CN113430601A - Pulse electroplating method for solving color difference of appearance of thin plate - Google Patents
Pulse electroplating method for solving color difference of appearance of thin plate Download PDFInfo
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- CN113430601A CN113430601A CN202110659288.3A CN202110659288A CN113430601A CN 113430601 A CN113430601 A CN 113430601A CN 202110659288 A CN202110659288 A CN 202110659288A CN 113430601 A CN113430601 A CN 113430601A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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Abstract
The invention discloses a pulse electroplating method for solving the appearance chromatic aberration of a thin plate, which is characterized by comprising the following steps of: the method comprises the following steps of (1) placing a thin plate to a first conveying section through a plate placing machine, and conveying the thin plate to an ultrasonic pickling section for pickling; (2) after the pickling is finished, the sheet is conveyed to a feeding steering machine through a conveying section II, and after the sheet is steered, the sheet is conveyed to a pickling section through an automatic feeding machine to be pickled; (3) conveying the copper-plated copper to a copper plating cylinder after acid pickling, wherein the copper plating cylinder is divided into 7 sections, each section is divided into set waveform parameters, and the intensity of reverse current in the waveform parameters is changed from strong to weak; (4) and after copper plating is finished, conveying the copper plate to an automatic blanking machine for blanking. The invention solves the phenomenon of appearance color difference by setting different waveform parameters, and can effectively reduce the problems of wrinkling and foaming of the outer-layer circuit dry film caused by the phenomenon.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) manufacturing methods, in particular to a pulse electroplating method for solving the problem of color difference of a thin plate appearance.
Background
Pcb (printed circuit board), also called printed circuit board, and printed circuit board, is an important electronic component, which is a support for electronic components and is a provider of electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing.
The reverse waveform in the production parameters of pulse plating VCP lines in the industry is usually set according to plate thickness or aspect ratio: for example, the plate with the aspect ratio of 8:1 has the positive and negative current intensity ratio of (100%: 180%) and the positive and negative plating time ratio of (20 ms: 1ms), and the plate produced by the parameter or the like has the phenomenon of inconsistent plate surface color after being plated, as shown in figure 2.
Disclosure of Invention
The invention aims to solve the problems that: the pulse electroplating method solves the problem of appearance color difference by setting different waveform parameters, and can effectively reduce the problems of wrinkling and foaming of an outer-layer circuit dry film caused by the phenomenon.
The technical scheme provided by the invention for solving the problems is as follows: a pulse plating method for solving the color difference of the appearance of a thin plate comprises the following steps,
(1) placing the thin plate on the first conveying section through a plate placing machine, and conveying the thin plate to an ultrasonic immersion cleaning section for immersion cleaning;
(2) after the pickling is finished, the sheet is conveyed to a feeding steering machine through a conveying section II, and after the sheet is steered, the sheet is conveyed to a pickling section through an automatic feeding machine to be pickled;
(3) conveying the copper-plated copper to a copper plating cylinder after acid pickling, wherein the copper plating cylinder is divided into 7 sections, each section is divided into set waveform parameters, and the intensity of reverse current in the waveform parameters is changed from strong to weak;
(4) and after copper plating is finished, conveying the copper plate to an automatic blanking machine for blanking.
Preferably, a CCD code reader for reading the two-dimensional code information on the sheet is arranged on the first conveying section.
Preferably, in the step (3), the reverse current is not applied to the first copper plating cylinder, the forward/reverse current ratio of the second copper plating cylinder is 1:1.5, the forward/reverse current ratio of the third copper plating cylinder is 1:1.4, the forward/reverse current ratio of the fourth copper plating cylinder is 1:1.2, the forward/reverse current ratio of the fifth copper plating cylinder is 1:1, the forward/reverse current ratio of the sixth copper plating cylinder is 1:1, and the reverse current is not applied to the seventh copper plating cylinder.
Preferably, the copper plating solution is fed into a front buffer cylinder for buffering before being conveyed to the copper plating cylinder in the step (3).
Preferably, an intermediate buffer cylinder is arranged in the 7-section copper plating cylinder.
