CN113358491A - Aging test method for bonded joint - Google Patents
Aging test method for bonded joint Download PDFInfo
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- CN113358491A CN113358491A CN202110530284.5A CN202110530284A CN113358491A CN 113358491 A CN113358491 A CN 113358491A CN 202110530284 A CN202110530284 A CN 202110530284A CN 113358491 A CN113358491 A CN 113358491A
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- 230000032683 aging Effects 0.000 title claims abstract description 51
- 238000010998 test method Methods 0.000 title claims abstract description 22
- 239000000853 adhesive Substances 0.000 claims abstract description 50
- 230000001070 adhesive effect Effects 0.000 claims abstract description 50
- 238000012360 testing method Methods 0.000 claims abstract description 41
- 238000004088 simulation Methods 0.000 claims abstract description 18
- 238000001514 detection method Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 11
- 230000009467 reduction Effects 0.000 claims abstract description 6
- 230000014759 maintenance of location Effects 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 8
- 238000005336 cracking Methods 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 230000002431 foraging effect Effects 0.000 claims 3
- 230000007613 environmental effect Effects 0.000 abstract description 24
- 238000011156 evaluation Methods 0.000 abstract description 11
- 230000006872 improvement Effects 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 abstract 2
- 230000008859 change Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/24—Investigating strength properties of solid materials by application of mechanical stress by applying steady shearing forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N17/00—Investigating resistance of materials to the weather, to corrosion, or to light
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
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- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Chemical & Material Sciences (AREA)
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- General Physics & Mathematics (AREA)
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- Environmental & Geological Engineering (AREA)
- Environmental Sciences (AREA)
- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
Abstract
The invention provides an aging test method of a bonded joint. The aging test method of the adhesive joint comprises a heating step, wherein in the heating step, the environmental temperature and the environmental humidity of the position where the adhesive joint is located are increased to a first preset environmental temperature and a preset environmental humidity, and the first preset time is kept; a temperature reduction step, wherein in the temperature reduction step, the environment temperature is reduced to a second preset environment temperature and is kept for a second preset time; and a detection step, wherein in the detection step, the mechanical property of the bonded joint is tested. The aging test method of the adhesive joint can simulate the aging behavior of the adhesive sample in the natural environment to a high degree, so that the simulation degree of the adhesive joint is higher, the performance assessment is more perfect, and a good test data basis is provided for the improvement of the adhesive joint. The aging test method makes up the blank of the aging method and the related performance evaluation of the adhesive joint in the complex service environment, and has the advantages of higher simulation degree, more perfect performance evaluation, aging test time saving and the like.
Description
Technical Field
The invention relates to the technical field of performance test of a bonding joint, in particular to an aging test method of the bonding joint.
Background
The bonding is an indispensable connection mode of the railway vehicle, has engineering characteristics of simple operation, low cost, no stress and the like, and is widely applied to connection of important structures such as side windows, front windows and the like of railway passenger cars in recent years.
With the improvement of the vehicle speed grade and the expansion of the operation interval, the service environment of the vehicle is severe day by day, and the service performance evaluation and quality safety evaluation of the adhesive joint under the conditions of high temperature, severe cold, damp heat, vibration and the like are in urgent need of improvement.
Disclosure of Invention
The invention provides an aging test method of an adhesive joint, which is used for solving the defect of incomplete aging test in the prior art and realizing the aging test of the adhesive joint with high simulation degree.
The invention provides an aging test method of a bonded joint, which comprises the following steps:
a temperature raising step, wherein in the temperature raising step, the ambient temperature and the ambient humidity of the position where the bonding joint is located are raised to a first preset ambient temperature and a preset ambient humidity, and the first preset duration is kept;
a temperature reduction step, wherein in the temperature reduction step, the environment temperature is reduced to a second preset environment temperature and is kept for a second preset time;
and a detection step, wherein in the detection step, the mechanical property of the bonding joint is tested.
According to an embodiment of the present invention, the temperature increasing step further includes:
increasing the ambient temperature and the ambient humidity to the first preset ambient temperature and the preset ambient humidity within a third preset time period;
the cooling step further comprises:
and within a fourth preset time period, reducing the ambient temperature to a second preset ambient temperature.
According to an embodiment of the present invention, between the cooling step and the detecting step, the method further includes:
and carrying out appearance detection on the bonding joint.
According to an embodiment of the present invention, the step of performing appearance inspection on the bonded joint includes:
performing at least one of appearance inspection of color, shape and surface cracking of the bonded joint.
According to an embodiment of the present invention, the step of performing a mechanical property test on the bonded joint includes:
and (3) carrying out tensile shear strength test on the bonded joint, and comparing and calculating the retention rate of the tensile shear strength.
