CN113451182A - Diffusion furnace temperature control constant temperature system for chip production - Google Patents
Diffusion furnace temperature control constant temperature system for chip production Download PDFInfo
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- CN113451182A CN113451182A CN202111000498.8A CN202111000498A CN113451182A CN 113451182 A CN113451182 A CN 113451182A CN 202111000498 A CN202111000498 A CN 202111000498A CN 113451182 A CN113451182 A CN 113451182A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Abstract
The invention relates to a diffusion furnace temperature control constant temperature system for chip production, which comprises a rotating mechanism, wherein the rotating mechanism comprises a limit buckle, the bottom of the limit buckle is connected with a supporting rod, the outer wall of the supporting rod is connected with a bearing, the outer wall of the bearing is connected with an upper barrel and a lower barrel, and the lower barrel is connected with a motor; the turnover mechanism comprises a first turnover cover and a second turnover cover, the first turnover cover and the second turnover cover are sleeved on a furnace mouth of the diffusion furnace, and the motor drives the lower barrel to rotate; the limiting rod is arranged on the other side of the first turnover cover, and the other side of the second turnover cover is fixedly connected with a rotating shaft; the central controller is connected with the motor and used for adjusting the opening angles of the first flip cover and the second flip cover, the central controller obtains the temperature, the gas flow and the reaction time in the diffusion furnace for producing the chips in advance and determines the reaction parameters of the diffusion furnace, and the central controller determines whether the motor needs to be started according to the reaction parameters calculated by the obtained temperature, the gas flow and the reaction time in the diffusion furnace for producing the chips.
Description
Technical Field
The invention relates to the technical field of diffusion furnaces, in particular to a temperature control constant temperature system of a diffusion furnace for chip production.
Background
The diffusion furnace is one of important process equipment of a front process of a semiconductor production line, is used for diffusion, oxidation, annealing, alloying, sintering and other processes in industries such as large-scale integrated circuits, discrete devices, power electronics, photoelectric devices, optical fibers and the like, and is an important device in the semiconductor production process. The diffusion furnace needs to be fixed by using a temperature control thermostatic device when in use, can better control the temperature of the diffusion furnace at constant temperature when in use, and can better improve the quality of semiconductors in the use process.
The existing diffusion furnace temperature control constant temperature equipment for chip production is easy to influence the overall temperature control precision by external temperature fluctuation because a furnace mouth part of a diffusion furnace extends out of a diffusion furnace main body in the using process.
In summary, the prior art still lacks a thermal insulation device which can perform different thermal insulation adjustment on the temperature of the furnace mouth of the diffusion furnace according to different reaction temperatures and time of the diffusion furnace, thereby reducing the influence of temperature fluctuation and ensuring the stability of the process temperature of the diffusion furnace.
Disclosure of Invention
Therefore, the invention provides a temperature control constant temperature system of a diffusion furnace for chip production, which is used for overcoming the problem that in the prior art, the temperature of a furnace mouth of the diffusion furnace can be subjected to different heat preservation adjustment according to different reaction temperatures and time of the diffusion furnace, so that the influence of temperature fluctuation is reduced, and the stability of the process temperature of the diffusion furnace is ensured.
In order to achieve the above object, the present invention provides a diffusion furnace temperature-controlled constant temperature system for chip production, comprising,
the rotating mechanism comprises a limiting buckle, the bottom of the limiting buckle is fixedly connected with a supporting rod, the outer wall of the supporting rod is fixedly connected with a bearing, the outer wall of the bearing is fixedly connected with an upper barrel and a lower barrel, the upper barrel and the lower barrel are the same in shape and size, and the lower barrel is connected with a motor;
the turnover mechanism comprises a first turnover cover and a second turnover cover, the first turnover cover and the second turnover cover are sleeved on a furnace opening of the diffusion furnace, one side of the first turnover cover is connected with the upper barrel, one side of the second turnover cover is connected with the lower barrel, and the motor drives the lower barrel to rotate so as to adjust the opening angles of the first turnover cover and the second turnover cover;
the limiting rod is arranged on the other side of the first turnover cover, and the other side of the second turnover cover is fixedly connected with a rotating shaft;
the buckle is movably arranged on the outer wall of the rotating shaft and comprises a buckle body, a reserved hole is formed in one side of the buckle body, a clamping groove is formed in the front face of the buckle body, and the size of the outer wall of the rotating shaft is matched with that of the inner wall of the reserved hole;
the central controller is connected with the motor and used for adjusting the opening angles of the first turnover cover and the second turnover cover, the central controller acquires the temperature, the gas flow and the reaction time in the diffusion furnace for chip production in advance and determines the reaction parameters of the diffusion furnace, and the central controller determines whether the motor needs to be started or not according to the reaction parameters calculated by the acquired temperature, the gas flow and the reaction time in the diffusion furnace for chip production;
when the temperature control constant temperature system judges that the motor needs to be started, the central controller compares the difference value with the reaction parameter difference value according to the difference value of the reaction parameter and the reaction difference value threshold value calculated in real time, and preliminarily determines the opening angle of the rotating mechanism;
the central controller receives the external real-time temperature of an environmental temperature sensor arranged outside the temperature control constant temperature system, and adjusts the opening angle of the rotating mechanism according to the difference between the temperature in the diffusion furnace and the environmental temperature;
when the diffusion furnace finishes diffusion work of the chips, the diffusion depth of the finished chips is detected, the detection result is transmitted to the central controller, and the central controller adjusts the opening angle of the rotating mechanism for the second time according to the difference value between the received diffusion depth value and the preset diffusion depth value.
