CN113381185B - 5G mobile terminal MIMO antenna based on chip integrated module - Google Patents
5G mobile terminal MIMO antenna based on chip integrated module Download PDFInfo
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- CN113381185B CN113381185B CN202110533246.5A CN202110533246A CN113381185B CN 113381185 B CN113381185 B CN 113381185B CN 202110533246 A CN202110533246 A CN 202110533246A CN 113381185 B CN113381185 B CN 113381185B
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- 239000002184 metal Substances 0.000 claims abstract description 42
- 230000005855 radiation Effects 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 230000008878 coupling Effects 0.000 claims abstract description 10
- 238000010168 coupling process Methods 0.000 claims abstract description 10
- 238000005859 coupling reaction Methods 0.000 claims abstract description 10
- 238000002955 isolation Methods 0.000 abstract description 6
- 238000013461 design Methods 0.000 abstract description 4
- 238000010295 mobile communication Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000001788 irregular Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
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Abstract
The invention discloses a 5G mobile terminal MIMO antenna based on a chip integrated module unit, which is applicable to the field of mobile communication and comprises: a dielectric substrate, a system metal floor and four integrated chip modules. The four integrated chip modules have the same physical size, are arranged at four corners of the system metal floor and are symmetrically distributed; each integrated chip module comprises two sub-antenna units working at 3.5GHz and two corresponding feed ports; each sub-antenna unit consists of a radiation slot and a feed microstrip line; in addition, a microstrip line branch structure is added between the two sub-antenna units, and an additional reverse-phase coupling path is introduced between the sub-antenna units, so that the aim of improving the isolation between the sub-antenna units is fulfilled. This 5G mobile terminal MIMO antenna has used the chip collection moulding piece of integrated design, and convenient the dismantlement is changed, and has the space-saving, low cost's advantage, consequently has good application prospect in 5G mobile phone terminal.
Description
The technical field is as follows:
the invention belongs to the technical field of mobile communication, relates to a design of a mobile phone antenna, and particularly relates to a 5G mobile terminal MIMO antenna based on a chip integration module.
Background art:
in recent years, the progress of antenna technology has been synchronized with the development of mobile phones. With the increase of the demand of users for mobile phone communication, 5G technology is born. The 5G technology has many advantages such as high communication capacity, high communication rate, low time delay and the like. To meet the target of 5G, MIMO technology capable of effectively expanding channel capacity has been developed. In 2015 world radio society, 3.5GHz is confirmed to be one of Sub-6GHz bands, which is also a current research hotspot.
However, as the 5G technology is developed, more MIMO sub-antenna units need to be integrated into a limited space of a mobile terminal, and as the number of the sub-antenna units increases, the sub-antenna units are closer to each other, so that strong surface waves and spatial inductive coupling occur between the sub-antennas, and the performance of the MIMO antenna array, such as frequency band, efficiency, etc., is deteriorated. Therefore, how to adopt reasonable and effective decoupling measures to ensure the comprehensive performance of the antenna array is a problem to be researched and solved urgently to design the handheld terminal MIMO antenna meeting the practical application requirements.
The invention content is as follows:
the invention provides a 5G mobile terminal MIMO antenna based on a chip integrated module for solving the problems in the prior art, wherein two sub-antenna units working at 3.5GHz are integrated into a chip module, and the two sub-antenna units can be isolated highly through the decoupling of a parasitic unit.
The technical scheme adopted by the invention is as follows: A5G mobile terminal MIMO antenna based on a chip integrated module comprises a dielectric substrate and a system metal floor printed on the upper surface of the dielectric substrate, a first integrated chip module, a second integrated chip module, a third integrated chip module and a fourth integrated chip module which have the same size and are in mirror symmetry are welded at four corners of the upper surface of the medium substrate, the first integrated chip module comprises a medium base layer, a first sub-antenna unit and a second sub-antenna unit, wherein the first sub-antenna unit and the second sub-antenna unit are positioned on the medium base layer, the first sub-antenna unit consists of a first feed microstrip line, a first radiation gap and a first feed port, the second sub-antenna unit consists of a second feed microstrip line, a second radiation gap and a second feed port, and an additional decoupling structure unit consisting of microstrip line branch structure is also introduced between the first sub-antenna unit and the second sub-antenna unit.
