CN113451845A

CN113451845A - Lead device for measuring temperature of thermal control system tile

Info

Publication number: CN113451845A
Application number: CN202110655928.3A
Authority: CN
Inventors: 朱超; 赵东强
Original assignee: Yanan Thermal Power Plant Of Datang Shaanxi Power Generation Co ltd
Current assignee: Yanan Thermal Power Plant Of Datang Shaanxi Power Generation Co ltd
Priority date: 2021-06-11
Filing date: 2021-06-11
Publication date: 2021-09-28
Anticipated expiration: 2041-06-11
Also published as: CN113451845B

Abstract

The utility model belongs to the field of tile temperature measurement, and discloses a lead device for measuring the temperature of a thermal control system tile, which comprises a device body and a cable, wherein a through mounting opening is arranged on the device body near the cable, and a fusing component is arranged in the mounting opening; the fusing component comprises a fusing cavity, a fusing piece is arranged in the fusing cavity, the fusing piece is electrically connected with the cable and the device body, and metal sodium is used as a melt; the metal sodium is used as a melt, the conductivity is high at normal temperature, when a circuit has a short-circuit fault, the short-circuit current generates high temperature to quickly vaporize the sodium, and the vaporous sodium is in a high-resistance state, so that the short-circuit current is limited; when the short-circuit current disappears, the temperature drops, and the metal sodium recovers the original good conductive performance.

Description

Lead device for measuring temperature of thermal control system tile

Technical Field

The utility model belongs to the tile temperature measurement field, concretely relates to lead wire device of thermal control system tile temperature measurement.

Background

The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry.

Disclosure of Invention

It is an object of the present disclosure to provide a lead wire arrangement for temperature measurement of a thermal control system tile.

The purpose of the disclosure can be realized by the following technical scheme:

the lead device for measuring the temperature of the thermal control system tile comprises a device body and a cable, wherein a through mounting opening is formed in the device body close to the cable, and a fusing assembly is mounted in the mounting opening;

the fusing component comprises a fusing cavity, a fusing piece is arranged in the fusing cavity, the fusing piece is electrically connected with the cable and the device body, and metal sodium is used as a melt;

the fusing component comprises a mounting frame, the mounting frame is mounted in the mounting opening, a rectangular cavity is formed in the mounting frame, a fusing cavity is formed in the rectangular cavity, a partition component is arranged in the rectangular cavity and divides the rectangular cavity into a suction bin at the upper end and a communication bin at the lower end, a fuse link is placed in the communication bin, two opposite side walls of the communication bin are respectively provided with an electrode plate, one electrode plate is electrically connected with a cable, the other electrode plate is electrically connected with the device body, and two sides of the fuse link in the communication bin are respectively attached to the corresponding electrode plates, so that the cable and the device body can be electrically connected by the fuse link in the communication bin;

the pressure intensity of the absorption bin is less than that of the communication bin; the partition assembly comprises a partition plate, a channel which can communicate the absorbing bin and the communicating bin is arranged on the partition plate, a blocking column used for blocking the channel is arranged in the channel, a spring is arranged at the upper end of the blocking column, and the top end of the spring is fixedly connected with the top wall of the absorbing bin.

The device comprises a device body, a terminal strip and a tile box, wherein the tile box is arranged in the middle of the device body, the tile box is tightly attached to the device body, a cable is arranged on the left side of the device body and electrically connected with the device body, an interface device is arranged in the middle of the device body, and the interface device is electrically connected with the device body;

the right side of the device body is provided with a terminal strip which is fixedly connected with the device body, the right end of the device body is provided with a line port which is fixedly connected with the device body, and the right side of the device body is provided with an inserting plate which is fixedly connected with the device body.

Further, be in the intercommunication storehouse be provided with between the installing frame lateral wall sliding connection's the backup pad, the backup pad lower extreme is provided with spacing, when this position, spacing bottom and installing frame bottom portion offset, the backup pad is in the biggest restraint position downwards this moment, the fuse link is placed in the upper end of backup pad, the fuse link both sides in the intercommunication storehouse are laminated with the electrode slice that corresponds respectively for the fuse link that is in the intercommunication storehouse can carry out electric connection with cable and device body.

