CN113451529A - Display panel, preparation method plate and display device - Google Patents
Display panel, preparation method plate and display device Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title abstract description 19
- 239000010410 layer Substances 0.000 claims abstract description 326
- 239000012044 organic layer Substances 0.000 claims abstract description 121
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 62
- 239000000758 substrate Substances 0.000 claims description 84
- 238000002955 isolation Methods 0.000 claims description 56
- 239000000463 material Substances 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 42
- 238000004519 manufacturing process Methods 0.000 claims description 30
- 230000005540 biological transmission Effects 0.000 claims description 18
- 239000011540 sensing material Substances 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 239000010408 film Substances 0.000 description 19
- 238000001514 detection method Methods 0.000 description 14
- 239000002245 particle Substances 0.000 description 13
- 230000008859 change Effects 0.000 description 12
- 238000002834 transmittance Methods 0.000 description 12
- 239000003292 glue Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 239000011368 organic material Substances 0.000 description 8
- 244000062793 Sorghum vulgare Species 0.000 description 4
- 235000019713 millet Nutrition 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
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Abstract
The application discloses a display panel, a preparation method and a display device, relates to the technical field of display, and can improve the influence of photoresist residue between an organic layer and an electrode layer on device performance in the preparation process of the existing organic light-emitting display panel. The display panel includes: a backing plate comprising a first target area and a second target area; a first device disposed within the second target area of the backplane, the first device comprising a first organic layer and a first electrode layer, the first organic layer disposed between the backplane and the first electrode layer; a second electrode layer, the first device disposed between the backplane and the second electrode layer.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel, a preparation method and a display device.
Background
With the continuous progress of science and technology, display devices such as smart phones and tablet computers have become an indispensable part of people's lives. The display panel is also being more demanded as an important component of the display device. An Organic Light-Emitting Diode (OLED) Display panel has advantages of being lighter and thinner, higher in brightness, lower in power consumption, faster in response, higher in definition, better in flexibility, and higher in Light-Emitting efficiency than a Liquid Crystal Display (LCD) panel, and is widely used in Display devices.
However, in the preparation process of the organic light emitting device in the existing organic light emitting display panel, photoresist residue is easily generated between the organic layer and the electrode layer, which affects the transmission of current carriers in the device, and further affects the performance of the device.
Disclosure of Invention
The embodiment of the application provides a display panel, a preparation method and a display device, which can improve the influence of photoresist residue between an organic layer and an electrode layer on the device performance in the preparation process of the conventional organic light-emitting display panel.
In a first aspect of embodiments of the present application, a display panel is provided, including:
a backing plate comprising a first target area and a second target area;
a first device disposed within the second target area of the backplane, the first device comprising a first organic layer and a first electrode layer, the first organic layer disposed between the backplane and the first electrode layer;
a second electrode layer, the first device disposed between the backplane and the second electrode layer.
In some embodiments, the display panel further comprises:
a second device disposed within the first target region of the backplate, the second device disposed between the backplate and the second electrode layer, the second device including a second organic layer and a third electrode layer, the second organic layer disposed between the backplate and the third electrode layer.
In some embodiments, the orthographic projection of the first device on the backplane is a first projection, the orthographic projection of the second device on the backplane is a second projection, the display panel comprises a high light transmission region, the orthographic projection of the high light transmission region on the backplane is a third projection, and the third projection separates the first projection from the second projection;
the orthographic projection of the second electrode layer on the back plate covers the first projection, the second projection and the third projection.
In some embodiments, one of the first organic layer and the second organic layer is made of an organic light emitting material and the other is made of a photo-sensing material; or the like, or, alternatively,
one of the first organic layer and the second organic layer is made of a first organic light emitting material, and the other is made of a second organic light emitting material.
In some embodiments, the area of the first projection is different from the area of the second projection.
In a second aspect of the embodiments of the present application, there is provided a method for manufacturing a display panel, which is applied to the display panel according to the first aspect, the method including:
arranging a first isolation layer in a first target area of a backboard to obtain a first intermediate substrate;
sequentially arranging a first organic layer and a first electrode layer on one side of the first intermediate substrate, which is far away from the backboard, so as to form a first device in a second target area of the backboard;
stripping the first isolation layer to obtain a second intermediate substrate;
and arranging a second electrode layer on one side of the second intermediate substrate, which is far away from the back plate.
In some embodiments, before the step of disposing the second electrode layer on the side of the second intermediate substrate facing away from the back sheet, the method further comprises:
arranging a second isolation layer on one side of the second intermediate substrate, which is far away from the backboard, so as to obtain a third intermediate substrate, wherein the second isolation layer is arranged in the second target area of the backboard;
sequentially arranging a second organic layer and a third electrode layer on one side of the third intermediate substrate, which is far away from the backboard, so as to form a second device in the first target area;
stripping the second isolation layer to obtain a fourth intermediate substrate;
the step of providing a second electrode layer on a side of the second intermediate substrate facing away from the backplane comprises:
and arranging the second electrode layer on one side of the fourth intermediate substrate, which is far away from the back plate.
In some embodiments, the step of providing a first isolation layer within the first target area of the backplane to obtain a first intermediate substrate comprises:
and sequentially arranging a first sacrificial layer and a first photoresist layer in the first target area of the backboard to obtain the first intermediate substrate.
In some embodiments, the step of sequentially disposing a first sacrificial layer and a first photoresist layer in the first target area of the backplate to obtain the first intermediate substrate comprises:
sequentially arranging a first sacrificial film and a first photoresist film on one side of the back plate;
sequentially exposing and developing the first photoresist film to obtain a first photoresist layer;
and dissolving the first sacrificial film based on the first photoresist layer to form a first sacrificial layer, so as to obtain the first intermediate substrate, wherein the first sacrificial layer and the first photoresist layer form the first isolation layer.
In some embodiments, the step of peeling off the first isolation layer to obtain the second intermediate substrate includes:
dissolving the first sacrificial layer in the first isolation layer to enable the first photoresist layer in the first isolation layer and the first organic layer and the first electrode layer stacked on the first photoresist layer to be stripped together, and obtaining the second intermediate substrate.
