CN113316309A - Flexible circuit board, manufacturing method and device thereof and computer equipment - Google Patents
Flexible circuit board, manufacturing method and device thereof and computer equipment Download PDFInfo
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- CN113316309A CN113316309A CN202110443796.8A CN202110443796A CN113316309A CN 113316309 A CN113316309 A CN 113316309A CN 202110443796 A CN202110443796 A CN 202110443796A CN 113316309 A CN113316309 A CN 113316309A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 87
- 229910052751 metal Inorganic materials 0.000 claims abstract description 87
- 229910000679 solder Inorganic materials 0.000 claims abstract description 46
- 239000002131 composite material Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000000059 patterning Methods 0.000 claims abstract description 14
- 238000005530 etching Methods 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 29
- 239000004642 Polyimide Substances 0.000 claims description 19
- 229920001721 polyimide Polymers 0.000 claims description 19
- 239000011889 copper foil Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 238000005553 drilling Methods 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 6
- 238000004590 computer program Methods 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 9
- 229910052802 copper Inorganic materials 0.000 description 15
- 239000010949 copper Substances 0.000 description 15
- 230000007774 longterm Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 229920000620 organic polymer Polymers 0.000 description 6
- 239000002861 polymer material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a flexible circuit board, a manufacturing method and a manufacturing device thereof, and computer equipment. Wherein, the flexible wiring board includes: the flexible substrate layer, the composite dielectric layer, the metal circuit pattern layer, the electrode layer, the solder mask layer and the circuit buried in the electrode layer are sequentially stacked from bottom to top, wherein a preset number of pad areas are reserved on the upper surface of the solder mask layer, the metal circuit pattern layer and the pattern layer can be sequentially stacked from bottom to top, the metal circuit layer can be made of a wet film, the pattern layer after circuit patterning is used as a mask to etch the metal circuit layer, and a circuit pattern matched with a circuit pattern corresponding to the pattern layer is formed. Through the mode, the service life of the flexible circuit board can be prolonged.
Description
Technical Field
The invention relates to the technical field of flexible circuit boards, in particular to a flexible circuit board, a manufacturing method and a manufacturing device thereof, and computer equipment.
Background
In recent years, electronic products are increasingly developed in a direction of small size, light weight and complex function. Printed Circuit Boards (PCBs) are essential basic components of electronic products, and provide interconnection of electrical signals and support for electronic components. Especially, Flexible Printed Circuit (FPC) is one of the most vigorous industries.
However, in the existing flexible circuit board, a copper etching mode is generally adopted during the preparation, and the adopted copper etching mode generally needs pretreatment, but the pretreatment needs a certain time, so that the efficiency of preparing the flexible circuit board is general; and the adopted copper etching mode generally generates copper etching liquid, and the copper etching liquid has certain corrosivity, so that the service life of the prepared flexible circuit board is general.
Disclosure of Invention
In view of this, the present invention provides a flexible printed circuit, a method and an apparatus for manufacturing the same, and a computer device, which can improve the service life of the flexible printed circuit.
According to an aspect of the present invention, there is provided a flexible wiring board including: the circuit comprises a flexible substrate layer, a composite dielectric layer, a metal circuit pattern layer, an electrode layer, a solder mask layer and a circuit embedded in the electrode layer, wherein the flexible substrate layer, the composite dielectric layer, the metal circuit pattern layer, the electrode layer and the solder mask layer are sequentially stacked from bottom to top; the upper surface of the solder mask layer is reserved with a preset number of pad areas; the metal circuit pattern layer comprises a metal circuit layer and a pattern layer which are sequentially stacked from bottom to top; the material of the graphic layer is a wet film, and the graphic layer after the circuit patterning is used as a mask to etch the metal circuit layer, so as to form a metal circuit pattern matched with the circuit pattern corresponding to the graphic layer.
Wherein the material of the solder mask layer is polyimide.
Wherein the electrode layer is a copper foil.
According to another aspect of the present invention, there is provided a method of manufacturing a flexible wiring board, including: providing a flexible substrate layer; attaching a composite dielectric layer on the flexible substrate layer; laminating a metal circuit pattern layer integrated with a metal circuit layer and a pattern layer which are sequentially laminated from bottom to top on the composite dielectric layer; wherein the pattern layer is made of a wet film; etching the metal circuit layer by taking the patterned circuit layer as a mask to form a metal circuit pattern matched with the circuit pattern corresponding to the patterned circuit layer; adding an electrode layer on the etched metal circuit pattern layer in an electroplating mode; embedding a circuit on the electrode layer in a laser drilling mode; and manufacturing a solder mask layer on the upper surface of the electrode layer after the circuit is embedded, and reserving a preset number of pad areas on the upper surface of the solder mask layer.
