CN113400196A - Cleaning method, device and equipment for grinding fixed disc groove and computer storage medium - Google Patents

Cleaning method, device and equipment for grinding fixed disc groove and computer storage medium Download PDF

Info

Publication number
CN113400196A
CN113400196A CN202110680277.3A CN202110680277A CN113400196A CN 113400196 A CN113400196 A CN 113400196A CN 202110680277 A CN202110680277 A CN 202110680277A CN 113400196 A CN113400196 A CN 113400196A
Authority
CN
China
Prior art keywords
pixel
crushed
combination
actual
grinding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110680277.3A
Other languages
Chinese (zh)
Inventor
张帅
黄兆皓
周雷雷
刘永亮
李�昊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xian Eswin Silicon Wafer Technology Co Ltd
Xian Eswin Material Technology Co Ltd
Original Assignee
Xian Eswin Silicon Wafer Technology Co Ltd
Xian Eswin Material Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xian Eswin Silicon Wafer Technology Co Ltd, Xian Eswin Material Technology Co Ltd filed Critical Xian Eswin Silicon Wafer Technology Co Ltd
Priority to CN202110680277.3A priority Critical patent/CN113400196A/en
Publication of CN113400196A publication Critical patent/CN113400196A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
    • B02C19/00—Other disintegrating devices or methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Food Science & Technology (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The embodiment of the invention discloses a cleaning method, a device, equipment and a computer storage medium for a grinding fixed disc groove; the method comprises the following steps: determining the pixel position of the combination to be crushed on the image according to the acquired image of the grinding fixed plate; mapping to obtain the actual position of the combination to be crushed in the groove according to the pixel position of the combination to be crushed; controlling a micro drill to move to an actual position of the binder to be crushed and crushing the binder to be crushed; and washing the crushed product to enable the product to be discharged out of the grooves of the grinding fixed disc.

