CN113393767A - Display module and display device - Google Patents
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- CN113393767A CN113393767A CN202110622148.9A CN202110622148A CN113393767A CN 113393767 A CN113393767 A CN 113393767A CN 202110622148 A CN202110622148 A CN 202110622148A CN 113393767 A CN113393767 A CN 113393767A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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Abstract
The display module and the display device provided by the embodiment of the application comprise a substrate, a first metal layer, a photoresist auxiliary eliminating layer and a packaging layer. When using this application, through set up the supplementary elimination layer of photoresist in the one side that is located first metal level and keeps away from the base plate, can assist the inclined plane slope that slows down the encapsulation groove that first metal level was seted up to weaken the mobility of photoresist on the inclined plane. In addition, by slowing down the slope gradient of the package groove, the exposure area of the slope can be increased to ensure the elimination of the photoresist on the slope as much as possible. By the design, the photoresist can be prevented from flowing into the packaging groove and generating bubbles in the packaging groove, and when the packaging is carried out through the packaging layer, the packaging reliability between part of the packaging layer and the packaging groove can be ensured, so that the packaging reliability of the whole display module is improved.
Description
Technical Field
The application belongs to the technical field of display, and particularly relates to a display module and display equipment.
Background
Current display device packaging technologies include package lid + glass sheet packaging, film packaging, and Frit packaging. Compared with the packaging cover + glass sheet packaging technology and the thin film packaging technology, Frit packaging has a better packaging effect and can be put into mass production, so that Frit packaging is widely applied to the packaging process of display equipment. However, the inventors have studied and found that bubbles are likely to occur inside the display device at the time of actual packaging, thereby affecting the packaging reliability of the display device to some extent.
Disclosure of Invention
In view of this, the application provides a display module and display device, through set up the supplementary elimination layer of photoresist in the one side that the base plate is kept away from to first metal level, can assist the inclined plane slope that slows down the encapsulation groove that first metal level was seted up to weaken the mobility of photoresist on the inclined plane, avoid photoresist to flow to the encapsulation inslot and produce the bubble in the encapsulation groove, thereby avoid display module to produce the bubble in the packaging process, improve display device's encapsulation reliability.
In a first aspect of the embodiments of the present application, a display module is provided, including:
a substrate;
the first metal layer is positioned on one side of the substrate and provided with a packaging groove;
the photoresist auxiliary eliminating layer is positioned on one side, far away from the substrate, of the first metal layer;
and the packaging layer comprises a first part and a second part, the first part is positioned on one side of the photoresist auxiliary elimination layer, which is far away from the first metal layer, and the second part is filled in the packaging groove.
In an alternative embodiment of the first aspect, the photoresist auxiliary removing layer includes a first region, the first region has a through hole, the through hole is communicated with a first packaging groove to form a water vapor releasing groove, and an orthographic projection of the first packaging groove on the substrate is close to an edge region of the substrate.
In an alternative embodiment of the first aspect, an orthographic projection of the moisture release groove on the substrate extends from a side near a central region of the substrate to an edge region away from the central region.
In an alternative embodiment of the first aspect, the auxiliary photoresist removing layer includes a second region, and a portion of the auxiliary photoresist removing layer in the second region covers the second package trench along a sidewall and a bottom surface of the second package trench, and an orthographic projection of the second package trench on the substrate is close to a central region of the substrate.
In an alternative embodiment of the first aspect, a package reinforcement portion is disposed on a sidewall of the package slot, and at least a portion of the package layer is filled in the package reinforcement portion.
In an alternative embodiment of the first aspect, the package reinforcement part is a concave part recessed from the side wall toward the first metal layer.
In an alternative embodiment of the first aspect, the first metal layer is a titanium aluminum titanium metal layer.
In an alternative embodiment of the first aspect, the substrate includes a buffer layer, a gate insulating layer, a second metal layer, a capacitor insulating layer, and an interlayer insulating layer;
the gate insulating layer is positioned on one side of the buffer layer;
the second metal layer is positioned on one side, far away from the buffer layer, of the gate insulating layer;
the capacitor insulating layer is positioned on one side of the second metal layer far away from the grid electrode insulating layer;
the interlayer insulating layer is positioned on one side of the capacitor insulating layer far away from the second metal layer;
the first metal layer is located on one side, far away from the capacitor insulating layer, of the interlayer insulating layer.
