CN113337248A - Composite wave-absorbing material and preparation method thereof - Google Patents
Composite wave-absorbing material and preparation method thereof Download PDFInfo
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- CN113337248A CN113337248A CN202110609852.0A CN202110609852A CN113337248A CN 113337248 A CN113337248 A CN 113337248A CN 202110609852 A CN202110609852 A CN 202110609852A CN 113337248 A CN113337248 A CN 113337248A
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- 238000007731 hot pressing Methods 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims description 64
- 239000002184 metal Substances 0.000 claims description 64
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- 238000000576 coating method Methods 0.000 claims description 44
- 239000002518 antifoaming agent Substances 0.000 claims description 29
- 239000003795 chemical substances by application Substances 0.000 claims description 29
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- 239000000080 wetting agent Substances 0.000 claims description 29
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- ARHKYYXTHCPOLC-UHFFFAOYSA-N dialuminum;oxygen(2-);dihydrate Chemical compound O.O.[O-2].[O-2].[O-2].[Al+3].[Al+3] ARHKYYXTHCPOLC-UHFFFAOYSA-N 0.000 claims description 2
- 239000003759 ester based solvent Substances 0.000 claims description 2
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- 229910001512 metal fluoride Inorganic materials 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
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- 150000004767 nitrides Chemical class 0.000 claims description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 2
- 229910052755 nonmetal Inorganic materials 0.000 claims description 2
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 claims description 2
- 229910021332 silicide Inorganic materials 0.000 claims description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 claims description 2
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
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Images
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
Abstract
The invention provides a composite wave-absorbing material and a preparation method thereof. Aiming at the problems of insufficient magnetic conductivity, poor heat dissipation performance, non-wear-resistant surface and the like of the existing wave absorbing plate, the wave absorbing plate designed by the invention is formed by carrying out hot-pressing treatment on an insulating structure, a shielding structure and a wave absorbing structure, wherein the insulating structure provides a protection effect and high sheet resistance performance, the shielding structure provides electromagnetic shielding performance, and the wave absorbing structure provides wave absorbing performance. The wave absorbing plate prepared by the invention has high magnetic conductivity, good heat dissipation performance and strong surface wear resistance.
Description
Technical Field
The invention relates to the field of microwave absorbing materials, in particular to a composite wave absorbing material and a preparation method thereof.
Background
With the rapid development of modern information technology, the pollution of electromagnetic radiation is becoming more serious, and microwave absorbing materials are materials having the function of absorbing incident electromagnetic waves and attenuating the incident electromagnetic waves, and can protect human bodies and equipment from the harm of the electromagnetic waves. The manufacturing and design processes of microwave absorbing materials are also continuously improved, and novel wave absorbing materials are developing towards the direction of thin thickness, high magnetic conductivity and good heat dissipation performance.
The performance of the wave-absorbing material is related to the impedance of the material, the magnetic conductivity is an important factor influencing the impedance, and the absorption and attenuation of electromagnetic waves can be greatly increased by improving the magnetic conductivity of the wave-absorbing material to match the impedance of the wave-absorbing material with the impedance of a free space. In the material design, the degree of freedom of the multilayer wave-absorbing composite material is higher than that of the single-layer wave-absorbing material, and the requirements of high wave-absorbing efficiency and high heat dissipation performance are better met. At present, the performance of the existing wave-absorbing materials of the same type in the market reaches the bottleneck, the magnetic conductivity is only about 70%, the heat dissipation is not good, and the wave-absorbing materials cannot be applied to high-end products. In order to solve the problem, the invention provides a multilayer composite wave-absorbing material which not only has high magnetic conductivity, but also has high heat dissipation performance and surface wear resistance.
Disclosure of Invention
Therefore, the invention provides a composite wave-absorbing material, which comprises 3 functional structures: the wave absorption structure comprises an insulation structure, a shielding structure and a wave absorption structure in sequence, wherein the shielding structure is provided with a bulge on a contact surface with the insulation structure.
