CN113410721A - Automatic wire welding device - Google Patents

Abstract

The invention discloses an automatic wire welding device, which comprises a control box, a wire welding device and a wire welding device, wherein the control box is provided with a wire welding head; the cover body is arranged above the control box; the wire feeding device is movably arranged above the control box; the peeling and cutting device is fixedly arranged on the control box and is arranged behind the wire feeding device; the welding assisting device is arranged on the side edge of the peeling and cutting device; the first transfer device and the second transfer device are movably arranged on the control box, the first transfer device clamps the wire rods cut off by the peeling and cutting device, and the second transfer device clamps the wire rods on the first transfer device for conveying; the second transfer device is used for transferring the wire to the soldering device; the jig conveying device is movably arranged on the control box and below the soldering tin device, and the soldering tin device welds the wire rods on products in the jig conveying device. The invention effectively realizes the automatic wire welding function.

Description

Automatic wire welding device

Technical Field

The invention relates to the technical field of automation equipment, in particular to an automatic wire welding device.

Background

At present, an electronic factory welds electronic components and electronic wires by 80% manually by workers, the electronic wires are customized by a company specially producing the electronic wires and then welded on the electronic components for sale, the welding of the electronic components and the electronic wires is basically realized by welding the electronic components and the electronic wires together by a tin melting and solidifying method, the manual welding has complex processes and is harmful to human bodies due to smoke generated during tin soldering, the damage is irreversible for old staff who insist on the tin soldering position for a long time, the manual welding cost and the efficiency are high for a human unit, the number of people who are willing to weld for a long time is small, new staff need to completely master the welding technology and need short time training and practical operation, a large amount of products are produced in the period, and the loss is brought to the company.

The automatic wire bonding machine is selectively researched and developed by a few factories, the existing wire bonding machine in the market has single function and single product capable of being welded, and the diversity of products in an electronic factory cannot be solved; only one product can be welded at a time, the welding efficiency is low, and the cost recovery of equipment users is slow. Therefore, in view of the defects of the above solutions in actual manufacturing and implementation, the present invention provides an automatic wire bonding apparatus, which is modified and improved, and is based on the spirit and concept of the solution, and is created by the assistance of professional knowledge and experience, and after many kinds of puzzles and experiments, so as to solve the above problems.

Disclosure of Invention

It is an object of the present invention to provide an automatic wire bonding apparatus to solve the above problems.

The automatic wire welding device can be realized by the following technical scheme:

the invention relates to an automatic wire welding device, which comprises a control box, wherein a central control board is arranged in the control box; the cover body is arranged above the control box; the wire feeding device is movably arranged above the control box; the peeling and cutting device is fixedly arranged on the control box and is arranged behind the wire feeding device and used for peeling or cutting the wire rods conveyed by the wire feeding device; the welding assisting device is arranged on the side edge of the peeling and cutting device; the first transfer device and the second transfer device are movably arranged on the control box, the first transfer device clamps the wire rods cut off by the peeling and cutting device, and the second transfer device clamps the wire rods on the first transfer device for conveying; the second transfer device is used for transferring the wire to the soldering device; the jig conveying device is movably arranged on the control box and below the soldering tin device, and the soldering tin device welds the wire rods on products in the jig conveying device.

In one embodiment, the wire feeding device comprises a first X-axis guide rail, a first motor, a first Y-axis guide rail, a first mounting plate, a second motor, a wire leveling assembly, a wire pressing cylinder and a wire feeding motor; the first X-axis guide rail is horizontally arranged on the control box; the first motor is fixedly arranged on the first X-axis guide rail; the first Y-axis guide rail is movably arranged on the first X-axis guide rail and can horizontally move on the first X-axis guide rail under the driving of the first motor; the first mounting plate is movably arranged on the first Y-axis guide rail and can move longitudinally on the first Y-axis guide rail under the driving of the second motor; the wire leveling assembly is fixedly arranged above the first mounting plate; the wire pressing cylinder and the wire feeding motor are sequentially arranged behind the wire leveling assembly.

