CN113423217B - Forming method of shell assembly, shell assembly and electronic equipment - Google Patents
Forming method of shell assembly, shell assembly and electronic equipment Download PDFInfo
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- CN113423217B CN113423217B CN202110682877.3A CN202110682877A CN113423217B CN 113423217 B CN113423217 B CN 113423217B CN 202110682877 A CN202110682877 A CN 202110682877A CN 113423217 B CN113423217 B CN 113423217B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- Casings For Electric Apparatus (AREA)
Abstract
The application provides a shell assembly forming method, a shell assembly and electronic equipment. The shell assembly comprises a shell and a conductive block welded on the shell. The molding method of the shell assembly comprises the following steps: and forming the to-be-welded block to enable the to-be-welded block to comprise a conductive block and positioning glue arranged on the conductive block. And adhering one side of the positioning adhesive departing from the conductive block to the shell. And welding the to-be-welded block and the shell to enable at least part of the positioning glue to be heated and volatilized, wherein the conductive block is fixed on the shell and is electrically connected with the shell to form a shell assembly. The forming method of the shell assembly can reduce insufficient solder and empty solder and improve the welding reliability between the to-be-welded block and the shell. The application provides a conducting block closely is fixed in on the casing among casing subassembly and the electronic equipment, and conducting block and casing electricity are connected.
Description
Technical Field
The application relates to the technical field of electronics, in particular to a shell assembly forming method, a shell assembly and electronic equipment.
Background
In order to improve the performance of an antenna in the electronic device for receiving and transmitting electromagnetic wave signals, in the related art, the metal elastic sheet is welded on the inner side surface of the shell, so that the shell is conducted with the metal elastic sheet. However, in the process of welding the metal elastic sheet to the housing, the metal elastic sheet is often loosened, jumped, dropped, and the like due to clamping, so that the metal elastic sheet and the housing are not fixed and electrically connected.
Disclosure of Invention
The application provides a method for forming a shell assembly, which can reduce insufficient solder and empty solder and improve the reliability of welding between a block to be welded and a shell; and a shell assembly and an electronic device, wherein the conductive block is fixed on the shell through welding and is electrically connected with the shell.
In one aspect, the present application provides a method of forming a housing assembly, the method comprising:
forming a block to be welded, so that the block to be welded comprises a conductive block and positioning glue arranged on the conductive block;
bonding one side of the positioning glue, which is far away from the conductive block, on the shell;
and welding the conductive block and the shell to enable at least part of the positioning glue to be heated and volatilized, wherein the conductive block is fixed on the shell and is electrically connected with the shell to form a shell assembly.
In another aspect, the present application further provides a housing assembly manufactured by the method for molding the housing assembly.
In another aspect, the present application further provides an electronic device, which includes a main board, a reference ground and the housing assembly, wherein the main board is disposed in the housing, the reference ground is disposed on the main board, and the conductive block deviates from one side of the housing and is electrically connected to the reference ground.
The application provides a casing assembly's forming method, through set up the positioning glue on the conducting block, make the conducting block through the welding between conducting block and the casing of positioning glue again behind the casing adhesion to because the conducting block passes through the positioning glue and casing is pre-fixed, the conducting block appears beating, dislocation, the problem that drops when reducible or avoid welding, and then reduces rosin joint, empty solder joint, the improvement treats the reliability of welding between welding block and the casing. In addition, owing to at the in-process of welding conducting block and casing, the location between conducting block and the casing is glued and is heated volatilizing, consequently the conducting block can closely be fixed in on the casing among the casing subassembly and the electronic equipment that this application provided, realizes conducting block and casing and is connected and switch on. In an application scenario, the shell is grounded through the conductive block, and the influence of the shell on the receiving and transmitting antenna signals of the electronic equipment is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below.