Further, the central controller acquires the temperature in the diffusion furnace, the gas flow and the reaction time of the diffusion furnace for producing the chip in advance, determines the reaction parameters of the diffusion furnace, sets the reaction parameters as x,
x=Tw/Tw0+Q/Q0+t/t0
where Tw represents a real-time temperature in the diffusion furnace, Tw0 represents a preset temperature of the diffusion furnace, Q represents a gas flow rate in the diffusion furnace, Q0 represents a preset gas flow rate, t represents a reaction time in the diffusion furnace, and t0 represents a preset reaction time.
Further, reaction parameter difference values X1, X2, X3, … and Xn are preset in the central controller, wherein X1 represents a first preset reaction parameter difference value, X2 represents a second preset reaction parameter difference value, X3 represents a third preset reaction parameter difference value, and Xn represents an nth preset reaction parameter difference value;
opening angles A1, A2, A3, … and An are preset in the central controller, wherein A1 represents a first preset opening angle, A2 represents a second preset opening angle, A3 represents a third preset opening angle, and An represents An nth preset opening angle.
Further, the central controller determines whether the motor needs to be started according to a reaction parameter x received in real time and calculated by pre-obtaining the furnace temperature, the gas flow and the reaction time of the diffusion furnace for producing the chips, sets a reaction parameter threshold value Xz, sets the initial state of the diffusion furnace temperature control constant temperature system to be that the buckle is connected with the limiting rod, and sets the opening angle of the first flip cover and the second flip cover to be zero,
if x is less than or equal to Xz, the central controller judges that the motor does not need to be started;
and if x is larger than Xz, the central controller judges that the motor needs to be started.
Further, when the central controller judges that the motor needs to be started, the central controller preliminarily determines the opening angle of the rotating mechanism according to the difference between the reaction parameter calculated in real time and the reaction difference threshold value and the reaction parameter difference value,
if X-Xz is less than or equal to X1, the central controller preliminarily determines that the opening angle of the rotating mechanism is A1;
if X1 is larger than X-Xz and is not larger than X2, the central controller preliminarily determines that the opening angle of the rotating mechanism is A2;
if X2 is larger than X-Xz and is not larger than X3, the central controller preliminarily determines that the opening angle of the rotating mechanism is A3;
if X (n-1) < X-Xz is less than or equal to Xn, the central controller preliminarily determines that the opening angle of the rotating mechanism is An.
Further, temperature differences Tc1, Tc2, Tc3, … and Tcn are preset in the central controller, wherein Tc1 represents a first preset temperature difference, Tc2 represents a second preset temperature difference, Tc3 represents a third preset temperature difference, and Tcn represents an nth preset temperature difference;
adjusting parameter values alpha 1, alpha 2, alpha 3, … and alpha 4 are preset in the central controller, wherein alpha 1 represents a first preset adjusting parameter value, alpha 2 represents a second preset adjusting parameter value, alpha 3 represents a third preset adjusting parameter value, and alpha 4 represents a fourth preset adjusting parameter value.
Further, the central controller receives the external real-time temperature of an environment temperature sensor arranged outside the temperature control constant temperature system, adjusts the opening angle of the rotating mechanism according to the difference value between the temperature in the diffusion furnace and the environment temperature, sets the external real-time environment temperature to be Tb, sets the real-time temperature in the diffusion furnace to be Tw,
if Tb is larger than Tw, the central controller judges the system fault;
if Tw-Tb is greater than 0 and less than or equal to Tc1, the central controller determines that the adjusting parameter value is alpha 1, the opening angle of the rotating mechanism is adjusted to be B, and B = alpha 1 xA 1;
if Tc1 is more than Tw-Tb and less than or equal to Tc2, the central controller determines that the adjusting parameter value is alpha 2, the opening angle of the rotating mechanism is adjusted to be B, and B = alpha 2 xA 2;
if Tc2 is more than Tw-Tb and less than or equal to Tc3, the central controller determines that the adjusting parameter value is alpha 3, the opening angle of the rotating mechanism is adjusted to be B, and B = alpha 3 xA 3;
if Tc (n-1) < Tw-Tb is less than or equal to Tcn, the central controller determines that the adjusting parameter value is alpha n, the opening angle of the rotating mechanism is adjusted to be B, and B = alpha n multiplied by An.
Furthermore, a first preset diffusion depth difference value of K1, a second preset diffusion depth difference value of K2 and a third preset diffusion depth difference value of K3 are preset in the central controller, and K1 is larger than K2 and K3 is larger than K1;
a first preset opening angle compensation degree D1 and a second preset opening angle compensation degree D2 are preset in the central controller, and D1 is smaller than D2.
