CN113403669A - Rotary electrode diamond abrasive surface coating device and method - Google Patents
Rotary electrode diamond abrasive surface coating device and method Download PDFInfo
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- CN113403669A CN113403669A CN202110601207.4A CN202110601207A CN113403669A CN 113403669 A CN113403669 A CN 113403669A CN 202110601207 A CN202110601207 A CN 202110601207A CN 113403669 A CN113403669 A CN 113403669A
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- plating
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 64
- 239000010432 diamond Substances 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000011248 coating agent Substances 0.000 title claims description 10
- 238000000576 coating method Methods 0.000 title claims description 10
- 238000007747 plating Methods 0.000 claims abstract description 78
- 238000009713 electroplating Methods 0.000 claims abstract description 58
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 49
- 239000002245 particle Substances 0.000 claims abstract description 40
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 3
- DLDJFQGPPSQZKI-UHFFFAOYSA-N but-2-yne-1,4-diol Chemical compound OCC#CCO DLDJFQGPPSQZKI-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 230000009467 reduction Effects 0.000 claims description 3
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 claims description 3
- 229940081974 saccharin Drugs 0.000 claims description 3
- 235000019204 saccharin Nutrition 0.000 claims description 3
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 4
- 239000003082 abrasive agent Substances 0.000 abstract description 2
- 230000001737 promoting effect Effects 0.000 abstract description 2
- 238000000227 grinding Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000010183 spectrum analysis Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
- C25D3/16—Acetylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a device and a method for plating the surface of a diamond abrasive material with a rotary electrode, wherein the device comprises a barrel plating base, a plating solution bottle, the rotary electrode, a nickel rod, an electroplating power supply and the like, wherein the plating solution bottle is used for containing electroplating solution, is obliquely arranged on the barrel plating base as a roller and is driven by a rotary motor to rotate; the electroplating device also comprises a rotary electrode and a nickel rod, wherein the rotary electrode extends into electroplating solution in the electroplating solution bottle and rotates under the drive of a rotary motor; the nickel rod extends into the electroplating solution through the bracket, and the nickel rod and the rotary electrode are respectively electrically connected with the anode and the cathode of the electroplating power supply. Compared with the existing barrel plating method, the barrel plating method has the advantages of improving the plating efficiency and quality of the surface of the diamond abrasive particles and having obvious scientific and practical application value for promoting the development of diamond abrasive particle plating technology.
Description
Technical Field
The invention relates to the technical field of diamond abrasive surface plating, in particular to a diamond abrasive surface nickel plating method adopting rotary electrode barrel plating.
Background
At present, electroplating plating on the surface of diamond is to plate a layer of metal on the surface of diamond by an electroplating method. The diamond grinding wheel has the advantages that when the diamond grinding material is adopted to manufacture the grinding wheel, the holding force of the diamond and the bonding agent is increased, and meanwhile, the metal outer layer also plays a role in protecting and enhancing the abrasive particles.
The diamond serving as an abrasive has excellent grinding performance such as strong processing capacity, high sharpness, good shape precision retention, high reliability and the like, and in the use process of the diamond grinding tool, the binding agent is crucial to the holding strength of the abrasive grains, but because the interface energy between the diamond and other materials is high and the surface energy is high, the diamond is difficult to form firm chemical or metallurgical bonding with other material binding agents, the holding force of the binding agent on the diamond abrasive grains is reduced, the abrasive grains are prone to fall off prematurely in the grinding process, the sharpness of the grinding tool is reduced, and the use performance and the service life of the grinding tool are seriously influenced. In order to improve the bonding strength between the bonding agent and the diamond abrasive particles, the surface of the diamond is treated, and a layer of metal or other material coat is wrapped on the surface of the diamond through a surface plating technology, so that the purpose of improving the bonding strength between the diamond and the bonding agent is achieved. At present, the most widely and effectively used method is to plate nickel and its alloy, and the main method is to deposit a layer of nickel or alloy on the diamond surface by chemical plating or electroplating method for diamond abrasive material whose surface is subjected to conductive treatment in advance, so as to achieve the purpose of surface modification. The electroplating method has high efficiency and good coating quality, and the diamond abrasive is fine particle and may not be used directly as the cathode in electroplating system. The cathode of the prior barrel plating electroplating method is mainly in a fixed mode, and has some defects, such as limited cathode area, poor contact uniformity of particles and electrodes, uneven integral coating of abrasive particles, and limited production efficiency due to not too large one-time loading; when the electrode is fixed, the turning of the abrasive stack mainly depends on the power generated by the rolling of the plating solution bottle, so that the rolling frequency of particles is low, the conduction uniformity among the particles is poor, the uniformity of a plating layer is influenced, and the improvement of the plating yield is also restricted. These problems have restricted the development of diamond barrel plating electroplating technology to high efficiency and high quality.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a device and a method for plating the surface of a diamond abrasive of a rotating electrode.
