CN113324912A - Plastic package structure internal defect detection device and method and storage medium - Google Patents
Plastic package structure internal defect detection device and method and storage medium Download PDFInfo
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- 238000001514 detection method Methods 0.000 title claims abstract description 123
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/1702—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/1702—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
- G01N2021/1706—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids in solids
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Abstract
The present disclosure provides a device, a method and a storage medium for detecting internal defects of a plastic package structure, which includes: the detection probe is arranged outside the plastic package structure and is configured to emit detection laser with the wavelength of 1000nm to 1100nm, which irradiates the plastic package shell, so that the plastic package shell generates detection sound waves under the irradiation of the detection laser; the receiving probe is arranged outside the plastic package structure and beside the detection probe and is configured to be capable of receiving feedback sound waves after detection of the detection sound waves in the plastic package structure is completed; and the processor is in communication connection with the detection probe and the receiving probe and is configured to analyze the feedback sound wave to determine the defects in the plastic package structure. According to the method, the low-power-density laser is irradiated on the surface of the plastic package structure, so that the shell of the plastic package structure generates ultrasonic waves, and the ultrasonic waves are used for detecting the defects inside the plastic package structure, so that the restriction that the traditional ultrasonic detection technology needs to adopt a water-based coupling medium for ultrasonic detection is broken through, and the secondary damage during detection is avoided.
Description
Technical Field
The present disclosure relates to the field of defect detection technologies, and in particular, to a device and a method for detecting internal defects of a plastic package structure, and a storage medium.
Background
In the process of encapsulating the molding compound, the existing plastic package structure may generate defects such as internal cavities, delamination, cracks and the like between the molding compound and a chip or a metal frame, and an ultrasonic scanning microscope detection device is one of the effective methods for detecting the defects at present.
However, in the conventional ultrasonic scanning microscope inspection system, ionized water is used as a coupling medium to perform imaging inspection on internal structure defects of the plastic package device, and the plastic package structure needs to be completely immersed in the ionized water and needs to be dried at a high temperature of 125 ℃ after the inspection. The plastic package structure causes secondary damage to the device structure due to moisture absorption and high-temperature baking processes, thereby bringing new defects.
Disclosure of Invention
In view of the above, an object of the present disclosure is to provide a device and a method for detecting internal defects of a plastic package structure, and a storage medium.
Based on above-mentioned purpose, this disclosure provides a plastic envelope structure internal defect check out test set, is applied to the plastic envelope structure including the plastic envelope shell, includes:
the detection probe is arranged outside the plastic package structure and is configured to emit detection laser with the wavelength of 1000nm to 1100nm and irradiated on the plastic package shell, so that the plastic package shell generates detection sound waves under the irradiation of the detection laser;
the receiving probe is arranged outside the plastic package structure and beside the detection probe and is configured to be capable of receiving feedback sound waves after the detection of the detection sound waves in the plastic package structure is completed;
and the processor is in communication connection with the detection probe and the receiving probe and is configured to analyze the feedback sound waves to determine the defects in the plastic package structure.
Based on the same concept, the disclosure also provides a method for detecting the internal defect of the plastic package structure, which comprises the following steps:
the processor controls the detection probe to emit detection laser with the wavelength of 1000nm to 1100nm to the plastic package structure according to the input instruction, so that the plastic package shell of the plastic package structure generates detection sound waves under the irradiation of the detection laser;
the processor obtains feedback sound waves which are received by the receiving probe and are detected in the plastic package structure, and the defects in the plastic package structure are determined according to the feedback sound waves.
Based on the same concept, the present disclosure also provides a non-transitory computer-readable storage medium storing computer instructions for causing the computer to implement the method of any one of the above.