Wherein the material of the solder mask layer is polyimide.
Wherein the electrode layer is a copper foil.
According to still another aspect of the present invention, there is provided a manufacturing apparatus of a flexible wiring board, including: providing a module, an attaching module, a fitting module, an etching module, an adding module, a burying module and a manufacturing module; the providing module is used for providing a flexible substrate layer; the attaching module is used for attaching a composite dielectric layer on the flexible substrate layer; the bonding module is used for bonding the metal circuit pattern layer integrated with the metal circuit layer and the pattern layer which are sequentially stacked from bottom to top onto the composite dielectric layer; wherein the pattern layer is made of a wet film; the etching module is used for etching the metal circuit layer by taking the patterned circuit layer as a mask to form a metal circuit pattern matched with the circuit pattern corresponding to the patterned circuit layer; the adding module is used for adding an electrode layer on the etched metal circuit pattern layer in an electroplating mode; the embedded module is used for embedding a circuit on the electrode layer in a laser drilling mode; and the manufacturing module is used for manufacturing a solder mask on the upper surface of the electrode layer after the circuit is embedded, and reserving a preset number of pad areas on the upper surface of the solder mask.
Wherein the material of the solder mask layer is polyimide.
According to still another aspect of the present invention, there is provided a computer apparatus comprising: at least one processor; and a memory communicatively coupled to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being executable by the at least one processor to enable the at least one processor to perform the method of manufacturing a flexible wiring board according to any of the above.
According to still another aspect of the present invention, there is provided a computer-readable storage medium storing a computer program which, when executed by a processor, implements the method of manufacturing a flexible wiring board as described in any one of the above.
It can be found that, in the above aspect, the flexible wiring board may include a flexible substrate layer, a composite dielectric layer, a metal wiring pattern layer, an electrode layer, a solder resist layer, and a wiring embedded in the electrode layer, which are stacked in this order from bottom to top, wherein, a preset number of pad areas are reserved on the upper surface of the solder mask layer, the metal circuit pattern layer can comprise a metal circuit layer and a pattern layer which are sequentially stacked from bottom to top, the material of the pattern layer can be a wet film, the metal circuit layer is etched by taking the pattern layer after circuit patterning as a mask, a metal circuit pattern matched with the circuit pattern corresponding to the pattern layer is formed, etching can be carried out in a copper etching avoiding mode, the metal circuit layer can be etched by taking the pattern layer after circuit patterning as the mask, and the service life of the flexible circuit board can be prolonged.
Furthermore, according to the scheme, the material of the solder mask layer can be polyimide, so that the polyimide material is one of organic polymer materials with the best comprehensive performance, can resist high temperature of more than 400 ℃, has a long-term use temperature range of-200-300 ℃, has no obvious melting point, has high insulating property, and can prolong the service life of the flexible circuit board.
Furthermore, according to the scheme, the electrode layer can be made of copper foil, so that the copper foil can protect the current collector, and the service life of the flexible circuit board can be prolonged.
Further, the above scheme can provide a flexible substrate layer, and can attach a composite dielectric layer on the flexible substrate layer, and can attach a metal circuit pattern layer integrated by a metal circuit layer and a pattern layer which are sequentially stacked from bottom to top on the composite dielectric layer, wherein the material of the pattern layer is a wet film, and can etch the metal circuit layer by taking the pattern layer after circuit patterning as a mask to form a metal circuit pattern matched with the circuit pattern corresponding to the pattern layer, and can add an electrode layer on the etched metal circuit pattern layer by electroplating, and can bury a circuit on the electrode layer by laser drilling, and can make a solder mask on the upper surface of the electrode layer after circuit burying, and reserve a preset number of pad areas on the upper surface of the solder mask, the method can realize that the metal circuit layer is etched by taking the patterned layer after the circuit is patterned as a mask instead of etching in a copper etching mode, can avoid the time required by the pretreatment of etching in the copper etching mode, and can improve the efficiency of preparing the flexible circuit board.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of a flexible printed circuit board according to the present invention;
FIG. 2 is a schematic flow chart of an embodiment of a method for manufacturing a flexible printed circuit board according to the present invention;
FIG. 3 is a schematic structural diagram of an embodiment of an apparatus for manufacturing a flexible printed circuit board according to the present invention;
FIG. 4 is a schematic structural diagram of an embodiment of the computer apparatus of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be noted that the following examples are only illustrative of the present invention, and do not limit the scope of the present invention. Similarly, the following examples are only some but not all examples of the present invention, and all other examples obtained by those skilled in the art without any inventive work are within the scope of the present invention.
