CN113434028A - Heat dissipation control system and method thereof - Google Patents
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Abstract
The application provides a heat dissipation control system, which comprises a fan control module, a chip group, a central processing unit, a display card fan module, a display card chip and an embedded controller. The fan control module is used for controlling a first fan, and the first fan is set to correspond to a first duty ratio; the chipset is electrically connected with the fan control module; the central processing unit is used for outputting first heat source information; the display card fan module is used for controlling a second fan, and the second fan is set to correspond to a second duty ratio; the display card chip is electrically connected with the display card fan module and used for outputting second heat source information; the embedded controller is electrically connected with the chipset, the central processing unit and the display card chip, and dynamically adjusts the first duty ratio and the second duty ratio according to the first heat source information and the second heat source information.
Description
Technical Field
The present application relates to a heat dissipation control system, and more particularly, to a heat dissipation control system using a fan.
Background
In the existing assembled computer, control signals of a radiator and a fan are connected to a mainboard for unified control, but because various components in the assembled computer are purchased and installed by a user, the heat dissipation capacity of each assembled computer is not only greatly different, but also a heat dissipation system cannot be calibrated before leaving a factory like a brand packaged computer.
When the fan is controlled on the mainboard, the duty cycle (BIOS) or software sends out is to control the fan to rotate through the fan control module, so no matter the BIOS or software is, the duty cycle temperature curve is used to control the fan rotating speed, the larger the value of the duty cycle is, the faster the fan rotating speed is, therefore, the higher the temperature is, the higher the fan rotating speed is, but the higher the fan rotating speed is, the higher the noise is simultaneously.
The current practice is that the duty ratio temperature curve is preset in the fan control module before the mainboard leaves the factory, but because the RPM (revolution per minute) reflected by each fan for the same duty ratio is different, the mainboard opens the control interface to allow the user to adjust the fan speed by himself, so that the user needs to adjust the duty ratio temperature curve by himself continuously to a state of balancing heat dissipation and noise, and the adjustment can be completed by performing test and verification back and forth, which is very inconvenient.
Disclosure of Invention
The present application provides a heat dissipation control system, which includes a fan control module, a chipset, a central processing unit, a graphics card fan module, a graphics card chip, and an embedded controller. The fan control module is used for controlling a first fan, and the first fan is set to correspond to a first duty ratio; the chipset is electrically connected with the fan control module; the central processing unit is electrically connected with the chip set and used for outputting first heat source information; the display card fan module is used for controlling a second fan, and the second fan is set to correspond to a second duty ratio; the display card chip is electrically connected with the display card fan module and used for outputting second heat source information; the embedded controller is electrically connected with the chipset, the central processing unit and the display card chip, and dynamically adjusts the first duty ratio and the second duty ratio according to the first heat source information and the second heat source information.
The present application further provides a heat dissipation control method, which is executed by an embedded controller, the embedded controller at least receives first heat source information from a first heat source device and second heat source information from a second heat source device, and dynamically adjusts at least two fans including a first fan and a second fan according to the first heat source information and the second heat source information, the heat dissipation control method comprising: carrying out a screening step: the embedded controller performs screening according to the first heat source information and the second heat source information to screen at least one of the first heat source device and the second heat source device which needs heat dissipation; and (3) carrying out a testing step: the embedded controller gradually reduces the rotating speed of at least two fans, and records the change of first heat source information correspondingly output by the first heat source device and the change of second heat source information correspondingly output by the second heat source device; and performing a prediction step: the embedded controller can respectively obtain a first heat dissipation parameter and a second heat dissipation parameter according to the rotating speed of the first fan, the rotating speed of the second fan and the change of the first heat source information and the second heat source information, converts the first heat dissipation parameter into a first fan setting parameter and converts the second heat dissipation parameter into a second fan setting parameter through a built-in conversion model, so that the embedded controller can adjust the first duty ratio of the first fan according to the first heat source information, the second heat source information and the first fan setting parameter and adjust the second duty ratio of the second fan according to the first heat source information, the second heat source information and the second fan setting parameter.