As can be seen from the foregoing, the present disclosure provides a device, a method and a storage medium for detecting internal defects of a plastic package structure, including: the detection probe is arranged outside the plastic package structure and is configured to emit detection laser with the wavelength of 1000nm to 1100nm, which irradiates the plastic package shell, so that the plastic package shell generates detection sound waves under the irradiation of the detection laser; the receiving probe is arranged outside the plastic package structure and beside the detection probe and is configured to be capable of receiving feedback sound waves after detection of the detection sound waves in the plastic package structure is completed; and the processor is in communication connection with the detection probe and the receiving probe and is configured to analyze the feedback sound wave to determine the defects in the plastic package structure. According to the ultrasonic detection method, the low-power-density laser is irradiated on the surface of the plastic package structure, so that the shell of the plastic package structure generates ultrasonic waves, and the ultrasonic waves are used for detecting the defects inside the plastic package structure, so that the restriction that the traditional ultrasonic detection technology needs to adopt a water-based coupling medium for ultrasonic detection is broken through, the coupling-medium-free ultrasonic detection technology is realized, the secondary damage caused by water coupling and high-temperature treatment in the traditional ultrasonic micro plastic package structure defect detection is avoided, and the detection accuracy is effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present disclosure or technical solutions in related arts, the drawings used in the description of the embodiments or related arts will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present disclosure, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an internal defect detection device of a conventional plastic package structure according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a plastic package structure internal defect detection device according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a probe of a plastic package structure internal defect detection device according to an embodiment of the present disclosure;
fig. 4 is a schematic flow chart of a method for detecting internal defects of a plastic package structure according to an embodiment of the present disclosure.
Detailed Description
To make the objects, technical solutions and advantages of the present specification more apparent, the present specification is further described in detail below with reference to the accompanying drawings in combination with specific embodiments.
It is to be noted that technical terms or scientific terms used in the embodiments of the present disclosure should have a general meaning as understood by those having ordinary skill in the art to which the present disclosure belongs, unless otherwise defined. The use of "first," "second," and similar terms in the embodiments of the disclosure is not intended to indicate any order, quantity, or importance, but rather to distinguish one element from another. The word "comprising" or "comprises", and the like, means that a element, article, or method step that precedes the word, and includes the element, article, or method step that follows the word, and equivalents thereof, does not exclude other elements, articles, or method steps. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
As described in the background section, the plastic package structure encapsulates the semiconductor chip, the metal frame, the bonding wires, and other structures with a molding compound. But because the plastic package structure belongs to a humidity and temperature change sensitive device, the defects of the traditional detection test are more obvious: the plastic package structure can cause secondary damage of the device structure due to moisture absorption and high-temperature baking processes, thereby bringing new defects. As shown in fig. 1, a schematic structural diagram of an internal defect detection device of a conventional plastic package structure is shown. The working principle is that ultrasonic waves 121 with a certain frequency (10-100MHz) are emitted by the ultrasonic transducer 120, focused by the acoustic lens and transmitted to the plastic package structure 110 by the coupling medium 100 (such as deionized water). The ultrasonic waves 121 enter the inside of the plastic package structure 110 and are reflected by an interface in the plastic package structure 110 to form echoes, and an ultrasonic image is generated on a plane in a mechanical scanning mode by changing the horizontal position of the transducer. Since the acoustic wave is a mechanical longitudinal wave and needs to be transmitted by a transmission medium, in order to improve the transmission efficiency of the acoustic wave, deionized water is used as a coupling mechanism of the acoustic wave, and therefore the plastic package structure 110 needs to be soaked in the deionized water. Soaking the plastic package structure 110 in a liquid can cause a large amount of moisture absorption of the plastic package structure 110, and although the plastic package structure 110 is subjected to processes such as drying, great risk is brought to secondary damage of a plastic package device.
In combination with the above practical situation, the embodiment of the present disclosure provides a device for detecting internal defects of a plastic package structure, in which a low-power-density laser is irradiated on a surface of the plastic package structure to generate an ultrasonic wave on an outer shell of the plastic package structure, so that the ultrasonic wave is used for detecting the internal defects of the plastic package structure, thereby breaking through the restriction that a water-based coupling medium must be used for ultrasonic detection in the conventional ultrasonic detection technology, realizing a coupling-medium-free ultrasonic detection technology, avoiding secondary damage caused by water coupling and high-temperature treatment in the conventional ultrasonic microscopic plastic package structure defect detection, and effectively improving the detection accuracy.
As shown in fig. 2, a schematic structural diagram of a device for detecting internal defects of a plastic package structure provided in the present disclosure is applied to a plastic package structure 110 including a plastic package housing 111, and includes:
the detection probe 210 is arranged outside the plastic package structure 110, and is configured to emit detection laser 211 with a wavelength of 1000nm to 1100nm, which irradiates the plastic package shell 111, so that the plastic package shell 111 generates a detection sound wave 212 under irradiation of the detection laser 211;
a receiving probe 220, disposed outside the plastic package structure 110, near the detecting probe 210, and configured to receive a feedback sound wave 222 that the detecting sound wave 212 has detected inside the plastic package structure 110;
a processor 300, communicatively connected to the probing probe 210 and the receiving probe 220, configured to analyze the feedback sound waves 222 to determine defects inside the plastic package structure 110.
