CN113378321B - Modeling method, device and equipment of test piece, storage medium and test piece - Google Patents
Modeling method, device and equipment of test piece, storage medium and test piece Download PDFInfo
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- CN113378321B CN113378321B CN202110729758.9A CN202110729758A CN113378321B CN 113378321 B CN113378321 B CN 113378321B CN 202110729758 A CN202110729758 A CN 202110729758A CN 113378321 B CN113378321 B CN 113378321B
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- G06F30/17—Mechanical parametric or variational design
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
- G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
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Abstract
The embodiment of the application relates to a modeling method, a modeling device, modeling equipment, a storage medium and a test piece for simulating a solar wing substrate. The test piece comprises a panel made of metal materials, a through hole is formed in the panel, and the method comprises the following steps: carrying out finite element analysis on the solar wing substrate to be simulated to obtain a mechanical analysis result; the solar wing substrate to be simulated is a solar wing substrate actually used in the spacecraft; acquiring the plane size of a solar wing substrate to be simulated and the quality of the solar wing to be simulated; and (3) optimizing the thickness of the panel and the parameters of the holes by taking the mechanical analysis result as an optimization target and the plane size and the quality as constraint conditions, thereby obtaining the test piece. The method shortens the processing period of the test piece, reduces the test cost, enables the mechanical property of the test piece to be matched with the solar wing substrate actually used in the spacecraft, and avoids the safety risk caused by the test by adopting the real solar wing substrate.
Description
Technical Field
The application relates to the technical field of satellites, in particular to a modeling method, a modeling device, modeling equipment, a storage medium and a test piece for simulating a solar wing substrate.
Background
At present, when a solar wing spreading mechanism test or a whole star structure identification test is carried out, some solar wing substrate structures adopt real solar wing substrate structures for testing, and the real solar wing substrate structures refer to final solar wing substrate inspection and acceptance or spare parts for extra production. However, most of the real solar wing substrates are honeycomb sandwich structures in the form of carbon fiber skins-aluminum honeycomb cores-carbon fiber skins, and the processing cycle is long, so that the requirement of civil aerospace on the grinding cycle cannot be met; in addition, honeycomb sandwich structures are complex to manufacture, relatively expensive, and may have an unknown adverse effect on the structural performance of the final product if tested using test equipment, and may increase the cost of satellite design if additional spare parts are made.
Disclosure of Invention
Based on the modeling method, the modeling device, the modeling equipment, the storage medium and the test piece for simulating the test piece of the solar wing substrate, the test cost can be reduced, the development period can be shortened, and the rigidity requirement required by the test can be met.
In a first aspect, an embodiment of the present application provides a modeling method for a test piece for simulating a solar wing substrate, where the test piece includes a panel made of a metal material, and a hole is formed in the panel, and the method includes:
carrying out finite element analysis on the solar wing substrate to be simulated to obtain a mechanical analysis result; the solar wing substrate to be simulated is a solar wing substrate actually used in a spacecraft;
acquiring the plane size of the solar wing substrate to be simulated and the quality of the solar wing to be simulated;
and optimizing the thickness of the panel and the parameters of the hole by taking the mechanical analysis result as an optimization target and the plane size and the quality as constraint conditions, thereby obtaining the test piece.
In a second aspect, an embodiment of the present application provides a modeling apparatus for simulating a test piece of a solar wing substrate, where the test piece includes a panel made of a metal material, a hole penetrating through the panel is provided, and the apparatus includes:
the first processing module is used for carrying out finite element analysis on the solar wing substrate to be simulated to obtain a mechanical analysis result; the solar wing substrate to be simulated is a solar wing substrate actually used in a spacecraft;
the acquisition module is used for acquiring the plane size of the solar wing substrate to be simulated and the quality of the solar wing to be simulated;
and the second processing module is used for optimizing the thickness of the panel and the parameters of the hole by taking the mechanical analysis result as an optimization target and the plane size and the quality as constraint conditions, so that the test piece is obtained.