Furthermore, a touch point is arranged in the channel, an elastic part is arranged at the lower end of the blocking column, a touch block is arranged at the lower end of the elastic part, and when the blocking column blocks the channel, the touch point is positioned between the lower end of the blocking column and the upper end of the touch block;

the channel is internally provided with a bayonet, the blocking column is provided with a clamping block, and when the clamping block on the blocking column is positioned at the bayonet position, the blocking column is rotated to ensure that the clamping block on the blocking column is positioned at the bayonet position.

Further, in the short circuit process, when the touch frequency of the touch sensing point pair and the touch sensing block is smaller than or equal to a threshold value in a specified time period, the clamping block on the blocking column is located at the bayonet position;

and in a specified time period, the blocking column exceeds a threshold value set by the touch frequency of the touch sensing block and the touch sensing point, the blocking column rotates, and the clamping block on the blocking column is separated from the bayonet position.

Furthermore, the top end of the absorption bin is provided with a rotating block which is connected in a rotating mode, and the upper end of the spring is fixedly connected with the rotating block.

Furthermore, two outflow ports which are arranged up and down are arranged in the channel, each outflow port corresponds to one flow channel, the flow channel corresponding to the outflow port positioned above is communicated with the communicating bin, the flow channel corresponding to the outflow port positioned below is communicated with the absorbing bin, and when the blocking column blocks the channel, the blocking column blocks the two outflow ports completely.

Furthermore, a sliding groove is formed in the lower end portion of the mounting frame, limiting clamping blocks which are arranged in a mirror image mode are arranged on the sliding groove, when the mounting frame is located on the mounting opening, the limiting clamping blocks on the lower end portion of the mounting frame are exposed below the mounting opening, the limiting clamping blocks are moved towards two sides, and the limiting clamping blocks are buckled on the edge of the lower end portion of the mounting opening;

the limiting clamping block is provided with a limiting hole, the limiting clamping block is buckled with a clamping cover, and the limiting clamping block on the clamping cover is buckled in the limiting hole.

The beneficial effect of this disclosure:

the sodium metal is used as a melt, the conductivity is high at normal temperature, when a circuit has a short-circuit fault, the short-circuit current generates high temperature to quickly vaporize the sodium, and the vaporous sodium is in a high-resistance state, so that the short-circuit current is limited; when the short-circuit current disappears, the temperature drops, and the metal sodium recovers the original good conductive performance.

Drawings

In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present disclosure, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.

FIG. 1 is a schematic overall structure diagram of an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of a partially exploded structure of an embodiment of the present disclosure;

FIG. 3 is a partial structural schematic of an embodiment of the present disclosure;

FIG. 4 is a cross-sectional view of a fuse assembly according to an embodiment of the disclosure;

FIG. 5 is an enlarged schematic view at A of FIG. 4 of an embodiment of the present disclosure;

fig. 6 is an enlarged schematic structural diagram at B of fig. 4 of an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

As shown in fig. 1 to 6, the lead device for measuring the temperature of the thermal control system tile comprises a device body 11 and a terminal strip 12, wherein a tile box 13 is arranged in the middle of the device body 11, the tile box 13 is tightly attached to the device body 11, a cable 14 is arranged on the left side of the device body 11, the cable 14 is electrically connected with the device body 11, an interface device 2 is arranged in the middle of the device body 11, and the interface device 2 is electrically connected with the device body 11;

the right side of device body 11 is provided with terminal strip 12, and terminal strip 12 and device body 11 fixed connection, the right-hand member of device body 11 are provided with the line mouth, and the line mouth is connected with device body 11 fixed connection, and the right side of device body 11 is provided with inserts board 15, inserts board 15 and device body 11 fixed connection.

A through mounting opening 110 is formed in the device body 11 close to the cable 14, and the fusing component 2 is mounted in the mounting opening 110;

the fusing component 2 comprises a fusing cavity, a fusing piece 21 is arranged in the fusing cavity, the fusing piece 21 is electrically connected with the cable 14 and the device body 11, metal sodium is used as a melt, the conductivity is high at normal temperature, when a short-circuit fault occurs in a circuit, short-circuit current generates high temperature to quickly vaporize sodium, and vapor-state sodium is in a high-resistance state, so that the short-circuit current is limited; when the short-circuit current disappears, the temperature drops, and the metal sodium recovers the original good conductive performance.