The plastic package structure is formed by encapsulating structures such as a semiconductor chip, a metal frame, a bonding wire and the like by adopting a molding compound, and forming a plastic package shell by the molding compound. In a specific application scenario, the inventor finds that the plastic package shell absorbs high-energy laser under the irradiation of low-power-density laser, so that the material is subjected to thermal expansion locally, so that the material is subjected to strain and stress, the plastic package shell generates a group of mechanical waves under the irradiation of pulses with certain frequency, ultrasonic waves can be generated on the plastic package shell by modulating the pulse frequency of the laser, the ultrasonic waves are conducted to the interior of a plastic package device, and the defect detection and imaging can be performed similarly to a traditional ultrasonic scanning microscope. Therefore, the plastic package shell can generate ultrasonic waves for detection by irradiating probe laser with the wavelength of 1000nm to 1100nm, the plastic package shell cannot be damaged due to overhigh energy, and the generated ultrasonic waves have higher ultrasonic frequency and wider frequency band than the ultrasonic waves used for the conventional ultrasonic defect detection. Therefore, the scheme that the plastic package structure is soaked in the coupling medium and is detected through ultrasound in the prior art can be replaced by a laser irradiation mode, and meanwhile, the plastic package structure cannot be soaked in the coupling medium and does not need to be subjected to high-temperature drying treatment, so that new defects caused by secondary damage of the plastic package structure due to moisture absorption and a high-temperature baking process can be effectively prevented. And then, an optical focusing photoacoustic imaging detection mode is adopted, because optical focusing is tighter than acoustic focusing, the optical focus is smaller than an acoustic detection focus, the transverse resolution depends on the size of the optical focus, the dimension of the optical focus can reach hundreds of nanometers to several micrometers, and the depth can reach 1-2 mm. It can be seen that the detection by using the photoacoustic conversion method has higher detection precision and can discover the defects of the interior of the plastic packaging structure, which are finer and deeper, than the detection by directly using the existing acoustic wave.
Then, the receiving probe can be directly contacted with the plastic package shell to receive the feedback sound wave; the wave properties of the light waves and the sound waves and the interference characteristics of the waves can be utilized, and the receiving probe can also receive the feedback sound waves by utilizing laser through the vibration measuring laser, and the like. That is, in some application scenarios, as shown in fig. 2, the receiving probe 220 is a vibration measuring laser capable of emitting interference laser light 221 with a wavelength of 1500nm to 1600 nm; the vibration measuring laser is configured to receive the feedback sound wave 222 through interference of the interference laser 221 and the feedback sound wave 222. In a specific application scenario, the main difference between the mode of using laser to generate ultrasound for defect detection and the existing mode of using ultrasound for defect detection is that the frequency of the ultrasound wave during and after excitation is high and the frequency band is wide. For the reception of the laser-excited ultrasound, it is essentially the reception of the mass point vibration displacement, and thus this is consistent with the reception method of the conventional piezoelectric ultrasound.
And finally, determining the defects inside the plastic package structure by the processor according to the feedback sound wave. In some application scenes, the detection of the internal defects of single points of the plastic package structure can be completed through the reciprocating motion of the probe and the receiving probe in the range of the plastic package shell, the whole plastic package device is scanned point by point and line by line in a light beam deflection mode, and finally the defect detection and imaging in the plastic package structure can be formed by the processor.
