 1. In the heat radiating section 102, the vapor is cooled by heat radiation to be liquefied. The liquefied working medium 2 moves toward the heated portion 101 in the core structure 3 by capillary action. In fig. 1, the flow of the vapor after the vaporization of the working medium 2 is indicated by black arrows, and the flow of the liquid working medium 2 is indicated by hollow arrows. As described above, the working medium 2 moves while changing the state, and thereby heat is continuously transferred from the heated target portion 101 side to the heat radiating portion 102 side.
(2. method for manufacturing vapor chamber)
Next, a method for manufacturing the vapor chamber 1 will be described. Fig. 3 is a flowchart showing a flow of a manufacturing process of the vapor chamber 1. The method for manufacturing the vapor chamber 1 includes a placement step S1, a positioning step S2, a joining step S3, an injection step S4, and a cutting step S5. In fig. 3, S indicates start and E indicates end.
(2-1. preparation Process)
The 1 st metal plate 4 supporting the core structure 3 is prepared. The 2 nd metal plate 5 is disposed to face the 1 st metal plate 4 so as to cover the core structure 3. That is, the method for manufacturing the vapor chamber 1 includes the following disposing step S1: the 1 st metal plate 4 and the 2 nd metal plate 5 are arranged to face each other through the core structure 3 for conveying the working medium 2.
In the disposing step S1, the 1 st metal plate 4 and the 2 nd metal plate 5 are disposed to face each other, thereby forming the accommodating portion 31 and the positioning portion 32. The housing 31 is a part that houses the core structure 3. The positioning portion 32 is a portion formed to be connected to the housing portion 31. The positioning pins 41 described later come into contact with the positioning portions 32.
The positioning portions 32 are arranged in parallel with the housing portion 31 in the X-axis direction, for example. The direction in which the positioning portion 32 is connected to the housing portion 31 is not limited to the X-axis direction described above, and may be the Y-axis direction. That is, the direction in which the positioning portion 32 is connected to the housing portion 31 may be a direction perpendicular to the Z-axis direction.
That is, in the disposing step S1, the 1 st metal plate 4 and the 2 nd metal plate 5 are disposed to face each other, thereby forming the housing portion 31 for housing the core structure 3 and the positioning portion 32 connected to the housing portion 31 in the direction perpendicular to the facing direction.
The positioning portions 32 are formed at a plurality of locations around the housing portion 31 in the XY plane. In particular, as shown in fig. 1, the positioning portions 32 are formed at two positions sandwiching the core structure 3 in a direction perpendicular to the Z-axis direction. That is, in the disposing step S1, the 1 st metal plate 4 and the 2 nd metal plate 5 are disposed to face each other, and the positioning portions 32 connected to the housing portions 31 are formed at a plurality of locations in a plane perpendicular to the facing direction. The plurality of portions include portions symmetrically arranged about the core structure 3 in a plane perpendicular to the facing direction. The symmetry here means point symmetry, that is, a positional relationship at an interval of 180 ° in the plane, but includes positional relationships other than the 180 ° interval described later.
Referring to fig. 1 and 2, the size and shape of the 1 st metal plate 4 and the 2 nd metal plate 5 are the same in plan view, i.e., when viewed from the Z-axis direction. Therefore, the positioning portion 32 formed by the facing arrangement of the 1 st metal plate 4 and the 2 nd metal plate 5 is formed by both the 1 st metal plate 4 and the 2 nd metal plate 5.
A part of the positioning portion 32 formed at a plurality of locations also serves as the injection portion 33 of the working medium 2. The injection portion 33 includes an injection port 33a of the working medium 2. The inlet 33a is connected to a communication path 1c formed between the 1 st metal plate 4 and the 2 nd metal plate 5. The communication path 1c communicates with a space 1b inside the case 1a formed by the 1 st metal plate 4 and the 2 nd metal plate 5. Therefore, in the injection step S4 described later, the working medium 2 can be injected into the space 1b through the injection port 33 a.