In a third aspect, an embodiment of the present application provides a modeling apparatus for a test piece for simulating a solar wing substrate, including a memory and a processor, where the memory stores a computer program, and the processor implements the steps of the modeling method for a test piece for simulating a solar wing substrate provided in the first aspect of the embodiment of the present application when executing the computer program.
In a fourth aspect, embodiments of the present application provide a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, implements the steps of the method for modeling a test piece for simulating a solar wing substrate provided in the first aspect of the embodiments of the present application.
In a fifth aspect, an embodiment of the present application provides a test piece for simulating a solar wing substrate, including: the panel is made of metal materials, and a through hole is formed in the panel; the thickness of the panel and the parameters of the holes are optimized by the modeling method for simulating the test piece of the solar wing substrate provided by the first aspect of the embodiment of the application.
According to the technical scheme provided by the embodiment of the application, the structure of the test piece for simulating the solar wing substrate is a metal panel, and the panel is provided with the through holes; in addition, by taking the mechanical analysis result of the solar wing substrate actually used in the spacecraft as an optimization target and taking the plane size of the solar wing substrate actually used in the spacecraft and the mass of the solar wing as constraint conditions, the thickness of the panel and the hole parameters of the test piece are optimized, so that the mechanical property of the finally obtained test piece is matched with the solar wing substrate actually used in the spacecraft, the rigidity requirement required by the test is met, and the safety risk caused by the test by adopting the real solar wing substrate is avoided.
Drawings
Fig. 1 is a schematic structural diagram of a test piece for simulating a solar wing substrate according to an embodiment of the present disclosure;
FIG. 2 is a schematic flow chart of a modeling method for a test piece for simulating a solar wing substrate according to an embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of a modeling apparatus for a test piece for simulating a solar wing substrate according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a modeling apparatus for a test piece for simulating a solar wing substrate according to an embodiment of the present application.
Detailed Description
Generally, the solar span opening mechanism test or the whole star structure identification test can be performed in the following manner:
the first method is as follows: and (3) carrying out a test by adopting a real solar wing substrate structure, wherein the real solar wing substrate structure refers to a final solar wing substrate inspection and acceptance item or a spare part for extra production.
The second method comprises the following steps: and (4) adopting a simulation structural member with larger rigidity difference with the real solar wing substrate to carry out the test.
In the first mode, the real solar wing substrate structure is mostly a carbon fiber skin-aluminum honeycomb core-carbon fiber skin honeycomb sandwich structure, the processing period is long, and the requirement of the development period of rapid design, production and delivery of civil aerospace cannot be met; furthermore, honeycomb sandwich structures are complex to manufacture and relatively expensive, and if tested in proof units, may have an unknown adverse effect on the structural properties of the final product, which may increase the cost of the satellite design if additional production is required.
In the second mode, the structural member with a large rigidity difference is adopted to simulate the solar wing substrate, so that during the solar wing unfolding mechanism test and the whole satellite structure identification test, due to the large rigidity difference between the simulated member and the real solar wing substrate, the test is insufficient, even the static and dynamic characteristics of the satellite related structure cannot be verified, and the hidden danger of the structural performance exists.
Therefore, the technical scheme provided by the embodiment of the application aims to solve the technical problems in the mode.
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions in the embodiments of the present application are further described in detail by the following embodiments in combination with the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In practical application, a plurality of alternative structures of the test piece can be preset, and the alternative structures with simple manufacturing work, short period and low cost are selected as the test piece by evaluating the manufacturing process, period and cost of the plurality of alternative structures. Through repeated evaluation, a solar wing substrate which is used in the actual simulation spacecraft and is equivalent to the test piece shown in the figure 1 can be selected.
As shown in fig. 1, the present application provides a test piece for simulating a solar wing substrate, where the test piece may include a panel made of metal, and the panel is provided with a through hole. Compared with a honeycomb sandwich structure, the honeycomb sandwich structure of the real solar wing substrate is equivalently simulated through the structural form, and the test piece is simple in structure, simple in manufacturing process and low in manufacturing cost.