FIG. 1 is a schematic flow chart of a method for forming a housing assembly according to an exemplary embodiment of the present disclosure;
FIG. 2 is a schematic flow chart illustrating another method for forming a housing assembly according to an exemplary embodiment of the present disclosure;
FIG. 3 is a schematic flow chart of step 110 of the method of forming the housing assembly of FIG. 2;
FIG. 4 is a schematic flow chart of step 117 of the method of forming the housing assembly of FIG. 2;
fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
FIG. 6 is a schematic structural diagram of the electronic device shown in FIG. 5 including a housing assembly, a main board and a ground reference;
fig. 7 is a schematic structural diagram of a housing assembly of the electronic device shown in fig. 6.
Detailed Description
In order to implement a wireless communication function, a variety of antennas are disposed inside a communication electronic device such as a mobile phone, however, a housing of the electronic device (e.g., a middle frame and a front shell of the mobile phone) is often made of a metal material to meet requirements such as strength, and thus interference is easily caused to signals transmitted and received by the antennas. Through the technical scheme that the metal elastic sheet is welded inside the shell and the shell is grounded through the metal elastic sheet, the interference of the shell to the antenna receiving and transmitting signals can be reduced. In addition, in an electronic device that realizes wireless communication by using a housing (e.g., a middle frame of a mobile phone) as a radiator to receive and transmit antenna signals, a metal elastic sheet is welded inside the housing, so that the housing is electrically connected with a radio frequency module in the electronic device through the metal elastic sheet, thereby realizing that the housing receives and transmits antenna signals under the control of the radio frequency module.
In the related art, after the metal elastic sheet is clamped on the shell through the clamping claw fixture, the metal elastic sheet and the shell are welded through a spot welding process, so that the metal elastic sheet is fixed on the shell and electrically connected with the shell. When welding a plurality of metal shrapnels, this technical scheme's realization needs to use a large amount of pressure claw tools, and because general metal shrapnel size is less, operating personnel can't guarantee the stability of metal shrapnel at the clamping in-process that carries out metal shrapnel, lead to before the welding or in the welding process, the metal shrapnel because the clamping is lax etc. causes to appear beating, dislocation, drops etc. cause rosin joint, the empty solder joint of certain proportion, can not be better realization metal shrapnel and the fixed of casing and be connected with the electricity. Therefore, the forming method of the shell assembly can reduce insufficient solder and empty solder and improve the welding reliability between the block to be welded and the shell; and a shell assembly and an electronic device, wherein the conductive block is fixed on the shell through welding and is electrically connected with the shell.
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. The embodiments listed in the present application may be appropriately combined with each other.
As shown in fig. 1, fig. 1 is a schematic flow chart of a method for forming a housing assembly according to an embodiment of the present disclosure. The shell assembly comprises a shell and a conductive block welded on the shell. The molding method of the housing assembly includes at least the following steps 101, 102 and 103.
Step 101: and forming the block to be welded to enable the block to be welded to comprise a conductive block and positioning glue arranged on the conductive block.
The to-be-welded block comprises a conductive block and positioning glue arranged on the conductive block. Specifically, the conductive block may be a metal sheet, an alloy sheet, or the like. For example: the conductive block is a copper sheet, a stainless steel sheet, a beryllium copper sheet and the like. The positioning glue is hot melt glue. The positioning glue can be solid glue or liquid glue at normal temperature and can be melted when heated to a certain temperature. The step of forming the blocks to be welded includes forming one block to be welded at a time, or forming a plurality of blocks to be welded at a time.
Step 102: and adhering one side of the positioning adhesive departing from the conductive block to the shell.
It can be understood that the conductive block is bonded to the housing by connecting the conductive block to the housing through the positioning adhesive. Wherein, the casing includes the bottom plate and encloses the all round curb plate of establishing bottom plate a week. When the number of the to-be-welded blocks is one, one side of the positioning glue departing from the conductive block is bonded on the shell, and the conductive block is fixed on the bottom plate or the peripheral side plate of the shell through the positioning glue arranged on the conductive block. When a plurality of blocks to be welded are arranged, adhering one side of the positioning glue, which deviates from the conductive blocks, on the shell comprises sequentially fixing the plurality of conductive blocks on a bottom plate of the shell through the positioning glue arranged on each conductive block; or, fixing a plurality of conductive blocks on the peripheral side plate of the shell in sequence through positioning glue arranged on each conductive block; or the plurality of conductive blocks are respectively fixed on the bottom plate and the peripheral side plate of the shell through positioning glue arranged on the conductive blocks.
