CN113382592B - Electronic equipment - Google Patents
Electronic equipment Download PDFInfo
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- CN113382592B CN113382592B CN202110681007.4A CN202110681007A CN113382592B CN 113382592 B CN113382592 B CN 113382592B CN 202110681007 A CN202110681007 A CN 202110681007A CN 113382592 B CN113382592 B CN 113382592B
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- circuit board
- sealing
- sealing layer
- bracket
- support
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The application discloses electronic equipment, which belongs to the field of communication equipment, wherein the electronic equipment comprises a circuit board, a sealing element, a bracket, a middle frame assembly and a supporting assembly, wherein the circuit board is provided with a mounting notch formed by inwards extending the edge of the circuit board, and the bracket and the supporting assembly are fixedly connected with the circuit board; the seal includes a first sealing layer located on a first side of the circuit board and a second sealing layer located on a second side of the circuit board; along the thickness direction of the circuit board: the first sealing layer is clamped between the circuit board and the bracket, and the second sealing layer is clamped between the circuit board and the support assembly; along the extending direction of the mounting notch, the sealing piece is clamped between the bracket and the middle frame component. The electronic equipment can provide isolation effect by the wired interface, and the overall thickness of the electronic equipment can be reduced, so that the electronic equipment is favorable for developing towards light weight and thinness.
Description
Technical Field
The application belongs to the technical field of communication equipment, and particularly relates to electronic equipment.
Background
In view of the superiority of the wired connection, the current electronic device still maintains some wired interfaces while further developing wireless connection technology. Taking electronic equipment such as a mobile phone and the like as an example, a charging interface is arranged on the mobile phone, and part of the mobile phone still remains an earphone interface and the like. At present, the silica gel sleeve is sleeved outside the electronic device at the interface, and the silica gel sleeve is in sealing connection with other parts inside the electronic device, so that the inner cavity of the wired interface and the inner space of the electronic device can be mutually separated, and external water vapor is prevented from entering the inner space of the electronic device through the inner cavity of the wired interface, and adverse effects are generated on the safety and service life of the electronic device. However, in the above-mentioned scheme, because the periphery of the interface device is covered with a portion of the silicone sleeve, especially, the opposite sides of the interface device along the thickness direction of the circuit board are covered with the silicone sleeve, the overall thickness of the electronic device is adversely affected, which is not beneficial for the development of the electronic device to be light and thin.
Disclosure of Invention
An objective of the embodiments of the present application is to provide an electronic device, so as to solve the problem that the overall thickness of the electronic device is large because the current electronic device is an isolated wired interface, which is not beneficial to the development of the electronic device to be light and thin.
In order to solve the technical problems, the application is realized as follows:
the embodiment of the application discloses electronic equipment, which comprises: a circuit board, a sealing member, a bracket, a middle frame component and a supporting component, wherein,
the circuit board is provided with a mounting notch which is formed by inwards extending from the edge of the circuit board, and the bracket and the supporting component are fixedly connected with the circuit board;
the seal includes a first sealing layer located on a first side of the circuit board and a second sealing layer located on a second side of the circuit board;
along the thickness direction of the circuit board: the first sealing layer is clamped between the circuit board and the bracket, and the second sealing layer is clamped between the circuit board and the support assembly;
along the extending direction of the mounting notch, the sealing piece is clamped between the bracket and the middle frame component.
The embodiment of the application discloses electronic equipment, it includes the circuit board, the sealing member, the support, center subassembly and supporting component, wherein, the circuit board is equipped with the installation breach that inwards extends from its edge, this installation breach can hold interface device, the sealing member includes first sealing layer and second sealing layer, under the condition that support and supporting component all are connected with the circuit board fixed, first sealing layer can be held between circuit board and support, the second sealing layer can be held between circuit board and supporting component, and along the extending direction of installation breach, the sealing member can be held between support and center subassembly, thereby make the support, first sealing layer, the circuit board, the second sealing layer, supporting component and center subassembly can form an isolated chamber, this isolated chamber has the accent, the accent corresponds with the opening of installation breach, and except for aforesaid accent, the inner wall in isolated chamber is complete inner wall, and then can prevent that the isolated inner wall in accent of self isolated chamber from getting into can flow to the opposite side in chamber through the chamber, guarantee that the region that is equipped with interface device and electronic equipment's inside is isolated with electronic equipment has the waterproof performance even if there is the wire, the interface device is also high.