In one embodiment, the wire leveling assembly comprises a plurality of pulley blocks, each pulley block comprising a plurality of pulleys, the plurality of pulleys being arranged in parallel and equidistant, and the wire passing through the plurality of pulleys in sequence.

In one embodiment, the peeling and cutting device comprises a fixed seat, a peeling and cutting motor, a lifting screw rod, a first cutter and a second cutter; the fixed seat is fixedly arranged on the control box; the peeling and wire cutting motor is fixedly arranged above the fixed seat, the lifting screw rod is arranged below the peeling and wire cutting motor, and the first cutting knife is fixedly arranged on the fixed seat and is flush with the height of a wire of the wire feeding device; the second cutter is arranged on the lifting screw rod and right above the first cutter, and is matched with the first cutter to peel or cut off the wire.

In one embodiment, the soldering aid device comprises a solder paste furnace and a rosin box, wherein the solder paste furnace and the rosin box are respectively arranged on one side of the fixed seat.

In one embodiment, the first transfer device comprises a second X-axis guide rail, a third motor, a second Y-axis guide rail, a fourth motor, a second mounting plate, a first wire clamping claw and a first wire clamping cylinder; the second X-axis guide rail is fixed on the control box and is arranged behind the peeling and cutting device; the third motor is arranged on the second X-axis guide rail; the second Y-axis guide rail is movably arranged on the second X-axis guide rail and is driven by the third motor to horizontally move along the second X-axis guide rail; the fourth motor is fixedly arranged on the second Y-axis guide rail; the second mounting plate is movably arranged on the second Y-axis guide rail and can move longitudinally on the second Y-axis guide rail under the driving of the fourth motor; the first wire clamping cylinder is arranged on the second mounting plate, and the first wire clamping claw is arranged above the first wire clamping cylinder.

In one embodiment, the second transfer device comprises a portal frame, a third Y-axis guide rail, a third mounting plate, a fifth motor, a second wire clamping cylinder and a second wire clamping claw; the portal frame is fixedly arranged on the control box; the third Y-axis guide rail is arranged on the portal frame; the third mounting plate is movably arranged on the third Y-axis guide rail; the fifth motor is arranged on the third Y-axis guide rail and drives the third mounting plate to move on the third Y-axis guide rail; the second wire clamping cylinder is arranged on the third mounting plate, and the second wire clamping claw is arranged below the second wire clamping cylinder.

In one embodiment, the soldering device comprises a mounting base, a first Z-axis guide rail, a fourth mounting plate, a sixth motor, at least one group of soldering components and at least one fine adjustment structure; the mounting seat is fixedly arranged on the portal frame; the first Z-axis guide rail is arranged on the mounting seat; the fourth mounting plate is movably arranged on the first Z-axis guide rail; the sixth motor is fixedly arranged on the first Z-axis guide rail and drives the fourth mounting plate to move on the first Z-axis guide rail; at least one fine adjustment structure is arranged on the fourth mounting plate; at least one set of the solder assemblies is disposed below the fine tuning structure, which enables wire bonding operations.

In one of the embodiments, each group of soldering tin assembly comprises a third wire clamping claw, an electric soldering iron and a solder wire feeding structure, the third wire clamping claw clamps the wires conveyed by the second transfer device, and the electric soldering iron and the solder wire feeding structure are matched to solder the wires on the products on the jig conveying device.

In one embodiment, the jig conveying device comprises a jig guide rail, a jig and a jig conveying motor, the jig guide rail is arranged on the control box, the jig is movably arranged on the jig guide rail, and a product to be welded is arranged in the jig; the jig conveying motor is arranged on the jig guide rail and drives the jig to move.