Furthermore, the insulation structure is composed of 2 insulation layers, and can be divided into a high-hardness insulation layer and a tough insulation layer according to different contents of high-insulation fillers in the material; the wave absorbing structure consists of 2 wave absorbing layers, and can be divided into a first wave absorbing layer and a second wave absorbing layer according to different contents of magnetic fillers in materials; the shielding structure is composed of a single metal layer.
Furthermore, the composite wave-absorbing material is composed of a high-hardness insulating layer, a tough insulating layer, a metal layer, a first wave-absorbing layer and a second wave-absorbing layer in sequence, wherein the metal layer is provided with conical bulges arranged on the contact surface of the metal layer and the tough insulating layer.
The invention provides a preparation method of a composite wave-absorbing material, which comprises the following steps:
s10: preparing a high-hardness insulating layer, namely uniformly mixing reagents including a high-insulation filler, resin, a cross-linking agent, a coupling agent, a defoaming agent, a wetting agent, a flatting agent and a solvent, filtering, coating the mixture on a PET release film and drying the PET release film;
s20: preparing a tough insulating layer, namely uniformly mixing reagents including a high-insulation filler, resin, a cross-linking agent, a coupling agent, a defoaming agent, a wetting agent, a flatting agent and a solvent, filtering, coating the mixture on the high-hardness insulating layer, drying the high-hardness insulating layer, and marking a groove on the surface of the high-hardness insulating layer opposite to the surface;
s30: preparing a metal layer, namely sputtering or evaporating a metal material to the groove surface of the tough insulating layer by using a metal sputtering or evaporation process;
s40: preparing a first wave absorption layer, namely uniformly mixing reagents including a magnetic filler, resin, a cross-linking agent, a coupling agent, a defoaming agent, a wetting agent, a flatting agent and a solvent, filtering, coating the mixture on a metal layer and drying the metal layer;
s50: preparing a second wave-absorbing layer, namely uniformly mixing reagents including a magnetic filler, resin, a cross-linking agent, a coupling agent, a defoaming agent, a wetting agent, a flatting agent and a solvent, filtering, coating the mixture on the first wave-absorbing layer and drying the mixture;
s60: and carrying out hot-pressing treatment on the sequentially coated structures to obtain a finished product.
Further, the high-insulation filler comprises at least one of alumina, aluminum oxide monohydrate, aluminum oxide dihydrate, ferric oxide, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, insulating carbon black, fumed silica, crystalline silica and glass microspheres, and preferably aluminum nitride and fumed silica.
Further, the magnetic filler includes at least one of ferrite, metal, and a compound of metal and nonmetal.
Further, the resin comprises at least one of polyurethane resin, acrylic resin, epoxy resin, phenolic resin, olefin rubber, alkane rubber, acrylic modified polyurethane resin and epoxy modified polyurethane resin, preferably acrylic modified polyurethane resin, preferably resin with molecular weight of 8000-100000, preferably resin with hardness of 40-96A.
Further, the solvent includes at least one of benzene solvents, ester solvents, ketone solvents, alkane solvents, nitrogen-containing solvents and ether solvents, and preferably ketone solvents and alkane solvents.
Further, the metal material includes at least one of a simple metal, a metal alloy, a metal oxide, a metal fluoride, a metal carbide, a metal silicide, a metal nitride, a metal sulfide, a metal boride, a metal telluride, and a metal antimonide.
Further, the hot pressing treatment is carried out under the conditions that the hot pressing pressure is 3-16 MPa, the hot pressing temperature is 130-200 ℃, and the hot pressing pressure is preferably 5MPa, 6MPa, 8MPa, 10MPa, 12MPa or 14 MPa.
Further, the imprint is preferably an imprint of a conical groove having a height of 2 μm and a bottom diameter of 3 μm, with a groove pitch of 2 μm.
Further, the thickness of the metal layer after sputtering or evaporation in the step S30 is controlled to be 150 nm.
