CN113432773B - Sensor suitable for measuring pressure of shock wave on surface of flexible object and manufacturing method - Google Patents
Sensor suitable for measuring pressure of shock wave on surface of flexible object and manufacturing method Download PDFInfo
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- 230000035939 shock Effects 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000010410 layer Substances 0.000 claims abstract description 88
- 238000003466 welding Methods 0.000 claims abstract description 81
- 238000009459 flexible packaging Methods 0.000 claims abstract description 43
- 239000012792 core layer Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 claims description 28
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 8
- 238000007650 screen-printing Methods 0.000 claims description 8
- 238000003698 laser cutting Methods 0.000 claims description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 230000000295 complement effect Effects 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229920006267 polyester film Polymers 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 238000007790 scraping Methods 0.000 claims description 3
- 229920002799 BoPET Polymers 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000009824 pressure lamination Methods 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- 238000002791 soaking Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 8
- 238000012360 testing method Methods 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 88
- 238000005259 measurement Methods 0.000 description 11
- 230000035945 sensitivity Effects 0.000 description 9
- 239000002033 PVDF binder Substances 0.000 description 7
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 7
- 230000010287 polarization Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000009530 blood pressure measurement Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/14—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force of explosions; for measuring the energy of projectiles
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Abstract
The invention belongs to the technical field of experimental mechanics tests, and particularly relates to a pressure measuring sensor suitable for a shock wave on the surface of a flexible object and a manufacturing method thereof. The sensor comprises a piezoelectric film element and an insulating leveling layer, wherein the piezoelectric film element is embedded in the center of the insulating leveling layer and forms a core layer of the sensor with the piezoelectric film element, the upper side and the lower side of the core layer are flexible packaging plates, electrodes are arranged on the positions, corresponding to the piezoelectric film element, of the flexible packaging plates, the sizes and the shapes of the electrodes are the same as those of the piezoelectric film element, the electrodes and welding points on the flexible packaging plates are connected through electrode leads, silk-screen adhesive bonding layers are arranged on the positions, corresponding to the insulating leveling layer, of the flexible packaging plates, welding holes are formed in the silk-screen adhesive bonding layers so that the sensor can be conveniently bonded, packaged and welded by external leads, and insulating protection layers are arranged on the outer sides of the flexible packaging plates. The invention benefits from the fact that all the components are definite in size and symmetrical in geometric configuration, is convenient for mass production, and ensures that the manufacturing materials, the process and the pressing pressure are uniform, thereby reducing the individual variability of the manometer.
Description
Technical Field
The invention belongs to the technical field of experimental mechanics tests, and particularly relates to a pressure measuring sensor suitable for a shock wave on the surface of a flexible object and a manufacturing method thereof.
Background
The film type pressure sensor using the piezoelectric film as a sensitive element has the advantages of wide frequency response, large dynamic pressure testing range, high force-electricity conversion coefficient, good flexibility, good biological interface compatibility and the like, and is widely applied to impact pressure measurement of structural surfaces, material internal interfaces, organism body surfaces and other positions. At present, the piezoelectric film manometer is mainly manufactured by adopting a sandwich structure, namely a piezoelectric element is positioned between two electrodes, and the electrodes at two sides are bonded by adopting modes of gluing and the like. The electrode can be lapped on the piezoelectric film by adopting a metal foil, or can be connected with the piezoelectric film by adopting a conductive adhesiveAnd (5) bonding and fixing. However, the flatness of the piezoelectric element layer inside such a pressure gauge is difficult to ensure, and stress concentration of the piezoelectric element may be caused to cause poor measurement stability thereof. For this purpose, flat piezoelectric films are also used as the core layer (CN 103674225B), the local polarization being chosen to ensure a uniform overall thickness of the gauge. However, the piezoelectric film in the polarized region is limited by surrounding materials, and is not in a one-dimensional stress state under the action of out-of-plane pressure, and the limitation of in-plane deformation and the existence of in-plane stress can cause the