The pre-positioning of the conductive block and the shell can be realized by implementing the step 102, and the jumping, falling and dislocation of the conductive block are reduced or prevented. In addition, the implementation of this scheme need not to provide a plurality of pressure claw tools, compares the mode of conducting block through the positioning adhesive and connect in the casing simple, reliable with the mode of metal shrapnel clamping on the casing in correlation technique, can improve positioning efficiency, reduces manpower, material resources etc..
Step 103: and welding the conductive block and the shell to enable at least part of the positioning glue to be heated and volatilized, wherein the conductive block is fixed on the shell and is electrically connected with the shell to form a shell assembly.
It can be understood that, in the process of welding the conductive block and the shell, at least one of the conductive block and the shell and the solder are melted to form a melting area, the conductive block and the shell have a higher temperature, and since the melting point of the positioning adhesive is lower than the melting points of the conductive block and the shell, the positioning adhesive connected between the conductive block and the shell is melted until being vaporized and volatilized. When the melting area between the conductive block and the shell is cooled and solidified, a connecting welding spot or welding seam is formed, the conductive block is conducted with the shell through the connecting welding spot or welding seam, or the conductive block is directly contacted and conducted with the shell, so that the conductive block is fixed on the shell and is electrically connected with the shell.
When the shell is bonded with the plurality of conductive blocks, the plurality of conductive blocks and the shell can be welded in sequence, so that the positioning glue on the plurality of conductive blocks is heated and volatilized, and the plurality of conductive blocks are fixed on the shell and are electrically connected with the shell.
According to the scheme of clamping the metal elastic sheet through the clamping claw fixtures in the related art, a plurality of clamping claw fixtures are generally required to clamp a plurality of metal elastic sheets respectively, only a small amount of metal elastic sheets can be clamped once, clamping and welding of all the other metal elastic sheets are carried out after welding of the small amount of metal elastic sheets are achieved, otherwise, when the front metal elastic sheet is welded, dislocation and falling of the rear metal elastic sheet occur easily, the whole forming process needs a large amount of manpower and clamping tools, multiple times of clamping and multiple times of welding are required, and production efficiency is low.
The step of welding the plurality of conductive blocks and the shell realizes that the plurality of conductive blocks are completely fixed on the shell and electrically connected with the shell through one-time bonding and welding procedures, so that the production efficiency can be greatly improved, and the requirements on manpower and material resources are reduced.
The application provides a casing assembly's forming method, through set up the positioning glue on the conducting block, make the conducting block through the welding between conducting block and the casing of positioning glue adhesion back on the casing again to because the conducting block passes through positioning glue and casing pre-fixation, the conducting block appears beating, dislocation, the problem that drops when reducible or avoid welding, and then reduces rosin joint, empty solder joint, improves and treats the welded reliability between welding block and the casing. In addition, because at the in-process of welding conducting block and casing, the location between conducting block and the casing is glued and is heated volatilize, consequently the conducting block can closely be fixed in on the casing among the casing subassembly and the electronic equipment that this application provided, realizes the fixed connection and the switch-on of conducting block and casing. In an application scenario, the shell is grounded through the conductive block, and the influence of the shell on the receiving and transmitting antenna signals of the electronic equipment is reduced.
In addition, for the special-shaped blocks to be welded (such as L-shaped blocks to be welded) and the blocks to be welded which need to be fixed at the bent part of the shell, the shell and the blocks to be welded are pre-fixed by the positioning glue, so that the stability of the blocks to be welded can be improved, poor welding is reduced, and the quality of the shell assembly is improved.
The following embodiments specifically describe the molding method of the housing assembly provided by the present application in terms of the housing assembly including a housing and a plurality of conductive bumps welded on the housing.
Fig. 2 is a schematic flow chart of another method for forming a housing assembly according to an embodiment of the present disclosure, as shown in fig. 2. The molding method of the housing assembly includes steps 110, 111 and 112.
Step 110: and forming the conductive plate.