Furthermore, the first integrated chip module, the second integrated chip module, the third integrated chip module and the fourth integrated chip module have the same physical structure, and the sizes of the first integrated chip module, the second integrated chip module, the third integrated chip module and the fourth integrated chip module are all 20 multiplied by 5 multiplied by 1mm 3 。
Furthermore, the thickness of the medium base layer is 1mm, the upper surface of the medium substrate is provided with a top metal circuit layer, and the lower surface of the medium substrate is provided with a bottom metal circuit layer.
Further, the first sub-antenna unit and the second sub-antenna unit are 10 × 5 × 1mm in size 3 。
Furthermore, the width of the first feed microstrip line in the first sub-antenna unit and the width of the second feed microstrip line in the second sub-antenna unit are 0.5mm, the first feed microstrip line and the second feed microstrip line are in an L shape and are located on the top metal circuit layer, and the first radiation gap and the second radiation gap are formed by digging a bending gap with the width of 0.5mm on the bottom metal circuit layer.
Further, the first feeding port and the second feeding port are connected with the microstrip line for feeding.
Furthermore, the decoupling structure unit is located on the top metal circuit layer, is composed of two sections of L-shaped microstrip line branch structures which are symmetrically distributed, and is respectively connected with the first feed microstrip line and the second feed microstrip line.
Furthermore, the overall shape of the system metal floor is rectangular, and hollowed areas serving as mounting bases for the first integrated chip module, the second integrated chip module, the third integrated chip module and the fourth integrated chip module are distributed at four corners of the system metal floor.
Furthermore, the bottom metal circuit layers on the lower surfaces of the first integrated chip module, the second integrated chip module, the third integrated chip module and the fourth integrated chip module are welded with the mounting base on the system metal floor.
The invention has the following beneficial effects:
(1) the size of the integrated module chip is very small, only 20X 5X 1mm 3 The free space volume occupied by the MIMO antenna array can be effectively reduced.
(2) The port isolation between the two sub-antenna units is very high, and 21dB isolation is realized in the 3400-3600MHz frequency band.
(3) The decoupling circuit is small in size and equivalent to a distributed capacitor, a lumped element is not needed, and the manufacturing cost of the antenna and the complexity of the decoupling circuit are reduced.
Description of the drawings:
fig. 1 is a three-dimensional structural diagram of a MIMO chip antenna of the present invention.
Fig. 2 is a three-dimensional structure diagram of a first integrated chip module in the MIMO chip antenna according to the present invention.
Fig. 3 is an S-parameter curve in the same antenna module of the MIMO chip antenna of the present invention.
Fig. 4 shows the isolation between different antenna modules in the MIMO chip antenna according to the present invention.
Fig. 5 shows the radiation efficiency when different ports in the MIMO chip antenna are excited.
The specific implementation mode is as follows:
the invention will be further described with reference to the accompanying drawings.
The invention relates to a 5G mobile terminal MIMO antenna based on a chip integrated module, which comprises a dielectric substrate 6 and a system metal floor 5 printed on the upper surface of the dielectric substrate 6, wherein four corners on the upper surface of the dielectric substrate 6 are welded with a first integrated chip module 1, a second integrated chip module 2, a third integrated chip module 3 and a fourth integrated chip module 4 which have the same size and are in mirror symmetry, the first integrated chip module 1 comprises a dielectric base layer 1h, and a first sub-antenna unit and a second sub-antenna unit which are positioned on the dielectric base layer 1h, the first sub-antenna unit consists of a first feed microstrip line 1a, a first radiation slot 1d and a first feed port 1f, and the second sub-antenna unit consists of a second feed microstrip line 1b, a second radiation slot 1c and a second feed port 1G; in addition, an additional decoupling structure unit 1e formed by a microstrip line branch structure is introduced between the first sub-antenna unit and the second sub-antenna unit, and the decoupling structure unit 1e introduces an additional reverse phase coupling path between the first sub-antenna unit and the second sub-antenna unit, so that the spacing degree between the first sub-antenna unit and the second sub-antenna unit is improved.