Further, the coating in the steps S10, S20, S40 and S50 is coating using a coater, and the thickness of the dried film after drying is controlled to be 5 μm.
In summary, the above embodiments of the present application may have one or more of the following advantages or benefits:
1. the composite wave-absorbing material has a multi-layer composite structure, a high-hardness insulating layer has high hardness and high surface resistance, a tough insulating layer has certain hardness and excellent flexibility, and the insulating structure provides a protective wear-resistant effect and high surface resistance performance; the metal layer provides electromagnetic shielding performance; the first wave-absorbing layer provides main wave-absorbing performance, and the magnetic conductivity is higher than that of the second wave-absorbing layer.
2. The composite wave-absorbing material absorbs electromagnetic waves through the wave-absorbing structure, and the shielding structure reflects and absorbs the electromagnetic waves which cannot be absorbed by the wave-absorbing structure, so that the effect of secondary absorption is achieved, and the composite wave-absorbing material has good wave-absorbing performance.
3. The composite wave-absorbing material provided by the invention is prepared by changing the proportion of the high-insulation filler, the magnetic filler, the resin, the cross-linking agent, the coupling agent, the defoaming agent, the wetting agent, the flatting agent and the solvent.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural view of the composite wave-absorbing material in embodiment 1.
Fig. 2 is a relative permeability spectrum of sample 1.
Fig. 3 is a relative permeability spectrum of sample 2.
Fig. 4 is a relative permeability spectrum of sample 3.
FIG. 5 is a graph showing the relative permeability of comparative example.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
[ example 1 ]
preparing a high-hardness insulating layer: uniformly mixing 60 parts of acrylic resin (with the molecular weight of 50000 and the hardness of 85A), 75 parts of aluminum oxide monohydrate, 18 parts of a cross-linking agent, 0.8 part of a coupling agent, 2 parts of a defoaming agent, 3 parts of a wetting agent, 3 parts of a leveling agent and 272 parts of ethyl acetate, filtering by using a 400-mesh screen, coating the mixture on a PET release film (with the release force of 20 grams and the thickness of 50 mu m) by using a coating machine, drying, and controlling the thickness of a dry film to be 5 mu m to prepare a semi-finished product 1;
preparing a tough insulating layer: 86 parts of polyurethane resin (with the molecular weight of 50000 and the hardness of 78A), 19 parts of gallium nitride, 28 parts of a cross-linking agent, 1 part of a coupling agent, 1 part of a defoaming agent, 2 parts of a wetting agent, 0.5 part of a leveling agent and 196 parts of methyl isobutyl ketone are uniformly mixed, filtered by using a 400-mesh screen, coated on a high-hardness insulating layer surface of a semi-finished product 1 by using a coating machine and dried, the thickness of a dry film is controlled to be 5 mu m, and then conical grooves with the height of 2 mu m and the bottom diameter of 3 mu m are micro-embossed and printed, and the distance between the grooves is 2 mu m, so that a semi-finished product 2 is prepared;
preparing a metal layer: sputtering or evaporating conductive metal to the tough insulating layer surface of the semi-finished product 2 by adopting a metal nickel sputtering or evaporation process, controlling the thickness of the metal layer to be 150nm, and filling the conical groove with the metal to prepare a semi-finished product 3;
preparing a first wave absorption layer: uniformly mixing 36 parts of epoxy resin (molecular weight 8000, hardness 47A), 165 parts of ferrite powder, 0.8 part of cross-linking agent, 0.8 part of coupling agent, 1.2 parts of defoaming agent, 2.0 parts of wetting agent, 2.0 parts of flatting agent and 225 parts of ethylene glycol monoethyl ether, filtering by using a 80-mesh screen, coating on the metal layer surface of the semi-finished product 3 by using a coating machine, drying, and controlling the thickness of a dry film to be 5 mu m to prepare a semi-finished product 4;
preparing a second wave-absorbing layer: 41 parts of polyurethane resin (with the molecular weight of 20000 and the hardness of 48A), 220 parts of ferrosilicon aluminum powder, 1 part of cross-linking agent, 2 parts of coupling agent, 0.part of defoaming agent, 0.8 part of wetting agent, 0.8 part of flatting agent and 240 parts of DMF (dimethyl formamide), uniformly mixing, filtering by using a 80-mesh screen, coating on a first wave absorption layer surface of a semi-finished product 4 by using a coating machine, drying, and controlling the thickness of a dry film to be 5 mu m to prepare a semi-finished product 5;
and then carrying out hot pressing treatment on the semi-finished product 5 at the hot pressing pressure of 6MPa and the hot pressing temperature of 170 ℃, and finally cutting edges and winding to obtain a finished product.