That is, the positioning portion 32 includes the injection portion 33 of the working medium 2. The injection portion 33 has an injection port 33a, and the injection port 33a communicates with the space 1b between the 1 st metal plate 4 and the 2 nd metal plate 5, and is used for injecting the working medium 2 into the space 1 b.
(2-2. positioning step)
Next, as shown in fig. 1, the positioning pins 41 are brought into contact with at least one of the 1 st metal plate 4 and the 2 nd metal plate 5, and the 1 st metal plate 4 and the 2 nd metal plate 5 are positioned relative to each other. The positioning pin 41 is a metal pin having a cylindrical shape with a central axis along the Z-axis direction. The positioning pins 41 are supported by a holding member, not shown, that holds the 1 st metal plate 4 and the 2 nd metal plate 5.
In the positioning step S2, the positioning pins 41 are brought into contact with the positioning portions 32 to perform positioning. As described above, the positioning portion 32 is formed by both the 1 st metal plate 4 and the 2 nd metal plate 5. Therefore, by bringing positioning pin 41 into contact with positioning portion 32, positioning pin 41 is brought into contact with both of 1 st metal plate 4 and 2 nd metal plate 5. When the size and shape of the 1 st metal plate 4 and the 2 nd metal plate 5 are different from each other when viewed in the Z-axis direction, the positioning pin 41 is in contact with the larger one of the 1 st metal plate 4 and the 2 nd metal plate 5, which will be described later.
That is, the method for manufacturing the steam chamber 1 includes the following positioning step S2: the positioning pins 41 are brought into contact with at least one of the 1 st metal plate 4 and the 2 nd metal plate 5 disposed to face each other, and the 1 st metal plate 4 and the 2 nd metal plate 5 are positioned to face each other.
In the positioning step S2, the positioning pins 41 are brought into contact with the positioning portions 32 to perform positioning.
The number of positioning pins 41 that contact one positioning portion 32 is two in fig. 1. In one direction perpendicular to the Z-axis direction, the positioning portion 32 is sandwiched by two positioning pins 41, and the two positioning pins 41 are brought into contact with the positioning portion 32. In particular, when the positioning portions 32 are formed at a plurality of locations as shown in fig. 1, two positioning pins 41 are assigned to each positioning portion 32, and each positioning portion 32 is sandwiched and brought into contact with the two positioning pins 41. In addition, the positioning pins 41 are also preferably arranged symmetrically in the XY plane about the core structure 3, similarly to the positioning portion 32.
That is, in the positioning step S2, the positioning pins 41 are brought into contact with the positioning portions 32 at a plurality of locations, respectively, to perform positioning. In fig. 1, two positioning pins 41 are brought into contact with the positioning portions 32 so as to sandwich 1 positioning portion 32 from the Y direction, whereby the 1 st metal plate 4 and the 2 nd metal plate 5 are positioned in both the X direction and the Y direction.
The number of positioning pins 41 that contact one positioning portion 32 may be three or more. Further, if the number of forming positions of positioning portions 32 is increased, positioning may be performed even if the number of positioning pins 41 that contact each positioning portion 32 is 1. That is, the number of positioning pins 41 that contact one positioning portion 32 is not limited to two in fig. 1.
The position where positioning pin 41 contacts positioning portion 32 is referred to herein as contact position CP, also denoted CP in the drawings.
(2-3. joining Process)
Next, the positioned 1 st metal plate 4 and 2 nd metal plate 5 are joined by the hot pressing to form a joint portion 6. Thereby, the 1 st metal plate 4 and the 2 nd metal plate 5 are joined by the joining portion 6 in a state where the core structure 3 is housed in the internal space 1 b. That is, the method for manufacturing the vapor chamber 1 includes the following bonding step S3: the 1 st metal plate 4 and the 2 nd metal plate 5 after being positioned are joined with the core structure 3 housed in the internal space 1b to form a joint 6.
