CN113347779A - Embedded micro-channel printed circuit board compatible with vertical transmission structure and preparation method - Google Patents
Embedded micro-channel printed circuit board compatible with vertical transmission structure and preparation method Download PDFInfo
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- CN113347779A CN113347779A CN202110601090.XA CN202110601090A CN113347779A CN 113347779 A CN113347779 A CN 113347779A CN 202110601090 A CN202110601090 A CN 202110601090A CN 113347779 A CN113347779 A CN 113347779A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses an embedded micro-channel printed circuit board compatible with a vertical transmission structure and a preparation method thereof, wherein the embedded micro-channel printed circuit board comprises a top multilayer wiring layer, a metal core plate and a bottom multilayer wiring layer which are sequentially arranged from top to bottom, an embedded micro-channel for heat dissipation is arranged in the metal core plate, a protection perforation is arranged in a region of the metal core plate where the embedded micro-channel is not arranged, an insulation protection ring is arranged in the protection perforation, an interconnection inner hole is arranged in the insulation protection ring, and the interconnection inner hole penetrates through the top multilayer wiring layer and the bottom multilayer wiring layer to form a vertical transmission channel for transmitting signals at two sides; the interconnection and intercommunication of electric signals on the front side and the back side of the metal core micro-channel can be realized without connectors, cables, insulators and the like while realizing high-efficiency heat dissipation.
Description
Technical Field
The invention relates to the technical field of microelectronic heat dissipation, in particular to an embedded micro-channel printed circuit board compatible with a vertical transmission structure and a preparation method thereof.
Background
The printed circuit board is a general electronic system substrate and an important carrier for high-density integration of components. The traditional printed circuit board mainly comprises organic materials and copper wiring layer materials, and the application requirements of high-density integrated high-power electronic devices are difficult to meet due to the low thermal conductivity of the organic materials (generally less than 1W/m.K).
The method for constructing the micro-channel embedded printed circuit board can be realized by combining the micro-channel heat dissipation technology with the high-density integration technology of the printed circuit board, and the metal core plate with the embedded micro-channel is integrated in the printed circuit board, so that the following technical advantages are realized: (1) the heat dissipation of high heat flux density in a local area is realized by a micro-channel heat dissipation technology taking liquid as a cooling medium; (2) by integrating the micro-channel in the printed circuit board, the integration method of an external metal micro-channel cold plate is replaced, and the integration density is obviously improved. Therefore, the embedded micro-channel printed circuit board has wide application prospect in the field of high-power electronic device system integration. However, after the printed circuit board is embedded with the all-metal structure, the vertical transmission of the electrical signals on the front side and the back side of the printed circuit board is isolated, so that the design of a circuit system is difficult.
The chinese patent 202110118888.9 of the invention proposes a printed circuit board embedded with micro channels, which utilizes the enhanced heat dissipation effect of the micro-scale fluid to realize high heat flux density heat dissipation. However, the patent does not relate to the interconnection method of the electrical signals on the front side and the back side of the metal core micro flow channel. Therefore, there is a need for a micro-channel embedded printed circuit board compatible with vertical transmission structure and a method for manufacturing the same.
Disclosure of Invention
The invention aims to provide an embedded micro-channel printed circuit board compatible with a vertical transmission structure and a preparation method thereof, wherein a metal core micro-channel is embedded in the printed circuit board and the vertical transmission structure penetrating through a metal core is prepared, so that the interconnection and intercommunication of electric signals on the front side and the back side of the metal core micro-channel can be realized without connectors, cables, insulators and the like while the high-efficiency heat dissipation is realized, and the application requirement of high-density integrated high-power electronic devices is met.
The technical scheme of the invention is as follows:
the utility model provides a compatible perpendicular transmission structure's embedded microchannel printed circuit board, includes top multilayer wiring layer, metal core and bottom multilayer wiring layer that top-down arranged in proper order, the inside embedded microchannel that is used for the radiating that is provided with of metal core, the region that the metal core did not set up embedded microchannel is provided with the protection and perforates, the protection is perforated and is provided with insulating guard circle, be provided with the hole of interconnection in the insulating guard circle, the hole of interconnection runs through top multilayer wiring layer and bottom multilayer wiring layer, forms the perpendicular transmission passageway that is used for transmitting both sides signal.