In summary, the present application uses the embedded controller to record information of each heat source device and the fan at any time, and properly adjust the rotation speed of the fan and observe the temperature variation of the heat source device to analyze the correlation between the heat source device and the fan, so as to optimize the duty ratio of the fan, reduce the noise, maintain the heat dissipation capability, and further achieve the balance between the heat dissipation and the noise.
Other features and embodiments of the present application will be described in detail below with reference to the drawings.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic flow chart illustrating a heat dissipation control method according to an embodiment of the present application;
fig. 2 is a schematic diagram of a heat dissipation control system according to an embodiment of the present application;
fig. 3 is a schematic diagram of a first heat dissipation duty cycle curve and a second heat dissipation duty cycle curve according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a first duty cycle temperature profile and a second duty cycle temperature profile according to an embodiment of the present application;
FIG. 5 is an architecture diagram of a transformation model according to an embodiment of the present application;
FIG. 6 is a block diagram illustrating a heat dissipation control system according to an embodiment of the present application;
FIG. 7 is a graph of temperature versus noise versus fan duty cycle according to an embodiment of the present application.
Detailed Description
The positional relationship described in the following embodiments includes: the top, bottom, left and right, unless otherwise indicated, are based on the orientation of the elements in the drawings.
Referring to fig. 1 and fig. 2, the heat dissipation control method is executed by the embedded controller 12, and the embedded controller 12 at least receives first heat source information from the first heat source device 14 and second heat source information from the second heat source device 16, and dynamically adjusts at least two fans including the first fan 18 and the second fan 20 according to the first heat source information and the second heat source information. The heat dissipation control method sequentially comprises a screening step of step S10, a testing step of step S20, and a predicting step of step S30.
As shown in step S10, a screening step is performed: when the computer is running, the embedded controller 12 records the first heat source information and the second heat source information of the first heat source device 14 and the second heat source device 16 at intervals, and different heat source information exists according to different user habits, so that the embedded controller 12 performs screening according to the change of the first heat source information and the second heat source information to screen at least one of the first heat source device 14 and the second heat source device 16 which needs heat dissipation; when the first heat source device 14 and the second heat source device 16 are screened to require heat dissipation, the embedded controller 12 first sets the weight of the first heat source device 14 and the second heat source device 16 requiring heat dissipation to determine the priority of heat dissipation. In one embodiment, the first heat source information and the second heat source information are temperature, voltage, current, power consumption or rotation speed.
As shown in step S20, a test step is performed: the embedded controller 12 gradually decreases the rotation speed of the first fan 18 and the second fan 20, and records the variation of the first heat source information outputted by the first heat source device 14 and the variation of the second heat source information outputted by the second heat source device 16.
In detail, when the first heat source device 14 needs to dissipate heat, when the first heat source information tends to be stable, the embedded controller 12 gradually decreases the rotation speed of the first fan 18 and the second fan 20, and records the change of the first heat source information correspondingly output by the first heat source device 14, and when the change of the first heat source information exceeds a first limit value, the rotation speed of the first fan 18 and the second fan 20 is adjusted back and the change of the first heat source information is maintained to be not more than the first limit value.
When the second heat source device 16 needs to dissipate heat, when the second heat source information tends to be stable, the embedded controller 12 gradually decreases the rotation speeds of the first fan 18 and the second fan 20, and records the change of the second heat source information correspondingly output by the second heat source device 16, and when the change of the second heat source information exceeds a second limit value, the rotation speeds of the first fan 18 and the second fan 20 are adjusted back, and the change of the second heat source information is maintained to be not more than the second limit value. In one embodiment, the embedded controller 12 may reduce the rotation speed of the first fan 18 and the second fan 20 simultaneously or separately, and the reduction ratio may be the same or different.
As shown in step S30, the prediction step is performed: the embedded controller 12 may obtain a first heat dissipation parameter corresponding to the first fan 18 according to a change between the rotation speed of the first fan 18 and the first heat source information and a change between the rotation speed of the first fan 18 and the second heat source information (including a change between the rotation speed of the first fan 18 and the first heat source information and a change between the rotation speed of the first fan 18 and the second heat source information), and may obtain a second heat dissipation parameter corresponding to the second fan 20 according to a change between the rotation speed of the second fan 20 and the first heat source information and a change between the rotation speed of the second fan 20 and the second heat source information.