Here, as shown in fig. 1, the contact position CP of the positioning pin 41 is located at a position separated in the X-axis direction with respect to the joint portion 6. That is, the contact position CP of the positioning pin 41 of at least one of the 1 st metal plate 4 and the 2 nd metal plate 5 is located at a position separated from the joint 6 in a direction perpendicular to the facing direction of the 1 st metal plate 4 and the 2 nd metal plate 5. Such a positional relationship between the contact position CP and the joint 6 is realized by heating and pressing the 1 st metal plate 4 and the 2 nd metal plate 5 by hot pressing at a position closer to the core structure 3 than the contact position CP. In the housing portion 31, the engaging portion 6 is formed at a position separated from the contact position CP in the X-axis direction.
That is, in the joining step S5, the joint 6 is formed at a position separated in the direction perpendicular to the facing direction with respect to the contact position CP with the positioning pin 41 in the positioning portion 32.
(2-4. injection step)
The working medium 2 such as water is injected into the space 1b from an injection port 33a of the injection portion 33 also serving as the positioning portion 32. That is, the method for manufacturing the vapor chamber 1 includes the following injection step S4: the working medium 2 is injected into the space 1b between the 1 st metal plate 4 and the 2 nd metal plate 5 via the injection portion 33.
(2-5. cutting-off Process)
After the working medium 2 is injected, the positioning portion 32 is cut by a cutting member 51 such as a cutter for metal working. That is, the method of manufacturing the steam chamber 1 includes the cutting step S5 of cutting the positioning portion 32.
In the cutting step S5, the 1 st metal plate 4 and the 2 nd metal plate 5 constituting the communication path 1c exposed by the cutting are welded together with the positioning portion 32. Thereby, the communication path 1c is closed, and the working medium 2 is sealed in the space 1 b. That is, in the cutting step S5, after the working medium 2 is injected into the space 1b in the injection step S4, the positioning portion 32 is cut and the communication path 1c between the space 1b and the injection port 33a exposed by the cutting is closed. The communication path 1c may be closed by a method other than welding of a metal plate.
(3. Effect)
As described above, the contact position CP of the positioning pin 41 is located at a position separated from the joint 6 in the direction perpendicular to the facing direction of the 1 st metal plate 4 and the 2 nd metal plate 5. Thus, even if contact marks caused by contact with the positioning pins 41 remain on both or either of the 1 st metal plate 4 and the 2 nd metal plate 5, the possibility that the contact marks interfere with the joint portion 6 and damage the joint portion 6 can be reduced. Therefore, even if the working medium 2 is sealed in the internal space 1b formed by the facing arrangement of the 1 st metal plate 4 and the 2 nd metal plate 5, the possibility that damage to the joint 6 affects the flow path of the working medium 2 therein can be reduced. For example, the possibility that the working medium 2 stored inside the 1 st metal plate 4 and the 2 nd metal plate 5 leaks to the outside through the joint 6 due to the positioning of the 1 st metal plate 4 and the 2 nd metal plate 5 can be reduced.
The engaging portion 6 is formed at a position separated from the contact position CP with the positioning pin 41 in the positioning portion 32. Thus, even if a trace of contact with the positioning pin 41 remains in the positioning portion 32, the possibility of the contact trace interfering with the joint portion 6 of the housing portion 31 can be reduced. Therefore, even when the positioning pin 41 is brought into contact with the positioning portion 32 to perform positioning, the possibility that the joint portion 6 is damaged by a contact mark with the positioning pin 41 can be reduced, and the possibility that the damage of the joint portion 6 affects the flow path of the working medium 2 inside can be reduced.
In the positioning step S2, the positioning pins 41 are brought into contact with the positioning portions 32 at a plurality of positions, respectively, to perform positioning. This can easily suppress the 1 st metal plate 4 and the 2 nd metal plate 5 from moving in a plane perpendicular to the facing direction. Therefore, the relative positioning at the time of joining the 1 st metal plate 4 and the 2 nd metal plate 5 can be performed with high accuracy.