Meanwhile, as described above, the first sealing layer and the second sealing layer in the sealing member are respectively disposed on opposite sides of the circuit board, and by making one end of the interface device protrude from the through hole of the first sealing layer and making the other end of the interface device protrude from the through hole of the second sealing layer, the sealing member is not stacked on the interface device accommodated in the mounting notch, so that the size of the interface device in the thickness direction of the circuit board is not further increased, and further, in the case of adopting the sealing manner described above, the overall thickness of the electronic device is not further increased, which is favorable for the development of thinning of the electronic device.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:
fig. 1 is an exploded schematic view of an electronic device disclosed in an embodiment of the present application;
fig. 2 is a schematic diagram of a part of a structure in an electronic device disclosed in an embodiment of the present application;
FIG. 3 is a cross-sectional view of the structure shown in FIG. 2 taken along the B-B direction;
FIG. 4 is a cross-sectional view of the structure shown in FIG. 2 taken along the direction C-C;
fig. 5 is a schematic view of a part of a structure including a bracket in an electronic device according to an embodiment of the present application;
fig. 6 is an assembly diagram between a limit protrusion and a bracket in an electronic device according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a seal in an electronic device according to an embodiment of the present disclosure;
fig. 8 is a schematic cross-sectional view of a seal in an electronic device according to an embodiment of the present disclosure.
Reference numerals illustrate:
100-circuit board, 110-mounting notch,
200-sealing element, 210-first sealing layer, 220-second sealing layer, 230-sealing part, 231-connecting section, 232-limiting section, 232 a-first plane, 232 b-second plane, 232 c-arc transition surface, 240-arc chamfer part, and,
300-bracket, 310-bracket body, 320-sinking platform part, 321-arc matching part,
400-middle frame component, 410-side part, 420-main body part, 430-sealing foam,
500-supporting component, 510-supporting board, 520-main upper part, 530-limit projection,
710-interface device, 720-rear housing, 730-display screen, 740-camera.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings of the embodiments of the present application, and it is apparent that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The terms first, second and the like in the description and in the claims, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type and not limited to the number of objects, e.g., the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
The folding mechanism and the electronic device provided by the embodiment of the application are described in detail below by means of specific embodiments and application scenes thereof with reference to the accompanying drawings.
As shown in fig. 1 to 8, the embodiment of the present application discloses an electronic device, which includes a circuit board 100, a bracket 300, a middle frame assembly 400, a support assembly 500, and a sealing member 200, of course, the electronic device further includes structural members such as a rear housing 720 and a display screen 730, and may also be provided with devices such as a camera 740, which are not described in detail herein in view of brevity.
The circuit board 100 is a device for laying out a circuit structure in an electronic device, and the electronic device in the electronic device may be connected to the circuit board 100, and the display screen 730 and the camera 740 may be electrically connected to the circuit board 100 by soldering. In order to reduce the thickness of the whole electronic device, the circuit board 100 is provided with a mounting notch 110 extending inwards from the edge thereof, and the mounting notch 110 can accommodate the interface device 710 during the assembly process of the electronic device, so that the maximum thickness of the combined structure of the interface device 710 and the circuit board 100 is relatively small, and the electronic device can be thinned. The interface device 710 is specifically a device having an interface such as a jack, and the interface device 710 may be provided with a solder tail, so that the interface device 710 is soldered on the circuit board 100 through the solder tail, on one hand, the interface device 710 is fixed, on the other hand, the interface device 710 and the circuit board 100 can be ensured to form an electrical connection, so that the electronic device can be connected with devices such as peripheral products or data lines through the interface device 710 in a wired manner, so as to perform operations such as information interaction or charge and discharge.
As described above, the circuit board 100 is provided with the mounting notch 110, and projections of the first sealing layer 210 and the second sealing layer 220 in the thickness direction of the circuit board 100 each cover the inner wall of the mounting notch 110. That is, the first sealing layer 210 and the second sealing layer 220 cover opposite sides of the inner wall of the mounting gap 110, respectively. In addition, each of the first sealing layer 210 and the second sealing layer 220 is provided with a perforation, the perforation on the first sealing layer 210 penetrates the first sealing layer 210 along the thickness direction of the circuit board 100, and correspondingly, the perforation on the second sealing layer 220 penetrates the second sealing layer 220 along the thickness direction of the circuit board 100, so that one end of the interface device 710 mounted on the mounting notch 110 protrudes from the perforation of the first sealing layer 210, and the other end of the interface device 710 protrudes from the perforation of the second sealing layer 220, so as to reduce the overall thickness of the combined structure of the interface device 710, the circuit board 100 and the sealing member 200.