From the foregoing, it can be seen that the present disclosure provides a plastic envelope structure internal defect detection apparatus, including: the detection probe is arranged outside the plastic package structure and is configured to emit detection laser with the wavelength of 1000nm to 1100nm, which irradiates the plastic package shell, so that the plastic package shell generates detection sound waves under the irradiation of the detection laser; the receiving probe is arranged outside the plastic package structure and beside the detection probe and is configured to be capable of receiving feedback sound waves after detection of the detection sound waves in the plastic package structure is completed; and the processor is in communication connection with the detection probe and the receiving probe and is configured to analyze the feedback sound wave to determine the defects in the plastic package structure. According to the ultrasonic detection method, the low-power-density laser is irradiated on the surface of the plastic package structure, so that the shell of the plastic package structure generates ultrasonic waves, and the ultrasonic waves are used for detecting the defects inside the plastic package structure, so that the restriction that the traditional ultrasonic detection technology needs to adopt a water-based coupling medium for ultrasonic detection is broken through, the coupling-medium-free ultrasonic detection technology is realized, the secondary damage caused by water coupling and high-temperature treatment in the traditional ultrasonic micro plastic package structure defect detection is avoided, and the detection accuracy is effectively improved.
More importantly, the plastic package structure internal defect detection equipment provided by the disclosure selects a non-contact laser ultrasonic detection scheme, and because the laser can remotely send and receive acoustic signals in a non-contact manner, a coupling medium is not needed, so that interference and pollution of a water-based coupling medium to a plastic package device are avoided. Meanwhile, since the non-contact laser detection can be completed in severe environments such as high temperature, high pressure, corrosion and the like, the generated acoustic signal not only has the advantages of high frequency, short wavelength, high detection precision, high sensitivity and the like, but also can be transmitted in various substances such as metal, alloy, composite materials, liquid, gas and the like, so that the defect of micron order can be detected.
In some application scenarios, in order to determine the laser wavelength with the strongest interference characteristic in the wavelength range of the interference laser, the effect of receiving the feedback sound wave is optimized. The wavelength of the interference laser is 1550 nm.
In some application scenarios, the detection laser has a wavelength of 1064 nm. The laser with the wavelength of 1064nm is selected, the laser stability is good, high energy can be generated, meanwhile, the narrow pulse width laser with the wavelength has good absorption capacity on the surfaces of plastic package shells made of different materials, and more stable detection sound waves can be generated.
In some application scenarios, a laser with a specific wavelength can be generated more stably. As shown in fig. 3, the probing probe 210 includes: a laser 213 configured to generate raw laser light; a laser collimator 214 connected to the laser through a transmission fiber, configured to receive the original laser light diffused after transmission by the transmission fiber, and convert the diffused original laser light into parallel laser light; a focusing lens 215 configured to receive the parallel laser light and focus the parallel laser light; a scanning galvanometer 216 configured to receive the focused parallel laser light and generate scanning laser light; a beam splitter 217 configured to receive the scanning laser light for splitting to generate the detection laser light.
The laser collimator belongs to an optical element for input and output of an optical fiber communication optical device, and changes divergent light transmitted out through an optical fiber into parallel laser (Gaussian beam) through a structure such as a preposed convex lens. The focusing lens belongs to a gradient index lens. Has the characteristics of end face focusing and imaging, and has the cylindrical appearance characteristic, thereby being applied to various micro optical systems. There are 5 basic types of focusing lenses: i.e. plano-convex, positive meniscus, aspherical, diffractive and reflective lenses. The last type of mirror is typically an off-axis parabolic mirror, and the focusing lens may be one or more in the context of a particular application. The scanning galvanometer is a good vector scanning device, is a special swing motor, the basic principle is that an electrified coil generates moment in a magnetic field, but different from a rotating motor, a rotor of the scanning galvanometer is added with reset moment by a mechanical spring or an electronic method, the magnitude of the reset moment is in direct proportion to the angle of the rotor deviating from a balance position, when the coil is electrified with certain current and the rotor deflects to a certain angle, the electromagnetic moment is equal to the reset moment, so the scanning galvanometer can not rotate like a common motor and can only deflect, the deflection angle is in direct proportion to the current and is the same as a galvanometer, and the scanning galvanometer is called a galvanometer scanning galvanometer (galvanometer). The number of the scanning galvanometers can be one or more in a specific application scene. The beam splitter is a coated glass. One or more layers of thin films are coated on the surface of the optical glass, and after one beam of light is projected onto the coated glass, the beam of light is divided into two or more beams through reflection and refraction.
In some application scenarios, the plastic package structure is suitable for different types and different materials. The single pulse energy of the detection laser is 1mJ to 16mJ, the pulse width of the detection laser is 5ns to 8ns, and the repetition frequency of the detection laser is 1kHz to 2 kHz.