The first integrated chip module 1, the second integrated chip module 2, the third integrated chip module 3 and the fourth integrated chip module 4 have the same physical structure, and the sizes of the first integrated chip module, the second integrated chip module, the third integrated chip module and the fourth integrated chip module are all 20 multiplied by 5 multiplied by 1mm 3 。
The thickness of medium basic unit 1h is 1mm, and the upper surface of medium base plate 1h is equipped with top metal circuit layer, and the lower surface of medium base plate 1h is equipped with bottom metal circuit layer.
The sizes of the first sub-antenna unit and the second sub-antenna unit are 10 multiplied by 5 multiplied by 1mm 3 。
The width of the first feed microstrip line 1a in the first sub-antenna unit and the width of the second feed microstrip line 1b in the second sub-antenna unit are 0.5mm, and the feed microstrip lines are L-shaped and are positioned on the top metal circuit layer. The first radiation slit 1d and the second radiation slit 1c are formed by cutting a curved slit having a width of 0.5mm in the bottom metal circuit layer.
The first feed port 1f and the second feed port 1g are connected with the microstrip line for feeding, so that holes are prevented from being formed in the system metal floor 5.
An additional decoupling structure unit 1e composed of microstrip line branch structure is introduced between the first sub-antenna unit and the second sub-antenna unit, the decoupling structure unit 1e is positioned on the top metal circuit layer, is composed of two sections of L-shaped microstrip line branches which are symmetrically distributed, equivalently, an additional distributed capacitor is added, and is respectively connected with the first feed microstrip line 1a and the second feed microstrip line 1 b. The decoupling structure unit 1e introduces an additional coupling path on the basis of the original equivalent coupling path between the first sub-antenna unit and the second sub-antenna unit, and the additional coupling path and the original path have equal amplitude and opposite phase at the frequency of 3.5GHz and cancel each other out to achieve the decoupling target.
The overall shape of the system metal floor 5 is rectangular, and irregular hollowed areas which are substantially rectangular are distributed at four corners of the system metal floor and serve as mounting bases of the first integrated chip module 1, the second integrated chip module 2, the third integrated chip module 3 and the fourth integrated chip module 4.
The bottom metal circuit layers on the lower surfaces of the first integrated chip module 1, the second integrated chip module 2, the third integrated chip module 3 and the fourth integrated chip module 4 are welded with the mounting base on the system metal floor 5, so that the common ground purpose is achieved.
The following is a detailed description of an embodiment of an 8-element MIMO mobile phone antenna covering the 3.5GHz band in 5G Sub-6GHz applications:
the three-dimensional structure diagram of the MIMO chip antenna of the invention is shown in figure 1: the system comprises a medium substrate 6 and a system metal floor 5 printed on the upper surface of the medium substrate 6, wherein a first integrated chip module 1, a second integrated chip module 2, a third integrated chip module 3 and a fourth integrated chip module 4 which have the same size and are in mirror symmetry are welded at four corners of the upper surface of the medium substrate 6; wherein each integrated chip module comprises two sub-antenna elements.
The three-dimensional structure of each integrated chip module in the invention is shown in FIG. 2, and the lowest part is an FR-4 dielectric substrate 6 (epsilon) r 4.4, tan delta 0.02), volume 140 × 70 × 0.8mm 3 The upper surface of the FR-4 dielectric substrate 6 is a system metal floor 5(140 mm multiplied by 70 mm) 2 ) And irregular hollow areas which are approximately rectangular are distributed at four corners of the system metal floor 5 and are used as integrated chip module mounting bases.