Description

Cleaning method, device and equipment for grinding fixed disc groove and computer storage medium
Technical Field
The embodiment of the invention relates to the technical field of semiconductors, in particular to a cleaning method, a cleaning device, cleaning equipment and a computer storage medium for a grinding fixed disc groove.
Background
The silicon chip is used as an important raw material in the semiconductor industry and is a resource which is in short supply in the domestic market at present. Generally, after the polycrystalline silicon is subjected to the processes of remelting and pulling, slicing, chamfering, grinding, cleaning and the like, a chip-level silicon wafer with a smooth and flat surface and a regular edge can be obtained. The grinding process is an important process for removing silicon slice traces and surface damage layers and releasing the internal stress of the previous process. Therefore, the grinding process occupies this important position in the whole silicon wafer production flow.
However, when the grinding machine is used for a certain period of time, the grooves of the grinding fixed plate are filled with the grinding waste, so that the grinding waste cannot be discharged in time, the newly fed grinding slurry cannot uniformly act on the silicon wafer, and particularly, a combination generated by the reaction of quartz slag and rust on the grinding fixed plate is fixed in the grooves, which affects the flow of the grinding slurry and may scratch the silicon wafer. For the combination generated by the reaction of quartz slag and rusty substances of a grinding fixed disc, at present, no cleaning tool and a feasible method exist, manual cleaning is time-consuming and labor-consuming, and the production efficiency is reduced.
Disclosure of Invention
In view of the above, embodiments of the present invention are directed to a method, an apparatus, a device and a computer storage medium for cleaning grooves of a polishing platen; the device can effectively remove the combination generated by the reaction of the quartz slag and the rust on the fixed plate, reduce the maintenance time of the device, improve the production efficiency of the device and improve the product quality of the silicon wafer.
The technical scheme of the embodiment of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a cleaning method for a groove of a grinding fixed disk, where the method includes:
determining the pixel position of the combination to be crushed on the image according to the acquired image of the grinding fixed plate;
mapping to obtain the actual position of the combination to be crushed in the groove according to the pixel position of the combination to be crushed;
controlling a micro drill to move to an actual position of the binder to be crushed and crushing the binder to be crushed;
and washing the crushed product to enable the product to be discharged out of the grooves of the grinding fixed disc.
In a second aspect, an embodiment of the present invention provides a cleaning apparatus for a groove of a polishing fixed disk, the apparatus including a determining section, a mapping section, a pulverizing section, and a rinsing section; wherein the content of the first and second substances,
the determination part is configured to determine the pixel position of the combination to be crushed on the image according to the acquired image of the grinding fixed disc;
the mapping part is configured to map the actual position of the combination to be crushed in the groove according to the pixel position of the combination to be crushed;
the crushing part is configured to control the micro-drill to move to the actual position of the combination to be crushed and crush the combination to be crushed;
the washing part is configured to wash the crushed product so that the product is discharged out of the grooves of the grinding surface plate.
In a third aspect, an embodiment of the present invention provides a cleaning apparatus for grinding a fixed disk groove, where the apparatus includes a (Charge Coupled Device, CCD) camera, a memory, a processor, a micro drill, a high pressure water gun, and a driving mechanism; wherein the content of the first and second substances,
the CCD camera is used for acquiring an image of the grinding fixed plate;
the memory for storing a computer program operable on the processor;
the processor, when executing the computer program, is configured to perform the following steps:
determining the pixel position of the combination to be crushed on the image according to the acquired image of the grinding fixed plate;
mapping to obtain the actual position of the combination to be crushed in the groove according to the pixel position of the combination to be crushed;
the micro-drill configured to crush the combination to be crushed at an actual position obtained by the processor based on the actual position;
the high-pressure water gun is configured to wash the crushed products so that the products are discharged out of the grooves of the grinding fixed disc;
the drive mechanism is configured to control the micro-drill to move to the actual position based on the actual position obtained by the processor.
In a fourth aspect, an embodiment of the present invention provides a computer storage medium storing a program for cleaning polishing platen grooves, which when executed by at least one processor implements the method steps for cleaning polishing platen grooves of the first aspect.
