CN113376773A - Optical module heat radiation structure and optical module assembly - Google Patents
Optical module heat radiation structure and optical module assembly Download PDFInfo
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- CN113376773A CN113376773A CN202110729830.8A CN202110729830A CN113376773A CN 113376773 A CN113376773 A CN 113376773A CN 202110729830 A CN202110729830 A CN 202110729830A CN 113376773 A CN113376773 A CN 113376773A
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- heat dissipation
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- heat conduction
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
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- Cooling Or The Like Of Electrical Apparatus (AREA)
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Abstract
The invention relates to the technical field of heat dissipation structures, in particular to an optical module heat dissipation structure and an optical module assembly, which are used for solving the problem that a flexible contact is scraped off when an optical module is inserted. The optical module heat radiation structure comprises a heat radiator device and an optical module installation cage, when an optical module is installed from an installation opening of the optical module installation cage, the heat radiator is located at a first rotating position, the heat radiator inclines towards the inside of the optical module installation cage along the direction of a first heat conduction surface to a second heat conduction surface, and the optical module contacts the second heat conduction surface far away from the installation opening. When the optical module gradually enters the installation cage, the optical module gradually contacts the flexible contact piece. When the heat dissipation device is located at the second rotation position, the optical module is completely attached to the flexible contact piece and the second heat conduction surface. The heat dissipation device is rotatably arranged on the installation cage, and the flexible contact piece can be prevented from being scraped off when the optical module is installed.
Description
Technical Field
The invention relates to the technical field of communication, in particular to an optical module heat dissipation structure and an optical module assembly.
Background
The optical module is an optoelectronic device for performing photoelectric and electro-optical conversion, a transmitting end of the optical module converts an electrical signal into an optical signal, a receiving end of the optical module converts the optical signal into the electrical signal, and when the power consumption of the optical module is high, a radiator is required to be arranged to radiate the optical module.
The optical module and the heat sink are usually in hard contact, and the hard contact cannot ensure good contact of contact surfaces, so that thermal contact resistance is high and the heat dissipation effect is affected. In order to ensure good contact between the optical module and the heat sink, a flexible contact may also be provided between the optical module and the heat sink.
However, when the optical module is inserted, the flexible contact is easily scraped off, which affects the assembly efficiency of the optical module.
Disclosure of Invention
In view of the foregoing problems, embodiments of the present invention provide an optical module heat dissipation structure and an optical module assembly, which avoid scraping a flexible contact when an optical module is inserted, and ensure assembly efficiency of the optical module and a heat dissipation effect of the optical module heat dissipation structure on the optical module.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
a first aspect of an embodiment of the present invention provides a heat dissipation structure of an optical module.
The optical module heat radiation structure includes: the optical module installation cage, the first side of optical module installation cage is provided with the dress mouth, with the second side adjacent first side is provided with the window.
The heat dissipation device is rotatably arranged on the optical module installation cage and comprises a heat radiator and a flexible contact piece, the heat radiator comprises a heat dissipation body and a heat conduction part connected with the heat dissipation body, the heat conduction part extends into the window and is provided with a heat conduction surface facing the inside of the optical module installation cage, the heat conduction surface comprises a first heat conduction surface close to the installation opening and a second heat conduction surface far away from the installation opening, and the flexible contact piece is arranged on the first heat conduction surface.
The heat dissipation device has a first rotational position at which the heat dissipation device is inclined toward the inside of the optical module mounting cage along a direction from the first heat conduction surface toward the second heat conduction surface, and a second rotational position at which the flexible contact member and the second heat conduction surface can be attached to an optical module loaded in the optical module mounting cage.
Compared with the prior art, the optical module heat dissipation structure provided by the embodiment of the invention has the following advantages:
when the optical module is installed from the installation opening of the optical module installation cage, the heat dissipation device is located at the first rotating position, and inclines towards the inside of the optical module installation cage along the direction of the first heat conduction surface towards the second heat conduction surface, so that a larger opening is formed between the flexible contact element and the bottom surface of the optical module installation cage, when the optical module enters the optical module installation cage, the optical module cannot contact the side edge of the flexible contact element, the flexible contact element is prevented from being scraped off in the installation process of the optical module, and the assembly efficiency of the optical module is ensured. When the heat dissipation device is located at the second rotating position, the optical module is completely attached to the flexible contact element and the second heat conduction surface, the flexible contact element is arranged to ensure good contact between the optical module and the heat sink, and the heat dissipation effect of the optical module heat dissipation structure on the optical module is improved.