In an alternative embodiment of the first aspect, the photoresist assisted removal layer has a thickness of 350nm to 450 nm;
preferably, the thickness of the photoresist auxiliary elimination layer is 400 nm.
In a first aspect of the embodiments of the present application, a display device is provided, which includes the above display module.
In summary, compared with the prior art, the display module and the display device provided in the embodiment of the present application include a substrate, a first metal layer, a photoresist auxiliary removing layer, and a packaging layer. When using this application, through set up the supplementary elimination layer of photoresist in the one side that is located first metal level and keeps away from the base plate, can assist the inclined plane slope that slows down the encapsulation groove that first metal level was seted up to weaken the mobility of photoresist on the inclined plane. In addition, by slowing down the slope gradient of the package groove, the exposure area of the slope can be increased to ensure the elimination of the photoresist on the slope as much as possible. By the design, the photoresist can be prevented from flowing into the packaging groove and generating bubbles in the packaging groove, and when the packaging is carried out through the packaging layer, the packaging reliability between part of the packaging layer and the packaging groove can be ensured, so that the packaging reliability of the whole display module is improved.
Drawings
Fig. 1 is a schematic view of a partial structure of a display module before packaging.
Fig. 2 is a schematic view of a display module package.
Fig. 3 is a schematic partial structure diagram of a display module provided in the embodiment of the present application before packaging.
Fig. 4 is a schematic packaging diagram of a display module according to an embodiment of the present disclosure.
Fig. 5 is a first cross-sectional view of a display module according to an embodiment of the disclosure.
FIG. 6 is a schematic structural diagram of a first metal layer without a photoresist auxiliary removal layer.
FIG. 7 is a schematic diagram of a first metal layer with an additional photoresist-assisted removal layer.
Fig. 8 is a schematic plan view of a display module according to an embodiment of the present application.
Fig. 9 is a second cross-sectional view of a display module according to an embodiment of the disclosure.
Icon:
100-a display device;
10-a substrate; 11-a buffer layer; 12-a gate insulating layer; 13-a second metal layer; 14-a capacitive insulating layer; 15-interlayer insulating layer;
20-a first metal layer; 21-packaging groove; 2101-first package slot; 2102-a second packaging slot; 211-side walls; 2111-package stiffener; 212-bottom surface;
30-photoresist auxiliary elimination layer; 301-a first region; 302-a second region; 31-a through hole;
40-an encapsulation layer;
50-a water vapor release groove;
60-photoresist.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In the description of the present application, it is to be understood that the terms "center," "lateral," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner and are not to be considered limiting of the present application. Further, when an element is referred to as being "formed on" another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present.
Referring to fig. 1 and 2, in order to improve the adhesion of the display module package, the first metal layer 20 contacting the package layer 40 is usually grooved to reduce the flatness of the lower layer of the package layer 40. Generally, the film level difference between the first metal layer 20 and the substrate 10 is about 800nm-850 nm. In practical applications, in order to improve the transmittance of the display module, the photoresist is usually thinned, for example, the thickness of the photoresist is reduced from 2100nm to 1650nm, and the exposure is accordingly reduced. However, the reduction in the exposure amount may result in that the photoresist 60 located at the groove bottom of the first metal layer 20 cannot be removed, thereby leaving the photoresist 60 at the groove bottom of the first metal layer 20. When the encapsulation layer 40 is used for encapsulation, the photoresist 60 remaining on the bottom of the first metal layer 20 is prone to generate bubbles, which may affect the overall encapsulation reliability of the display module.
In view of the above problems, the related art is improved by photoresist overexposure (actively increasing the exposure amount) or adjusting the packaging process. However, the electrical connection between the related layers may be affected by overexposure of the photoresist, and it is difficult to balance the structural adaptation between different layers by adjusting the packaging process.
Based on this, the inventor innovatively provides a display module and display device, can effectively reduce the photoresist residue in the encapsulation groove to avoid remaining photoresist to produce gas in the packaging process, and then avoid the inside bubble that produces of display module, improve display module's encapsulation reliability.