Compared with the prior art, the automatic wire welding device has the beneficial effects that:

according to the automatic wire welding device, the wire is fed through the wire feeding device to peel and cut off the peeling and cutting device, the first transfer device clamps the cut wires and transmits the wires to the second transfer device, the second transfer device clamps the wires and transmits the wires to the soldering device, and the soldering device automatically welds the wires on products in the jig, so that the automatic wire welding function is effectively realized; the wire rods are transferred twice through the first transfer device and the second transfer device, so that the transfer efficiency of the wire rods is improved; a plurality of groups of wire leveling assemblies can be arranged on the wire feeding device according to actual requirements, the wire leveling assemblies are used for leveling a plurality of groups of wires, and then corresponding peeling and cutting are carried out through the matched peeling and cutting devices, so that peeling or cutting of a plurality of wires can be simultaneously carried out at one time, and the production efficiency is effectively improved; also can set up multiunit soldering tin subassembly according to the demand, carry out the soldering tin of wire rod simultaneously through multiunit soldering tin subassembly, realize production efficiency's promotion.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic view of an automatic wire bonding apparatus according to the present invention;

FIG. 2 is a schematic view of the automatic wire bonding apparatus of FIG. 1 with the cover removed;

FIG. 3 is a schematic view of another side view of the automatic wire bonding apparatus of FIG. 2 with the cover removed;

FIG. 4 is a schematic view of the wire feeding device of the automatic wire bonding apparatus of FIG. 2;

FIG. 5 is a schematic diagram of the peeling and cutting device and the welding aid device of the automatic wire bonding apparatus of FIG. 2;

FIG. 6 is a schematic structural view of a first transfer device of the automated bonding apparatus of FIG. 2;

FIG. 7 is a schematic structural view of a second transfer device of the automated bonding apparatus of FIG. 2 according to the present invention;

fig. 8 is a schematic structural diagram of a soldering device in the automatic wire bonding device of the invention shown in fig. 2.

The following are marked in the figure: 11, a control box; 111, a wheel; 112, a support seat; 12, a cover body; 121, an alarm device; 13, a wire feeding device; 131, a first X-axis guide; 132, a first motor; 133, a first Y-axis rail; 134, a first mounting plate; 135, a second motor; 136, a wire leveling assembly; 137, a line pressing cylinder; 138, a wire feed motor; 14, a peeling and cutting device; 141, a fixed seat; 142, a peeling and cutting motor; 143, a lifting screw rod; 144, a first cutter; 145, a second cutter; 146, a waste cartridge; 15, a welding aid device; 151, solder paste oven; 152, a pine aroma box; 16, a first transfer device; 161, a second X-axis guide rail; 162, a third motor; 163, a second Y-axis guide; 164, a fourth motor; 165, a second mounting plate; 166, a first clamping jaw; 167, a first wire clamping cylinder; 17, a second transfer device; 171, a gantry; 172, a stiffener plate; 173, a third Y-axis guide; 174, a third mounting plate; 175, a fifth motor; 176, a second wire clamping cylinder; 177, a second wire clamping claw; 18, a soldering device; 181, a mounting seat; 182, a first Z-axis guide; 183, a fourth mounting plate; 184, a sixth motor; 185, solder assembly; 1851, a third gripper; 1852, electric iron; 1853, providing a solder line structure; 186, a fine tuning structure; 19, a jig conveying device; 191, a jig guide rail; 192, a jig; 193, the jig transports the motor.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "upper", "lower", and the like refer to orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