As an improvement of the heat dissipation structure of the optical module according to the embodiment of the present invention, a vertical distance is provided between the first heat conduction surface and the second heat conduction surface, and the vertical distance is smaller than a thickness of the flexible contact in a free state.
As a further improvement of the heat dissipation structure of the optical module in the embodiment of the present invention, in the first rotation position, a distance between one end of the flexible contact piece, which is far away from the loading opening, and a sidewall of a third side, which is opposite to the second side of the optical module mounting cage, is greater than a thickness of the optical module.
As a further improvement of the optical module heat dissipation structure according to the embodiment of the present invention, the optical module heat dissipation structure includes an elastic member, the elastic member is disposed between an end of the heat dissipation body close to the first heat conduction surface and an outer wall surface of the first side of the optical module mounting cage; in the first rotating position, the elastic part is in a stretching state; in the second rotational position, the resilient member is in a compressed state.
As a further improvement of the optical module heat dissipation structure according to the embodiment of the present invention, the optical module heat dissipation structure includes mounting structures disposed on two axial sides of the heat dissipation device, the heat dissipation device is mounted on the optical module mounting cage through the mounting structures on the two sides, the mounting structure includes a shaft sleeve portion and a connecting portion that are connected to each other, a rotating shaft that is sleeved on the shaft sleeve portion is disposed on the heat dissipation device, and the connecting portion is connected to the optical module mounting cage.
As a further improvement of the heat dissipation structure of the optical module in the embodiment of the present invention, the mounting structure includes a first fastening member and a second fastening member, the first fastening member includes a first semicircular arc groove and a first fastening portion connected to each other, and the second fastening member includes a second semicircular arc groove and a second fastening portion connected to each other.
The first clamping portion is clamped with the second clamping portion, and the first semicircular arc groove and the second semicircular arc groove form the shaft sleeve portion.
As a further improvement of the optical module heat dissipation structure in the embodiment of the present invention, the connection portion includes a card interface disposed on the second fastening member, and the optical module mounting cage is provided with a first protrusion structure fastened to the card interface.
As a further improvement of the optical module heat dissipation structure in the embodiment of the present invention, the connection portion includes a third fastener connected to the optical module mounting cage, and the third fastener is located between the second semicircular groove and the card interface and outside the second fastener.
As a further improvement of the heat dissipation structure of the optical module in the embodiment of the present invention, a groove is provided on the second fastening member, and a part of the structure of the third fastening member is located in the groove.
The third fastener extends along the mounting direction of the optical module, two second protruding structures are arranged on the optical module mounting cage, the two second protruding structures are located on two sides of the second fastener in the extending direction of the third fastener, an opening facing the third fastener is formed in each second protruding structure, and two ends of the third fastener are inserted into the openings respectively.
As a further improvement of the heat dissipation structure of the optical module in the embodiment of the present invention, the heat dissipation body includes a substrate and a fin disposed on one surface of the substrate, the heat conduction portion includes a heat pipe disposed on the other surface of the substrate and a boss disposed on a side of the heat pipe away from the substrate, and the heat conduction surface is disposed on the boss.
A second aspect of an embodiment of the present invention provides an optical module assembly.
An optical module assembly comprises an optical module and an optical module heat dissipation structure, wherein the optical module is installed in an optical module installation cage through the installation opening, and the optical module is attached to the flexible contact piece and the second heat conduction surface.