In some embodiments, the fuse assembly 2 includes a mounting frame 22, the mounting frame 22 is mounted in the mounting opening 110, a rectangular cavity is formed in the mounting frame 22, the rectangular cavity forms a fuse cavity, a partition assembly is disposed in the rectangular cavity, the partition assembly partitions the rectangular cavity into an upper absorbing bin 2210 and a lower communicating bin 2211, the fuse link 21 is disposed in the communicating bin 2211, electrode pads 23 are disposed on two opposite sidewalls of the communicating bin 2211, one electrode pad 23 is electrically connected to the cable 14, the other electrode pad 23 is electrically connected to the device body 11, two sides of the fuse link 21 in the communicating bin 2211 are respectively attached to the corresponding electrode pads 23, so that the fuse link 21 in the communicating bin 2211 can electrically connect the cable 14 and the device body 11.

The pressure of the absorption cabin 2210 is smaller than that of the communication cabin 2211; the partition assembly comprises a partition plate 31, a channel 30 which can communicate the absorption bin 2210 and the communication bin 2211 is arranged on the partition plate 31, a blocking column 32 for blocking the channel 30 is arranged in the channel 30, a spring 33 is arranged at the upper end of the blocking column 32, and the top end of the spring 33 is fixedly connected with the top wall of the absorption bin 2210; aiming at the beginning, the blocking column 32 is positioned in the channel 30, although pressure difference exists between the absorbing bin 2210 and the communicating bin 2211, the blocking column 32 has a tendency of moving towards the absorbing bin 2210, and because the spring 33 relaxes, the limiting of the blocking column 32 is restrained, so that the blocking column 32 can be stably kept in the channel 30 to block the channel 30; when the short-circuit fault occurs in the circuit, the short-circuit current generates high temperature to rapidly vaporize sodium, the vaporous sodium presents a high resistance state, the pressure in the communicating bin 2211 is increased, the blocking column 32 is extruded until the blocking column 32 is separated from the channel 30, and part of the vaporous sodium in the communicating bin 2211 is discharged into the absorbing bin 2210; the communicating cabin 2211 is opened, including when the short-circuit current disappears, the temperature drops, at this time, the partial gaseous sodium in the communicating cabin 2211 is re-solidified to form the incomplete fuse link 21, and the incomplete fuse link 21 cannot effectively communicate the cable 14 with the device body 11.

In the present embodiment, a supporting plate 24 slidably connected to the side wall of the mounting frame 22 is disposed in the communicating chamber 2211, a limiting strip 25 is disposed at the lower end of the supporting plate 24, at this position, the bottom end of the limiting strip 25 abuts against the bottom end of the mounting frame 22, at this time, the supporting plate 24 is at a downward maximum constraint position, the fuse link 21 is disposed at the upper end of the supporting plate 24, initially, two sides of the fuse link 21 in the communicating chamber 2211 are respectively attached to the corresponding electrode plates 23, so that the fuse link 21 in the communicating chamber 2211 can electrically connect the cable 14 and the device body 11; in the process of discharging part of vaporous sodium in the communicating bin 2211 into the absorbing bin 2210, the supporting plate 24 moves upwards due to the reduction of the pressure in the communicating bin 2211, the electrode plate 23 is gradually shielded and closed by the side wall of the upwards moving supporting plate 24 until the electrode plate 23 is completely shielded and closed, at the moment, part of vaporous sodium in the communicating bin 2211 is re-solidified to form a incomplete fuse link 21, the incomplete fuse link 21 cannot effectively communicate the cable 14 with the device body 11, and the fusing property is ensured.