piezoelectric element to generate additional charges, so that the stability of the force-electric conversion coefficient of the sensor is affected. In addition, the current sandwich type pressure gauge often fixedly connects the pressure film with the electrode, and in-plane deformation and out-of-plane slight bending of the electrode can cause the stress state of the pressure film to change in the loading process, thereby affecting the stability of the sensitivity of the pressure gauge. Therefore, the pressure sensor is not suitable for pressure measurement of soft back support and large deformation structure surface, such as explosion shock wave measurement of organism surface, and the rapid deformation of the back support leads to the change of the stress state of the piezoelectric element and the flexible deflection, so that the measurement result is greatly deviated from the actual situation. Finally, the piezoelectric film type pressure sensor is mainly used for measuring dynamic stress waves and shock waves with higher amplitude, and the pressure of shock waves applied to the surface of a soft organism by aerial explosion is generally 10 -1 ~10 1 The acting time is only 10 Mpa -3 ~10 2 ms, the pressure amplitude is the same as the atmospheric pressure, and the sensor has the characteristics of low amplitude, high loading rate, strong nonlinearity and the like, wherein the coupling effect of rapid deformation of the flexible support on the shock wave reflection process is also involved, and the requirements on the linearity and stability of the sensor in the measuring pressure range are higher.
Disclosure of Invention
The invention provides a sensor suitable for measuring shock wave pressure on the surface of a flexible object and a manufacturing method thereof, aiming at solving the problems that the traditional sandwich type piezoelectric film pressure gauge has internal flatness, the stress state of a piezoelectric film element is easily influenced by deformation of a core layer and an electrode and the sensitivity and stability are poor.
The invention adopts the following technical scheme: the utility model provides a be applicable to flexible object surface shock wave pressure measurement sensor, including piezoelectric film element and insulating tie layer, piezoelectric film element inlays in insulating tie layer central point put and rather than forming the sandwich layer of sensor, the upper and lower both sides of sandwich layer are flexible package board, electrode has been laid with piezoelectric film element corresponding position on the flexible package board, electrode size and shape are the same with piezoelectric film element, electrode and welding point pass through electrode lead connection on the flexible package board, silk screen printing adhesive bonding layer has been laid with insulating tie layer corresponding position on the flexible package board, be provided with the welding hole on the silk screen printing adhesive bonding layer in order to sensor bonding encapsulation and external lead welding, the outside of flexible package board sets up insulating protection layer.
Further, the piezoelectric thin film element is a piezoelectric polymer and a composite material thereof.
Further, the insulating pad layer is an unpolarized thin film of the same material and thickness as the piezoelectric film element, and does not have piezoelectric properties. The insulating leveling layer is provided with an embedded hole which has the same geometric shape as the piezoelectric film element and has a slightly larger size than the piezoelectric element, and the piezoelectric film element and the insulating leveling layer form a sensor core layer with the same thickness through the embedded hole.
Furthermore, a gap of 0.1mm is arranged between the outer edge of the piezoelectric film element and the inner edge of the embedded hole on the insulating pad layer, and the micro gap can be a preset gap for in-plane expansion deformation of the piezoelectric film element when the piezoelectric film element is pressed out of the plane, and can also avoid short circuit of the upper electrode and the lower electrode.
Further, the upper flexible packaging plate, the lower flexible packaging plate and the core layer of the sensor are pressed together in a vacuum environment, so that the contact surface between the piezoelectric film element and the electrode in the sensor and the preset gap between the piezoelectric film element and the insulating leveling layer are all in the vacuum environment, and the influence of the internal pressure on the measurement result is eliminated.
Further, the flexible package board includes a polyester film or PET film substrate, metal electrodes and leads, an adhesive layer, a solder joint, and a solder joint hole. Welding points are reserved at symmetrical positions of the tail ends of the electrodes respectively, welding holes are formed in vertical symmetrical positions of the welding points, the diameter of each welding hole is larger than that of each welding point by 1mm, the adhesive layer is coated on the flexible packaging plate in a silk screen printing mode on the electrodes, the leads, the welding points and the areas except the welding holes, and the thickness of the adhesive layer is consistent with that of the printed electrodes and the electrode leads. In order to facilitate the sensor to be externally connected with a lead, the welding point on the flexible packaging plate is a through hole type welding point.