Wherein, according to the plastic packaging structure of different grade type, survey laser and need adjust to different laser energy and repetition frequency.
It should be noted that, the embodiments of the present disclosure can be further described by the following ways:
in some embodiments, the receiving probe is a vibration measuring laser capable of emitting interference laser light with a wavelength of 1500nm to 1600 nm;
the vibration measuring laser is configured to receive the feedback sound wave through interference of the interference laser and the feedback sound wave.
In some embodiments, the wavelength of the interfering laser is 1550 nm.
In some embodiments, the detection laser has a wavelength of 1064 nm.
In some embodiments, the probing probe comprises:
a laser configured to generate raw laser light;
the laser collimator is connected with the laser through a transmission optical fiber and is configured to receive the original laser diffused after being transmitted by the transmission optical fiber and convert the diffused original laser into parallel laser;
a focusing lens configured to receive the parallel laser light and focus the parallel laser light;
a scanning galvanometer configured to receive the focused parallel laser light and generate scanning laser light;
a beam splitter configured to receive the scanning laser light for splitting to generate the detection laser light.
In some embodiments, the energy of a single pulse of the probing laser is 1mJ to 16mJ, the pulse width of the probing laser is 5ns to 8ns, and the repetition rate of the probing laser is 1kHz to 2 kHz.
Based on the same concept, the present disclosure further provides a method for detecting internal defects of a plastic package structure, which corresponds to any of the above-described embodiments, and as shown in fig. 4, the method specifically includes the following steps:
And 402, acquiring feedback sound waves which are received by the receiving probe and are detected in the plastic package structure by the detection sound waves by the processor, and determining the defects in the plastic package structure according to the feedback sound waves.
The method of the foregoing embodiment is applied to the plastic package structure internal defect detection device corresponding to the foregoing embodiment, and the description of the specific content included in the foregoing steps and the corresponding beneficial effects have been already related to the foregoing embodiment of the plastic package structure internal defect detection device, so details are not described again in this embodiment.
In some application scenes, the detection laser is specially limited to be suitable for various plastic package structure materials, and the detection laser achieves a better detection effect. The wavelength of the detection laser is 1064nm, the single pulse energy of the detection laser is 1 mJ-16 mJ, the pulse width of the detection laser is 5 ns-8 ns, and the repetition frequency of the detection laser is 1 kHz-2 kHz.
In some application scenarios, in order to adapt to different detection environments, even in severe environments such as high temperature, high pressure, corrosion, etc., the receiving probe can preferably receive the feedback sound wave by means of laser. Namely, the receiving probe is a vibration measuring laser capable of emitting interference laser with the wavelength of 1500nm to 1600 nm; the processor obtains feedback sound waves which are received by the receiving probe and are detected and completed in the plastic package structure, and the feedback sound waves comprise: the vibration measuring laser receives the feedback sound wave through the interference of the interference laser and the feedback sound wave to generate a receiving signal; the processor acquires the received signal.
It should be noted that, the embodiments of the present disclosure can be further described by the following ways:
in some embodiments, the detection laser has a wavelength of 1064nm, a single pulse energy of 1mJ to 16mJ, a pulse width of 5ns to 8ns, and a repetition rate of 1kHz to 2 kHz.
In some embodiments, the receiving probe is a vibration measuring laser capable of emitting interference laser light with a wavelength of 1500nm to 1600 nm;
the processor obtains feedback sound waves which are received by the receiving probe and are detected and completed in the plastic package structure, and the feedback sound waves comprise:
the vibration measuring laser receives the feedback sound wave through the interference of the interference laser and the feedback sound wave to generate a receiving signal;
the processor acquires the received signal.
Based on the same concept, the present disclosure also provides a non-transitory computer-readable storage medium storing computer instructions for causing a computer to execute a method for detecting internal defects of a plastic package structure according to any of the above embodiments, corresponding to any of the above embodiments.
Computer-readable media of the present embodiments, including both non-transitory and non-transitory, removable and non-removable media, may implement information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), Read Only Memory (ROM), Electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), Digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information that can be accessed by a computing device.
The computer instructions stored in the storage medium of the foregoing embodiment are used to enable the computer to execute the method for detecting the internal defect of the plastic package structure according to any one of the foregoing embodiments, and have the beneficial effects of the corresponding method embodiments, which are not described herein again.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the idea of the present disclosure, also technical features in the above embodiments or in different embodiments may be combined, steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present disclosure as described above, which are not provided in detail for the sake of brevity.
