CN113438849A

CN113438849A - Shell, preparation method thereof and electronic equipment

Info

Publication number: CN113438849A
Application number: CN202110742946.5A
Authority: CN
Inventors: 陈奕君; 胡梦; 李聪
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-06-30
Filing date: 2021-06-30
Publication date: 2021-09-24

Abstract

The application provides a shell, a preparation method thereof and electronic equipment. The housing of the present application includes: the shell comprises a shell body, wherein the raw material components of the shell body comprise ceramic powder, thermoplastic resin and polyfluoroolefin; the weight ratio of the ceramic powder to the thermoplastic resin is 1:1 to 10: 1. The shell has the advantages of good processing performance, low friction coefficient and smooth ceramic hand feeling.

Description

Shell, preparation method thereof and electronic equipment

Technical Field

The application relates to the field of electronics, in particular to a shell, a preparation method of the shell and electronic equipment.

Background

Ceramics have a warm and moist hand feeling and a high gloss texture, and therefore, are often used as exterior structural members of high-end electronic device housings, middle frames, decorative parts, and the like. However, since the ceramic has a high density, severe processing conditions and high processing cost, and the application is greatly limited, the ceramic is added with resin to reduce the processing performance of the ceramic, but the friction coefficient of the shell is greatly increased, the surface friction resistance is increased, and the smooth feeling similar to the ceramic is difficult to have.

Disclosure of Invention

In view of the above problems, embodiments of the present application provide a housing with better processability, lower friction coefficient and smoother ceramic hand feeling.

The embodiment of the application provides a casing, it includes: the shell comprises a shell body, wherein the raw material components of the shell body comprise ceramic powder, thermoplastic resin and polyfluoroolefin; the weight ratio of the ceramic powder to the thermoplastic resin is 1:1 to 10: 1.

The embodiment of the application also provides a preparation method of the shell, which comprises the following steps:

mixing and granulating polyfluoroolefin and thermoplastic resin at a first temperature to obtain first granules;

mixing the first granules with the ceramic powder, and carrying out banburying granulation at a second temperature to obtain second granules, wherein the second temperature is lower than the first temperature;

molding the second granules to obtain a blank; and

and carrying out warm isostatic pressing on the blank to obtain the shell body.

An embodiment of the present application further provides an electronic device, which includes:

the shell is provided with an accommodating space;

a display component for displaying; and

the circuit board assembly is arranged in the accommodating space and electrically connected with the display assembly and used for controlling the display assembly to display.

The raw material components of the shell body of the shell comprise ceramic powder, thermoplastic resin and polyfluoroolefin, wherein the thermoplastic resin enables the shell body to have better processing performance and lighter weight; the main chain of the polyfluoroolefin molecule is formed by C-C bonds, the side chain comprises a large number of fluorine atoms, the radius of the fluorine atoms is large, the surfaces of most polymer chains are covered, meanwhile, the fluorine atoms are negatively charged, the positive charge of the carbon atoms of the main chain can be effectively shielded, due to the repulsion action of the fluorine atoms between the adjacent molecular chains, the adjacent molecular chains are mutually repelled, the bonding force between the adjacent molecular chains is weak, and the adjacent molecular chains are easy to slide relatively; therefore, the polyfluoroolefin is introduced into the shell body, so that the surface friction coefficient of the shell body can be reduced, and the smoother ceramic hand feeling and better wear resistance of the shell body are improved; and further, the shell has better processing performance, lighter weight, smoother ceramic hand feeling and better wear resistance.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a housing according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a housing according to another embodiment of the present application.

Fig. 3 is a schematic flow chart of a method for manufacturing a housing according to an embodiment of the present disclosure.

Fig. 4 is a schematic flow chart of a method for manufacturing a housing according to another embodiment of the present disclosure.

Fig. 5 is a schematic flow chart of a method for manufacturing a housing according to another embodiment of the present disclosure.

Fig. 6 is an exploded view of an electronic device according to an embodiment of the present application.

Fig. 7 is a circuit block diagram of an electronic device according to an embodiment of the present application.

Description of reference numerals:

100-housing 500-electronic device

10-housing body 510-display assembly

101-accommodating space 530-circuit board assembly

11-backplane 531-processor

13-side plate 533-memory

30-protective layer

Detailed Description

In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present application, and a detailed description of the like parts is omitted in different embodiments for the sake of brevity.

Ceramics have a warm and moist hand feeling and a high gloss texture, and therefore, are often used as exterior structural members of high-end electronic device housings, middle frames, decorative parts, and the like. However, the ceramic has high density, the manufactured electronic device appearance structural member is heavy, the pencil has high hardness, is easy to crack and has high processing difficulty, and in addition, the processing cost of the ceramic is high, so that the application of the ceramic is greatly limited. In order to improve the performance and cost of ceramics, in the related art, a shell of electronic equipment is manufactured by mixing thermoplastic resin and ceramic powder and injection molding, however, the friction coefficient of the manufactured shell is greatly increased and the surface friction resistance is increased due to the addition of the thermoplastic resin, so that the manufactured shell is difficult to have smooth hand feeling similar to ceramics.

Referring to fig. 1, a housing 100 provided in the embodiment of the present application includes a housing body 10, and raw material components of the housing body 10 include ceramic powder, thermoplastic resin, and polyfluoroolefin; the weight ratio of the ceramic powder to the thermoplastic resin is 1:1 to 10: 1.

The term "polyfluoroolefin" as used herein refers to polymers of olefins having two or more fluorine atoms.

Alternatively, the housing 100 of the present application may be an outer case, a middle frame, a decoration, and the like of an electronic device. The housing 100 of the embodiment of the present application may have a 2D structure, a 2.5D structure, a 3D structure, or the like. As shown in fig. 1, the housing 100 may optionally include a bottom plate 11 and a side plate 13 connected to the bottom plate 11 in a bent manner. The bottom plate 11 and the side plate 13 enclose an accommodating space 101. In some embodiments, the bottom plate 11 and the side plate 13 are a unitary structure, and in other embodiments, the bottom plate 11 and the side plate 13 are formed separately and then connected together. In a specific embodiment, the bottom plate 11 is a rear cover of the electronic device, and the side plate 13 is a middle frame of the electronic device.