On the system metal floor 5 is a floor with the size of 20 multiplied by 5 multiplied by 1mm 3 The first integrated chip module 1 comprises an FR-4 dielectric base layer 1h with a thickness of 1mm, a top metal circuit layer positioned on the upper surface of the dielectric substrate 1h and a bottom metal circuit layer positioned on the lower surface of the dielectric base layer 1h, and comprises two sub-antenna units.
In the sub-antenna unit, a first feed microstrip line 1a and a second feed microstrip line 1b in the sub-antenna unit are in an L shape and are positioned on the top metal circuit layer; the first radiation slit 1d and the second radiation slit 1c are formed by cutting out bent slits in the bottom bulk metal layer.
An additional decoupling structure unit 1e composed of microstrip line branch structure is introduced between the first sub-antenna unit and the second sub-antenna unit, the decoupling structure unit 1e is positioned on the top metal circuit layer and is composed of two sections of L-shaped microstrip line branches which are symmetrically distributed, and equivalently, an additional distributed capacitor is added to connect the first feed microstrip line 1a and the second feed microstrip line 1 b. The additional decoupling structure unit 1e introduces an additional coupling path on the basis of the original equivalent coupling path between the antenna subunits, and the additional coupling path and the original path have equal amplitude and opposite phase at the frequency of 3.5GHz and cancel each other out to achieve the decoupling target.
In the embodiment, the sizes of the first sub-antenna unit and the second sub-antenna unit are 10 × 5 × 1mm 3 The widths of the first feed microstrip line 1a, the second feed microstrip line 1b, the first radiation slot 1d and the second radiation slot 1c are all 0.5 mm.
The central operating frequency of this embodiment is selected to be 3.5GHz, the operating bandwidth is 3400-.
Fig. 3 illustrates S parameters of two sub-antenna units in the same integrated antenna module of the MIMO chip antenna according to this embodiment. Both sub-antenna elements resonate at around 3.5 GHz. S11 is the reflection coefficient of the first feed port (1f) with a-6 dB bandwidth of about 15.7%, and S22 is the reflection coefficient of the second feed port (1g) with a-6 dB bandwidth of about 5%. The overlapped bandwidth of the two ports covers the 3400-3600MHz band. Within this band, the isolation of the two ports is represented by S12, reaching 21dB at the frequency of 3.5 GHz.
Fig. 4 shows S parameters between different integrated antenna modules of the MIMO chip antenna according to the present embodiment. The isolation between any two integrated antenna modules is above 13 dB.
Fig. 5 shows the total efficiency of the MIMO chip antenna of the present embodiment. In the frequency range of 3400-3600MHz, the total efficiency when the first feed port (1f) is excited reaches about 60 percent, and the total efficiency when the second feed port (1g) is excited is better than 53 percent.
The chip integrated module with the integrated design is used in the 5G mobile terminal MIMO antenna, so that the antenna is convenient to disassemble and replace, has the advantages of space saving and low cost, and has a good application prospect in a 5G mobile phone terminal.
The foregoing is only a preferred embodiment of this invention and it should be noted that modifications can be made by those skilled in the art without departing from the principle of the invention and these modifications should also be considered as the protection scope of the invention.
Claims (7)
1. A5G mobile terminal MIMO antenna based on chip integrated module, its characterized in that: the antenna comprises a dielectric substrate (6) and a system metal floor (5) printed on the upper surface of the dielectric substrate (6), wherein a first integrated chip module (1), a second integrated chip module (2), a third integrated chip module (3) and a fourth integrated chip module (4) which have the same size and are in mirror symmetry are welded at four corners of the upper surface of the dielectric substrate (6), the first integrated chip module (1) comprises a dielectric base layer (1 h), and a first sub-antenna unit and a second sub-antenna unit which are positioned on the dielectric base layer (1 h), the first sub-antenna unit consists of a first feed microstrip line (1a), a first radiation slot (1d) and a first feed port (1f), the second sub-antenna unit consists of a second feed microstrip line (1b), a second radiation slot (1c) and a second feed port (1g), the thickness of the medium base layer (1 h) is 1mm, a top metal circuit layer is arranged on the upper surface of the medium base layer (1 h), a bottom metal circuit layer is arranged on the lower surface of the medium base layer (1 h), an additional decoupling structure unit (1 e) composed of microstrip line branch structure is further introduced between the first sub-antenna unit and the second sub-antenna unit, the decoupling structure unit (1 e) is located on the top metal circuit layer and composed of two sections of L-shaped microstrip line branch structures which are symmetrically distributed and respectively connected with the first feed microstrip line (1a) and the second feed microstrip line (1b), and the decoupling structure unit (1 e) introduces an additional reverse phase coupling path between the first sub-antenna unit and the second sub-antenna unit.