In some embodiments, the orthographic projection of the first device on the backplane is a first projection, the orthographic projection of the second device on the backplane is a second projection, the display panel comprises a high light transmission region, the orthographic projection of the high light transmission region on the backplane is a third projection, and the third projection separates the first projection from the second projection;
the step of providing a second electrode layer on a side of the fourth intermediate substrate facing away from the backplane comprises:
and arranging the second electrode layer on one side of the fourth intermediate substrate, which is far away from the back plate, so that the orthographic projection of the second electrode layer on the back plate covers the first projection, the second projection and the third projection.
In some embodiments, the material from which the first organic layer is made is different from the material from which the second organic layer is made.
In some embodiments, one of the first organic layer and the second organic layer is made of an organic light emitting material and the other is made of a photo-sensing material; or the like, or, alternatively,
one of the first organic layer and the second organic layer is made of a first organic light emitting material, and the other is made of a second organic light emitting material.
In some embodiments, the step of providing a first spacer layer in the first target area of the backplane to obtain a first intermediate substrate is preceded by the steps of:
and arranging a first anode in the first target area of the back plate, and arranging a second anode in the second target area of the back plate to obtain a fifth intermediate substrate.
In some embodiments, before the step of disposing a first isolation layer in the first target area of the backplane to obtain a first intermediate substrate, the method further comprises:
and arranging a pixel defining layer on one side of the fifth intermediate substrate, which faces away from the back plate, wherein the orthographic projection of the pixel defining layer on the back plate covers the edge of the orthographic projection of the first anode on the back plate and the edge of the orthographic projection of the second anode on the back plate.
In a third aspect of the embodiments of the present application, there is provided a display device including: the display panel according to the first aspect.
In the display panel, the preparation method and the display device provided by the embodiment of the application, the first electrode layer and the second electrode layer can be used as a cathode together, it will be appreciated that the first electrode layer and the second electrode layer need to be prepared separately, and the step of photoresist stripping can be carried out from before the first electrode layer is prepared to after the first electrode layer is prepared, and then can avoid the cull particle between first organic layer and first electrode layer to influence the transmission of carrier, first electrode layer and second electrode layer pass through the form electricity of face contact and connect jointly as the negative pole, can not influence and be connected between first electrode layer and the second electrode layer electricity, compare in prior art the cull and exist between organic layer and the electrode layer, the display panel that this application embodiment provided can solve the cull and to the carrier transmission between organic layer and the electrode layer, and then can improve the performance of first device.
Drawings
Fig. 1 is a schematic partial structure diagram of a display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic partial structure diagram of another display panel provided in an embodiment of the present application
Fig. 3 is a schematic partial structure diagram of another display panel according to an embodiment of the present disclosure;
fig. 4 is a partial top view of a display panel according to an embodiment of the present disclosure;
fig. 5 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 6 is a partial schematic view of a structural change in a manufacturing process of a display panel according to an embodiment of the present disclosure;
FIG. 7 is a partial top view of a backing plate according to an embodiment of the present disclosure;
fig. 8 is a partial schematic view of a structural change in a manufacturing process of another display panel according to an embodiment of the present disclosure;
fig. 9 is a light emitting efficiency test curve of a light emitting device according to an embodiment of the present application;
fig. 10 is an external quantum efficiency test curve of a photoelectric detection device provided in an embodiment of the present application;
fig. 11 is a partial schematic view of a structural change in a manufacturing process of another display panel according to an embodiment of the present disclosure;
fig. 12 is a partial schematic view of a structural change in a manufacturing process of another display panel according to an embodiment of the present disclosure;
fig. 13 is a partial schematic view of a structural change in a manufacturing process of a display panel according to an embodiment of the present disclosure;
fig. 14 is a schematic structural diagram of a display device according to an embodiment of the present application.
Detailed Description
In order to better understand the technical solutions provided by the embodiments of the present specification, the technical solutions of the embodiments of the present specification are described in detail below with reference to the drawings and specific embodiments, and it should be understood that the specific features in the embodiments and examples of the present specification are detailed descriptions of the technical solutions of the embodiments of the present specification, and are not limitations on the technical solutions of the embodiments of the present specification, and the technical features in the embodiments and examples of the present specification may be combined with each other without conflict.
In this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element. The term "two or more" includes the case of two or more.
With the continuous progress of science and technology, display devices such as smart phones and tablet computers have become an indispensable part of people's lives. The display panel is also being more demanded as an important component of the display device. The organic light emitting diode display panel has advantages of being lighter and thinner, higher in brightness, lower in power consumption, faster in response, higher in definition, better in flexibility, higher in light emitting efficiency, and the like than the liquid crystal display panel, and thus is widely used in display devices. However, in the preparation process of the organic light emitting device in the existing organic light emitting display panel, photoresist residue is easily generated between the organic layer and the electrode layer, which affects the transmission of current carriers in the device, and further affects the performance of the device.
In view of the above, the present disclosure provides a display panel, a manufacturing method thereof and a display device, which can improve the effect of photoresist remaining between an organic layer and an electrode layer on device performance in the manufacturing process of the conventional organic light emitting display panel.
In a first aspect of an embodiment of the present application, a display panel is provided, and fig. 1 is a schematic partial structure diagram of the display panel provided in the embodiment of the present application. As shown in fig. 1, the display panel includes:
a backing plate 100 comprising a first target area 110 and a second target area 120; a first device 300 disposed in the second target area 120 of the back plate 100, the first device 300 including a first organic layer 310 and a first electrode layer 320, the first organic layer 310 disposed between the back plate 100 and the first electrode layer 320; a second electrode layer 400, and the first device 300 is disposed between the back plate 100 and the second electrode layer 400.
