CN113307626A - Preparation method of graphene heat dissipation material with high infrared emissivity - Google Patents
Preparation method of graphene heat dissipation material with high infrared emissivity Download PDFInfo
- Publication number
- CN113307626A CN113307626A CN202110647291.3A CN202110647291A CN113307626A CN 113307626 A CN113307626 A CN 113307626A CN 202110647291 A CN202110647291 A CN 202110647291A CN 113307626 A CN113307626 A CN 113307626A
- Authority
- CN
- China
- Prior art keywords
- graphene
- preparation
- heat dissipation
- steps
- dissipation material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
- C04B35/522—Graphite
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/638—Removal thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/5072—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials with oxides or hydroxides not covered by C04B41/5025
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/87—Ceramics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6562—Heating rate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/95—Products characterised by their size, e.g. microceramics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/963—Surface properties, e.g. surface roughness
- C04B2235/9638—Tolerance; Dimensional accuracy
Abstract
A preparation method of a graphene heat dissipation material with high infrared emissivity belongs to the technical field of materials. The invention aims to solve the problem of low thermal emissivity of a graphene plate, and the method comprises the following steps: carrying out vacuum freezing treatment on the graphene slurry; pre-pressing the graphene block after freeze drying; carrying out vacuum degreasing treatment on the graphene pre-pressed block; carrying out vacuum hot-pressing sintering treatment on the degreased graphene pre-pressed block; carrying out high-temperature graphitization treatment on the graphene plate after vacuum hot pressing sintering; machining the graphene plate in a machining center; polishing the surface of the graphene plate by using a mechanical flat grinder; preheating a graphene plate by using a heating table; uniformly spraying a thermal radiation coating on the surface of the graphene plate by using a spray gun; and curing the sprayed graphene plate. The preparation method of the graphene heat dissipation material with high infrared emissivity is firm in coating and bonding, high in heat radiation coefficient, simple in process and easy to realize.
Description
Technical Field
The invention belongs to the technical field of materials, and particularly relates to a preparation method of a graphene heat dissipation material with high infrared emissivity.
Background
Graphene, as a carbon material, has a unique set of properties: ultrahigh electric conductivity, super-large heat conductivity, extremely large specific surface area, strong wave-absorbing capacity and the like. The graphene plate is formed by stacking layers of graphene, the problem of high heat conduction of macroscopic materials is solved due to the graphene plate, the graphene plate has great significance for heat dissipation development of electronic devices, and the graphene plate has a very deep application prospect from aerospace to smart phones. However, the biggest problem in applying the graphene board to the field of electronic devices is that due to the characteristics of the graphene board, the thermal emissivity of the surface of the graphene board is very low, and therefore, heat cannot be better spread out. Therefore, finding an effective method to improve the thermal emissivity of the graphene plate has great significance for the application of the graphene plate in the fields of electronic devices and the like.
Disclosure of Invention
The invention aims to solve the problem of low thermal emissivity of a graphene plate and provides a preparation method of a graphene heat dissipation material with high infrared emissivity.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a preparation method of a graphene heat dissipation material with high infrared emissivity comprises the following specific steps:
the method comprises the following steps: carrying out vacuum freezing treatment on the graphene slurry;
step two: pre-pressing the graphene block after freeze drying;
step three: carrying out vacuum degreasing treatment on the graphene pre-pressed block;
step four: carrying out vacuum hot-pressing sintering treatment on the degreased graphene pre-pressed block;
step five: carrying out high-temperature graphitization treatment on the graphene plate after vacuum hot pressing sintering;
step six: machining the graphene plate in a machining center;
step seven: polishing the surface of the graphene plate by using a mechanical flat grinder;
step eight: preheating a graphene plate by using a heating table;
step nine: uniformly spraying a thermal radiation coating on the surface of the graphene plate by using a spray gun; the heat radiation coating layer includes: zirconium dioxide, ferric oxide, chromium oxide, silicon dioxide and graphene powder according to the ratio of 2-3: 1: 1-2: 1: 1-2.
Step ten: and curing the sprayed graphene plate.
Further, in the step one, the vacuum freezing treatment is to gradually increase the temperature from-45 ℃ to 45 ℃, and the temperature increase rate is 1-2 ℃/h.
Further, in the second step, the pre-pressure treatment is to gradually increase the pressure from 0t to 10t at a pressure increasing rate of 1t-1.5t/h (the pressure increasing rate can be adjusted freely within the range).
Further, in the third step, the temperature of the vacuum degreasing is gradually increased from 600 ℃ to 1100 ℃, and the temperature increasing rate is 10-15 ℃/min (the temperature increasing rate is randomly adjusted in the range).
Further, in the fourth step, the sintering temperature is gradually increased from 2000 ℃ to 2600 ℃, and the temperature increasing rate is 7-10 ℃/min (the temperature increasing rate is adjusted freely in the range).
Further, in the fifth step, the high temperature is gradually increased from 2500 ℃ to 2900 ℃, and the temperature increasing rate is 5-10 ℃/min (the temperature increasing rate is randomly adjusted in the range).