Then, the embedded controller 12 converts the first heat dissipation parameter into a first fan setting parameter and converts the second heat dissipation parameter into a second fan setting parameter through the built-in conversion model 121, so that the embedded controller 12 adjusts the first duty ratio of the first fan 18 according to the first heat source information, the second heat source information and the first fan setting parameter, and adjusts the second duty ratio of the second fan 20 according to the first heat source information, the second heat source information and the second fan setting parameter.
The embedded controller 12 may further repeat the screening step of step S10, the testing step of step S20, and the predicting step of step S30, and repeat whether the comparison result matches the previous comparison result, if not, another new set of the first fan setting parameter and the second fan setting parameter may be selected, and then repeat steps S10 to S30 until the comparison result converges to match, that is, steps S10 to S30 are repeated, and the comparison result obtained each time is the same set of the first fan setting parameter and the second fan setting parameter, which represents convergence to match, and this indicates that the settings of the first fan 18 and the second fan 20 are completed.
In an embodiment, when the embedded controller 12 selects a new set of the first and second fan setting parameters, the method includes dynamically adjusting the original first and second fan setting parameters, and using the adjusted first and second fan setting parameters as the new set of fan setting parameters.
In an embodiment, the first heat dissipation parameter is a first heat dissipation duty cycle curve, and the second heat dissipation parameter is a second heat dissipation duty cycle curve, and the first heat dissipation duty cycle curve and the second heat dissipation duty cycle curve can refer to fig. 3. The first fan setting parameter is a first duty ratio temperature curve, the second fan setting parameter is a second duty ratio temperature curve, and the first duty ratio temperature curve and the second duty ratio temperature curve can be referred to as shown in fig. 4.
Referring to fig. 1, fig. 2 and fig. 5, in step S20, the embedded controller 12 obtains a first heat dissipation duty cycle curve (a first heat dissipation parameter) according to a change between the rotation speed of the first fan 18 and the first heat source information and the second heat source information, or obtains a second heat dissipation duty cycle curve (a second heat dissipation parameter) according to a change between the rotation speed of the second fan 20 and the first heat source information and the second heat source information, and the first heat dissipation duty cycle curve and the second heat dissipation parameter have only a local heat dissipation duty cycle curve, as shown in the left side curve shown in fig. 5; after the local first heat dissipation duty cycle curve and the local second heat dissipation duty cycle curve are subjected to prediction processing by the conversion model 121, the local first heat dissipation duty cycle curve and the local second heat dissipation duty cycle curve can be converted and output into a first duty cycle temperature curve and a second duty cycle temperature curve as shown in a right-side curve of fig. 5.
In one embodiment, the transformation model 121 tries different combinations of computer components at the design end stage, and collects data of all fans from 0% to 100% of duty ratio through a large number of experiments according to different combination characteristics, and then confirms the classification, so as to give corresponding fan setting parameters.
Taking the architecture of the heat dissipation control system shown in fig. 2 as an example, please refer to fig. 2, the step of training the conversion model at the embedded controller 12 further includes: the first duty cycle of the first fan 18 is gradually adjusted from 0% to 100%, and the heat dissipation conditions of the first heat source device 14 and the second heat source device 16 are recorded to establish a first heat dissipation duty cycle curve. Then, the second duty cycle of the second fan 20 is gradually adjusted from 0% to 100%, and the heat dissipation conditions of the first heat source device 14 and the second heat source device 16 are recorded, so as to establish a second heat dissipation duty cycle curve.
The first heat dissipation duty cycle curve and the second heat dissipation duty cycle curve are also shown in fig. 3. According to the first and second heat dissipation duty cycle curves and the chip specification parameters of the first and second heat source devices, a first reference duty cycle temperature curve corresponding to the first fan and a second reference duty cycle temperature curve corresponding to the second fan are respectively established, wherein the first and second reference duty cycle temperature curves are also shown in fig. 4.