The display panel provided by the embodiment of the application can be used as a cathode by arranging the first electrode layer 320 and the second electrode layer 400, it is understood that the first electrode layer 320 and the second electrode layer 400 need to be separately prepared, the step of photoresist stripping can be performed from before the first electrode layer 320 is prepared to after the first electrode layer 320 is prepared, and then can avoid the cull particle between first organic layer 310 and first electrode layer 320 to influence the transmission of carrier, first electrode layer 320 and second electrode layer 400 are connected through the form electricity of face contact and are regarded as the negative pole jointly, can not influence and be connected between first electrode layer 320 and the second electrode layer 400 electrically, compared in the residual glue and exist between organic layer and the electrode layer among the prior art, the display panel that this application embodiment provided can solve the cull and to the carrier transmission between organic layer and the electrode layer, and then can improve the performance of first device 300.
In some embodiments, fig. 2 is a schematic partial structure diagram of another display panel provided in an embodiment of the present application. As shown in fig. 2, the display panel may further include:
the second device 600 is disposed in the first target region 110 of the back plate 100, the second device 600 is disposed between the back plate 100 and the second electrode layer 400, the second device 600 includes a second organic layer 610 and a third electrode layer 620, and the second organic layer 610 is disposed between the back plate 100 and the third electrode layer 620.
In some embodiments, the material from which the first organic layer is made is different from the material from which the second organic layer is made. The organic material employed for the first organic layer 310 is different from the organic material employed for the second organic layer 610, and thus the first device 300 and the second device 600 are different devices, what the first device 300 is depending on what organic material is employed for the first organic layer 310, illustratively, one of the first organic layer 310 and the second organic layer 610 is made of an organic light emitting material and the other is made of a photo-sensing material; alternatively, one of the first and second organic layers 310 and 610 is made of a first organic light emitting material, and the other is made of a second organic light emitting material. If the first organic material is an organic light emitting material, the first device 300 is an organic light emitting device, and the first device 300 may be configured to emit light to provide light for the display panel to display a picture. If the first organic layer 310 employs a photo-detection material, the first device 300 is an organic photo-detection device, which can be used to provide a fingerprint identification function for the display panel. Organic photoelectric detector can utilize the light that organic light emitting device sent to be the light source, and the light of light source is if running into the millet or the ridge of the fingerprint on display panel surface, and then the light intensity of reflection can be different, and organic photoelectric detector can reflect back light intensity or wavelength conversion to the signal of telecommunication through the millet or the ridge that will sense to the fingerprint to realize fingerprint identification's function. The type of the second device 600 depends on the type of material used for the second organic layer 610, and the second device 600 may also be an organic light emitting device or a photodetector device. If the first device 300 and the second device 600 are both organic light emitting devices, the colors of light emitted by the first device 300 and the second device 600 may be different, and the organic light emitting materials used for the corresponding first organic layer 310 and the second organic layer 610 are also different. For example, if the first organic layer 310 employs a red organic light emitting material, the second organic layer 610 may employ a blue organic light emitting material or a green organic light emitting material, which are not particularly limited in this application.
The display panel provided in the embodiment of the present application needs to be separately manufactured because the first organic layer 310 and the second organic layer 610 use different materials to form different devices. When the first device 300 and the second device 600 are separately prepared, the isolation layer needs to be peeled off twice, the adhesive residue particles can be remained on the surfaces of the first electrode layer 320 and the third electrode layer 620 in the process of peeling the isolation layer, and the second electrode layer 400 is arranged on the whole surface, so that compared with the condition that the adhesive residue exists between the organic layer and the electrode layer in the prior art, the adhesive residue particles are transferred between the first electrode layer 320 and the second electrode layer 400 in the embodiment of the application, and the problem of carrier transmission between the organic layer and the electrode layer by the adhesive residue can be solved under the condition that the adhesive residue does not influence the electric connection between the first electrode layer 320 and the second electrode layer 400, so that the performances of the first device 300 and the second device 600 can be improved. The carrier may be an electron or a hole, and the present application is not particularly limited.
In some embodiments, fig. 3 is a schematic partial structure diagram of another display panel provided in an embodiment of the present application. As shown in fig. 3, the display panel may further include an anode including a first anode 710 and a second anode 720, the first anode 710 being located in the second target region 120, the second anode 720 being located in the first target region 110; the first anode 710 is disposed between the back plate 100 and the first organic layer 310, and the second anode 720 is disposed between the back plate 100 and the second organic layer 610. The first anode 710 corresponds to the first device 300 and the second anode 720 corresponds to the second device 600. The first anode 710 and the first electrode layer 320 may act on the first organic layer 310, and the second anode 720 and the third electrode layer 620 may act on the second organic layer 610. The edges of the first anode 710 and the second anode 720 may be covered by the pixel definition layer 800, and the orthographic projection of the pixel definition layer 800 on the backplane 100 covers the edge of the orthographic projection of the first anode 710 on the backplane and the edge of the orthographic projection of the second anode 720 on the backplane. The pixel defining layer 800 serves to define the boundaries of the first device 300 and the second device 600, i.e. to separate the first device 300 and the second device 600. The pixel defining layer 800 covers edges of the first anode 710 and the second anode 720, a middle portion of the first anode 710 and the second anode 720 is exposed, the exposed portion of the first anode 710 is used for contacting the first organic layer 310, and the exposed portion of the second anode 720 is used for contacting the second organic layer 610.
The display panel provided by the embodiment of the application is provided with the first anode 710 and the second anode 720, the first anode 710 and the first electrode layer 320 jointly act on the first organic layer 310, the second anode 720 and the third electrode layer 620 jointly act on the second organic layer 610, and the pixel defining layer 800 is used for defining the boundary of the first device 300 and the second device 600, so that the mutual interference between the first device 300 and the second device 600 can be avoided.
