CN113434056B - Electronic equipment and touch module and system common-ground detection method thereof - Google Patents
Electronic equipment and touch module and system common-ground detection method thereof Download PDFInfo
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- CN113434056B CN113434056B CN202110795868.5A CN202110795868A CN113434056B CN 113434056 B CN113434056 B CN 113434056B CN 202110795868 A CN202110795868 A CN 202110795868A CN 113434056 B CN113434056 B CN 113434056B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Abstract
The invention relates to an electronic device and a common-ground inspection method of a touch module and a system thereof, wherein the electronic device comprises a metal shell, a power supply, the touch module and a detection pad, the grounding end of the power supply is grounded through the metal shell, the touch module comprises a touch chip, the touch chip is provided with a grounding pad and a signal receiving pin, the grounding pad is configured to be in common ground with the grounding end of the power supply, the detection pad is electrically connected with the signal receiving pin, and the detection pad is configured to form a parallel plate capacitor with the metal shell when the grounding pad is in common ground with the grounding end of the power supply. The electronic equipment can solve the problem that the touch module and the system are easily damaged by external factors to influence the whole machine test and generate signal interference, so that the system can mistakenly report the point condition.
Description
Technical Field
The invention relates to the technical field of electronic equipment, in particular to electronic equipment and a common ground detection method of a touch module and a system of the electronic equipment.
Background
In an electronic device, the module and the system power ground are grounded to avoid signal interference and improve the signal-to-noise ratio, and a reference potential is provided as a basis, which is very important in system design. For the touch module, it is further necessary to combine the touch module with the display module and the application system to avoid the interference of external signals and influence on the reporting processing. In practical applications, the common ground state of the touch module and the system is easily damaged by external factors, for example, the common ground of the touch module and the system is damaged by vibration falling off, deterioration of the conductive adhesive, and the like, and the damage is difficult to be detected, so that the overall test is affected and signal interference is generated, and the system false alarm point condition occurs.
Disclosure of Invention
Therefore, it is necessary to provide an electronic device, a touch module thereof, and a system common ground inspection method thereof, aiming at the problem that the touch module and the system common ground are easily damaged by external factors to affect the overall machine test and generate signal interference, which results in the occurrence of system false alarm point conditions.
An electronic device, comprising: a metal housing; the grounding end of the power supply is grounded through the metal shell; the touch module comprises a touch chip, wherein the touch chip is provided with a grounding pad and a signal receiving pin, and the grounding pad is configured to be grounded with a grounding end of the power supply; and a detection pad electrically connected to the signal receiving pin, the detection pad configured to constitute a parallel plate capacitor with the metal chassis when the ground pad is grounded to a ground terminal of the power supply.
In an embodiment of the present invention, the electronic device further includes a flexible circuit board, where the flexible circuit board includes a flexible substrate parallel to the metal chassis; the detection bonding pad is arranged on one side surface of the flexible substrate.
In an embodiment of the present invention, the flexible circuit board further includes a back metal plate, one end of the back metal plate is connected to the metal chassis, the other end of the back metal plate is bent, and a laminated portion laminated with the metal chassis is formed at one end of the back metal plate connected to the metal chassis; the flexible substrate is attached to the surface of the laminated part, which faces away from one side of the metal shell.
In an embodiment of the invention, the lamination portion and the metal chassis are bonded by a conductive adhesive.
In an embodiment of the invention, the laminated portion, the conductive adhesive and the metal chassis constitute a ground layer of the power supply; the detection bonding pad is arranged outside the grounding layer and is connected with the touch control chip by wiring; or the detection bonding pad is coated in the grounding layer, the grounding layer is provided with a through hole, and the detection bonding pad is in routing connection with the contact chip through the through hole.
In an embodiment of the present invention, the detection pad is disposed on a side of the flexible substrate opposite to the metal chassis to form two parallel substrates with the metal chassis; or the detection bonding pad is arranged on one side of the flexible substrate facing the metal shell so as to form two substrates parallel to each other with the metal shell.