Alternatively, the panel may be an aluminum alloy panel or other lower cost steel panel. The holes may be arranged on the metal panel at equal intervals (fig. 1 only shows the equal interval arrangement), but of course, other arrangements may also be adopted, such as non-equal interval arrangement or other types of arrangements. Optionally, the holes may be circular holes, square holes or triangular holes, and the shape of the holes is not limited in this embodiment and may be set based on actual requirements.
After the overall architecture of the test piece is determined, the thickness of the panel of the test piece and the parameters of the holes can be optimized by the following method, so that the mechanical properties of the test piece are matched with the real solar wing substrate.
Next, specifically describing the parameter optimization process of the test piece, it should be noted that the implementation subject of the method embodiments described below may be a modeling apparatus for simulating a test piece of a solar wing substrate, and the apparatus may be implemented as part or all of an electronic device by software, hardware, or a combination of software and hardware. Optionally, the electronic device may be a personal computer, a smart phone, a tablet computer, a vehicle-mounted terminal, and the like, and the specific form of the electronic device is not limited in the embodiment of the disclosure. The method embodiments described below are described by taking as an example that the execution subject is an electronic device.
Specifically, as shown in fig. 2, the method may include:
s201, carrying out finite element analysis on the solar wing substrate to be simulated to obtain a mechanical analysis result.
The solar wing substrate to be simulated is a solar wing substrate actually used in the spacecraft. The finite element analysis mainly refers to static stiffness analysis and modal analysis of the solar wing substrate to be simulated, and the modal analysis mainly refers to analysis of vibration frequency of the solar wing substrate to be simulated. Through finite element analysis, the static and dynamic characteristics of the solar substrate to be simulated can be obtained, and the static and dynamic characteristics can be considered as the result of the mechanical analysis.
In practical application, a finite element model can be established in advance, and static stiffness analysis and modal analysis can be performed on the real solar wing substrate through the established finite element model.
S202, acquiring the plane size of the solar wing substrate to be simulated and the mass of the solar wing to be simulated.
The solar wing to be simulated comprises a real solar wing substrate and solar cells arranged on the solar wing substrate, so that the quality not only comprises the quality of the real solar wing substrate, but also comprises the quality of the solar cells. In order to equivalently simulate a real solar wing substrate through a test piece, therefore, the plane size of the test piece needs to be matched with the plane size of the real solar wing substrate; meanwhile, when a real solar wing substrate is equivalently simulated, in order to simulate the static and dynamic characteristics of the real solar wing, the mass of a test piece is required to be matched with the mass of the real solar wing. Of course, in practical applications, some error between the mass of the test piece and the mass of the real solar wing may be allowed.
For this reason, the electronic device needs to acquire the planar size of the real solar wing substrate (i.e., the solar wing substrate actually used in the spacecraft) and the quality of the real solar wing.
S203, optimizing the thickness of the panel and the parameters of the hole by taking the mechanical analysis result as an optimization target and the plane size and the quality as constraint conditions, so as to obtain the test piece.
The parameters of the holes may include the size of the holes and the arrangement number of the holes. It will be understood that the size of the holes and the number of holes arranged are constrained to each other given the planar dimensions of the test piece. Similarly, given the mass of the test piece, the thickness of the panel, the size of the holes and the number of holes arranged are constrained to each other.
After obtaining a real finite element analysis result of the solar wing substrate, a real plane size of the solar wing substrate and a real mass of the solar wing, the electronic device may use the finite element analysis result as an expected mechanical analysis result of the test piece, that is, an optimization target, use the real plane size of the solar wing substrate and the real mass of the solar wing as constraint conditions of the test piece, and repeatedly optimize the thickness of the panel of the test piece, the size of the holes arranged on the panel and the number of the holes until the mechanical analysis result of the test piece satisfies the optimization target, and the plane size and the mass of the test piece also satisfy the constraint conditions, thereby obtaining the test piece with equivalent performance to the real solar wing substrate.