In particular, the plurality of portions forming the positioning portion 32 includes two portions symmetrically arranged about the core structure 3 in the direction perpendicular to the facing direction. By bringing the positioning pins 41 into contact with the positioning portions 32 at the two locations, the rotation of the 1 st metal plate 4 and the 2 nd metal plate 5 in the plane perpendicular to the facing direction can be further suppressed. Therefore, the accuracy of the relative positioning when the 1 st metal plate 4 and the 2 nd metal plate 5 are joined can be improved.
Even if there are traces of contact caused by contact with positioning pins 41 remaining on positioning portions 32, the traces of contact are not present in steam chambers 1 that are the final products by cutting positioning portions 32 in cutting step S5. Therefore, in the steam chamber 1 of the final product from which the positioning portion 32 is removed, the possibility that damage of the joint portion 6 affects the flow path of the working medium 2 inside can be reduced.
Since the positioning portion 32 includes the injection portion 33, the injection portion 33 of the working medium 2 can be positioned in the positioning step S2. That is, the injection portion 33 can be effectively used not only for injecting the working medium 2 but also for positioning.
In the injection step S4, after the working medium 2 is injected into the space 1b, the positioning portion 32 is cut off and the communication path 1c is blocked. This makes it possible to obtain the vapor chamber 1 having a structure in which the working medium 2 is sealed in the space 1 b.
(4. modification of the arrangement position of the positioning part)
Fig. 4 to 6 are plan views showing other structural examples of the vapor chamber 1. In fig. 4 to 6, the steam chamber 1 is shown before the position determining portion 32 is cut, and the position determining portion 32 is cut and the casing 1a is used in a sealed state when it is used.
In the manufacturing process of the steam chamber 1, as shown in fig. 4, the positioning portions 32 at a plurality of positions formed in the arranging step S1 may be arranged at angular intervals of 90 ° around the Z axis with the core structure 3 as the center. That is, the plurality of positioning portions 32 may be formed at positions rotationally symmetrical about the core structure 3 in the XY plane perpendicular to the Z-axis direction. Although not shown, the angular intervals may be intervals other than 90 ° such as 120 °.
As shown in fig. 5, the positioning portions 32 at a plurality of positions may be arranged at random angular intervals around the Z axis around the core structure 3. As shown in fig. 6, the number of the positioning portions 32 connected to the housing portion 31 may be one. Although not shown, the positioning portion 32 may be formed at a corner of the case 1a in the XY plane and connected to the housing portion 31.
(5. other methods of manufacturing vapor Chamber)
Fig. 7 is a plan view showing still another configuration example of the vapor chamber 1. Fig. 8 is a cross-sectional view taken along line B-B' of fig. 7. The sizes of the 1 st metal plate 4 and the 2 nd metal plate 5 may be different from each other. In this case, the manufacturing method of the present embodiment can also be applied.
For example, when viewed from the Z-axis direction which is the facing direction of the 1 st metal plate 4 and the 2 nd metal plate 5, the 1 st metal plate 4 is larger in size than the 2 nd metal plate 5, and when these are arranged to face each other, the outer shape of the 2 nd metal plate 5 is located inward of the outer shape of the 1 st metal plate 4. In this case, the positioning pins 41 may be positioned by being brought into contact with the 1 st outer peripheral portion 71 defining the outer shape of the 1 st metal plate 4.
That is, in the disposing step S1, the 2 nd metal plate 5 disposed to face the 1 st metal plate 4 is located inward of the outer shape of the 1 st metal plate 4 when viewed from the facing direction, and in the positioning step S2, the positioning pins 41 are positioned by being brought into contact with the 1 st outer peripheral portion 71 that defines the outer shape of the 1 st metal plate 4.