In an embodiment of the invention, a dielectric layer between two parallel substrates formed by the detection pad and the metal chassis is air.
In an embodiment of the invention, an insulating layer is attached to a side of the detection pad facing away from the flexible substrate.
In an embodiment of the invention, a projection of the detection pad on the metal chassis overlaps a projection of the lamination portion on the metal chassis, so that the lamination portion serves as a dielectric layer between two substrates parallel to each other and formed by the detection pad and the metal chassis.
In an embodiment of the invention, the number of the detection pads and the number of the signal receiving pins are both provided in plural, and each of the detection pads is electrically connected to a different signal receiving pin.
In an embodiment of the invention, projections of each of the detection pads on the metal chassis are spaced from each other.
A common-ground detection method for a touch module and a system of electronic equipment is characterized in that the electronic equipment comprises a metal shell, a power supply and a touch module, wherein the grounding end of the power supply is grounded through the metal shell; the method comprises the following steps:
providing a detection bonding pad, electrically connecting the detection bonding pad with the signal receiving pin, and enabling the detection bonding pad and the metal shell to form two substrates which are parallel to each other; and detecting whether the detection bonding pad and the metal shell form a parallel plate capacitor or not.
In an embodiment of the present invention, the detecting whether the detecting pad and the metal chassis form a parallel plate capacitor specifically includes: and detecting the charging/discharging time of the capacitor between the detection bonding pad and the gold casing.
The electronic equipment comprises a metal shell, a power supply, a touch module and a detection pad, wherein the grounding end of the power supply is grounded through the metal shell, the touch module comprises a touch chip, the touch chip is provided with a grounding pad and a signal receiving pin, the grounding pad is configured to be grounded with the grounding end of the power supply, the detection pad is electrically connected with the signal receiving pin, and the detection pad is configured to form a parallel plate capacitor with the metal shell when the grounding pad is grounded with the grounding end of the power supply. By electrically connecting the detection bonding pads to the signal receiving pins of the touch chip and arranging the detection bonding pads and the metal casing as two substrates parallel to each other, when the grounding pad of the touch module is grounded with the grounding end of the power supply, the detection pad and the metal case form a parallel plate capacitor, when the grounding pad of the touch module is disconnected with the grounding end of the power supply and is grounded, the detection pad and the metal shell do not form a parallel plate capacitor, and the RC value change between the detection pad and the metal shell is used to judge whether the grounding pad of the touch module and the grounding end of the power supply are normally grounded, therefore, whether the common ground state of the touch module and the system is damaged or not can be conveniently detected, the situation that the common ground state of the touch module and the system is damaged but not detected to influence the test of the whole machine and generate signal interference is avoided, and the situation that the touch module and the system are disconnected and common ground leads to system false alarm point is further avoided.
Drawings
FIG. 1 is a schematic diagram of a circuit structure in which a module and a system power ground are grounded in the related art;
fig. 2 is a schematic circuit structure diagram of a touch module of an electronic device and a power ground terminal being grounded according to an embodiment of the invention;
FIG. 3 is a schematic diagram illustrating a connection position of the detection pad in FIG. 2;
fig. 4 is a schematic structural diagram of a back metal plate of a flexible circuit board of an electronic device before bending;
fig. 5 is a schematic structural diagram of a bent back metal plate of a flexible circuit board of an electronic device according to an embodiment of the invention;
fig. 6 is a schematic structural diagram of a detection pad disposed outside a ground layer according to an embodiment of the invention;
FIG. 7 is a schematic diagram of a structure in which a detection pad is covered in a ground layer according to another embodiment of the present invention;
fig. 8 is a schematic diagram of a stacked structure in which the detection pads are disposed on a side of the flexible substrate opposite to the metal chassis according to an embodiment of the present invention;
fig. 9 is a schematic diagram of a stacked structure in which the detection pads are disposed on a side of the flexible substrate opposite to the metal chassis according to another embodiment of the present invention;
fig. 10 is a schematic diagram of a stacked structure in which the detection pads are disposed on a side of the flexible substrate facing the metal chassis according to another embodiment of the present invention;
fig. 11 is a schematic diagram of a stacked structure in which the detection pads are disposed on a side of the flexible substrate facing the metal chassis according to another embodiment of the present invention;
fig. 12 is a flowchart illustrating a method for checking a touch module and a system common ground of an electronic device according to an embodiment of the invention.