Compared with the prior art, the optical module assembly provided by the embodiment of the invention has the following advantages:
since the optical module assembly includes the optical module heat dissipation structure of the first aspect, the optical module assembly also has the same advantages as the optical module heat dissipation structure, and reference may be made to the above description.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a hard assembly of a light module assembly in the related art;
FIG. 2 is a schematic diagram of a soft assembly of a light module assembly according to the related art;
FIG. 3 is a schematic diagram of a heat sink of the optical module assembly of FIG. 1;
FIG. 4 is a sectional view taken along line A-A of the optical module heat dissipation structure shown in FIG. 3;
fig. 5 is a front view of a heat dissipation device of a heat dissipation structure of an optical module according to an embodiment of the present invention;
fig. 6 is a left side view of a heat dissipation device of a heat dissipation structure of an optical module according to an embodiment of the present invention;
fig. 7 is an assembly view of an optical module heat dissipation structure, a circuit board, and an optical module connector according to an embodiment of the present invention;
FIG. 8 is a schematic diagram illustrating an assembly process of an optical module assembly according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of an assembled optical module assembly according to an embodiment of the present invention;
fig. 10 is a structural diagram of a first fastener provided in the embodiment of the present invention;
FIG. 11 is a front view of a second fastener provided in accordance with an embodiment of the present invention;
FIG. 12 is a left side view of a second latch according to an embodiment of the present invention;
FIG. 13 is a block diagram of a third fastening device according to an embodiment of the present invention;
fig. 14 is an assembly structure view of a first locking member and a second locking member provided in the embodiment of the present invention;
fig. 15 is a left side view of a heat dissipation structure of an optical module according to an embodiment of the present invention;
fig. 16 is a front view of an optical module assembly provided by an embodiment of the present invention;
fig. 17 is a left side view of an optical module assembly according to an embodiment of the present invention.
Description of reference numerals:
50: an optical module assembly; 51: an optical module; 52: an optical module heat dissipation structure; 53: a circuit board; 54: an optical module connector; 55: a housing; 200: an optical module mounting cage; 201: a first bump structure; 202: a second bump structure; 203: loading into an opening; 204: a window; 100: a heat sink; 101: a substrate; 102: a fin; 111: a heat pipe; 112: a boss; 113: a first heat-conducting surface; 114: a second heat-conducting surface; 2: a flexible contact; 3: an elastic member; 4: a rotating shaft; 31: a first fastener; 311: a first clamping part; 312: a first semicircular arc groove; 32: a second fastener; 321: a second clamping part; 322: a second semi-arc groove; 323: a card interface; 324: a groove; 33: a third fastener; 331: a third semi-arc groove.
Detailed Description
The optical module is an optoelectronic device for performing photoelectric and electro-optical conversion, a transmitting end of the optical module converts an electrical signal into an optical signal, a receiving end of the optical module converts the optical signal into the electrical signal, and when the power consumption of the optical module is high, a radiator is required to be arranged to radiate the optical module.
In a related art, a hard contact manner is adopted between an optical module and a heat sink, and the optical module is directly connected with a heat conduction portion of the heat sink in an optical module heat dissipation structure. Referring to fig. 1, fig. 3 and fig. 4, fig. 1 is a schematic diagram of a hard assembly of an optical module assembly in the related art, fig. 3 is a schematic diagram of a structure of a heat dissipation device of the optical module assembly shown in fig. 1, fig. 4 is a sectional view of the heat dissipation structure of the optical module shown in fig. 3, the heat sink includes a heat conduction portion, a substrate 101 and fins 102, a boss 112 directly contacts with an optical module 51, and a contact surface of the heat conduction surface and the optical module 51 cannot be guaranteed to be completely contacted well by adopting a hard contact manner, so that a contact thermal resistance is large, and a heat dissipation effect is affected.
In another related technology, a soft contact mode is adopted between the optical module and the heat sink, and in order to ensure that the optical module and the heat sink are in good contact, a flexible contact element is arranged between the optical module and the heat sink. Referring to fig. 2, fig. 2 is a schematic diagram illustrating soft assembly of an optical module assembly in the related art. However, when the flexible contact 2 is disposed on the heat conducting surface of the heat sink 100 facing the inside of the optical module mounting cage 200, since the flexible contact 2 has elasticity, when there is no external force, the distance between one end of the flexible contact 2 away from the insertion opening 203 and the sidewall of the third side opposite to the second side of the optical module mounting cage 200 is smaller than the thickness of the optical module 51, when the optical module 51 enters from the insertion opening 203 of the optical module mounting cage 200 and contacts with the heat sink, the flexible contact 2 is easily scraped off by the thrust of the optical module 51, which affects the contact between the optical module 51 and the heat sink, and reduces the heat dissipation effect.