The material structure of the finished product is schematically shown in figure 1: 1-high hardness insulating layer, 2-toughness insulating layer, 3-metal layer, 4-first wave-absorbing layer and 5-second wave-absorbing layer.
[ example 2 ]
Sample 2 was prepared as follows:
preparing a high-hardness insulating layer: 85 parts of acrylic resin (with the molecular weight of 66000 and the hardness of 88A), 45 parts of insulating carbon black, 9 parts of a cross-linking agent, 1 part of a coupling agent, 1 part of a defoaming agent, 2 parts of a wetting agent, 2 parts of a leveling agent and 302 parts of a solvent are uniformly mixed, filtered by using a 400-mesh screen, coated on a PET release film (with the release force of 20 grams and the thickness of 50 microns) by using a coating machine, dried, and the thickness of a dry film is controlled to be 5 microns to prepare a semi-finished product 1;
preparing a tough insulating layer: uniformly mixing 70 parts of acrylic acid modified polyurethane resin (with the molecular weight of 78000 and the hardness of 96A), 7 parts of glass microspheres, 35 parts of magnesium oxide cross-linking agent of 30 parts, 0.8 part of coupling agent, 0.9 part of defoaming agent, 2 parts of wetting agent, 1.5 parts of flatting agent and 210 parts of solvent, filtering by using a 400-mesh screen, coating on a high-hardness insulating layer surface of a semi-finished product 1 by using a coating machine, drying, controlling the thickness of a dry film to be 5 mu m, and then carrying out micro-embossing on conical grooves with the height of 2 mu m and the bottom diameter of 3 mu m and the groove spacing of 2 mu m to prepare a semi-finished product 2;
preparing a metal layer: sputtering or evaporating conductive metal to the tough insulating layer surface of the semi-finished product 2 by adopting a copper-silver alloy sputtering or evaporation process, controlling the thickness of the metal layer to be 150nm, and filling the conical groove with the metal to prepare a semi-finished product 3;
preparing a first wave absorption layer: uniformly mixing 18 parts of alkane rubber (molecular weight of 60000 and hardness of 80A), 18 parts of acrylic resin (molecular weight of 81000 and hardness of 62A), 145 parts of neodymium-iron-boron powder, 3 parts of cross-linking agent, 1 part of coupling agent, 2 parts of defoaming agent, 0.5 part of wetting agent, 0.5 part of flatting agent and 218 parts of solvent, filtering by using a 80-mesh screen, coating on the metal layer surface of the semi-finished product 3 by using a coating machine, drying, and controlling the thickness of a dry film to be 5 mu m to prepare a semi-finished product 4;
preparing a second wave-absorbing layer: uniformly mixing 48 parts of phenolic resin (with the molecular weight of 78000 and the hardness of 92A), 215 parts of ferrosilicon aluminum powder, 1 part of a cross-linking agent, 1 part of a coupling agent, 1 part of a defoaming agent, 1 part of a wetting agent, 0.5 part of a flatting agent and 180 parts of a solvent, filtering by using a 80-mesh screen, coating on a first wave absorption layer surface of a semi-finished product 4 by using a coating machine, drying, and controlling the thickness of a dry film to be 5 mu m to prepare a semi-finished product 5;
and then carrying out hot pressing treatment on the semi-finished product 5 at the hot pressing pressure of 5MPa and the hot pressing temperature of 160 ℃, and finally cutting edges and winding to obtain a finished product.