In this embodiment, for a single short circuit, the communication can be performed again in time, in this embodiment, the channel 30 is provided with the sensing point 301, the lower end of the blocking pillar 32 is provided with the elastic member 321, the lower end of the elastic member 321 is provided with the sensing block 322, and when the blocking pillar 32 blocks the channel 30, the sensing point 301 is located between the lower end of the blocking pillar 32 and the upper end of the sensing block 322;

a bayonet 300 is arranged in the channel 30, a fixture block 323 is arranged on the blocking column 32, when the fixture block 323 on the blocking column 32 is located at the position of the bayonet 300, the blocking column 32 is rotated, so that the fixture block 323 on the blocking column 32 is located at the position of the bayonet 300, at this time, the blocking column 32 is located at a stable position relative to the channel 30, namely, at this time, the blocking column 32 is pushed by external force, and cannot be moved relative to the channel 30, namely, the fuse link 21 is vaporized, so that the pressure of the communicating bin 2211 is increased, only the touch sensing block 322 is caused to move along the channel 30 to form touch with the touch sensing point 301, and the touch sensing point 301 records the touch frequency of the touch sensing block 322 each time;

for example, in some application scenarios, the disconnection recovery needs to be performed in time only for a short-circuit phenomenon, in the short-circuit process, only the touch block 322 touches the touch point 301, and the touch point 301 records the frequency of the touch with the touch block 322, in this environment, for convenience of understanding, a single time (1 time) can be understood, and when the short-circuit current disappears, the temperature drops, and the metal sodium recovers the original good conductivity; of course, the frequency threshold value can be set for a single time according to actual needs, such as 2 times, 3 times and the like;

when the threshold value set by the touch point 301 for the touch frequency with the touch block 322 is exceeded in a specified time period, it can be indirectly determined that the lead device has a substantial defect fault, at this time, an open circuit needs to be stably formed in the communicating bin 2211, that is, the blocking column 32 is controlled to rotate at this time, when a short circuit occurs next time, in the process that part of vaporous sodium in the communicating bin 2211 is discharged into the absorbing bin 2210, when the temperature drops, part of the vaporous sodium in the communicating bin 2211 is re-solidified to form a incomplete fuse link 21, and the incomplete fuse link 21 cannot effectively communicate the cable 14 with the device body 11; or because the electrode slice 23 is gradually shielded by the side wall of the supporting plate 24 until the electrode slice 23 is completely shielded, at the moment, partial gaseous sodium in the communicating bin 2211 is solidified again to form the incomplete fuse link 21, the incomplete fuse link 21 can not effectively communicate the cable 14 with the device body 11, and the fusing property is ensured.

In this embodiment, for the rotation of the plugging column 32, the top end of the absorption bin 2210 is provided with a rotation block 331 which is rotatably connected, the upper end of the spring 33 is fixedly connected with the rotation block 331, the rotation block 331 is connected with an external driving member, the driving member drives the rotation block 331 to rotate, the rotation block 331 drives the plugging column 32 to rotate through the spring 33, so that the fixture block 323 of the plugging column 32 is clamped in the bayonet 300, and at this time, the plugging column 32 is in a stable state relative to the channel 30; of course, the latch 323 on the blocking post 32 can be disengaged from the bayonet 300 according to the requirement, such as to maintain a stable open circuit of the communicating chamber 2211.

In the present embodiment, two outflow ports 302 are disposed up and down in the channel 30, each outflow port 302 corresponds to one flow channel, the flow channel corresponding to the outflow port 302 located above communicates with the communicating bin 2211, the flow channel corresponding to the outflow port 302 located below communicates with the accommodating bin 2210, and when the blocking column 32 blocks the channel 30, the blocking column 32 blocks the two outflow ports 302 completely; certainly, in some scenes, when the circuit has a short-circuit fault in a state where the fixture block 323 on the blocking column 32 is disengaged from the bayonet 300, the short-circuit current generates high temperature to rapidly vaporize sodium, the vaporous sodium is in a high resistance state, at this time, the pressure in the communicating bin 2211 is increased, the blocking column 32 is squeezed until the blocking column 32 is disengaged from the channel 30 or the vaporous sodium enters the absorbing bin 2210 from a flow channel corresponding to the outflow port 302 located below, and part of the vaporous sodium in the communicating bin 2211 is discharged into the absorbing bin 2210; or the gaseous sodium is supplemented to the communicating cabin 2211 to form the fuse link 21, the accommodating cabin 2210 is heated to vaporize the sodium in the accommodating cabin 2210, and then the sodium is expanded to extrude the blocking column 32 until the blocking column 32 moves, so that the vaporous sodium enters the communicating cabin 2211 from the flow channel corresponding to the outflow port 302 positioned above, part of the vaporous sodium in the accommodating cabin 2210 is discharged into the communicating cabin 2211, the communicating cabin 2211 is expanded until the bottom end of the limiting strip 25 abuts against the bottom end of the mounting frame 22, the communicating cabin 2211 completes sodium supplementation, and after the temperature is reduced, the sodium in the communicating cabin 2211 is cooled to form the fuse link 21, so that the communicating cabin 2211 is communicated again.