The invention provides a flexible circuit board, which can prolong the service life of the flexible circuit board.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a flexible printed circuit according to an embodiment of the invention. In this embodiment, the flexible wiring board 10 includes a flexible substrate layer 11, a composite dielectric layer 12, a metal wiring pattern layer 13, an electrode layer 14, a solder resist layer 15, and a wiring 16 embedded in the electrode layer 14, which are stacked in this order from bottom to top; wherein, a preset number of pad regions are reserved on the upper surface of the solder mask layer 15.
The metal circuit pattern layer 13 comprises a metal circuit layer 131 and a pattern layer 132 which are sequentially stacked from bottom to top; the material of the pattern layer 132 is a wet film, and the metal circuit layer 131 is etched by using the pattern layer 132 after the circuit patterning as a mask, so as to form a metal circuit pattern matched with the circuit pattern corresponding to the pattern layer 132.
Optionally, the solder mask layer 15 is made of polyimide, which is one of organic polymer materials with the best comprehensive performance, and has the advantages of high temperature resistance of more than 400 ℃, long-term use temperature range of-200 to 300 ℃, no obvious melting point, high insulating property and capability of prolonging the service life of the flexible circuit board.
Alternatively, the electrode layer 14 is a copper foil, which is advantageous in that the copper foil can protect the current collector, thereby prolonging the service life of the flexible circuit board.
In this embodiment, the copper foil may be a roll annealed copper, a deposited copper foil, or the like, and the present invention is not limited thereto.
It can be seen that, in the present embodiment, the flexible wiring board may include a flexible substrate layer, a composite dielectric layer, a metal wiring pattern layer, an electrode layer, a solder resist layer, and a wiring embedded in the electrode layer, which are stacked in this order from bottom to top, wherein, a preset number of pad areas are reserved on the upper surface of the solder mask layer, the metal circuit pattern layer can comprise a metal circuit layer and a pattern layer which are sequentially stacked from bottom to top, the material of the pattern layer can be a wet film, the metal circuit layer is etched by taking the pattern layer after circuit patterning as a mask, a metal circuit pattern matched with the circuit pattern corresponding to the pattern layer is formed, etching can be carried out in a copper etching avoiding mode, the metal circuit layer can be etched by taking the pattern layer after circuit patterning as the mask, and the service life of the flexible circuit board can be prolonged.
Furthermore, in the embodiment, the material of the solder mask layer can be polyimide, which has the advantages that the polyimide material is one of organic polymer materials with the best comprehensive performance, the polyimide material can resist high temperature of more than 400 ℃, the long-term use temperature range is-200 to 300 ℃, no obvious melting point exists, the polyimide material has high insulating performance, and the service life of the flexible circuit board can be prolonged.
Further, in this embodiment, the electrode layer may be a copper foil, which is advantageous in that the copper foil can protect the current collector, thereby prolonging the service life of the flexible circuit board.
The invention also provides a preparation method of the flexible circuit board, which can improve the efficiency of preparing the flexible circuit board.
Referring to fig. 2, fig. 2 is a schematic flow chart of an embodiment of a method for manufacturing a flexible printed circuit board according to the present invention. It should be noted that the method of the present invention is not limited to the flow sequence shown in fig. 2 if the results are substantially the same. As shown in fig. 2, the method comprises the steps of:
s201: a flexible substrate layer is provided.
S202: a composite dielectric layer is attached to the flexible substrate layer.
S203: laminating a metal circuit pattern layer integrated with a metal circuit layer and a pattern layer which are sequentially laminated from bottom to top on the composite dielectric layer; wherein, the material of the pattern layer is a wet film.
S204: and etching the metal circuit layer by taking the patterned circuit layer as a mask to form a metal circuit pattern matched with the circuit pattern corresponding to the patterned circuit layer.
S205: and adding an electrode layer on the etched metal circuit pattern layer in an electroplating mode.
