CN113447131A - Infrared thermal imaging field temperature measurement calibration device and method - Google Patents
Infrared thermal imaging field temperature measurement calibration device and method Download PDFInfo
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- CN113447131A CN113447131A CN202010222214.9A CN202010222214A CN113447131A CN 113447131 A CN113447131 A CN 113447131A CN 202010222214 A CN202010222214 A CN 202010222214A CN 113447131 A CN113447131 A CN 113447131A
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- 238000009529 body temperature measurement Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000001931 thermography Methods 0.000 title claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 239000004065 semiconductor Substances 0.000 claims abstract description 28
- 238000005057 refrigeration Methods 0.000 claims abstract description 10
- 238000005259 measurement Methods 0.000 claims description 9
- 238000004891 communication Methods 0.000 claims description 5
- 238000004364 calculation method Methods 0.000 claims description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 description 7
- 239000013307 optical fiber Substances 0.000 description 5
- 230000036760 body temperature Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000012806 monitoring device Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 2
- 230000005457 Black-body radiation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J2005/0077—Imaging
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Abstract
The invention relates to the technical field of infrared thermal imaging, in particular to a low-power consumption infrared thermal imaging field temperature measurement calibration device and method. An infrared thermal imaging on-site temperature measurement calibration device comprises a metal plate (1), a semiconductor refrigeration piece (2) used for controlling the temperature on the metal plate (1), and a temperature sensor (3) used for measuring the temperature of the metal plate (1); the semiconductor refrigerating sheet (2) is fixed on the back surface of the metal plate (1); the front surface of the metal plate (1) is black. The invention has the beneficial effects that: the calibration device is simple in structure and convenient to use. The calibration method provided by the invention can be used for carrying out real-time data acquisition on the calibration device and the object to be measured on site, and has the advantages of simple calibration process, convenience in operation, high efficiency, good real-time performance and low power consumption. The thermal infrared imager response curves at different temperatures are calibrated at the same time, the influence of the environmental temperature change on the temperature measurement accuracy is weakened to the maximum extent, and the calibration precision is further improved.
Description
Technical Field
The invention relates to the technical field of infrared thermal imaging, in particular to a low-power consumption infrared thermal imaging field temperature measurement calibration device and method.
Background
In nature, when the temperature of an object is higher than absolute zero, electromagnetic waves are radiated to the periphery continuously due to the internal thermal motion of the object, wherein the electromagnetic waves comprise infrared rays with the wave band of 0.75-100 mu m. The maximum characteristic is that under a given temperature and wavelength, the radiation energy emitted by a body has a maximum value, the material is called a black body, the reflection coefficient of the material is set to be 1, the reflection coefficient of other materials is smaller than 1, the material is called a gray body, and due to the fact that the spectral radiation power P (lambda T) of the black body and the absolute temperature T meet the Planck's law. It is illustrated that the radiation power of the black body per unit area at the wavelength λ is P (λ T) at the absolute temperature T. The more intense the radiant energy of the object as the temperature increases. The method is a starting point of an infrared radiation theory and is also a design basis of a single-band infrared thermometer.
As the temperature increases, the radiation peak shifts in the direction of the short wave (to the left) and satisfies the wien displacement theorem, the wavelength at the peak is inversely proportional to the absolute temperature T, and the dashed line is the line at the peak. This formula tells us why the high temperature thermometer works at short wavelength more and the low temperature thermometer at long wavelength more.
The change rate of radiation energy along with temperature is larger at the short wave position than at the long wave position, namely, the relative signal-to-noise ratio (high sensitivity) of the temperature measuring instrument working at the short wave position is high, the anti-interference performance is strong, and the temperature measuring instrument should work at the peak wavelength as far as possible, especially under the condition of low-temperature small target.
Under an ideal model, the target temperature T and the output D of the detector are in a certain functional relation T ═ f (D), and the target temperature T can be obtained by substituting the functional relation into the output value D of the detector.
In the actual temperature measurement process, the output data D of the thermal infrared imager is not simply related to the target temperature T, but is also subjected to the ambient temperature T around the thermal infrared imagerfIs thus given by the function T ═f (D) the target temperature cannot be accurately obtained. The original response output to the target thermal infrared imager of 30 degrees is D2However, the response output of the thermal infrared imager is D due to the influence of temperature drift1The substitution of the function T ═ f (d) will result in a measured temperature of less than 30 degrees.