The reference numbers illustrate:
100: the metal chassis 500: flexible circuit board
200: power supply 510: flexible substrate
300: the touch chip 520: back metal plate
310: ground pad 521: laminated part
400: the detection pad 600: conductive adhesive
410: insulating layer 700: module group
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Referring to fig. 1, fig. 1 is a schematic diagram illustrating a circuit structure of a module and a system power ground in the related art. In an electronic device, grounding the module 700 to the system ground is an important design in the system, since it can avoid signal interference and improve the signal-to-noise ratio and provide a reference potential as a basis. For example, in an electronic device, a touch module is combined with a display module and an application system to avoid interference of external signals and influence on reporting processing.
However, in the practical application process, the common ground state of the touch module and the system power supply is easily damaged by external factors, for example, the common ground of the touch module and the system power supply is damaged by vibration falling, deterioration of the conductive adhesive and other conditions, and the damage is difficult to be detected, so that the overall machine test is influenced, signal interference is generated, and a system misreport point condition occurs. Therefore, there is a need for an electronic device that solves the problem that the common ground state of the touch module and the system is difficult to check.
Referring to fig. 2 and 3, fig. 2 is a schematic diagram illustrating a circuit structure of a touch module of an electronic device according to an embodiment of the invention, the touch module being grounded to a power ground, and fig. 3 is a schematic diagram illustrating a connection position of a detection pad in fig. 2. An embodiment of the invention provides an electronic device, including a metal chassis 100, a power supply 200, a touch module and a detection pad 400, wherein a ground terminal of the power supply 200 is grounded through the metal chassis 100, the touch module includes a touch chip 300, the touch chip 300 is provided with a ground pad 310 and a signal receiving pin, the ground pad 310 is configured to be grounded to the ground terminal of the power supply 200, the detection pad 400 is electrically connected to the signal receiving pin, and the detection pad 400 is configured to form a parallel plate capacitor with the metal chassis 100 when the ground pad 310 is grounded to the ground terminal of the power supply 200. By electrically connecting the detection pad 400 to the signal receiving pin of the touch chip 300, and disposing the detection pad 400 and the metal chassis 100 as two substrates parallel to each other, when the grounding pad 310 of the touch module is grounded to the ground of the power supply 200, the detection pad 400 and the metal case 100 form a parallel plate capacitor, when the grounding pad 310 of the touch module is disconnected from the grounding terminal of the power supply 200, the detection pad 400 and the metal casing 100 do not form a parallel plate capacitor, and the RC value between the detection pad 400 and the metal casing 100 is changed to determine whether the grounding pad 310 of the touch module and the grounding terminal of the power supply 200 are normally grounded, therefore, whether the common ground state of the touch module and the system is damaged or not can be conveniently detected, the situation that the common ground state of the touch module and the system is damaged but not detected to influence the test of the whole machine and generate signal interference is avoided, and the situation that the touch module and the system are disconnected and common ground leads to system false alarm point is further avoided.
In some embodiments, the electronic device further comprises a flexible circuit board 500, the flexible circuit board 500 comprising a flexible substrate 510 parallel to the metal chassis 100; the detection pad 400 is disposed on a side surface of the flexible substrate 510. By disposing the detection pad 400 on one side surface of the flexible substrate 510 of the flexible circuit board 500, since the flexible substrate 510 of the flexible circuit board 500 is parallel to the metal chassis 100, the detection pad 400 and the metal chassis 100 form two parallel substrates, when a dielectric layer exists between the two parallel substrates, if the touch module is grounded to the system power supply 200, the detection pad 400 and the metal chassis 100 form a parallel plate capacitor, and if the touch module is grounded to the system power supply 200, the detection pad 400 and the metal chassis 100 do not form a parallel plate capacitor, based on which, by detecting the capacitance charging/discharging time between the detection pad 400 and the metal chassis 100, it can be checked whether the touch module is grounded to the system power supply 200. The dielectric layer between the two parallel substrates formed by the detection pad 400 and the metal chassis 100 includes one or more of air and a metal dielectric layer.