In order to solve the technical problems, the invention provides an optical module heat dissipation structure and an optical module assembly, wherein a heat dissipation device in the optical module heat dissipation structure is rotatably arranged on an optical module mounting cage, the heat dissipation device is rotated to a first angle position before an optical module is mounted, a flexible contact element is prevented from being scraped off when the optical module is mounted, the optical module is well contacted with the heat dissipation device through the flexible contact element, and the heat dissipation capacity of the optical module heat dissipation structure on the optical module is improved.
In order to make the aforementioned objects, features and advantages of the embodiments of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An optical module assembly according to an embodiment of the present invention is described below with reference to the accompanying drawings.
Referring to fig. 7, 8 and 9, fig. 7 is an assembly diagram of an optical module heat dissipation structure, a circuit board and an optical module connector according to an embodiment of the present invention, fig. 8 is an assembly process schematic diagram of an optical module assembly according to an embodiment of the present invention, and fig. 9 is a structural schematic diagram of the optical module assembly according to an embodiment of the present invention after assembly.
The optical module assembly 50 includes an optical module 51, an optical module heat dissipation structure 52, a circuit board 53, an optical module connector 54, and an optical module assembly chassis 55, where the optical module heat dissipation structure 52 is disposed in the optical module assembly chassis 55, the optical module heat dissipation structure 52 is used to dissipate heat of the optical module 51, the circuit board 53 is disposed on the outer side of the optical module mounting cage 200 away from the optical module 51, and the optical module connector 54 is used to connect the optical module 51.
An optical module heat dissipation structure according to an embodiment of the present invention is described below with reference to the accompanying drawings.
As shown in fig. 7, the optical module heat dissipation structure 52 includes an optical module mounting cage 200 and a heat dissipation device 100, a first side of the optical module mounting cage 200 is provided with an installation opening 203, and a second side adjacent to the first side is provided with a window 204. The optical module 51 enters the optical module mounting cage 200 from a loading opening 203 provided at a first side of the cage 200. The heat sink 100 comprises a heat sink comprising a heat dissipating body and a heat conducting portion connected to the heat dissipating body, the heat conducting portion extending into the window 204 of the optical module mounting cage 200, and a flexible contact 2. The heat conducting portion has a heat conducting surface facing the inside of the optical module mounting cage 200, the heat conducting surface includes a first heat conducting surface 113 disposed close to the loading opening 203 and a second heat conducting surface 114 disposed far from the loading opening 203, the flexible contact 2 is disposed on the first heat conducting surface 113, and the heat dissipation device 100 is rotatably disposed on the optical module mounting cage 200.
The heat sink 100 has a first rotational position where the heat sink 100 is inclined toward the inside of the optical module mounting cage 200 in a direction from the first heat-conducting surface 113 toward the second heat-conducting surface 114, and a second rotational position where the flexible contact 2 and the second heat-conducting surface 114 can be attached to the optical module 51 loaded in the optical module mounting cage 200.
The heat dissipation device 100 is rotatably disposed on the optical module mounting cage 200, the heat dissipation device 100 is inclined toward the inside of the optical module mounting cage 200, an opening formed between the flexible contact 2 and the bottom surface of the optical module mounting cage 200 is large, and when the optical module 51 enters the optical module mounting cage 200, the optical module 51 does not contact the side edge of the flexible contact 2, so that the flexible contact 2 is prevented from being scraped off when the optical module 51 is installed. On the other hand, the arrangement of the flexible contact 2 can reduce the thermal resistance and improve the heat dissipation effect of the optical module heat dissipation structure on the optical module 51.
When the heat sink 100 is in the first rotational position, the optical module 51 enters from the loading opening 203 of the optical module mounting cage 200, and in order to avoid the optical module 51 contacting and scraping the flexible contact 2, it is further preferable that a distance between one end of the flexible contact 2 away from the loading opening 203 and a sidewall of a third side of the optical module mounting cage 200 opposite to the second side is greater than a thickness of the optical module 51. In this case, when the optical module 51 enters the optical module mounting cage 200, it contacts the second heat-conducting surface 114 first and then contacts the flexible contacts 2, thereby preventing the flexible contacts 2 from being scratched.
When the heat dissipation device 100 is in the second rotational position, the flexible contact 2 is in a compressed state under the pressure of the heat sink, so that the flexible contact 2 and the second heat conduction surface 114 can be attached to the optical module 51 installed in the optical module mounting cage 200, and good contact between the flexible contact 2 and the contact surface of the second heat conduction surface 114 is ensured, and the thickness of the flexible contact 2 in a free state is greater than the vertical distance between the first heat conduction surface 113 and the second heat conduction surface 114.