S206: and embedding a circuit on the electrode layer by means of laser drilling.
S207: and manufacturing a solder mask layer on the upper surface of the electrode layer after the circuit is embedded, and reserving a preset number of pad areas on the upper surface of the solder mask layer.
The material of the solder mask is polyimide, so that the polyimide material is one of organic polymer materials with the best comprehensive performance, has high temperature resistance of more than 400 ℃, long-term use temperature range of-200-300 ℃, no obvious melting point, high insulating property and can prolong the service life of the flexible circuit board.
The electrode layer is made of copper foil, so that the copper foil can protect the current collector, and the service life of the flexible circuit board can be prolonged.
It can be found that, in this embodiment, a flexible substrate layer can be provided, a composite dielectric layer can be attached on the flexible substrate layer, and a metal circuit pattern layer which integrates a metal circuit layer and a pattern layer which are sequentially stacked from bottom to top can be attached on the composite dielectric layer, wherein the material of the pattern layer is a wet film, the metal circuit layer can be etched by using the pattern layer after circuit patterning as a mask to form a metal circuit pattern matched with the circuit pattern corresponding to the pattern layer, an electrode layer can be added on the etched metal circuit pattern layer by electroplating, a circuit can be embedded on the electrode layer by laser drilling, a solder mask can be made on the upper surface of the electrode layer after circuit embedding, and a predetermined number of pad regions are reserved on the upper surface of the solder mask, the method can realize that the metal circuit layer is etched by taking the patterned layer after the circuit is patterned as a mask instead of etching in a copper etching mode, can avoid the time required by the pretreatment of etching in the copper etching mode, and can improve the efficiency of preparing the flexible circuit board.
The invention also provides a device for preparing the flexible circuit board, which can improve the efficiency of preparing the flexible circuit board.
Referring to fig. 3, fig. 3 is a schematic structural diagram of an embodiment of a device for manufacturing a flexible printed circuit board according to the present invention. In this embodiment, the device 30 for manufacturing a flexible printed circuit board includes a providing module 31, an attaching module 32, an attaching module 33, an etching module 34, an adding module 35, an embedding module 36, and a manufacturing module 37.
The providing module 31 is used for providing a flexible substrate layer.
The attaching module 32 is used for attaching a composite dielectric layer on the flexible substrate layer.
The attaching module 33 is used for attaching the metal circuit pattern layer formed by integrating the metal circuit layer and the pattern layer which are sequentially stacked from bottom to top to the composite dielectric layer; wherein, the material of the pattern layer is a wet film.
The etching module 34 is configured to etch the metal circuit layer by using the patterned circuit layer after the circuit patterning as a mask, so as to form a metal circuit pattern matched with the circuit pattern corresponding to the patterned circuit layer.
The adding module 35 is configured to add an electrode layer on the etched metal circuit pattern layer by electroplating.
The embedding module 36 is used for embedding a circuit on the electrode layer by means of laser drilling.
The manufacturing module 37 is configured to manufacture a solder mask layer on the upper surface of the electrode layer after the circuit is embedded, and reserve a preset number of pad regions on the upper surface of the solder mask layer.
The material of the solder mask is polyimide, so that the polyimide material is one of organic polymer materials with the best comprehensive performance, has high temperature resistance of more than 400 ℃, long-term use temperature range of-200-300 ℃, no obvious melting point, high insulating property and can prolong the service life of the flexible circuit board.
The electrode layer is made of copper foil, so that the copper foil can protect the current collector, and the service life of the flexible circuit board can be prolonged.
Each unit module of the device 30 for preparing a flexible printed circuit board can respectively execute the corresponding steps in the above method embodiments, and therefore, the detailed description of each unit module is omitted here, and please refer to the description of the corresponding steps above.
The present invention further provides a computer device, as shown in fig. 4, comprising: at least one processor 41; and, a memory 42 communicatively coupled to the at least one processor 41; the memory 42 stores instructions executable by the at least one processor 41, and the instructions are executed by the at least one processor 41, so that the at least one processor 41 can execute the above method for manufacturing a flexible printed circuit board.