The metal core plate material is copper, aluminum, molybdenum-copper alloy and the like. Preferably, the metal core plate material is copper.
The width of the embedded micro-channel is 100 mu m-3 mm. Preferably, the width of the embedded microchannel is 500 μm.
The thickness of the insulating protective ring is not less than 0.2 mm. Preferably, the thickness of the insulating protective ring is 0.3 mm.
The minimum distance between the wall of the protective perforated hole and the side wall of the embedded micro-channel is not less than 1 mm. Preferably, the minimum spacing is 2 mm. The position of the vertical transmission structure penetrating through the metal core micro-channel through reasonable layout is reserved with certain width of the side wall of the channel, so that the cooling working medium only contacts the metal structure in the embedded micro-channel printed circuit board, the structural strength of the channel is ensured, and the structural damage of the channel caused by the pressure of the cooling working medium is avoided. The welding defects of mutual communication between the flow channel and the vertical transmission structure are avoided, the cooling working medium is prevented from leaking outwards through the defects, the filled insulating material is prevented from permeating into the flow channel through the defects, and after the cooling working medium is injected into a micro-channel region, the cooling working medium is prevented from contacting with organic materials in a printed circuit board through the side wall of the flow channel to generate moisture absorption and denaturation phenomena, so that the reliability risks of layer rising, bulging, liquid leakage and the like are caused.
The top multilayer wiring layer comprises a top organic substrate layer and a top copper wiring layer arranged on the top organic substrate layer, preferably, the number of layers of the top organic substrate layer and the top copper wiring layer is n, and n is more than or equal to 10 and is more than or equal to 1.
The bottom multilayer wiring layer comprises a bottom organic substrate layer and a bottom copper wiring layer arranged on the bottom organic substrate layer, preferably, the number of layers of the bottom organic substrate layer and the bottom copper wiring layer is m, and m is more than or equal to 10 and more than or equal to 1.
The invention also provides a preparation method of the micro-channel embedded printed circuit board compatible with the vertical transmission structure, which comprises the following steps:
s1: selecting a metal core plate with embedded micro-channels;
s2: machining a protection through hole on a metal core plate embedded with a micro-channel by adopting a printed circuit board machining process;
s3: performing surface treatment on the side wall of the protection perforation;
s4: filling insulating materials in the protective through holes by adopting a hole plugging process, and carrying out surface treatment on the metal core plate;
s5: providing a top multilayer wiring layer and a bottom multilayer wiring layer, wherein the top multilayer wiring layer is prepared through a printed circuit board lamination process, and the bottom multilayer wiring layer is prepared through the printed circuit board lamination process;
s6: laminating the top multilayer wiring layer, the metal core plate embedded with the micro-channel and the bottom multilayer wiring layer into a printed circuit board embedded with the micro-channel, wherein the laminating method is a laminating process method of the printed circuit board;
s7: machining an interconnection inner hole on the printed circuit board internally embedded with the micro-channel by adopting a printed circuit board machining process and a hole metallization process, wherein the interconnection inner hole penetrates through the top multilayer wiring layer and the bottom multilayer wiring layer to form a vertical transmission channel for transmitting signals on two sides;
s8: and (3) finishing the processing of the embedded micro-channel printed circuit board compatible with the vertical transmission structure by adopting the conventional process of other printed circuit boards.
Preferably, the surface treatment process in steps S3 and S4 is blackening or browning.
Preferably, the hole plugging process in step S4 is screen printing hole plugging resin or prepreg vacuum pressing underfill.
Preferably, in step S1, the overall size of the metal core plate with embedded micro-channels is also finely controlled by using size compensation and/or micro-channel processing control. The problem of dislocation of a vertical transmission structure caused by the size expansion and contraction of the metal core micro-channel is prevented, and the damage of the channel structure caused by the small minimum distance between the wall of the protective through hole and the side wall of the channel is effectively avoided. The embedded micro-channel is prepared by a precision machining method, a chemical corrosion method, an electric spark machining method or a metal micro-electroforming method; the metal core plate is prepared by a vacuum diffusion welding method, a vacuum brazing method or a solder welding method, and after high-temperature welding, the metal core plate can expand and contract to a certain extent; it is therefore desirable to use this method to control dimensional errors.