Further, when the diffusion furnace finishes the diffusion work of the chip, the diffusion depth of the finished chip is detected and the detection result is transmitted to the central controller, the central controller secondarily adjusts the opening angle of the rotating mechanism according to the difference value between the received diffusion depth value and the preset diffusion depth value, the diffusion depth value of the chip is set to be k, the preset diffusion depth value is set to be Kf, and then,
if the absolute value kf-K is less than or equal to K1 or the absolute value kf-K is more than K3, the central controller does not adjust the opening angle of the rotating mechanism;
if K1 < | kf-K | ≦ K2, the central controller determines that the opening angle compensation degree is D1, the opening angle of the secondary adjustment rotating mechanism is C, and C = B + D1;
if K2 < | kf-K | ≦ K3, the central controller determines that the opening angle compensation degree is D2, the opening angle of the secondary adjustment rotating mechanism is C, and C = B + D2.
Further, the central controller sets An as the maximum opening angle and a1 as the minimum opening angle, if the opening angle B of the adjusted rotating mechanism is greater than An, the An is taken as the adjusted opening angle, and if the opening angle B of the adjusted rotating mechanism is less than a1, the a1 is taken as the adjusted opening angle;
if the opening angle C of the adjusted rotating mechanism is greater than An, An is taken as the adjusted opening angle, and if the opening angle C of the adjusted rotating mechanism is less than a1, a1 is taken as the adjusted opening angle.
Compared with the prior art, the invention has the advantages that the temperature control constant temperature system of the diffusion furnace for chip production is provided, whether the motor needs to be started is judged according to the obtained reaction parameters calculated by the furnace temperature, the gas flow and the reaction time of the diffusion furnace for chip production, if the motor needs to be started, the central controller compares the difference with the reaction parameter difference and preliminarily determines the opening angle of the rotating mechanism according to the difference between the calculated reaction parameter and the reaction difference threshold, the central controller receives the external real-time temperature of an environment temperature sensor arranged outside the temperature control constant temperature system, adjusts the opening angle of the rotating mechanism according to the difference between the temperature in the diffusion furnace and the environment temperature, and detects the diffusion depth of the finished chip and transmits the detection result to the central controller when the diffusion furnace finishes the diffusion work of the chip, the central controller adjusts the opening angle of the rotating mechanism for the second time according to the difference value between the received diffusion depth value and the preset diffusion depth value, in the diffusion process of the same batch of chips, when the diffusion furnace finishes the diffusion work of the chips for two times, the central controller re-determines and adjusts the opening angle of the rotating mechanism, when the diffusion furnace finishes the first chip diffusion work, namely, after the furnace mouth of the diffusion furnace is opened, the diffusion process of the chip for the second time runs at the opening angle after the second adjustment, when the second chip diffusion is finished, the central controller re-determines and adjusts the opening angle until the current chip diffusion is finished, therefore, the problem that the furnace body is easy to damage due to instantaneous large-current heating when the furnace mouth is opened is effectively solved, the temperature fluctuation when the furnace mouth is opened is minimized, and the process temperature stability of the diffusion furnace is ensured.
Particularly, when the device is adjusted, the clamping limit state with the limiting rod is released by using the rotating shaft to rotate the buckle, after the release, the central controller controls the rotating mechanism to adjust the rotating angles of the first flip cover and the second flip cover, opens the first flip cover and the second flip cover, adjusts the opening angles of the first flip cover and the second flip cover by using the temperature control constant temperature system after the opening, firstly preliminarily determines the opening angles through the calculated reaction parameters, secondly adjusts the opening angles according to the difference range of the real-time temperature in the diffusion furnace and the ambient temperature, and finally secondarily adjusts the opening angles of the first flip cover and the second flip cover according to the diffusion depth of the diffused chip, improves the diffusion effect of the chip by using the adjusted opening angles in the diffusion process of the second chip, and adopts an adjusting mode of combining two types, the deviation of data has been reduced, improve the stability and the authenticity of data, when using through flip can be better when switching the furnace gate, protect the temperature of diffusion furnace fire door, let the fixed stability and the security of equipment all have better promotion when using, through the angle of opening of adjusting first flip and second flip, carry out not equidimension to the temperature of fire door and keep, reduce the fire door temperature fluctuation to guarantee the stability of diffusion furnace technology temperature.
Furthermore, the first flip cover and the second flip cover are made of high-temperature-resistant quartz, high-temperature-resistant quartz wool is filled in the first flip cover and the second flip cover, and the quartz shell can ensure that the cleanliness of the shell does not influence the use environment requirement of the diffusion furnace opening. The quartz heat preservation system is formed by filling high-temperature-resistant quartz cotton in a quartz shell, is nested and assembled on a furnace tube opening of the diffusion furnace and exposed out of a main furnace body, and is used for preserving heat through the constant temperature system, so that the temperature of the furnace opening is prevented from being influenced by the ambient temperature, and the heat preservation effect of the temperature control constant temperature system is improved.
Drawings
FIG. 1 is a schematic structural diagram of a diffusion furnace temperature-controlled constant temperature system for chip production according to the present invention;
FIG. 2 is a schematic view of another view structure of the diffusion furnace temperature-controlled constant temperature system for producing chips according to the present invention;
FIG. 3 is a schematic structural diagram of a rotating mechanism in a diffusion furnace temperature-controlled constant temperature system for chip production according to the present invention;
FIG. 4 is a schematic structural diagram of a buckle in a diffusion furnace temperature-controlled constant temperature system for chip production according to the present invention;
FIG. 5 is an enlarged schematic view of the invention at A;
FIG. 6 is an enlarged view of the present invention at B.
Detailed Description
In order that the objects and advantages of the invention will be more clearly understood, the invention is further described below with reference to examples; it should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and do not limit the scope of the present invention.