In one embodiment, as shown in FIG. 3, step 110 includes, but is not limited to, steps 1101 and 1102.
Step 1101: a stamped steel sheet is provided.
Wherein, the steel sheet can be a common steel sheet or a stainless steel sheet.
Step 1102: and arranging a conductive layer on the stamping steel sheet and forming a conductive plate.
The conductive layer on the punched steel sheet can be plated metal or alloy on the punched steel sheet. For example: plating one or more of gold layer, silver layer, nickel layer and copper layer on the punched steel sheet. Optionally, disposing a conductive layer on the stamped steel sheet and forming a conductive plate comprises plating one or more layers of gold on the stamped steel sheet and forming a conductive plate. In this embodiment, a layer of gold is plated on the stamped steel sheet and forms a conductive plate, wherein the gold is plated on the entire surface of the stamped steel sheet.
Step 111: and paving a glue layer on the conductive plate to form a plate to be welded.
In this embodiment, the adhesive layer laid on the conductive plate is a solid adhesive at normal temperature. In one embodiment, the laid adhesive layer is a double-sided adhesive air-melting adhesive. Laying a glue layer on the conductive plate to form a plate to be welded, wherein one bonding surface of the glue layer is stuck on the whole conductive plate to form the plate to be welded. Wherein, the glue layer is laid on the side of the punching steel sheet where the conducting layer is not arranged. In other words, the glue layer and the conductive layer are respectively positioned on two opposite sides of the stamped steel sheet.
Step 112: and die-cutting the board to be welded and forming a plurality of blocks to be welded, wherein the conductive plate after die-cutting forms a conductive block, and the adhesive layer after die-cutting forms positioning adhesive.
Specifically, the plate to be welded is cut according to a pre-designed size or shape, and a plurality of blocks to be welded are formed. Each block to be welded comprises a conductive block and positioning glue arranged on the conductive block. In one embodiment, the size (length x width x height) of each block to be soldered is 2.1mm x 1.5mm x 0.1mm.
It can be understood that the method for molding the to-be-welded block provided by the embodiment can mold a plurality of to-be-welded blocks at one time, reduces the working procedures and improves the efficiency of molding the to-be-welded blocks.
Further, after step 112, the method for molding the housing assembly further includes steps 113, 114, 115, 116, 117, 118 and 119.
Step 113: a separation membrane is provided.
Wherein the separation membrane can be at least one of an adhesive release membrane, a composite release membrane and a non-adhesive release membrane.
Step 114: and determining a plurality of preset positions on the separation membrane, so that the preset positions correspond to the welding parts of the blocks to be welded on the shell one by one.
In other words, a plurality of preset positions are determined on the separation membrane by the welding portions required to weld a plurality of pieces to be welded to the case. Wherein, a preset position corresponds to a setting position of a block to be welded on the separation membrane, and a preset position corresponds to a welding part of the block to be welded on the shell.
Step 115: and respectively arranging a plurality of blocks to be welded at a plurality of preset positions to enable the positioning glue on each block to be welded to deviate from the separation membrane.
The welding method comprises the steps of cutting a separation film into a plurality of blocks to be welded, wherein the blocks to be welded are respectively arranged at a plurality of preset positions, namely, a plurality of blocks to be welded formed by die cutting are respectively pre-fixed at a plurality of preset positions of the separation film. When a plurality of to-be-welded blocks are pre-fixed on the separation film, the conductive block of each to-be-welded block is in contact with the separation film, and the positioning glue of each to-be-welded block faces to one side departing from the separation film.
Step 116: crimping the separation membrane.
Specifically, the separation membrane is rolled so that the shape of the separation membrane is the same as that of the case. In one embodiment, the welding parts of the blocks to be welded on the shell are all positioned on the peripheral side plate of the shell. Wherein, the peripheral side plate is a rectangular frame. The rolling separation membrane comprises rolling the separation membrane to form the separation membrane into a rectangular frame, and enabling blocks to be welded on the separation membrane to face the outside of the separation membrane.
Step 117: and enabling the plurality of blocks to be welded to be opposite to the plurality of parts to be welded on the shell one by one.