The raw material components of the shell body 10 of the shell 100 of the present application include ceramic powder, thermoplastic resin and polyfluoroolefin, and the thermoplastic resin enables the shell body 10 to have better processability and lighter weight; the main chain of the polyfluoroolefin molecule is formed by C-C bonds, the side chain comprises a large number of fluorine atoms, the radius of the fluorine atoms is large, the surfaces of most polymer chains are covered, meanwhile, the fluorine atoms are negatively charged, the positive charge of the carbon atoms of the main chain can be effectively shielded, due to the repulsion action of the fluorine atoms between the adjacent molecular chains, the adjacent molecular chains are mutually repelled, the bonding force between the adjacent molecular chains is weak, and the adjacent molecular chains are easy to slide relatively; therefore, the polyfluoroolefin is introduced into the shell body 10, so that the surface friction coefficient of the shell body 10 can be reduced, and the smoother ceramic hand feeling and better wear resistance of the shell body 10 are improved; further, the housing 100 has a smooth ceramic hand feeling and better wear resistance while having better processability and lighter weight.

Optionally, the polyfluoroolefin comprises a polymer comprising one or more of fluoroethylene, fluoropropylene. Alternatively, the copolymer may be, but is not limited to, one or more of a random copolymer, an alternating copolymer, a block copolymer, and a graft copolymer.

Optionally, the fluorine-containing ethylene comprises one or more of difluoroethylene, trifluoroethylene, tetrafluoroethylene; the fluorine-containing propylene comprises one or more of difluoropropylene, trifluoropropene, tetrafluoropropene, fluorine-free propylene and hexafluoropropylene. In other words, the polyfluoroolefin may be a polymer of one or more of difluoroethylene, trifluoroethylene, tetrafluoroethylene, difluoropropylene, trifluoropropene, tetrafluoropropene, non-fluoropropylene, hexafluoropropene. For example, in one embodiment, the polyfluoroolefin is polytetrafluoroethylene; in another embodiment, the polyfluoroolefin is a copolymer of polytetrafluoroethylene and polyhexafluoropropylene. When the molecular chain of the polyfluoroolefin contains more fluorine atoms, the repulsion between the adjacent molecular chains is larger, the adjacent molecular chains are easier to slide relatively, and after the polyfluoroolefin is added into the shell body 10, the friction coefficient of the surface of the shell body 10 can be lower, so that the more fluorine atoms the molecular chain of the polyfluoroolefin contains, the more obvious the reduction of the friction coefficient of the surface of the shell body 10 is. When the polyfluoroolefin is polytetrafluoroethylene, there are no large branches in the molecular chain (e.g., C-CF)₃) Only the main chain C-C and the side chain C-F have larger repulsion between adjacent molecular chains, and the lower the acting force between the adjacent molecular chains, the more obvious the reduction of the friction coefficient of the surface of the shell body 10.

Optionally, the weight average molecular weight of the polyfluoroolefin ranges from 50W to 500W; specifically, it may be, but is not limited to, 50W, 100W, 150W, 200W, 250W, 300W, 350W, 400W, 450W, 500W, etc. When the molecular weight of the polyfluoroolefin is too high, the viscosity of the polyfluoroolefin is too high, which affects the mixing uniformity of the polyfluoroolefin and the thermoplastic resin (in other words, the dispersibility of the polyfluoroolefin is not good), thereby affecting the mechanical properties of the prepared shell body 10; when the molecular weight of the polyfluoroolefin is too low, the mechanical properties of the case body 10, such as flexural strength, may be reduced.

Optionally, the weight content of the polyfluoroolefin is 5 to 30 percent of the total weight of the thermoplastic resin and polyfluoroolefin; specifically, it may be, but not limited to, 5%, 8%, 10%, 13%, 15%, 18%, 20%, 22%, 25%, 27%, 30%, etc. When the weight content of the polyfluoroolefin is controlled within this range, not only the friction coefficient of the surface of the case body 10 can be reduced, the wear resistance of the case body 10 can be improved, but also the bending strength and toughness of the case body 10 can be improved. When the content of the polyfluoroolefin is too low, the reduction of the surface friction coefficient of the shell body 10 is not obvious, and the improvement of the bending strength and the toughness of the shell body 10 is also not obvious; when the content of the polyfluoroolefin is too high, the friction coefficient of the housing body 10 is further decreased to a limited extent, but the flexural strength and toughness of the housing body 10 are gradually decreased. Optionally, when the weight content of the polyfluoroolefin is 15% to 25% of the total weight of the thermoplastic resin and the polyfluoroolefin, the housing body 10 has a lower friction coefficient, better wear resistance, and higher bending strength and toughness.

Optionally, the weight ratio of the ceramic powder to the thermoplastic resin is 1:1 to 10: 1. Specifically, the weight ratio of the ceramic powder to the thermoplastic resin may be, but is not limited to, 1:1, 2:1, 3:1, 4:1, 5:1, 6:1, 7:1, 8:1, 9:1, 10:1, and the like. When the content of the ceramic powder is too small, the wear resistance of the manufactured shell 100 is poor, the service life of the shell 100 is reduced, and meanwhile, the ceramic texture of the shell 100 is affected due to poor surface glossiness. When the content of the ceramic powder is too large, the housing body 10 is difficult to mold, and the manufactured housing 100 has poor toughness and is easily broken. When the weight ratio of the ceramic powder to the thermoplastic resin is 1:1 to 10:1, the prepared shell 100 has better ceramic texture and hand feeling, higher pencil hardness, higher toughness and is not easy to break.

Compared with a ceramic matrix prepared from thermosetting resin or thermosetting resin plus thermoplastic resin, the shell body 10 is prepared from the thermoplastic resin when the shell 100 of the embodiment of the application is prepared, so that the shell body 10 can be prepared in an injection molding mode, and the preparation cost of the shell body 10 is reduced; the ceramic substrate including the thermosetting resin cannot be prepared by injection molding and can only be prepared by other methods except injection molding, so that the preparation cost is high.

In some embodiments, the ceramic powder is a ceramic powder modified with a surfactant. The ceramic powder is modified by the surfactant, so that the compatibility between the ceramic powder and the thermoplastic resin and the polyfluoroolefin can be increased, the binding force between the ceramic powder and the thermoplastic resin and the polyfluoroolefin can be improved, the ceramic powder, the thermoplastic resin and the polyfluoroolefin can be uniformly mixed, and a mixed system is more stable, so that the mechanical property of the shell body 10 can be improved, and the mechanical property of the shell 100 can be improved.