When the 2 nd metal plate 5 is located inward of the outer shape of the 1 st metal plate 4 as viewed from the facing direction, the 2 nd outer peripheral portion 72 defining the outer shape of the 2 nd metal plate 5 is located inward of the 1 st outer peripheral portion 71 of the 1 st metal plate 4. That is, the 2 nd outer peripheral portion 72 is located at a position separated from the 1 st outer peripheral portion 71 in a direction perpendicular to the facing direction. Therefore, when the positioning pins 41 are brought into contact with the 1 st outer peripheral portion 71 of the 1 st metal plate 4 to perform positioning and then the 1 st metal plate 4 and the 2 nd metal plate 5 are joined, the joint portion 6 between the 1 st metal plate 4 and the 2 nd metal plate 5 can be formed at a position separated in a direction perpendicular to the facing direction from the contact position CP with the positioning pins 41 in the 1 st outer peripheral portion 71 of the 1 st metal plate 4. Therefore, even if a contact mark caused by contact with the positioning pin 41 remains in the 1 st outer peripheral portion 71 of the 1 st metal plate 4, the possibility of interference between the contact mark and the joint portion 6 can be reduced.
Therefore, even when the positioning pins 41 are brought into contact with the 1 st outer peripheral portion 71 of the 1 st metal plate 4 having a larger size to perform positioning using the 1 st metal plate 4 and the 2 nd metal plate 5 having different sizes, the possibility of damage to the joint portion 6 due to contact marks with the positioning pins 41 can be reduced, and the possibility of damage to the joint portion 6 affecting the flow path of the working medium 2 inside can be reduced.
At this time, a plurality of positioning pins 41 may be used to position the 1 st metal plate 4 at a plurality of positions by bringing the positioning pins 41 into contact with the plurality of positions of the 1 st outer peripheral portion 71. In this case, the plurality of portions preferably includes two portions located at positions sandwiching the core structure 3 in a direction perpendicular to the facing direction. Fig. 7 shows a state in which the positioning pins 41 are brought into contact with the 1 st outer peripheral portion 71 of the 1 st metal plate 4 at least at two locations sandwiching the core structure 3 in the X-axis direction to perform positioning.
That is, in the positioning step S2, the positioning pins 41 are positioned by being brought into contact with a plurality of portions of the 1 st outer peripheral portion 71 of the 1 st metal plate 4, respectively, the plurality of portions including two portions located on opposite sides with respect to the core structure 3 in the direction perpendicular to the facing direction.
By bringing the positioning pins 41 into contact with the two positions of the 1 st outer peripheral portion 71 of the 1 st metal plate 4, the 1 st metal plate 4 can be easily prevented from rotating and moving within the XY plane perpendicular to the facing direction. This enables the 1 st metal plate 4 to be positioned with high accuracy when the 1 st metal plate 4 and the 2 nd metal plate 5 are joined. From the viewpoint of further improving the positioning accuracy, it is preferable that the number of the portions of the 1 st metal plate 4 that contact the 1 st outer peripheral portion 71 of the positioning pin 41 be three or more.
In the above-described manufacturing method, since the positioning pin 41 is brought into direct contact with the 1 st outer circumferential portion 71 of the 1 st metal plate 4 without forming the positioning portion 32 shown in fig. 1, the cutting step S5 of cutting the positioning portion 32 is not required, and the number of steps can be reduced.
(6. still another method for manufacturing vapor chamber)
Fig. 9 is a plan view showing still another configuration example of the vapor chamber 1. Fig. 10 is a cross-sectional view taken along line C-C' of fig. 9. When the 1 st metal plate 4 and the 2 nd metal plate 5 having the same size are used as viewed in the Z-axis direction which is the facing direction, the contact position CP of the positioning pin 41 and the joint portion 6 may be arranged so as to be separated by adjusting the formation position of the joint portion 6 between the 1 st metal plate 4 and the 2 nd metal plate 5. For example, the joint 6 may be formed by joining only the portion close to the core structure 3 of the surface where the 1 st metal plate 4 and the 2 nd metal plate 5 are in contact with each other, and the joint 6 may be separated from the contact position CP.