It should be noted that in the description of the present invention, the terms of direction or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, which are only for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1 to 6, the invention provides a diffusion furnace temperature control constant temperature system for chip production, which comprises a rotating mechanism 1, wherein the rotating mechanism 1 comprises a limit buckle 101, the bottom of the limit buckle 101 is fixedly connected with a support rod 105, the outer wall of the support rod 105 is fixedly connected with a bearing 104, the outer wall of the bearing 104 is fixedly connected with an upper barrel 102 and a lower barrel 103, the upper barrel 102 and the lower barrel 103 have the same shape and size, and the lower barrel 103 is connected with a motor 2. Tilting mechanism 3, it includes first flip 301 and second flip 302, first flip 301 and second flip 302 cover are established on the fire door of diffusion furnace 6, one side and last section of thick bamboo 102 of first flip 301 are connected, one side and the lower section of thick bamboo 103 of second flip 302 are connected, motor 2 drives down section of thick bamboo 103 and rotates to adjust the angle that opens of first flip 301 and second flip 302. And the limiting rod 4 is arranged on the other side of the first flip 301, and the other side of the second flip 302 is fixedly connected with a rotating shaft 5. The buckle 8 is movably arranged on the outer wall of the rotating shaft 5, the buckle 8 comprises a buckle body 801, a reserved hole 802 is formed in one side of the buckle body 801, a clamping groove 803 is formed in the front face of the buckle body 801, and the size of the outer wall of the rotating shaft 5 is matched with the size of the inner wall of the reserved hole 802. And the central controller 7 is connected with the motor 2 and used for adjusting the opening angles of the first turnover cover 301 and the second turnover cover 302, the central controller 7 acquires the furnace temperature, the gas flow and the reaction time of the diffusion furnace 6 for chip production in advance and determines the reaction parameters of the diffusion furnace 6, and the central controller 7 determines whether the motor 2 needs to be started according to the reaction parameters calculated by the acquired furnace temperature, the gas flow and the reaction time of the diffusion furnace 6 for chip production.
Specifically, in the embodiment of the present invention, when the temperature-controlled constant temperature system determines that the motor 2 needs to be started, the central controller 7 compares the difference value with the reaction parameter difference value according to the difference value between the reaction parameter and the reaction difference value threshold calculated in real time, and preliminarily determines the opening angle of the rotating mechanism 1.
Specifically, in the embodiment of the present invention, the central controller 7 receives the external real-time temperature of the ambient temperature sensor disposed outside the temperature-controlled constant temperature system, and the central controller 7 adjusts the opening angle of the rotating mechanism 1 according to the difference between the temperature inside the diffusion furnace 6 and the ambient temperature.
Specifically, in the embodiment of the present invention, when the diffusion furnace 6 finishes the diffusion work of the chip, the diffusion depth of the finished chip is detected and the detection result is transmitted to the central controller 7, and the central controller 7 secondarily adjusts the opening angle of the rotation mechanism 1 according to the difference between the received diffusion depth value and the preset diffusion depth value.
Specifically, in the embodiment of the present invention, the first flip cover 301 and the second flip cover 302 are made of high temperature resistant quartz, and high temperature resistant quartz wool is filled in the first flip cover and the second flip cover, and the quartz shell can ensure that the cleanliness of the shell does not affect the use environment requirement of the diffusion furnace 6. A quartz shell is used, high-temperature-resistant quartz wool is filled in the quartz shell to form a quartz heat preservation system, the system is nested and assembled on a furnace mouth of a diffusion furnace 6, which is exposed outside a main furnace body, heat preservation is carried out through the constant temperature system, and the temperature of the furnace mouth is prevented from being influenced by the ambient temperature.
Specifically, in the embodiment of the present invention, one side of the second flip cover 302 is fixedly connected with the rotating shaft 5, the outer wall of the rotating shaft 5 is movably connected with the buckle 8, and the first flip cover 301 and the second flip cover 302 are sleeved on the furnace opening of the diffusion furnace 6 to preserve heat of the furnace opening of the diffusion furnace 6, so as to reduce the phenomenon that the temperature of the furnace opening of the diffusion furnace 6 is extremely reduced when the furnace door is opened and closed. When the temperature control constant temperature system works, the protection effect of the temperature control constant temperature system is more comprehensively guaranteed through the matching work among the rotating mechanism 1, the buckle 8 and the rotating shaft 5, the situation that the temperature drops too fast can be better prevented in the using process, the operation stability and the safety of the diffusion furnace 6 are better improved, when equipment is adjusted, the rotating shaft 5 is used for rotating the buckle 8 to release the clamping limit state with the limiting rod 4, after the release, the central controller 7 controls the rotating mechanism 1, adjusts the rotating angles of the first flip 301 and the second flip 302, opens the first flip 301 and the second flip 302, after the opening, the temperature control constant temperature system is used for adjusting the opening angles of the first flip 301 and the second flip 302, when the furnace door is opened and closed better through the flip, the temperature of the furnace mouth of the diffusion furnace 6 is protected, and when the equipment is used, the fixing stability and the safety are better improved, the temperature of the furnace mouth is kept in different degrees by adjusting the opening angles of the first turnover cover 301 and the second turnover cover 302, so that the temperature fluctuation of the furnace mouth is reduced, and the stability of the process temperature of the diffusion furnace 6 is ensured. When the temperature control constant temperature system is not used, the buckle 8 can be rotated by using the rotating shaft 5, the buckle 8 is clamped with the limiting rod 4, the first turnover cover 301 and the second turnover cover 302 are connected and fixed, the fixing stability between the first turnover cover 301 and the diffusion furnace 6 and the fixing stability between the second turnover cover 302 and the diffusion furnace 6 can be better guaranteed through the buckle 8, and the stability of the temperature control constant temperature system is improved.