Optionally, the ceramic powder includes one or more of alumina, silica, titania, silicon nitride, silicon, magnesia, chromium oxide, beryllium oxide, vanadium pentoxide, diboron trioxide, spinel, zinc oxide, calcium oxide, mullite, and barium titanate.

Alternatively, the surfactant may be, but is not limited to, one or more of a silane coupling agent, a borate coupling agent, a titanate coupling agent. Optionally, the addition amount of the surfactant is 0.5% to 3% by weight of the ceramic powder, and specifically, the addition amount of the surfactant may be, but not limited to, 0.5%, 0.8%, 1.0%, 1.5%, 1.8%, 2.0%, 2.3%, 2.8%, 3.0%, and the like. When the addition amount of the surfactant is less than 0.5%, the modification of the ceramic powder is incomplete, in other words, part of the ceramic powder is not modified, which affects the binding force between the ceramic powder and the thermoplastic resin and the polyfluoroolefin, and when the addition amount of the surfactant is more than 3%, excessive surfactant molecules are deposited on the surface of the ceramic powder, so that the obtained ceramic powder is easy to agglomerate and is not easy to be uniformly dispersed in the thermoplastic resin and the polyfluoroolefin, which is not beneficial to improving the mechanical performance of the shell 100.

Alternatively, the ceramic powder may be prepared by:

1) dissolving a surfactant in alcohol, or water, or an alcohol-water mixed solvent, and uniformly mixing; and optionally, the alcohol may be, but is not limited to, ethanol, propanol, etc., and the present application is not particularly limited.

2) Adding ceramic powder, mixing uniformly at normal temperature, and drying to obtain surface modified ceramic powder.

Specifically, after the ceramic powder is added, the mixture can be placed at normal temperature, mixed by mechanical stirring or ultrasonic waves, and then dried by flash evaporation or in a vacuum drying oven at 60 ℃ to 80 ℃ to obtain the ceramic powder.

In some embodiments, the thermoplastic resin may be, but is not limited to, one or more of Polyphenylene sulfide (PPS), Polysulfone (PSU), Polyethersulfone (PES), Polyetherketone (PEK), polycarbonate, polyamide, and polymethyl methacrylate. When the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyether sulfone, or polyether ketone, after the housing body 10 is molded, the thermoplastic resin can be subjected to chain extension and crosslinking at a temperature higher than the melting temperature of the mixed system of the thermoplastic resin and the polyfluoroolefin, so that the crystallinity and the crosslinking degree of the thermoplastic resin are improved, the ceramic powder can be better bound in a crosslinking network of the thermoplastic resin, the bonding force between the thermoplastic resin and the ceramic powder is favorably improved, and the pencil hardness and the toughness of the prepared housing 100 are improved.

In some embodiments, the raw material components of the housing body 10 further include a dispersant, and the dispersant is used to enable the polyfluoroolefin, the thermoplastic resin and the ceramic powder to be mixed more uniformly, so that the mixed system is more stable. The dispersant may be, but is not limited to, liquid paraffin or the like. The amount of the dispersant added may be 2% to 6% by weight of the total weight of the polyfluoroolefin, the thermoplastic resin and the ceramic powder, and specifically, may be, but is not limited to, 2%, 3%, 4%, 5%, 6%, and the like.

In some embodiments, the raw material composition of the housing body 10 further includes a plasticizer for enhancing the plasticity of the thermoplastic resin and the polyfluoroolefin and the fluidity of the molten state, so as to reduce the processing temperature of the housing body 10 and improve the processability of the housing 100. The plasticizer may be, but is not limited to, dioctyl oxalate, and the amount of the plasticizer added may be 2% to 6% by weight, specifically, 2%, 3%, 4%, 5%, 6%, and the like, based on the total weight of the polyfluoroolefin, the thermoplastic resin, and the ceramic powder.

In some embodiments, the raw material components of the housing body 10 further include a pigment for providing the housing body 10 with a colored pattern or color, so that the housing 100 has a colored pattern or color, such as a pattern and color of a blue-and-white porcelain. By controlling the color and the ratio of the pigment, the housing body 10 can present different appearance effects, so that the housing 100 presents different appearance effects. Alternatively, the pigment may be added in an amount of 0.5% to 5% by weight, specifically, but not limited to, 0.5%, 1%, 2%, 3%, 4%, 5%, and the like, based on the total weight of the polyfluoroolefin, the thermoplastic resin, and the ceramic powder.

Optionally, the thickness of the housing body 10 is 0.3mm to 1 mm; specifically, the thickness of the case body 10 may be, but is not limited to, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, and the like. When the housing body 10 is too thin, the supporting and protecting functions cannot be well performed, the mechanical strength cannot well meet the requirements of the electronic device housing 100, and when the housing body 10 is too thick, the weight of the electronic device is increased, the hand feeling of the electronic device is affected, and the user experience is not good.

Alternatively, the surface roughness of the case body 10 is Ra 0.02 to Ra 0.08, and specifically, may be, but is not limited to, Ra 0.02, Ra 0.03, Ra 0.04, Ra 0.05, Ra 0.06, Ra0.07, Ra 0.08, or the like. If the roughness is too large, the ceramic texture of the shell 100 is affected, and if the roughness is too small, the process requirements are too strict, and the preparation cost is high.

Optionally, the pencil hardness of the housing body 10 is 2H to 9H; specifically, it may be, but not limited to, 2H, 3H, 4H, 5H, 6H, 7H, 8H, 9H, etc. When the hardness of the pencil of the housing body 10 is too small, the wear resistance of the manufactured housing 100 is poor, and the glossiness and the ceramic texture of the surface of the housing 100 are affected after the housing 100 is used for a period of time.

Referring to fig. 2, in some embodiments, the shell 100 of the embodiment of the present application further includes a protective layer 30, where the protective layer 30 is disposed on a surface of the shell body 10, and the protective layer 30 is used for preventing dirt and fingerprints, so as to improve the user experience of the shell 100.

In some embodiments, the water contact angle of the overcoat layer 30 is greater than 105 °, specifically, may be, but is not limited to, 106 °, 110 °, 115 °, 120 °, 125 °, 130 °, 140 °, 150 °, etc., and the greater the water contact angle, the better the anti-fingerprint effect of the overcoat layer 30.