After the test piece meets the requirements of the overall static and dynamic characteristics, the structure of the test piece can be further set in detail. For example, an interface structure for external connection is provided on the panel, and a weak area on the panel, which is subjected to a large load, is locally reinforced.
After the structure of the test piece is set in detail, the quality of the test piece and whether the static and dynamic characteristics meet the requirements need to be checked again.
For this reason, on the basis of the above embodiment, optionally, after the optimization of the parameters of the thickness of the panel and the hole in the above S203, the method may further include:
step 1: and determining the current quality of the first test piece and the current mechanical analysis result.
The first test piece is obtained by arranging an interface structure on the optimized panel, and the interface structure is used for connecting external equipment. The interface structure mainly comprises a turnover structure connecting point and a pressing point of the solar wing.
After the interface structure and the local reinforcement are arranged on the optimized panel, the current quality of the first test piece is measured, and finite element analysis is carried out on the first test piece so as to obtain the current mechanical analysis result of the first test piece.
Step 2: and when the current quality does not meet the expected quality and/or the current mechanical analysis result does not meet the expected mechanical analysis result, adjusting the interface structure until the current quality meets the expected quality and the current mechanical analysis result meets the expected mechanical analysis result, thereby obtaining a second test piece.
Wherein the expected mass is related to the mass of the solar wing to be simulated, and the expected mass is generally matched with the mass of the real solar wing as a constraint condition, and in practical application, a certain error is allowed between the expected mass and the mass of the real solar wing. The expected mechanical analysis result refers to a real mechanical analysis result of the solar wing substrate, and is a parameter optimization target of the test piece.
The electronic equipment still takes the expected mass as a constraint condition, takes an expected mechanical analysis result as an optimization target, and adjusts the interface structure or the local reinforcement mode of the first test piece to enable the interface structure or the local reinforcement mode to meet the static and dynamic characteristics required by an equivalent structural member under the constraint condition of the expected mass, so that a second test piece equivalent to the real mechanical performance of the solar wing substrate is obtained.
According to the modeling method for the test piece for simulating the solar wing substrate, the structure of the test piece for simulating the solar wing substrate is a panel made of metal, and the panel is provided with through holes; in addition, by taking the mechanical analysis result of the solar wing substrate actually used in the spacecraft as an optimization target and taking the plane size of the solar wing substrate actually used in the spacecraft and the mass of the solar wing as constraint conditions, the thickness of the panel and the hole parameters of the test piece are optimized, so that the mechanical property of the finally obtained test piece is matched with the solar wing substrate actually used in the spacecraft, the rigidity requirement required by the test is met, and the safety risk caused by the test by adopting the real solar wing substrate is avoided.
Fig. 3 is a schematic structural diagram of a modeling apparatus for a test piece for simulating a solar wing substrate according to an embodiment of the present application. The test piece comprises a panel made of metal, and the panel is provided with a through hole, as shown in fig. 3, the device may include: a first processing module 301, an acquisition module 302 and a second processing module 303.
Specifically, the first processing module 301 is configured to perform finite element analysis on the solar wing substrate to be simulated to obtain a mechanical analysis result; the solar wing substrate to be simulated is a solar wing substrate actually used in a spacecraft;
the obtaining module 302 is configured to obtain a planar size of the solar wing substrate to be simulated and a mass of the solar wing to be simulated;
the second processing module 303 is configured to optimize the thickness of the panel and the parameters of the hole by using the mechanical analysis result as an optimization target and the plane size and the mass as constraint conditions, so as to obtain the test piece.