Preferably, a rear buffer cylinder and a water washing section are arranged behind the copper plating cylinder.
Preferably, a blanking steering machine is arranged behind the automatic blanking machine.
Compared with the prior art, the invention has the advantages that: the invention divides the copper cylinder into 7 sections, each section separately sets waveform parameters, and the reverse current intensity is optimized from the prior single waveform setting parameter to the combined waveform setting parameter, and the reverse current intensity is gradually reduced from strong to weak to reduce the influence of pulse reverse current, so that the appearance colors of the plates are consistent, and the problems of wrinkling and foaming of the outer layer circuit dry film caused by the phenomenon are reduced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
FIG. 1 is a flow chart of the pulse plating process of the present invention;
fig. 2 is an external view of a plate member after copper plating according to the prior art.
Detailed Description
The embodiments of the present invention will be described in detail with reference to the accompanying drawings and examples, so that how to implement the technical means for solving the technical problems and achieving the technical effects of the present invention can be fully understood and implemented.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the embodiments of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the invention. As used in the description of embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Example 1
A pulse plating method for solving the color difference of the appearance of a thin plate comprises the following steps,
(1) placing the thin plate on the first conveying section through a plate placing machine, and conveying the thin plate to an ultrasonic immersion cleaning section for immersion cleaning;
(2) after the pickling is finished, the sheet is conveyed to a feeding steering machine through a conveying section II, and after the sheet is steered, the sheet is conveyed to a pickling section through an automatic feeding machine to be pickled;
(3) conveying the copper-plated cylinder to a copper-plating cylinder after acid pickling, wherein the copper-plating cylinder is divided into 7 sections, each section is divided into waveform parameters, and the intensity of reverse current in the waveform parameters is changed from strong to weak, wherein reverse current is not applied to the copper-plating cylinder in the first section, the forward-reverse current ratio of the copper-plating cylinder in the second section is 1:1.5, the forward-reverse current ratio of the copper-plating cylinder in the third section is 1:1.4, the forward-reverse current ratio of the copper-plating cylinder in the fourth section is 1:1.2, the forward-reverse current ratio of the copper-plating cylinder in the fifth section is 1:1, the forward-reverse current ratio of the copper-plating cylinder in the sixth section is 1:1, and reverse current is not applied to the copper-plating cylinder in the seventh section.
(4) And after copper plating is finished, conveying the copper plate to an automatic blanking machine for blanking.
In this embodiment, a CCD code reader for reading two-dimensional code information on the sheet is disposed on the first conveying section.
In this embodiment, the copper alloy is buffered in a front buffer cylinder before being transferred to the copper plating cylinder in the step (3).
In this embodiment, an intermediate buffer cylinder is provided in the 7-stage copper plating cylinder.
In the implementation, a rear buffer cylinder and a water washing section are arranged behind the copper plating cylinder.
In this implementation, a blanking steering machine is arranged behind the automatic blanking machine.
Wherein, the setting parameters of the combined waveform are shown in the following table, and the reverse current intensity is weakened from-150% to-100% in sequence.
Example 2
A pulse plating method for solving the color difference of the appearance of a thin plate comprises the following steps,
(1) placing the thin plate on the first conveying section through a plate placing machine, and conveying the thin plate to an ultrasonic immersion cleaning section for immersion cleaning;
(2) after the pickling is finished, the sheet is conveyed to a feeding steering machine through a conveying section II, and after the sheet is steered, the sheet is conveyed to a pickling section through an automatic feeding machine to be pickled;
(3) conveying the copper-plated cylinder to a copper-plating cylinder after acid pickling, wherein the copper-plating cylinder is divided into 7 sections, each section is divided into waveform parameters, and the intensity of reverse current in the waveform parameters is changed from strong to weak, wherein reverse current is not applied to the copper-plating cylinder in the first section, the forward-reverse current ratio of the copper-plating cylinder in the second section is 1:1.5, the forward-reverse current ratio of the copper-plating cylinder in the third section is 1:1.4, the forward-reverse current ratio of the copper-plating cylinder in the fourth section is 1:1.3, the forward-reverse current ratio of the copper-plating cylinder in the fifth section is 1:2, the forward-reverse current ratio of the copper-plating cylinder in the sixth section is 1:1, and reverse current is not applied to the copper-plating cylinder in the seventh section.