[ example 3 ]
preparing a high-hardness insulating layer: uniformly mixing 40 parts of olefin rubber (molecular weight of 55000 and hardness of 85A), 13 parts of polyurethane resin (molecular weight of 42000 and hardness of 72A), 83 parts of aluminum nitride, 14 parts of cross-linking agent, 3 parts of coupling agent, 2 parts of defoaming agent, 2 parts of wetting agent, 2 parts of flatting agent and 271 parts of solvent, filtering by using a 400-mesh screen, coating on a PET (polyethylene terephthalate) release film (the release force is 20 grams and the thickness is 50 mu m) by using a coating machine, drying, and controlling the thickness of a dry film to be 5 mu m to prepare a semi-finished product 1;
preparing a tough insulating layer: 97 parts of epoxy resin (molecular weight 8000, hardness 86A), 25 parts of magnesium oxide, 26 parts of cross-linking agent, 4 parts of coupling agent, 5 parts of defoaming agent, 3 parts of wetting agent, 2 parts of flatting agent and 202 parts of the epoxy resin are uniformly mixed, filtered by using a 400-mesh screen, coated on the high-hardness insulating layer surface of the semi-finished product 1 by adopting a coating machine and dried, the thickness of a dry film is controlled to be 5 mu m, then conical grooves with the height of 2 mu m and the bottom diameter of 3 mu m are micro-embossed, and the distance between the grooves is 2 mu m, so that a semi-finished product 2 is prepared;
preparing a metal layer: sputtering or evaporating conductive metal to the tough insulating layer surface of the semi-finished product 2 by adopting an iron nitride sputtering or evaporation process, controlling the thickness of the metal layer to be 150nm, and filling the conical groove with the metal to prepare a semi-finished product 3;
preparing a first wave absorption layer: uniformly mixing 30 parts of olefin rubber (with the molecular weight of 78000 and the hardness of 92A), 160 parts of iron-silicon-aluminum powder, 25 parts of ferrite soft magnetic powder, 3 parts of a cross-linking agent, 4 parts of a coupling agent, 0.8 part of a defoaming agent, 1 part of a wetting agent, 1 part of a flatting agent and 188 parts of a solvent, filtering by using an 80-mesh screen, coating on the metal layer surface of a semi-finished product 3 by using a coating machine, drying, and controlling the thickness of a dry film to be 5 mu m to prepare a semi-finished product 4;
preparing a second wave-absorbing layer: 50 parts of acrylic modified polyurethane (with the molecular weight of 71000 and the hardness of 55A), 50 parts of phenolic resin (with the molecular weight of 10000 and the hardness of 90A), 193 parts of ferrite soft magnetic powder, 2 parts of a cross-linking agent, 1 part of a coupling agent, 4 parts of a defoaming agent, 1 part of a wetting agent, 1 part of a leveling agent, 199 parts of cyclohexanone and 50 parts of propanol are uniformly mixed, filtered by using a 80-mesh screen, coated on a first wave absorption layer surface of a semi-finished product 4 by using a coating machine and dried, and the thickness of a dry film is controlled to be 5 mu m to prepare a semi-finished product 5;
and then carrying out hot pressing treatment on the semi-finished product 5 at the hot pressing pressure of 8MPa and the hot pressing temperature of 175 ℃, cutting edges and rolling to obtain a finished product.