Specifically, as can be seen from fig. 3, the effective duty ratio of the first fan 18 or the second fan 20 to the first heat source device 14 is about 80%, the effective duty ratio to the second heat source device 16 is about 60%, and the reference duty ratio temperature curve as shown in fig. 4 can be completed by combining the upper temperature limit of the chip specification as the chip specification parameter. The foregoing steps are repeated to obtain a large number of first reference duty ratio temperature curves and second reference duty ratio temperature curves, and the conversion model 121 is trained according to the relationship between the large number of first heat dissipation duty ratio curves and the first reference duty ratio temperature curves and the relationship between the second heat dissipation duty ratio curves and the second reference duty ratio temperature curves through a supervised mechanical learning manner such as a support vector machine. Through the conversion model 121, the embedded controller 12 can predict the corresponding duty ratio temperature curve only by a local heat dissipation duty ratio curve.
In a computer, the most common heat source devices are a central processing unit, a graphics card chip on a graphics card, or a solid state disk, and the most common central processing unit and the graphics card chip are used as the heat source devices of the present application.
Referring to fig. 6, the heat dissipation control system 10 includes a fan control module 22, a chipset 24, a cpu 26, a graphics card fan module 28, a graphics card chip 30, and an embedded controller 12.
The fan control module 22 is mainly used for controlling and driving the first fan 18, the first fan 18 is set to correspond to a first duty ratio, the chipset 24 is electrically connected with the fan control module 22 and used for transmitting information, the central processing unit 26 is electrically connected with the chipset 24 and used for outputting first heat source information, the graphics card fan module 28 is mainly used for controlling and driving the second fan 20, the second fan 20 is set to correspond to a second duty ratio, and the graphics card chip 30 is electrically connected with the graphics card fan module 28 and used for outputting second heat source information.
The embedded controller 12 is electrically connected to the chipset 24, the cpu 26 and the graphic card chip 30, and the embedded controller 12 further has a conversion model 121 built therein for converting a first heat dissipation parameter established according to a change between the rotation speed of the first fan 18 and the first heat source information and the second heat source information into a first fan setting parameter, and for converting a second heat dissipation parameter established according to a change between the rotation speed of the second fan 20 and the first heat source information and the second heat source information into a second fan setting parameter, so that the embedded controller 12 can adjust the first duty ratio of the first fan 18 according to the first heat source information, the second heat source information and the first fan setting parameter and adjust the second duty ratio of the second fan 20 according to the first heat source information, the second heat source information and the second fan setting parameter.
The fan control module 22, the chipset 24, the cpu 26 and the embedded controller 12 are located on the motherboard 34. In addition, the display card 36 includes a display card power module 32 electrically connected to the display card chip 30 in addition to the display card fan module 28 and the display card chip 30 to provide a required power.
When the first duty ratio of the first fan 18 is adjusted, the embedded controller 12 generates corresponding first duty ratio data according to the first heat source information, the second heat source information and the first fan setting parameter and transmits the corresponding first duty ratio data to the chipset 24, the chipset 24 transmits the first duty ratio data to the fan control module 22, and the fan control module 22 generates a first driving signal to the first fan 18 according to the first duty ratio data, so as to adjust the first duty ratio of the first fan 18, and enable the first fan 18 to operate at the adjusted first duty ratio.
When the second duty ratio of the second fan 20 is adjusted, the embedded controller 12 generates corresponding second duty ratio data according to the first heat source information, the second heat source information and the second fan setting parameter and transmits the corresponding second duty ratio data to the graphics card chip 30, the graphics card chip 30 generates a second control signal according to the second duty ratio data and transmits the second control signal to the graphics card fan module 28, and the graphics card fan module 28 generates a second driving signal to the second fan 20 according to the second control signal, so as to adjust the second duty ratio of the second fan 20, and enable the second fan 20 to operate with the adjusted second duty ratio.
In one embodiment, please refer to fig. 6, the fan control module 22 further includes a super input/output controller (SIO)221, a fan driving chip 222, and a connection interface 223. The super i/o controller 221 is electrically connected to the chipset 24 to receive the first duty ratio data and generate a first control signal, the fan driving chip 222 is electrically connected to the super i/o controller 221 and the connection interface 223, the connection interface 223 is electrically connected to the second fan 18, the fan driving chip 222 generates a corresponding first driving signal according to the first control signal, and transmits the first driving signal to the first fan 18 through the connection interface 223 to adjust the first duty ratio of the first fan 18.
