CN113347806B - Ceramic dielectric capacitor protection method - Google Patents
Ceramic dielectric capacitor protection method Download PDFInfo
- Publication number
- CN113347806B CN113347806B CN202110603149.9A CN202110603149A CN113347806B CN 113347806 B CN113347806 B CN 113347806B CN 202110603149 A CN202110603149 A CN 202110603149A CN 113347806 B CN113347806 B CN 113347806B
- Authority
- CN
- China
- Prior art keywords
- ceramic dielectric
- dielectric capacitor
- leads
- circuit board
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Capacitors (AREA)
Abstract
The invention provides a ceramic dielectric capacitor protection method, which comprises the following steps: s1, bending two leads of a ceramic dielectric capacitor into a right-angle type with an inverted arc; s2, welding the two leads with the circuit board; s3, glue injection reinforcement is carried out between the ceramic dielectric capacitor and the circuit board in a layered mode; and S4, respectively carrying out dispensing encapsulation on the welding positions of the two leads and the circuit board. The invention can improve the mechanical property of external impact and vibration resistance of the ceramic dielectric capacitor, in particular to a lead-type high-voltage ceramic dielectric capacitor, reduce the damage risk after the ceramic dielectric capacitor is subjected to a complex mechanical environment when the ceramic dielectric capacitor is launched and put into orbit along with a carrier rocket, and improve the reliability of the ceramic dielectric capacitor.
Description
Technical Field
The invention relates to the field of capacitance protection in space electronic equipment, in particular to a mechanical protection method for ceramic dielectric capacitance.
Background
Space electronic equipment used in the aerospace field needs to experience complex mechanical environments when launching and entering orbit with a carrier rocket, such as: harsh periodic vibration, random vibration, transient shock, and the like. The mechanical environments mainly comprise working states of pulsation noise generated by an engine, transmission noise generated by the ground, aerodynamic noise, ignition, shutdown, interstage separation of the engine, separation of a spacecraft and a carrier rocket, expansion of accessories and the like, and after the complex forces are transmitted through the structure, the structure can be subjected to overstress damage or fatigue damage, so that the structural integrity is damaged, and the performance of space electronic equipment is reduced, the working failure is caused, or the equipment is failed integrally.
Therefore, electronic equipment for space needs to glue and reinforce installed components on the ground. The poured liquid compound is solidified into the thermosetting polymer insulating material with excellent performance under the normal temperature or the heating condition. The overall mechanical property of the electronic device can be improved, and the resistance to external impact and vibration can be improved;
the conventional encapsulation and protection process for components is to inject liquid compound into the components with electronic components and circuits mechanically or manually, and then protect the components after curing. However, the ceramic dielectric capacitor used for space electronic equipment in the aerospace field, especially the lead-type high-voltage ceramic dielectric capacitor, has large mass and large volume, the two welding supports at the two ends of the lead are thinner, and the high-voltage insulation requirement at the two ends of the lead is high, so that the conventional encapsulation mode cannot meet the mechanical property requirement of the device in the space electronic equipment in the aerospace field.
Disclosure of Invention
The invention provides a ceramic dielectric capacitor protection method for solving the problems.
In order to achieve the purpose, the invention adopts the following specific technical scheme:
a ceramic dielectric capacitor protection method is characterized by comprising the following steps:
s1, bending two leads of a ceramic dielectric capacitor into a right-angle type with an inverted arc;
s2, welding the two leads with the circuit board;
s3, glue injection reinforcement is carried out between the ceramic dielectric capacitor and the circuit board in a layered mode;
and S4, respectively carrying out dispensing encapsulation on the welding positions of the two leads and the circuit board.
Preferably, in step S1, the root portions of the two leads need to be protected during the forming process of the two leads, so as to prevent the root portions of the two leads from being damaged during the bending forming process.
Preferably, in step S1, the radius of the rounded chamfer of the two leads is required to be 3 to 5 times the diameter of the two leads during bending.