It can be understood that, by carrying a plurality of blocks to be welded on the separation film and curling the separation film, the plurality of blocks to be welded on the separation film are opposite to the plurality of parts to be welded on the housing one by one, that is, each block to be welded is opposite to one part to be welded on the housing. Wherein, each block to be welded is opposite to one part to be welded on the shell, which means that each block to be welded faces the part to be welded on the corresponding shell.
Optionally, the peripheral side plate of the casing includes a first frame and a second frame. The orientation of the first frame is different from the orientation of the second frame. In one embodiment, the peripheral side plate is a rectangular frame. The first frame and the second frame are arranged adjacently, namely the first frame and the second frame extend along the length direction and the width direction of the shell respectively, and the orientation of the first frame is intersected with the orientation of the second frame. Of course, in other embodiments, the first frame and the second frame may be disposed opposite to each other, and the orientation of the first frame is opposite to that of the second frame. The plurality of to-be-welded blocks include at least one first to-be-welded block and at least one second to-be-welded block. The first to-be-welded block needs to be welded on the first frame. The second block to be welded needs to be welded to the second frame.
As shown in FIG. 4, step 117 includes, but is not limited to, step 1170 and step 1171.
Step 1170: and enabling at least one first to-be-welded block to be opposite to at least one first to-be-welded part on the first frame one by one.
Step 1171: and enabling at least one second block to be welded to be opposite to at least one second part to be welded on the second frame one by one.
Step 118: and pressing the separation membrane to ensure that one sides of the positioning adhesives on the blocks to be welded, which are deviated from the conductive blocks, are respectively connected to the parts to be welded, which are opposite to the shell.
The pressing separation membrane can be pressed manually or by a mechanical arm.
Step 119: and separating the separation membrane from the plurality of blocks to be welded and forming a prepositioned shell assembly.
Wherein, prepositioning the casing subassembly and a plurality of conducting blocks are pre-fixed on the casing through positioning glue.
It can be understood that, this embodiment can once be with a plurality ofly treat the welding block and bond in the corresponding welding position department of casing through the separation membrane, avoids a plurality ofly to treat the welding block and need bonding process many times, can practice thrift production time, improves and treats a plurality ofly and weld the efficiency of welding block on the casing.
Further, after step 119, the method for molding the housing assembly further includes steps 120, 121, 122, 123 and 124.
Step 120: and installing the pre-positioning shell assembly on the rotary jig.
Step 121: and enabling the conductive block of the first block to be welded to face a welding head.
It can be understood that when the pre-positioning shell assembly is mounted on the rotary fixture, the conductive block of the first block to be welded can be made to face the welding head, and the conductive block of the first block to be welded can also be made to face the welding head by rotating the rotary fixture.
Step 122: welding the first conducting block of waiting to weld with first portion of waiting to weld makes the location of the first piece of waiting to weld is glued and is heated and volatilize, the first conducting block of waiting to weld is fixed in on the first frame and with first frame electricity is connected.
Wherein, the welding the conducting block of the first piece that waits to weld with the first portion that waits to weld includes: and carrying out one or more times of spot welding on the conductive block of the first block to be welded. In this embodiment, the welding of the conductive block of the first to-be-welded block and the first frame is performed by a spot welding process, and the spot welding can make the conductive block of the first to-be-welded block and the first frame tightly contact, thereby improving the reliability of the electrical connection between the conductive block of the first to-be-welded block and the first frame.
Step 123: and rotating the rotary jig to enable the conductive block of the second block to be welded to face the welding head.
Step 124: and welding the conductive block of the second to-be-welded block and the second to-be-welded part to enable the positioning adhesive of the second to-be-welded block to be heated and volatilized, wherein the conductive block of the second to-be-welded block is fixed on the second frame and is electrically connected with the second frame.
Wherein, the welding the second waits to weld the conductive block of piece with the second waits to weld the portion, includes: and carrying out one or more times of spot welding on the conductive block of the second block to be welded. In this embodiment, the conductive block of the second block to be welded and the second frame are welded by a spot welding process, and the spot welding can make the conductive block of the second block to be welded and the second frame closely contact each other, thereby improving the reliability of the electrical connection between the conductive block of the second block to be welded and the second frame.