Specifically, in the embodiment of the present invention, the rotating mechanism 1 includes a limit buckle 101, an upper barrel 102, a lower barrel 103, a bearing 104 and a support rod 105, the bottom of the limit buckle 101 is fixedly connected with the support rod 105, the outer wall of the support rod 105 is fixedly connected with the bearing 104, the outer wall of the bearing 104 is fixedly connected with the upper barrel 102, the outer wall of the bearing 104 is fixedly connected with the lower barrel 103, the upper barrel 102 and the lower barrel 103 have the same shape and size, and the lower barrel 103 is connected with the motor 2. During operation, the upper barrel 102 and the lower barrel 103 are the same in shape and size, so that the operation stability and balance of the temperature control constant temperature system can be better improved when the temperature control constant temperature system is used.
Specifically, in the embodiment of the present invention, the buckle 8 includes a buckle body 801, a reserved hole 802 and a slot 803, wherein the reserved hole 802 is formed on one side of the buckle body 801, the slot 803 is formed on the front surface of the buckle body 801, and the size of the outer wall of the rotating shaft 5 is identical to the size of the inner wall of the reserved hole 802; during operation, the size of the outer wall of the rotating shaft 5 is matched with the size of the inner wall of the reserved hole 802, so that the equipment can better rotate the buckle 8 in the using process.
Specifically, in the embodiment of the present invention, the buckle 8 on the first flip 301 and the second flip 302 form a rotating structure through the rotating shaft 5, and a penetrating structure is formed between the buckle 8 and the rotating shaft 5; during operation, the buckle 8 and the second flip cover 302 form a rotating structure through the rotating shaft 5, so that the temperature control constant temperature system can better connect and fix the turnover mechanism 3 and the diffusion furnace 6 when in use.
Specifically, in the embodiment of the invention, the turnover mechanism 3 forms a rotating structure through the rotating mechanism 1 and the diffusion furnace 6, and the number of the rotating mechanisms 1 is two and is symmetrically distributed on one side of the turnover cover; during operation, flip constitutes revolution mechanic through tilting mechanism 3 and diffusion furnace 6 and lets temperature control constant temperature system is at the during operation, and well accuse ware 7 makes tilting mechanism 3 carry out the angle that opens of different degrees through adjustment motor 2, carries out the heat protection of different degrees, and rotary mechanism 1's quantity is two can be better to supporting. The present invention is not limited to the number of the rotating mechanisms 1, and only one rotating mechanism 1 may be provided when the length of the supporting rod 105 is equal to the length of one side of the first flip 301.
Specifically, in the embodiment of the present invention, the upper cylinder 102 and the lower cylinder 103 form a rotating structure through the bearing 104 and the support rod 105, and the central axes between the bearing 104 and the support rod 105 coincide; during operation, the upper barrel 102 and the lower barrel 103 form a rotating structure through the bearing 104 and the support rod 105 to enable the opening and closing stability of the rotating mechanism 1 to be better improved, and the rotating stability of the equipment is better guaranteed through the coincidence of the central axes between the bearing 104 and the support rod 105 during use.
Specifically, in the embodiment of the present invention, when the temperature-controlled constant temperature system is not used, the rotation shaft 5 may rotate the engagement between the buckle 8 and the limit rod 4 to enter the limit state, when the temperature-controlled constant temperature system is used, the limit state between the buckle 8 and the limit rod 4 is released, and when the temperature-controlled constant temperature system is operated, the central controller 7 adjusts the motor 2 in the rotation mechanism 1 to generate different opening angles between the first flip 301 and the second flip 302, and performs different adjustments on the opening angles in different operating states, so as to improve the temperature protection effect of the temperature-controlled constant temperature system on the diffusion furnace 6, reduce the temperature fluctuation, and thereby improve the diffusion effect of the diffusion furnace 6. After the adjustment is finished, the turnover mechanism 3 is closed by the rotating mechanism 1, the buckle 8 is rotated by the rotating shaft 5 after the closing, the buckle 8 is clamped with the limiting rod 4, and the turnover mechanism 3 and the diffusion furnace 6 are connected and fixed.
Specifically, in the embodiment of the invention, the central controller acquires the furnace temperature, the gas flow and the reaction time of the diffusion furnace for producing the chip in advance, determines the reaction parameters of the diffusion furnace, sets the reaction parameters as x,
x=Tw/Tw0+Q/Q0+t/t0
where Tw represents a real-time temperature in the diffusion furnace, Tw0 represents a preset temperature of the diffusion furnace, Q represents a gas flow rate in the diffusion furnace, Q0 represents a preset gas flow rate, t represents a reaction time in the diffusion furnace, and t0 represents a preset reaction time.