In order to achieve the purpose, the invention adopts the following technical scheme:
a rotary electrode diamond abrasive surface plating device comprises a barrel plating base, a plating solution bottle, a rotary electrode, a nickel rod, an electroplating power supply and the like, wherein the plating solution bottle is used for containing electroplating solution, and the plating solution bottle is obliquely arranged on the barrel plating base as a roller and is driven by a rotary motor to rotate; the electroplating device also comprises a rotary electrode and a nickel rod, wherein the rotary electrode extends into electroplating solution in the electroplating solution bottle and rotates under the drive of a rotary motor; the nickel rod extends into the electroplating solution through the bracket, and the nickel rod and the rotary electrode are respectively electrically connected with the anode and the cathode of the electroplating power supply.
Furthermore, the rotating electrode mainly comprises a cathode rotor and a rotating main shaft, one end of the rotating main shaft is connected with the cathode rotor, and the other end of the rotating main shaft is connected with an output shaft of the driving motor through a coupler; the cathode rotor is made of a conductive material; the surface of the rotating main shaft is insulated by a plastic sleeve.
Further, the cathode rotor has a cylindrical shape.
The invention also provides a diamond abrasive surface nickel plating method using the device, which comprises the following specific processes:
s1, adding electroplating solution into the solution bottle, wherein the nickel rod and the rotary electrode are used as an anode and a cathode respectively and extend into the electroplating solution, and the nickel rod and the rotary electrode are respectively connected to the anode and the cathode of an electroplating power supply;
s2, adding the diamond abrasive particles subjected to surface conductive treatment into electroplating solution in an electroplating solution bottle;
s3, switching on an electroplating power supply, starting a rotating motor and a driving motor, and enabling a plating solution bottle and a rotating electrode to start rotating;
s4, covering and accumulating diamond abrasive particles on the rotating electrode to form a plating system; for the diamond abrasive particles stacked and covered on the rotating electrode, in the barrel plating process, the diamond abrasive particles are integrally formed into a cathode by the contact conduction between the diamond abrasive particles and the rotating electrode at the moment when the diamond abrasive particles are contacted with the rotating electrode, and a plating system forms a closed cathodeClosing the circuit, at this time Ni in the plating solution2+The metal nickel coating is formed on the surface of the diamond abrasive particles through electron reduction deposition.
Further, in the above method, the plating solution includes NiCl4·6H2O 80g/L、Ni(NH2SO3)2·4H2O 420g/L、H3BO340g/L, 0.5-1g/L of 1, 4-butynediol, 0.1g/L of sodium dodecyl sulfate and 1g/L of saccharin, pH 4.1 and temperature 50-60 ℃.
The invention has the beneficial effects that: the invention adopts the rotary electrode barrel plating method to plate nickel on the surface of the abrasive, and because the cathode is used for rotating in the barrel plating process of plating metal nickel on the surface of the abrasive, the contact area of the electrode and abrasive particles is increased, the dispersing capacity is improved, and the uniform conductivity of electricity among the particles is increased, thereby effectively improving the electroplating plating efficiency and improving the problem of non-uniformity of the plating layer on the surface of the plated abrasive. Compared with the existing barrel plating method, the method has the advantages of improving the plating efficiency and quality of the superhard abrasive particles and has obvious scientific and practical application value for promoting the development of diamond abrasive particle plating technology.