By arranging the pre-positioning shell assembly on the rotary jig, when the first to-be-welded block and the first frame are welded, the pre-positioning shell assembly can be driven by the rotary jig to rotate, so that the conductive block of the first to-be-welded block faces the welding head. When the second to-be-welded block and the second frame are welded, the pre-positioning shell assembly can be driven by the rotary jig to rotate, so that the second to-be-welded block is the conductive block facing the welding head. It can be understood that the welding of a plurality of welding blocks of treating of a plurality of different positions, different orientations can be once realized to this embodiment, and the shaping casing subassembly, and need not to carry out bonding, welding process many times, improves a plurality of welding efficiencies of treating welding block and casing.
It can be understood that, the method for forming a housing assembly according to the above embodiment may form the housing assembly through one-step forming, bonding and welding, and the housing assembly includes a housing and a plurality of conductive blocks welded to the housing, so that the production efficiency may be greatly improved and the demands for manpower and material resources may be reduced while reducing the cold joints and the empty joints between the conductive blocks and the housing assembly, and improving the reliability of the fixed connection and the electrical connection between the conductive blocks and the housing assembly.
In addition, as shown in fig. 5, the present application also provides an electronic device 100. The electronic device 100 provided by the present application may be a mobile phone, a tablet computer, an e-reader, a handheld computer, a notebook, a netbook, and an Augmented Reality (AR) \ Virtual Reality (VR) device, a media player, a watch, glasses, and the like. The embodiment of the application takes a mobile phone as an example.
As shown in fig. 6, the electronic apparatus 100 includes a housing assembly 1, a main board 2, and a ground 3. The housing assembly 1 is manufactured by the molding method of the housing assembly 1 according to any one of the above embodiments.
Specifically, referring to fig. 6 and 7, the housing assembly 1 includes a housing 10 and one or more conductive blocks 11 welded to the housing 10. The housing 10 includes a bottom plate 101 and a peripheral side plate 102. The bottom plate 101 and the peripheral side plate 102 are integrally formed or connected. The peripheral side plate 102 has a rectangular frame structure. When the number of the conductive bumps 11 is plural, the plural conductive bumps 11 may be disposed at different positions of the housing 10 at intervals.
In one embodiment, the peripheral side plate 102 includes a first frame 120, a second frame 121, a third frame 122, and a fourth frame 123 connected end to end. The plurality of conductive bumps 11 includes five conductive bumps 11. Wherein, the volume key 103 is disposed on the second frame 121. The third frame 122 is provided with a USB interface 104. Three conductive blocks 11 are soldered on the second frame 121 and close to the volume key 103. Another conductive piece 11 is soldered to the third frame 122, close to the USB interface 104. The remaining one of the conductive pieces 11 is welded to the first bezel 120.
The main board 2 is provided in the housing 10. The reference ground 3 is provided on the main board 2. The side of the conductive block 11 facing away from the housing 10 is electrically connected to the reference ground 3. Optionally, the side of the conductive block 11 facing away from the housing 10 abuts against the ground reference 3.
In the electronic device 100 provided by the application, the conductive block 11 is fixed on the housing 10 by welding and electrically connected with the housing 10, which is beneficial to electrically connecting the housing 10 with the reference ground 3 on the main board 2 through the conductive block 11 and reducing the influence of the housing 10 on the antenna performance; alternatively, the housing 10 is connected to the rf module in the electronic device 100 through the conductive block 11, so that the housing 10 becomes an antenna radiator, and the housing 10 transmits and receives antenna signals.
The foregoing are some embodiments of the present application, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations are also regarded as the scope of protection of the present application.