Preferably, in step S6, measures such as size compensation and printed board processing control are further adopted to compensate for the size expansion and contraction of the organic wiring layer material after lamination, so as to perform fine control on the overall size of the top multilayer wiring layer and the bottom multilayer wiring layer. The problem of dislocation of a vertical transmission structure caused by the expansion and contraction of the material size of the organic wiring layer is prevented, and the risk of short circuit of electrical signals caused by the dislocation is effectively avoided.
Due to the adoption of the technical scheme, the invention has the beneficial effects that:
(1) the metal core micro-channel is embedded in the printed circuit board, the vertical transmission structure penetrating through the metal core is prepared, and the interconnection and intercommunication of electric signals on the front side and the back side of the metal core micro-channel can be realized without connectors, cables, insulators and the like while the efficient heat dissipation is realized.
(2) The position of the vertical transmission structure of the metal core micro-channel is penetrated through a reasonable layout, certain width of the side wall of the channel is reserved, and the cooling working medium is only contacted with the metal structure in the embedded micro-channel printed circuit board: the structural strength of the flow channel is ensured, and the structural damage of the flow channel caused by the pressure of the cooling working medium is avoided; the welding defects of mutual communication between the flow channel and the vertical transmission structure are avoided, the cooling working medium is prevented from leaking outwards through the defects, and the filled insulating material is prevented from permeating into the flow channel through the defects; the problems that in the use process of the printed circuit board, after cooling working media are injected into the micro-channel area, the cooling working media are in contact with organic materials in the printed circuit board through the side wall of the channel, moisture absorption and denaturation phenomena are generated, and therefore reliability risks such as layer rising, bulging and liquid leakage are caused are avoided.
(3) By comprehensively utilizing measures such as size compensation, fine control of a micro-channel processing technology, control of a printed board processing technology and the like, the problems of dislocation of a vertical transmission structure and the like caused by size expansion and shrinkage of materials of a metal core micro-channel and an organic wiring layer are prevented, and risks such as channel structure damage, electric signal short circuit and open circuit caused by the dislocation are effectively avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic cross-sectional view of a micro flow channel embedded metal core plate according to the present invention;
FIG. 2 is a schematic cross-sectional view of a top multilayer wiring layer of the present invention;
FIG. 3 is a cross-sectional schematic view of a bottom multilayer wiring layer of the present invention;
FIG. 4 is a schematic cross-sectional view of a vertical transport structure of the present invention;
FIG. 5 is a schematic top view of a vertical transport structure of the present invention;
FIG. 6 is a schematic cross-sectional view of an embedded micro-channel PCB compatible with vertical transmission structures according to the present invention;
FIG. 7 is a process flow diagram of a method of making the present invention.
Description of specific element symbols: 1 a metal core plate; 2 embedding a micro-channel; 3 a top multi-layer wiring layer; 4 a top organic substrate layer; 5 a top copper wiring layer; 6 a bottom multilayer wiring layer; 7 a bottom organic substrate layer; 8 a bottom copper wiring layer; 9 vertical transmission structure; 10 protecting the perforation; 11 interconnecting the inner bores; 12 insulating protective rings; 13 an embedded micro-channel printed circuit board compatible with a vertical transmission structure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Referring to fig. 1 to 7, an embedded micro channel printed circuit board 13 compatible with a vertical transmission structure according to the present embodiment includes a top multilayer wiring layer 3, a metal core board 1 and a bottom multilayer wiring layer 6, which are sequentially arranged from top to bottom, wherein the embedded micro channel 2 for heat dissipation is disposed inside the metal core board 1, a protection through hole 10 is disposed in a region of the metal core board 1 where the embedded micro channel 2 is not disposed, an insulating protection ring 12 is disposed in the protection through hole 10, an interconnection inner hole 11 is disposed in the insulating protection ring 12, and the interconnection inner hole 11 penetrates through the top multilayer wiring layer 3 and the bottom multilayer wiring layer 6 to form a vertical transmission channel for transmitting signals on two sides.