Specifically, the shape of both the first sealing layer 210 and the second sealing layer 220 may be made the same as or similar to the shape of the inner wall of the mounting gap 110. For example, if the mounting gap 110 is in an arc-shaped U-shaped structure, the first sealing layer 210 and the second sealing layer 220 may also be in an arc-shaped U-shaped structure, and if the mounting gap 110 is in a fold-shaped U-shaped structure, the first sealing layer 210 and the second sealing layer 220 may also be in a fold-shaped U-shaped structure, so as to ensure that both the first sealing layer 210 and the second sealing layer 220 can provide a reliable sealing effect for the connection between the mounting gap 110 and the opposite two side portions 410.
More specifically, the first sealing layer 210 and the second sealing layer 220 may be sheet-shaped structures, the specific shapes of the two may correspond to the specific shape of the mounting notch 110, and the thickness of the first sealing layer 210 and the second sealing layer 220 may be selected according to actual requirements, which is not limited herein. Alternatively, the structures of the first sealing layer 210 and the second sealing layer 220 may be different, and in another embodiment of the present application, the structures of the first sealing layer 210 and the second sealing layer 220 are the same, so that on one hand, the processing difficulty of the sealing member 200 is further reduced, and on the other hand, the structures of the components corresponding to the first sealing layer 210 and the second sealing layer 220 in the sealing member 200 are substantially the same, so that the overall sealing performance of the sealing member 200 is improved to a certain extent.
The support assembly 500 may be, in particular, a front housing in an electronic device and the display screen 730 may be mounted on a side of the support assembly 500 facing away from the circuit board 100. Both the bracket 300 and the support assembly 500 are fixedly connected to the circuit board 100, thereby providing a necessary condition for the electronic device to form a stable insulating cavity at the area where the mounting notch 110 is located. Specifically, the support 300 and the circuit board 100, and the support assembly 500 and the circuit board 100 may be fixedly connected by a connection member such as a screw, or the support 300 and the circuit board 100 may be fixed to each other by bonding, and the support 300 and the support assembly 500 may be fixed to each other. In addition, the specific shapes of the bracket 300, the supporting member 500 and the circuit board 100 are not limited herein, and it is only necessary to ensure that the areas of the bracket 300 and the supporting member 500, which are opposite to the mounting notch 110 in the circuit board 100, respectively, have a non-porous surface, so as to ensure that the formed cavity has a complete cavity wall, thereby preventing moisture or dust entering from the opening of the mounting notch 110 from entering the interior of the electronic device through the cavity wall. The area of the bracket 300 and the support assembly 500 opposite to the mounting notch 110 may have a complete surface without holes, or the area of the bracket 300 and the support assembly 500 opposite to the mounting notch 110 may be formed into a complete surface by coating an adhesive layer or covering an insulating layer.
In the case where the bracket 300 and the support member 500 are fixed to each other with respect to the circuit board 100, the first sealing layer 210 can be clamped between the circuit board 100 and the bracket 300, and the second sealing layer 220 can be clamped between the circuit board 100 and the support member 500 in the thickness direction of the circuit board 100, so that the bracket 300, the first sealing layer 210, the circuit board 100, the second sealing layer 220, and the support member 500 can form an insulating cavity, and the cavity opening of the insulating cavity corresponds to the position of the opening of the mounting gap 110 at the edge of the circuit board 100.
However, a gap may still exist between the cavity opening of the isolation cavity formed by the above components and the middle frame assembly 400, based on this situation, the sealing member 200 is clamped between the bracket 300 and the middle frame assembly 400 along the extending direction of the mounting notch 110, so that a press fit relationship is formed between the sealing member 200 and the middle frame assembly 400, the gap possibly existing between the middle frame assembly 400 and the cavity opening of the formed isolation cavity is sealed, the formed isolation cavity has a complete inner wall except for the cavity opening corresponding to the opening of the mounting notch 110, and it is ensured that water vapor or dust entering the isolation cavity from the opening of the mounting notch 110 can only be discharged from the cavity opening of the isolation cavity, but cannot pass through the cavity wall of the isolation cavity to enter the other side of the isolation cavity. The thickness direction of the circuit board 100 is specifically the direction M in fig. 4, and the extending direction of the mounting notch 110 is specifically the direction N in fig. 4.
Specifically, by designing the specific structure of the bracket 300, for example, the cross section of the bracket 300 may be a bent structure, which may include a cross beam and a longitudinal beam connected to each other, the cross beam may be engaged with the first sealing layer 210, and the longitudinal beam may be engaged with the entire sealing member 200, so as to ensure that the bracket 300 may provide a limiting effect for the first sealing layer 210 in the thickness direction of the circuit board 100 and a limiting effect for the sealing member 200 in the extending direction of the mounting notch 110. In addition, by extending the sealing member 200 in a direction approaching the middle frame assembly 400 relative to the cross beam, the extending portion of the sealing member 200 can be matched with the middle frame assembly 400, and the extending portion of the sealing member 200 relative to the bracket 300 can be pressed under the limiting action of the bracket 300, so that a stable and reliable sealing connection relationship is formed with the middle frame assembly 400.