The embodiment of the invention provides a cleaning method and a system for a grinding fixed disc groove and a computer storage medium; the pixel position of the combination to be crushed in the image of the grinding fixed disc can be collected through a CCD camera, and the actual position of the combination to be crushed in the groove is obtained through mapping; after the actual positions of the binders to be crushed are determined, the binders are crushed by the aid of the micro drill, and the crushed products are washed and discharged through the discharge holes in the grooves, so that the binders in the grooves cannot be scratched when silicon wafers are ground, and quality of the silicon wafers is improved.
Drawings
Fig. 1 is a schematic structural diagram of a polishing apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a cleaning apparatus for polishing grooves of a fixed platen according to an embodiment of the present invention.
Fig. 3 is a schematic flow chart of a cleaning method for polishing the grooves of the fixed platen according to an embodiment of the present invention.
Fig. 4 is a schematic image of a polishing platen according to an embodiment of the present invention.
Fig. 5 is a schematic view of an actual structure of a polishing fixed plate according to an embodiment of the present invention.
FIG. 6 is a schematic diagram of the CCD camera and the micro-drill being moved out of the grinding platen after the cleaning operation according to the embodiment of the present invention.
Fig. 7 is a schematic diagram illustrating an exemplary cleaning apparatus for polishing grooves of a fixed platen according to an embodiment of the present invention.
FIG. 8 is a schematic view of another cleaning apparatus for polishing grooves of a fixed platen according to an embodiment of the present invention.
Fig. 9 is a schematic structural diagram of hardware components of a cleaning apparatus for polishing grooves of a fixed platen according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1, a conventional polishing apparatus 1 capable of implementing the technical solution of the embodiment of the present invention is shown, and the polishing apparatus 1 may include a polishing platen AD, grooves TR disposed in the polishing platen AD, a polishing head 10, and a control component 20 for controlling the polishing platen AD and the polishing head 10 to make a circular motion. It should be noted that the structure of the polishing apparatus 1 shown in fig. 1 is not particularly limited, and other components required for polishing a silicon wafer are omitted for clarity of illustrating the technical solution of the embodiment of the present invention.
Based on the grinding apparatus 1 shown in fig. 1, referring to fig. 2, above the grinding surface plate AD, an optical observation instrument 2, such as a CCD camera, may be added for observing whether there is a combination of quartz slag and rust of the surface plate AD in the groove TR; since this type of bond is strongly bonded to the grooves TR and is therefore difficult and time consuming to clean using tools such as brushes or knives, it is also possible to provide cleaning tools 3, such as micro-drills, above the grinding surface plate AD, see fig. 2; in practice, the position of the bond in the trench TR can be determined by the optical observation instrument 2 and cleaned by the cleaning tool 3. When all the bonds have been comminuted, a separate high-pressure flushing device 4, for example a high-pressure water gun, can be provided for flushing the comminuted product. Of course, the crushed product can also be rinsed by a water washing unit (not shown in the figure) in the grinding apparatus 1.
The polishing platen AD is provided with a discharge hole (not shown) for discharging the waste, and the discharge hole can discharge the crushed product even when the grooves TR are actually cleaned.
Of course, in order to realize that the CCD camera 2 and the micro-drill 3 can scan and clean the combination in the trench TR in all directions, as shown in fig. 2, some other components need to be provided, such as:
a fixing member 5;
a first movable member 6 provided on the fixed member 5, wherein the first movable member 6 is rotatable about the fixed member 5 in an XOY plane of a cartesian orthogonal coordinate system and is movable in a length direction of the fixed member 5;
a second movable member 7 provided on the first movable member 6, wherein the second movable member 7 is movable in a longitudinal direction of the first movable member 6; wherein, the CCD camera 2 and the micro-drill 3 are fixedly arranged on the second movable part 7;
and a driving mechanism 8 for controlling the first movable member 6 and the second movable member 7 to move or rotate.
Based on the above-mentioned equipment composition, referring to fig. 3, it is shown that an embodiment of the present invention provides a cleaning method for grinding the grooves TR of the fixed plate AD, the method includes:
s301, determining the pixel position of a combination to be crushed on the image according to the acquired image of the grinding fixed plate;
s302, mapping to obtain the actual position of the combination to be crushed in the groove according to the pixel position of the combination to be crushed;
s303, controlling a micro drill to move to the actual position of the combination to be crushed and crushing the combination to be crushed;
s304, washing the crushed product to enable the product to be discharged out of the groove of the grinding fixed disc.
For the technical scheme, the image of the whole grinding fixed disc AD is mainly acquired through the CCD camera 2, the pixel position of the combination to be crushed is determined through the acquired image, and the actual position of the combination to be crushed in the groove is calculated and obtained according to the proportional relation between the pixel size of the acquired image and the actual size of the grinding fixed disc AD;