Therefore, temperature drift is the source of temperature measurement errors.
Therefore, the infrared thermometer needs to consider the influence of temperature drift on the temperature response curve during calibration.
The existing common temperature calibration method is to use a black body unit to generate heat radiation with different preset temperatures, then a control unit performs data fitting according to temperature values of all black body radiation sources measured at different temperatures to obtain a fitting formula, and when the temperature is measured, the temperature value input by a thermal imaging unit is operated by using the fitting formula to obtain a final temperature measurement result. The calibration method has the defects of poor real-time performance, high power consumption and low precision.
Disclosure of Invention
The invention aims to solve the technical problem of providing a low-power-consumption and high-precision thermal imaging field temperature measurement calibration device and method.
The technical scheme adopted by the invention for solving the technical problems is as follows: a thermal imaging field temperature measurement calibration device comprises: the temperature measuring device comprises a metal plate (1), a semiconductor refrigerating sheet (2) used for controlling the temperature of the metal plate (1) and a temperature sensor (3) used for measuring the temperature of the metal plate (1); the semiconductor refrigerating sheet (2) is fixed on the back surface of the metal plate (1); the front surface of the metal plate (1) is black.
As a preferable mode of the present invention, the back surface of the metal plate (1) includes at least two semiconductor chilling plates (2), and one temperature sensor (3) is fixed on each semiconductor chilling plate (2).
Further preferably, the semiconductor refrigeration pieces (2) are arranged on the back surface of the metal plate (1) at equal intervals.
The invention also provides a low-power-consumption and high-precision thermal imaging field temperature measurement calibration method for solving the technical problem, which comprises the following steps:
1) determining the temperature range T of an object to be measuredmin～TmaxSequentially selecting n calibration points from low temperature to high temperature, and respectively marking as T1、T2…TnN is more than or equal to 2 and less than or equal to the number of temperature sensors on the calibration device, T1＝Tmin，Tn＝Tmax；
2) Controlling the semiconductor refrigerating sheet on the metal plate to work so that each calibration temperature corresponds to the temperature of an area on the metal plate;
3) after the given calibration temperature value on the metal plate is stable, measuring the metal plate by using a thermal imager and automatically storing the measured gray value of each calibration point;
4) after the measurement is finished, the upper computer performs data fitting according to the measured gray value and the calibrated temperature value through a linear fitting algorithm to obtain a fitting formula;
in the formula, T is the actual temperature of the object to be measured;
Gmand Gm+1Respectively being a calibration temperature point TmAnd Tm+1Corresponding measured gray value, GxFor determining gray values of the object to be measured, Gm≤Gx≤Gm+1，1≤m<n。
5) And substituting the gray value obtained by measuring the object to be measured by the thermal imager into a fitting formula for calculation to obtain a final temperature measurement result.
In a preferred embodiment of the present invention, the n calibration points are in a temperature range Tmin～TmaxAnd taking points at equal intervals.
As another preferred mode of the invention, on the premise of not changing the value of n, more calibration points are taken in the temperature dense distribution range of the object to be measured, and less calibration points are taken in the temperature sparse distribution range.
As another preferred mode of the present invention, the thermal imager is connected to an upper computer through a communication device, and measures the calibration device and the object to be measured simultaneously.
The invention has the beneficial effects that:
(1) the calibration device is simple in structure and convenient to use.
(2) The calibration method provided by the invention has the advantages that the real-time data acquisition is carried out on the calibration device and the object to be measured on site, and the calibration is carried out on site in real time, so that the calibration process is simple, the operation is convenient, the calibration efficiency is high, the real-time performance is good, and the power consumption is low.
(3) The temperature calibration point selected by the calibration method covers the whole temperature measurement range of the object to be measured, does not need to cover the whole temperature measurement range of the thermal imager, has higher precision in the measurement requirement range, and can realize the accurate calibration of the real-time measurement temperature required by the temperature measurement equipment.
(4) The calibration method calibrates the response curves of the thermal infrared imagers at different temperatures at the same time, weakens the influence of the environmental temperature change on the temperature measurement accuracy to the maximum extent, and further improves the calibration accuracy.