In order to ensure good contact between the optical module 51 and the heat sink and prevent the flexible contacts 2 from being scraped off, the flexible contacts 2 are preferably made of a material having high hardness and good thermal conductivity, for example, silicone rubber.
In order to better maintain the heat sink 100 at the first rotational position, as shown in fig. 7, the elastic member 3 is preferably disposed between one end of the heat sink body close to the first heat conduction surface 113 and the outer wall surface of the first side of the optical module mounting cage 200. When the heat sink 100 is mounted on the optical module mounting cage 200, the elastic member 3 of the heat sink 100 is compressed by the pressure of the optical module mounting cage 200. After the heat dissipation device 100 is installed, the heat dissipation device 100 reversely rotates to the first rotation position under the elastic action of the elastic member 3, and the rotation angle is 0 to 3 degrees, at this time, the elastic member 3 is in a stretching state. When the heat dissipation device 100 is at the first rotation position, the heat dissipation device 100 is inclined toward the inside of the optical module mounting cage 200 along the direction from the first heat conduction surface 113 to the second heat conduction surface 114. After the optical module 51 is assembled, under the action of a lever force (described later in detail), the heat sink 100 is in the second rotational position, the flexible contact 2 and the second heat-conducting surface 114 can be attached to the optical module 51 assembled in the optical module mounting cage 200, and at this time, the elastic member 3 is in a compressed state.
It should be noted that the elastic member 3 is preferably a spring for the convenience of installation and better compression and extension of the elastic member 3.
In order to facilitate the heat dissipation device 100 to better rotate on the optical module mounting cage 200, in a preferred embodiment, referring to fig. 7, the rotating shaft 4 is installed in the direction of the offset fin 102 in the middle of the boss 112, which is more beneficial to the heat dissipation device 100 to tilt towards the inside of the optical module mounting cage 200.
In a specific embodiment, referring to fig. 8 and 9, when heat spreader 100 is mounted to optical module mounting cage 200, the springs of heat spreader 100 are in a compressed state when subjected to pressure from optical module mounting cage 200. The heat sink 100 is rotated in the opposite direction to the first rotation position by the elasticity of the elastic member 3, the rotation angle is 0-3 °, and the spring is in a stretched state. When the heat dissipation device 100 is at the first rotation position, the heat dissipation device 100 is inclined toward the inside of the optical module mounting cage 200 along the direction from the first heat conduction surface 113 to the second heat conduction surface 114. When the optical module 51 enters the optical module mounting cage 200 from the loading opening 203 provided at the first side of the optical module mounting cage 200, a distance between one end of the flexible contact 2 away from the loading opening 203 and a sidewall of a third side of the optical module mounting cage 200 opposite to the second side is greater than a thickness of the optical module 51. In this case, the optical module 51 first contacts the second heat-conducting surface 114 when entering the optical module mounting cage 200. The optical module 51 provides a lever force to the second heat conducting surface 114 away from the optical module mounting cage 200. As the optical module 51 gradually enters the optical module installation cage 200, the heat dissipation device 100 rotates along the rotation shaft 4 in the forward direction, so that the heat dissipation device 100 is located at the second rotation position. Since the thickness of the flexible contact 2 in the free state is larger than the vertical distance between the first heat conduction surface 113 and the second heat conduction surface 114, the flexible contact 2 and the second heat conduction surface 114 can be attached to the optical module 51 mounted in the optical module mounting cage 200 under the pressure of the heat sink 100.
In order to equalize the temperature of the heat dissipation device 100, in an embodiment, refer to fig. 5 and 6, where fig. 5 is a front view of the heat dissipation device according to the embodiment of the present invention, and fig. 6 is a left side view of the heat dissipation device according to the embodiment of the present invention. The heat pipe 111 is provided on the other surface of the substrate 101 in the heat conduction portion, and the heat pipe 111 is formed in a square shape and is provided on the substrate 101 by soldering in order to facilitate mounting of the heat pipe 111. One side of the heat pipe 111 is in contact with the boss 112, and the other side is in contact with the substrate 101, so that heat emitted by the optical module 51 can be better transmitted to the fins 102 of the substrate 101 to be radiated, and a temperature equalization effect is achieved.