on the other hand, according to the obtained actual position, the driving mechanism 8 controls the first movable part 6 and the second movable part 7 to move so as to drive the micro drill 3 to move to the actual position of the combination to be crushed in the groove and perform crushing work. When the combination to be crushed is completely crushed, the high-pressure water gun 4 sprays deionized water to wash the crushed product until the product is completely discharged out of the groove TR of the grinding fixed plate AD.
It is understood that before the embodiment shown in fig. 3 is implemented, the driving mechanism 8 controls the first movable component 6 to move up and down in the Z-axis direction and rotate around the fixed component 5 in the XOY plane, and controls the second movable component 7 to move left and right in the Y-axis direction, so that the CCD camera 2 reaches a proper position to clearly present the grinding surface plate AD in the field of view.
For the solution shown in fig. 3, in some examples, the determining, according to the acquired image of the grinding surface plate, the pixel position of the conjugate to be crushed on the image includes:
setting a ray led out from the center of a pixel of the grinding fixed disc as a pixel polar axis QW based on the image, and acquiring a pixel angle theta of the pixel of the combination to be crushed on the image, which deviates from the pixel polar axis QW;
connecting the pixels of the to-be-crushed combination on the image with the pixel center of the grinding fixed plate to obtain a line segment QB, and acquiring the pixel length l of the line segment QBOB；
Pixel length l based on the line segment QBOBDetermining the pixel distance l between the combination to be crushed and the center of the grinding fixed disc;
and characterizing the pixel position of the binder to be crushed on the image by using the pixel distance l and the pixel angle l.
Referring to fig. 4, which shows an image of the grinding surface plate AD collected by the CCD camera 2, the combination (shown by black circles) formed by the reaction between the graphite slag and the rust on the grinding surface plate AD in the grooves TR can be clearly observed in the image. It can be understood that, in order to obtain the pixel position of the conjugate to be crushed, a technician may preset a ray led out from the pixel center Q of the grinding surface plate AD on the acquired image as a pixel polar axis QW; in specific implementation, a connecting line segment QB of the pixel of the binder to be crushed and the pixel center Q of the grinding fixed plate AD can be obtained on the collected image, and the pixel length l of the line segment QB is measuredOBThe pixel distance l between the combination to be crushed and the center of the grinding fixed plate AD can be obtained; on the other hand, the angle between the ray QW and the line segment QB, i.e. the pixel angle θ of the pixel of the to-be-comminuted material on the acquired image deviating from the pixel polar axis QW, can also be measured on the acquired image.
For the technical solution shown in fig. 3, in some examples, the mapping the actual position of the binder to be crushed in the trench according to the pixel position of the binder to be crushed includes:
acquiring a proportional relation K between the pixel size and the actual size according to the pixel size of the outer edge of the grinding fixed disc and the actual size of the outer edge of the grinding fixed disc;
and mapping to obtain the actual position of the combination to be crushed according to the pixel position of the combination to be crushed and the proportional relation K.
For the above example, in some implementations, the obtaining a proportional relationship K between the pixel size and the actual size according to the pixel size of the outer edge of the polishing fixed disk and the actual size of the outer edge of the polishing fixed disk includes:
acquiring the actual diameter D of the outer edge of the grinding fixed disc;
acquiring the pixel diameter d of the outer edge of the grinding fixed disc based on the image of the grinding fixed disc;
and calculating to obtain a proportional relation K (D/D) between the pixel size and the actual size through the pixel diameter D and the actual diameter D.
It can be understood that, in order to obtain the proportional relationship K corresponding to the pixel size and the actual size of the outer edge of the grinding surface plate AD, the actual diameter D of the outer edge of the grinding surface plate AD may be used as a research object, and the required proportional relationship K may be obtained by calculating the ratio of the actual diameter D of the outer edge of the grinding surface plate AD to the pixel diameter D.
For the above example, in some implementations, the mapping the actual position of the conjugate to be pulverized according to the pixel position of the conjugate to be pulverized and the proportional relation K includes:
determining an actual polar axis MN corresponding to the pixel polar axis on the grinding fixed disc according to the pixel polar axis QW on the image;
determining the actual angle alpha of the combination to be crushed deviating from the actual polar axis MN according to the pixel angle theta and the pixel polar axis QW;
determining the actual distance L between the combination to be crushed and the center of the grinding fixed disc as K x L according to the pixel distance L and the proportional relation K;
the actual position of the bond to be comminuted in the groove TR is characterized by the actual distance L and the actual angle α.
It should be noted that, depending on the size of the angle and the length of the line segments forming the two sides of the angle, it can be seen that: the actual angle a of the bond to be comminuted from the actual polar axis MN is also the pixel angle theta described above. Therefore, referring to fig. 5, the actual position of the combined material to be crushed in the groove TR can be determined according to the actual distance L between the combined material to be crushed and the center M of the grinding surface plate AD and the actual angle α, so that the crushing can be accurately performed according to the actual position, and the work efficiency is improved.