Optionally, the protective layer 30 is light transmissive, and the optical transmittance of the protective layer 30 is greater than or equal to 80%, and specifically, may be, but is not limited to, 80%, 82%, 85%, 88%, 90%, 92%, 95%, 96%, 97%, and the like. The protective layer 30 has a high transmittance, so that the ceramic texture and grain color of the housing body 10 are not shielded, thereby affecting the appearance of the housing 100.

In some embodiments, the raw material component of the protective layer 30 may include, but is not limited to, one or more of perfluoropolyether, perfluoropolyether derivatives, and the like, and the protective layer 30 is formed by evaporating a glue solution composed of the raw material component of the protective layer 30 on the surface of the case body 10. The perfluoropolyether and the perfluoropolyether derivative have excellent fingerprint resistance and can play a good role in fingerprint resistance and stain resistance. Alternatively, the thickness of the protective layer 30 is 5nm to 20nm, and specifically, may be, but is not limited to, 5nm, 6nm, 8nm, 10nm, 12nm, 14nm, 16nm, 18nm, 20nm, and the like. If the thickness of the protective layer 30 is too thin, the antifouling and fingerprint-proof effects cannot be achieved, and if the thickness of the protective layer 30 is too thick, the manufacturing cost of the housing 100 is increased, and the hand feeling of the housing 100 is also affected.

Referring to fig. 1 and fig. 3 together, an embodiment of the present application further provides a method for manufacturing a housing 100, and the method for manufacturing the housing 100 can be applied to manufacture the housing 100 of the above embodiments. The housing 100 includes a housing body 10, and the method of manufacturing the housing 100 includes:

s201, mixing and granulating polyfluoroolefin and thermoplastic resin at a first temperature to obtain first granules;

specifically, a polyfluoroolefin is mixed with a thermoplastic resin, and subjected to extrusion granulation on a twin-screw extruder to obtain a first pellet. Before banburying and granulating, the polyfluoroolefin and the thermoplastic resin are extruded and granulated, so that two phases of the polyfluoroolefin and the thermoplastic resin can be uniformly dispersed, and in addition, the extrusion and granulation are firstly carried out, and the melting points of a mixed system of the polyfluoroolefin and the thermoplastic resin are respectively lower than the melting point of the thermoplastic resin and the melting point of the polyfluoroolefin, so that the temperature of the banburying and granulating can be reduced, and the thermoplastic resin is prevented from chain extension and crosslinking reaction in the banburying stage.

Optionally, the first temperature is in the range of Tm₁To Tm₁+40 ℃, wherein said Tm is₁Is the melting temperature of the polyfluoroolefin; specifically, the first temperature may be, but is not limited to, Tm₁、Tm₁+5℃、Tm₁+10℃、Tm₁+15℃、Tm₁+20℃、Tm₁+25℃、Tm₁+30℃、Tm₁+35℃、Tm₁+40 ℃ and the like. When the temperature is too low, the polyfluoroolefin and the thermoplastic resin may not be partially melted completely, affecting the uniformity of dispersion between the polyfluoroolefin and the thermoplastic resin; when the temperature is too high, the thermoplastic resin is easy to generate chain extension and crosslinking reactions in advance, and the subsequent molding of a blank body is influenced. The term "melting temperature" as used herein refers to the temperature at which the resin is fully converted from a highly elastic state to a molten state.

In some embodiments, the first temperature ranges from 260 ℃ to 360 ℃, and specifically, may be, but is not limited to, 260 ℃, 270 ℃, 290 ℃, 310 ℃, 330 ℃, 350 ℃, 360 ℃, and the like. In one embodiment, the polyfluoroolefin is polytetrafluoroethylene, the thermoplastic resin is polyphenylene sulfide, and the weight ratio of polytetrafluoroethylene to polyphenylene sulfide is 3:17, the first temperature is 330 ℃ to 360 ℃.

In this embodiment, the thermoplastic resin may be, but is not limited to, one or more of polyphenylene sulfide, polysulfone, polyethersulfone, polyetherketone, polycarbonate, polyamide, and polymethyl methacrylate.

S202, mixing the first granules with ceramic powder, and carrying out banburying granulation at a second temperature to obtain second granules, wherein the second temperature is lower than the first temperature;

optionally, the first granules and the ceramic powder are mixed by one or more of dry mixing and wet mixing, and are subjected to banburying granulation in an internal mixer in a negative pressure state (in other words, a vacuum state) or an inert atmosphere to obtain second granules. The ceramic powder in the cluster can be scattered in the banburying process, so that the ceramic powder can be more uniformly dispersed in the polyfluoroolefin and the thermoplastic resin, and the mechanical property of the prepared shell 100 is improved. In addition, during banburying, the polyfluoroolefin and the thermoplastic resin begin to melt and flow, the polyfluoroolefin molecular chains and the thermoplastic resin molecular chains move and are wound together to form a three-dimensional through network structure, so that the bonding force among the thermoplastic resin molecular chains, between the thermoplastic resin molecular chains and the polyfluoroolefin molecular chains, and between the thermoplastic resin and the ceramic powder is increased, meanwhile, the ceramic powder can be wrapped in the network structure formed by the thermoplastic resin and the polyfluoroolefin, and the pencil hardness and the toughness of the formed shell body 10 are favorably increased. The banburying process is in a negative pressure state, so that the thermoplastic resin can be better prevented from being oxidized, and in addition, in the banburying process, gas generated by side reaction can be better discharged, so that the gas generated by the side reaction is prevented from staying in a system to form air holes to influence the mechanical property of the prepared shell body 10.

The term "dry mixing" as used herein refers to the manner in which the solid components are mixed by, for example, ball milling, sand milling, mechanical blending, and the like. The term "wet mixing" as used herein refers to the mixing of the solid components by, for example, ball milling, sanding, mechanical blending, etc., under the influence of water or other liquid.

OptionallyAnd the second temperature is in the range of Tm₂To Tm₂+40 ℃; wherein, the Tm is₂Is the melting temperature of the mixed system of the polyfluoroolefin and the thermoplastic resin. In particular, the second temperature may be, but is not limited to, Tm₂、Tm₂+5℃、Tm₂+10℃、Tm₂+15℃、Tm₂+20℃、Tm₂+25℃、Tm₂+30℃、Tm₂+35℃、Tm₂+40 ℃ and the like. When the temperature is too low, the ceramic powder is difficult to be uniformly dispersed in the first granules, and various properties of the prepared shell body 10 are affected; when the temperature is too high, the thermoplastic resin is easy to generate chain extension and crosslinking reactions in advance, and the subsequent molding of a blank body is influenced.