A manufacturing method of a pressure measuring sensor suitable for a flexible object surface shock wave comprises the following steps.
S1, cutting a circular piezoelectric film element from the whole film by adopting a laser cutting or punching mode, removing burrs and oxide layers on the edge, soaking and cleaning by adopting alcohol/acetone, and removing impurities and a short circuit area possibly generated by cutting.
S2-providing a film of unpolarized piezoelectric polymer or composite material thereof, carrying out perforation treatment on the film by adopting a laser cutting or perforating mode to form an embedded hole, and opening bilateral symmetry welding holes at a position opposite to the embedded hole, and cutting the perforated film into the shape and the size of the sensor to serve as an insulating pad layer of the sensor.
S3, providing a flexible packaging board manufactured by FPC (flexible printed circuit) technology, and performing silk-screen printing on a non-circuit area on the packaging board by using a silk-screen printing plate provided with hollowed-out patterns complementary with printed circuit patterns, wherein the thickness of a glue scraping pressure control glue layer is adjusted to be consistent with that of the printed circuit, so as to obtain the flexible packaging board with a silk-screen printing glue bonding layer and a conductive circuit, and the conductive circuit comprises electrodes, leads, welding points and welding holes.
S4, completely bonding the insulating pad layer obtained in the step S2 with the adhesive layer of the bottom packaging plate, exposing the circular electrode area on the bottom packaging plate through the embedded hole formed in the insulating pad layer of the core layer, and then installing the piezoelectric film element obtained in the step S1 into the embedded hole, wherein the lower surface of the piezoelectric film element is in direct contact with the bottom electrode to realize electric connection, so that the combined structure formed by the core layer and the bottom packaging plate is obtained.
S5-repeating the step S3 to obtain a top flexible packaging plate with the same configuration and the same size as the top flexible packaging plate, transferring the sandwich insulating gasket layer and piezoelectric film element combined structure bonded in the step S4 and the top packaging plate to a vacuum operation box, symmetrically attaching the top flexible packaging plate with a silk-screen adhesive bonding layer and a conductive circuit and the bottom flexible packaging plate to the insulating gasket layer in a vacuum environment to form a double-sided symmetrical sandwich type pressure gauge, performing pressure lamination on the laminated pressure gauge, and then cutting redundant areas to form the appearance of the pressure gauge.
In step S5, when the flexible packaging board is bonded to the insulating pad layer, the positions of the welding point and the welding hole on the top packaging board are controlled to correspond to the welding hole and the welding point on the bottom packaging board respectively, and the welding points and the welding holes are corresponding to the welding holes on the insulating pad layer; the upper surface of the piezoelectric film element is in direct contact electrical connection with the electrode on the top flexible packaging plate.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the pressure gauge, the two sides of the piezoelectric film element are electrically connected with the electrodes in a free lamination manner, the pressure gauge is not influenced by non-out-of-plane compression deformation such as in-plane stretching and out-of-plane bending of the upper electrode layer and the lower electrode layer, meanwhile, a reserved in-plane gap exists between the piezoelectric film element and the pad layer, the piezoelectric film element can be effectively ensured to maintain a one-dimensional stress state during working, the force-electric coupling relation of the element is clear, and the noise-signal ratio of an output signal is reduced; the charge density in the 3 direction is mainly detected during actual measurement by setting the two orthogonal directions in the plane of the piezoelectric film to be 1 and 2 respectively and the out-of-plane direction to be 3q 3 The charge generation in the direction is related to the stress in three directions, the charge density generated by the acting forces in the three directions is in a linear relationship, and the force-electricity conversion coefficients are respectivelyd 31 、d 32 Andd 33 is provided withf 1 、f 2 Andf 3 the positive stresses respectively born by the three directions, the charge output of the piezoelectric film element in the thickness direction can be expressed as:q 3 =d 31 f 1 + d 32 f 2 + d 33 f 3 therefore, the piezoelectric element only maintains the one-dimensional stress stateThe relationship can be approximated as linear. When the piezoelectric film element is fixedly adhered to the upper electrode and the lower electrode, the deformation of the piezoelectric film element in the 1 and 2 directions is influenced by the deformation of the electrodes and the whole sensor sheet, and interference charge output is introduced; when the middle leveling layer and the piezoelectric film element are integrated, the element is in a one-dimensional strain three-dimensional stress state, the deformation in the 1 and 2 directions is limited, and interference charge output is also introduced. The piezoelectric film element is only subjected to out-of-plane stress, and is free to deform in the 1 and 2 directions, so that the linearity of the force and electricity output is high.