2. The chip integrated module based 5G mobile terminal MIMO antenna of claim 1, wherein: the first integrated chip module (1), the second integrated chip module (2), the third integrated chip module (3) and the fourth integrated chip module (4) have the same physical structure, and the sizes of the first integrated chip module, the second integrated chip module, the third integrated chip module and the fourth integrated chip module are 20 multiplied by 5 multiplied by 1mm 3 。
3. The chip integrated module based 5G mobile terminal MIMO antenna of claim 1, wherein: the sizes of the first sub-antenna unit and the second sub-antenna unit are 10 multiplied by 5 multiplied by 1mm 3 。
4. The chip integrated module based 5G mobile terminal MIMO antenna of claim 1, wherein: the first feed microstrip line (1a) in the first sub-antenna unit and the second feed microstrip line (1b) in the second sub-antenna unit are 0.5mm wide, are L-shaped, are positioned on the top metal circuit layer, and are formed by digging a bent gap with the width of 0.5mm on the bottom metal circuit layer to form the first radiation gap (1d) and the second radiation gap (1 c).
5. The chip integrated module based 5G mobile terminal MIMO antenna of claim 1, wherein: the first feeding port (1f) and the second feeding port (1g) are connected with a microstrip line for feeding.
6. The chip integrated module based 5G mobile terminal MIMO antenna of claim 1, wherein: the overall shape of the system metal floor (5) is rectangular, and hollowed areas serving as mounting bases of the first integrated chip module (1), the second integrated chip module (2), the third integrated chip module (3) and the fourth integrated chip module (4) are distributed at four corners of the system metal floor.
7. The chip integrated module based 5G mobile terminal MIMO antenna of claim 4, wherein: and the bottom metal circuit layers on the lower surfaces of the first integrated chip module (1), the second integrated chip module (2), the third integrated chip module (3) and the fourth integrated chip module (4) are welded with the mounting base on the system metal floor (5).
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| CN105789888A (en) * | 2014-12-18 | 2016-07-20 | 哈尔滨飞羽科技有限公司 | Four-port multi-input-multi-output (MIMO) antenna with high isolation degree |
| CN108428998B (en) * | 2018-01-31 | 2019-12-06 | 西安电子科技大学 | Millimeter wave dielectric resonator MIMO antenna applied to 5G mobile communication |
| CN209329147U (en) * | 2019-03-29 | 2019-08-30 | 安徽邮电职业技术学院 | A kind of four unit MIMO hand held antenna system of compact |
| CN110061349B (en) * | 2019-05-08 | 2020-04-28 | 清华大学 | Broadband 5G MIMO mobile phone antenna based on orthogonal mode pair |
| CN110112559B (en) * | 2019-06-05 | 2020-04-28 | 西安电子科技大学 | Miniaturized dual-band eight-unit MIMO terminal antenna suitable for 5G |
| CN110350312B (en) * | 2019-07-04 | 2020-08-25 | 北京理工大学 | 5G mobile terminal MIMO antenna based on circuit decoupling |
| CN112635985B (en) * | 2020-12-11 | 2021-11-23 | 西安电子科技大学 | Low-profile eight-port MIMO antenna integrated on back cover of 5G mobile phone |
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