For the solution shown in fig. 3, in some examples, the method further comprises:
and after all the combinations to be crushed are cleaned, controlling the CCD camera and the micro drill to move to the outer side of the grinding fixed plate AD.
As will be understood, referring to fig. 6, after all the bonds to be crushed in the grooves TR are completely crushed and discharged from the grinding platen AD, the driving mechanism 8 can control the first movable member 6 to be lifted along the Z-axis direction of the fixed member 5 and to rotate clockwise or counterclockwise around the fixed member 5 in the XOY plane, so that the CCD camera 2 and the micro-drill 3 are completely moved out of the grinding platen AD by the driving action of the second movable member 7 to facilitate the next grinding operation.
Based on the same inventive concept as described above, referring to fig. 7, it is shown that an embodiment of the present invention further provides a cleaning apparatus 70 for grinding the grooves TR of the fixed plate AD, the apparatus 70 includes a determining portion 701, a mapping portion 702, a pulverizing portion 703 and a washing portion 704; wherein the content of the first and second substances,
the determining part 701 is configured to determine the pixel position of the combination to be crushed on the image according to the acquired image of the grinding surface plate AD;
the mapping part 702 is configured to map the actual position of the binder to be crushed in the groove TR according to the pixel position of the binder to be crushed;
the crushing portion 703 configured to control the micro drill to move to an actual position of the binder to be crushed and crush the binder to be crushed;
the washing section 704 is configured to wash the product after the pulverization treatment so that the product is discharged out of the grooves TR of the grinding platen AD.
In the above scheme, the determining part 701 is configured to:
setting a ray led out from the center of a pixel of the grinding fixed disc as a pixel polar axis QW based on the image, and acquiring a pixel angle theta of the pixel of the combination to be crushed on the image, which deviates from the pixel polar axis QW;
connecting the pixels of the to-be-crushed combination on the image with the pixel center of the grinding fixed plate to obtain a line segment QB, and acquiring the pixel length l of the line segment QBOB；
Pixel length l based on the line segment QBOBDetermining the pixel distance l between the combination to be crushed and the center of the grinding fixed disc;
and characterizing the pixel position of the combination to be crushed on the image by using the pixel distance l and the pixel angle theta.
In the above scheme, the mapping portion 702 is configured to:
acquiring a proportional relation K between the pixel size and the actual size according to the pixel size of the outer edge of the grinding fixed disc and the actual size of the outer edge of the grinding fixed disc;
and mapping to obtain the actual position of the combination to be crushed according to the pixel position of the combination to be crushed and the proportional relation K.
In the above scheme, the mapping portion 702 is configured to:
acquiring the actual diameter D of the outer edge of the grinding fixed disc;
acquiring the pixel diameter d of the outer edge of the grinding fixed disc based on the image of the grinding fixed disc;
and calculating to obtain a proportional relation K (D/D) between the pixel size and the actual size through the pixel diameter D and the actual diameter D.
In the above scheme, the mapping portion 702 is further configured to:
determining an actual polar axis MN corresponding to the pixel polar axis on the grinding fixed disc according to the pixel polar axis QW on the image;
determining the actual angle alpha of the combination to be crushed deviating from the actual polar axis MN according to the pixel angle theta and the pixel polar axis QW;
determining the actual distance L between the combination to be crushed and the center of the grinding fixed disc as K x L according to the pixel distance L and the proportional relation K;
the actual position of the bond to be comminuted in the groove is characterized by the actual distance L and the actual angle a.
Referring to fig. 8, for the above solution, the apparatus 70 further includes a control section 705, the control section 705 being configured to:
and after the combination to be crushed is completely cleaned, controlling the CCD camera and the micro drill to move to the outer side of the grinding fixed disc.
It is understood that in this embodiment, "part" may be part of a circuit, part of a processor, part of a program or software, etc., and may also be a unit, and may also be a module or a non-modular.
In addition, each component in the embodiment may be integrated in one processing unit, or each unit may exist alone physically, or two or more units are integrated in one unit. The integrated unit can be realized in a form of hardware or a form of a software functional module. Based on the understanding that the technical solution of the present embodiment essentially or a part contributing to the prior art, or all or part of the technical solution may be embodied in the form of a software product stored in a storage medium, and include several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) or a processor (processor) to execute all or part of the steps of the method of the present embodiment. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