(4) And after copper plating is finished, conveying the copper plate to an automatic blanking machine for blanking.
In this embodiment, a CCD code reader for reading two-dimensional code information on the sheet is disposed on the first conveying section.
In this embodiment, the copper alloy is buffered in a front buffer cylinder before being transferred to the copper plating cylinder in the step (3).
In this embodiment, an intermediate buffer cylinder is provided in the 7-stage copper plating cylinder.
In the implementation, a rear buffer cylinder and a water washing section are arranged behind the copper plating cylinder.
In this implementation, a blanking steering machine is arranged behind the automatic blanking machine.
Example 3
A pulse plating method for solving the color difference of the appearance of a thin plate comprises the following steps,
(1) placing the thin plate on the first conveying section through a plate placing machine, and conveying the thin plate to an ultrasonic immersion cleaning section for immersion cleaning;
(2) after the pickling is finished, the sheet is conveyed to a feeding steering machine through a conveying section II, and after the sheet is steered, the sheet is conveyed to a pickling section through an automatic feeding machine to be pickled;
(3) conveying the copper-plated cylinder to a copper-plating cylinder after acid pickling, wherein the copper-plating cylinder is divided into 7 sections, each section is divided into waveform parameters, and the intensity of reverse current in the waveform parameters is changed from strong to weak, wherein reverse current is not applied to the copper-plating cylinder in the first section, the forward-reverse current ratio of the copper-plating cylinder in the second section is 1:1.5, the forward-reverse current ratio of the copper-plating cylinder in the third section is 1:1.4, the forward-reverse current ratio of the copper-plating cylinder in the fourth section is 1:1.3, the forward-reverse current ratio of the copper-plating cylinder in the fifth section is 1:1, the forward-reverse current ratio of the copper-plating cylinder in the sixth section is 1:1, and reverse current is not applied to the copper-plating cylinder in the seventh section.
(4) And after copper plating is finished, conveying the copper plate to an automatic blanking machine for blanking.
In this embodiment, a CCD code reader for reading two-dimensional code information on the sheet is disposed on the first conveying section.
In this embodiment, the copper alloy is buffered in a front buffer cylinder before being transferred to the copper plating cylinder in the step (3).
In this embodiment, an intermediate buffer cylinder is provided in the 7-stage copper plating cylinder.
In the implementation, a rear buffer cylinder and a water washing section are arranged behind the copper plating cylinder.
In this implementation, a blanking steering machine is arranged behind the automatic blanking machine.
The foregoing is merely illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the claims. The present invention is not limited to the above embodiments, and the specific structure thereof is allowed to vary. All changes which come within the scope of the invention as defined by the independent claims are intended to be embraced therein.
Claims (7)
1. A pulse electroplating method for solving the problem of color difference of the appearance of a thin plate is characterized by comprising the following steps: the method comprises the following steps of,
(1) placing the thin plate on the first conveying section through a plate placing machine, and conveying the thin plate to an ultrasonic immersion cleaning section for immersion cleaning;
(2) after the pickling is finished, the sheet is conveyed to a feeding steering machine through a conveying section II, and after the sheet is steered, the sheet is conveyed to a pickling section through an automatic feeding machine to be pickled;
(3) conveying the copper-plated copper to a copper plating cylinder after acid pickling, wherein the copper plating cylinder is divided into 7 sections, each section is divided into set waveform parameters, and the intensity of reverse current in the waveform parameters is changed from strong to weak;
(4) and after copper plating is finished, conveying the copper plate to an automatic blanking machine for blanking.
2. The pulse plating method for solving the color difference of the appearance of the thin plate according to claim 1, wherein: and a CCD code reader for reading two-dimensional code information on the thin plate is arranged on the first conveying section.