2. The pressure gauge has a flat internal structure and uniform overall thickness, the problem of unstable sensitivity caused by stress concentration is solved, the pressure gauge backing layer adopts an unpolarized film which is the same as the piezoelectric film in material and thickness, the thickness is consistent, the deformation of the overall core layer under the action of pressure is consistent, and the problems of deformation harmony and local stress concentration caused by different materials of the backing layer and the piezoelectric film element are solved; and external leads can be welded on both sides of the through hole type welding point and the symmetrically arranged welding Kong Shichuan sensor on the flexible packaging plate, so that flexible layout of the structure surface is realized.
3. The pressure gauge provided by the invention is in a vacuum environment during lamination packaging, so that the electrical connection quality of the piezoelectric film element and circuits on two sides is effectively ensured, and lower pressure (10-10) is eliminated -1 MPa) and the interference of internal gas pressure under non-vacuum package to the measurement result, so that the area structure of the piezoelectric film element in the sensor is compact, and the interference of the mutual motion between the electrode-piezoelectric film element-electrode three-layer structure to the charge output and pressure transmission process is eliminated.
4. The invention benefits from the fact that all the components are definite in size and symmetrical in geometric configuration, is convenient for mass production, and ensures that the manufacturing materials, the process and the pressing pressure are uniform, thereby reducing the individual variability of the manometer.
Drawings
FIG. 1 is a partial cross-sectional view of a sandwich-type membrane manometer;
FIG. 2 is a schematic view of the structure of an FPC board used in embodiment 1
FIG. 3 is a graph comparing the measured shock wave curve of the sensor obtained in example 1 with a standard curve;
FIG. 4 is a calibration graph of the sensor sensitivity coefficient obtained in example 1;
in the figure, the piezoelectric film element, the 2-electrode, the 3-insulating protective layer, the 4-adhesive layer, the 5-insulating pad leveling layer, the 6-electrode lead, the 7-welding point and the 8-welding hole are formed.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples.
As shown in figure 1, the sensor suitable for measuring the shock wave pressure on the surface of a flexible object comprises a piezoelectric film element 1 and an insulating leveling layer 5, wherein the piezoelectric film element 1 is embedded in the center of the insulating leveling layer 5 and forms a core layer of the sensor with the insulating leveling layer, the upper side and the lower side of the core layer are flexible packaging plates, electrodes 2 are arranged on the positions, corresponding to the piezoelectric film element 1, of the flexible packaging plates, the sizes and the shapes of the electrodes 2 are the same as those of the piezoelectric film element 1, the electrodes 2 and welding points 7 on the flexible packaging plates are connected through electrode leads 6, silk-screen adhesive bonding layers 4 are arranged on the positions, corresponding to the insulating leveling layer 5, of the flexible packaging plates, welding holes 8 are formed in the silk-screen adhesive bonding layers 4 so that the sensor is packaged in an adhesive mode and welded by external leads, and insulating protection layers 3 are arranged on the outer sides of the flexible packaging plates. The arrangement of the welding point and the welding hole is beneficial to double-sided welding and convenient to use. According to the invention, non-adhesive electrical connection is adopted among the layer structures, so that the piezoelectric film is in a one-dimensional stress state as much as possible.