Referring to fig. 3 and 4, a display module 100 according to an embodiment of the present disclosure may include a substrate 10, a first metal layer 20, a photoresist auxiliary removing layer 30, and an encapsulation layer 40. Further, the first metal layer 20 is located on one side of the substrate 10, and the first metal layer 20 is opened with a package slot 21. The auxiliary photoresist removing layer 30 is disposed on a side of the first metal layer 20 away from the substrate 10, and the encapsulation layer 40 includes a first portion disposed on a side of the auxiliary photoresist removing layer 30 away from the first metal layer 20 and a second portion filled in the encapsulation groove 21.
In the embodiment of the present application, the first metal layer 20 may be a power signal line metal layer M3, the substrate may be a TFT (Thin Film Transistor) substrate, and the photoresist auxiliary removing layer 30 may be a passivation layer. It can be understood that, by adding the photoresist auxiliary removing layer 30 on the side of the first metal layer 20 away from the substrate 10, when the first metal layer 20 is etched to form the package groove 21, the slope gradient of the package groove 21 formed in the first metal layer 20 can be reduced, so as to weaken the flowability of the photoresist on the slope. Further, by slowing down the slope gradient of the package groove 21, the exposure area of the slope can be increased to ensure the elimination of the photoresist on the slope as much as possible. With such a design, the generation of bubbles in the package groove 21 due to the flow of the photoresist into the package groove 21 can be avoided, and the package reliability between a part of the package layer 40 and the package groove 21 can be ensured when the package layer 40 is used for packaging, thereby improving the package reliability of the whole display module 100.
In practical application process, in order to further reduce the bubble production risk in the display module packaging process, can also release in order to carry out steam through seting up steam release slot. In this regard, referring to fig. 3, fig. 4 and fig. 5, the auxiliary photoresist removing layer 30 includes a first region 301 corresponding to the first package slot 2101, the first region 301 is opened with a through hole 31, the through hole 31 is communicated with the first package slot 2101 to form a vapor releasing trench 50, and a front projection of the first package slot 2101 on the substrate 10 is close to an edge region of the substrate 10. By adopting the design, the substrate 10 can be pre-baked before the display module 100 is packaged, so that water vapor in the packaging groove 21 area is released, and thus, in the subsequent process of laminating the packaging layer 40 and the substrate 10, the risk of generating bubbles can be further reduced.
In other embodiments, the location of the through-hole 31 may correspond to an edge region of the substrate 10. For example, referring to fig. 5, the photoresist auxiliary removing layer 30 is provided with a through hole 31 in a region corresponding to the edge region. By such design, the moisture can be released from the inside to the outside of the plane of the substrate 10.
For some alternative embodiments, referring to fig. 5 and 8 in combination, an orthographic projection of the water vapor release trench 50 on the substrate 10 extends from a side near a central region of the substrate 10 to an edge region away from the central region. By such design, the moisture release along the moisture release groove 50 can be ensured.
It will be appreciated that fig. 3 and 5 are partial cross-sectional views of the region of fig. 8 after being cut in the direction I-I.
With continued reference to fig. 8 and 9, the auxiliary photoresist removing layer 30 includes a second region 302 opposite to the second packaging cavity 2102, and a portion of the auxiliary photoresist removing layer 30 located in the second region 302 covers the second packaging cavity 2102 along the side wall 211 and the bottom surface 212 of the second packaging cavity 2102, and an orthogonal projection of the second packaging cavity 2102 on the substrate 10 is close to a central region of the substrate 10.
It will be appreciated that fig. 9 is a partial cross-sectional view of the area of fig. 8 after cutting in the direction II-II.
In practical implementation, the encapsulation groove 21 may be modified in order to further improve the encapsulation adhesion between the encapsulation layer 40 and the encapsulation groove 21. In this regard, referring to fig. 3 and 4, the sidewall 211 of the package slot 21 may be opened with a package reinforcement portion 2111. In the embodiment of the present application, the package reinforcing portion 2111 is a concave portion recessed from the sidewall 211 toward the first metal layer 20. By such a design, when the display module 100 is packaged, a portion of the packaging layer 40 may be filled in the package reinforcing portion 2111, so that the packaging adhesion between the packaging layer 40 and the packaging groove 21 may be improved.
In a related embodiment, the first metal layer 20 may be a titanium aluminum titanium metal layer, which is designed to facilitate lateral etching of the first metal layer 20 to achieve an improvement of the package trench 21.