Drawings
FIG. 1 is a schematic structural view of an apparatus according to embodiment 1 of the present invention;
FIG. 2 is a schematic view showing a coating photomicrograph of the diamond-coated abrasive according to example 2 of the present invention and EDS spectroscopy results;
fig. 3 is a schematic diagram of a contact plating process of a rotary electrode and a diamond abrasive stack in example 2 of the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings, and it should be noted that the present embodiment is based on the technical solution, and the detailed implementation and the specific operation process are provided, but the protection scope of the present invention is not limited to the present embodiment.
Example 1
The embodiment provides a rotary electrode diamond abrasive surface plating device, as shown in figure 1, comprising a barrel plating machine base 1 and a plating solution bottle 3, wherein the plating solution bottle 3 is used for containing a plating solution 5, and the plating solution bottle 3 is used as a plating solutionIs obliquely arranged on the barrel plating stand 1 for a roller and driven by a rotating motor 2 to rotate at a speed V1The linear velocity of (2) is rotated and revolved; the device also comprises a rotary electrode 7 and a nickel rod (anode) 4, wherein the rotary electrode 7 extends into the electroplating solution in the electroplating solution bottle 3 and is driven by a rotary motor 8 to be V-shaped2The linear velocity of (2) is rotated; the nickel rod (anode) 4 extends into the electroplating solution 5 through a bracket, and the nickel (anode) 4 and the rotary electrode (cathode) 7 are respectively and electrically connected with the anode and the cathode of the electroplating power supply 10.
Further, in this embodiment, the rotating electrode is mainly composed of a cathode rotor and a rotating spindle, one end of the rotating spindle is connected to the cathode rotor, and the other end is connected to an output shaft of the driving motor 8 through a coupling; the cathode rotor is cylindrical and made of good conductive materials such as graphite, copper and the like; the surface of the rotating main shaft is sleeved with an insulating sleeve.
Furthermore, the rotary electrode can be connected with the rack of the barrel plating machine base through the combined action of the support sleeve and the insulated bakelite connecting plate.
Furthermore, an auxiliary heating sheet 9 is arranged at the bottom of the plating liquid bottle 3. The auxiliary heating plate 9 can be used for providing proper electroplating temperature for the electroplating solution.
Example 2
The embodiment provides a method for plating nickel on a diamond abrasive by using the device in embodiment 1, which comprises the following specific steps:
s1, adding electroplating solution into the solution bottle, wherein the nickel rod and the rotary electrode are used as an anode and a cathode respectively and extend into the electroplating solution in the solution bottle, and the nickel rod and the rotary electrode are respectively connected with an anode and a cathode of an electroplating power supply;
s2, adding the diamond abrasive subjected to surface conductive treatment into electroplating solution in an electroplating solution bottle;
s3, switching on an electroplating power supply, starting a rotating motor and a driving motor, and enabling a plating solution bottle and a rotating electrode to start rotating;
s4, covering and accumulating the diamond abrasive particles 6 on the rotating electrode to form a plating system; for abrasive particles stacked on the rotating electrode, the abrasive particles rotate during barrel platingThe moment of electrode contact and the contact conduction among the abrasive particles can lead the abrasive particles to form a cathode integrally, and the plating system forms a closed loop, wherein Ni in the electroplating solution2+An electron reduction deposition is obtained on the surface of the abrasive particles to form a metallic nickel coating.
The rotation speed of the rotary electrode is set according to the granularity of diamond abrasive to be plated and the required quality, and is generally 10 to 30rpm under the condition that the capacity of the plating solution bottle is 2L. The diameter of the cathode rotor is set according to the size of the plating bath bottle and the amount of diamond abrasive to be plated at one time, and is generally 15 to 30mm in a 2L plating bath bottle. The electroplating power supply adopts a direct current power supply, and the current density is generally 2A/dm2。
In addition, the plating solution includes NiCl4·6H2O 80g/L、Ni(NH2SO3)2·4H2O 420g/L、H3BO340g/L, 0.5-1g/L of 1, 4-butynediol, 0.1g/L of sodium dodecyl sulfate and 1g/L of saccharin, pH 4.1 and temperature 50-60 ℃.