Drawings
FIG. 1 is a schematic back structure view of an infrared thermal imaging field temperature measurement calibration apparatus in embodiment 1 of the present invention;
FIG. 2 is a schematic flow chart of the infrared thermal imaging field temperature measurement calibration method of the present invention;
FIG. 3 is a schematic diagram of the relative positions of the calibration device, the object to be calibrated, and the thermal imager to be calibrated according to the present invention;
in the figure, 201, a metal plate, 202, a semiconductor refrigerating sheet, 203, a temperature sensor, 301, a calibration device, 302, an object to be measured, 303 and a thermal imager are shown.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive work based on the embodiments of the present invention, belong to the scope of protection of the present invention.
In order that those skilled in the art will better understand the disclosure, the invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
The embodiment 1 provided by the invention is as follows: an infrared thermal imaging field temperature measurement calibration device, fig. 1 is a schematic structural view of the back of a calibration device 301 in this embodiment. As shown in fig. 1, the calibration device 301 is mainly composed of a metal plate 201, a semiconductor chilling plate 202 and a temperature sensor 203. The semiconductor chilling plates 202 are fixed on the back of the metal plate 201 at equal intervals, and a temperature sensor 203 is fixed on each semiconductor chilling plate 202.
An independent area is formed on the back surface of the metal plate 201 at the position where each semiconductor refrigeration piece is located, and the temperature of each area can be adjusted through the work of the semiconductor refrigeration piece 202 to reach different temperatures, so that gradient temperature is formed on the whole metal plate.
The front surface of the metal plate 201 is black, and in the process of calibrating the infrared thermal imaging, the front surface of the metal plate 201 serves as an irradiation surface for receiving an infrared imager to be calibrated.
It should be noted that the structure of the back surface of the metal plate 201 of the calibration apparatus 301 of the present invention is not limited to the structure shown in fig. 1, and in fact, the number and the positions of the semiconductor chilling plates 202 and the temperature sensors 203 on the back surface of the metal plate 201 should be set reasonably according to actual requirements.
The embodiment 2 provided by the invention is as follows: an infrared thermal imaging field temperature measurement calibration method is shown in a flow chart of fig. 2, and comprises the following steps:
1) determining the temperature range T of an object to be measuredmin～TmaxSequentially selecting n calibration points from low temperature to high temperature, and respectively marking as T1、T2…TnN is more than or equal to 2 and less than or equal to the number of temperature sensors on the calibration device, T1＝Tmin，Tn＝Tmax；
2) Controlling the semiconductor refrigerating sheet on the metal plate to work so that each calibration temperature corresponds to the temperature of an area on the metal plate;
3) controlling the semiconductor refrigerating sheet on the calibration device to work, and observing and adjusting the working state of the semiconductor refrigerating sheet in real time by using a temperature sensor until the temperature of each area on the calibration device respectively reaches the calibration temperature selected in the step 2) in sequence;
4) the thermal imager is correctly connected with an upper computer through communication equipment;
5) enabling the thermal imager to be in a working state, and aligning the lens with the calibration device and the object to be measured;
6) after the given calibration temperature value on the calibration device is stable, the thermal imager measures the calibration device and automatically stores the measured gray value of each calibration point, and then the upper computer obtains the gray value measured by the thermal imager in an instruction mode and corresponds to the calibration temperature value one by one;
7) calibration point T1、T2…TnCorrespondingly measuring gray scale values respectively by G1、G2…GnRepresents;
8) after the measurement is finished, the upper computer performs data fitting according to the measured gray value and the calibrated temperature value through a linear fitting algorithm to obtain a fitting formula;
in the formula, T is the actual temperature of the object to be measured;
Gmand Gm+1Respectively being a calibration temperature point TmAnd Tm+1Corresponding measured gray value, GxFor determining gray values of the object to be measured, Gm≤Gx≤Gm+1，1≤m<n；
Calibrating temperature point TmAnd Tm+1The values of (A) are as follows: gxAnd the temperatures of the calibration points corresponding to the left and right adjacent gray values.
9) And substituting the gray value obtained by measuring the object to be measured by the thermal imager into a fitting formula for calculation to obtain a final temperature measurement result.
In this embodiment, the temperature of the calibration point must cover the whole temperature range of the object to be measured, so as to ensure the practicability and accuracy of the thermal imager temperature measurement. The number n of calibration points is determined according to the temperature range of the object to be measured, and within the range acceptable by the calibration time, the greater the value of n is, the higher the calibration precision is;
in general, the temperatures of the n calibration points are equally spaced for the temperature of the object to be measured to be evenly distributed within a certain range, so as to facilitate the operation.