The metal core plate 1 embedded with the micro-flow channels 2 is made of copper. The width of the embedded micro flow channel 2 is 500 μm. The distance between the protective perforation 10 and the wall of the interconnecting bore 11, i.e. the thickness of the insulating protective ring 12, is 0.3 mm. The minimum distance between the hole wall of the protection perforation 10 and the side wall of the embedded micro-flow channel 2 is 2 mm. The structure strength of the flow channel is ensured, and meanwhile, the phenomenon that the flow channel and the vertical transmission structure are communicated with each other and welding defects are avoided. The metal core plate 1 top multilayer wiring layer 3 comprises a top organic substrate layer 4 and a top copper wiring layer 5, and the number of layers of the top organic substrate layer 4 and the top copper wiring layer 5 is 2. The metal core plate 1 bottom multilayer wiring layer 6 comprises a bottom organic substrate layer 7 and a bottom copper wiring layer 8, and the number of layers of the bottom organic substrate layer 7 and the bottom copper wiring layer 8 is 2.
The preparation method of this embodiment comprises the following steps:
step (1): the micro-channel is prepared by a precision machining method, and the copper core plate embedded with the micro-channel 2 is obtained by a vacuum diffusion welding method. After high temperature welding, the metal core plate 1 will have a certain degree of size expansion and contraction, so the overall size of the metal core plate 1 embedded with the micro flow channels 2 needs to be finely controlled by means of size compensation, micro flow channel processing technology control and the like. The problem of dislocation of a vertical transmission structure caused by the size expansion and contraction of the metal core micro-channel is prevented, and the damage of the channel structure caused by the small minimum distance between the hole wall of the protection perforation 10 and the side wall of the channel is effectively avoided.
Step (2): a printed circuit board machining process is adopted, and a protective through hole 10 is machined in a metal core plate 1 embedded with a micro-channel 2.
And (3): and (3) performing surface blackening treatment on the side wall of the protective through hole 10 in the step (2).
And (4): and (5) filling an insulating material into the protective through hole 10 subjected to surface treatment in the step (3) by adopting a screen printing hole plugging resin process: and (4) carrying out surface blackening treatment on the metal core plate 1 embedded with the micro flow channel 2 after the treatment of the step (4).
And (6): the top multilayer wiring layer 3 is prepared using a printed circuit board lamination process.
And (7): the bottom multilayer wiring layer 6 is prepared by a printed circuit board lamination process.
And (8): and laminating the multilayer wiring layers 3 on the top of the metal core plate 1, the metal core plate 1 embedded with the micro-channels 2 and the multilayer wiring layers 6 on the bottom of the metal core plate 1 into the printed circuit board embedded with the micro-channels 2 by adopting a printed circuit board laminating process method. After lamination, the organic wiring layer material may have a certain degree of dimensional expansion and contraction, and therefore, the overall dimensions of the top multilayer wiring layer 3 and the bottom multilayer wiring layer 6 need to be finely controlled by using means such as dimensional compensation and printed board processing control. The problem of dislocation of a vertical transmission structure caused by the expansion and contraction of the material size of the organic wiring layer is prevented, and the risk of short circuit of electrical signals caused by the dislocation is effectively avoided.
And (9): and (3) machining an interconnection inner hole 11 on the printed circuit board embedded with the micro-channel 2 in the step (8) by adopting a printed circuit board machining process and a hole metallization process to realize a vertical transmission structure 9 penetrating through the metal core of the micro-channel.
Step (10): and the processing of the embedded micro-channel printed circuit board 13 compatible with the vertical transmission structure is completed by adopting the conventional process of other printed circuit boards.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a compatible perpendicular transmission structure's embedded microchannel printed circuit board, its characterized in that, includes top multilayer wiring layer, metal core and bottom multilayer wiring layer that top-down arranged in proper order, the inside embedded microchannel that is used for the radiating that is provided with of metal core, the region that the metal core did not set up embedded microchannel is provided with the protection and perforates, the protection is perforated and is provided with insulating guard circle, be provided with the hole of interconnection in the insulating guard circle, the hole of interconnection runs through top multilayer wiring layer and bottom multilayer wiring layer, forms the perpendicular transmission channel who is used for transmitting both sides signal.