It should be noted that, since the support 300 and the middle frame assembly 400 can provide the seal member 200 with the limiting function along the axial direction, and the support 300, the circuit board 100 and the support assembly 500 can provide the seal member 200 with the pressing function along the thickness direction of the circuit board 100, even if the support assembly 500 and the middle frame do not provide the seal member 200 with the limiting function along the extending direction of the mounting notch 110, the seal member 200 can be basically ensured to form a reliable sealing connection relationship with the middle frame, and the formed isolation cavity is ensured to have a complete cavity wall.
The embodiment of the application discloses an electronic device, which includes a circuit board 100, a sealing member 200, a bracket 300, a middle frame assembly 400 and a supporting assembly 500, wherein, the circuit board 100 is provided with a mounting notch 110 extending inwards from the edge of the circuit board 100, the mounting notch 110 can accommodate an interface device 710, the sealing member 200 includes a first sealing layer 210 and a second sealing layer 220, under the condition that the bracket 300 and the supporting assembly 500 are fixedly connected with the circuit board 100, the first sealing layer 210 can be clamped between the circuit board 100 and the bracket 300, the second sealing layer 220 can be clamped between the circuit board 100 and the supporting assembly 500, and along the extending direction of the mounting notch 110, the sealing member 200 can be clamped between the bracket 300 and the middle frame assembly 400, so that the bracket 300, the first sealing layer 210, the circuit board 100, the second sealing layer 220, the supporting assembly 500 and the middle frame assembly 400 can form a cavity, the cavity opening corresponds to the opening of the mounting notch 110, and besides the cavity opening, the inner wall of the cavity is a complete inner wall, and further, the inner wall of the cavity can be prevented from flowing from entering the electronic device through the inner wall of the mounting notch 110, and the electronic device has a high moisture isolation area, and even if the electronic device is provided with an interface, and the moisture isolation area is guaranteed.
Meanwhile, as described above, the first sealing layer 210 and the second sealing layer 220 in the sealing member 200 are respectively disposed at opposite sides of the circuit board 100, and by making one end of the interface device 710 protrude from the through hole of the first sealing layer 210 and the other end of the interface device 710 protrude from the through hole of the second sealing layer 220, the sealing member 200 is not stacked on the interface device 710 accommodated at the mounting notch 110, so that the size of the interface device 710 in the thickness direction of the circuit board 100 is not further increased, and further, in the case of adopting the above-described sealing manner, the overall thickness of the electronic device is not further increased, which is advantageous for the development of the electronic device toward light and slim.
As described above, the first sealing layer 210 is clamped between the support 300 and the circuit board 100, and optionally, at least one side surface of the first sealing layer 210 is provided with a strip-shaped sealing protrusion, and the extending direction of the strip-shaped sealing protrusion is the same as that of the whole first sealing layer 210, for example, the strip-shaped sealing protrusion and the first sealing layer 210 may be arc-shaped U-shaped structures. More specifically, both opposite sides of the first sealing layer 210 may be provided with strip-shaped sealing protrusions, and the number of strip-shaped sealing protrusions per side may be one or more. During the process of assembling the first sealing layer 210, the support 300 and the circuit board 100 are fixed to each other, so that the support 300 and the circuit board 100 can apply a pressing action to the first sealing layer 210, thereby causing a certain elastic deformation of the strip-shaped sealing protrusions, and further enhancing the sealing fit tightness between the first sealing layer 210 and the support 300 and between the first sealing layer 210 and the circuit board 100. Correspondingly, at least one surface of the opposite sides of the second sealing layer 220 may also be provided with a strip-shaped sealing protrusion, so as to promote the tightness of the sealing engagement between the circuit board 100 and the supporting component 500.
Optionally, seal 200 further includes a seal portion 230, seal portion 230 includes a connection section 231, and respective first ends of first seal layer 210 and second seal layer 220 are connected by connection section 231 of seal portion 230, so that first seal layer 210 and second seal layer 220 can be connected as a unit, facilitating installation and transportation of seal 200. Specifically, the connection section 231 may be a block-shaped structural member, and in order to improve the processing efficiency of the sealing member 200, the first sealing layer 210, the second sealing layer 220 and the sealing portion 230 may be formed by integrally injection molding, which may further improve the connection reliability between the parts, and may further improve the sealing performance of the whole sealing member 200.