Preferably, in step S2, during soldering, a vertical distance between a lowest end of the ceramic capacitor and the circuit board is greater than 3 mm, so that a mounting space is reserved between the ceramic capacitor and the circuit board.
Preferably, the small components are soldered in a row in the reserved mounting space.
Preferably, in step S3, during glue injection, glue is injected layer by layer from the surface of the circuit board by using an injector until the circuit board is connected with the ceramic dielectric capacitor, and then glue injection is continued until the area of the circuit board is larger than 1/3 of the area of the lower end of the ceramic dielectric capacitor, so as to form a ceramic dielectric capacitor reinforcing glue structure.
Preferably, in step S4, after the glue is dispensed and filled at the welding positions of the two leads and the circuit board, a reinforcing glue structure is formed, and the two reinforcing glue structures are not in contact.
The invention can obtain the following technical effects:
the invention can improve the mechanical property of external impact and vibration resistance of the ceramic dielectric capacitor, in particular to a lead-type high-voltage ceramic dielectric capacitor, reduce the damage risk after the ceramic dielectric capacitor is subjected to a complex mechanical environment when the ceramic dielectric capacitor is launched and put into orbit along with a carrier rocket, and improve the reliability of the ceramic dielectric capacitor.
Drawings
FIG. 1 is a schematic diagram of a method for protecting a ceramic capacitor according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart of a method for protecting a ceramic capacitor according to an embodiment of the present invention;
wherein the reference numerals include: 1 is a circuit board, 2 is a lead, 3 is a ceramic dielectric capacitor, 4 is a reinforcing adhesive structure of the lead and the circuit board, 5 is a reinforcing adhesive structure of the ceramic dielectric capacitor, R is a circular arc chamfer radius of the capacitor lead, H 1 The distance between the upper end of the bent corner of the lead wire of the capacitor and the circuit board H 2 The vertical distance from the lowest end of the capacitor to the circuit board.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention.
The following detailed description of the operation of the present invention is made with reference to fig. 1 and 2:
s1, bending two lead wires 2 of the ceramic dielectric capacitor into a reverse arc right-angle type.
The inverted arc right-angle type means: the included angle of straight lines at two ends of the formed lead is a right angle, but the middle part of the lead can not be directly bent into the right angle, but has circular arc transition, which is similar to the shape of a sharp right angle part rounded off in engineering; the root of the lead needs to be protected during forming, and the protection method is that the root of the lead is manually held by hands during bending, force is applied to the root of the lead to resist the force transmitted to the root of the lead during bending, and the root is prevented from being damaged when the force generated in the bending forming process is transmitted to the root; meanwhile, when the two leads are bent and formed, the radius of the arc chamfer is required to be 3-5 times of the diameter of the two leads, so that the leads can be prevented from being damaged or broken during bending.
And S2, welding the two leads 2 with the circuit board 1.
After the lead wires 2 are bent and formed, welding the two lead wires 2 with the circuit board 1; during welding, the vertical distance H from the lowest end of the ceramic dielectric capacitor 3 to the circuit board 1 2 If the distance is larger than 3 mm, a mounting space is reserved between the ceramic dielectric capacitor 3 and the circuit board 1, and other needed small components are arranged and welded in the reserved mounting space.
And S3, glue injection and reinforcement are carried out between the ceramic dielectric capacitor 3 and the circuit board 1 in a layered mode.
After welding other small components, injecting glue between the ceramic dielectric capacitor 3 and the circuit board 1 in a layered manner by using an injector from the surface of the circuit board 1, wherein the glue injection is slow and delicate, so that bubbles are prevented from being generated after the glue is solidified due to air entering the inside of the glue, after one layer of glue is injected, the steps of completely cooling and solidifying the glue are required to be waited, and then the steps of injecting the glue and waiting for cooling are repeated again; in the layered glue injection process, glue injection is carried out continuously and slowly until the glue injection is connected with the ceramic dielectric capacitor 3, and the glue injection is stopped until the area of the glue covering the ceramic dielectric capacitor 3 is larger than 1/3 of the area of the lower end of the ceramic dielectric capacitor 3, so that the firm glue adhesion can be ensured, and the actual use requirement can be met; and after the glue is cooled, forming a ceramic dielectric capacitor reinforcing glue structure 5.