In some embodiments, the second temperature ranges from 200 ℃ to 350 ℃, and specifically, may be, but is not limited to, 200 ℃, 220 ℃, 240 ℃, 250 ℃, 270 ℃, 290 ℃, 310 ℃, 330 ℃, 350 ℃, and the like. In one embodiment, the polyfluoroolefin is polytetrafluoroethylene, the thermoplastic resin is polyphenylene sulfide, and the weight ratio of polytetrafluoroethylene to polyphenylene sulfide is 3:17, the second temperature is 300 ℃ to 330 ℃.

Alternatively, the air pressure of the banburying process is less than 0.01MPa, and for example, it may be, but not limited to, 0.008MPa, 0.005MPa, 0.001MPa, 0.0008MPa, 0.0005MPa, 0.0001MPa, etc. The smaller the gas pressure in the banburying process, the less easily the thermoplastic resin is oxidized, and the more advantageously the discharge of the gas generated by the side reaction is facilitated, however, the smaller the gas pressure, the higher the requirements for the reaction equipment are, and the operational risk factor is increased. Furthermore, the banburying process may be carried out in an inert atmosphere, in other words, the banburying process is carried out under the protection of an inert gas such as nitrogen or argon.

Optionally, the banburying time is 2h to 12h, and specifically, may be, but is not limited to, 2h, 4h, 6h, 8h, 6h, 10h, 12h, and the like. If the banburying time is too short, the ceramic powder, the polyfluoroolefin and the thermoplastic resin cannot be sufficiently mixed (the mixture is not uniform), and if the banburying time is too long, the mixing uniformity among the ceramic powder, the polyfluoroolefin and the thermoplastic resin cannot be greatly changed.

When the raw material components of the housing body 10 further include one or more of a dispersant, a plasticizer, and a pigment, the step S202 further includes mixing the one or more of a dispersant, a plasticizer, and a pigment with the ceramic powder and the first granular material.

S203, molding the second granules to obtain a blank; and

alternatively, the molding may be, but is not limited to, one or more of injection molding, high temperature compression molding, hot press molding, and the like.

Optionally, when the molding is injection molding, the injection molding temperature is Tm₂To Tm₂+80 ℃. Specifically, the temperature of the injection molding may be, but is not limited to, Tm₂、Tm₂+10℃、Tm₂+20℃、Tm₂+30℃、Tm₂+40℃、Tm₂+50℃、Tm₂+60℃、Tm₂+70℃、Tm₂+80 ℃ and the like. When the injection molding temperature is too low, the viscosity of the polyfluoroolefin and the thermoplastic resin is too high, and the fluidity is poor, so that the prepared shell body 10 has obvious flow marks, and is not beautiful enough in appearance, large in porosity, and low in pencil hardness and toughness. When the injection molding temperature is too high, the polyfluoroolefin and the thermoplastic resin may be partially decomposed, and the mechanical properties of the housing body 10 may be affected. In some embodiments, the temperature of the injection molding is 200 ℃ to 350 ℃, and specifically, may be, but is not limited to, 200 ℃, 220 ℃, 240 ℃, 250 ℃, 270 ℃, 290 ℃, 310 ℃, 330 ℃, 350 ℃, and the like. In one embodiment, when the polyfluoroolefin is polytetrafluoroethylene and the thermoplastic resin is polyphenylene sulfide, the injection molding temperature ranges from 300 ℃ to 350 ℃. The injection molding temperature of the present application refers to the temperature of the head of the injection molding machine.

In one embodiment, the polyfluoroolefin is polytetrafluoroethylene, the thermoplastic resin is polyphenylene sulfide, and the injection molding is carried out by gradually raising the temperature in an injection molding machine in the following temperature ranges: the first temperature range is 270 ℃ to 290 ℃, the second temperature range is 290 ℃ to 310 ℃, the third temperature range is 310 ℃ to 330 ℃, the fourth temperature range is 330 ℃ to 350 ℃, and the head temperature is 330 ℃ to 350 ℃; temperature of the die: 160 ℃.

And S204, carrying out warm isostatic pressing on the blank to obtain the shell body 10.

Specifically, the blank body is placed into a sheath, the sheath is vacuumized to remove gas adsorbed on the surface of the blank body, the inner space of the blank body and the sheath, the blank body is subjected to vacuum sealing, and the blank body is placed into a pressure container with a heating furnace for isostatic pressing after the vacuum sealing. Generally, the injection molding time is short, molecular chains of the polyfluoroolefin and the thermoplastic resin do not have enough time to move and intertwine with each other, the porosity of a formed blank is large, the improvement of the pencil hardness and the toughness of the prepared shell body 10 is not facilitated, the blank is subjected to warm isostatic pressing, chain segments in the molecular chains of the polyfluoroolefin and the thermoplastic resin can have enough time to move, the compactness between the thermoplastic resin and the ceramic powder and between the polyfluoroolefin and the ceramic powder in the prepared shell 100 can be improved, the elimination of air holes of a thermoplastic resin, polyfluoroolefin and ceramic powder system is facilitated, acting forces between the thermoplastic resin and the ceramic powder and between the polyfluoroolefin and the ceramic powder are enhanced, and therefore the mechanical properties of the shell 100, such as the pencil hardness, the toughness, the bending strength and the like, are improved.

Optionally, the temperature of the warm isostatic pressing ranges from Tg +20 ℃ to Tg +60 ℃, wherein Tg is the glass transition temperature of the mixed system of the polyfluoroolefin and the thermoplastic resin. Specifically, the temperature of the warm isostatic pressing may range from, but is not limited to, Tg +20 ℃, Tg +30 ℃, Tg +40 ℃, Tg +50 ℃, Tg +60 ℃, and the like. In this temperature range, the polyfluoroolefin and the thermoplastic resin are in a high elastic state, chain segments in molecular chains of the polyfluoroolefin and the thermoplastic resin can move, and meanwhile, the polyfluoroolefin and the ceramic powder can be more compact under the action of pressure, so that the pores of a polyfluoroolefin, thermoplastic resin and ceramic powder system can be eliminated, the acting force between the thermoplastic resin and the ceramic powder, and the acting force between the polyfluoroolefin and the ceramic powder can be enhanced, and the mechanical properties of the shell 100, such as pencil hardness, toughness, bending strength and the like, can be improved.