In this embodiment, a sliding groove is formed in the lower end portion of the mounting frame 22, a limiting fixture block 251 arranged in a mirror image is arranged on the sliding groove, when the mounting frame 22 is located on the mounting opening 110, the limiting fixture block 251 on the lower end portion of the mounting frame 22 is exposed below the mounting opening 110, and the limiting fixture block 251 is moved towards two sides, so that the limiting fixture block 251 is fastened on the edge of the lower end portion of the mounting opening 110;

the limiting clamping block 251 is provided with a limiting hole 250, the limiting clamping block 251 is buckled with the clamping cover 26, the limiting clamping block 251 on the clamping cover 26 is buckled in the limiting hole 250, the limiting clamping block 251 and the clamping cover 26 are mutually installed and positioned, the clamping cover 26 is provided with a threaded hole, the device body 11 is provided with a corresponding threaded hole, the bolt 27 is matched with the threaded hole, and the mounting frame 22 is fixedly installed on the device body 11 through the clamping cover 26.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the disclosure. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing illustrates and describes the general principles, principal features, and advantages of the present disclosure. It will be understood by those skilled in the art that the present disclosure is not limited to the embodiments described above, which are presented solely for purposes of illustrating the principles of the disclosure, and that various changes and modifications may be made to the disclosure without departing from the spirit and scope of the disclosure, which is intended to be covered by the claims.

Claims

1. The lead device for measuring the temperature of the thermal control system tile comprises a device body (11) and a cable (14), and is characterized in that a through mounting hole (110) is formed in the device body (11) close to the cable (14), and a fusing component (2) is mounted in the mounting hole (110);

the fusing component (2) comprises a fusing cavity, a fusing piece (21) is arranged in the fusing cavity, the fusing piece (21) is electrically connected with the cable (14) and the device body (11), and metal sodium is used as a melt;

the fusing component (2) comprises a mounting frame (22), the mounting frame (22) is mounted in a mounting opening (110), a rectangular cavity is formed in the mounting frame (22), a fusing cavity is formed by the rectangular cavity, a partition component is arranged in the rectangular cavity, the partition component divides the rectangular cavity into a suction cabin (2210) at the upper end and a communication cabin (2211) at the lower end, a fusing piece (21) is placed in the communication cabin (2211), electrode pieces (23) are respectively arranged on two opposite side walls of the communication cabin (2211), one electrode piece (23) is electrically connected with a cable (14), the other electrode piece (23) is electrically connected with the device body (11), two sides of the fusing piece (21) in the communication cabin (2211) are respectively attached to the corresponding electrode pieces (23), so that the fuse link (21) in the communication cabin (2211) can electrically connect the cable (14) and the device body (11);

the pressure of the absorption bin (2210) is smaller than that of the communication bin (2211); the partition assembly comprises a partition plate (31), a channel (30) which can communicate the absorbing bin (2210) and the communicating bin (2211) is arranged on the partition plate (31), a blocking column (32) which is used for blocking the channel (30) is arranged in the channel (30), a spring (33) is arranged at the upper end of the blocking column (32), and the top end of the spring (33) is fixedly connected with the top wall of the absorbing bin (2210).