Further, the sealing portion 230 may further include a limiting section 232, where the limiting section 232 is connected to the connecting section 231, and the limiting section 232 protrudes toward a side of the first sealing layer 210 away from the second sealing layer 220, that is, the limiting section 232 protrudes with respect to the first sealing layer 210, in this case, the limiting section 232 may be clamped between the bracket 300 and the middle frame assembly 400, so that the entire sealing member 200 may be clamped between the bracket 300 and the middle frame assembly 400 along the extending direction of the mounting notch 110. Specifically, the limiting section 232 may be a block structure, and in the case that no other structure except the limiting section 232 is disposed between the bracket 300 and the middle frame assembly 400, the size of the limiting section 232 in the extending direction of the mounting notch 110 is slightly larger than the distance between the bracket 300 and the middle frame assembly 400, so that after the bracket 300 and the circuit board 100 are mutually fixed, the limiting section 232 is pressed between the bracket 300 and the middle frame assembly 400, and further the sealing member 200 and the middle frame assembly 400 form a better sealing connection relationship.
Compared with the technical scheme that the whole sealing member 200 is arranged between the bracket 300 and the middle frame assembly 400 in a squeezed mode, the reliability of the clamping effect provided by the bracket 300 and the middle frame assembly 400 can be improved due to the fact that the size of the part, clamped by the bracket 300 and the middle frame assembly 400, of the sealing member 200 is relatively small; in addition, in the case of adopting the above technical solution, the situation that the first sealing layer 210 and/or the second sealing layer 220 is curled due to the extrusion action of the extending direction of the mounting notch 110 can be reduced as much as possible, so as to further improve the sealing effect between the bracket 300 and the circuit board 100 and/or between the supporting component 500 and the circuit board 100.
In order to prevent the connection between the limiting segment 232 and the first sealing layer 210 from forming a sealing dead angle in the process of being matched with the support 300, further, in the connection between the limiting segment 232 and the first sealing layer 210, an arc chamfer portion 240 is arranged towards the connection corner of the support 300, correspondingly, an arc matching portion 321 is arranged at the end of the support 300, and the arc matching portion 321 is in extrusion fit with the arc chamfer portion 240. Specifically, the arc shapes and the like of the arc-shaped fitting portion 321 and the arc-shaped chamfering portion 240 may be determined according to actual conditions, and are not limited herein.
Under the condition of adopting the technical scheme, when the support 300 and the circuit board 100 are mutually fixed, so that the support 300 and the circuit board 100 extrude the first sealing layer 210, and the support 300 and the middle frame assembly 400 extrude the limiting section 232, a sealing dead angle can be basically prevented from being formed between the connecting part of the limiting section 232 and the first sealing layer 210 and the support 300, the attaching reliability between the support 300 and the sealing piece 200 can be improved, and the sealing condition of the cavity wall of the isolated cavity formed by the components can be further ensured to be better.
In order to further improve the sealing reliability between the sealing member 200 and the middle frame assembly 400, optionally, the second ends of the first sealing layer 210 and the second sealing layer 220 may be connected by the connection section 231 of the sealing portion 230, and the structures of the two sealing portions 230 are identical. In this case, both ends of the first sealing layer 210 may be in sealing engagement with the middle frame assembly 400 through the limiting sections 232 of the sealing portion 230, so that the sealing reliability between the sealing member 200 and the middle frame assembly 400 may be improved, and further, the sealing performance of the cavity wall of the formed isolation cavity may be ensured to be higher.
Optionally, the support assembly 500 includes a support plate 510 and a main upper 520, which are connected to each other, the main upper 520 is sandwiched between the middle frame assembly 400 and the support plate 510 along the extension direction of the mounting gap 110, the sealing member 200 is sandwiched between the bracket 300 and the main upper 520, and the sealing member 200 is further sandwiched between the support plate 510 and the main upper 520. In this embodiment, both opposite sides of the sealing member 200 may be subjected to the clamping action along the extending direction of the mounting notch 110, so that the sealing reliability between the sealing member 200 and the middle frame assembly 400, specifically, between the sealing member 200 and the main upper 520 may be further improved.
Specifically, the shape and size of each of the support plate 510 and the main upper 520 may be determined according to actual requirements, the support plate 510 and the main upper 520 may be fixed to each other by means of connection or adhesion, and a structure such as a limiting groove may be provided on the support plate 510, so as to ensure that the support plate 510 may provide a limiting effect along the extending direction of the mounting notch 110 for the seal member 200, and correspondingly, the main upper 520 may also include a lateral extension and a longitudinal extension that are connected to each other, so as to ensure that the main upper 520 may provide a limiting effect along the thickness direction of the circuit board 100 for the seal member 200 through the lateral extension, may also provide a limiting effect along the extending direction of the mounting notch 110 for the seal member 200 through the longitudinal extension, and the lateral extension of the main upper 520 may be connected to the support plate 510, and may provide a supporting effect for the display screen 730 in the electronic device, and the like, and the longitudinal extension of the main upper 520 may be clamped between the seal member 200 and the middle frame assembly 400.