That is, in the positioning step S2, the positioning pins 41 are positioned by being brought into contact with both the 1 st outer peripheral portion 71 defining the outer shape of the 1 st metal plate 4 when viewed from the facing direction and the 2 nd outer peripheral portion 72 defining the outer shape of the 2 nd metal plate 5 in the same shape as the 1 st outer peripheral portion 71 when viewed from the facing direction, and in the joining step S3, the joint 6 is formed at a position apart from the 1 st outer peripheral portion 71 and the 2 nd outer peripheral portion 72 toward the core structure 3 side in the 1 st metal plate 4 and the 2 nd metal plate 5. Specifically, by performing the hot pressing as follows, the joint portions 6 can be formed at positions separated from the 1 st outer peripheral portion 71 and the 2 nd outer peripheral portion 72 toward the core structure 3, that is, at positions separated in the X-axis direction and the Y-axis direction.
Fig. 11 is a cross-sectional view schematically showing a state where the 1 st metal plate 4 and the 2 nd metal plate 5 are joined in the joining process S3. First, the 1 st metal plate 4 and the 2 nd metal plate 5 are arranged to face each other, and the positioning pins 41 are positioned by being brought into contact with the 1 st outer peripheral portion 71 and the 2 nd outer peripheral portion 72. Then, the 1 st metal plate 4 and the 2 nd metal plate 5 are sandwiched from the opposing direction by the pair of heated blocks 81, and the 1 st metal plate 4 and the 2 nd metal plate 5 are heated and pressed.
At this time, the 1 st metal plate 4 and the 2 nd metal plate 5 are sandwiched by the pair of blocks 81 in the region on the core structure 3 side inside the 1 st outer peripheral portion 71 and the 2 nd outer peripheral portion 72. Here, the above-described region is referred to as a pressing region PR. That is, the 1 st metal plate 4 and the 2 nd metal plate 5 are heated and pressed in the pressing region PR inside the 1 st outer peripheral portion 71 and the 2 nd outer peripheral portion 72. Thereby, only a portion of the contact surface between the 1 st metal plate 4 and the 2 nd metal plate 5, which is located in the pressing region PR, is bonded by hot pressing. Therefore, the joint portion 6 formed in the pressing region PR is formed at a position separated in the direction perpendicular to the facing direction from the contact position CP with the positioning pin 41 in the 1 st outer peripheral portion 71 and the 2 nd outer peripheral portion 72.
That is, in the joining step S3, in the 1 st metal plate 4 and the 2 nd metal plate 5 which are arranged to face each other, the pressing region PR which is inside the 1 st outer peripheral portion 71 and the 2 nd outer peripheral portion 72 as viewed from the facing direction is pressed by the heated block 81 from the facing direction, whereby the joining portion 6 is formed at a position which is apart from the 1 st outer peripheral portion 71 and the 2 nd outer peripheral portion 72 toward the core structure 3 side.
In this way, in the joining step S3, the joint 6 is formed at a position away from the 1 st outer peripheral portion 71 and the 2 nd outer peripheral portion 72 toward the core structure 3. Therefore, in positioning step S2, even if a contact mark caused by contact with positioning pin 41 remains in both of 1 st outer peripheral portion 71 and 2 nd outer peripheral portion 72, the possibility of interference between the contact mark and joint portion 6 can be reduced. Therefore, even when the 1 st metal plate 4 and the 2 nd metal plate 5 having the same size are used and the positioning pins 41 are brought into contact with both the 1 st metal plate 4 and the 2 nd metal plate 5 to perform positioning, the possibility that the joint portion 6 is damaged by contact marks with the positioning pins 41 can be reduced. As a result, the possibility that damage to the joint 6 affects the flow path of the working medium 2 inside can be reduced.
In the joining step S3, the joining portion 6 is formed at a position separated from the 1 st outer peripheral portion 71 and the 2 nd outer peripheral portion 72 toward the core structure 3 side by pressing the pressing region PR, which is located inward of the 1 st outer peripheral portion 71 and the 2 nd outer peripheral portion 72 when viewed from the facing direction, with the block 81. This can reliably achieve the above-described effect of reducing the possibility that damage to the joint 6 affects the flow path of the working medium 2 inside.