3. The pulse plating method for solving the color difference of the appearance of the thin plate according to claim 1, wherein: in the step (3), reverse current is not applied to the first section of the copper plating cylinder, the forward and reverse current ratio of the second section of the copper plating cylinder is 1:1.5, the forward and reverse current ratio of the third section of the copper plating cylinder is 1:1.4, the forward and reverse current ratio of the fourth section of the copper plating cylinder is 1:1.2, the forward and reverse current ratio of the fifth section of the copper plating cylinder is 1:1, the forward and reverse current ratio of the sixth section of the copper plating cylinder is 1:1, and reverse current is not applied to the seventh section of the copper plating cylinder.
4. The pulse plating method for solving the color difference of the appearance of the thin plate according to claim 1, wherein: and (4) before being conveyed to the copper plating cylinder in the step (3), the copper plating cylinder is conveyed into a front buffer cylinder for buffering.
5. The pulse plating method for solving the color difference of the appearance of the thin plate according to claim 1, wherein: and a middle buffer cylinder is arranged in the 7-section copper plating cylinder.
6. The pulse plating method for solving the color difference of the appearance of the thin plate according to claim 1, wherein: and a rear buffer cylinder and a water washing section are arranged behind the copper plating cylinder.
7. The pulse plating method for solving the color difference of the appearance of the thin plate according to claim 1, wherein: and a discharging steering machine is arranged behind the automatic discharging machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110659288.3A CN113430601A (en) | 2021-06-15 | 2021-06-15 | Pulse electroplating method for solving color difference of appearance of thin plate |
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| CN202110659288.3A CN113430601A (en) | 2021-06-15 | 2021-06-15 | Pulse electroplating method for solving color difference of appearance of thin plate |
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| CN202110659288.3A Pending CN113430601A (en) | 2021-06-15 | 2021-06-15 | Pulse electroplating method for solving color difference of appearance of thin plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114126244A (en) * | 2021-12-01 | 2022-03-01 | 广德东风电子有限公司 | PCB production process based on laser direct writing exposure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102877098A (en) * | 2012-10-29 | 2013-01-16 | 东莞市若美电子科技有限公司 | Multi-waveband output pulse plating method |
| CN205000002U (en) * | 2015-07-31 | 2016-01-27 | 东莞市威力固电路板设备有限公司 | Perpendicular continuous electroplating equipment of moduleization |
| CN209039623U (en) * | 2018-09-04 | 2019-06-28 | 深圳市金业达电子有限公司 | Wiring board vertical continuous electroplating assembly line |
| CN212293786U (en) * | 2020-06-02 | 2021-01-05 | 东莞市维迅机械科技有限公司 | VCP copper plating system suitable for high thickness-diameter ratio through-hole PCB |
-
2021
- 2021-06-15 CN CN202110659288.3A patent/CN113430601A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102877098A (en) * | 2012-10-29 | 2013-01-16 | 东莞市若美电子科技有限公司 | Multi-waveband output pulse plating method |
| CN205000002U (en) * | 2015-07-31 | 2016-01-27 | 东莞市威力固电路板设备有限公司 | Perpendicular continuous electroplating equipment of moduleization |
| CN209039623U (en) * | 2018-09-04 | 2019-06-28 | 深圳市金业达电子有限公司 | Wiring board vertical continuous electroplating assembly line |
| CN212293786U (en) * | 2020-06-02 | 2021-01-05 | 东莞市维迅机械科技有限公司 | VCP copper plating system suitable for high thickness-diameter ratio through-hole PCB |
Non-Patent Citations (1)
| Title |
|---|
| 马建: "脉冲VCP电镀技术的发展与应用前景分析", 《印制电路信息》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114126244A (en) * | 2021-12-01 | 2022-03-01 | 广德东风电子有限公司 | PCB production process based on laser direct writing exposure |
| CN114126244B (en) * | 2021-12-01 | 2023-07-14 | 广德东风电子有限公司 | PCB production method based on laser direct writing exposure |
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Application publication date: 20210924 |