In some embodiments, fig. 4 is a partial top view of a display panel provided in an embodiment of the present application. With reference to fig. 3 and 4, an orthographic projection of the first device 300 on the rear panel 100 is a first projection 140, an orthographic projection of the second device 600 on the rear panel 100 is a second projection 150, the display panel includes a high-transmittance region 160, an orthographic projection of the high-transmittance region 160 on the rear panel 100 is a third projection 130, and the third projection 130 separates the first projection 140 from the second projection 150; the third projection 130 may be located at the overlap region of the first target region 110 and the second target region 120. The size relationship, shape and arrangement of the first projection 140 and the second projection 150 shown in fig. 4 are only schematic and are not intended to limit the present application. The orthographic projection of the second electrode layer 400 on the back-plate 100 covers the first projection 140, the second projection 150 and the third projection 130. As shown in fig. 3, in the high light transmittance region 160, only a single layer of the second electrode layer 400 has a higher light transmittance in the high light transmittance region 160 than in the region where the first device 300 is located and the region where the second device 600 is located, and the arrangement of the high light transmittance region 160 can improve the light transmittance of the display panel.
The display panel that this application embodiment provided utilizes high light transmission region 160 to the improvement of display panel light transmissivity, can realize the design of camera under the screen, can need not to dig the hole design on display panel and place the camera, can improve display panel's screen and account for than.
In some embodiments, as shown in fig. 4, the area of the first projection 140 is different from the area of the second projection 150. If the second device 600 is an organic photodetection device and the first device 300 is an organic light emitting device, the area of the second projection 150 may be smaller than the area of the first projection 140, and generally, the organic photodetection device may not occupy a large area, and the space can be saved for the high light-transmitting region 160.
In a second aspect of the embodiments of the present application, a method for manufacturing a display panel is provided, and fig. 5 is a schematic flowchart of the method for manufacturing the display panel provided in the embodiments of the present application. As shown in fig. 5, a method for manufacturing a display panel provided in the embodiment of the present application includes:
s100: and arranging a first isolation layer in a first target area of the back plate to obtain a first intermediate substrate. Fig. 6 is a partial schematic view of a structural change in a manufacturing process of a display panel according to an embodiment of the present disclosure; fig. 7 is a partial top view of a back plate according to an embodiment of the present disclosure. Referring to fig. 6 and 7, the backplate 100 includes a first target area 110 and a second target area 120, and in step S100, a first spacer 200 is disposed in the first target area 110 of the backplate 100, resulting in a first intermediate substrate a 10. Fig. 7 is a partial top view of the back plate 100, and the number and arrangement of the first target areas 110 and the second target areas 120 of the back plate 100 can be designed according to specific requirements, and the application is not limited in detail. The first isolation layer 200 may be made of a fluorine-containing ether material, such as photoresist, and the like, and the application is not particularly limited.
S200: and sequentially arranging a first organic layer and a first electrode layer on one side of the first intermediate substrate, which is far away from the back plate, so as to form a first device in a second target area of the back plate. Exemplarily, as shown in fig. 6, the first organic layer 310 and the first electrode layer 320 are sequentially disposed on the side of the first intermediate substrate a10 facing away from the back plate 100, and the first device 300 may be formed in the second target area 120 of the back plate 100. The back plate 100 may be a driving back plate, the back plate 100 may be used to drive the operation of the first device 300, and the first device 300 may be disposed on a driving side of the back plate 100, which is not specifically limited in this application. The first organic layer 310 and the first electrode layer 320 may be prepared on the whole surface during the preparation process, so that a portion of the first organic layer 310 and the first electrode layer 320 is also disposed above the first isolation layer 200. The first device 300 may be an Organic light emitting device, or may be an Organic photo electric Detector (OPD) for fingerprint recognition, and the present application is not particularly limited.
S300: and stripping the first isolation layer to obtain a second intermediate substrate. With continued reference to fig. 6, the first isolation layer 200 is stripped off to obtain a second intermediate substrate a20, and when the first isolation layer 200 is stripped off, the first organic layer 310 and the first electrode layer 320 stacked on the first isolation layer are also stripped off. The first isolation layer 200 may be dissolved and peeled off by using a peeling solution, and the application is not particularly limited.
S400: and arranging a second electrode layer on one side of the second intermediate substrate, which is far away from the back plate. With continued reference to fig. 6, a second electrode layer 400 is provided on the side of the second intermediate substrate a20 facing away from the back-sheet 100. The first electrode layer 320 and the second electrode layer 400 are in surface contact, and the first electrode layer 320 and the second electrode layer 400 may act as one electrode layer in common to the first organic layer. The first isolation layer 200 is peeled off after the first electrode layer 320 is prepared, some adhesive residue particles inevitably remain on the surface of the first electrode layer 320 in the process of peeling off the first isolation layer 200, in order to enhance the driving capability of the first electrode layer 320, the second electrode layer 400 is arranged on the first electrode layer 320 and is used for driving the whole surface, and the first electrode layer 320 is in surface contact with the second electrode layer 400, so that even if some adhesive residue particles exist between the first electrode layer 320 and the second electrode layer 400, the electrical connection between the first electrode layer 320 and the second electrode layer 400 is not affected. The first electrode layer 320 and the second electrode layer 400 may be made of the same conductive material, and the present application is not particularly limited.
It should be noted that the first intermediate substrate a10 and the second intermediate substrate a20 both belong to a process product in a manufacturing process of a display panel, and the present application is not particularly limited.
In the method for manufacturing a display panel according to the embodiment of the present application, the first isolation layer 200 is disposed to shield the first target region 110, the first device 300 is manufactured in the second target region 120 that is not shielded, the first device 300 includes the first organic layer 310 and the first electrode layer 320, after the first electrode layer 320 is manufactured, the first isolation layer 200 is peeled off, the residual glue particles only remain on the surface of the first electrode layer 320, the second electrode layer 400 is disposed on the first electrode layer 320, the residual glue particles exist between the first electrode layer 320 and the second electrode layer 400, the first electrode layer 320 and the second electrode layer 400 are in surface contact, and the residual glue particles do not cause adverse effects on electrical connection due to a conductor material in surface contact, so that, compared with the existing method for manufacturing a display panel, the situation that the residual glue particles exist between the organic layer and the electrode layer affects the carrier transport performance between the electrode layer and the organic layer, further influencing the performance of the device, the preparation method of the display panel provided by the embodiment of the application has the advantages that by arranging two layers of electrode surfaces to be contacted, that is, the first electrode layer 320 and the second electrode layer 400 are in surface contact and jointly used as one electrode layer, the first electrode layer 320 and the second electrode layer 400 need to be separately prepared, the step of stripping the photoresist can be carried out from before the first electrode layer 320 is prepared to after the first electrode layer 320 is prepared, thereby preventing the photoresist from remaining between the first organic layer 310 and the first electrode layer 320, which is different from the prior art in which the photoresist remains between the organic layer and the electrode layer, the present embodiment transfers the remnant glue particles between the first electrode layer 320 and the second electrode layer 400, under the condition that the electric connection between the first electrode layer 320 and the second electrode layer 400 is not affected, the problem of carrier transmission between the organic layer and the electrode layer due to residual glue can be solved, and the performance of the first device 300 can be improved.