For an object to be measured with unbalanced temperature distribution, in order to improve the temperature measurement precision, on the premise of not changing the value of n, more calibration points can be selected in the dense temperature distribution range of the object to be measured, and the number of the calibration points can be properly reduced in the sparse temperature distribution range.
The invention further provides an application example of the calibration device and the calibration method in the embodiment, which comprises the following steps:
embodiment 3 is a field calibration method for a body temperature monitoring device of an infrared thermal imager, so as to improve the measurement accuracy and the real-time performance of the body temperature monitoring device of the thermal imager and reduce the calibration power consumption of the corresponding device. The relative positions of the calibration device 301, the object 302 to be measured and the thermal imager 303 are shown in fig. 3.
The object to be detected is a human body, the normal temperature range of the object to be detected is 35.8-37.8 ℃, and the temperature range after heating is generally 37.8-42 ℃. The method adopts the calibration device 301 to carry out temperature measurement calibration on the thermal imager 303 body temperature monitoring equipment, and specifically comprises the following steps:
1) firstly, selecting 35 ℃ as a first calibration point, then considering that the body temperature of a human body is mostly concentrated at 35.8-37.8 ℃, and about 37.8 ℃ is a threshold value for judging whether the human body generates heat, and sequentially selecting 10 calibration temperature points of 35 ℃, 36 ℃, 36.5 ℃, 37 ℃, 37.5 ℃, 38 ℃, 38.5 ℃, 39.5 ℃, 40.5 ℃ and 41.5 ℃.
2) Controlling the semiconductor chilling plates 202 on the back of the metal plate 201 of the calibration device 301 to work, and observing and timely adjusting the working states of the semiconductor chilling plates 202 in real time by using the temperature sensors 203 until the temperatures of ten areas on the metal plate 201 respectively reach the calibration temperatures selected in the step 1) in sequence;
3) the thermal imager 303 is correctly connected with an upper computer through communication equipment;
4) as shown in fig. 3, the thermal imager 303 is in a working state, and the lens is aligned with the front surface of the calibration device 301 and the object 302 to be measured (person to be measured);
5) after the given calibration temperature value on the calibration device 301 is stable and does not change any more, the thermal imager 303 measures the calibration device 301 and automatically stores the measured gray value of each calibration point, and then the upper computer obtains the gray value measured by the thermal imager 303 in an instruction mode and corresponds to the calibration temperature value one by one;
6) after the measurement is finished, the upper computer performs data fitting according to the measured gray value and the calibrated temperature value through a set linear fitting algorithm to obtain a fitting formula:
in the formula, T is the actual temperature of the object to be measured;
Gmand Gm+1Respectively being a calibration temperature point TmAnd Tm+1Corresponding measured gray value, GxFor determining gray values of the object to be measured, Gm≤Gx≤Gm+1，1≤m<n；
Calibrating temperature point TmAnd Tm+1The values of (A) are as follows: gxAnd the temperatures of the calibration points corresponding to the left and right adjacent gray values.
7) Measuring the gray value G obtained by the object 302 (person to be measured) to be measured by the thermal imager 303xSubstituting the fitting formula for calculation to obtain a final temperature measurement result.