2. The lead device for measuring the temperature of the tiles of the thermal control system according to claim 1, comprising a terminal row (12) and a tile box (13), wherein the tile box (13) is arranged in the middle of the device body (11), the tile box (13) is tightly attached to the device body (11), a cable (14) is arranged on the left side of the device body (11), the cable (14) is electrically connected with the device body (11), an interface device (2) is arranged in the middle of the device body (11), and the interface device (2) is electrically connected with the device body (11);

the right side of the device body (11) is provided with a terminal strip (12), the terminal strip (12) is fixedly connected with the device body (11), the right end of the device body (11) is provided with a line port, the line port is fixedly connected with the device body (11), the right side of the device body (11) is provided with an inserting plate (15), and the inserting plate (15) is fixedly connected with the device body (11).

3. The lead device for measuring the temperature of the tile block of the thermal control system according to claim 1, wherein a support plate (24) slidably connected with the side wall of the mounting frame (22) is arranged in the communicating chamber (2211), a limit strip (25) is arranged at the lower end of the support plate (24), the bottom end of the limit strip (25) abuts against the bottom end of the mounting frame (22) at this position, the support plate (24) is at a downward maximum constraint position, the fuse link (21) is arranged at the upper end of the support plate (24), and two sides of the fuse link (21) in the communicating chamber (2211) are respectively attached to the corresponding electrode plates (23), so that the fuse link (21) in the communicating chamber (2211) can electrically connect the cable (14) and the device body (11).

4. The lead device for measuring the temperature of the thermal control system tile according to claim 1, wherein a sensing contact point (301) is arranged in the channel (30), an elastic member (321) is arranged at the lower end of the blocking column (32), a sensing contact block (322) is arranged at the lower end of the elastic member (321), and when the blocking column (32) blocks the channel (30), the sensing contact point (301) is positioned between the lower end of the blocking column (32) and the upper end of the sensing contact block (322);

a bayonet (300) is formed in the channel (30), a clamping block (323) is formed on the blocking column (32), and when the clamping block (323) on the blocking column (32) is located at the position of the bayonet (300), the blocking column (32) is rotated, so that the clamping block (323) on the blocking column (32) is located at the position of the bayonet (300).

5. The lead device for temperature measurement of the thermal control system tile according to claim 4, wherein for a short circuit process, when the frequency of the touch point (301) to the touch block (322) is less than or equal to a threshold value within a specified time period, the fixture block (323) on the blocking column (32) is at the position of the bayonet (300);

when the touch frequency of the touch point (301) to the touch block (322) is set to exceed a threshold value within a specified time period, the blocking column (32) rotates, and the fixture block (323) on the blocking column (32) is separated from the position of the bayonet (300).

6. The lead wire device for temperature measurement of the thermal control system tile according to claim 1, wherein the top end of the absorption bin (2210) is provided with a rotary block (331) which is rotatably connected, and the upper end of the spring (33) is fixedly connected with the rotary block (331).

7. The lead wire device for temperature measurement of tiles of a thermal control system according to claim 5, wherein two outflow ports (302) are formed in the channel (30) and arranged up and down, each outflow port (302) corresponds to one flow channel, the flow channel corresponding to the outflow port (302) at the upper part is communicated with the communicating cabin (2211), the flow channel corresponding to the outflow port (302) at the lower part is communicated with the absorbing cabin (2210), and when the channel (30) is blocked by the blocking column (32), the two outflow ports (302) are completely blocked by the blocking column (32).

8. The lead device for measuring the temperature of the tiles of the thermal control system according to claim 1, wherein a sliding groove is formed in the lower end portion of the mounting frame (22), limiting clamping blocks (251) arranged in a mirror image mode are arranged on the sliding groove, when the mounting frame (22) is located on the mounting opening (110), the limiting clamping blocks (251) on the lower end portion of the mounting frame (22) are exposed below the mounting opening (110), and the limiting clamping blocks (251) are moved towards two sides, so that the limiting clamping blocks (251) are clamped on the edge of the lower end portion of the mounting opening (110);

the limiting clamping block (251) is provided with a limiting hole (250), the limiting clamping block (251) is buckled with a clamping cover (26), and the limiting clamping block (251) on the clamping cover (26) is buckled in the limiting hole (250).