Specifically, in the embodiment of the present invention, the value Tw0 is 900 ℃, and the preset temperature of the diffusion furnace may also be adjusted differently according to the diffusion requirement of a specific chip, and the present invention does not limit the specific value of the preset value. The value of Q0 is 1slm, and the value of the preset gas flow can be adjusted according to different diffusion processes of chip diffusion. t0 takes the value 500 s. The reaction parameters are calculated according to the reaction parameters in the diffusion process of the diffusion furnace, the reaction process is preliminarily judged, and support is provided for the adjustment work of the temperature control constant temperature system, the data acquired in advance by the temperature control constant temperature system can be input into the temperature control constant temperature system in advance, the temperature and the air inflow in the diffusion furnace can be measured in real time through a gas measuring instrument arranged on an air inlet pipeline and an infrared thermometer arranged outside the diffusion furnace, and the reaction time can be directly acquired through a central controller.
Specifically, in the embodiment of the present invention, reaction parameter differences X1, X2, X3, …, and Xn are preset in the central controller, where X1 represents a first preset reaction parameter difference, X2 represents a second preset reaction parameter difference, X3 represents a third preset reaction parameter difference, and Xn represents an nth preset reaction parameter difference.
Specifically, in the embodiment of the present invention, opening angles a1, a2, A3, …, An are preset in the central controller, where a1 represents a first preset opening angle, a2 represents a second preset opening angle, A3 represents a third preset opening angle, and An represents An nth preset opening angle.
Specifically, in the embodiment of the invention, the central controller determines whether the motor needs to be started according to the real-time received reaction parameter x calculated by pre-obtaining the furnace temperature, the gas flow and the reaction time of the diffusion furnace for producing the chips, sets the reaction parameter threshold value Xz, sets the initial state of the diffusion furnace temperature control constant temperature system to be that the buckle is connected with the limiting rod, and sets the opening angle of the first flip cover and the second flip cover to be zero,
if x is less than or equal to Xz, the central controller judges that the motor does not need to be started;
and if x is larger than Xz, the central controller judges that the motor needs to be started.
Specifically, in the embodiment of the present invention, when the central controller determines that the motor needs to be started, the central controller preliminarily determines the opening angle of the rotating mechanism according to the difference between the reaction parameter calculated in real time and the reaction difference threshold value in combination with the reaction parameter difference, and then,
if X-Xz is less than or equal to X1, the central controller preliminarily determines that the opening angle of the rotating mechanism is A1;
if X1 is larger than X-Xz and is not larger than X2, the central controller preliminarily determines that the opening angle of the rotating mechanism is A2;
if X2 is larger than X-Xz and is not larger than X3, the central controller preliminarily determines that the opening angle of the rotating mechanism is A3;
if X (n-1) < X-Xz is less than or equal to Xn, the central controller preliminarily determines that the opening angle of the rotating mechanism is An.
Specifically, in the embodiment of the present invention, temperature differences Tc1, Tc2, Tc3, …, and Tcn are preset in the central controller, where Tc1 represents a first preset temperature difference, Tc2 represents a second preset temperature difference, Tc3 represents a third preset temperature difference, and Tcn represents an nth preset temperature difference.
Specifically, in the embodiment of the present invention, adjustment parameter values α 1, α 2, α 3, …, and α 4 are preset in the central controller, where α 1 represents a first preset adjustment parameter value, α 2 represents a second preset adjustment parameter value, α 3 represents a third preset adjustment parameter value, and α 4 represents a fourth preset adjustment parameter value.
Specifically, in the embodiment of the present invention, the central controller receives the external real-time temperature of the ambient temperature sensor disposed outside the temperature-controlled constant temperature system, adjusts the opening angle of the rotating mechanism according to the difference between the temperature inside the diffusion furnace and the ambient temperature, sets the external real-time ambient temperature to Tb, sets the real-time temperature inside the diffusion furnace to Tw,
if Tb is larger than Tw, the central controller judges the system fault;
if Tw-Tb is greater than 0 and less than or equal to Tc1, the central controller determines that the adjusting parameter value is alpha 1, the opening angle of the rotating mechanism is adjusted to be B, and B = alpha 1 xA 1;
if Tc1 is more than Tw-Tb and less than or equal to Tc2, the central controller determines that the adjusting parameter value is alpha 2, the opening angle of the rotating mechanism is adjusted to be B, and B = alpha 2 xA 2;
if Tc2 is more than Tw-Tb and less than or equal to Tc3, the central controller determines that the adjusting parameter value is alpha 3, the opening angle of the rotating mechanism is adjusted to be B, and B = alpha 3 xA 3;
if Tc (n-1) < Tw-Tb is less than or equal to Tcn, the central controller determines that the adjusting parameter value is alpha n, the opening angle of the rotating mechanism is adjusted to be B, and B = alpha n multiplied by An.
Specifically, in the embodiment of the present invention, a first preset diffusion depth difference value is preset in the central controller as K1, a second preset diffusion depth difference value is preset as K2, and a third preset diffusion depth difference value is preset as K3, where K1 is greater than K2 and K3;
a first preset opening angle compensation degree D1 and a second preset opening angle compensation degree D2 are preset in the central controller, and D1 is smaller than D2.