Referring to fig. 1 to 6, regarding the cpu 26 in the embedded controller 12 as the first heat source device 14 and the graphic card chip 30 as the second heat source device 16, the detailed processes (including the screening step, the testing step and the predicting step) of the heat dissipation control method and the process of establishing the conversion model 121 are the same as those of the embodiment shown in fig. 2, so that reference is made to the foregoing description and no further description is provided herein.
In one embodiment, referring to fig. 2 and fig. 6, the first duty cycle of the first fan 18 and the second duty cycle of the second fan 20 are up to 80% (maximum efficiency). Referring to fig. 7, the embedded controller 12 adjusts the temperature-noise-fan duty ratio curve of fig. 7, and it can be seen from fig. 7 that the temperature and noise balance is achieved when the fan duty ratio reaches 80%, so that the first duty ratio of the first fan 18 and the second duty ratio of the second fan 20 are set to 80% at the maximum as the maximum efficiency value. Therefore, according to the heat source device which needs heat dissipation most at present, the rotating speed of the fan which has heat dissipation assistance most is increased according to the efficiency of the fan, and the rotating speed of the fan which is not assisted is reduced, so that the effects of heat dissipation and fan noise reduction are achieved at the same time.
To sum up, the embedded controller used in the present application can record the information of each heat source device and the fan at any time, analyze the correlation between the heat source device and the fan by properly adjusting the rotation speed of the fan and observing the temperature change of the heat source device, optimize the duty ratio of the fan, reduce the noise and keep the heat dissipation capability, thereby achieving the balance between the heat dissipation and the noise. On the other hand, the algorithm of the conversion model is built in the embedded controller, the performance of the central processing unit is not occupied during execution, and the algorithm is independent of the operation of the operating system, so the performance of the computer is not influenced.
The above-described embodiments and/or implementations are only for illustrating the preferred embodiments and/or implementations of the technology of the present application, and are not intended to limit the implementations of the technology of the present application in any way, and those skilled in the art can make modifications or changes to other equivalent embodiments without departing from the scope of the technology disclosed in the present application, but should be construed as technology or implementations substantially the same as the present application.
Claims (14)
1. A heat dissipation control system, comprising:
the fan control module is used for controlling a first fan, and the first fan is set to correspond to a first duty ratio;
the chipset is electrically connected with the fan control module;
the central processing unit is electrically connected with the chip set and used for outputting first heat source information;
the display card fan module is used for controlling a second fan, and the second fan is set to correspond to a second duty ratio;
the display card chip is electrically connected with the display card fan module and used for outputting second heat source information; and
and the embedded controller is electrically connected with the chipset, the central processing unit and the display card chip and dynamically adjusts the first duty ratio and the second duty ratio according to the first heat source information and the second heat source information.
2. The system as claimed in claim 1, wherein the embedded controller further comprises a conversion model for converting a first heat dissipation parameter, which is established according to the variation between the rotation speed of the first fan and the first and second heat source information, into a first fan setting parameter, and for converting a second heat dissipation parameter, which is established according to the variation between the rotation speed of the second fan and the first and second heat source information, into a second fan setting parameter.
3. The system of claim 2, wherein the embedded controller performs a screening step, a testing step, and a prediction step based on the first heat source information and the second heat source information.
4. The system of claim 1, wherein the first heat source information and the second heat source information are temperature, voltage, current, power consumption, or rotational speed.
5. The heat dissipation control system of claim 2, wherein the embedded controller generates first duty cycle data according to the first heat source information, the second heat source information, and the first fan setting parameter and transmits the first duty cycle data to the chipset, the chipset transmits the first duty cycle data to the fan control module, and the fan control module generates a first driving signal according to the first duty cycle data to adjust a first duty cycle of the first fan.
6. The heat dissipation control system of claim 5, wherein the fan control module further comprises:
the super input/output controller is electrically connected with the chip set to receive the first duty ratio data and generate a first control signal;
the fan driving chip is electrically connected with the super input/output controller and generates the first driving signal according to the first control signal; and
the connection interface is electrically connected with the fan driving chip and the first fan and transmits the first driving signal to the first fan so as to adjust the first duty ratio of the first fan.