The heat dissipation device 100 is rotatably disposed on the optical module mounting cage 200, optionally, mounting structures are disposed on two axial sides of the heat dissipation device 100, the heat dissipation device 100 is mounted on the optical module mounting cage 200 through the mounting structures on the two sides, the mounting structures include a shaft sleeve portion and a connecting portion, the shaft sleeve portion is sleeved with the rotating shaft 4, and the connecting portion is connected with the optical module mounting cage 200.
The mounting structure comprises a first buckle 31 and a second buckle 32, the first buckle 31 comprises a first semicircular arc groove 312 and a first clamping portion 311 which are connected, and the second buckle 32 comprises a second semicircular arc groove 322 and a second clamping portion 321 which are connected. The first clamping portion is clamped with 311 the second clamping portion 321, and the first semicircular arc groove 312 and the second semicircular arc groove 322 form a shaft sleeve portion.
In an alternative embodiment, referring to fig. 10, 11, 12 and 14, fig. 10 is a structural view of a first fastener provided in an embodiment of the present invention, fig. 11 is a front view of a second fastener provided in an embodiment of the present invention, fig. 12 is a left view of the second fastener provided in an embodiment of the present invention, and fig. 14 is an assembly structural view of the first fastener and the second fastener provided in an embodiment of the present invention. The first fastener 31 is in a strip shape, the middle bending portion is a first semicircular arc groove 312, and two sides of the first semicircular arc groove 312 are respectively bent to form a first fastening portion 311. The second fastener 32 is a rectangular plate-shaped structure, a notch is formed in the middle of one side of the rectangular plate to form a second semicircular groove 322, the two sides of the second semicircular groove 322 are respectively bent to form a second fastening portion 321, and a plurality of parallel grooves 324 are formed in the bottom of the other side opposite to the side where the second semicircular groove 322 is formed. When the first fastener 31 and the second fastener 32 are installed, the first fastening portion 311 of the first fastener 31 is fastened to the second fastening portion 321 of the second fastener 32, the first semicircular groove 312 and the second semicircular groove 322 form a shaft sleeve portion, and the rotating shaft 4 of the heat dissipation device 100 is sleeved on the shaft sleeve portion.
In order to mount the second fastener 32 on the optical module mounting cage 200, in an alternative embodiment, referring to fig. 15 and 17, fig. 15 is a left side view of a heat dissipation structure of an optical module according to an embodiment of the present invention, and fig. 17 is a left side view of an optical module assembly according to an embodiment of the present invention. Two sides of the optical module installation cage 200 are respectively provided with a first protrusion structure 201, and the first protrusion structure 201 is a solid polygon. The first protrusion structure 201 is engaged with the engaging opening 323 of the second engaging member 32, so that the second engaging member 32 is fixedly mounted on the optical module mounting cage 200.
In order to further fix the second fastener 32, the connecting portion further includes a third fastener 33 connected to the optical module mounting cage 200, and the third fastener 33 is installed between the second semi-arc groove 322 and the card interface 323 and located outside the second fastener 32.
In an alternative embodiment, referring to fig. 13 and 16, fig. 13 is a structural view of a third fastener provided in an embodiment of the invention, and fig. 16 is a front view of an optical module assembly provided in an embodiment of the invention. The third fastener 33 is in the shape of a long strip, and two third semi-circular grooves 331 are formed in the middle. The two sides of the optical module mounting cage 200 are respectively provided with a second protrusion structure 202, the second protrusion structure 202 is a square, one end of the second protrusion structure is arranged on the optical module mounting cage 200, and the middle of the second protrusion structure is provided with an opening. The third fastener 33 extends along the mounting direction of the optical module 51, two ends of the third fastener 33 are respectively inserted into the openings of the second protrusion structures 202, and a part of the third fastener 33 is located in the groove 324 of the second fastener 32. The second fastener 32 is placed between the optical module mounting cage 200 and the third fastener 33, and plays a role in mounting and fixing the second fastener 32.