According to the modeling device for the test piece for simulating the solar wing substrate, the structure of the test piece for simulating the solar wing substrate is a panel made of metal, and the panel is provided with through holes; in addition, by taking the mechanical analysis result of the solar wing substrate actually used in the spacecraft as an optimization target and taking the plane size of the solar wing substrate actually used in the spacecraft and the mass of the solar wing as constraint conditions, the thickness of the panel and the hole parameters of the test piece are optimized, so that the mechanical property of the finally obtained test piece is matched with the solar wing substrate actually used in the spacecraft, the rigidity requirement required by the test is met, and the safety risk caused by the test by adopting the real solar wing substrate is avoided.
Optionally, the holes are arranged on the panel at equal intervals.
Optionally, the holes are circular, square or triangular holes.
Optionally, the panel is an aluminum alloy sheet.
Optionally, the parameters of the holes include the size of the holes and the number of the holes arranged.
On the basis of the foregoing embodiment, optionally, the apparatus may further include: a determination module and a third processing module.
Specifically, the determining module is configured to determine the current quality and the current mechanical analysis result of the first test piece after the second processing module 303 optimizes the thickness of the panel and the parameters of the hole by using the mechanical analysis result as an optimization target and the plane size and the quality as constraint conditions; the first test piece is obtained by arranging an interface structure on the optimized panel, wherein the interface structure is used for connecting external equipment;
the third processing module is used for adjusting the interface structure when the current quality does not meet the expected quality and/or the current mechanical analysis result does not meet the expected mechanical analysis result until the current quality meets the expected quality and the current mechanical analysis result meets the expected mechanical analysis result, so that a second test piece is obtained; wherein the desired mass is related to the mass of the solar wing to be simulated.
In one embodiment, a modeling apparatus for simulating a test piece of a solar wing substrate is also provided, and the internal structure of the apparatus may be as shown in fig. 4. The apparatus includes a processor and a memory connected by a system bus. Wherein the processor of the device is configured to provide computing and control capabilities. The memory of the device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The database of the device is used for storing data required in the modeling process of the test piece. The computer program is executed by a processor to implement a modeling method for a test piece simulating a solar wing substrate.
It will be understood by those skilled in the art that the structure shown in figure 4 is a block diagram of only a portion of the structure relevant to the present application and does not constitute a limitation of the modeling apparatus for a test piece used to simulate a solar wing substrate to which the present application applies, and that a particular apparatus may include more or fewer components than shown in the figures, or combine certain components, or have a different arrangement of components.
In one embodiment, there is provided a modeling apparatus for a test piece for simulating a solar wing substrate, the test piece comprising a panel of metal material having a hole formed therethrough, the apparatus comprising a memory and a processor, the memory having stored therein a computer program, the processor implementing the following steps when executing the computer program:
carrying out finite element analysis on the solar wing substrate to be simulated to obtain a mechanical analysis result; the solar wing substrate to be simulated is a solar wing substrate actually used in a spacecraft;
acquiring the plane size of the solar wing substrate to be simulated and the quality of the solar wing to be simulated;
and optimizing the thickness of the panel and the parameters of the hole by taking the mechanical analysis result as an optimization target and the plane size and the quality as constraint conditions, thereby obtaining the test piece.
In one embodiment, there is also provided a computer readable storage medium having a computer program stored thereon, the computer program when executed by a processor implementing the steps of:
carrying out finite element analysis on the solar wing substrate to be simulated to obtain a mechanical analysis result; the solar wing substrate to be simulated is a solar wing substrate actually used in a spacecraft;
acquiring the plane size of the solar wing substrate to be simulated and the quality of the solar wing to be simulated;
and optimizing the thickness of the panel and the parameters of the hole by taking the mechanical analysis result as an optimization target and the plane size and the quality as constraint conditions, thereby obtaining the test piece.
The modeling device, the equipment and the storage medium for the test piece for simulating the solar wing substrate provided in the above embodiments can execute the modeling method for the test piece for simulating the solar wing substrate provided in any embodiment of the disclosure, and have corresponding functional modules and beneficial effects for executing the method. Technical details not elaborated in the above embodiments may be referred to a modeling method for a test piece for simulating a solar wing substrate provided in any of the embodiments of the present disclosure.