The piezoelectric film element can be a piezoelectric polymer such as PVDF, PZT/PVDF, PVDF-TrFE and the like and a composite material thereof, has piezoelectric performance after polarization treatment, and is cut into a piezoelectric film element with a certain geometric shape and size by adopting a drilling tool or a laser cutting mode.
The insulating leveling layer is an unpolarized film with the same material and thickness as the piezoelectric film element, does not have piezoelectric performance, is provided with an embedded hole which has the same geometric shape as the piezoelectric film and has a slightly larger size than the piezoelectric element, and after the piezoelectric film element is embedded into the leveling layer, a tiny gap is reserved between the leveling layer and the edge of the piezoelectric film for transverse deformation of the piezoelectric film element.
The outer edge of the piezoelectric film element and the inner edge of the embedded hole on the insulating pad layer are provided with 0.1mm gaps, and the micro gaps can be preset gaps for in-plane expansion deformation of the piezoelectric film element when the piezoelectric film element is pressed out of the plane and can also avoid short circuits of the upper electrode and the lower electrode.
The upper flexible packaging plate, the lower flexible packaging plate and the core layer of the sensor are pressed together in a vacuum environment, so that the contact surface between the piezoelectric film element and the electrode in the sensor and the preset gap between the piezoelectric film element and the insulating leveling layer are all in the vacuum environment, and the influence of the internal pressure on the measurement result is eliminated.
The flexible packaging plate is characterized in that a polyester film or PET (polyethylene terephthalate) is used as a substrate, conductive electrodes, leads and welding points with certain sizes and shapes are printed on the flexible packaging plate by adopting FPC (flexible printed circuit) technology, the sizes and the shapes of the electrodes are the same as those of the piezoelectric film element, the welding points are reserved at symmetrical positions of the tail ends of the electrodes respectively, symmetrical welding holes are formed in the positions of the welding points, which are about the vertical symmetrical axes of the electrodes, of the welding points, and the diameters of the welding holes are larger than that of the welding points. The printed circuit-free area of the packaging plate is covered with an adhesive layer, and the thickness of the adhesive layer is consistent with that of the printed electrode.
The embodiment of the invention provides a manufacturing method of a pressure measuring sensor suitable for a shock wave on the surface of a flexible object, which comprises the following specific steps:
s1: the PVDF piezoelectric film after polarization is provided, the PVDF is polyvinylidene fluoride, and the PVDF has piezoelectric performance after polarization. A round piezoelectric film element is cut from the whole piezoelectric film by adopting a laser cutting mode, the round piezoelectric film element has a thickness of 52 mu m and a diameter of 6mm, burrs and oxide layers are removed from the edge, and the piezoelectric film element is soaked and cleaned by adopting alcohol/acetone to remove impurities and short circuit areas possibly generated by cutting.