The term "glass transition temperature" as used herein refers to the temperature at which the resin is fully converted from a glassy state to a highly elastic state.

In some embodiments, the temperature of the warm isostatic press ranges from 80 ℃ to 300 ℃; specifically, the temperature may be, but not limited to, 80 ℃, 100 ℃, 120 ℃, 150 ℃, 180 ℃, 200 ℃, 230 ℃, 250 ℃, 280 ℃, 300 ℃ and the like. In one embodiment, when the polyfluoroolefin is polytetrafluoroethylene and the thermoplastic resin is polyphenylene sulfide, the warm isostatic pressure has a temperature in a range of 115 ℃ to 155 ℃.

The pressure range of the warm isostatic pressing is 50MPa to 500 MPa; specifically, it may be, but not limited to, 50MPa, 80MPa, 100MPa, 150MPa, 200MPa, 250MPa, 300MPa, 350MPa, 400MPa, 450MPa, 500MPa, etc. When the pressure is within this range, the movement of the segments in the molecular chains of the polyfluoroolefin and the thermoplastic resin can be accelerated, so that the combination between the polyfluoroolefin and the segments of the thermoplastic resin, the combination between the molecules of the thermoplastic resin and the ceramic powder, and the combination between the polyfluoroolefin and the ceramic powder are further densified, and simultaneously, the air holes in the system can be eliminated, the pencil hardness and the toughness of the prepared shell body 10 can be further improved, and the pencil hardness and the toughness of the prepared shell 100 can be further improved. When the pressure is too small, it is difficult to compact the polyfluoroolefin, the thermoplastic resin and the ceramic powder, which is disadvantageous to the densification of the green body, and when the pressure is too large, it contributes little to the further densification of the green body, but the requirements on the equipment are severe.

Alternatively, the time of the warm isostatic pressing is 0.5h to 3h, and specifically, may be, but is not limited to, 0.5h, 0.8h, 1h, 1.2h, 1.5h, 2h, 3h, and the like. When the time of the warm isostatic pressing is too short, the chain segments of the molecular chains of the polyfluoroolefin and the thermoplastic resin do not have enough time to move and deform, so that the densification between the thermoplastic resin and the ceramic powder and the densification between the polyfluoroolefin and the ceramic powder are not facilitated, the air holes of the polyfluoroolefin, the thermoplastic resin and the ceramic powder system are not facilitated to be eliminated, and the acting force between the thermoplastic resin and the ceramic powder and the acting force between the polyfluoroolefin and the ceramic powder are not facilitated to be enhanced. When the time of the warm isostatic pressing is too long, the thermoplastic resin and the ceramic powder, the polyfluoroolefin and the ceramic powder in the blank are difficult to be further densified, and the performance of the prepared shell body 10 is less affected.

In some embodiments, after the housing body 10 is manufactured, the housing 100 is machined by Computer Numerical Control (CNC) machining, and surface grinding and polishing are performed to obtain the housing 100 conforming to the specifications of the electronic device.

For the parts of the ceramic powder, the thermoplastic resin, and the like that are not described in detail, reference is made to the description of the corresponding parts of the above embodiments, and the description is not repeated here.

Referring to fig. 1 and fig. 4, an embodiment of the present application further provides a method for manufacturing a housing 100, and the method for manufacturing the housing 100 can be applied to manufacture the housing 100 of the above embodiment. The housing 100 includes a housing body 10, and the method of manufacturing the housing 100 includes:

s301, mixing and granulating polyfluoroolefin and thermoplastic resin at a first temperature to obtain first granules;

in this embodiment, the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyethersulfone, and polyetherketone. For the description of other features, refer to the description of the corresponding parts of the above embodiments, and are not repeated herein.

S302, mixing the first granules with ceramic powder, and carrying out banburying granulation at a second temperature to obtain second granules, wherein the second temperature is lower than the first temperature;

s303, molding the second granules to obtain a blank;

s304, carrying out warm isostatic pressing on the blank; and

for detailed descriptions of steps S301 to S304, refer to the descriptions of the corresponding parts of the above embodiments, which are not repeated herein.

S305, carrying out heat treatment on the blank to obtain the shell body 10.

Alternatively, the blank subjected to the warm isostatic pressing treatment is placed in an air or oxygen atmosphere, and is subjected to a heat treatment at a high temperature and a high pressure to obtain the housing body 10.

Optionally, the temperature of the heat treatment is in the range of Tm₂To Tm₂+70 ℃, specifically, may be, but is not limited to, Tm₂、Tm₂+10℃、Tm₂+20℃、Tm₂+30℃、Tm₂+35℃、Tm₂+40℃、Tm₂+45℃、Tm₂+50℃、Tm₂+55℃、Tm₂+60℃、Tm₂+65℃、Tm₂+70 ℃ and the like. When the temperature is within this range, chain extension reaction occurs among molecules of the thermoplastic resin (such as polyphenylene sulfide), and in addition, under the action of oxygen, oxidation crosslinking reaction occurs among molecules of the thermoplastic resin, so that the molecular weight and the crosslinking degree of the thermoplastic resin are improved, the ceramic powder can be better bound in a crosslinking network of the thermoplastic resin, the bonding force between the thermoplastic resin and the ceramic powder is favorably improved, and the pencil hardness and the toughness of the prepared shell 100 are further improved. Meanwhile, the temperature of the heat treatment is controlled to be Tm₂The temperature is less than +70 ℃, so that the occurrence of chain extension reaction and crosslinking reaction is not too fast, the crosslinking degree is controlled in a certain range, the crystallinity and the crosslinking degree of the thermoplastic resin in the formed shell body 10 are effectively controlled, and the toughness of the shell body 10 is not reduced due to too high crosslinking degree.

In some embodiments, the temperature of the heat treatment is 100 ℃ to 360 ℃, and specifically, may be, but is not limited to, 100 ℃, 130 ℃, 150 ℃, 180 ℃, 200 ℃, 220 ℃, 240 ℃, 250 ℃, 270 ℃, 290 ℃, 310 ℃, 330 ℃, 360 ℃, and the like.