In one embodiment, a test piece for simulating a solar wing substrate is further provided, the test piece comprises a panel made of a metal material, and the panel is provided with a through hole; the thickness of the panel and the parameters of the holes are optimized by the modeling method for simulating the test piece of the solar wing substrate according to any embodiment.
Because above-mentioned test piece belongs to pure metal structure, compares honeycomb sandwich structure, simple structure and preparation simple process. Meanwhile, the thickness of the test piece, the size of the holes and the arrangement number of the holes are optimized by adopting the modeling method, so that the mechanical property of the finally obtained test piece is matched with the real solar wing substrate. Therefore, after the test piece is put into production, the production cost of the test piece is reduced, the production period is shortened, and the generated test piece can meet the rigidity requirement required by the test.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A modeling method for a test piece for simulating a solar wing substrate is characterized in that the test piece comprises a panel made of metal, a through hole is formed in the panel, and the method comprises the following steps:
carrying out finite element analysis on the solar wing substrate to be simulated to obtain a mechanical analysis result; the solar wing substrate to be simulated is a solar wing substrate actually used in a spacecraft;
acquiring the plane size of the solar wing substrate to be simulated and the quality of the solar wing to be simulated; wherein the quality comprises the quality of the solar wing substrate actually used and the quality of the solar cell slice;
and optimizing the thickness of the panel and the parameters of the hole by taking the mechanical analysis result as an optimization target and the plane size and the quality as constraint conditions, thereby obtaining the test piece.
2. The method of claim 1, wherein the holes are equally spaced on the panel.
3. The method of claim 1, wherein the holes are circular, square, or triangular holes.
4. The method of claim 1, wherein the panel is an aluminum alloy sheet.
5. The method according to any one of claims 1 to 4, wherein the parameters of the holes comprise the size of the holes and the number of arrangements of the holes.
6. The method according to any one of claims 1 to 4, wherein after optimizing the thickness of the panel and the parameters of the hole with the mechanical analysis result as an optimization target and the planar size and the mass as constraints, the method further comprises:
determining the current quality and the current mechanical analysis result of the first test piece; the first test piece is obtained by arranging an interface structure on the optimized panel, wherein the interface structure is used for connecting external equipment;
when the current quality does not meet the expected quality and/or the current mechanical analysis result does not meet the expected mechanical analysis result, adjusting the interface structure until the current quality meets the expected quality and the current mechanical analysis result meets the expected mechanical analysis result, thereby obtaining a second test piece; wherein the desired mass is related to the mass of the solar wing to be simulated.
7. The utility model provides a modeling device for simulating test piece of solar wing base plate which characterized in that, the test piece includes the panel of metal material, be provided with the hole that runs through on the panel, the device includes:
the first processing module is used for carrying out finite element analysis on the solar wing substrate to be simulated to obtain a mechanical analysis result; the solar wing substrate to be simulated is a solar wing substrate actually used in a spacecraft;
the acquisition module is used for acquiring the plane size of the solar wing substrate to be simulated and the quality of the solar wing to be simulated; wherein the quality comprises the quality of the solar wing substrate actually used and the quality of the solar cell slice;
and the second processing module is used for optimizing the thickness of the panel and the parameters of the hole by taking the mechanical analysis result as an optimization target and the plane size and the quality as constraint conditions, so that the test piece is obtained.
8. Modeling apparatus for a test piece for simulating a solar wing substrate, comprising a memory and a processor, the memory storing a computer program, characterized in that the processor realizes the steps of the method according to any of claims 1 to 6 when executing the computer program.
9. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 1 to 6.
10. A test piece for simulating a solar wing substrate, comprising: the panel is made of metal materials, and a through hole is formed in the panel;
wherein the thickness of the panel and the parameters of the holes are optimized by the method of any one of claims 1 to 6.
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