Therefore, the present embodiment provides a computer storage medium, which stores a program for cleaning of the polishing platen grooves, and the program for cleaning of the polishing platen grooves is executed by at least one processor to implement the method steps for cleaning of the polishing platen grooves in the above technical solution.
Referring to fig. 9, a specific hardware structure of an apparatus 90 for cleaning polishing fixed disk grooves, which is capable of implementing the above apparatus 70 for cleaning polishing fixed disk grooves, according to the above apparatus 70 for cleaning polishing fixed disk grooves and computer storage medium, is shown, where the apparatus 90 may be applied to the apparatus structure shown in fig. 2, and the apparatus 90 may include: a CCD camera 901, a memory 902, a processor 903, a micro-drill 904, a high-pressure water gun 905 and a driving mechanism 906; the various components may be coupled together by a bus system 907. It is understood that bus system 907 is used to enable communications among the components for connection. The bus system 907 includes a power bus, a control bus, and a status signal bus in addition to a data bus. But for clarity of illustration the various buses are labeled in figure 9 as bus system 907. Wherein the content of the first and second substances,
the CCD camera 901 is used for collecting an image of the grinding surface plate AD;
the memory 902 is used for storing a computer program capable of running on the processor;
the processor 903 is configured to execute the following steps when the computer program runs:
determining the pixel position of the combination to be crushed on the image according to the acquired image of the grinding fixed plate;
mapping to obtain the actual position of the combination to be crushed in the groove according to the pixel position of the combination to be crushed;
the micro drill 904 configured to crush the combination to be crushed at an actual position obtained by the processor 903;
the high-pressure water gun 905 is configured to flush the crushed product so that the product is discharged out of the groove of the grinding fixed disc;
the drive mechanism 906 is configured to control the movement of the micro drill 904 to the actual position based on the actual position obtained by the processor 903.
With respect to the above, in some examples, the drive mechanism 906 may be further configured to:
after all the binders to be crushed are cleaned, the CCD camera 901 and the micro drill 904 are controlled to move to the outside of the grinding surface plate AD.
It is to be understood that the memory 902 in embodiments of the present invention may be either volatile memory or nonvolatile memory, or may include both volatile and nonvolatile memory. The non-volatile Memory may be a Read-Only Memory (ROM), a Programmable ROM (PROM), an Erasable PROM (EPROM), an Electrically Erasable PROM (EEPROM), or a flash Memory. Volatile Memory can be Random Access Memory (RAM), which acts as external cache Memory. By way of illustration and not limitation, many forms of RAM are available, such as Static random access memory (Static RAM, SRAM), Dynamic Random Access Memory (DRAM), Synchronous Dynamic random access memory (Synchronous DRAM, SDRAM), Double Data Rate Synchronous Dynamic Random Access Memory (DDRSDRAM), Enhanced Synchronous SDRAM (ESDRAM), Sync Link DRAM (SLDRAM), and Direct Rambus RAM (DRRAM). The memory 902 of the systems and methods described herein is intended to comprise, without being limited to, these and any other suitable types of memory.
And the processor 903 may be an integrated circuit chip having signal processing capabilities. In implementation, the steps of the above method may be performed by integrated logic circuits of hardware or instructions in the form of software in the processor 903. The Processor 903 may be a general-purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic device, or discrete hardware components. The various methods, steps and logic blocks disclosed in the embodiments of the present invention may be implemented or performed. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The steps of the method disclosed in connection with the embodiments of the present invention may be directly implemented by a hardware decoding processor, or implemented by a combination of hardware and software modules in the decoding processor. The software module may be located in ram, flash memory, rom, prom, or eprom, registers, etc. storage media as is well known in the art. The storage medium is located in the memory 902, and the processor 903 reads information in the memory 902 and performs the steps of the above method in combination with hardware thereof.
It is to be understood that the embodiments described herein may be implemented in hardware, software, firmware, middleware, microcode, or any combination thereof. For a hardware implementation, the Processing units may be implemented within one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), general purpose processors, controllers, micro-controllers, microprocessors, other electronic units configured to perform the functions described herein, or a combination thereof.
For a software implementation, the techniques described herein may be implemented with modules (e.g., procedures, functions, and so on) that perform the functions described herein. The software codes may be stored in a memory and executed by a processor. The memory may be implemented within the processor or external to the processor.
Specifically, when the processor 903 is further configured to run the computer program, the method steps for cleaning the polishing surface plate groove in the foregoing technical solution are executed, and are not described herein again.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims (10)