And S4, respectively carrying out dispensing encapsulation on the welding positions of the two leads 2 and the circuit board 1.
After the ceramic dielectric capacitor reinforcing adhesive structure 5 is finished, respectively carrying out glue dispensing and encapsulating on welding positions of the two leads 2 of the ceramic dielectric capacitor and the circuit board 1, wherein the glue dispensing process is slow and delicate to prevent air from entering the inside of glue to cause bubbles after solidification, and after the glue dispensing is finished, the two leads 2 and the circuit board 1 respectively form a reinforcing adhesive structure 4 of the leads and the circuit board; during glue injection, important attention should be paid to the fact that the two reinforcing glue structures cannot be in adhesion contact, and otherwise, a short circuit phenomenon can occur.
By integrating the steps, the two leads, the reinforcing adhesive structure 4 of the circuit board and the ceramic dielectric capacitor reinforcing adhesive structure 5 form a three-position encapsulation reinforcing structure for the ceramic dielectric capacitor 3, so that the glue injection protection for the ceramic dielectric capacitor 3 is completed. The method can effectively protect the ceramic dielectric capacitor, improve the mechanical property of the ceramic dielectric capacitor against external impact and vibration, reduce the damage risk after experiencing a complex mechanical environment when the ceramic dielectric capacitor is launched and put into orbit along with a carrier rocket, and improve the reliability of the ceramic dielectric capacitor.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
While embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are exemplary and should not be taken as limiting the invention. Variations, modifications, substitutions and alterations of the above-described embodiments may be made by those of ordinary skill in the art without departing from the scope of the present invention.
The above embodiments of the present invention should not be construed as limiting the scope of the present invention. Any other corresponding changes and modifications made according to the technical idea of the present invention should be included in the protection scope of the claims of the present invention.
Claims (5)
1. A ceramic dielectric capacitor protection method is characterized in that the ceramic dielectric capacitor protection method is used for ceramic dielectric capacitor protection in space electronic equipment, and comprises the following steps:
s1, bending two leads of a ceramic dielectric capacitor into a reversed arc right-angle type, wherein the radius of an arc chamfer of the two leads is required to be 3-5 times of the diameter of the two leads when the two leads are bent and formed;
s2, welding the two leads with a circuit board;
s3, glue injection reinforcement is carried out between the ceramic dielectric capacitor and the circuit board in a layered mode, glue injection is carried out layer by layer from the surface of the circuit board by using an injector in the glue injection process until the glue injection is connected with the ceramic dielectric capacitor, and the glue injection is continued until the glue injection is larger than 1/3 of the area of the lower end of the ceramic dielectric capacitor, so that a ceramic dielectric capacitor reinforcement glue structure is formed;
and S4, respectively carrying out dispensing encapsulation on the welding positions of the two leads and the circuit board.
2. The method for protecting a ceramic capacitor according to claim 1, wherein in step S1, the two leads protect the roots of the two leads during molding.
3. The method for protecting a ceramic capacitor of claim 1, wherein in step S2, the vertical distance from the lowest end of the ceramic capacitor to the circuit board is greater than 3 mm, so that a mounting space is reserved between the ceramic capacitor and the circuit board.
4. The ceramic dielectric capacitor protection method as claimed in claim 3, wherein small components are soldered in the mounting space.