In addition, well-known power/ground connections to Integrated Circuit (IC) chips and other components may or may not be shown in the provided figures for simplicity of illustration and discussion, and so as not to obscure the embodiments of the disclosure. Furthermore, devices may be shown in block diagram form in order to avoid obscuring embodiments of the present disclosure, and this also takes into account the fact that specifics with respect to implementation of such block diagram devices are highly dependent upon the platform within which the embodiments of the present disclosure are to be implemented (i.e., specifics should be well within purview of one skilled in the art). Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the disclosure, it should be apparent to one skilled in the art that the embodiments of the disclosure can be practiced without, or with variation of, these specific details. Accordingly, the description is to be regarded as illustrative instead of restrictive.
While the present disclosure has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art in light of the foregoing description. For example, other memory architectures (e.g., dynamic ram (dram)) may use the discussed embodiments.
The disclosed embodiments are intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalents, improvements, and the like that may be made within the spirit and principles of the embodiments of the disclosure are intended to be included within the scope of the disclosure.
Claims (10)
1. The utility model provides a plastic envelope structure internal defect check out test set, is applied to the plastic envelope structure including the plastic envelope shell, includes:
the detection probe is arranged outside the plastic package structure and is configured to emit detection laser with the wavelength of 1000nm to 1100nm and irradiated on the plastic package shell, so that the plastic package shell generates detection sound waves under the irradiation of the detection laser;
the receiving probe is arranged outside the plastic package structure and beside the detection probe and is configured to be capable of receiving feedback sound waves after the detection of the detection sound waves in the plastic package structure is completed;
and the processor is in communication connection with the detection probe and the receiving probe and is configured to analyze the feedback sound waves to determine the defects in the plastic package structure.
2. The apparatus of claim 1, wherein the receiving probe is a vibration measuring laser capable of emitting interfering laser light having a wavelength of 1500nm to 1600 nm;
the vibration measuring laser is configured to receive the feedback sound wave through interference of the interference laser and the feedback sound wave.
3. The apparatus of claim 2, wherein the interfering laser light has a wavelength of 1550 nm.
4. The apparatus of claim 1, wherein the probe laser has a wavelength of 1064 nm.
5. The apparatus of claim 1, wherein the probe comprises:
a laser configured to generate raw laser light;
the laser collimator is connected with the laser through a transmission optical fiber and is configured to receive the original laser diffused after being transmitted by the transmission optical fiber and convert the diffused original laser into parallel laser;
a focusing lens configured to receive the parallel laser light and focus the parallel laser light;
a scanning galvanometer configured to receive the focused parallel laser light and generate scanning laser light;
a beam splitter configured to receive the scanning laser light for splitting to generate the detection laser light.
6. The apparatus of claim 1, wherein the probing laser has a single pulse energy of 1mJ to 16mJ, a pulse width of 5ns to 8ns, and a repetition rate of 1kHz to 2 kHz.
7. A method for detecting internal defects of a plastic package structure comprises the following steps:
the processor controls the detection probe to emit detection laser with the wavelength of 1000nm to 1100nm to the plastic package structure according to the input instruction, so that the plastic package shell of the plastic package structure generates detection sound waves under the irradiation of the detection laser;
the processor obtains feedback sound waves which are received by the receiving probe and are detected in the plastic package structure, and the defects in the plastic package structure are determined according to the feedback sound waves.
8. The method of claim 7, wherein the probe laser has a wavelength of 1064nm, a single pulse energy of 1mJ to 16mJ, a pulse width of 5ns to 8ns, and a repetition rate of 1kHz to 2 kHz.
9. The method of claim 7, wherein the receiving probe is a vibration measuring laser capable of emitting interfering laser light having a wavelength of 1500nm to 1600 nm;
the processor obtains feedback sound waves which are received by the receiving probe and are detected and completed in the plastic package structure, and the feedback sound waves comprise:
the vibration measuring laser receives the feedback sound wave through the interference of the interference laser and the feedback sound wave to generate a receiving signal;
the processor acquires the received signal.
10. A non-transitory computer-readable storage medium storing computer instructions for causing a computer to implement the method of any one of claims 7 to 9.
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