In some embodiments, fig. 8 is a partial schematic view of a structural change in a manufacturing process of another display panel provided in examples of the present application. As shown in fig. 8, before step S400, the method for manufacturing a display panel provided in the embodiment of the present application may further include:
s301: and arranging a second isolation layer on one side of the second intermediate substrate, which is far away from the backboard, to obtain a third intermediate substrate, wherein the second isolation layer is arranged in a second target area of the backboard. Providing the second isolation layer 500 in the second target area 120 on the side of the second intermediate substrate a20 facing away from the backpanel 100 enables to obtain a third intermediate substrate a 30.
S302: and sequentially arranging a second organic layer and a third electrode layer on one side of the third intermediate substrate, which is far away from the back plate, so as to form a second device in the first target area. With continued reference to fig. 8, by sequentially providing a second organic layer 610 and a third electrode layer 620 on a side of the third intermediate substrate a30 facing away from the backplane 100, a second device 600 may be formed in the first target area.
S303: and stripping the second isolation layer to obtain a fourth intermediate substrate. Simultaneously with the peeling of the second separation layer 500, the second organic layer 610 and the third electrode layer 620 stacked on the second separation layer 500 are also peeled off, and a fourth intermediate substrate a40 can be obtained.
Step S400, including:
and arranging a second electrode layer on one side of the fourth intermediate substrate, which is far away from the back plate. With continued reference to fig. 8, a second electrode layer 400 is provided on a side of the fourth intermediate substrate a40 facing away from the backsheet 100.
In some embodiments, the material from which the first organic layer is made is different from the material from which the second organic layer is made. The organic material employed for the first organic layer 310 is different from the organic material employed for the second organic layer 610, and thus the first device 300 and the second device 600 are different devices, what the first device 300 is depending on what organic material is employed for the first organic layer 310, illustratively, one of the first organic layer 310 and the second organic layer 610 is made of an organic light emitting material and the other is made of a photo-sensing material; alternatively, one of the first and second organic layers 310 and 610 is made of a first organic light emitting material, and the other is made of a second organic light emitting material. If the first organic material is an organic light emitting material, the first device 300 is an organic light emitting device, and the first device 300 may be configured to emit light to provide light for the display panel to display a picture. If the first organic layer 310 employs a photo-detection material, the first device 300 is an organic photo-detection device, which can be used to provide a fingerprint identification function for the display panel. Organic photoelectric detector can utilize the light that organic light emitting device sent to be the light source, and the light of light source is if running into the millet or the ridge of the fingerprint on display panel surface, and then the light intensity of reflection can be different, and organic photoelectric detector can reflect back light intensity or wavelength conversion to the signal of telecommunication through the millet or the ridge that will sense to the fingerprint to realize fingerprint identification's function. The type of the second device 600 depends on the type of material used for the second organic layer 610, and the second device 600 may also be an organic light emitting device or a photodetector device. If the first device 300 and the second device 600 are both organic light emitting devices, the colors of light emitted by the first device 300 and the second device 600 may be different, and the organic light emitting materials used for the corresponding first organic layer 310 and the second organic layer 610 are also different. For example, if the first organic layer 310 employs a red organic light emitting material, the second organic layer 610 may employ a blue organic light emitting material or a green organic light emitting material, which are not particularly limited in this application.
It should be noted that the first device 300 may be prepared first, and then the second device 600 is prepared, if the first device 300 is an organic light emitting device, the organic light emitting device is prepared first, and if the first device is an organic photoelectric detection device, the organic photoelectric detection device is prepared first, so the preparation sequence of the organic light emitting device and the organic photoelectric detection device is not limited in this application. Similarly, the preparation sequence of the different types of organic light emitting devices is not particularly limited.
In the method for manufacturing a display panel according to the embodiment of the present application, the first isolation layer 200 is used to shield the first target area 110, so as to dispose the first device 300 in the second target area 120, and the second isolation layer 500 is used to shield the second target area, so as to dispose the second device 600 in the first target area 110. Since the first organic layer 310 and the second organic layer 610 use different materials to form different devices, they need to be separately prepared. When the first device 300 and the second device 600 are separately prepared, the first isolation layer 200 and the second isolation layer 500 need to be peeled off twice, the adhesive residue particles can be remained on the surfaces of the first electrode layer 320 and the third electrode layer 620 in the process of peeling the isolation layers, and the second electrode layer 400 is arranged on the whole surface. The carrier may be an electron or a hole, and the present application is not particularly limited.
Exemplarily, fig. 9 provides a luminous efficiency test curve of a light emitting device according to an embodiment of the present application. As shown in fig. 9, fig. 9 illustrates 3 luminous efficiency curves corresponding to the reference and existing light emitting devices and the light emitting device provided in the embodiment of the present application, and as can be seen from fig. 9, the luminous efficiency curve corresponding to the light emitting device provided in the embodiment of the present application is obviously located above the luminous efficiency curve corresponding to the reference and existing light emitting devices, that is, the luminous efficiency corresponding to the light emitting device provided in the embodiment of the present application is better than the luminous efficiency of the reference and existing light emitting devices. The luminous efficiency curve of the light emitting device is a change curve of the luminous efficiency of the light emitting device with time, the ordinate shown in fig. 9 is a luminous efficiency value (unit is%), the abscissa is time (unit is hour), and the luminous efficiency curve of the light emitting device can reflect the change of the service life of the light emitting device with time, so that the service life curve corresponding to the light emitting device provided by the embodiment of the application is superior to the service life curves of the reference and existing light emitting devices.