Where memory 42 and processor 41 are coupled in a bus, the bus may comprise any number of interconnected buses and bridges that couple one or more of the various circuits of processor 41 and memory 42 together. The bus may also connect various other circuits such as peripherals, voltage regulators, power management circuits, and the like, which are well known in the art, and therefore, will not be described any further herein. A bus interface provides an interface between the bus and the transceiver. The transceiver may be one element or a plurality of elements, such as a plurality of receivers and transmitters, providing a means for communicating with various other apparatus over a transmission medium. The data processed by the processor 41 is transmitted over a wireless medium through an antenna, which further receives the data and transmits the data to the processor 41.
The present invention further provides a computer-readable storage medium storing a computer program. The computer program realizes the above-described method embodiments when executed by a processor.
It can be found that, in the above aspect, the flexible wiring board may include a flexible substrate layer, a composite dielectric layer, a metal wiring pattern layer, an electrode layer, a solder resist layer, and a wiring embedded in the electrode layer, which are stacked in this order from bottom to top, wherein, a preset number of pad areas are reserved on the upper surface of the solder mask layer, the metal circuit pattern layer can comprise a metal circuit layer and a pattern layer which are sequentially stacked from bottom to top, the material of the pattern layer can be a wet film, the metal circuit layer is etched by taking the pattern layer after circuit patterning as a mask, a metal circuit pattern matched with the circuit pattern corresponding to the pattern layer is formed, etching can be carried out in a copper etching avoiding mode, the metal circuit layer can be etched by taking the pattern layer after circuit patterning as the mask, and the service life of the flexible circuit board can be prolonged.
Furthermore, according to the scheme, the material of the solder mask layer can be polyimide, so that the polyimide material is one of organic polymer materials with the best comprehensive performance, can resist high temperature of more than 400 ℃, has a long-term use temperature range of-200-300 ℃, has no obvious melting point, has high insulating property, and can prolong the service life of the flexible circuit board.
Furthermore, according to the scheme, the electrode layer can be made of copper foil, so that the copper foil can protect the current collector, and the service life of the flexible circuit board can be prolonged.
Further, the above scheme can provide a flexible substrate layer, and can attach a composite dielectric layer on the flexible substrate layer, and can attach a metal circuit pattern layer integrated by a metal circuit layer and a pattern layer which are sequentially stacked from bottom to top on the composite dielectric layer, wherein the material of the pattern layer is a wet film, and can etch the metal circuit layer by taking the pattern layer after circuit patterning as a mask to form a metal circuit pattern matched with the circuit pattern corresponding to the pattern layer, and can add an electrode layer on the etched metal circuit pattern layer by electroplating, and can bury a circuit on the electrode layer by laser drilling, and can make a solder mask on the upper surface of the electrode layer after circuit burying, and reserve a preset number of pad areas on the upper surface of the solder mask, the method can realize that the metal circuit layer is etched by taking the patterned layer after the circuit is patterned as a mask instead of etching in a copper etching mode, can avoid the time required by the pretreatment of etching in the copper etching mode, and can improve the efficiency of preparing the flexible circuit board.
In the several embodiments provided in the present invention, it should be understood that the disclosed system, apparatus and method may be implemented in other manners. For example, the above-described apparatus embodiments are merely illustrative, and for example, a division of a module or a unit is merely a logical division, and an actual implementation may have another division, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
Units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention may be substantially or partially implemented in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, a network device, or the like) or a processor (processor) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
The above description is only a part of the embodiments of the present invention, and not intended to limit the scope of the present invention, and all equivalent devices or equivalent processes performed by the present invention through the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A flexible wiring board, comprising:
the circuit comprises a flexible substrate layer, a composite dielectric layer, a metal circuit pattern layer, an electrode layer, a solder mask layer and a circuit embedded in the electrode layer, wherein the flexible substrate layer, the composite dielectric layer, the metal circuit pattern layer, the electrode layer and the solder mask layer are sequentially stacked from bottom to top; the upper surface of the solder mask layer is reserved with a preset number of pad areas;
the metal circuit pattern layer comprises a metal circuit layer and a pattern layer which are sequentially stacked from bottom to top; the material of the graphic layer is a wet film, and the graphic layer after the circuit patterning is used as a mask to etch the metal circuit layer, so as to form a metal circuit pattern matched with the circuit pattern corresponding to the graphic layer.