Referring to fig. 4 and 5, fig. 4 shows a schematic structural view of the back metal plate of the flexible circuit board before bending, and fig. 5 shows a schematic structural view of the back metal plate of the flexible circuit board after bending. In some embodiments, the flexible circuit board 500 further includes a back metal plate 520, one end of the back metal plate 520 is connected to the metal chassis 100, the other end of the back metal plate 520 is bent, and the end of the back metal plate 520 connected to the metal chassis 100 forms a lamination portion 521 laminated with the metal chassis 100; the flexible substrate 510 is attached to a surface of the laminated part 521 on a side facing away from the metal chassis 100. The metal chassis 100 is stacked by the stacking portion 521 on the back metal plate 520 of the flexible circuit board 500, so that the stacking of the substrate and the metal chassis 100 is realized, and the operation is convenient. Further, in some embodiments, the laminated portion 521 is bonded to the metal chassis 100 by the conductive adhesive 600, so as to further realize the lamination between the flexible substrate 510 and the metal chassis 100.
Referring to fig. 5, 6 and 7, in the above embodiment, the laminating portion 521, the conductive adhesive 600 and the metal casing 100 form a ground layer of the power supply 200, and in order to realize the connection between the detection pad 400 and the touch chip 300, the sensing circuit corresponding to the detection pad 400 is electrically connected to the touch chip 300 (see fig. 3) through a trace. Specifically, in some embodiments, the detection pad 400 is disposed outside the ground layer and is connected to the touch chip 300 by a wire; in other embodiments, the detection pad 400 is covered in a ground layer, the ground layer has a via hole, and the detection pad 400 is connected to the contact chip trace through the via hole.
Referring to fig. 8 and 9, in some embodiments, the detection pad 400 is disposed on a side of the flexible substrate 510 facing away from the metal chassis 100 to form two parallel substrates with the metal chassis 100, and referring to fig. 10 and 11, in other embodiments, the detection pad 400 is disposed on a side of the flexible substrate 510 facing towards the metal chassis 100 to form two parallel substrates with the metal chassis 100, specifically, the detection pad 400 may be disposed on a side of the flexible substrate 510 facing away from the metal chassis 100 or the detection pad 400 may be disposed on a side of the flexible substrate 510 facing towards the metal chassis 100 according to a space available between the flexible substrate 510 and the chassis. When the detection pad 400 is disposed on the side of the flexible substrate 510 facing the metal chassis 100, the distance between the detection pad 400 and the metal chassis 100 is smaller, and there is no influence of other structures between the detection pad 400 and the metal chassis 100, so that the detection effect is better.
Referring to fig. 8 and 10, in some embodiments, the dielectric layer between the two parallel substrates formed by the detection pad 400 and the metal chassis 100 is air. The air is used as a dielectric layer between two parallel substrates formed by the detection pad 400 and the metal casing 100, and no additional dielectric layer is required to be arranged between the detection pad 400 and the metal casing 100, so that the structure is simple and the cost is low. In this case, since air is used as a dielectric layer between the two parallel substrates formed by the detection pad 400 and the metal chassis 100, the laminated portion 521 avoids the detection surface of the detection pad 400, that is, the projection of the laminated portion 521 on the metal chassis 100 and the projection of the detection pad 400 on the metal chassis 100 are spaced from each other, so that the material required for the laminated portion 521 can be reduced to some extent, thereby saving the cost.
Referring to fig. 8 to 10, in some embodiments, an insulating layer 410 is attached to a side of the detection pad 400 opposite to the flexible substrate 510. By attaching the insulating layer 410 on the side of the detection pad 400 opposite to the flexible substrate 510, the interference of other components on the side of the detection pad 400 opposite to the flexible substrate 510 on the detection result is avoided, so that the detection result is more accurate.