Illustratively, fig. 10 is an external quantum efficiency test curve of a photoelectric detection device provided in an embodiment of the present application. As shown in fig. 10, fig. 10 illustrates 3 curves, which respectively correspond to External Quantum Efficiency curves of a reference, a conventional light emitting device and a photoelectric detection device provided in the embodiments of the present application, where External Quantum Efficiency (EQE) is one of main performance indexes of a photoelectric detector, and a value of the External Quantum Efficiency is a ratio of the number of collected electrons to the number of incident photons. The ordinate shown in fig. 10 is the external quantum efficiency value (in%) and the abscissa is the wavelength (in nm). As can be seen from fig. 10, the external quantum efficiency curve corresponding to the photo-detection device provided in the embodiment of the present application is obviously located above the external quantum efficiency curve corresponding to the reference and existing photo-detection devices, that is, the external quantum efficiency corresponding to the photo-detection device provided in the embodiment of the present application is better than the external quantum efficiency corresponding to the reference and existing photo-detection devices.
In some embodiments, before step S100, the method may include:
a backsheet 100 is prepared. For example, the backplane 100 may be a driving backplane, a plurality of driving devices may be disposed on the driving backplane, and the driving devices may be Thin Film Transistors (TFTs), which may be used to drive the first device 300 and the second device 600 to operate, and the present application is not limited in particular.
In some embodiments, fig. 11 is a partial schematic view of a structural change in a manufacturing process of another display panel provided in an example of the present application. As shown in fig. 11, before step S100, the method includes:
s101: and arranging a first anode in the first target area of the back plate, and arranging a second anode in the second target area of the back plate to obtain a fifth intermediate substrate.
For example, step S101 may specifically include:
an anode layer is provided on the driving side of the back plate 100. The driving side of the backplate 100 may be understood as the side of the backplate where the driving devices are disposed, and the present application is not particularly limited. The anode layer may be disposed over the whole surface, and may be a single layer of metal material or a stack of multiple layers of metal materials, such as ti-al-ti or mo-al-mo, which is not limited in this application.
The anode layer is etched to form a first anode 710 and a second anode 720 in the first target area 110 of the back plate, resulting in a fifth intermediate substrate a 50.
As an example, the etching process of the anode layer may specifically include: coating, developing and exposing a photoresist;
etching the anode layer to obtain a first anode and a second anode; and stripping the photoresist.
In the method for manufacturing a display panel provided in the embodiment of the present application, the first anode 710 corresponds to the first device 300, and the second anode 720 corresponds to the second device 600. The first anode 710 and the first electrode layer 320 may act on the first organic layer 310, and the second anode 720 and the third electrode layer 620 may act on the second organic layer 610.
In some embodiments, before step S100, the method for manufacturing a display panel provided in the embodiments of the present application further includes:
s102: and arranging a pixel defining layer on one side of the fifth intermediate substrate, which faces away from the back plate, wherein the orthographic projection of the pixel defining layer on the back plate covers the edge of the orthographic projection of the first anode on the back plate and the edge of the orthographic projection of the second anode on the back plate. With continued reference to fig. 11, the side of the fifth intermediate substrate a50 facing away from the backplane 100 is referred to as the pixel defining layer 800. The pixel defining layer 800 serves to define the boundaries of the first device 300 and the second device 600, i.e. to separate the first device 300 and the second device 600. The pixel defining layer 800 covers edges of the first anode 710 and the second anode 720, and a middle portion of the first anode 710 and the second anode 720 is exposed.
In the method for manufacturing a display panel according to the embodiment of the present application, the first anode 710 and the second anode 720 are disposed, the first anode 710 and the first electrode layer 320 jointly act on the first organic layer 310, the second anode 720 and the third electrode layer 620 jointly act on the second organic layer 610, and the pixel defining layer 800 is used for defining the boundary between the first device 300 and the second device 600, so that the first device 300 and the second device 600 can be prevented from interfering with each other.
In some embodiments, with continued reference to fig. 11, step S100 may include:
s110: and sequentially arranging a first sacrificial layer and a first photoresist layer in a first target area of the backboard to obtain a first intermediate substrate. A first sacrificial layer 210 and a first photoresist layer 220 are sequentially provided within the first target area 110 of the back-plate 100, resulting in a first intermediate substrate a 10.
Fig. 12 is a partial schematic view of a structural change in a manufacturing process of another display panel according to an embodiment of the present application. As shown in fig. 12, specifically, step S110 may include:
s111: a first sacrificial film and a first photoresist film are sequentially disposed on one side of a backplate. The entire first sacrificial film 201 and the entire first photoresist film 202 are sequentially disposed on the side of the pixel defining layer 800 away from the backplane 100. The first sacrificial film 201 and the first photoresist film 202 involved in this step are coated over the entire surface.
S112: the first photoresist film 202 is sequentially exposed and developed to obtain a first photoresist layer 220. The first photoresist film 202 is exposed and developed to obtain a photoresist pattern, which is located in the first target region 110, i.e., a first photoresist layer 220.
S113: the first sacrificial film 201 is dissolved based on the first photoresist layer 220 to form a first sacrificial layer 210, resulting in a first intermediate substrate a10, wherein the first sacrificial layer 210 and the first photoresist layer 220 form a first isolation layer 200. The first photoresist layer 220 is used to pattern the formation of the first sacrificial layer 210.
In some embodiments, fig. 13 is a partial schematic view of a structural change in a manufacturing process of a display panel provided in an example of the present application. As shown in fig. 13, step S300 may include:
s310: the first sacrificial layer 210 in the first isolation layer 200 is dissolved so that the first photoresist layer 220 in the first isolation layer 200 and the first organic layer 310 and the first electrode layer 320 stacked on the first photoresist layer 220 are stripped together, resulting in the second intermediate substrate a 20. The first sacrificial layer 210 may be made of a fluorine-ether material that can be dissolved by a stripping solution, and when the first sacrificial layer 210 is dissolved, the first photoresist layer 220 will fall off naturally, and the fall off of the first photoresist layer 220 will be accompanied by the fall off of the first organic layer 310 and the first electrode layer 320 stacked on the first photoresist layer 220.