The diamond abrasive is a diamond-based abrasive having a surface that is subjected to a conductive treatment and has a coarse particle size that does not have suspension properties in an electroplating solution, i.e., within a coarse range of 320 mesh.
The microphotograph of the coating layer of the diamond-coated abrasive and the EDS energy spectrum analysis result are shown in FIG. 2, it can be seen from FIG. 2 that the coating layer is uniform, dense, bright and flat, the EDS energy spectrum analysis result is obvious, and the Ni content of the coating layer reaches 83.27%.
It should be noted that the process of plating the rotating electrode in contact with the diamond abrasive stack is shown in fig. 3. Abrasive particles in the electroplating solution are accumulated and cover on the rotary cathode under the action of gravity, along with the rotation of the plating bottle, the diamond abrasive particle stack moves upwards and overturns along the wall of the plating bottle under the drive of the wall of the plating solution bottle, and meanwhile, the overturning frequency of the diamond abrasive particle stack covering the diamond abrasive particle stack is increased by matching with the rotation of the rotary electrode. The cylindrical surface of the cathode rotor in the rotary electrode enables the contact area of the cathode to the diamond stack to be greatly increased, and in the plating process, the abrasive particles are always in contact with the cathode rotor and are electrically conducted through the contact between the abrasive particles to enable the whole abrasive particles to form the cathode, so that the uniform and efficient electroplating plating of the diamond particles is realized.
Various corresponding changes and modifications can be made by those skilled in the art based on the above technical solutions and concepts, and all such changes and modifications should be included in the protection scope of the present invention.
Claims (5)
1. The diamond abrasive surface plating device with the rotary electrode is characterized by comprising a barrel plating base and a plating solution bottle, wherein the plating solution bottle is used for containing electroplating solution, is obliquely arranged on the barrel plating base as a roller and is driven by a rotary motor to rotate; the electroplating device also comprises a rotary electrode and a nickel rod, wherein the rotary electrode extends into electroplating solution in the electroplating solution bottle and rotates under the drive of a rotary motor; the nickel rod extends into the electroplating solution through the bracket, and the nickel rod and the rotary electrode are respectively electrically connected with the anode and the cathode of the electroplating power supply.
2. The rotary electrode diamond abrasive surface coating device according to claim 1, wherein the rotary electrode is mainly composed of a cathode rotor and a rotary main shaft, one end of the rotary main shaft is connected to the cathode rotor, and the other end of the rotary main shaft is connected with an output shaft of a driving motor through a coupler; the cathode rotor is made of a conductive material; the surface of the rotating main shaft is insulated by a plastic sleeve.
3. The rotary electrode diamond abrasive surface coating apparatus of claim 2, wherein the cathode rotor is cylindrical.
4. A method for plating nickel on the surface of a diamond abrasive by using the device of any one of claims 1 to 3 is characterized by comprising the following specific steps:
s1, adding electroplating solution into the solution bottle, wherein the nickel rod and the rotary electrode are used as an anode and a cathode respectively and extend into the electroplating solution, and the nickel rod and the rotary electrode are respectively connected to the anode and the cathode of an electroplating power supply;
s2, adding the diamond abrasive particles subjected to surface conductive treatment into electroplating solution in an electroplating solution bottle;
s3, switching on an electroplating power supply, starting a rotating motor and a driving motor, and enabling a plating solution bottle and a rotating electrode to start rotating;
s4, covering and accumulating diamond abrasive particles on the rotating electrode to form a plating system; for the diamond abrasive particles stacked and covered on the rotating electrode, in the barrel plating process, the diamond abrasive particles are integrally formed into a cathode by the contact conduction between the diamond abrasive particles and the rotating electrode at the moment when the diamond abrasive particles are contacted with the rotating electrode, and a plating system forms a closed loop, wherein at the moment, Ni in electroplating solution is2+The metal nickel coating is formed on the surface of the diamond abrasive particles through electron reduction deposition.