At this time, a plurality of positioning pins 41 may be used, and positioning pins 41 may be brought into contact with a plurality of positions of 1 st outer circumferential portion 71 and 2 nd outer circumferential portion 72 to perform positioning at a plurality of positions. In this case, the plurality of portions preferably includes two portions located at positions sandwiching the core structure 3 in a direction perpendicular to the facing direction. Fig. 9 shows a state in which the positioning pins 41 are brought into contact with the 1 st outer peripheral portion 71 and the 2 nd outer peripheral portion 72 at least at two locations sandwiching the core structure 3 in the X axis direction to perform positioning.
That is, in the positioning step S2, the positioning pins 41 are positioned by being brought into contact with a plurality of locations of the 1 st outer peripheral portion 71 and the 2 nd outer peripheral portion 72, respectively, the plurality of locations including two locations located on opposite sides of the core structure 3 in a direction perpendicular to the facing direction.
By bringing the positioning pins 41 into contact with the 1 st outer peripheral portion 71 and the 2 nd outer peripheral portion 72 at the two locations, respectively, it is possible to easily suppress rotation and movement of the 1 st metal plate 4 and the 2 nd metal plate 5 within the XY plane perpendicular to the facing direction. This enables the 1 st metal plate 4 and the 2 nd metal plate 5 to be positioned with high accuracy when joined together. From the viewpoint of further improving the positioning accuracy, it is preferable that the number of portions of positioning pin 41 that contact 1 st outer peripheral portion 71 and 2 nd outer peripheral portion 72 be three or more.
In the above-described manufacturing method, since the positioning pins 41 are brought into direct contact with the 1 st outer peripheral portion 71 of the 1 st metal plate 4 and the 2 nd outer peripheral portion 72 of the 2 nd metal plate 5 without forming the positioning portions 32 shown in fig. 1, the cutting step S5 of cutting the positioning portions 32 is not necessary, and the number of steps can be reduced.
While the embodiments of the present invention have been described above, the scope of the present invention is not limited to the embodiments, and various modifications can be made without departing from the scope of the present invention. The above embodiments and modifications thereof may be combined as appropriate.
Industrial applicability
The present invention can be used for manufacturing a heat conduction member such as a vapor chamber or a heat pipe.
Claims (12)
1. A method for manufacturing a heat conductive member includes the steps of:
a placement step of placing the 1 st metal plate and the 2 nd metal plate in opposition to each other with the core structure for conveying the working medium interposed therebetween;
a positioning step of bringing positioning pins into contact with at least one of the 1 st metal plate and the 2 nd metal plate disposed to face each other to perform relative positioning of the 1 st metal plate and the 2 nd metal plate; and
a joining step of joining the 1 st metal plate and the 2 nd metal plate to be positioned with the core structure housed in an internal space to form a joint portion,
a contact position of the positioning pin with respect to at least one of the 1 st metal plate and the 2 nd metal plate is located at a position separated from the joint portion in a direction perpendicular to a facing direction of the 1 st metal plate and the 2 nd metal plate.
2. The manufacturing method of a heat conduction member according to claim 1,
in the disposing step, the 1 st metal plate and the 2 nd metal plate are disposed to face each other, thereby forming a housing portion housing the core structure and a positioning portion connected to the housing portion in a direction perpendicular to the facing direction,
in the positioning step, the positioning is performed by bringing the positioning pin into contact with the positioning portion,
in the joining step, the joining portion is formed at a position separated from a contact position with the positioning pin in the positioning portion in a direction perpendicular to the facing direction.
3. The manufacturing method of a heat conducting member according to claim 2,
in the disposing step, the 1 st metal plate and the 2 nd metal plate are disposed to face each other, and the positioning portions connected to the housing portions are formed at a plurality of locations in a plane perpendicular to the facing direction,
in the positioning step, the positioning pins are brought into contact with the positioning portions of the plurality of portions, respectively, to perform the positioning.
4. The manufacturing method of a heat conducting member according to claim 3,
the plurality of portions include portions symmetrically arranged about the core structure in a plane perpendicular to the facing direction.
5. The manufacturing method of a heat conductive member according to any one of claims 2 to 4,
the method of manufacturing a heat conductive member further includes a cutting step of cutting the positioning portion.