Further, in the present invention, unless otherwise expressly stated or limited, the first feature may be directly contacting the second feature or may be directly contacting the first or second feature with the second feature therebetween. Also, the first feature being above, on or above the second feature includes the first feature being directly above and obliquely above the second feature, or merely means that the first feature is at a higher level than the second feature. A first feature that underlies, and underlies a second feature includes a first feature that is directly under and obliquely under a second feature, or simply means that the first feature is at a lesser level than the second feature.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-3, an automatic wire bonding apparatus according to the present invention may include a control box 11, a cover 12, a wire feeding device 13, a peeling and cutting device 14, a welding assisting device 15, a first transfer device 16, a second transfer device 17, a soldering device 18, and a jig transfer device 19; a central control board is arranged in the control box 11; the cover body 12 is arranged above the control box 11 and wraps the wire feeding device 13, the peeling and cutting device 14, the welding assisting device 15, the first transfer device 16, the second transfer device 17, the soldering device 18 and the jig conveying device 19; the wire feeding device 13 is movably arranged above the control box 11 and is used for leveling and conveying the welded wire to the peeling and cutting device 14; the peeling and cutting device 14 is fixedly arranged on the control box 11 and behind the wire feeding device 13, and peels or cuts the wire rod conveyed by the wire feeding device 13; the welding assisting device 15 is arranged at the side of the peeling and cutting device 14, after the peeling and cutting device 14 peels the wire on the wire feeding device 13, the wire feeding device 13 moves to the welding assisting device 15 to dip rosin and tin; the first transfer device 16 and the second transfer device 17 are movably arranged on the control box 11, the first transfer device 16 clamps the wire rod cut off by the peeling and cutting device 14, and the second transfer device 17 clamps the wire rod 11 on the first transfer device 16 for conveying; the soldering device 18 is arranged on the second transfer device 17, and the second transfer device 17 transfers the wire rods to the soldering device 18 for welding; the jig conveying device 19 is movably arranged on the control box 11 and below the soldering device 18, and the soldering device 18 welds the wire rod on the product on the jig conveying device 19.

Referring to fig. 1 and fig. 2, in the present embodiment, the control box 11 is a rectangular box body, and a central control board is disposed therein, and the central control board is electrically connected to the wire feeding device 13, the peeling and cutting device 14, the first transferring device 16, the second transferring device 17, the soldering device 18, and the jig conveying device 19, respectively, and the control technology adopted by the central control board is the prior art, and therefore, the details are not repeated; a plurality of wheels 111 are arranged below the control box 11, so that the whole equipment can move conveniently, a support seat 112 is arranged on the side edge of each wheel 111, and the height of each support seat 112 can be adjusted; in some embodiments, a brake structure is further disposed on the wheel 111. In this embodiment, an alarm device 121 is further disposed above the cover 12, and when the device fails, the alarm device 121 can send a signal to remind a user to handle the failure.

Referring to fig. 2 and 4, in the present embodiment, the wire feeding device 13 includes a first X-axis guide rail 131, a first motor 132, a first Y-axis guide rail 133, a first mounting plate 134, a second motor 135, a wire leveling assembly 136, a wire pressing cylinder 137, and a wire feeding motor 138; the first X-axis guide rail 131 is horizontally arranged on the control box 11; the first motor 132 is fixedly arranged on the first X-axis guide rail 131; the first Y-axis guide rail 133 is movably disposed on the first X-axis guide rail 131, and can move horizontally on the first X-axis guide rail 131 under the driving of the first motor 132, in this embodiment, the first motor 132 and the transmission belt cooperate with each other to drive the first Y-axis guide rail 133 to move horizontally on the first X-axis guide rail 131; in some embodiments, the first motor 132 may also cooperate with a drag chain to drive the first Y-axis guide rail 133 to move horizontally on the first X-axis guide rail 131; the first mounting plate 134 is movably disposed on the first Y-axis guide rail 133, and can move longitudinally on the first Y-axis guide rail 133 under the driving of the second motor 135; the wire leveling component 136 is fixedly arranged above the first mounting plate 134 and comprises a plurality of pulley blocks, each pulley block comprises a plurality of pulleys, the plurality of pulleys are arranged in parallel at equal intervals, and the wire sequentially passes through the plurality of pulleys to be leveled under the action of the pulleys; and a wire pressing cylinder 137 and a wire feeding motor 138 are sequentially arranged behind each group of the pulley blocks, the wire pressing cylinder 137 presses the wire, and the wire feeding motor 138 drives the wire to be fed to a set length.