It is easily understood that the peeling step of the second separation layer 500 may be the same as the peeling step of the first separation layer 200, and the present application is not particularly limited.
Illustratively, step S301 may include:
and a second sacrificial film and a second photoresist film are sequentially arranged on one side of the second intermediate substrate, which is far away from the back plate. The second sacrificial film and the second photoresist film involved in this step are coated over the entire surface.
And sequentially exposing and developing the second photoresist film to obtain a second photoresist layer.
And dissolving the second sacrificial film based on the second photoresist layer to form a second sacrificial layer and obtain a third intermediate substrate, wherein the second sacrificial layer and the second photoresist layer form a second isolation layer.
Step S303 may include:
and dissolving the second sacrificial layer in the second isolation layer, so that the second photoresist layer in the second isolation layer and the second organic layer and the third electrode layer stacked on the second photoresist layer are stripped together, and obtaining the fourth intermediate substrate.
In the preparation method of the display panel provided in the embodiment of the present application, the first isolation layer 200 is formed by using the first sacrificial layer 210 and the first photoresist layer 220, and the first isolation layer 200 is stripped by dissolving the first sacrificial layer 210. The first photoresist layer 220 is used for forming a mask pattern for the formation of the first sacrificial layer 210, and the dissolution of the first sacrificial layer 210 can cause the first photoresist layer 220 to fall off naturally, and the fall off of the first photoresist layer 220 can be accompanied with the fall off of the first organic layer 310 and the first electrode layer 320 stacked on the first photoresist layer 220. Through step-by-step arrangement of the first isolation layer 200 and the second isolation layer 500 and step-by-step stripping of the first isolation layer 200 and the second isolation layer 500, step-by-step preparation of the first device 300 and the second device 600 and step-by-step preparation of the cathode (the first electrode layer 320 and the second electrode layer 400 can be jointly used as a cathode, and the third electrode layer 620 and the second electrode layer 400 can be jointly used as a cathode) can be achieved, the residual glue particles are transferred between the first electrode layer 320 and the second electrode layer 400 or between the third electrode layer 620 and the second electrode layer 400, and under the condition that the residual glue does not affect the electric connection between the first electrode layer 320 and the second electrode layer 400, the problem of carrier transmission between an organic layer and the electrode layers caused by the residual glue can be solved, and further the performances of the first device 300 and the second device 600 can be improved.
A hole transport layer may be further disposed between the first anode 710 and the first organic layer 310, and an electron transport layer may be further disposed between the first organic layer 310 and the first electrode layer 320; a hole transport layer may be further disposed between the second anode 720 and the second organic layer 610, and an electron transport layer may be further disposed between the second organic layer 610 and the third electrode layer 620, which is not particularly limited in this application.
In some embodiments, with reference to fig. 3 and 4, the orthographic projection of the first device 300 on the backplane 100 is a first projection 140, the orthographic projection of the second device 600 on the backplane 100 is a second projection 150, the display panel comprises a high-light-transmission region 160, the orthographic projection of the high-light-transmission region 160 on the backplane 100 is a third projection 130, and the third projection 130 separates the first projection 140 from the second projection 150; the third projection 130 may be located at the overlap region of the first target region 110 and the second target region 120. The size relationship, shape and arrangement of the first projection 140 and the second projection 150 shown in fig. 4 are only schematic and are not intended to limit the present application.
And arranging a second electrode layer on one side of the fourth intermediate substrate, which is far away from the back plate, wherein the step comprises the following steps:
and arranging a second electrode layer on one side of the fourth intermediate substrate, which is far away from the back plate, so that the orthographic projection of the second electrode layer on the back plate covers the first projection, the second projection and the third projection. As shown in fig. 3, in the high light transmittance region 160, only a single layer of the second electrode layer 400 has a higher light transmittance in the high light transmittance region 160 than in the region where the first device 300 is located and the region where the second device 600 is located, and the arrangement of the high light transmittance region 160 can improve the light transmittance of the display panel.
The display panel prepared by the preparation method of the display panel provided by the embodiment of the application utilizes the improvement of the high light transmission area 160 on the light transmission performance of the display panel, can realize the design scheme of the camera under the screen, can place the camera without digging a hole on the display panel, and can improve the screen occupation ratio of the display panel.
It should be noted that the first intermediate substrate a10, the second intermediate substrate a20, the third intermediate substrate a30, the fourth intermediate substrate a40 and the fifth intermediate substrate a50 all belong to process products in the preparation process of the display panel, and the application is not limited in particular.
In a third aspect of the embodiments of the present application, a display device is provided, and fig. 14 is a schematic structural diagram of the display device provided in the embodiments of the present application. As shown in fig. 14, a display device provided in an embodiment of the present application includes: the second aspect provides a display panel 1000. The display device may be a smart phone, a tablet computer, a notebook computer, etc., and the present application is not particularly limited.
While preferred embodiments of the present specification have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all changes and modifications that fall within the scope of the specification. It will be apparent to those skilled in the art that various changes and modifications may be made in the present specification without departing from the spirit and scope of the specification.
Claims (16)
1. A display panel, comprising:
a backing plate comprising a first target area and a second target area;
a first device disposed within the second target area of the backplane, the first device comprising a first organic layer and a first electrode layer, the first organic layer disposed between the backplane and the first electrode layer;
a second electrode layer, the first device disposed between the backplane and the second electrode layer.
2. The display panel according to claim 1, characterized in that the display panel further comprises:
a second device disposed within the first target region of the backplate, the second device disposed between the backplate and the second electrode layer, the second device including a second organic layer and a third electrode layer, the second organic layer disposed between the backplate and the third electrode layer.