Further, the middle frame assembly 400 may include a side portion 410 and a body portion 420, the side portion 410 being coupled to an outer circumference of the body portion 420, the side portion 410 having a side surface of the electronic device, the body portion 420 being disposed inside the electronic device, and correspondingly, the main upper 520 being interposed between the side portion 410 and the support plate 510 along an extension direction of the mounting gap 110; correspondingly, the bracket 300 is clamped between the main body 420 and the circuit board 100 in the thickness direction of the circuit board 100. Specifically, the actual structures and dimensions of the side portion 410 and the main body portion 420 may be set correspondingly according to specific situations, and the present invention is not limited thereto, and the main body portion 420 and the side portion 410 may be made of hard materials such as plastics or metals, and may be fixed together by welding, heat sintering or bonding, and the main body portion 420 and the bracket 300 may be fixed to each other by bonding or connecting members.
In consideration of the structures such as holes or grooves which may be formed on the bracket 300 and the main body 420 to provide a mounting base function or an avoidance space function for other electronic devices in the electronic apparatus, in order to reduce the difficulty of forming a complete surface in the area opposite to the mounting notch 110 in the bracket 300, optionally, a sealing foam 430 is disposed between the bracket 300 and the main body 420 in a pressing manner, and the projection of the sealing foam 430 in the thickness direction of the circuit board 100 covers the mounting notch 110, in this case, the complete surface in the area corresponding to the mounting notch 110 in the circuit board 100 can be ensured by the sealing foam 430, so that the integrity of the cavity wall of the formed isolated cavity is better, regardless of the specific structures of the bracket 300 and the main body 420. In addition, in the case that the sealing foam 430 is provided, the bracket 300 and the sealing foam 430, and the sealing foam 430 and the main body 420 may be fixed to each other by means of glue adhesion, which may further improve the integrity and sealing performance of the surface of the combined structure formed by the circuit board 100, the sealing foam 430 and the main body 420.
In order to improve the bonding reliability between the support 300, the sealing member 200 and the main upper 520 and the sealing foam 430, optionally, the first surface of the limiting section 232 facing the sealing foam 430 includes a first plane 232a, a second plane 232b and an arc transition surface 232c, the first plane 232a is flush with the surface of the support 300 facing the sealing foam 430, the second plane 232b is flush with the surface of the main upper 520 facing the sealing foam 430, the first plane 232a and the second plane 232b are connected by the arc transition surface 232c, and the sealing foam 430 is bonded to the support 300, the first surface and the main upper 520.
Under the condition of adopting the technical scheme, by means of the transitional effect of the arc transitional surface 232c, the surface of the bracket 300, the first surface of the sealing element 200 and the surface of the main upper part 520 are mutually connected to form a foam bonding surface which is gentle and almost has no dead angle, so that the sealing foam 430 made of flexible materials can form a relatively tight bonding relationship with the foam bonding surface, and gaps exist between any one of the bracket 300, the sealing element 200 and the main upper part 520 and the sealing foam 430, thereby adversely affecting the isolation reliability of the formed isolation cavity.
In the case where the middle frame assembly 400 includes the side portion 410 and the main body portion 420, further, the stand 300 may include the stand body 310 and the sink deck portion 320, the sink deck portion 320 being concavely disposed toward one side of the stand body 310 with respect to the stand body 310, that is, both the sink deck portion 320 and the stand body 310 are not in the same plane. Specifically, the sink deck 320 and the bracket body 310 may be formed by a plate-like structural member through sheet metal. In the thickness direction of the circuit board 100, the first sealing layer 210 is clamped between the circuit board 100 and the counter part 320, and the counter part 320 is clamped between the circuit board 100 and the main body part 420, in this case, by reducing the stress area of the part of the support 300 corresponding to the first sealing layer 210, the pressing effect of the main body part 420 on the counter part 320 is better, so that the pressing effect of the counter part 320 on the first sealing layer 210 is further improved, and the sealing effect between the counter part 320 and the circuit board 100 is better. Of course, a structure similar to the counter portion 320 may be disposed in the region of the main body 420 corresponding to the counter portion 320, so as to further reduce the contact area between the main body 420 and the counter portion 320 and improve the holding effect between the main body 420 and the counter portion 320.