Referring to fig. 16 and 17, the assembly process of the optical module assembly 50 is as follows:
the heat sink 100 and the optical module mounting cage 200 are fixed. First, the first fastener 31 and the second fastener 32 are installed, the first fastening portion 311 of the first fastener 31 is fastened to the second fastening portion 321 of the second fastener 32, the first semicircular groove 312 and the second semicircular groove 322 form a shaft sleeve portion, and the rotating shaft 4 of the heat dissipation device 100 is sleeved inside the shaft sleeve portion. The first protrusion structure 201 is engaged with the engaging opening 323 of the second engaging member 32, so that the second engaging member 32 is fixedly mounted on the optical module mounting cage 200. And then, the third fastener 33 is installed, and the third fastener 33 is installed between the second semicircular arc groove 322 and the fastener interface 323 and is located at the outer side of the second fastener 32. Two ends of the third fastening member 33 are respectively inserted into the openings of the second protrusion structures 202, and the third semi-circular groove 331 of the third fastening member 33 contacts with the groove 324 of the second fastening member 32, so as to further fix the second fastening member 32.
Next, in the process of assembling the optical module 51, when the heat dissipation device 100 is located at the first rotation position, the heat dissipation device 100 is inclined toward the inside of the optical module mounting cage 200 along the direction from the first heat conduction surface 113 to the second heat conduction surface 114, the optical module 51 enters from the loading opening 203 of the optical module mounting cage 200, and when the optical module 51 enters the optical module mounting cage 200, the optical module 51 contacts the second heat conduction surface 114 first and then contacts the flexible contact 2, so as to prevent the flexible contact 2 from being scratched. When the optical module 51 is inserted into the optical module connector 54, the heat sink 100 is in the second rotation position, the flexible contact 2 is in a compressed state under the pressure of the heat sink, the flexible contact 2 and the second heat-conducting surface 114 can be attached to the optical module 51 loaded into the optical module mounting cage 200, and the optical module 51 completes the assembling process.
The embodiments or implementation modes in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
In the description of the present specification, references to "one embodiment", "some embodiments", "an illustrative embodiment", "an example", "a specific example", or "some examples", etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (11)
1. An optical module heat dissipation structure, comprising:
the optical module mounting device comprises an optical module mounting cage, a first side of the optical module mounting cage is provided with a mounting opening, and a second side adjacent to the first side is provided with a window;
the heat dissipation device is rotatably arranged on the optical module mounting cage and comprises a heat radiator and a flexible contact element, the heat radiator comprises a heat dissipation body and a heat conduction part connected with the heat dissipation body, the heat conduction part extends into the window, the heat conduction part is provided with a heat conduction surface facing the inside of the optical module mounting cage, the heat conduction surface comprises a first heat conduction surface close to the loading port and a second heat conduction surface far away from the loading port, and the flexible contact element is arranged on the first heat conduction surface;
the heat dissipation device has a first rotational position at which the heat dissipation device is inclined toward the inside of the optical module mounting cage along a direction from the first heat conduction surface toward the second heat conduction surface, and a second rotational position at which the flexible contact member and the second heat conduction surface can be attached to an optical module loaded in the optical module mounting cage.
2. The optical module heat dissipation structure of claim 1, wherein the first heat conduction surface and the second heat conduction surface have a vertical distance therebetween, the vertical distance being smaller than a thickness of the flexible contact in a free state.
3. The optical module heat dissipation structure of claim 1, wherein in the first rotational position, a distance between an end of the flexible contact distal from the loading opening and a sidewall of a third side of the optical module mounting cage opposite the second side is greater than a thickness of the optical module.
4. The optical module heat dissipation structure of any one of claims 1 to 3, wherein the optical module heat dissipation structure comprises an elastic member, the elastic member is disposed between an end of the heat dissipation body close to the first heat conduction surface and an outer wall surface of the first side of the optical module mounting cage;
in the first rotating position, the elastic part is in a stretching state; in the second rotational position, the resilient member is in a compressed state.
5. The optical module heatsink according to any one of claims 1 to 3, wherein the optical module heatsink comprises mounting structures provided on both axial sides of the heatsink, the heatsink being mounted to the optical module mounting cage via the mounting structures on both sides,
the mounting structure comprises a shaft sleeve portion and a connecting portion which are connected, a rotating shaft which is sleeved by the shaft sleeve portion is arranged on the heat dissipation device, and the connecting portion is connected with the optical module mounting cage.