1. A method for cleaning grooves of a grinding fixed disk, comprising:
determining the pixel position of the combination to be crushed on the image according to the acquired image of the grinding fixed plate;
mapping to obtain the actual position of the combination to be crushed in the groove according to the pixel position of the combination to be crushed;
controlling a micro drill to move to an actual position of the binder to be crushed and crushing the binder to be crushed;
and washing the crushed product to enable the product to be discharged out of the grooves of the grinding fixed disc.
2. The method of claim 1, wherein said determining pixel locations of the bonds to be comminuted on the image from the captured image of the grinding surface plate comprises:
setting a ray led out from the center of a pixel of the grinding fixed disc as a pixel polar axis QW based on the image, and acquiring a pixel angle theta of the pixel of the combination to be crushed on the image, which deviates from the pixel polar axis QW;
connecting the pixels of the to-be-crushed combination on the image with the pixel center of the grinding fixed plate to obtain a line segment QB, and acquiring the pixel length l of the line segment QBOB；
Pixel length l based on the line segment QBOBDetermining the pixel distance l between the combination to be crushed and the center of the grinding fixed disc;
and characterizing the pixel position of the combination to be crushed on the image by using the pixel distance l and the pixel angle theta.
3. The method according to claim 2, wherein the mapping the actual position of the binder to be crushed in the groove according to the pixel position of the binder to be crushed comprises:
acquiring a proportional relation K between the pixel size and the actual size according to the pixel size of the outer edge of the grinding fixed disc and the actual size of the outer edge of the grinding fixed disc;
and mapping to obtain the actual position of the combination to be crushed according to the pixel position of the combination to be crushed and the proportional relation K.
4. The method according to claim 3, wherein the obtaining the proportional relationship K between the pixel size and the actual size according to the pixel size of the outer edge of the grinding fixed disk and the actual size of the outer edge of the grinding fixed disk comprises:
acquiring the actual diameter D of the outer edge of the grinding fixed disc;
acquiring the pixel diameter d of the outer edge of the grinding fixed disc based on the image of the grinding fixed disc;
and calculating to obtain a proportional relation K (D/D) between the pixel size and the actual size through the pixel diameter D and the actual diameter D.
5. The method according to claim 4, wherein the mapping the actual position of the binder to be crushed according to the pixel position of the binder to be crushed and the proportional relation K comprises:
determining an actual polar axis MN corresponding to the pixel polar axis on the grinding fixed disc according to the pixel polar axis QW on the image;
determining the actual angle alpha of the combination to be crushed deviating from the actual polar axis MN according to the pixel angle theta and the pixel polar axis QW;
determining the actual distance L between the combination to be crushed and the center of the grinding fixed disc as K x L according to the pixel distance L and the proportional relation K;
the actual position of the bond to be comminuted in the groove is characterized by the actual distance L and the actual angle a.
6. The method of claim 1, further comprising:
and after the combination to be crushed is completely cleaned, controlling the CCD camera and the micro drill to move to the outer side of the grinding fixed disc.
7. A cleaning apparatus for a groove of a polishing surface plate, comprising a determining section, a mapping section, a pulverizing section and a rinsing section; wherein the content of the first and second substances,
the determination part is configured to determine the pixel position of the combination to be crushed on the image according to the acquired image of the grinding fixed disc;
the mapping part is configured to map the actual position of the combination to be crushed in the groove according to the pixel position of the combination to be crushed;
the crushing part is configured to control the micro-drill to move to the actual position of the combination to be crushed and crush the combination to be crushed;
the washing part is configured to wash the crushed product so that the product is discharged out of the grooves of the grinding surface plate.
8. The apparatus of claim 7, wherein the determining portion is configured to:
setting a ray led out from the center of a pixel of the grinding fixed disc as a pixel polar axis QW based on the image, and acquiring a pixel angle theta of the pixel of the combination to be crushed on the image, which deviates from the pixel polar axis QW;
connecting the pixels of the to-be-crushed combination on the image with the pixel center of the grinding fixed plate to obtain a line segment QB, and acquiring the pixel length l of the line segment QBOB；
Pixel length l based on the line segment QBOBDetermining the pixel distance l between the combination to be crushed and the center of the grinding fixed disc;
and characterizing the pixel position of the combination to be crushed on the image by using the pixel distance l and the pixel angle theta.
9. A cleaning device for grinding fixed disc grooves is characterized by comprising a CCD camera, a memory, a processor, a micro drill bit, a high-pressure water gun and a driving mechanism; wherein the content of the first and second substances,
the CCD camera is used for acquiring an image of the grinding fixed plate;
the memory for storing a computer program operable on the processor;
the processor, when executing the computer program, is configured to perform the following steps:
determining the pixel position of the combination to be crushed on the image according to the acquired image of the grinding fixed plate;
mapping to obtain the actual position of the combination to be crushed in the groove according to the pixel position of the combination to be crushed;
the micro-drill configured to crush the combination to be crushed at the actual position based on the actual position obtained by the processor;
the high-pressure water gun is configured to wash the crushed products so that the products are discharged out of the grooves of the grinding fixed disc;
the drive mechanism configured to control the micro-drill to move to the actual position based on the actual position obtained by the processor.
10. A computer storage medium, characterized in that it stores a program for cleaning of grinding tables grooves, which when executed by at least one processor implements the method steps for cleaning of grinding tables grooves according to any one of claims 1 to 6.
CN202110680277.3A 2021-06-18 2021-06-18 Cleaning method, device and equipment for grinding fixed disc groove and computer storage medium Pending CN113400196A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110680277.3A CN113400196A (en) 2021-06-18 2021-06-18 Cleaning method, device and equipment for grinding fixed disc groove and computer storage medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110680277.3A CN113400196A (en) 2021-06-18 2021-06-18 Cleaning method, device and equipment for grinding fixed disc groove and computer storage medium