Embodiment 4 this embodiment relates to a calibration method for a thermal imager optical fiber temperature monitoring device, so as to improve the measurement accuracy and the real-time performance of the thermal imager optical fiber temperature monitoring device and reduce the calibration power consumption of the corresponding device. The object to be measured is a standard optical fiber, and the normal working temperature range of the object to be measured is-40-75 ℃. Adopt calibration device 301 to carry out the temperature measurement to thermal imager 303 optic fibre temperature monitoring equipment and mark, specifically include the following step:
1) firstly, selecting-40 ℃ as a first calibration point, and sequentially selecting 12 calibration temperature points of-30 ℃, 20 ℃, 10 ℃, 0 ℃, 10 ℃, 20 ℃, 30 ℃, 40 ℃, 50 ℃, 60 ℃, 70 ℃, 80 ℃ and the like at intervals of 10 ℃;
2) controlling the semiconductor refrigeration piece 202 on the metal plate 201 to work, and observing and timely adjusting the working state of the semiconductor refrigeration piece 202 in real time by using a temperature sensor 203 at the back of the metal plate 201 until the temperatures of twelve areas on the metal plate 201 respectively reach the calibration temperatures selected in the step 1) in sequence;
3) the thermal imager 303 is correctly connected with an upper computer through communication equipment;
4) as shown in fig. 3, the thermal imager 303 is in an operating state, and a lens is set on the front surface of the metal plate 201 and the object 302 to be measured (standard optical fiber);
5) after the given calibration temperature value on the calibration device 301 is stable and does not change any more, the thermal imager 303 measures the calibration device 301 and automatically stores the measured gray value of each calibration point, and then the upper computer obtains the gray value measured by the thermal imager 303 in an instruction mode and corresponds to the calibration temperature value one by one;
6) after the measurement is finished, the upper computer performs data fitting according to the measured gray value and the calibrated temperature value through a set linear fitting algorithm to obtain a fitting formula:
in the formula, T is the actual temperature of the object to be measured;
Gmand Gm+1Respectively being a calibration temperature point TmAnd Tm+1Corresponding measured gray value, GxFor determining gray values of the object to be measured, Gm≤Gx≤Gm+1，1≤m<n；
Calibrating temperature point TmAnd Tm+1The values of (A) are as follows: gxAnd the temperatures of the calibration points corresponding to the left and right adjacent gray values.
7) Measuring the gray value G obtained by the object 302 (standard optical fiber) to be measured by the thermal imager 303xSubstituting into the fitting formulaAnd calculating to obtain a final temperature measurement result.
Claims (7)
1. An infrared thermal imaging on-site temperature measurement calibration device is characterized by comprising a metal plate (1), a semiconductor refrigeration piece (2) used for controlling the temperature on the metal plate (1) and a temperature sensor (3) used for measuring the temperature of the metal plate (1); the semiconductor refrigerating sheet (2) is fixed on the back surface of the metal plate (1); the front surface of the metal plate (1) is black.
2. The on-site temperature measurement and calibration device for the infrared thermal imaging according to claim 1, wherein the back surface of the metal plate (1) comprises at least two semiconductor refrigeration pieces (2), and each semiconductor refrigeration piece (2) is fixed with one temperature sensor (3).
3. The on-site temperature measurement and calibration device for the infrared thermal imaging according to claim 2, wherein the semiconductor refrigeration pieces (2) are arranged on the back surface of the metal plate (1) at equal intervals.
4. An infrared thermal imaging field temperature measurement calibration method is characterized by comprising the following steps:
1) determining the temperature range T of an object to be measuredmin～TmaxSequentially selecting n calibration points from low temperature to high temperature, and respectively marking as T1、T2...TnN is more than or equal to 2 and less than or equal to the number of temperature sensors on the calibration device, T1＝Tmin，Tn＝Tmax；
2) Controlling the semiconductor refrigerating sheet on the metal plate to work so that each calibration temperature corresponds to the temperature of an area on the metal plate;
3) after the given calibration temperature value on the calibration device is stable, measuring the metal plate by using a thermal imager and automatically storing the measured gray value of each calibration point;
4) after the measurement is finished, the upper computer performs data fitting according to the measured gray value and the calibrated temperature value through a linear fitting algorithm to obtain a fitting formula;
in the formula, T is the actual temperature of the object to be measured;
Gmand Gm+1Respectively being a calibration temperature point TmAnd Tm+1Corresponding measured gray value, GxFor determining gray values of the object to be measured, Gm≤Gx≤Gm+1，1≤m＜n。
5) And substituting the gray value obtained by measuring the object to be measured by the thermal imager into a fitting formula for calculation to obtain a final temperature measurement result.
5. The infrared thermal imaging field temperature measurement calibration method according to claim 4, characterized in that: the n calibration points are in a temperature range Tmin～TmaxAnd taking points at equal intervals.
6. The infrared thermal imaging field temperature measurement calibration method according to claim 4, characterized in that: and on the premise of not changing the value of n, more calibration points are taken in the temperature dense distribution range of the object to be measured, and less calibration points are taken in the temperature sparse distribution range.
7. The infrared thermal imaging field temperature measurement calibration method according to claim 4, characterized in that: the thermal imager is connected with an upper computer through communication equipment and is used for simultaneously measuring the calibration device and the object to be measured.
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