7. The system of claim 1, wherein the fan control module, the chipset, the cpu, and the embedded controller are located on a motherboard.
8. The system of claim 2, wherein the embedded controller generates a second duty ratio data according to the first heat source information, the second heat source information, and the second fan setting parameter and transmits the second duty ratio data to the graphics card chip, the graphics card chip transmits a second control signal generated according to the second duty ratio data to the graphics card fan module, and the graphics card fan module generates a second driving signal to the second fan according to the second control signal to adjust the second duty ratio of the second fan.
9. A heat dissipation control method is executed by an embedded controller, the embedded controller at least receives first heat source information from a first heat source device and second heat source information from a second heat source device, and dynamically adjusts at least two fans according to the first heat source information and the second heat source information, the at least two fans include a first fan and a second fan, and the heat dissipation control method comprises:
carrying out a screening step: the embedded controller performs screening according to the first heat source information and the second heat source information to screen at least one of the first heat source device and the second heat source device which needs heat dissipation;
and (3) carrying out a testing step: the embedded controller gradually reduces the rotating speed of the at least two fans, and records the change of the first heat source information correspondingly output by the first heat source device and the change of the second heat source information correspondingly output by the second heat source device; and
performing a prediction step: the embedded controller can respectively obtain a first heat dissipation parameter and a second heat dissipation parameter according to the rotating speed of the first fan, the rotating speed of the second fan and the change of the first heat source information and the second heat source information, converts the first heat dissipation parameter into a first fan setting parameter and converts the second heat dissipation parameter into a second fan setting parameter through a built-in conversion model, so that the embedded controller can adjust the first duty ratio of the first fan according to the first heat source information, the second heat source information and the first fan setting parameter and adjust the second duty ratio of the second fan according to the first heat source information, the second heat source information and the second fan setting parameter.
10. The method of claim 9, wherein the embedded controller further repeats the screening step, the testing step, and the predicting step, and repeatedly compares whether the results match at the previous time, and if not, selects a new set of the first and second fan setting parameters to converge to match.
11. The method as claimed in claim 10, wherein selecting a new set of the first and second fan setting parameters comprises dynamically adjusting the first and second fan setting parameters as the new set of fan setting parameters.
12. The heat dissipation control method of claim 9, wherein in the screening step, when both the first heat source device and the second heat source device need to dissipate heat, the embedded controller sets a weight for the first heat source device and the second heat source device to dissipate heat.
13. The heat dissipation control method of claim 9, wherein in the testing step, when the change in the first heat source information exceeds a first limit value, the rotation speed of the at least two fans is adjusted back and the change in the first heat source information is maintained not to exceed the first limit value; and when the change of the second heat source information exceeds a second limit value, the rotating speed of the at least two fans is adjusted back, and the change of the second heat source information is maintained to be not more than the second limit value.
14. The method of claim 9, wherein the step of the embedded controller training the conversion model further comprises:
gradually adjusting the first duty ratio of the first fan from 0% to 100%, and recording the heat dissipation conditions of the first heat source device and the second heat source device to establish a first heat dissipation duty ratio curve;
gradually adjusting the second duty ratio of the second fan from 0% to 100%, and recording the heat dissipation conditions of the first heat source device and the second heat source device to establish a second heat dissipation duty ratio curve;
establishing a first reference duty ratio temperature curve corresponding to the first fan and a second reference duty ratio temperature curve corresponding to the second fan according to the first heat dissipation duty ratio curve and the second heat dissipation duty ratio curve and chip specification parameters of the first heat source device and the second heat source device; and
and repeating the steps to obtain a large number of first reference duty ratio temperature curves and second reference duty ratio temperature curves.
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| CN103699190A (en) * | 2012-09-27 | 2014-04-02 | 联想(北京)有限公司 | Method for reducing temperature of graphics card and electronic device |
| CN110799757A (en) * | 2018-11-30 | 2020-02-14 | 深圳市大疆创新科技有限公司 | Fan control method, fan control device and electronic equipment |
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| CN116483180A (en) * | 2023-03-10 | 2023-07-25 | 苏州振畅智能科技有限公司 | Intelligent control method, system, equipment and medium of active heat dissipation device |
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