Claims (11)
1. A method of forming a housing assembly, the method comprising:
forming a plurality of blocks to be welded to enable the blocks to be welded to comprise conductive blocks and positioning glue arranged on the conductive blocks;
determining a plurality of preset positions on a separation membrane, and enabling the preset positions to correspond to welding parts of the blocks to be welded on the shell in a one-to-one mode;
respectively arranging a plurality of blocks to be welded at a plurality of preset positions, and enabling the positioning adhesive on each block to be welded to be away from the separation membrane;
bonding one sides, away from the conductive blocks, of the positioning glues of the blocks to be welded on the separation film to the welding parts on the shell;
and welding the conductive block and the shell to enable at least part of the positioning glue to be heated and volatilized, wherein the conductive block is fixed on the shell and is electrically connected with the shell to form a shell assembly.
2. The method of claim 1, wherein the forming the plurality of to-be-welded blocks to include conductive blocks and positioning glue disposed on the conductive blocks comprises:
forming a conductive plate;
paving a glue layer on the conductive plate to form a plate to be welded;
and die-cutting the board to be welded and forming a plurality of blocks to be welded, wherein the conductive plate after die-cutting forms a conductive block, and the adhesive layer after die-cutting forms positioning adhesive.
3. The method of claim 2, wherein the forming the conductive plate comprises:
providing a stamped steel sheet;
and arranging a conductive layer on the stamping steel sheet and forming a conductive plate.
4. The method according to claim 3, wherein before the step of adhering the positioning glue of the pieces to be soldered on the separation film on the side away from the conductive pieces to the soldering portions on the case, the method further comprises:
crimping the separation membrane.
5. The method according to claim 4, wherein the adhering the side of the positioning glue of the blocks to be welded on the separation film, which faces away from the conductive blocks, to the welding part on the shell comprises:
the welding blocks to be welded are opposite to the parts to be welded on the shell one by one;
pressing the separation film to enable one sides, away from the conductive blocks, of the positioning adhesives on the blocks to be welded to be connected to the corresponding parts to be welded respectively;
and separating the separation film from the plurality of blocks to be welded to form a prepositioned shell assembly.
6. The method of claim 5, wherein the housing includes a first bezel and a second bezel, the first bezel oriented differently than the second bezel; the plurality of blocks to be welded comprise at least one first block to be welded and at least one second block to be welded;
the one-to-one correspondence of the plurality of to-be-welded blocks and the plurality of to-be-welded parts on the shell comprises:
at least one first piece to be welded is opposite to at least one first part to be welded on the first frame one by one;
and enabling at least one second block to be welded to be opposite to at least one second part to be welded on the second frame one by one.
7. The method of claim 6, wherein before welding the conductive block to the housing to volatilize at least a portion of the positioning adhesive, the conductive block being secured to the housing and electrically connected to the housing to form a housing assembly, the method further comprises:
and installing the pre-positioning shell assembly on the rotary jig.
8. The method of claim 7, wherein the welding the conductive block to the housing to volatilize at least a portion of the positioning adhesive by heating, the conductive block being fixed to and electrically connected to the housing, comprises:
enabling the conductive block of the first block to be welded to face a welding head;
welding the conductive block of the first block to be welded and the first part to be welded to enable the positioning adhesive of the first block to be welded to be heated and volatilized, wherein the conductive block of the first block to be welded is fixed on the first frame and is electrically connected with the first frame;
rotating the rotary jig to enable the conductive block of the second block to be welded to face the welding head;
and welding the conductive block of the second to-be-welded block and the second to-be-welded part to enable the positioning adhesive of the second to-be-welded block to be heated and volatilized, wherein the conductive block of the second to-be-welded block is fixed on the second frame and is electrically connected with the second frame.
9. The method of claim 8,
the welding the conductive block of first piece that waits to weld with first portion that waits to weld includes:
performing one or more spot welding on the conductive block of the first block to be welded;
the welding the second treats the conducting block of the soldering lug with the second treats the soldering part, includes:
and carrying out one or more times of spot welding on the conductive block of the second block to be welded.
10. A housing component made by the method of any one of claims 1 to 9.
11. An electronic device, comprising a main board, a reference ground and a housing assembly as claimed in claim 10, wherein the main board is disposed in the housing, the reference ground is disposed on the main board, and a side of the conductive block facing away from the housing is electrically connected to the reference ground.
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| CN113423217A (en) | 2021-09-21 |
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