As described above, the sealing member 200 may be pressed between the bracket 300 and the middle frame assembly 400 in the extending direction of the mounting notch 110, and the positioning relationship between the bracket 300 and the middle frame assembly 400 may be formed by fixing the bracket 300, the circuit board 100 and the middle frame assembly 400 to each other. In another embodiment of the present application, a side of the support assembly 500 facing the circuit board 100 is provided with a limit protrusion 530, and the bracket 300 is pressed between the sealing member 200 and the limit protrusion 530 in the extending direction of the mounting gap 110. That is, in the present embodiment, by providing the limiting projection 530, the movement of the bracket 300 in the direction away from the middle frame assembly 400 along the extending direction of the mounting notch 110 is further limited, so that the sealing member 200 can be stably clamped between the bracket 300 and the middle frame assembly 400, and the sealing relationship between the sealing member 200 and the middle frame assembly 400 is stable and reliable.
Specifically, the dimensions of the limiting protrusion 530 in the extending direction of the mounting notch 110 may be determined according to the dimensions of the bracket 300, the seal member 200, and the like in the corresponding directions, so that when the bracket 300 is mounted to the limiting protrusion 530, a pressing action may be provided for the seal member 200, so that the seal member 200 is press-fitted with the middle frame assembly 400.
More specifically, the number of the limiting protrusions 530 may be one, and one limiting protrusion 530 may be disposed corresponding to the position of the sealing member 200, so that the connecting line between the limiting action point provided by the limiting protrusion 530 and the stress action point of the sealing member 200 is parallel to the extending direction of the mounting notch 110 as much as possible. Optionally, the number of the limiting protrusions 530 may be multiple, so that under the action of the multiple limiting protrusions 530, on one hand, the reliability of the support 300 in extruding the sealing element 200 can be further improved, and on the other hand, the situation that the support 300 rotates in a deflection manner with one limiting protrusion 530 as a fulcrum can be prevented, and the stability of the support 300 in extruding the sealing element 200 is improved; the plurality of limiting protrusions 530 may be disposed on the support assembly 500 at intervals, and the plurality of limiting protrusions 530 may be disposed as dispersedly as possible. More specifically, the number of the limit protrusions 530 may be two, and the two limit protrusions 530 may be disposed at opposite sides of the sealing member 200 in a direction perpendicular to the extending direction of the mounting gap 110 and the thickness direction of the circuit board 100, respectively, so as to provide a relatively uniform and stable limit effect for the bracket 300 to press the sealing member 200.
The electronic device disclosed in the embodiment of the application may be a mobile phone, a computer, an electronic book reader, a wearable device or the like, and the embodiment of the application is not limited to the specific type of the electronic device.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Furthermore, it should be noted that the scope of the methods and apparatus in the embodiments of the present application is not limited to performing the functions in the order shown or discussed, but may also include performing the functions in a substantially simultaneous manner or in an opposite order depending on the functions involved, e.g., the described methods may be performed in an order different from that described, and various steps may also be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.
The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those of ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are also within the protection of the present application.
Claims (7)
1. An electronic device, comprising: a circuit board, a sealing member, a bracket, a middle frame component and a supporting component, wherein,
the circuit board is provided with a mounting notch which is formed by inwards extending from the edge of the circuit board, and the bracket and the supporting component are fixedly connected with the circuit board;
the sealing piece comprises a first sealing layer, a second sealing layer and a sealing part, wherein the first sealing layer is positioned on a first side of the circuit board, and the second sealing layer is positioned on a second side of the circuit board;
along the thickness direction of the circuit board: the first sealing layer is clamped between the circuit board and the bracket, and the second sealing layer is clamped between the circuit board and the support assembly;
the sealing piece is clamped between the bracket and the middle frame component along the extending direction of the mounting notch;
the sealing part comprises a connecting section and a limiting section, the limiting section is connected with the connecting section, one end of the first sealing layer and one end of the second sealing layer are connected through the connecting section, the limiting section faces away from the first sealing layer, protrudes out of one side of the second sealing layer, and is arranged in the extending direction of the mounting notch in a clamping mode, the limiting section is arranged between the support and the middle frame assembly, an arc-shaped chamfer portion is arranged on one side of the support, facing to a connecting corner between the limiting section and the first sealing layer, an arc-shaped matching portion is arranged at the end of the support, and the arc-shaped matching portion is in extrusion fit with the arc-shaped chamfer portion.
2. The electronic device according to claim 1, wherein the other end of the first sealing layer and the other end of the second sealing layer are connected by a connecting section of the other sealing portion, and the two sealing portions are identical in structure.
3. The electronic device of claim 1, wherein the support assembly comprises a support plate and a main body connected to each other, the main body is sandwiched between the middle frame assembly and the support plate along an extending direction of the mounting gap, the first sealing layer is sandwiched between the bracket and the main body, and the second sealing layer is sandwiched between the support plate and the main body.