S2: an unpolarized PVDF film is provided which has no piezoelectric properties and is an insulating material. The thickness of the film is 52 mu m, the film is perforated in a laser cutting mode to form embedded holes with the diameter of 6.2mm, and welding holes which are bilaterally symmetrical are formed at a certain position relative to the embedded holes, the diameters are all 2mm, and the insulating film after perforation is cut to be used as a core layer leveling layer;
s3: the packaging board manufactured by the FPC circuit technology is provided, a polyimide film is adopted as a packaging board substrate, the thickness of the film is 12 mu m, an electrode 2 on the packaging board is in a round shape with the thickness of 15 mu m and the diameter of 6mm, the width of an electrode lead 6 is 1mm, the thickness of the electrode lead is 15 mu m, and the lead adopts a multi-section bending line so as to prevent the problem of disconnection of a connecting point caused by the deformation process of a pressure gauge in the plane. The tail of the lead is provided with a through hole welding point 7 with the diameter of 1mm, and the welding point 7 is provided with a welding hole 8 with the diameter of 2mm at the vertical diameter symmetry position of the electrode 2, as shown in fig. 2. The silk screen plate provided with the hollowed-out pattern complementary with the printed circuit pattern carries out silk screen printing glue on the non-circuit area on the packaging board, the thickness of the glue scraping pressure control glue layer is adjusted to be consistent with that of the printed circuit, and the flexible packaging board with the bonding layer 4 and the conductive circuit (comprising the electrode 2, the lead 6 and the welding hole 7) is obtained;
s4: completely bonding the leveling layer obtained in the step S2 with the adhesive layer of the bottom packaging plate, exposing a circular electrode area on the bottom packaging plate through an embedded hole formed in the insulating leveling layer, and then mounting the piezoelectric film element 1 obtained in the step S1 into the embedded hole, wherein the lower surface of the piezoelectric film element is in direct contact with the bottom electrode to realize electric connection;
s5: the step S3 is repeated to obtain a top package plate of the same configuration and size as it, the bonded core layer (including the insulating pad layer and the piezoelectric film element) and bottom package plate assembly is transferred to a vacuum operation box, and the top package plate with the bonding layer 4 and the circuit (including the electrode 2, the lead 6 and the soldering hole 7) and the bottom package plate are symmetrically attached to the core layer under vacuum environment, forming a double-sided symmetrical sandwich manometer. When the package board is adhered to the core layer, the positions of the welding point 7 and the welding hole 8 on the top package board and the welding hole 8 on the bottom package board are respectively corresponding to the positions of the welding hole 8 and the welding point 7 on the bottom package board, and the positions of the welding point 7 and the welding hole correspond to the welding holes on the leveling layer 5. In addition, the upper surface of the piezoelectric film element 1 is in direct contact electrical connection with the electrode 2 on the top package plate. And (3) performing pressure fit on the pressed pressure gauge, and then cutting the redundant area to form the appearance of the pressure gauge.
In the embodiment, when no external load acts, two sides of the piezoelectric film element in the inner core layer of the pressure gauge are electrically connected with the electrodes on the top and bottom packaging plates freely and in contact through internal negative pressure, and when the pressure gauge bears external pressure load, the electrical connection is more stable; in addition, in the embodiment, the diameter of an embedded hole formed in the insulating pad leveling layer in the core layer is slightly larger than that of the piezoelectric film element, so that the element can be freely deformed in the in-plane direction under the action of out-of-plane pressure, the one-dimensional stress state of the piezoelectric film element is ensured, and the stability of the force-electricity sensitivity coefficient of the pressure gauge is facilitated.
In the embodiment, the pressure gauge is of a sandwich structure, the thickness of the top and bottom packaging plates is uniform, the insulating pad layer is made of unpolarized films which are made of the same material and have the same thickness as the piezoelectric film element, so that the thickness uniformity of the initial configuration of the pressure gauge is ensured, the uniformity of the whole pressure deformation of the core layer material in the pressure process is also ensured, and the problems of deformation disharmonic and local stress concentration on the core layer can be effectively eliminated.
In the embodiment, the final packaging stage of the internal structure of the pressure gauge is performed in a vacuum environment, so that the pressure gauge is well electrically connected with two sides of the piezoelectric film in the atmospheric pressure and higher pressure environment test process, and the measurement accuracy and the high pressure resolution are ensured during the pressure test of the same magnitude as the atmospheric pressure. The invention has the application background of measuring the shock wave on the surface of a human body, the strength of the shock wave is about 0.1-1 MPa, and the problem of internal air pressure interference can be solved by packaging the shock wave under a vacuum environment.
In this embodiment, the pad layer in the core layer is provided with openings at the positions of the welding points and the welding holes of the package plates in addition to the embedded holes, and when the package is pressed, the welding points of the top package plate correspond to the welding holes of the bottom package plate, and the welding points on the similar bottom package plate correspond to the welding holes of the top package plate; because the through hole bonding pad is adopted as the welding point in the embodiment, after the pressure gauge is manufactured, the external electric wires can be directly welded on the two sides of the pressure gauge, so that the pressure gauge is convenient to paste on the surface of the structure and to wire in the follow-up process.