[ example 4 ]
The preparation method comprises the following steps:
preparing a high-hardness insulating layer: uniformly mixing 60 parts of acrylic resin (with the molecular weight of 50000 and the hardness of 85A), 75 parts of aluminum oxide monohydrate, 18 parts of a cross-linking agent, 0.8 part of a coupling agent, 2 parts of a defoaming agent, 3 parts of a wetting agent, 3 parts of a leveling agent and 272 parts of ethyl acetate, filtering by using a 400-mesh screen, coating the mixture on a PET release film (with the release force of 20 grams and the thickness of 50 mu m) by using a coating machine, drying, and controlling the thickness of a dry film to be 5 mu m to prepare a semi-finished product 1;
preparing a tough insulating layer: 86 parts of polyurethane resin (with the molecular weight of 50000 and the hardness of 78A), 19 parts of gallium nitride, 28 parts of a cross-linking agent, 1 part of a coupling agent, 1 part of a defoaming agent, 2 parts of a wetting agent, 0.5 part of a leveling agent and 196 parts of methyl isobutyl ketone are uniformly mixed, filtered by using a 400-mesh screen, coated on a high-hardness insulating layer surface of a semi-finished product 1 by using a coating machine and dried, the thickness of a dry film is controlled to be 5 mu m, and then conical grooves with the height of 2 mu m and the bottom diameter of 3 mu m are micro-embossed and printed, and the distance between the grooves is 2 mu m, so that a semi-finished product 2 is prepared;
preparing a metal layer: sputtering or evaporating conductive metal to the tough insulating layer surface of the semi-finished product 2 by adopting a metal nickel sputtering or evaporation process, controlling the thickness of the metal layer to be 150nm, and filling the conical groove with the metal to prepare a semi-finished product 3;
preparing a first wave absorption layer: uniformly mixing 36 parts of epoxy resin (molecular weight 8000, hardness 47A), 165 parts of ferrite powder, 0.8 part of cross-linking agent, 0.8 part of coupling agent, 1.2 parts of defoaming agent, 2.0 parts of wetting agent, 2.0 parts of flatting agent and 225 parts of ethylene glycol monoethyl ether, filtering by using a 80-mesh screen, coating on the metal layer surface of the semi-finished product 3 by using a coating machine, drying, and controlling the thickness of a dry film to be 5 mu m to prepare a semi-finished product 4;
preparing a second wave-absorbing layer: 41 parts of polyurethane resin (with the molecular weight of 20000 and the hardness of 48A), 220 parts of ferrosilicon aluminum powder, 1 part of cross-linking agent, 2 parts of coupling agent, 0.part of defoaming agent, 0.8 part of wetting agent, 0.8 part of flatting agent and 240 parts of DMF (dimethyl formamide), uniformly mixing, filtering by using a 80-mesh screen, coating on a first wave absorption layer surface of a semi-finished product 4 by using a coating machine, drying, and controlling the thickness of a dry film to be 5 mu m to prepare a semi-finished product 5;
and then carrying out hot pressing treatment on the semi-finished product 5 at the hot pressing pressure of 3MPa and the hot pressing temperature of 130 ℃, and finally cutting edges and winding to obtain a finished product.
[ example 5 ]
The preparation method comprises the following steps:
preparing a high-hardness insulating layer: uniformly mixing 60 parts of acrylic resin (with the molecular weight of 50000 and the hardness of 85A), 75 parts of aluminum oxide monohydrate, 18 parts of a cross-linking agent, 0.8 part of a coupling agent, 2 parts of a defoaming agent, 3 parts of a wetting agent, 3 parts of a leveling agent and 272 parts of ethyl acetate, filtering by using a 400-mesh screen, coating the mixture on a PET release film (with the release force of 20 grams and the thickness of 50 mu m) by using a coating machine, drying, and controlling the thickness of a dry film to be 5 mu m to prepare a semi-finished product 1;
preparing a tough insulating layer: 86 parts of polyurethane resin (with the molecular weight of 50000 and the hardness of 78A), 19 parts of gallium nitride, 28 parts of a cross-linking agent, 1 part of a coupling agent, 1 part of a defoaming agent, 2 parts of a wetting agent, 0.5 part of a leveling agent and 196 parts of methyl isobutyl ketone are uniformly mixed, filtered by using a 400-mesh screen, coated on a high-hardness insulating layer surface of a semi-finished product 1 by using a coating machine and dried, the thickness of a dry film is controlled to be 5 mu m, and then conical grooves with the height of 2 mu m and the bottom diameter of 3 mu m are micro-embossed and printed, and the distance between the grooves is 2 mu m, so that a semi-finished product 2 is prepared;
preparing a metal layer: sputtering or evaporating conductive metal to the tough insulating layer surface of the semi-finished product 2 by adopting a metal nickel sputtering or evaporation process, controlling the thickness of the metal layer to be 150nm, and filling the conical groove with the metal to prepare a semi-finished product 3;
preparing a first wave absorption layer: uniformly mixing 36 parts of epoxy resin (molecular weight 8000, hardness 47A), 165 parts of ferrite powder, 0.8 part of cross-linking agent, 0.8 part of coupling agent, 1.2 parts of defoaming agent, 2.0 parts of wetting agent, 2.0 parts of flatting agent and 225 parts of ethylene glycol monoethyl ether, filtering by using a 80-mesh screen, coating on the metal layer surface of the semi-finished product 3 by using a coating machine, drying, and controlling the thickness of a dry film to be 5 mu m to prepare a semi-finished product 4;
preparing a second wave-absorbing layer: 41 parts of polyurethane resin (with the molecular weight of 20000 and the hardness of 48A), 220 parts of ferrosilicon aluminum powder, 1 part of cross-linking agent, 2 parts of coupling agent, 0.part of defoaming agent, 0.8 part of wetting agent, 0.8 part of flatting agent and 240 parts of DMF (dimethyl formamide), uniformly mixing, filtering by using a 80-mesh screen, coating on a first wave absorption layer surface of a semi-finished product 4 by using a coating machine, drying, and controlling the thickness of a dry film to be 5 mu m to prepare a semi-finished product 5;
and then carrying out hot pressing treatment on the semi-finished product 5 at the hot pressing pressure of 16MPa and the hot pressing temperature of 200 ℃, and finally cutting edges and winding to obtain a finished product.
[ example 6 ]
Respectively randomly sampling a sample 1, a sample 2, a sample 3 and a comparative example, and simultaneously detecting, wherein the comparative example is a wave-absorbing material circulated in the market, and the detection items and the detection method are as follows:
(1) and (3) appearance detection: the test was carried out as specified in clause 6.1 of GB/T32596-2016. The wave-absorbing material has the advantages of smooth appearance surface, uniform color distribution, no bubbles, cracks, holes, deformation, corrosion, obvious impurities, processing damage, no powder falling, no layering, no scratch and other obvious apparent defects.
(2) The density detection method comprises the following steps: the test was carried out as specified in clause 6.5 of GB/T32596-2016.
(3) The thickness detection method comprises the following steps: the test was carried out as specified in clause 6.5 of GB/T32596-2016.
(4) The relative magnetic permeability detection method comprises the following steps: the test is carried out according to the specification of 6.2 of GB/T32596-2016, and the numerical value at 3MHz is taken, the inner diameter of the sample holder is 6mm, the outer diameter is 19mm, and the height is kept between 0.2mm and 0.7 mm.
(5) The surface resistance detection method comprises the following steps: the test was carried out as specified in clause 6.5 of GB/T32596-2016.
(6) The heat conductivity coefficient detection method comprises the following steps: detection was performed as specified in DB 32/T3596-.
(7) The wear-resisting times detection method comprises the following steps: the detection is carried out according to the specification of 3.3 of HG/T4303-.
Specific detection results are shown in the following table, and the relative permeability spectra of samples 1, 2 and 3 and the comparative example are shown in fig. 2, fig. 3, fig. 4 and fig. 5.