2. The micro flow channel embedded printed circuit board compatible with vertical transmission structure of claim 1, wherein the metal core plate material is copper, aluminum, molybdenum-copper alloy, etc.
3. The micro flow channel-embedded printed circuit board compatible with vertical transmission structure of claim 1, wherein the width of the embedded micro flow channel is 100 μm to 3 mm.
4. The micro flow channel embedded printed circuit board compatible with vertical transmission structure as claimed in claim 1, wherein the thickness of the insulating protective ring is not less than 0.2 mm.
5. The micro flow channel-embedded printed circuit board compatible with vertical transmission structure of claim 1, wherein the minimum distance between the wall of the protection through hole and the side wall of the embedded micro flow channel is not less than 1 mm.
6. The micro-channel embedded printed circuit board compatible with the vertical transmission structure as claimed in claim 1, wherein the top multi-layer wiring layer comprises a top organic substrate layer and a top copper wiring layer arranged on the top organic substrate layer, the number of layers of the top organic substrate layer and the top copper wiring layer is n, and n is greater than or equal to 10 and greater than or equal to 1.
7. The micro-channel embedded printed circuit board compatible with the vertical transmission structure as claimed in claim 1, wherein the bottom multi-layer wiring layer comprises a bottom organic substrate layer and a bottom copper wiring layer arranged on the bottom organic substrate layer, the number of layers of the bottom organic substrate layer and the bottom copper wiring layer is m, and 10 m is larger than or equal to 1.
8. A method for preparing a micro-channel embedded printed circuit board compatible with a vertical transmission structure, which is characterized by comprising the circuit board of any one of claims 1 to 7, and further comprising the following steps:
s1: selecting a metal core plate with embedded micro-channels;
s2: machining a protection through hole on a metal core plate embedded with a micro-channel by adopting a printed circuit board machining process;
s3: performing surface treatment on the side wall of the protection perforation;
s4: filling insulating materials in the protective through holes by adopting a hole plugging process, and carrying out surface treatment on the metal core plate;
s5: providing a top multilayer wiring layer and a bottom multilayer wiring layer;
s6: laminating the top multilayer wiring layer, the metal core plate with the embedded micro-channel and the bottom multilayer wiring layer into a printed circuit board with the embedded micro-channel;
s7: and machining an interconnection inner hole on the printed circuit board internally embedded with the micro-channel by adopting a printed circuit board machining process and a hole metallization process, wherein the interconnection inner hole penetrates through the top multilayer wiring layer and the bottom multilayer wiring layer to form a vertical transmission channel for transmitting signals on two sides.
S8: and (3) finishing the processing of the embedded micro-channel printed circuit board compatible with the vertical transmission structure by adopting the conventional process of other printed circuit boards.
9. The method for preparing a micro fluidic channel embedded PCB compatible with vertical transmission structure as claimed in claim 8, wherein the surface treatment process in steps S3 and S4 is blackening or browning.
10. The method for preparing the micro flow channel embedded printed circuit board compatible with the vertical transmission structure as claimed in claim 8, wherein the hole plugging process in step S4 is screen printing hole plugging resin or prepreg vacuum pressing glue filling.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110601090.XA CN113347779B (en) | 2021-05-31 | 2021-05-31 | Method for preparing micro-channel embedded printed circuit board compatible with vertical transmission structure |
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| CN202110601090.XA CN113347779B (en) | 2021-05-31 | 2021-05-31 | Method for preparing micro-channel embedded printed circuit board compatible with vertical transmission structure |
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| CN113347779B CN113347779B (en) | 2022-06-28 |
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Cited By (1)
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| CN113891546A (en) * | 2021-11-02 | 2022-01-04 | 中国电子科技集团公司第二十九研究所 | Printed circuit board embedded with reinforced structure micro-channel and preparation method thereof |
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| CN113891546B (en) * | 2021-11-02 | 2023-05-16 | 中国电子科技集团公司第二十九研究所 | Printed circuit board embedded with micro-channels with reinforced structures and preparation method thereof |
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| CN113347779B (en) | 2022-06-28 |
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