Referring to fig. 2 and 5, in the present embodiment, the peeling and cutting device 14 includes a fixing base 141, a peeling and cutting motor 142, a lifting screw 143, a first cutter 144, a second cutter 145, and a waste box 146; the fixing seat 141 is fixedly arranged on the control box 11; the peeling and cutting motor 142 is fixedly arranged above the fixed seat 141, the lifting screw rod 143 is arranged below the peeling and cutting motor 142, and the first cutter 144 is fixedly arranged on the fixed seat 141 and is flush with the height of the wire feeding device 13; the second cutter 145 is arranged on the lifting screw 143 and right above the first cutter 144, and is driven by the peeling and cutting motor 142 and the lifting screw 143 to move downwards, so that the second cutter 145 cooperates with the first cutter 144 to peel or cut off the wire; the waste bin 146 is disposed just below the first cutter 144, and functions to collect the wire waste cut by the first cutter 144 and the second cutter 145. In this embodiment, the soldering assistant device 15 includes a solder paste furnace 151 and a rosin box 152, the solder paste furnace 151 and the rosin box 152 are respectively disposed at one side of the fixing base 141, and after the wire on the wire feeding device 13 is peeled by the peeling and cutting device 14, the wire feeding device 13 moves into the solder paste furnace 151 and the rosin box 152 respectively to be pasted with solder paste or rosin.

Referring to fig. 3 and 6, in the present embodiment, the first transfer device 16 includes a second X-axis guide rail 161, a third motor 162, a second Y-axis guide rail 163, a fourth motor 164, a second mounting plate 165, a first wire clamping claw 166 and a first wire clamping cylinder 167; the second X-axis guide rail 161 is fixed to the control box 11 and disposed behind the peeling and cutting device 14; the third motor 162 is disposed on the second X-axis guide rail 161; the second Y-axis guide rail 163 is movably disposed on the second X-axis guide rail 161, and is driven by the third motor 162 to horizontally move along the second X-axis guide rail 161; the fourth motor 164 is fixedly disposed on the second Y-axis guide rail 163; the second mounting plate 165 is movably arranged on the second Y-axis guide rail 163, and can move longitudinally on the second Y-axis guide rail 163 under the driving of the fourth motor 164; the first wire clamping cylinder 167 is arranged on the second mounting plate 165, and the first wire clamping claw 166 is arranged above the first wire clamping cylinder 167 and is driven by the first wire clamping cylinder 167 to clamp or loosen a wire.

Referring to fig. 3 and 7, in the present embodiment, the second transfer device 17 includes a gantry 171, a reinforcing plate 172, a third Y-axis guide 173, a third mounting plate 174, a fifth motor 175, a second wire clamping cylinder 176 and a second wire clamping claw 177; the gantry 171 is fixedly arranged on the control box 11; the two reinforcing plates 172 are respectively symmetrically arranged on two sides of the portal frame 171 and are used for reinforcing the bearing capacity of the portal frame 171; the third Y-axis guide 173 is disposed on the gantry 171; the third mounting plate 174 is movably disposed on the third Y-axis guide 173; the fifth motor 175 is disposed on the third Y-axis guide 173, and drives the third mounting plate 174 to move on the third Y-axis guide 173; the second wire clamping cylinder 176 is disposed on the third mounting plate 173, and the second wire clamping claw 177 is disposed below the second wire clamping cylinder 176, and is driven by the second wire clamping cylinder 176 to clamp the wire on the first wire clamping claw 166 or convey the wire to the soldering device 18.