5. The method of claim 4, wherein said plating bath comprises NiCl4·6H2O 80g/L、Ni(NH2SO3)2·4H2O 420g/L、H3BO340g/L, 0.5-1g/L of 1, 4-butynediol, 0.1g/L of sodium dodecyl sulfate and 1g/L of saccharin, pH 4.1 and temperature 50-60 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110601207.4A CN113403669A (en) | 2021-05-31 | 2021-05-31 | Rotary electrode diamond abrasive surface coating device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110601207.4A CN113403669A (en) | 2021-05-31 | 2021-05-31 | Rotary electrode diamond abrasive surface coating device and method |
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| CN113403669A true CN113403669A (en) | 2021-09-17 |
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|---|---|---|---|
| CN202110601207.4A Pending CN113403669A (en) | 2021-05-31 | 2021-05-31 | Rotary electrode diamond abrasive surface coating device and method |
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Citations (8)
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|---|---|---|---|---|
| JP2002339100A (en) * | 2001-05-15 | 2002-11-27 | Yamamoto Mekki Shikenki:Kk | Barrel plating apparatus |
| JP2003013295A (en) * | 2001-06-29 | 2003-01-15 | Kida Seiko Kk | Method and equipment for barrel plating |
| CN101376997A (en) * | 2008-10-07 | 2009-03-04 | 北京科技大学 | Technology for preparing Ni shaped charge liner using sulfamic acid nickel electroforming solution |
| CN202705526U (en) * | 2012-07-19 | 2013-01-30 | 郑州中南杰特超硬材料有限公司 | Novel super-hard material electric plating device |
| CN204849086U (en) * | 2015-08-13 | 2015-12-09 | 郑州中南杰特超硬材料有限公司 | Compound dispersion barrel -plating device of intermittent type formula |
| CN105780093A (en) * | 2016-03-10 | 2016-07-20 | 郑州人造金刚石及制品工程技术研究中心有限公司 | Composite electroplating technology of high-wear-resisting nano diamond alkene |
| CN111549362A (en) * | 2020-05-25 | 2020-08-18 | 烟台力凯数控科技有限公司 | Pretreatment method for electroplating of diamond wire |
| CN111763933A (en) * | 2020-07-14 | 2020-10-13 | 浙江新瑞欣精密线锯有限公司 | Chemical plating process for plating nickel on surface of diamond micro powder |
-
2021
- 2021-05-31 CN CN202110601207.4A patent/CN113403669A/en active Pending
Patent Citations (8)
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| JP2002339100A (en) * | 2001-05-15 | 2002-11-27 | Yamamoto Mekki Shikenki:Kk | Barrel plating apparatus |
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| CN101376997A (en) * | 2008-10-07 | 2009-03-04 | 北京科技大学 | Technology for preparing Ni shaped charge liner using sulfamic acid nickel electroforming solution |
| CN202705526U (en) * | 2012-07-19 | 2013-01-30 | 郑州中南杰特超硬材料有限公司 | Novel super-hard material electric plating device |
| CN204849086U (en) * | 2015-08-13 | 2015-12-09 | 郑州中南杰特超硬材料有限公司 | Compound dispersion barrel -plating device of intermittent type formula |
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| CN111549362A (en) * | 2020-05-25 | 2020-08-18 | 烟台力凯数控科技有限公司 | Pretreatment method for electroplating of diamond wire |
| CN111763933A (en) * | 2020-07-14 | 2020-10-13 | 浙江新瑞欣精密线锯有限公司 | Chemical plating process for plating nickel on surface of diamond micro powder |
Non-Patent Citations (1)
| Title |
|---|
| 陈超等: "金刚石颗粒表面均匀电镀工艺研究", 《表面技术》, vol. 35, no. 1, pages 40 - 43 * |
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