5. The method for protecting a ceramic capacitor according to claim 1, wherein in step S4, after the solder joints between the two leads and the circuit board are subjected to dispensing and potting, a reinforcing paste structure is formed, and the two reinforcing paste structures are free of contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110603149.9A CN113347806B (en) | 2021-05-31 | 2021-05-31 | Ceramic dielectric capacitor protection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110603149.9A CN113347806B (en) | 2021-05-31 | 2021-05-31 | Ceramic dielectric capacitor protection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113347806A CN113347806A (en) | 2021-09-03 |
| CN113347806B true CN113347806B (en) | 2023-03-24 |
Family
ID=77473212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110603149.9A Active CN113347806B (en) | 2021-05-31 | 2021-05-31 | Ceramic dielectric capacitor protection method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113347806B (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009033650A1 (en) * | 2009-07-17 | 2011-01-20 | Automotive Lighting Reutlingen Gmbh | Method and connection of an electronic component with a printed circuit board |
| CN204834359U (en) * | 2015-06-20 | 2015-12-02 | 山东精工电子科技有限公司 | Horizontal welding ultracapacitor system's aluminum hull |
| CN106024385A (en) * | 2016-07-15 | 2016-10-12 | 吴江佳亿电子科技有限公司 | Chip high voltage ceramic dielectric capacitor |
| CN106744644A (en) * | 2016-10-11 | 2017-05-31 | 中国科学院地质与地球物理研究所 | A kind of MEMS sensor low stress encapsulating package and package system |
| CN208079575U (en) * | 2018-04-28 | 2018-11-09 | 合肥巨一动力***有限公司 | A kind of controller architecture of integrated pcb board |
| CN110246687A (en) * | 2019-05-22 | 2019-09-17 | 何俊建 | A kind of patch type vibrationproof capacitor |
| EP3545986A1 (en) * | 2018-03-27 | 2019-10-02 | Roche Diabetes Care GmbH | Method and devices for pressure determination in an insulin pump |
| JP2019197791A (en) * | 2018-05-09 | 2019-11-14 | 凸版印刷株式会社 | Capacitor built-in glass substrate and capacitor built-in circuit substrate |
| CN110797190A (en) * | 2019-11-20 | 2020-02-14 | 杭州灵通电子有限公司 | Production fixture and process for multi-core group radial lead multilayer ceramic dielectric capacitor |
| CN210123694U (en) * | 2019-07-29 | 2020-03-03 | 六和电子（江西）有限公司 | Plastic shell structure of film capacitor for horizontal installation of circuit board |
| CN210403524U (en) * | 2019-07-29 | 2020-04-24 | 深圳市华信科科技有限公司 | Solid-state aluminum electrolytic capacitor with shock resistance |
| CN210606977U (en) * | 2019-08-15 | 2020-05-22 | 深圳华容伟业电子有限公司 | Lead structure of paster type aluminum electrolytic capacitor |
| CN210925997U (en) * | 2019-10-29 | 2020-07-03 | 浙江荷清柔性电子技术有限公司 | Flexible chip packaging structure |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1081212C (en) * | 1996-11-20 | 2002-03-20 | 国际商业机器公司 | Electrically conductive paste and composite and their use electrically conductive connector |
| JP2000277883A (en) * | 1999-03-26 | 2000-10-06 | Matsushita Electric Ind Co Ltd | Method of mounting surface mounted type capacitor |
| JP4843555B2 (en) * | 2007-05-11 | 2011-12-21 | 矢崎総業株式会社 | Parts fixing method |
| CN104316094B (en) * | 2014-10-14 | 2017-07-07 | 联合汽车电子有限公司 | Glue seals formula sensor and its manufacturing process |
| CN112867281B (en) * | 2021-01-04 | 2022-05-10 | 深圳市景旺电子股份有限公司 | Flexible circuit board and manufacturing method thereof |
-
2021
- 2021-05-31 CN CN202110603149.9A patent/CN113347806B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009033650A1 (en) * | 2009-07-17 | 2011-01-20 | Automotive Lighting Reutlingen Gmbh | Method and connection of an electronic component with a printed circuit board |