Taking polyphenylene sulfide (PPS) as an example of the thermoplastic resin, when the thermoplastic resin is polyphenylene sulfide (PPS), the temperature of the heat treatment ranges from 320 ℃ to 360 ℃; specifically, it may be, but not limited to, 320 ℃, 325 ℃, 330 ℃, 335 ℃, 340 ℃, 345 ℃, 350 ℃, 360 ℃ or the like. At this time, the main chemical reaction equation occurring between the molecular chains of the thermoplastic resin is as follows:

optionally, the pressure of the heat treatment is 0Mpa to 100 Mpa; specifically, it may be, but not limited to, 0MPa, 10MPa, 20MPa, 30MPa, 40MPa, 50MPa, 55MPa, 60MPa, 65MPa, 70MPa, 75MPa, 80MPa, 85MPa, 90MPa, 100MPa, etc. The pressure is favorable for maintaining the shape of the blank body, can accelerate the movement between the thermoplastic resin molecular chains, further densifys the combination between the thermoplastic resin molecular chains and between the thermoplastic resin molecules and the ceramic powder, and is favorable for further improving the pencil hardness and the toughness of the prepared shell body 10, thereby improving the pencil hardness and the toughness of the prepared shell 100.

Alternatively, the time of the heat treatment may range from 1h to 12h, and specifically, may be, but is not limited to, 1h, 2h, 3h, 4h, 5h, 6h, 7h, 8h, 9h, 10h, 11h, 12h, and the like. The heat treatment time is too short, the degrees of the chain extension reaction and the crosslinking reaction of the thermoplastic resin are too low, and the toughness of the formed shell body 10 is reduced; the long heat treatment time results in an excessively high degree of crosslinking of the thermoplastic resin, and the resulting housing body 10 has an excessively large brittleness and insufficient toughness.

It should be understood that, when the above-mentioned embodiments are used for extrusion granulation, banburying granulation, injection molding, warm isostatic pressing, and heat treatment, they may be performed at a certain temperature point of their respective temperature ranges, and each stage may be further generated by gradually increasing the temperature within a temperature range, and when the temperature satisfies the above-mentioned range, which manner is specifically adopted, and the application is not limited specifically.

Referring to fig. 2 and fig. 5, an embodiment of the present application further provides a method for manufacturing the housing 100, and the method for manufacturing the housing 100 can be applied to manufacture the housing 100 of the above embodiments. The shell 100 comprises a shell body 10 and a protective layer 30, wherein the protective layer 30 is arranged on the surface of the shell body 10, and the preparation method of the shell 100 comprises the following steps:

s401, mixing and granulating polyfluoroolefin and thermoplastic resin at a first temperature to obtain first granules;

S402, mixing the first granules with ceramic powder, and carrying out banburying granulation at a second temperature to obtain second granules, wherein the second temperature is lower than the first temperature;

s403, molding the second granules to obtain a blank;

s404, carrying out warm isostatic pressing on the blank;

s405, carrying out heat treatment on the blank to obtain a shell body 10; and

for detailed descriptions of steps S401 to S405, refer to the descriptions of the corresponding parts of the above embodiments, which are not repeated herein.

S406, forming the protective layer 30 on the surface of the housing body 10.

Specifically, a glue solution composed of one or more of raw material components of the protective layer 30, such as perfluoropolyether, perfluoropolyether derivatives, and the like, is evaporated on the surface of the case body 10 to form the protective layer 30. The protective layer 30 is used for anti-smudging and anti-fingerprint to improve the user experience of the housing 100.

The housing 100 produced in the examples of the present application is further described below by way of specific examples and comparative examples.

Examples 1 to 6

The case 100 of examples 1 to 6 was prepared by the following steps:

1) extruding and granulating polytetrafluoroethylene and polyphenylene sulfide at 350 ℃ to obtain first granules, wherein the weight average molecular weight of the polytetrafluoroethylene is 200 ten thousand;

2) mixing the first granules with the alumina, and carrying out banburying granulation at 320 ℃ to obtain second granules, wherein the weight ratio of the alumina to the polyphenylene sulfide is 6:4, and the alumina is modified by 2 wt% of a silane coupling agent;

3) performing injection molding on the second granules at 350 ℃ to obtain a blank body, wherein the thickness of the blank body is 0.8 mm;

4) carrying out isostatic pressing on the blank body for 1 hour at 120 ℃ and under the pressure of 200 Mpa;

5) heat treatment was performed at 350 ℃ for 3 hours to obtain the case 100.

Comparative examples 1 and 2

The housings of comparative examples 1 and 2 were prepared by the following steps:

1) mixing polyphenylene sulfide (comparative example 1) or polytetrafluoroethylene (comparative example 2) with the alumina, and carrying out banburying granulation at 320 ℃ to obtain granules, wherein the weight ratio of the alumina to the polyphenylene sulfide (comparative example 1) or the polytetrafluoroethylene (comparative example 2) is 6:4, the alumina is modified by 2 wt% of silane coupling agent, and the weight average molecular weight of the polytetrafluoroethylene is 200 ten thousand;

2) performing injection molding on the granules at 350 ℃ to obtain a blank body, wherein the thickness of the blank body is 0.8 mm;

3) carrying out isostatic pressing on the blank body for 1 hour at 120 ℃ and under the pressure of 200 Mpa;

4) heat treatment was performed at 350 ℃ for 3 hours to obtain the case 100.

The casing pencil hardness, abrasion resistance and ball drop height prepared in the above examples and comparative examples were tested by the following methods:

1) and (3) testing pencil hardness: GB/T6739-.

2) And (3) wear resistance test: the shell surface was rubbed until significant scratching using the GB10810.5-2012 standard.

3) Falling ball impact test: making the shell into a flat sheet with the size of 150mm multiplied by 73mm multiplied by 0.8 mm; the samples of the above-mentioned embodiment and comparative example were respectively supported on a jig (four sides of the case were each supported by a jig 3mm high, the middle was suspended), a stainless steel ball with a weight of 32g was freely dropped from a certain height onto the surface of the case to be measured, five points in the four corners and the center of the case were measured, each point was measured 5 times until the case was broken, and the height when the case was broken was the ball drop height. The higher the ball drop height, the more ductile the shell is, and the less likely it will crack.

4) Bending strength: the bending strength test is carried out by four-point bending, and the test method is carried out according to GB/T6569-2006.

5) Surface friction coefficient: the test was carried out using GB/T22895-2008.

The test results are shown in table 1 below.

TABLE 1 Performance parameters of the casings of the examples and comparative examples

As can be seen from table 1, the surface friction coefficient of the shell gradually decreased and the wear resistance gradually increased with the increase of the content of ptfe. The bending strength and toughness of the polyphenylene sulfide and alumina ceramic system can be improved by adding the polytetrafluoroethylene, the bending strength and toughness of the shell are gradually increased along with the increase of the content of the polytetrafluoroethylene, when the weight ratio of the polytetrafluoroethylene to the polyphenylene sulfide is 2:8, the bending strength and toughness reach the maximum value, at the moment, the content of the polytetrafluoroethylene is continuously increased, the bending strength and toughness of the shell are gradually reduced, but the bending strength and toughness are still better than those of the polytetrafluoroethylene/alumina system and the polyphenylene sulfide/alumina system.

Referring to fig. 6, an embodiment of the present application further provides an electronic device 500, which includes: in the housing 100 according to the embodiment of the present application, the housing 100 has an accommodating space 101; a display component 510 for displaying and closing the accommodating space 501, in other words, the display component 510 is disposed on one side of the housing 100 close to the accommodating space 501; and a circuit board assembly 530, wherein the circuit board assembly 530 is disposed in the accommodating space 501, and the circuit board assembly 530 is electrically connected to the display assembly 510 and is used for controlling the display assembly 510 to display.

The electronic device 500 of the embodiment of the present application may be, but is not limited to, a portable electronic device such as a mobile phone, a tablet, a notebook, a desktop, a smart band, a smart watch, an electronic reader, and a game console.

For a detailed description of the housing 100, please refer to the description of the corresponding parts of the above embodiments, which is not repeated herein.

Alternatively, the display module 510 may be, but is not limited to, one or more of a liquid crystal display module, a light emitting diode display module (LED display module), a micro light emitting diode display module (micro LED display module), a sub-millimeter light emitting diode display module (MiniLED display module), an organic light emitting diode display module (OLED display module), and the like.

Referring also to fig. 7, optionally, the circuit board assembly 530 may include a processor 531 and a memory 533. The processor 531 is electrically connected to the display component 510 and the memory 533, respectively. The processor 531 is configured to control the display component 510 to display, and the memory 533 is configured to store program codes required by the processor 531 to run, program codes required by the processor 510 to control the display component 510, display contents of the display component 510, and the like.

Alternatively, processor 531 includes one or more general-purpose processors, which may be any type of device capable of Processing electronic instructions, including a Central Processing Unit (CPU), microprocessor, microcontroller, main processor, controller, ASIC, and the like. The processor 531 is configured to execute various types of digitally stored instructions, such as software or firmware programs stored in the memory 533, which enable the computing device to provide a wide variety of services.

Alternatively, the Memory 533 may include a Volatile Memory (Volatile Memory), such as a Random Access Memory (RAM); the Memory 533 may also include a Non-volatile Memory (NVM), such as a Read-Only Memory (ROM), a Flash Memory (FM), a Hard Disk (Hard Disk Drive, HDD), or a Solid-State Drive (SSD). Memory 533 may also comprise a combination of the above types of memory.

Reference herein to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A housing, comprising:

the shell comprises a shell body, wherein the raw material components of the shell body comprise ceramic powder, thermoplastic resin and polyfluoroolefin; the weight ratio of the ceramic powder to the thermoplastic resin is 1:1 to 10: 1.

2. The housing of claim 1, wherein the polyfluoroolefin comprises a polymer comprising one or more of fluoroethylene, fluoropropylene, or a copolymer thereof.

3. The housing of claim 2, wherein the fluorine-containing ethylene comprises one or more of difluoroethylene, trifluoroethylene, tetrafluoroethylene; the fluorine-containing propylene comprises one or more of difluoropropylene, trifluoropropene, tetrafluoropropene, fluorine-free propylene and hexafluoropropylene.

4. The housing of claim 3, wherein the weight average molecular weight of the polyfluoroolefin is in the range of 50W to 500W.

5. The housing of any of claims 1-4, wherein the polyfluoroolefin is present in an amount of from 5 to 30 weight percent based on the combined weight of the thermoplastic resin and polyfluoroolefin.

6. The housing according to any one of claims 1 to 4, wherein the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyethersulfone, polyetherketone, polycarbonate, polyamide, polymethyl methacrylate; the ceramic powder is subjected to surface modification by a surfactant, and comprises one or more of aluminum oxide, silicon dioxide, titanium dioxide, silicon nitride, silicon, magnesium oxide, chromium oxide, beryllium oxide, vanadium pentoxide, diboron trioxide, spinel, zinc oxide, calcium oxide, mullite and barium titanate, wherein the surfactant comprises one or more of a silane coupling agent, a titanate coupling agent and a borate coupling agent, and the weight of the surfactant is 0.5-3% of that of the ceramic powder.

7. A method of making a housing, comprising:

mixing the first granules with ceramic powder, and carrying out banburying granulation at a second temperature to obtain second granules, wherein the second temperature is lower than the first temperature;

molding the second granules to obtain a blank; and

and carrying out warm isostatic pressing on the blank to obtain the shell body.

8. The method of claim 7, wherein the first temperature is in the range of Tm₁To Tm₁+40 ℃ and the second temperature is in the Tm range₂To Tm₂+40 ℃; wherein, the Tm is₁Is the melting temperature, the Tm, of the polyfluoroolefin₂Is that it isThe melting temperature of the mixed system of the polyfluoroolefin and the thermoplastic resin.

9. The method of manufacturing a housing of claim 8, wherein the molding is injection molding at a temperature Tm₂To Tm₂+80 ℃; the temperature of the warm isostatic pressing ranges from Tg +20 ℃ to Tg +60 ℃, and the pressure of the warm isostatic pressing ranges from 50MPa to 500MPa, wherein Tg is the glass transition temperature of the mixed system of the polyfluoroolefin and the thermoplastic resin.

10. The method for manufacturing the shell according to any one of claims 7 to 9, wherein the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyethersulfone and polyetherketone, and after the performing of the warm isostatic pressing, the method further comprises:

performing a heat treatment at a temperature in the range of Tm₂To Tm₂+70 ℃ wherein Tm is₂Is the melting temperature of the mixed system of the polyfluoroolefin and the thermoplastic resin.

11. An electronic device, comprising:

the housing of any one of claims 1 to 6, having an accommodating space;

a display component for displaying; and