4. The electronic device according to claim 3, wherein the center frame assembly includes a side portion and a main body portion, the side portion being connected to an outer periphery of the main body portion, the main body being sandwiched between the side portion and the support plate in an extending direction of the mounting gap; along the thickness direction of circuit board, the support centre gripping in main part with between the circuit board, the support with extrude between the main part and be provided with sealed bubble cotton, sealed bubble cotton is followed the projection of the thickness direction of circuit board covers the installation breach.
5. The electronic device of claim 4, wherein the first surface of the spacing section facing the sealing foam comprises a first plane, a second plane and an arc-shaped transition surface, the first plane is flush with a side surface of the support facing the sealing foam, the second plane is flush with a side surface of the main body facing the sealing foam, the first plane and the second plane are connected by the arc-shaped transition surface, and the sealing foam is attached to the support, the first surface and the main body.
6. The electronic device according to claim 4, wherein the holder includes a holder body and a sinking stage portion that is recessed toward one side of the holder body with respect to the holder body, the first sealing layer being sandwiched between the circuit board and the sinking stage portion, and the sinking stage portion being sandwiched between the circuit board and the main body portion in a thickness direction of the circuit board.
7. The electronic device according to claim 1, wherein a side of the support member facing the circuit board is provided with a limit projection, and the bracket is disposed between the seal member and the limit projection in a direction in which the mounting notch extends.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110681007.4A CN113382592B (en) | 2021-06-18 | 2021-06-18 | Electronic equipment |
| PCT/CN2022/098328 WO2022262666A1 (en) | 2021-06-18 | 2022-06-13 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110681007.4A CN113382592B (en) | 2021-06-18 | 2021-06-18 | Electronic equipment |
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| Publication Number | Publication Date |
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| CN113382592A CN113382592A (en) | 2021-09-10 |
| CN113382592B true CN113382592B (en) | 2023-06-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110681007.4A Active CN113382592B (en) | 2021-06-18 | 2021-06-18 | Electronic equipment |
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| Country | Link |
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| CN (1) | CN113382592B (en) |
| WO (1) | WO2022262666A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113382592B (en) * | 2021-06-18 | 2023-06-23 | 维沃移动通信有限公司 | Electronic equipment |
| CN114786079A (en) * | 2022-05-26 | 2022-07-22 | 维沃移动通信有限公司 | Electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207625639U (en) * | 2017-11-09 | 2018-07-17 | 广东欧珀移动通信有限公司 | Mobile terminal |
| CN110602902A (en) * | 2019-08-26 | 2019-12-20 | Oppo（重庆）智能科技有限公司 | Electronic device |
| CN213028146U (en) * | 2020-10-30 | 2021-04-20 | 维沃移动通信有限公司 | Electronic device |
| CN112739095A (en) * | 2020-12-23 | 2021-04-30 | Oppo广东移动通信有限公司 | Electronic device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102229153B1 (en) * | 2014-06-27 | 2021-03-18 | 삼성전자주식회사 | Connecor device and electronic device with the same |
| CN207625611U (en) * | 2017-11-09 | 2018-07-17 | 广东欧珀移动通信有限公司 | Mobile terminal and its earphone seat installation structure |
| KR102372641B1 (en) * | 2018-11-30 | 2022-03-10 | 삼성전자주식회사 | Sealing structure and electronic device including the same |
| CN209233929U (en) * | 2019-01-04 | 2019-08-09 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN211429364U (en) * | 2020-03-26 | 2020-09-04 | Oppo广东移动通信有限公司 | Electronic device |
| CN113382592B (en) * | 2021-06-18 | 2023-06-23 | 维沃移动通信有限公司 | Electronic equipment |
-
2021
- 2021-06-18 CN CN202110681007.4A patent/CN113382592B/en active Active
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- 2022-06-13 WO PCT/CN2022/098328 patent/WO2022262666A1/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207625639U (en) * | 2017-11-09 | 2018-07-17 | 广东欧珀移动通信有限公司 | Mobile terminal |
| CN110602902A (en) * | 2019-08-26 | 2019-12-20 | Oppo（重庆）智能科技有限公司 | Electronic device |
| CN213028146U (en) * | 2020-10-30 | 2021-04-20 | 维沃移动通信有限公司 | Electronic device |
| CN112739095A (en) * | 2020-12-23 | 2021-04-30 | Oppo广东移动通信有限公司 | Electronic device |
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| Publication number | Publication date |
|---|---|
| CN113382592A (en) | 2021-09-10 |
| WO2022262666A1 (en) | 2022-12-22 |
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