Publications (1)

Publication Number Publication Date
CN113400196A true CN113400196A (en) 2021-09-17

Family

ID=77681582

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110680277.3A Pending CN113400196A (en) 2021-06-18 2021-06-18 Cleaning method, device and equipment for grinding fixed disc groove and computer storage medium

Country Status (1)

Country Link
CN (1) CN113400196A (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019434A (en) * 2005-07-11 2007-01-25 Disco Abrasive Syst Ltd Polishing pad profile modification equipment and polishing equipment
CN101033958A (en) * 2007-02-01 2007-09-12 华中科技大学 Mechanical vision locating method
US20120236139A1 (en) * 2011-03-14 2012-09-20 Wen-Tung Chang Destructive web thickness measuring system of microdrills and method thereof
CN203566489U (en) * 2013-09-30 2014-04-30 上海超硅半导体有限公司 Cleaning device used for grinding disk grooves of silicon wafer grinder
CN106680288A (en) * 2017-01-03 2017-05-17 京东方科技集团股份有限公司 Grinding equipment and grinding method
CN109886917A (en) * 2019-01-09 2019-06-14 浙江舜宇光学有限公司 A kind of wafer disks localization method and device
CN110297232A (en) * 2019-05-24 2019-10-01 合刃科技（深圳）有限公司 Monocular distance measuring method, device and electronic equipment based on computer vision
CN111962145A (en) * 2020-09-16 2020-11-20 西安奕斯伟硅片技术有限公司 Method, device and equipment for detecting liquid level position of melt and computer storage medium
CN112197707A (en) * 2020-11-12 2021-01-08 北京逸驰科技有限公司 Tire wear detection method, computer device and readable storage medium
CN112504136A (en) * 2020-12-01 2021-03-16 深圳潜行创新科技有限公司 Object size measuring method, device, equipment and storage medium

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019434A (en) * 2005-07-11 2007-01-25 Disco Abrasive Syst Ltd Polishing pad profile modification equipment and polishing equipment
CN101033958A (en) * 2007-02-01 2007-09-12 华中科技大学 Mechanical vision locating method
US20120236139A1 (en) * 2011-03-14 2012-09-20 Wen-Tung Chang Destructive web thickness measuring system of microdrills and method thereof
CN203566489U (en) * 2013-09-30 2014-04-30 上海超硅半导体有限公司 Cleaning device used for grinding disk grooves of silicon wafer grinder
CN106680288A (en) * 2017-01-03 2017-05-17 京东方科技集团股份有限公司 Grinding equipment and grinding method
CN109886917A (en) * 2019-01-09 2019-06-14 浙江舜宇光学有限公司 A kind of wafer disks localization method and device
CN110297232A (en) * 2019-05-24 2019-10-01 合刃科技（深圳）有限公司 Monocular distance measuring method, device and electronic equipment based on computer vision
CN111962145A (en) * 2020-09-16 2020-11-20 西安奕斯伟硅片技术有限公司 Method, device and equipment for detecting liquid level position of melt and computer storage medium
CN112197707A (en) * 2020-11-12 2021-01-08 北京逸驰科技有限公司 Tire wear detection method, computer device and readable storage medium
CN112504136A (en) * 2020-12-01 2021-03-16 深圳潜行创新科技有限公司 Object size measuring method, device, equipment and storage medium

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
机械工业出版社, 机械工业出版社 *

Similar Documents

Publication Publication Date Title
TWI332683B (en) Systems and methods for wafer cleaning
US5320706A (en) Removing slurry residue from semiconductor wafer planarization
CN102554748B (en) Polishing method
DE112013002901T5 (en) Production process for semiconductor wafers
CN106944929A (en) The method for trimming of workpiece Ginding process and grinding pad
TW200705563A (en) Semiconductor wafer and process for producing a semiconductor wafer
CN205588088U (en) Stainless steel stamping workpiece grinding burr
CN106272037A (en) chemical mechanical polishing device and method
TW201535500A (en) Wafer polishing process, wafer polishing tool, and integrated circuit device manufacturing process
CN113400196A (en) Cleaning method, device and equipment for grinding fixed disc groove and computer storage medium
CN102157368A (en) Method for removing residues after chemical mechanical polishing
CN101894735A (en) Method for removing residues of chemical mechanical grinding
TW474852B (en) Method and apparatus for polishing workpieces
US20100018029A1 (en) Rinsing Wafers Using Composition-Tunable Rinse Water in Chemical Mechanical Polish
CN207127727U (en) A kind of ultrasonic wave conditioner discs and chemical mechanical grinder
CN113400188A (en) Chemical mechanical polishing method
KR20090086591A (en) Method and system for pad conditioning in an ecmp process
CN100537142C (en) Device and method for cleaning chemical and mechanical polishing equipment
CN207372448U (en) Gearburr removing grinding apparatus
US7004820B1 (en) CMP method and device capable of avoiding slurry residues
JPH0890417A (en) Deburring method and device therefor
CN103940643A (en) A preparation method for a TSV sample
CN106736947A (en) One kind is used for casting workpiece sanding burr automation equipment
CN106233432A (en) The system of the board cleaning after chemical-mechanical planarization, method and apparatus
KR100633997B1 (en) Method for cleaning brush of CMP apparatus

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20210917

RJ01 Rejection of invention patent application after publication