In this embodiment, the core layer and the packaging plate may be fabricated in batches by using the array template, so that the manometer with the same material, packaging process and pressing pressure is fabricated in batches, so as to reduce individual variability of the manometer.
Shock wave measurement and sensorThe sensitivity coefficient calibration experiment is based on the shock tube experimental device to generate loading shock waves, the loading shock waves are measured through the standard PCB 113B24 standard pressure sensor, the self-made sensor is stuck on the wave-facing surface of the simulated flexible silicon rubber target body, and the measurement result of the self-made sensor is compared with the standard PCB sensor, as shown in figure 3. The self-made pressure sensor provided by the invention can accurately measure the steep rising edge and the slower falling edge of the shock wave, and is consistent with the measurement result of the standard pressure sensor. In addition, by loading the impact waves with different intensities on the group of pressure sensors provided by the invention, the relation between the charge density and the pressure generated by the sensors can be compared, and the fitting can be obtainedq=Q/A=kpWhereinq(pc/mm 2 ) The amount of charge generated per unit area of the piezoelectric element,Q(pc) is the amount of charge produced by the sensor,A(mm 2 ) For the sensitive area of the piezoelectric element inside the sensor,k (pc/N) is the sensor nominal sensitivity coefficient,p (MPa) is the stress to which the sensor is subjected. By adopting the method provided by the invention, 10 sensors manufactured in the same batch are subjected to shock wave pressure calibration, and the result is shown in figure 4, and the fitted nominal sensitivity coefficient is about 114.6pC/N. The sensor provided by the invention has small individual difference, high sensitivity coefficient and stability.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (7)
1. The manufacturing method of the pressure measuring sensor suitable for the shock wave on the surface of the flexible object is characterized by comprising the following steps of: the sensor comprises a piezoelectric film element (1) and an insulating leveling layer (5), wherein the piezoelectric film element (1) is embedded in the center of the insulating leveling layer (5) and forms a core layer of the sensor with the insulating leveling layer, the upper side and the lower side of the core layer are flexible packaging boards, electrodes (2) are arranged on the flexible packaging boards at positions corresponding to the piezoelectric film element (1), the sizes and the shapes of the electrodes (2) are the same as those of the piezoelectric film element (1), the electrodes (2) and welding points (7) on the flexible packaging boards are connected through electrode leads (6), silk-screen adhesive bonding layers (4) are arranged on the flexible packaging boards at positions corresponding to the insulating leveling layer (5), welding holes (8) are formed in the silk-screen adhesive bonding layers (4) so as to facilitate bonding packaging and external lead welding of the sensor, and insulating protection layers (3) are arranged on the outer sides of the flexible packaging boards;
the specific steps are as follows,
s1-providing a polarized piezoelectric polymer or composite material film thereof, cutting a circular piezoelectric film element (1) from the whole film by adopting a laser cutting or punching mode, removing burrs and oxide layers at the edge, soaking and cleaning by adopting alcohol/acetone, and removing impurities and possibly short-circuit areas generated by cutting;
s2-providing unpolarized piezoelectric polymer and composite material films thereof, carrying out perforation treatment on the films by adopting a laser cutting or perforating mode to form embedded holes, and opening bilaterally symmetrical welding holes at a certain position relative to the embedded holes, and cutting the perforated films into the shape and the size of the sensor to serve as an insulating pad layer (5) of the sensor;
s3-providing a flexible packaging board manufactured by FPC circuit technology, providing a silk screen plate with hollowed-out patterns complementary with printed circuit patterns, carrying out silk-screen glue on a non-circuit area on the packaging board, and adjusting the thickness of a glue scraping pressure control glue layer to be consistent with the thickness of the printed circuit to obtain the flexible packaging board with a silk-screen glue bonding layer (4) and a conductive circuit, wherein the conductive circuit comprises an electrode (2), a lead (6) and a welding hole (7);
s4, completely bonding the insulating pad layer (5) obtained in the step S2 with the adhesive layer of the bottom packaging plate, exposing a circular electrode area on the bottom packaging plate through an embedded hole formed in the insulating pad layer (5) of the core layer, and then installing the piezoelectric film element (1) obtained in the step S1 into the embedded hole, wherein the lower surface of the piezoelectric film element (1) is in direct contact with the bottom electrode to realize electric connection, so that a combined structure formed by the core layer and the bottom packaging plate is obtained;
s5-repeating the step S3 to obtain a top flexible packaging plate with the same configuration and the same size as the top flexible packaging plate, transferring the sandwich insulating gasket layer and piezoelectric film element combined structure bonded by the step S4 and the top packaging plate to a vacuum operation box, symmetrically attaching the top flexible packaging plate with a silk-screen adhesive bonding layer (4) and a conductive circuit and the bottom flexible packaging plate to the insulating gasket layer (5) in a vacuum environment to form a double-sided symmetrical sandwich type pressure gauge, performing pressure lamination on the laminated pressure gauge, and then cutting redundant areas to form the appearance of the pressure gauge.