2. The flexible wiring board of claim 1, wherein the material of said solder resist layer is polyimide.
3. The flexible wiring board of claim 1, wherein said electrode layer is copper foil.
4. A method for manufacturing a flexible circuit board is characterized by comprising the following steps:
providing a flexible substrate layer;
attaching a composite dielectric layer on the flexible substrate layer;
laminating a metal circuit pattern layer integrated with a metal circuit layer and a pattern layer which are sequentially laminated from bottom to top on the composite dielectric layer; wherein the pattern layer is made of a wet film;
etching the metal circuit layer by taking the patterned circuit layer as a mask to form a metal circuit pattern matched with the circuit pattern corresponding to the patterned circuit layer;
adding an electrode layer on the etched metal circuit pattern layer in an electroplating mode;
embedding a circuit on the electrode layer in a laser drilling mode;
and manufacturing a solder mask layer on the upper surface of the electrode layer after the circuit is embedded, and reserving a preset number of pad areas on the upper surface of the solder mask layer.
5. The method for manufacturing a flexible wiring board according to claim 4, wherein the material of the solder resist layer is polyimide.
6. The method of manufacturing a flexible wiring board according to claim 4, wherein the electrode layer is a copper foil.
7. A manufacturing device of a flexible circuit board is characterized by comprising:
providing a module, an attaching module, a fitting module, an etching module, an adding module, a burying module and a manufacturing module;
the providing module is used for providing a flexible substrate layer;
the attaching module is used for attaching a composite dielectric layer on the flexible substrate layer;
the bonding module is used for bonding the metal circuit pattern layer integrated with the metal circuit layer and the pattern layer which are sequentially stacked from bottom to top onto the composite dielectric layer; wherein the pattern layer is made of a wet film;
the etching module is used for etching the metal circuit layer by taking the patterned circuit layer as a mask to form a metal circuit pattern matched with the circuit pattern corresponding to the patterned circuit layer;
the adding module is used for adding an electrode layer on the etched metal circuit pattern layer in an electroplating mode;
the embedded module is used for embedding a circuit on the electrode layer in a laser drilling mode;
and the manufacturing module is used for manufacturing a solder mask on the upper surface of the electrode layer after the circuit is embedded, and reserving a preset number of pad areas on the upper surface of the solder mask.
8. The manufacturing apparatus of a flexible wiring board according to claim 7, wherein a material of said solder resist layer is polyimide.
9. A computer device, comprising:
at least one processor; and the number of the first and second groups,
a memory communicatively coupled to the at least one processor; wherein,
the memory stores instructions executable by the at least one processor to enable the at least one processor to perform the method of manufacturing a flexible wiring board according to any one of claims 4 to 6.
10. A computer-readable storage medium storing a computer program, wherein the computer program is executed by a processor to implement the method for manufacturing a flexible wiring board according to any one of claims 4 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110443796.8A CN113316309A (en) | 2021-04-23 | 2021-04-23 | Flexible circuit board, manufacturing method and device thereof and computer equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110443796.8A CN113316309A (en) | 2021-04-23 | 2021-04-23 | Flexible circuit board, manufacturing method and device thereof and computer equipment |
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| CN113316309A true CN113316309A (en) | 2021-08-27 |
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| CN202110443796.8A Pending CN113316309A (en) | 2021-04-23 | 2021-04-23 | Flexible circuit board, manufacturing method and device thereof and computer equipment |
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Citations (4)
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|---|---|---|---|---|
| BE833267A (en) * | 1974-09-10 | 1975-12-31 | METHOD FOR MANUFACTURING A WIRING FOR MULTIPLE PELLETS | |
| CA2018208A1 (en) * | 1989-06-16 | 1990-12-16 | Albert Ott | Method of manufacturing printed circuit boards |
| CN101322448A (en) * | 2005-10-14 | 2008-12-10 | 宇部兴产株式会社 | Process for producing metal wiring board |
| CN104105351A (en) * | 2013-04-12 | 2014-10-15 | 安诺电子股份有限公司 | Method for manufacturing flexible antenna device |
-
2021
- 2021-04-23 CN CN202110443796.8A patent/CN113316309A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE833267A (en) * | 1974-09-10 | 1975-12-31 | METHOD FOR MANUFACTURING A WIRING FOR MULTIPLE PELLETS | |
| CA2018208A1 (en) * | 1989-06-16 | 1990-12-16 | Albert Ott | Method of manufacturing printed circuit boards |
| CN101322448A (en) * | 2005-10-14 | 2008-12-10 | 宇部兴产株式会社 | Process for producing metal wiring board |
| CN104105351A (en) * | 2013-04-12 | 2014-10-15 | 安诺电子股份有限公司 | Method for manufacturing flexible antenna device |
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