6. The optical module heat dissipation structure of claim 5, wherein the mounting structure comprises a first fastener and a second fastener, the first fastener comprises a first semicircular arc groove and a first fastening portion connected to each other, and the second fastener comprises a second semicircular arc groove and a second fastening portion connected to each other;
the first clamping portion is clamped with the second clamping portion, and the first semicircular arc groove and the second semicircular arc groove form the shaft sleeve portion.
7. The optical module heat dissipation structure of claim 6, wherein the connection portion includes a card interface disposed on the second fastening member, and a first protrusion structure clamped to the card interface is disposed on the optical module mounting cage.
8. The optical module heat dissipation structure of claim 7, wherein the connection portion comprises a third clip connected to the optical module mounting cage, and the third clip is located between the second semi-circular groove and the clip interface and outside the second clip.
9. The optical module heat dissipation structure of claim 8, wherein a groove is formed in the second fastening member, and a part of the third fastening member is located in the groove;
the third fastener extends along the mounting direction of the optical module, two second protruding structures are arranged on the optical module mounting cage, the two second protruding structures are located on two sides of the second fastener in the extending direction of the third fastener, an opening facing the third fastener is formed in each second protruding structure, and two ends of the third fastener are inserted into the openings respectively.
10. The optical module heat dissipation structure according to any one of claims 1 to 3, wherein the heat dissipation body includes a substrate and fins disposed on one surface of the substrate, the heat conduction portion includes a heat pipe disposed on the other surface of the substrate, and a boss disposed on a side of the heat pipe facing away from the substrate, and the heat conduction surface is disposed on the boss.
11. A light module assembly comprising a light module and the light module heatsink of any one of claims 1-10, wherein the light module is mounted in the light module mounting cage through the mounting opening, and wherein the light module is attached to the flexible contact and the second thermally conductive surface.
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| CN202110729830.8A CN113376773B (en) | 2021-06-29 | 2021-06-29 | Optical module heat radiation structure and optical module assembly |
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| CN202110729830.8A CN113376773B (en) | 2021-06-29 | 2021-06-29 | Optical module heat radiation structure and optical module assembly |
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| CN113376773B CN113376773B (en) | 2022-09-13 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115267989A (en) * | 2022-08-31 | 2022-11-01 | 西安易朴通讯技术有限公司 | Optical module device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104125751A (en) * | 2013-04-27 | 2014-10-29 | 华为技术有限公司 | Heat-dissipating structure of optical module |
| US20170148703A1 (en) * | 2015-11-20 | 2017-05-25 | Fujitsu Limited | Semiconductor device |
| CN207675989U (en) * | 2018-01-09 | 2018-07-31 | 武汉铭之光科技有限公司 | Novel heat dissipation structure for high-speed long-distance optical module |
| CN110687640A (en) * | 2018-07-05 | 2020-01-14 | 上海瑞波电子科技有限公司 | High-rate QSFP optical module for optical fiber communication |
| CN213395234U (en) * | 2020-11-02 | 2021-06-08 | 深圳市欧拓达科技有限公司 | Light-emitting diode heat dissipation device |
-
2021
- 2021-06-29 CN CN202110729830.8A patent/CN113376773B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104125751A (en) * | 2013-04-27 | 2014-10-29 | 华为技术有限公司 | Heat-dissipating structure of optical module |
| US20170148703A1 (en) * | 2015-11-20 | 2017-05-25 | Fujitsu Limited | Semiconductor device |
| CN207675989U (en) * | 2018-01-09 | 2018-07-31 | 武汉铭之光科技有限公司 | Novel heat dissipation structure for high-speed long-distance optical module |
| CN110687640A (en) * | 2018-07-05 | 2020-01-14 | 上海瑞波电子科技有限公司 | High-rate QSFP optical module for optical fiber communication |
| CN213395234U (en) * | 2020-11-02 | 2021-06-08 | 深圳市欧拓达科技有限公司 | Light-emitting diode heat dissipation device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115267989A (en) * | 2022-08-31 | 2022-11-01 | 西安易朴通讯技术有限公司 | Optical module device |
| CN115267989B (en) * | 2022-08-31 | 2023-09-26 | 西安易朴通讯技术有限公司 | Optical module device |
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| CN113376773B (en) | 2022-09-13 |
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