6. The manufacturing method of a heat conducting member according to claim 5,
the positioning portion includes an injection portion of the working medium,
the injection part has an injection port communicating with a space between the 1 st metal plate and the 2 nd metal plate for injecting the working medium into the space.
7. The manufacturing method of a heat conduction member according to claim 6,
the method for manufacturing a heat conductive member further includes the following injection step: injecting the working medium into the space between the 1 st metal plate and the 2 nd metal plate via the injection part,
in the cutting step, after the working medium is injected into the space in the injection step, the communication path between the space and the injection port exposed by the cutting is closed while the positioning portion is cut.
8. The manufacturing method of a heat conduction member according to claim 1,
in the disposing step, the 2 nd metal plate disposed to face the 1 st metal plate is located inward of an outer shape of the 1 st metal plate when viewed from the facing direction,
in the positioning step, the positioning pin is brought into contact with a 1 st outer peripheral portion defining the outer shape of the 1 st metal plate to perform the positioning.
9. The manufacturing method of a heat conducting member according to claim 8,
in the positioning step, the positioning pins are brought into contact with a plurality of portions in the 1 st outer peripheral portion of the 1 st metal plate to perform the positioning,
the plurality of portions include two portions located on opposite sides of the core structure in a direction perpendicular to the facing direction.
10. The manufacturing method of a heat conduction member according to claim 1,
in the positioning step, the positioning pin is brought into contact with both a 1 st outer peripheral portion defining an outer shape of the 1 st metal plate when viewed from the facing direction and a 2 nd outer peripheral portion defining an outer shape of the 2 nd metal plate in the same shape as the 1 st outer peripheral portion when viewed from the facing direction, to perform the positioning,
in the joining step, the joining portion is formed in the 1 st metal plate and the 2 nd metal plate at a position apart from the 1 st outer peripheral portion and the 2 nd outer peripheral portion toward the core structure body side.
11. The method of manufacturing a heat-conducting member according to claim 10,
in the joining step, in the 1 st metal plate and the 2 nd metal plate which are arranged to face each other, the joining portion is formed at a position apart from the 1 st outer peripheral portion and the 2 nd outer peripheral portion toward the core structure body side by pressing a pressing region which is located more inward than the 1 st outer peripheral portion and the 2 nd outer peripheral portion when viewed from the facing direction with a heated block from the facing direction.
12. The manufacturing method of a heat conducting member according to claim 10 or 11,
in the positioning step, the positioning pins are brought into contact with a plurality of portions in the 1 st outer circumferential portion and the 2 nd outer circumferential portion, respectively, to perform the positioning,
the plurality of portions include two portions located on opposite sides of the core structure in a direction perpendicular to the facing direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010235516.XA CN113471080A (en) | 2020-03-30 | 2020-03-30 | Method for manufacturing heat conduction member |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010235516.XA CN113471080A (en) | 2020-03-30 | 2020-03-30 | Method for manufacturing heat conduction member |
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| CN113471080A true CN113471080A (en) | 2021-10-01 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106871670A (en) * | 2015-12-10 | 2017-06-20 | 莱尔德电子材料(深圳)有限公司 | Heat exchanger |
| JP2019066175A (en) * | 2017-09-28 | 2019-04-25 | 大日本印刷株式会社 | Vapor chamber, electronic equipment and metal sheet for vapor chamber |
| CN110877154A (en) * | 2018-09-06 | 2020-03-13 | 本田技研工业株式会社 | Method and apparatus for manufacturing bonded separator |
-
2020
- 2020-03-30 CN CN202010235516.XA patent/CN113471080A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106871670A (en) * | 2015-12-10 | 2017-06-20 | 莱尔德电子材料(深圳)有限公司 | Heat exchanger |
| JP2019066175A (en) * | 2017-09-28 | 2019-04-25 | 大日本印刷株式会社 | Vapor chamber, electronic equipment and metal sheet for vapor chamber |
| CN110877154A (en) * | 2018-09-06 | 2020-03-13 | 本田技研工业株式会社 | Method and apparatus for manufacturing bonded separator |
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