| CN204834359U (en) * | 2015-06-20 | 2015-12-02 | 山东精工电子科技有限公司 | Horizontal welding ultracapacitor system's aluminum hull |
| CN106024385A (en) * | 2016-07-15 | 2016-10-12 | 吴江佳亿电子科技有限公司 | Chip high voltage ceramic dielectric capacitor |
| CN106744644A (en) * | 2016-10-11 | 2017-05-31 | 中国科学院地质与地球物理研究所 | A kind of MEMS sensor low stress encapsulating package and package system |
| EP3545986A1 (en) * | 2018-03-27 | 2019-10-02 | Roche Diabetes Care GmbH | Method and devices for pressure determination in an insulin pump |
| CN208079575U (en) * | 2018-04-28 | 2018-11-09 | 合肥巨一动力***有限公司 | A kind of controller architecture of integrated pcb board |
| JP2019197791A (en) * | 2018-05-09 | 2019-11-14 | 凸版印刷株式会社 | Capacitor built-in glass substrate and capacitor built-in circuit substrate |
| CN110246687A (en) * | 2019-05-22 | 2019-09-17 | 何俊建 | A kind of patch type vibrationproof capacitor |
| CN210123694U (en) * | 2019-07-29 | 2020-03-03 | 六和电子（江西）有限公司 | Plastic shell structure of film capacitor for horizontal installation of circuit board |
| CN210403524U (en) * | 2019-07-29 | 2020-04-24 | 深圳市华信科科技有限公司 | Solid-state aluminum electrolytic capacitor with shock resistance |
| CN210606977U (en) * | 2019-08-15 | 2020-05-22 | 深圳华容伟业电子有限公司 | Lead structure of paster type aluminum electrolytic capacitor |
| CN210925997U (en) * | 2019-10-29 | 2020-07-03 | 浙江荷清柔性电子技术有限公司 | Flexible chip packaging structure |
| CN110797190A (en) * | 2019-11-20 | 2020-02-14 | 杭州灵通电子有限公司 | Production fixture and process for multi-core group radial lead multilayer ceramic dielectric capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113347806A (en) | 2021-09-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8400253B2 (en) | Thermal fuse resistor, manufacturing method thereof, and installation method thereof | |
| JP2921722B2 (en) | Chip type surge absorber | |
| EP1043771B1 (en) | Method of fabricating a resin sealed electronic device | |
| KR101302640B1 (en) | Electronic component built-in substrate and method of manufacturing electronic component built-in substrate | |
| US6797881B2 (en) | Cross substrate, method of mounting semiconductor element, and semiconductor device | |
| US7675171B2 (en) | Semiconductor package and fabricating method thereof | |
| US20060068609A1 (en) | Electronic device | |
| CN113347806B (en) | Ceramic dielectric capacitor protection method | |
| CN103915405A (en) | Semiconductor device and method of making a semiconductor device | |
| JPH0750759B2 (en) | Semiconductor device | |
| CN1307712C (en) | Semiconductor device | |
| CN106572590A (en) | Printed circuit board, manufacturing method thereof and electronic device | |
| US20190214322A1 (en) | Power module and method of manufacturing the same | |
| JP2009147014A (en) | Resin sealed type electronic control unit and sealing molding method thereof | |
| US10879151B2 (en) | Semiconductor package with liquid metal conductors | |
| CN214254418U (en) | Power module and electronic equipment | |
| CN213599951U (en) | Novel electronic detonator externally connected with control module | |
| US20140131083A1 (en) | Printed circuit board and method for manufacturing the same | |
| KR20140076887A (en) | Semiconductor package and method of manufacturing thereof | |
| US10362692B2 (en) | Encapsulated electrical device and method of fabrication | |
| JP3260249B2 (en) | Semiconductor device mounting method and its mounting body | |
| CN219696443U (en) | Packaging structure based on dispensing technology | |
| CN209929149U (en) | A embedment capacitor assembly for thyristor converter valve | |
| CN219873163U (en) | Feedthrough capacitor | |
| CN220625546U (en) | NTC temperature sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |