CN113337011A - Copper-based composite material and preparation method and application thereof - Google Patents

Copper-based composite material and preparation method and application thereof Download PDF

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CN113337011A
CN113337011A CN202110535365.4A CN202110535365A CN113337011A CN 113337011 A CN113337011 A CN 113337011A CN 202110535365 A CN202110535365 A CN 202110535365A CN 113337011 A CN113337011 A CN 113337011A
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copper
based composite
composite material
heat dissipation
copper particles
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钟荣栋
刘悦
李同兵
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Guangdong Antopu Polymer Technology Co ltd
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Guangdong Antopu Polymer Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/12—Adsorbed ingredients, e.g. ingredients on carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

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Abstract

The invention discloses a copper-based composite material and a preparation method and application thereof. The copper-based composite material can effectively improve the heat dissipation performance of a high polymer material under low consumption, enables the high polymer material to keep excellent insulating property and has a certain improvement effect on the mechanical property of the high polymer material; meanwhile, the copper-based composite material has good compatibility with a high polymer material, and is not easy to generate phenomena such as agglomeration, layering and the like.

Description

Copper-based composite material and preparation method and application thereof
Technical Field
The invention relates to the technical field of cable materials, in particular to a copper-based composite material and a preparation method and application thereof.
Background
The cable is an important carrier for controlling installation, connecting equipment and transmitting power in daily life and production, and is a common and indispensable device in daily life. Different coating layers are generally arranged outside the conductor material of the cable and used for improving the weather resistance, corrosion resistance, wear resistance, flame retardance and the like of the cable. The coating layer of the cable comprises a sheath layer or an insulating layer made of high polymer materials such as thermoplastic elastomer materials and rubber. During the power transmission process of the cable, the conductor material inside the cable generates heat due to the existence of the resistance, so that the temperature of the conductor material is increased, and the resistance of the conductor material is increased along with the temperature increase, and finally, higher electric energy loss is caused. Meanwhile, excessive heat accumulated inside the cable can also cause spontaneous combustion, and fire risks occur. Therefore, the heat generated by the conductor material is dissipated in time, the temperature of the conductor material is reduced, and the method has important significance for reducing electric energy loss and improving the safety of the cable.
However, the heat resistance and heat dissipation of the polymer material used for manufacturing the sheath layer or the insulating layer outside the conductor material are limited, which hinders the dissipation of heat inside the cable, and is susceptible to the temperature rise of the conductor material to accelerate aging. In order to improve the heat dissipation performance of the cable, in the related art, heat conductive fillers such as carbon nanotubes, aluminum nitride, montmorillonite, silicon carbide and the like are mainly added, so that the heat conductive fillers can obtain a good heat dissipation effect under the condition of high consumption, and meanwhile, the mechanical performance of a cable sheath layer or an insulating layer can be influenced, and the use process requirement of the sheath cannot be met.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the copper-based composite material which has good heat dissipation performance by compounding the diamond with good heat conduction performance and the copper.
Meanwhile, the invention also provides a preparation method and application of the copper-based composite material.
Specifically, the technical scheme adopted by the invention is as follows:
according to a first aspect of the present invention, there is provided a copper-based composite material containing porous copper particles having nano-diamonds filled in pores thereof.
The copper-based composite material according to the first aspect of the present invention has at least the following advantageous effects:
the diamond has excellent heat conductivity, has the highest heat conductivity among all known materials, and has the heat conductivity of 2000W/(m.K) at normal temperature, but the diamond surface has strong chemical inertness, poor wettability and compatibility with various high polymer materials, is difficult to form uniform materials, and has high difficulty in modifying the diamond surface, so that the diamond is difficult to be applied to preparing various high polymer composite materials. According to the invention, the diamond is filled in the pores of the porous copper particles, and the copper has good heat-conducting property, so that the copper-based composite material can keep good heat-radiating performance; meanwhile, the difference between the thermal expansion coefficients of copper and diamond is small, and the copper and the diamond still have good stability under the high-temperature condition after being compounded; in addition, copper is relatively easy to carry out surface modification and reacts with high polymer materials, so that the copper-based composite material can be applied to the preparation of various high polymer composite materials.
In some embodiments of the invention, the nanodiamond has a particle size of 2nm to 300 nm.
In some embodiments of the invention, the porous copper particles have a particle size of 500nm to 1 μm.
In some embodiments of the invention, the pores in the porous copper particles are distributed between 200nm and 300 nm.
In some embodiments of the invention, the mass ratio of the porous copper particles to the nanodiamonds is 1: (0.05-0.5).
According to a second aspect of the present invention, there is provided a method for producing a copper-based composite material, comprising the steps of:
(1) mixing a copper salt, a reducing agent and a pore-forming agent to prepare a precursor solution, and reacting to obtain copper particles;
(2) calcining the copper particles in a protective atmosphere to obtain porous copper particles;
(3) and (3) soaking the porous copper particles in the nano-diamond dispersion liquid to obtain the copper-based composite material.
In the preparation process, copper salt is reduced into copper under the action of a reducing agent, a pore-forming agent is used as a crystal nucleus to grow to form copper particles, meanwhile, the pore-forming agent can also be used as a morphology regulator to influence the growth of the copper particles, then, the pore-forming agent is calcined and decomposed at high temperature to leave pores in the copper particles, and finally, the nano diamond is infiltrated into the pores of the porous copper particles through an impregnation method to form the composite material.
In some embodiments of the invention, the copper salt is a water-soluble copper salt, including any one or more of copper chloride, copper sulfate, copper nitrate, copper acetate, copper oleate, copper laurate, and hydrates thereof.
In some embodiments of the invention, the reducing agent comprises any one or more of hydrazine hydrate, sodium borohydride, potassium borohydride, sodium hypophosphite.
In some embodiments of the invention, the pore former comprises any one or more of carbon powder, carbon fiber, urea, cetyl trimethyl ammonium bromide.
In some embodiments of the present invention, the solvent of the precursor solution is any one of water, ethanol, methanol, and ethylene glycol.
In some embodiments of the invention, the molar ratio of the copper salt to the reducing agent is 1: (1 to 4), preferably 1: (2-3).
In some embodiments of the present invention, the mass concentration of the pore-forming agent in the precursor solution is 2 to 15%, preferably 5 to 10%.
In some embodiments of the invention, in step (1), the temperature of the reaction is in the range of-10 ℃ to 100 ℃.
In some embodiments of the invention, in step (1), the temperature of the reaction is between-10 ℃ and 80 ℃.
In some embodiments of the invention, in the step (1), the reaction is specifically to react the precursor solution at-10 to 0 ℃, and then raise the temperature to 50 to 100 ℃ for reaction; then alternately carrying out reaction at-10-0 ℃ and 50-100 ℃; the number of alternation is at least 2; and finally, cooling to room temperature from 50-100 ℃, and performing the step (2). The temperature of the reaction is regulated, so that the copper particles can be effectively combined with the pore-forming agent according to a certain mode, the formation of subsequent porous copper is facilitated, and the structure of filling the nano diamond in the porous copper is facilitated.
In some embodiments of the invention, in the step (1), the reaction is specifically to react the precursor solution at-10 to-5 ℃, and then raise the temperature to 50 to 80 ℃ for reaction; then alternately reacting at-10 to-5 ℃ and 50 to 80 ℃; the number of alternation is at least 2; and finally, cooling to room temperature from 50-80 ℃, and performing the step (2).
In some embodiments of the present invention, in step (1), the reaction time is 20min to 120 min.
In some embodiments of the present invention, in the step (1), the reaction time at 50 to 100 ℃ (or 50 to 80 ℃) is 5 to 20min, and the reaction time at-10 to 0 ℃ (or-10 to-5 ℃) is 5 to 20 min.
In some embodiments of the invention, in step (2), the temperature of the calcination is in the range of 800 ℃ to 1000 ℃, preferably 850 ℃ to 950 ℃.
In some embodiments of the invention, in step (2), the calcination time is 0.5h to 10 h.
In some embodiments of the present invention, in step (2), the protective atmosphere refers to an atmosphere containing no water or oxygen, such as a nitrogen atmosphere or an argon atmosphere.
In some embodiments of the present invention, in the step (3), the mass concentration of the nanodiamond in the nanodiamond dispersion liquid is 0.01% to 10%.
In some embodiments of the invention, in step (3), the ratio of the porous copper particles to the nanodiamond dispersion is 1 g: 20ml to 100 ml.
In some embodiments of the present invention, in the step (3), the mass ratio of the porous copper particles to the nanodiamonds is 1: (0.05-0.5).
In some embodiments of the present invention, before the step (3) of immersing the porous copper particles in the nanodiamond dispersion liquid, the method further comprises degassing the porous copper particles, wherein the degassing is performed under vacuum and the vacuum pressure is 0.09MPa to 0.99 MPa. Through degassing treatment, the nano diamond can be fully immersed into the pores of the porous copper particles.
In some embodiments of the present invention, in the step (3), after the porous copper particles are immersed in the nanodiamond dispersion liquid, the nanodiamond is immersed in pores of the porous copper particles by pressurization; the pressure for pressurizing is 0.15MPa to 0.8 MPa.
In some embodiments of the invention, in step (3), the temperature of the impregnation is 20 ℃ to 80 ℃.
In some embodiments of the invention, in step (3), the time for the immersion is 10min to 5 h.
According to a third aspect of the present invention, there is provided a polymeric heat dissipating material, which is prepared from the following raw materials:
thermoplastic elastomer
Copper-based composite material
A compatibilizer.
The copper-based composite material has good heat dissipation capability, and the heat dissipation of the high polymer material can be effectively improved by doping the copper-based composite material into the thermoplastic elastomer; meanwhile, the surface of the porous copper particles of the copper-based composite material is more active, some oxygen atoms or other groups are easily generated, and the combination compatilizer can be uniformly dispersed in the high polymer material, so that deposition and delamination are not easy to occur.
In some embodiments of the present invention, the polymeric heat dissipation material comprises the following raw materials in parts by mass:
10-45 parts of thermoplastic elastomer
5-30 parts of copper-based composite material
0.01-0.2 parts of compatilizer.
The copper-based composite material has high heat dissipation performance even if the high polymer heat dissipation material has high heat dissipation performance under the condition of extremely small using amount, so that the use of heat dissipation filler is saved; meanwhile, under the condition of low consumption, the prepared high polymer heat dissipation material has good insulating property, and the problem of circuit short circuit possibly caused by conductive copper in the copper-based composite material is avoided.
In some embodiments of the present invention, the raw materials for preparing the polymeric heat dissipation material further include a coupling agent, an antistatic agent, a flame retardant, a dispersant, an anti-wear agent, a plasticizer, and an insulating filler.
In some embodiments of the present invention, the polymeric heat dissipation material comprises the following raw materials in parts by mass:
Figure BDA0003069388390000051
in some embodiments of the present invention, the polymeric heat dissipation material comprises the following raw materials in parts by mass:
Figure BDA0003069388390000052
in some embodiments of the present invention, the polymeric heat dissipation material comprises the following raw materials in parts by mass:
Figure BDA0003069388390000053
Figure BDA0003069388390000061
in some embodiments of the present invention, the thermoplastic elastomer includes any one or more of a polyolefin-based elastomer (TPO), a styrene-butadiene block copolymer (SBS), a hydrogenated polystyrene-based elastomer (SEBS), a polyethylene-based elastomer, a polyurethane-based elastomer (TPU), and a polyamide-based elastomer.
In some embodiments of the invention, the compatibilizer is a maleic anhydride graft, such as maleic anhydride grafted SEBS, maleic anhydride grafted PE.
In some embodiments of the invention, the coupling agent is a silane coupling agent and/or a phthalate coupling agent.
In some embodiments of the invention, the antistatic agent may be a general antistatic agent, for example, an ethoxylated fatty alkyl amine based antistatic agent (e.g., ethoxylated alkylamine, ethoxylated lauramide).
In some embodiments of the present invention, the flame retardant is a general halogen-free flame retardant, for example, any one or more of melamine cyanurate, melamine polyphosphate, phosphate, hypophosphite and hypophosphite may be used, but not limited thereto.
In some embodiments of the present invention, the dispersant may be any one or more of general-purpose dispersants, such as sodium lauryl sulfate, polyethylene wax, benzyl naphthalene sulfonate formaldehyde Condensate (CNF), polyacrylamide, and fatty acid polyethylene glycol ester, but is not limited thereto.
In some embodiments of the present invention, the anti-wear agent may be a general-purpose anti-wear agent, such as any one or more of ceramic powder, silicon carbide, silicon nitride, alumina, calcium phosphate, and calcium carbonate, but is not limited thereto.
In some embodiments of the present invention, the plasticizer may be any one or more of general plasticizers, such as, but not limited to, trioctyl trimellitate, epoxidized fatty acid butyl ester, dioctyl adipate, and dioctyl sebacate.
In some embodiments of the present invention, the insulating filler may be any one or more of general fillers having an insulating function, such as mica powder, kaolin, talc, silica, glass fiber powder, alumina, silicon carbide, and titanium dioxide, but is not limited thereto. By adding the insulating filler, the resistivity of the high polymer heat dissipation material is further improved, and the problem of circuit short circuit possibly caused by conductive copper particles in the copper-based composite material is further avoided; meanwhile, part of the insulating filler also has a wear-resisting function.
According to a fourth aspect of the present invention, there is provided a method for preparing the polymer material, comprising the steps of: mixing the preparation raw materials, banburying, adding into a double-screw extruder, and performing melt extrusion.
In some embodiments of the invention, the temperature of banburying is 160-185 ℃, and the banburying time is 10-15 min.
In some embodiments of the invention, the temperature of the melting is from 180 ℃ to 230 ℃.
In some embodiments of the present invention, the preparation raw materials are mixed in sequence by mixing the thermoplastic elastomer, the copper-based composite material, the compatibilizer and the coupling agent, heating (40-100 ℃) and stirring uniformly; then adding antistatic agent, flame retardant, dispersant, wear-resisting agent, plasticizer and insulating filler.
According to a fifth aspect of the present invention, an application of the polymer heat dissipation material in preparing cables, electronic components, racks (such as outdoor 5G racks), and heat dissipation soft glue gaskets is provided.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a novel copper-based composite material, which is prepared by compounding diamond and copper and has good heat dissipation performance. The copper-based composite material can effectively improve the heat dissipation performance of the high polymer material under low consumption, enables the high polymer material to keep excellent insulating property and has certain improvement effect on the mechanical property of the high polymer material; meanwhile, the copper-based composite material has good compatibility with a high polymer material, and is not easy to generate phenomena such as agglomeration, layering and the like.
Detailed Description
The concept and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments to fully understand the objects, features and effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention.
In the following examples, the materials used are general-purpose materials and the processes used are general-purpose processes, unless otherwise specified.
Preparation of copper-base composite material
Example 1
4g (0.0)2mol)Cu(CH3COO)2·H2O was dissolved in 100ml of ethanol, 7.2g of cetyltrimethylammonium bromide was added, the mixed solution was quenched in a freezer at-10 ℃ and 5ml of 40% (about 0.04mol) hydrazine hydrate solution was added dropwise and stirred for about 10 min. Taking out the mixed solution, heating to 50 deg.C, stirring for 20min, placing into-10 deg.C refrigerator, quenching, and stirring for about 10 min; then, the mixture was taken out and heated to 50 ℃ and stirred for 20 min. And naturally standing and cooling the solution, centrifuging, and repeatedly washing by using ethanol to obtain the copper.
In a nitrogen atmosphere, the temperature is raised from room temperature to 850 ℃ at the temperature raising rate of 5 ℃/min, and the temperature is kept for 2h, so that the copper is calcined. And naturally cooling after calcining and sintering to obtain the porous copper.
Mixing nano diamond powder (D)50About 50 nm) and sodium pyrophosphate (playing a role in dispersing) are added into deionized water for ultrasonic dispersion to prepare nano-diamond dispersion liquid with the mass concentration of nano-diamond of 0.1% (the mass concentration of the sodium pyrophosphate is 0.05%).
Adding 60ml of nano diamond dispersion liquid into an autoclave, adding 1g of calcined porous copper, introducing nitrogen, controlling the temperature to be about 50 ℃ and the pressure to be about 0.2MPa, keeping for 1h, naturally cooling, centrifuging, and repeatedly washing by using ethanol to obtain the copper-based composite material.
Material characterization test:
in XRD analysis of the copper-based composite material, the characteristic diffraction peaks of a Cu simple substance appear near diffraction angles of 43 degrees, 50 degrees and 74 degrees, and weak CuO diffraction peaks appear near diffraction angles of 32 degrees, 35 degrees and 48 degrees, possibly leading to partial oxidation of porous copper; and diamond diffraction peaks appear around 42 degrees and 72 degrees, which indicates that the porous copper and the diamond are successfully compounded.
Scanning electron microscope observation is carried out on porous copper formed in the process of preparing the copper-based composite material, and the result shows that the particle size of the porous copper is mainly distributed between 700 nm and 900 nm; meanwhile, the porous copper has more holes, and the holes are mainly distributed between 200nm and 300 nm; meanwhile, the scanning electron microscope observation result of the copper-based composite material shows that relatively uniform particles are dispersed in the copper-based composite material, the particle size is mainly distributed between 700 nm and 900nm, and no pores exist, which indicates that the pores in the porous copper are filled with the nano-diamond after the nano-diamond dispersion liquid is soaked.
Example 2
This example provides a copper-based composite material, which is different from example 1 in that: the mass concentration of the nanodiamond dispersion for impregnating porous copper of this example was 0.5%.
As a result of the XRD analysis, the copper-based composite material obtained in this example was found to be similar to that of example 1.
Example 3
This example provides a copper-based composite material, which is different from example 1 in that: the mass concentration of the nanodiamond dispersion for impregnating porous copper of this example was 0.8%.
As a result of the XRD analysis, the copper-based composite material obtained in this example was found to be similar to that of example 1.
Comparative example 1
This comparative example provides a copper-based composite material, which is different from example 1 in that: this comparative example only performed the reaction at 50 ℃ in the copper preparation step.
Specifically, 4g (0.02mol) of Cu (CH)3COO)2·H2O was dissolved in 100ml of ethanol, 7.2g of cetyltrimethylammonium bromide was added, and the mixture was heated to 50 ℃. Then 5ml of 40% (about 0.04mol) hydrazine hydrate solution was slowly added dropwise, and the heating was stopped after stirring for about 60 min. And naturally standing and cooling the solution, centrifuging, and repeatedly washing by using ethanol to obtain the copper.
In a nitrogen atmosphere, the temperature is raised from room temperature to 850 ℃ at the temperature raising rate of 5 ℃/min, and the temperature is kept for 2h, so that the copper is calcined. And naturally cooling after calcining and sintering to obtain the porous copper.
Mixing nano diamond powder (D)50About 50 nm) and sodium pyrophosphate (playing a role in dispersing) are added into deionized water for ultrasonic dispersion to prepare nano-diamond dispersion liquid with the mass concentration of nano-diamond of 0.1% (the mass concentration of the sodium pyrophosphate is 0.05%).
Adding 60ml of nano diamond dispersion liquid into an autoclave, adding 1g of calcined porous copper, introducing nitrogen, controlling the temperature to be about 50 ℃ and the pressure to be about 0.2MPa, keeping for 1h, naturally cooling, centrifuging, and repeatedly washing by using ethanol to obtain the copper-based composite material.
Material characterization test:
in comparison with example 1, XRD analysis of the material of this comparative example showed no occurrence of diffraction peak of diamond.
And (3) carrying out scanning electron microscope observation on the porous copper formed in the preparation process, wherein the result shows that the surface of the porous copper is compact and no pore is observed.
Comparative example 2
This comparative example provides a copper-based composite material, which is different from example 1 in that: the mass concentration of the nanodiamond dispersion for impregnating porous copper of this example was 1%.
The obtained material is observed by a scanning electron microscope, and the result shows that the surface of the material is free of pores, more particles are agglomerated, the particles are obviously increased compared with the particles in the embodiment 1, and the particle size is mainly distributed between 2 and 3 mu m.
(II) preparation of high molecular heat dissipation material
Example 4
A polymer heat dissipation material is prepared according to the following mixture ratio of the following table 1:
TABLE 1 preparation of the materials and the amounts used for the preparation of the high molecular heat dissipating material
Figure BDA0003069388390000091
Figure BDA0003069388390000101
Note: the mixture of porous copper and nanodiamond powder in Table 1 was prepared by mixing the porous copper prepared in example 1 with nanodiamond powder (D)50Around 50 nm) as per 1: 0.06 mass ratio, and grinding was performed during grinding.
The preparation method of the polymer heat dissipation material comprises the following steps:
adding TPU into a high-speed stirrer, then adding copper-based composite material (or mixture of nano copper powder and nano diamond powder), maleic anhydride grafted LLDPE and vinyl trimethoxy silane, heating to 80 ℃ during stirring, and continuing stirring for 30min after the temperature is reached. Then adding the ethoxylated alkylamine, hypophosphite, sodium dodecyl sulfate, silicon carbide, trioctyl trimellitate and mica powder at 80 ℃, stirring uniformly, adding the mixture into an internal mixer, and internally mixing for 15min at 190 ℃. Then feeding the mixed materials into a double-screw extruder for melt blending and extrusion, wherein the melting temperature is set as follows: the first section is 180 ℃, the second section is 190 ℃, the third section is 190 ℃, the fourth section is 200 ℃, the fifth section is 210 ℃, the sixth section is 210 ℃, the seventh section is 220 ℃, the eighth section is 220 ℃, the ninth section is 230 ℃, the tenth section is 230 ℃, the head temperature is 225 ℃, 180 ℃, and the rotating speed of the main machine is 400 rpm.
The prepared polymer heat dissipation material is subjected to performance test, and the test standards are as follows:
coefficient of thermal conductivity: according to ISO 22007-2-2008 standard;
mechanical properties: according to ASTM D412;
volume resistivity: according to the GB/T31838.2-2019 standard.
TABLE 2 Performance test results of Polymer Heat sink materials
Figure BDA0003069388390000111
The test results show that, compared with the comparative group 4 without any copper-based composite material, after the copper-based composite materials of examples 1 to 3 (experimental groups 1 to 4) are added, the heat conductivity coefficient of the high polymer heat dissipation material is obviously increased, and the high polymer heat dissipation material has good insulating property. In contrast, when the copper-based composite material of comparative example 1 in which nanodiamond was not detected was used (comparative example 1), the heat conductive property of the resulting polymer heat dissipating material was not significantly improved, while the insulating property of the polymer heat dissipating material was also weakened. After the copper-based composite material of comparative example 2 is added (comparative example 2), although the high polymer material has better insulating property, the heat conducting property is not obviously improved, and the preparation method and the structure of the copper-based composite material of comparative example 2 are combined, so that the copper-based composite material is agglomerated due to excessive consumption of the nano diamond, and the heat conducting property is influenced. When the nano diamond is not filled in the pores of the porous copper (comparative group 3), the heat conductivity and the insulation of the prepared polymer heat dissipation material are reduced compared with those of the experimental group 1.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.

Claims (10)

1. A copper-based composite material characterized by: the copper-based composite material contains porous copper particles, and the pores of the porous copper particles are filled with nano-diamond.
2. Copper-based composite material according to claim 1, characterized in that: the particle size of the nano diamond is 2 nm-300 nm; the particle size of the porous copper particles is 500 nm-1 mu m; the pore distribution in the porous copper particles is between 200nm and 300 nm.
3. Copper-based composite material according to claim 2, characterized in that: the mass ratio of the porous copper particles to the nano-diamond is 1: (0.05-0.5).
4. A method for producing a copper-based composite material according to any one of claims 1 to 3, characterized in that: the method comprises the following steps:
(1) mixing a copper salt, a reducing agent and a pore-forming agent to prepare a precursor solution, and reacting to obtain copper particles;
(2) calcining the copper particles in a protective atmosphere to obtain porous copper particles;
(3) and (3) soaking the porous copper particles in the nano-diamond dispersion liquid to obtain the copper-based composite material.
5. The method according to claim 4, wherein: in the step (1), the reaction temperature is-10 ℃ to 100 ℃.
6. The method according to claim 5, wherein: in the step (1), the reaction is specifically carried out by reacting the precursor solution at-10-0 ℃, and then heating to 50-100 ℃ for reaction; then alternately carrying out reaction at-10-0 ℃ and 50-100 ℃; the number of alternations is at least 2.
7. A high polymer heat dissipation material is characterized in that: the preparation raw materials of the high polymer heat dissipation material comprise: thermoplastic elastomer
Copper-based composite material according to any one of claims 1 to 3
A compatibilizer.
8. The polymeric heat dissipating material of claim 7, wherein: the high polymer heat dissipation material comprises the following preparation raw materials in parts by mass:
10-45 parts of thermoplastic elastomer
5-30 parts of copper-based composite material
0.01-0.2 parts of compatilizer.
9. A method for preparing the polymer heat dissipation material of claim 7 or 8, wherein: the method comprises the following steps: mixing the preparation raw materials, banburying, adding into a double-screw extruder, and carrying out melt extrusion.
10. The use of the polymeric heat dissipating material of claim 7 or 8 in the preparation of cables, electronic components, racks, and heat dissipating soft rubber gaskets.
CN202110535365.4A 2021-05-17 2021-05-17 Copper-based composite material and preparation method and application thereof Pending CN113337011A (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN113929865A (en) * 2021-11-22 2022-01-14 山东一诺威聚氨酯股份有限公司 High-thermal-conductivity low-abrasion TPU material and preparation method thereof

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Title
朱洪法: "《催化剂手册》", 31 August 2008, 金盾出版社 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113929865A (en) * 2021-11-22 2022-01-14 山东一诺威聚氨酯股份有限公司 High-thermal-conductivity low-abrasion TPU material and preparation method thereof

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Application publication date: 20210903