Referring to fig. 9 and 11, in some embodiments, the projection of the detection pad 400 on the metal chassis 100 overlaps the projection of the laminating part 521 on the metal chassis 100, so that the laminating part 521 serves as a dielectric layer between two parallel substrates formed by the detection pad 400 and the metal chassis 100. By arranging the relative position relationship between the detection pad 400 and the laminated part 521, the projection of the detection pad 400 on the metal case 100 is overlapped with the projection of the laminated part 521 on the metal case 100, so that the laminated part 521 can be directly used as a dielectric layer between two parallel substrates formed by the detection pad 400 and the metal case 100, and the structure is simple.
In some embodiments, the number of the detection pads 400 is one, and the one detection pad 400 is disposed corresponding to an edge or a middle portion of the metal chassis 100, so as to implement a local area common ground condition inspection. In other embodiments, the number of the detection pads 400 and the number of the signal receiving pins are both multiple, and each detection pad 400 is electrically connected to a different signal receiving pin, so as to realize sensing of multiple channels, and thus, to realize common ground condition inspection in different areas. Moreover, when the number of the detection pads 400 is plural, the common ground condition of different devices can be checked by reasonably setting the positions of the detection pads 400. Under ideal conditions, each circuit element in the electronic equipment is connected with the system in common ground to avoid signal interference and improve the signal-to-noise ratio. In the above embodiment, the detection pad 400 is used for capacitance sensing to sense whether the detection pad is close to the other substrate of the two substrates parallel to each other, and the sensing is used as a judgment of whether a ground signal exists or not; when the common ground substrate is close to and in fixed contact with the common ground substrate, the common ground substrate and the common ground substrate form a parallel plate capacitor, namely, a capacitance signal is generated, and on the contrary, when no common ground substrate is close to and in fixed contact with the common ground substrate, no capacitance signal is generated.
In some embodiments, the projections of each of the probing pads 400 on the metal casing 100 are spaced apart from each other, that is, multiple probing pads 400 are used to realize multi-channel sensing, so as to realize common ground condition inspection of different regions.
In the above embodiments, the detection pad 400 may be configured to be circular, square, triangular or irregular, and may be specifically adjusted according to the available space on the electronic device, which is not limited herein.
Referring to fig. 12, the present invention further provides a method for testing a common ground of a touch module and a system of an electronic device, wherein the electronic device includes a metal casing, a power supply and the touch module, a ground terminal of the power supply is grounded through the metal casing, the touch module includes a touch chip, the touch chip is provided with a ground pad and a signal receiving pin, and the ground pad is configured to be common ground with the ground terminal of the power supply; the common ground detection method for the touch module and the system of the electronic equipment comprises the following steps:
step S1, providing a detecting pad, electrically connecting the detecting pad with the signal receiving pin, and making the detecting pad and the metal case form two parallel substrates;
step S2, detecting whether the detecting pad and the metal case form a parallel plate capacitor.
In the inspection method, the detection bonding pads are electrically connected to the signal receiving pins of the touch chip, and the detection bonding pads and the metal shell are arranged as two substrates parallel to each other, when the grounding pad of the touch module is grounded with the grounding end of the power supply, the detection pad and the metal case form a parallel plate capacitor, when the grounding pad of the touch module is disconnected with the grounding end of the power supply and is grounded, the detection pad and the metal shell do not form a parallel plate capacitor, and the RC value change between the detection pad and the metal shell is used to judge whether the grounding pad of the touch module and the grounding end of the power supply are normally grounded, therefore, whether the common ground state of the touch module and the system is damaged or not can be conveniently detected, the situation that the common ground state of the touch module and the system is damaged but not detected to influence the test of the whole machine and generate signal interference is avoided, and the situation that the touch module and the system are disconnected and common ground leads to system false alarm point is further avoided.