Referring to fig. 2 and 8, in the present embodiment, the soldering device 18 includes a mounting base 181, a first Z-axis guide 182, a fourth mounting plate 183, a sixth motor 184, at least one set of soldering components 185, and at least one fine adjustment structure 186; the mounting seat 181 is fixedly arranged on the gantry 171; the first Z-axis guide rail 182 is disposed on the mounting seat 181; the fourth mounting plate 183 is movably arranged on the first Z-axis guide rail 182; the sixth motor 184 is fixedly disposed on the first Z-axis guide rail 182, and drives the fourth mounting plate 183 to move on the first Z-axis guide rail 182; at least one fine adjustment structure 186 is disposed on the fourth mounting plate 183, which can be adjusted within a certain range to adapt to welding of different products; at least one set of the solder assemblies 185 is disposed below the trim structure 186 that enables wire bonding operations. In this embodiment, two sets of the solder assemblies 185 are disposed below the corresponding trimming structures 186, each set of the solder assemblies 185 includes a third wire clamping claw 1851, an electric soldering iron 1852 and a wire feeding structure 1853, the third wire clamping claw 1851 clamps the wire conveyed by the second transfer device 17, and the electric soldering iron 1852 and the wire feeding structure 1853 solder the wire to the product on the jig conveyor 19; in other embodiments, the number of the solder assemblies 185 can be set according to actual requirements.

Referring to fig. 2, in the present embodiment, the jig conveying device 19 includes a jig guide rail 191, a jig 192 and a jig conveying motor 193, the jig guide rail 191 is disposed on the control box 11, the jig 192 is movably disposed on the jig guide rail 191, and a product to be welded is disposed in the jig 192; the jig conveying motor 193 is disposed on the jig guide rail 191, and drives the jig 192 to move, so that the product in the jig 192 is moved, and the wire bonding operation is realized.

It should be noted that, the working process of the automatic wire bonding device of the present invention is as follows: the wire is leveled and straightened through the matching of the wire leveling assembly 136 and the wire pressing cylinder 137, the wire feeding motor 138 drives the wire to extend out of a set length, then the peeling and cutting motor 142 drives the lifting screw rod 143 to operate, so that the first cutting knife 144 is driven to move to the position of the second cutting knife 145 to peel the wire, and the peeled wire is moved into the welding assisting device 15 under the action of the wire feeding device 13 to dip soldering flux; then send traditional thread binding putting 13 to transport the wire rod that dips in the scaling powder and cut off 14 of skinning cutting device and cut off, first transfer device 16 presss from both sides the wire rod of cutting off and gives second transfer device 17, second transfer device 17 forwards the wire rod for third press from both sides line claw 1851, through electric iron 1852 with give the cooperation of the tin line on the tin line structure 1853, weld the wire rod on the product in the tool 192.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. An automatic wire welding device is characterized by comprising a control box, wherein a central control board is arranged in the control box; the cover body is arranged above the control box; the wire feeding device is movably arranged above the control box; the peeling and cutting device is fixedly arranged on the control box and is arranged behind the wire feeding device and used for peeling or cutting the wire rods conveyed by the wire feeding device; the welding assisting device is arranged on the side edge of the peeling and cutting device; the first transfer device and the second transfer device are movably arranged on the control box, the first transfer device clamps the wire rods cut off by the peeling and cutting device, and the first transfer device clamps the wire rods on the first transfer device for conveying; the second transfer device is used for transferring the wire to the soldering device; the jig conveying device is movably arranged on the control box and below the soldering tin device, and the soldering tin device welds the wire rods on products in the jig conveying device.

2. The automatic wire bonding apparatus of claim 1 wherein the wire feeder comprises a first X-axis guide, a first motor, a first Y-axis guide, a first mounting plate, a second motor, a wire leveling assembly, a wire pressing cylinder, and a wire feeding motor; the first X-axis guide rail is horizontally arranged on the control box; the first motor is fixedly arranged on the first X-axis guide rail; the first Y-axis guide rail is movably arranged on the first X-axis guide rail and can horizontally move on the first X-axis guide rail under the driving of the first motor; the first mounting plate is movably arranged on the first Y-axis guide rail and can move longitudinally on the first Y-axis guide rail under the driving of the second motor; the wire leveling assembly is fixedly arranged above the first mounting plate; the wire pressing cylinder and the wire feeding motor are sequentially arranged behind the wire leveling assembly.