2. The method for manufacturing the sensor for measuring the pressure of the shock wave on the surface of the flexible object according to claim 1, wherein the method comprises the following steps: in the step S5, when the flexible packaging board is bonded to the insulating leveling layer (5), the positions of the welding point (7) and the welding hole (8) on the top packaging board are controlled to correspond to the positions of the welding hole (8) and the welding point (7) on the bottom packaging board respectively, and the positions of the welding point and the welding hole correspond to the welding hole opened on the insulating leveling layer (5); the upper surface of the piezoelectric film element (1) is in direct contact and electric connection with the electrode (2) on the top flexible packaging plate, so that the piezoelectric film is in a one-dimensional stress state when being pressed out of the plane.
3. The method for manufacturing the sensor for measuring the pressure of the shock wave on the surface of the flexible object according to claim 1, wherein the method comprises the following steps: the piezoelectric film element (1) is a piezoelectric high polymer and a composite material thereof.
4. A method of manufacturing a sensor for measuring pressure of a shockwave on a surface of a flexible object according to claim 3, wherein: the insulating leveling layer (5) is an unpolarized film with the same material and thickness as the piezoelectric film element (1), the insulating leveling layer does not have piezoelectric property, the insulating leveling layer (5) is provided with an embedded hole with the same geometric shape as the piezoelectric film element (1) and slightly larger than the piezoelectric element in size, and the piezoelectric film element (1) and the insulating leveling layer (5) form a sensor core layer with the same thickness through the embedded hole.
5. The method for manufacturing the sensor for measuring the pressure of the shock wave on the surface of the flexible object according to claim 4, wherein the method comprises the following steps: the outer edge of the piezoelectric film element (1) and the inner edge of the embedded hole on the insulating pad layer (5) are provided with a gap of 0.1 mm.
6. The method for manufacturing the sensor for measuring the pressure of the shock wave on the surface of the flexible object according to claim 5, wherein the method comprises the following steps: the contact surface between the piezoelectric film element (1) and the electrode (2) in the sensor and the preset gap between the piezoelectric film element (1) and the insulating pad layer (5) are all vacuum environments.
7. The method for manufacturing the sensor for measuring the pressure of the shock wave on the surface of the flexible object according to claim 6, wherein the method comprises the following steps: the flexible packaging board comprises a polyester film or PET film substrate, a metal electrode, a lead, an adhesive layer, a welding point and a welding hole, wherein the welding point is reserved at the symmetrical position of the tail end of the electrode, the welding point (7) is provided with the welding hole (8) at the symmetrical vertical symmetrical position relative to the vertical symmetrical axis of the electrode, the diameter of the welding hole (8) is larger than the diameter of the welding point (7) by 1mm, the adhesive layer (4) is coated on the flexible packaging board in a silk screen printing mode in the areas except the electrode, the lead, the welding point and the welding hole, and the thickness of the adhesive layer (4) is consistent with that of the printed electrode and the electrode lead.
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