According to an embodiment of the present invention, the step of performing a mechanical property test on the bonded joint includes:
the bonded joint was subjected to a 180 ° peel test and the retention of peel strength was calculated by comparison.
According to an embodiment of the present invention, the first preset time period is 7 to 9 hours, the second preset time period is 7 to 9 hours, the third preset time period is 3 to 5 hours, and the fourth preset time period is 3 to 5 hours;
the first preset environment temperature is 60-80 ℃, the second preset environment temperature is-30-40 ℃, and the preset environment humidity is more than 90%.
According to an embodiment of the present invention, before the temperature raising step, the method further includes:
and placing the adhesive joint in a sample rack, and placing the sample rack in an environment simulation box body.
According to one embodiment of the invention, the sample rack comprises a first support frame and a second support frame, a first end of the first support frame and a first end of the second support frame are hinged to each other, and a second end of the first support frame and a second end of the second support frame are connected through a connecting frame.
According to an embodiment of the present invention, further comprising:
and circularly performing the temperature increasing step and the temperature decreasing step according to at least one of the type of the bonding joint, the ambient temperature and the ambient humidity.
According to the aging test method for the adhesive joint provided by the embodiment of the invention, the environmental temperature and the environmental humidity of the position of the adhesive joint are increased to the first preset environmental temperature and the preset environmental humidity, and the first preset environmental temperature is reduced to the second preset environmental temperature, so that the aging of the adhesive joint can be accelerated in a short time, the aging behavior of an adhesive sample in a natural environment is highly simulated, the simulation degree of the adhesive joint is higher, the performance check is more perfect, and a good test data basis is provided for the improvement of the adhesive joint. The aging test method makes up the blank of the aging method and the related performance evaluation of the adhesive joint in the complex service environment, and has the advantages of higher simulation degree, more perfect performance evaluation, aging test time saving and the like.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic flow chart of a method of aging a bonded joint provided by the present invention;
FIG. 2 is a schematic front view of a sample holder provided by the present invention;
fig. 3 is a schematic side view of a sample holder provided by the present invention.
Reference numerals:
100. a first support frame; 102. a second support frame; 104. and a connecting frame.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. Specific meanings of the above terms in the embodiments of the present invention can be understood in specific cases by those of ordinary skill in the art.
In embodiments of the invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
An aging test method for a bonded joint according to an embodiment of the present invention is described below with reference to fig. 1 to 3, including:
200, step 200 is a cooling step, in the cooling step, the ambient temperature of the position where the bonding joint is located is reduced to a second preset ambient temperature, and the second preset duration is kept;
According to the aging test method for the adhesive joint provided by the embodiment of the invention, the environmental temperature and the environmental humidity of the position of the adhesive joint are increased to the first preset environmental temperature and the preset environmental humidity, and the first preset environmental temperature is reduced to the second preset environmental temperature, so that the aging of the adhesive joint can be accelerated in a short time, the aging behavior of an adhesive sample in a natural environment is highly simulated, the simulation degree of the adhesive joint is higher, the performance check is more perfect, and a good test data basis is provided for the improvement of the adhesive joint. The aging test method makes up the blank of the aging method and the related performance evaluation of the adhesive joint in the complex service environment, and has the advantages of higher simulation degree, more perfect performance evaluation, aging test time saving and the like.
Specifically, before step 100, step 10 is further included, and step 10 is:
and placing the adhesive joint in a sample rack, and placing the sample rack in an environment simulation box body.
With continued reference to fig. 1-3, in step 10, an adhesive joint is first placed on a sample holder.
In one embodiment of the present invention, the sample rack comprises a first support frame 100 and a second support frame 102, wherein a first end of the first support frame 100 and a first end of the second support frame 102 are hinged to each other, and a second end of the first support frame 100 and a second end of the second support frame 102 are connected by a connecting frame 104.
Referring to fig. 2 to 3, the first support frame 100 and the second support frame 102 are substantially rectangular frames, that is, the height of the first support frame 100 may be 150 mm, the width of the first support frame 100 may be 120 mm, and similarly, the height of the second support frame 102 may also be 150 mm, and the width of the second support frame 102 may also be 120 mm.
Wherein, the top end of the first support frame 100 is a first end of the first support frame 100, and the bottom end of the first support frame 100 is a second end of the first support frame 100; the top end of the second support frame 102 is a first end of the second support frame 102, and the bottom end of the second support frame 102 is a second end of the second support frame 102.
The first end of the first support frame 100 and the first end of the second support frame 102 are connected with each other in a hinged manner; the second end of the first support bracket 100 and the second end of the second support bracket 102 are connected to each other by a connecting bracket 104. Wherein the length of the connecting frame 104 may be 110 mm, and the width of the connecting frame 104 may be 150 mm.
It is understood that the relative angle between the first support bracket 100 or the second support bracket 102 and the connecting bracket 104 is about 70 °.