3. The automatic wire bonding apparatus of claim 2 wherein said wire leveling assembly comprises a plurality of pulley blocks, each pulley block comprising a plurality of pulleys, said plurality of pulleys being equidistantly spaced apart, and wherein the wire passes through said plurality of pulleys in sequence.

4. The automatic wire welding device according to claim 1, wherein the peeling and cutting device comprises a fixed seat, a peeling and cutting motor, a lifting screw rod, a first cutter and a second cutter; the fixed seat is fixedly arranged on the control box; the peeling and wire cutting motor is fixedly arranged above the fixed seat, the lifting screw rod is arranged below the peeling and wire cutting motor, and the first cutting knife is fixedly arranged on the fixed seat and is flush with the height of a wire on the wire feeding device; the second cutter is arranged on the lifting screw rod and right above the first cutter, and is matched with the first cutter to peel or cut off the wire.

5. The automatic wire bonding device according to claim 4, wherein the soldering aid comprises a solder paste furnace and a rosin box, and the solder paste furnace and the rosin box are respectively arranged on one side of the fixing seat.

6. The automatic wire bonding device according to claim 1, wherein the first transfer device comprises a second X-axis guide rail, a third motor, a second Y-axis guide rail, a fourth motor, a second mounting plate, a first wire clamping claw and a first wire clamping cylinder; the second X-axis guide rail is fixed on the control box and is arranged behind the peeling and cutting device; the third motor is arranged on the second X-axis guide rail; the second Y-axis guide rail is movably arranged on the second X-axis guide rail and is driven by the third motor to horizontally move along the second X-axis guide rail; the fourth motor is fixedly arranged on the second Y-axis guide rail; the second mounting plate is movably arranged on the second Y-axis guide rail and can move longitudinally on the second Y-axis guide rail under the driving of the fourth motor; the first wire clamping cylinder is arranged on the second mounting plate, and the first wire clamping claw is arranged above the first wire clamping cylinder.

7. The automatic wire welding device according to claim 6, wherein the second transfer device comprises a portal frame, a third Y-axis guide rail, a third mounting plate, a fifth motor, a second wire clamping cylinder and a second wire clamping claw; the portal frame is fixedly arranged on the control box; the third Y-axis guide rail is arranged on the portal frame; the third mounting plate is movably arranged on the third Y-axis guide rail; the fifth motor is arranged on the third Y-axis guide rail and drives the third mounting plate to move on the third Y-axis guide rail; the second wire clamping cylinder is arranged on the third mounting plate, and the second wire clamping claw is arranged below the second wire clamping cylinder.

8. The automatic wire bonding apparatus of claim 7 wherein the soldering device includes a mounting base, a first Z-axis rail, a fourth mounting plate, a sixth motor, at least one set of soldering components, and at least one fine adjustment structure; the mounting seat is fixedly arranged on the portal frame; the first Z-axis guide rail is arranged on the mounting seat; the fourth mounting plate is movably arranged on the first Z-axis guide rail; the sixth motor is fixedly arranged on the first Z-axis guide rail and drives the fourth mounting plate to move on the first Z-axis guide rail; at least one fine adjustment structure is arranged on the fourth mounting plate; at least one set of the solder assemblies is disposed below the fine tuning structure, which enables wire bonding operations.

9. The automatic wire welding device according to claim 8, wherein each group of soldering components comprises a third wire clamping claw, an electric soldering iron and a wire feeding structure, the third wire clamping claw clamps the wires conveyed by the second transfer device, and the electric soldering iron and the wire feeding structure are matched to weld the wires on the products on the jig conveying device.

10. The automatic wire bonding device according to claim 1, wherein the jig transportation device comprises a jig guide rail, a jig and a jig transportation motor, the jig guide rail is arranged on the control box, the jig is movably arranged on the jig guide rail, and a product to be welded is arranged in the jig; the jig conveying motor is arranged on the jig guide rail and drives the jig to move.

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