Specifically, in the embodiment of the present invention, when the diffusion furnace completes diffusion of the chip, the diffusion depth of the completed chip is detected and the detection result is transmitted to the central controller, the central controller performs secondary adjustment on the opening angle of the rotation mechanism according to the difference between the received diffusion depth value and the preset diffusion depth value, the diffusion depth value of the chip is set to k, the preset diffusion depth value is set to Kf, and then,
if the absolute value kf-K is less than or equal to K1 or the absolute value kf-K is more than K3, the central controller does not adjust the opening angle of the rotating mechanism;
if K1 < | kf-K | ≦ K2, the central controller determines that the opening angle compensation degree is D1, the opening angle of the secondary adjustment rotating mechanism is C, and C = B + D1;
if K2 < | kf-K | ≦ K3, the central controller determines that the opening angle compensation degree is D2, the opening angle of the secondary adjustment rotating mechanism is C, and C = B + D2.
Specifically, in the embodiment of the present invention, the central controller sets An as the maximum opening angle and a1 as the minimum opening angle, and takes An as the adjusted opening angle if the opening angle B of the adjusted rotating mechanism is greater than An, and takes a1 as the adjusted opening angle if the opening angle B of the adjusted rotating mechanism is less than a 1;
if the opening angle C of the adjusted rotating mechanism is greater than An, An is taken as the adjusted opening angle, and if the opening angle C of the adjusted rotating mechanism is less than a1, a1 is taken as the adjusted opening angle.
So far, the technical solutions of the present invention have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Equivalent changes or substitutions of related technical features can be made by those skilled in the art without departing from the principle of the invention, and the technical scheme after the changes or substitutions can fall into the protection scope of the invention.
Claims (10)
1. A diffusion furnace temperature-control constant temperature system for chip production is characterized by comprising,
the rotating mechanism comprises a limiting buckle, the bottom of the limiting buckle is fixedly connected with a supporting rod, the outer wall of the supporting rod is fixedly connected with a bearing, the outer wall of the bearing is fixedly connected with an upper barrel and a lower barrel, the upper barrel and the lower barrel are the same in shape and size, and the lower barrel is connected with a motor;
the turnover mechanism comprises a first turnover cover and a second turnover cover, the first turnover cover and the second turnover cover are sleeved on a furnace opening of the diffusion furnace, one side of the first turnover cover is connected with the upper barrel, one side of the second turnover cover is connected with the lower barrel, and the motor drives the lower barrel to rotate so as to adjust the opening angles of the first turnover cover and the second turnover cover;
the limiting rod is arranged on the other side of the first turnover cover, and the other side of the second turnover cover is fixedly connected with a rotating shaft;
the buckle is movably arranged on the outer wall of the rotating shaft and comprises a buckle body, a reserved hole is formed in one side of the buckle body, a clamping groove is formed in the front face of the buckle body, and the size of the outer wall of the rotating shaft is matched with that of the inner wall of the reserved hole;
the central controller is connected with the motor and used for adjusting the opening angles of the first turnover cover and the second turnover cover, the central controller acquires the temperature, the gas flow and the reaction time in the diffusion furnace for chip production in advance and determines the reaction parameters of the diffusion furnace, and the central controller determines whether the motor needs to be started or not according to the reaction parameters calculated by the acquired temperature, the gas flow and the reaction time in the diffusion furnace for chip production;
when the temperature control constant temperature system judges that the motor needs to be started, the central controller compares the difference value with the reaction parameter difference value according to the difference value of the reaction parameter and the reaction difference value threshold value calculated in real time, and preliminarily determines the opening angle of the rotating mechanism;
the central controller receives the external real-time temperature of an environmental temperature sensor arranged outside the temperature control constant temperature system, and adjusts the opening angle of the rotating mechanism according to the difference between the temperature in the diffusion furnace and the environmental temperature;
when the diffusion furnace finishes diffusion work of the chips, the diffusion depth of the finished chips is detected, the detection result is transmitted to the central controller, and the central controller adjusts the opening angle of the rotating mechanism for the second time according to the difference value between the received diffusion depth value and the preset diffusion depth value.
2. The system of claim 1, wherein the central controller obtains the temperature, the gas flow rate and the reaction time of the diffusion furnace for producing the chips in advance, determines the reaction parameters of the diffusion furnace, sets the reaction parameters to be x,
x=Tw/Tw0+Q/Q0+t/t0
where Tw represents a real-time temperature in the diffusion furnace, Tw0 represents a preset temperature of the diffusion furnace, Q represents a gas flow rate in the diffusion furnace, Q0 represents a preset gas flow rate, t represents a reaction time in the diffusion furnace, and t0 represents a preset reaction time.
3. The diffusion furnace temperature-controlled constant temperature system for chip production as claimed in claim 2, wherein reaction parameter differences X1, X2, X3, …, Xn are preset in the central controller, wherein X1 represents a first preset reaction parameter difference, X2 represents a second preset reaction parameter difference, X3 represents a third preset reaction parameter difference, and Xn represents an nth preset reaction parameter difference;
opening angles A1, A2, A3, … and An are preset in the central controller, wherein A1 represents a first preset opening angle, A2 represents a second preset opening angle, A3 represents a third preset opening angle, and An represents An nth preset opening angle.