It should be noted that, in the embodiment of the present invention, the structural dimensions of the first support frame 100, the second support frame 102, and the connecting frame 104 may be flexibly set to other dimensions, and it is only necessary to match the structural dimensions of the first support frame 100, the second support frame 102, and the connecting frame 104 with the structural dimensions of the adhesive joint.
And after the adhesive joint is arranged on the sample rack, the whole sample rack is arranged in the environment simulation box body. It should be noted that, in the embodiment of the present invention, the structure of the environment simulation box is not particularly limited, for example, the environment simulation box may be a box structure capable of forming a sealed environment, in which devices such as a heater, a refrigerator, a humidifier, a temperature sensor, a humidity sensor, and the like are disposed. In addition, the box structure should have a certain accommodation space to completely accommodate the sample rack therein.
Step 10 is followed by step 100, wherein step 100 comprises:
and raising the ambient temperature and the ambient humidity of the position where the bonding joint is located to a first preset ambient temperature and a preset ambient humidity, and keeping the first preset duration.
In step 100, the ambient temperature and the ambient humidity at the position of the current adhesive joint may be detected in advance, so that the target values of the first preset ambient temperature and the preset ambient humidity, and the parameters such as the temperature rise rate and the humidification rate may be selected according to the current ambient temperature and the current ambient humidity.
After the ambient temperature and the ambient humidity at the position where the adhesive joint is located are respectively increased to a first preset ambient temperature and a preset ambient humidity, the first preset duration needs to be maintained.
The temperature and the humidity of the environment at the position where the adhesive joint is located can be respectively increased to the first preset environment temperature and the preset environment humidity within the third preset time.
In the embodiment of the present invention, the first predetermined time period is 7 to 9 hours, the third predetermined time period may be 3 to 5 hours, the first predetermined ambient temperature is 60 to 80 ℃, and the predetermined ambient humidity is greater than 90%.
That is, after the sample rack with the adhesive joint hung thereon is placed in the environment simulation box, the ambient temperature at the position of the adhesive joint can be raised to 60 to 80 ℃ within 3 to 5 hours, the ambient humidity at the position of the adhesive joint can be raised to more than 90%, and the temperature can be maintained for 7 to 9 hours.
200, step 200 is a cooling step, in the cooling step, the ambient temperature of the position where the bonding joint is located is reduced to a second preset ambient temperature, and the second preset duration is kept;
in step 200, the ambient temperature at the position where the current adhesive joint is located after temperature rise and humidification may be detected in advance, so that the target value of the second preset ambient temperature, the temperature decrease rate, and other parameters may be selected according to the current ambient temperature.
After the temperature rise and humidification are carried out, the environmental temperature of the position where the bonding joint is located is reduced to a second preset environmental temperature, and then the second preset duration is required to be kept.
And the ambient temperature of the position where the bonding joint is located can be reduced to a second preset ambient temperature within a fourth preset time period.
In the embodiment of the present invention, the second predetermined time period is 7 to 9 hours, the fourth predetermined time period may be 3 to 5 hours, and the second predetermined ambient temperature is-30 to-40 ℃.
That is, the temperature of the environment in the box is simulated for the heated and humidified environment, and the temperature can be reduced to-30 to-40 ℃ within 3 to 5 hours and kept for 7 to 9 hours.
Of course, after the step 200 is completed, the temperature increasing step and the temperature decreasing step may be performed in a cycle according to at least one of the type of the adhesive joint, the ambient temperature, and the ambient humidity.
That is, in this step, the above steps 100 and 200 may be performed in a cycle according to at least one of the type of the bonded joint, the ambient temperature, and the ambient humidity, and it should be noted that the cycle of the steps 100 and 200 may be stopped when the bonded joint is aged.
Therefore, the aging of the adhesive joint can be accelerated in a short time by performing the steps 100 and 200 once or circularly, the aging behavior of the adhesive sample in the natural environment is simulated in a high simulation mode, the simulation degree of the adhesive joint is higher, the performance assessment is more perfect, and a good test data basis is provided for the improvement of the adhesive joint.
In addition, between the steps 200 and 300, the following steps are further included:
and carrying out appearance detection on the bonded joint.
In this step, the bonded joint may be visually inspected for at least one of color, shape, and surface cracking.
Step 300 is a detection step, in which a mechanical property test is performed on the bonded joint.
In step 300, the mechanical properties of the aged bonded joint may be tested.
Specifically, in step 300, the bonded joint may be subjected to a tensile shear strength test and the retention of tensile shear strength calculated by comparison.
And (4) after the aged bonding joint is subjected to tensile shear strength test, comparing and calculating the retention rate of the tensile shear strength before and after the aging test so as to completely investigate the change condition of the mechanical properties before and after aging.