From the above experimental data, it can be seen that the properties of examples 1, 2 and 3 are superior to those of the comparative examples.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A composite wave-absorbing material is characterized by comprising 3 functional structures: the wave absorption structure comprises an insulation structure, a shielding structure and a wave absorption structure in sequence, wherein the shielding structure is provided with a bulge on a contact surface with the insulation structure.
2. The composite wave-absorbing material according to claim 1, wherein the insulating structure is composed of 2 insulating layers, and is divided into a high-hardness insulating layer and a tough insulating layer according to the content of high-insulation filler in the material; the wave absorbing structure consists of 2 wave absorbing layers, and can be divided into a first wave absorbing layer and a second wave absorbing layer according to different contents of magnetic fillers in materials; the shielding structure is composed of a single metal layer.
3. The composite wave-absorbing material of claim 2, which consists of a high-hardness insulating layer, a tough insulating layer, a metal layer, a first wave-absorbing layer and a second wave-absorbing layer in sequence, wherein the metal layer has conical protrusions arranged on the contact surface of the metal layer and the tough insulating layer.
4. A preparation method of a composite wave-absorbing material is characterized by comprising the following steps:
s10: preparing a high-hardness insulating layer, namely uniformly mixing reagents including a high-insulation filler, resin, a cross-linking agent, a coupling agent, a defoaming agent, a wetting agent, a flatting agent and a solvent, filtering, coating the mixture on a PET release film and drying the PET release film;
s20: preparing a tough insulating layer, namely uniformly mixing reagents including a high-insulation filler, resin, a cross-linking agent, a coupling agent, a defoaming agent, a wetting agent, a flatting agent and a solvent, filtering, coating the mixture on the high-hardness insulating layer, drying the high-hardness insulating layer, and marking a groove on the surface of the high-hardness insulating layer opposite to the surface;
s30: preparing a metal layer, namely sputtering or evaporating a metal material to the groove surface of the tough insulating layer by using a metal sputtering or evaporation process;
s40: preparing a first wave absorption layer, namely uniformly mixing reagents including a magnetic filler, resin, a cross-linking agent, a coupling agent, a defoaming agent, a wetting agent, a flatting agent and a solvent, filtering, coating the mixture on a metal layer and drying the metal layer;
s50: preparing a second wave-absorbing layer, namely uniformly mixing reagents including a magnetic filler, resin, a cross-linking agent, a coupling agent, a defoaming agent, a wetting agent, a flatting agent and a solvent, filtering, coating the mixture on the first wave-absorbing layer and drying the mixture;
s60: and carrying out hot-pressing treatment on the sequentially coated structures to obtain a finished product.
5. The method for preparing the composite wave-absorbing material according to claim 4, wherein the high-insulation filler comprises at least one of alumina, aluminum oxide monohydrate, aluminum oxide dihydrate, ferric oxide, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, insulation carbon black, gas phase silica, crystalline silica and glass microspheres.
6. The method for preparing the composite wave-absorbing material according to claim 4, wherein the magnetic filler comprises at least one of ferrite, metal and nonmetal compounds.
7. The method for preparing the composite wave-absorbing material according to claim 4, wherein the resin comprises at least one of polyurethane resin, acrylic resin, epoxy resin, phenolic resin, olefinic rubber, alkane rubber, acrylic modified polyurethane resin and epoxy modified polyurethane resin.
8. The method for preparing the composite wave-absorbing material according to claim 4, wherein the solvent comprises at least one of benzene solvents, ester solvents, ketone solvents, alkane solvents, nitrogen-containing solvents and ether solvents.
9. The method for preparing the composite wave-absorbing material according to claim 4, wherein the metal material comprises at least one of metal simple substance, metal alloy, metal oxide, metal fluoride, metal carbide, metal silicide, metal nitride, metal sulfide, metal boride, metal telluride and metal antimonide.
10. The preparation method of the composite wave-absorbing material according to claim 4, wherein the hot pressing treatment is carried out under the hot pressing pressure of 3-16 MPa and the hot pressing temperature of 130-200 ℃.
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