4. The diffusion furnace temperature-control constant temperature system for chip production according to claim 3, wherein the central controller determines whether a motor needs to be started or not according to a reaction parameter x received in real time and calculated in advance by acquiring the furnace temperature, the gas flow rate and the reaction time of the diffusion furnace for chip production, sets a reaction parameter threshold value Xz, sets an initial state of the diffusion furnace temperature-control constant temperature system that a buckle is connected with a limiting rod and an opening angle of the first flip cover and the second flip cover is zero,
if x is less than or equal to Xz, the central controller judges that the motor does not need to be started;
and if x is larger than Xz, the central controller judges that the motor needs to be started.
5. The diffusion furnace temperature-controlled constant temperature system for chip production according to claim 4, wherein when the central controller determines that the motor needs to be started, the central controller preliminarily determines the opening angle of the rotating mechanism according to the difference between the reaction parameter and the reaction difference threshold calculated in real time and the reaction parameter difference,
if X-Xz is less than or equal to X1, the central controller preliminarily determines that the opening angle of the rotating mechanism is A1;
if X1 is larger than X-Xz and is not larger than X2, the central controller preliminarily determines that the opening angle of the rotating mechanism is A2;
if X2 is larger than X-Xz and is not larger than X3, the central controller preliminarily determines that the opening angle of the rotating mechanism is A3;
if X (n-1) < X-Xz is less than or equal to Xn, the central controller preliminarily determines that the opening angle of the rotating mechanism is An.
6. The diffusion furnace temperature-controlled constant temperature system for producing chips as defined in claim 5, wherein temperature differences Tc1, Tc2, Tc3, … and Tcn are preset in the central controller, wherein Tc1 represents a first preset temperature difference, Tc2 represents a second preset temperature difference, Tc3 represents a third preset temperature difference, and Tcn represents an nth preset temperature difference;
adjusting parameter values alpha 1, alpha 2, alpha 3, … and alpha 4 are preset in the central controller, wherein alpha 1 represents a first preset adjusting parameter value, alpha 2 represents a second preset adjusting parameter value, alpha 3 represents a third preset adjusting parameter value, and alpha 4 represents a fourth preset adjusting parameter value.
7. The temperature-controlled constant temperature system of the diffusion furnace for producing chips as defined in claim 6, wherein the central controller receives an external real-time temperature of an ambient temperature sensor disposed outside the temperature-controlled constant temperature system, the central controller adjusts an opening angle of the rotary mechanism according to a difference between the temperature inside the diffusion furnace and the ambient temperature, sets the external real-time ambient temperature to Tb and the real-time temperature inside the diffusion furnace to Tw,
if Tb is larger than Tw, the central controller judges the system fault;
if Tw-Tb is greater than 0 and less than or equal to Tc1, the central controller determines that the adjusting parameter value is alpha 1, the opening angle of the rotating mechanism is adjusted to be B, and B = alpha 1 xA 1;
if Tc1 is more than Tw-Tb and less than or equal to Tc2, the central controller determines that the adjusting parameter value is alpha 2, the opening angle of the rotating mechanism is adjusted to be B, and B = alpha 2 xA 2;
if Tc2 is more than Tw-Tb and less than or equal to Tc3, the central controller determines that the adjusting parameter value is alpha 3, the opening angle of the rotating mechanism is adjusted to be B, and B = alpha 3 xA 3;
if Tc (n-1) < Tw-Tb is less than or equal to Tcn, the central controller determines that the adjusting parameter value is alpha n, the opening angle of the rotating mechanism is adjusted to be B, and B = alpha n multiplied by An.
8. The diffusion furnace temperature-controlled constant temperature system for chip production as claimed in claim 7, wherein a first preset diffusion depth difference of K1, a second preset diffusion depth difference of K2 and a third preset diffusion depth difference of K3 are preset in the central controller, K1 < K2 < K3;
a first preset opening angle compensation degree D1 and a second preset opening angle compensation degree D2 are preset in the central controller, and D1 is smaller than D2.
9. The temperature-controlled constant temperature system of the diffusion furnace for producing chips as defined in claim 8, wherein when the diffusion furnace completes diffusion of the chips, the diffusion depth of the completed chips is detected and the detection result is transmitted to the central controller, the central controller performs a secondary adjustment of the opening angle of the rotation mechanism according to the difference between the received diffusion depth value and a preset diffusion depth value, the diffusion depth value of the chip is set to k, and the preset diffusion depth value is set to Kf, and then,
if the absolute value kf-K is less than or equal to K1 or the absolute value kf-K is more than K3, the central controller does not adjust the opening angle of the rotating mechanism;
if K1 < | kf-K | ≦ K2, the central controller determines that the opening angle compensation degree is D1, the opening angle of the secondary adjustment rotating mechanism is C, and C = B + D1;
if K2 < | kf-K | ≦ K3, the central controller determines that the opening angle compensation degree is D2, the opening angle of the secondary adjustment rotating mechanism is C, and C = B + D2.
10. The temperature-controlled constant temperature system of the diffusion furnace for producing chips as claimed in claim 9, wherein the central controller sets An to be a maximum opening angle and a1 to be a minimum opening angle, and takes An to be An adjusted opening angle if the opening angle B of the adjusted rotation mechanism is greater than An, and takes a1 to be An adjusted opening angle if the opening angle B of the adjusted rotation mechanism is less than a 1;
if the opening angle C of the adjusted rotating mechanism is greater than An, An is taken as the adjusted opening angle, and if the opening angle C of the adjusted rotating mechanism is less than a1, a1 is taken as the adjusted opening angle.
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