In some possible embodiments, with reference to fig. 3, the substrate 10 may include a buffer layer 11, a gate insulating layer 12, a second metal layer 13, a capacitor insulating layer 14, and an interlayer insulating layer 15. In the embodiment of the present application, the second metal layer 13 may be a gate metal layer M1. Further, the gate insulating layer 12 is located on one side of the buffer layer 11, the second metal layer 13 is located on one side of the gate insulating layer 12 away from the buffer layer 11, the capacitor insulating layer 14 is located on one side of the second metal layer 13 away from the gate insulating layer 12, the interlayer insulating layer 15 is located on one side of the capacitor insulating layer 14 away from the second metal layer 13, and the first metal layer 20 is located on one side of the interlayer insulating layer 15 away from the capacitor insulating layer 14.
In practical implementation, in order to achieve compatibility between the photoresist removal and the package stability, the thickness of the photoresist auxiliary removing layer needs to be properly selected. Based on this, referring to fig. 6 and 7, the thickness of the photoresist auxiliary removing layer 30 may be 350nm to 450 nm. The thickness of the photoresist auxiliary removing layer 30 may be 400nm, and the thickness of the photoresist auxiliary removing layer 30 may be 350nm, 360nm, 370nm, 380nm, 390nm, 410nm, 420nm, 430nm, 440nm or 450 nm.
It can be understood that, as shown in fig. 6, on the premise that the photoresist auxiliary removal layer 30 is not added on one side of the first metal layer 20, after the etching and grooving of the first metal layer 20, an inclination angle between a plane L1 where the side wall of the package groove of the first metal layer 20 is located and a plane L1 where the side wall of the package groove of the first metal layer 20 is located is larger, and an exposure area of the plane L1 is smaller. On one hand, a part of the photoresist may flow to the package groove along the plane L1 where the sidewall of the package groove of the first metal layer 20 is located, thereby causing photoresist residue, and on the other hand, the photoresist may be insufficiently exposed to form residue on the plane L1 where the sidewall of the package groove of the metal layer 20 is located. Thus, bubbles may be generated in the display module 100 during the packaging process, which may affect the overall packaging reliability of the display module 100.
On the basis of fig. 6, fig. 7 shows a schematic view of adding a photoresist auxiliary removing layer 30 on one side of the first metal layer 20. By adding the auxiliary photoresist removing layer 30, after the first metal layer 20 and the auxiliary photoresist removing layer 30 are etched and grooved, an inclination angle between a plane L2 where the side wall of the package groove of the first metal layer 20 and the side wall of the auxiliary photoresist removing layer 30 are located and a plane of the substrate is reduced, and an exposure area of a plane L2 where the side wall of the package groove of the first metal layer 20 and the side wall of the auxiliary photoresist removing layer 30 are located is increased. By such design, the mobility of the photoresist on the plane L2 where the sidewall of the package trench of the first metal layer 20 and the sidewall of the auxiliary photoresist removal layer 30 are located can be weakened, and the photoresist on the plane L2 where the sidewall of the package trench of the first metal layer 20 and the sidewall of the auxiliary photoresist removal layer 30 are located can be prevented from flowing to the package trench and causing photoresist residue. In addition, the sufficient exposure of the photoresist on the plane L2 where the sidewall of the package trench of the first metal layer 20 and the sidewall of the photoresist auxiliary removing layer 30 are located can be ensured, and the photoresist residue can be avoided. Therefore, bubbles generated in the packaging process of the display module 100 can be avoided, and the overall packaging reliability of the display module 100 can be improved.
In addition, the thickness interval of the photoresist auxiliary eliminating layer 30 is 350 nm-450 nm, and the compatibility between photoresist removal and packaging stability can be realized in the thickness interval, so that the problem that the photoresist removal is insufficient due to the overlarge inclination angle can be avoided, and the problem that the packaging stability is influenced due to the overlarge inclination angle can be avoided.
On the basis of the content, the display device is further provided and comprises the display module. This display device can be wearing formula display device such as intelligent bracelet, intelligent wrist-watch or intelligent armlet etc. and this display device is difficult to the gassing at the encapsulation in-process, has good encapsulation reliability, long service life.