In some embodiments, detecting whether the detection pad and the metal chassis form a parallel plate capacitor specifically comprises: and detecting the charging/discharging time of the capacitor between the detection bonding pad and the gold casing. The charging/discharging time of the capacitor between the detection pad and the gold casing is detected to be used as a judgment basis for judging whether the common ground exists or not, the process is simple, and the result of the common ground inspection can be quickly and conveniently obtained.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (13)
1. An electronic device, comprising:
a metal housing;
the grounding end of the power supply is grounded through the metal shell;
the touch module comprises a touch chip, wherein the touch chip is provided with a grounding pad and a signal receiving pin, and the grounding pad is configured to be grounded with a grounding end of the power supply; and
a detection pad electrically connected to the signal receiving pin, the detection pad configured to form a parallel plate capacitor with the metal chassis when the ground pad is grounded to a ground terminal of the power supply.
2. The electronic device of claim 1, further comprising a flexible circuit board comprising a flexible substrate parallel to the metal chassis;
the detection bonding pad is arranged on one side surface of the flexible substrate.
3. The electronic device according to claim 2, wherein the flexible circuit board further comprises a back metal plate, one end of the back metal plate is connected to the metal chassis, the other end of the back metal plate is bent, and one end of the back metal plate connected to the metal chassis forms a lamination part laminated with the metal chassis;
the flexible substrate is attached to the surface of the laminated part, which faces away from one side of the metal shell.
4. The electronic device according to claim 3, wherein the lamination part and the metal chassis are bonded by a conductive adhesive.
5. The electronic device according to claim 4, wherein the laminated portion, the conductive adhesive, and the metal chassis constitute a ground layer of the power supply;
the detection bonding pad is arranged outside the grounding layer and is connected with the touch control chip by wiring; or
The detection bonding pad is coated in the grounding layer, the grounding layer is provided with a through hole, and the detection bonding pad is connected with the touch chip in a routing mode through the through hole.
6. The electronic device of claim 3, wherein the detection pads are disposed on a side of the flexible substrate opposite to the metal chassis to form two parallel substrates with the metal chassis; or
The detection bonding pad is arranged on one side, facing the metal shell, of the flexible substrate so as to form two substrates parallel to each other with the metal shell.
7. The electronic device of claim 6, wherein the dielectric layer between the two parallel substrates formed by the detection pad and the metal chassis is air.
8. The electronic device of claim 7, wherein a side of the detection pad facing away from the flexible substrate is attached with an insulating layer.
9. The electronic device of claim 6, wherein a projection of the detection pad on the metal chassis overlaps a projection of the lamination portion on the metal chassis, such that the lamination portion serves as a dielectric layer between two substrates parallel to each other and formed by the detection pad and the metal chassis.
10. The electronic device according to any one of claims 1 to 9, wherein a plurality of detecting pads and a plurality of signal receiving pins are provided, and each detecting pad is electrically connected to a different signal receiving pin.
11. The electronic device of claim 10, wherein the projections of each of the detection pads on the metal chassis are spaced apart from each other.
12. A common-ground detection method for a touch module and a system of electronic equipment is characterized in that the electronic equipment comprises a metal shell, a power supply and a touch module, wherein the grounding end of the power supply is grounded through the metal shell;
the method comprises the following steps:
providing a detection bonding pad, electrically connecting the detection bonding pad with the signal receiving pin, and enabling the detection bonding pad and the metal shell to form two substrates which are parallel to each other;
and detecting whether the detection bonding pad and the metal shell form a parallel plate capacitor or not.
13. The method of claim 12, wherein the detecting whether the detection pad and the metal chassis form a parallel plate capacitor comprises:
and detecting the charging/discharging time of the capacitor between the detection pad and the metal shell.
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| CN202110795868.5A CN113434056B (en) | 2021-07-14 | 2021-07-14 | Electronic equipment and touch module and system common-ground detection method thereof |
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| CN202110795868.5A CN113434056B (en) | 2021-07-14 | 2021-07-14 | Electronic equipment and touch module and system common-ground detection method thereof |
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| US8233284B2 (en) * | 2010-02-03 | 2012-07-31 | Lotes Co., Ltd. | Grounding structure and electrical device |
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