3. The display panel of claim 2, wherein the orthographic projection of the first device on the backplane is a first projection and the orthographic projection of the second device on the backplane is a second projection, the display panel comprising a high light transmission area, the orthographic projection of the high light transmission area on the backplane is a third projection, the third projection separating the first projection and the second projection;
the orthographic projection of the second electrode layer on the back plate covers the first projection, the second projection and the third projection.
4. The display panel according to claim 2, wherein one of the first organic layer and the second organic layer is made of an organic light emitting material, and the other is made of a photo-sensing material; or the like, or, alternatively,
one of the first organic layer and the second organic layer is made of a first organic light emitting material, and the other is made of a second organic light emitting material.
5. A display panel as claimed in claim 3 characterized in that the area of the first projection is different from the area of the second projection.
6. A method for manufacturing a display panel, applied to the display panel according to any one of claims 1 to 5, the method comprising:
arranging a first isolation layer in a first target area of a backboard to obtain a first intermediate substrate;
sequentially arranging a first organic layer and a first electrode layer on one side of the first intermediate substrate, which is far away from the backboard, so as to form a first device in a second target area of the backboard;
stripping the first isolation layer to obtain a second intermediate substrate;
and arranging a second electrode layer on one side of the second intermediate substrate, which is far away from the back plate.
7. The method for manufacturing a display panel according to claim 6, wherein before the step of providing the second electrode layer on the side of the second intermediate substrate facing away from the back sheet, the method further comprises:
arranging a second isolation layer on one side of the second intermediate substrate, which is far away from the backboard, so as to obtain a third intermediate substrate, wherein the second isolation layer is arranged in the second target area of the backboard;
sequentially arranging a second organic layer and a third electrode layer on one side of the third intermediate substrate, which is far away from the backboard, so as to form a second device in the first target area;
stripping the second isolation layer to obtain a fourth intermediate substrate;
the step of providing a second electrode layer on a side of the second intermediate substrate facing away from the backplane comprises:
and arranging the second electrode layer on one side of the fourth intermediate substrate, which is far away from the back plate.
8. The method according to claim 7, wherein the step of providing a first spacer layer in the first target area of the backplane to obtain a first intermediate substrate comprises:
and sequentially arranging a first sacrificial layer and a first photoresist layer in the first target area of the backboard to obtain the first intermediate substrate.
9. The method according to claim 8, wherein the step of sequentially disposing a first sacrificial layer and a first photoresist layer in the first target region of the backplane to obtain the first intermediate substrate comprises:
sequentially arranging a first sacrificial film and a first photoresist film on one side of the back plate;
sequentially exposing and developing the first photoresist film to obtain a first photoresist layer;
and dissolving the first sacrificial film based on the first photoresist layer to form a first sacrificial layer, so as to obtain the first intermediate substrate, wherein the first sacrificial layer and the first photoresist layer form the first isolation layer.
10. The method according to claim 9, wherein the step of peeling off the first spacer layer to obtain a second intermediate substrate comprises:
dissolving the first sacrificial layer in the first isolation layer to enable the first photoresist layer in the first isolation layer and the first organic layer and the first electrode layer stacked on the first photoresist layer to be stripped together, and obtaining the second intermediate substrate.
11. The method of claim 7, wherein the orthographic projection of the first device on the back plate is a first projection, the orthographic projection of the second device on the back plate is a second projection, the display panel comprises a high-light-transmission region, the orthographic projection of the high-light-transmission region on the back plate is a third projection, and the third projection separates the first projection from the second projection;
the step of providing a second electrode layer on a side of the fourth intermediate substrate facing away from the backplane comprises:
and arranging the second electrode layer on one side of the fourth intermediate substrate, which is far away from the back plate, so that the orthographic projection of the second electrode layer on the back plate covers the first projection, the second projection and the third projection.
12. The method according to claim 7, wherein a material for preparing the first organic layer is different from a material for preparing the second organic layer.
13. The method for manufacturing a display panel according to claim 12, wherein one of the first organic layer and the second organic layer is made of an organic light-emitting material, and the other is made of a photo-sensing material; or the like, or, alternatively,
one of the first organic layer and the second organic layer is made of a first organic light emitting material, and the other is made of a second organic light emitting material.
14. The method for manufacturing a display panel according to claim 7, wherein the step of providing the first isolation layer in the first target region of the backplane to obtain the first intermediate substrate comprises:
and arranging a first anode in the first target area of the back plate, and arranging a second anode in the second target area of the back plate to obtain a fifth intermediate substrate.
15. The method for manufacturing a display panel according to claim 14, wherein before the step of disposing a first isolation layer in the first target area of the backplane to obtain a first intermediate substrate, the method further comprises:
and arranging a pixel defining layer on one side of the fifth intermediate substrate, which faces away from the back plate, wherein the orthographic projection of the pixel defining layer on the back plate covers the edge of the orthographic projection of the first anode on the back plate and the edge of the orthographic projection of the second anode on the back plate.
16. A display device, comprising: the display panel of any one of claims 1-5.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107680985A (en) * | 2016-08-01 | 2018-02-09 | 三星显示有限公司 | Oganic light-emitting display device and the method for manufacturing it |
| US20200006440A1 (en) * | 2018-07-02 | 2020-01-02 | Hefei Xinsheng Optoelectroncs Technology Co., Ltd. | Organic light-emitting diode display panel and manufacturing method thereof, and display device |
| TW202114197A (en) * | 2019-09-02 | 2021-04-01 | 法商艾索格公司 | Display screen pixel |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107680985A (en) * | 2016-08-01 | 2018-02-09 | 三星显示有限公司 | Oganic light-emitting display device and the method for manufacturing it |
| US20200006440A1 (en) * | 2018-07-02 | 2020-01-02 | Hefei Xinsheng Optoelectroncs Technology Co., Ltd. | Organic light-emitting diode display panel and manufacturing method thereof, and display device |
| TW202114197A (en) * | 2019-09-02 | 2021-04-01 | 法商艾索格公司 | Display screen pixel |
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