In step 300, a 180 ° peel test may also be performed on the bonded joint and the peel strength retention calculated by comparison.
And (3) testing the 180-degree peel strength of the aged bonding joint, and comparing and calculating the retention rate of the peel strength before and after the aging test so as to completely investigate the change condition of the mechanical properties before and after aging.
In other words, in one embodiment of the present invention, the tensile shear strength test may be performed only on the bond joint after aging is completed, or the 180 ° peel test may be performed only on the bond joint after aging is completed, or the tensile shear strength test and the 180 ° peel test may be performed on the bond joint after aging is completed, respectively.
In the embodiment of the present invention, in step 300, a tensile shear strength test and a 180 ° peel test are performed on the aged bonded joint, respectively.
In summary, according to the aging test method for the adhesive joint provided by the embodiment of the invention, the environmental temperature and the environmental humidity of the position of the adhesive joint are increased to the first preset environmental temperature and the preset environmental humidity, and the first preset environmental temperature is reduced to the second preset environmental temperature, so that the adhesive joint can accelerate aging in a short time, and the aging behavior of the adhesive sample in the natural environment is simulated in a highly simulated manner. After the aged adhesive joint is subjected to a tensile shear strength test or a 180-degree peeling test, the retention rate of the tensile shear strength and the retention rate of the peeling strength before and after the aging test are compared and calculated, so that the change conditions of the mechanical properties before and after aging can be conveniently and completely examined, the simulation degree of the adhesive joint is higher, the performance evaluation is more complete, and a good test data basis is provided for the improvement of the adhesive joint. The aging test method makes up the blank of the aging method and the related performance evaluation of the adhesive joint in the complex service environment, and has the advantages of higher simulation degree, more perfect performance evaluation, aging test time saving and the like.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. An aging test method for a bonded joint, characterized by comprising:
a temperature raising step, wherein in the temperature raising step, the ambient temperature and the ambient humidity of the position where the bonding joint is located are raised to a first preset ambient temperature and a preset ambient humidity, and the first preset duration is kept;
a temperature reduction step, wherein in the temperature reduction step, the environment temperature is reduced to a second preset environment temperature and is kept for a second preset time;
and a detection step, wherein in the detection step, the mechanical property of the bonding joint is tested.
2. The aging test method for a bonded joint according to claim 1, wherein the temperature raising step further comprises:
increasing the ambient temperature and the ambient humidity to the first preset ambient temperature and the preset ambient humidity within a third preset time period;
the cooling step further comprises:
and within a fourth preset time period, reducing the ambient temperature to a second preset ambient temperature.
3. The aging test method for a bonded joint according to claim 2, further comprising, between the cooling step and the detecting step:
and carrying out appearance detection on the bonding joint.
4. The method for aging test of a bonded joint according to claim 3, wherein the step of performing appearance test of the bonded joint comprises:
performing at least one of appearance inspection of color, shape and surface cracking of the bonded joint.
5. The method for aging testing of bonded joints according to claim 2, wherein the step of subjecting the bonded joints to mechanical property testing comprises:
and (3) carrying out tensile shear strength test on the bonded joint, and comparing and calculating the retention rate of the tensile shear strength.
6. The method for aging testing of bonded joints according to claim 2, wherein the step of subjecting the bonded joints to mechanical property testing comprises:
the bonded joint was subjected to a 180 ° peel test and the retention of peel strength was calculated by comparison.
7. The aging test method for a bonded joint according to any one of claims 2 to 6, wherein the first predetermined period of time is 7 to 9 hours, the second predetermined period of time is 7 to 9 hours, the third predetermined period of time is 3 to 5 hours, and the fourth predetermined period of time is 3 to 5 hours;
the first preset environment temperature is 60-80 ℃, the second preset environment temperature is-30-40 ℃, and the preset environment humidity is more than 90%.
8. The aging test method for a bonded joint according to any one of claims 1 to 6, further comprising, before the temperature raising step:
and placing the adhesive joint in a sample rack, and placing the sample rack in an environment simulation box body.
9. The method for burn-in testing of a bonded joint of claim 8, wherein said sample holder comprises a first support and a second support, a first end of said first support and a first end of said second support are hinged to each other, and a second end of said first support and a second end of said second support are connected by a connecting bracket.
10. The aging test method for a bonded joint according to any one of claims 1 to 6, further comprising:
and circularly performing the temperature increasing step and the temperature decreasing step according to at least one of the type of the bonding joint, the ambient temperature and the ambient humidity.
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| CN202110530284.5A CN113358491A (en) | 2021-05-14 | 2021-05-14 | Aging test method for bonded joint |
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| CN202110530284.5A CN113358491A (en) | 2021-05-14 | 2021-05-14 | Aging test method for bonded joint |
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