In summary, the display module 100 and the display apparatus provided in the embodiment of the present application include a substrate 10, a first metal layer 20, a photoresist auxiliary removing layer 30, and an encapsulation layer 40. When the method is applied, the auxiliary photoresist removing layer 30 is additionally arranged on one side, far away from the substrate 10, of the first metal layer 20, so that the slope of the inclined surface of the packaging groove 21 formed in the first metal layer 20 can be reduced in an auxiliary manner, and the flowability of the photoresist on the inclined surface is weakened. Further, by slowing down the slope gradient of the package groove 21, the exposure area of the slope can be increased to ensure the elimination of the photoresist on the slope as much as possible. With such a design, the generation of bubbles in the package groove 21 due to the flow of the photoresist into the package groove 21 can be avoided, and the package reliability between a part of the package layer 40 and the package groove 21 can be ensured when the package layer 40 is used for packaging, thereby improving the package reliability of the whole display module 100.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A display module (100), comprising:
a substrate (10);
the first metal layer (20), the first metal layer (20) is positioned on one side of the substrate (10), and the first metal layer (20) is provided with an encapsulation groove (21);
a photoresist auxiliary removing layer (30), wherein the photoresist auxiliary removing layer (30) is positioned on one side of the first metal layer (20) far away from the substrate (10);
an encapsulation layer (40), wherein the encapsulation layer (40) comprises a first part and a second part, the first part is positioned on the side of the photoresist auxiliary elimination layer (30) far away from the first metal layer (20), and the second part is filled in the encapsulation groove (21).
2. The display module (100) according to claim 1, wherein the auxiliary photoresist removing layer (30) comprises a first region, the first region (301) is provided with a through hole (31), the through hole (31) is communicated with a first packaging groove (2101) to form a water vapor releasing groove (50), and an orthographic projection of the first packaging groove (2101) on the substrate (10) is close to an edge region of the substrate (10).
3. The display module (100) according to claim 2, wherein an orthographic projection of the moisture releasing groove (50) on the substrate (10) extends from a side close to a central region of the substrate (10) to an edge region away from the central region.
4. The display module (100) according to claim 2, wherein the auxiliary photoresist removing layer (30) comprises a second region (302), a portion of the auxiliary photoresist removing layer (30) located in the second region (302) covers a second package groove (2102) along a side wall (211) and a bottom surface (212) of the second package groove (2102), and an orthographic projection of the second package groove (2102) on the substrate (10) is close to a central region of the substrate (10).
5. The display module (100) according to any one of claims 1 to 4, wherein a package reinforcement portion (2111) is formed on a sidewall (211) of the package slot (21), and at least a portion of the package layer (40) is filled in the package reinforcement portion (2111).
6. The display module (100) according to claim 5, wherein the package reinforcement portion (2111) is a concave portion recessed from the sidewall (211) toward the first metal layer (20).
7. The display module (100) according to claim 5, wherein the first metal layer (20) is a titanium aluminum titanium metal layer.
8. The display module (100) according to claim 5, wherein the substrate (10) comprises a buffer layer (11), a gate insulating layer (12), a second metal layer (13), a capacitor insulating layer (14) and an interlayer insulating layer (15);
the gate insulating layer (12) is positioned on one side of the buffer layer (11);
the second metal layer (13) is positioned on one side, away from the buffer layer (11), of the gate insulating layer (12);
the capacitor insulating layer (14) is positioned on one side of the second metal layer (13) far away from the gate insulating layer (12);
the interlayer insulating layer (15) is positioned on one side, away from the second metal layer (13), of the capacitor insulating layer (14);
the first metal layer (20) is positioned on one side of the interlayer insulating layer (15) far away from the capacitance insulating layer (14).
9. The display module (100) according to claim 1, wherein the photoresist auxiliary removal layer (30) has a thickness of 350nm to 450 nm;
preferably, the thickness of the photoresist auxiliary elimination layer (30) is 400 nm.
10. A display device, characterized in that it comprises a display module (100) according to any one of claims 1 to 9.
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| CN202110622148.9A CN113393767A (en) | 2021-06-04 | 2021-06-04 | Display module and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110622148.9A CN113393767A (en) | 2021-06-04 | 2021-06-04 | Display module and display device |
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| CN113393767A true CN113393767A (en) | 2021-09-14 |
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Cited By (1)
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| CN115206194A (en) * | 2022-07-28 | 2022-10-18 | 昆山国显光电有限公司 | Flexible display module and electronic equipment |
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Application publication date: 20210914 |
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