Further, in the sixth step, the thickness of the processed graphene plate is controlled to be 2-3mm, the length is controlled to be 75mm +/-0.2 mm, the width is controlled to be 25 +/-0.25 mm, and the surface roughness is controlled to be Ra1.6.
Further, in the seventh step, the rough oversize Ra 12.5 after polishing; in step eight, the preheating temperature is 60 ℃ to 70 ℃ (which can be used in the temperature range).
Further, in the ninth step, the thickness of the coating is 3 μm to 5 μm.
Further, in the tenth step, the curing is specifically room temperature curing for 30min, and then curing at 250 ℃ for 30 min.
Compared with the prior art, the invention has the beneficial effects that: the heat conductivity and the heat dissipation efficiency of the surface are improved; the preparation method of the graphene heat dissipation material with high infrared emissivity is firm in coating and bonding, high in heat radiation coefficient, simple in process and easy to realize. According to practical application, the emissivity can be accurately controlled in different areas, and the coating is simple and convenient, firm in coating and combination and high in emissivity.
Drawings
FIG. 1 is a thermal infrared image spectrum of a thermal radiation coating without spraying;
FIG. 2 is a thermal infrared image spectrum of the thermal radiation coating sprayed in example 1;
FIG. 3 is a thermal infrared image spectrum of the thermal radiation coating sprayed in example 2;
fig. 4 is a thermal infrared image of the thermal radiation coating sprayed in example 3.
Detailed Description
The technical solutions of the present invention are further described below with reference to the drawings and the embodiments, but the present invention is not limited thereto, and modifications or equivalent substitutions may be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Example 1:
1) carrying out vacuum freezing treatment on the graphene slurry at the temperature of-45 ℃, and gradually heating at the heating rate of 1.5 ℃/h;
2) pre-pressing the frozen and dried graphene block body for 0t to 10t, gradually increasing the pressure, wherein the pressure increasing rate is 1.5 t/h;
3) carrying out vacuum degreasing treatment on the graphene pre-pressed block, heating the temperature to 1100 ℃ at a heating rate of 13 ℃/min;
4) carrying out vacuum hot-pressing sintering treatment on the degreased graphene pre-pressed block at 2000 ℃ to 2600 ℃, wherein the heating rate is 8 ℃/min;
5) carrying out high-temperature graphitization treatment on the graphene plate subjected to vacuum hot pressing sintering at 2500 ℃ to 2900 ℃, wherein the heating rate is 7 ℃/min;
6) machining a graphene plate in a machining center, wherein the thickness is controlled to be 2-3mm, the length is controlled to be 75mm +/-0.2 mm, the width is controlled to be 25 +/-0.25 mm, and the surface thickness and the surface super-roughness are controlled to be Ra1.6;
7) polishing the surface of the graphene plate by using a mechanical flat grinder, wherein the roughness is Ra 12.5;
8) preheating a graphene plate to 70 ℃ by using a heating table;
9) uniformly spraying a thermal radiation coating on the surface of the graphene plate by using a spray gun, wherein the thickness is controlled to be 3-5 μm; the radiation coating comprises: the zirconium dioxide, the ferric oxide, the chromium oxide, the silicon dioxide and the graphene powder are mixed according to the ratio of 3:1:1:1: 1.
10) And curing the sprayed graphene plate at room temperature for 30min, and then curing at 250 ℃ for 30 min.
11) Testing the thermal emissivity: and measuring the thermal emissivity of the graphene plate sprayed with the thermal radiation coating by using an infrared thermal imager under the condition that the temperature of the sample is 400 ℃. The thermal emissivity of the thermal radiation coated graphene sheet was measured to be 0.37 higher than that of the uncoated graphene sheet, as shown in fig. 2.
Example 2:
(1) carrying out vacuum freezing treatment on the graphene slurry at the temperature of-45 ℃, and gradually heating at the heating rate of 1-2 ℃/h;
(2) pre-pressing the frozen and dried graphene block body for 0t to 10t, gradually increasing the pressure, wherein the pressure increasing rate is 1.5 t/h;
(3) carrying out vacuum degreasing treatment on the graphene pre-pressed block, heating the temperature to 1100 ℃ at a heating rate of 10 ℃/min;
(4) carrying out vacuum hot-pressing sintering treatment on the degreased graphene pre-pressed block at 2000 ℃ to 2600 ℃, wherein the heating rate is 7 ℃/min;
(5) carrying out high-temperature graphitization treatment on the graphene plate subjected to vacuum hot pressing sintering at 2500 ℃ to 2900 ℃, wherein the heating rate is 5 ℃/min;
(6) machining a graphene plate in a machining center, wherein the thickness is controlled to be 2-3mm, the length is controlled to be 75mm +/-0.2 mm, the width is controlled to be 25 +/-0.25 mm, and the surface thickness and the surface super-roughness are controlled to be Ra1.6;
(7) polishing the surface of the graphene plate by using a mechanical flat grinder, wherein the roughness is Ra 12.5;
(8) preheating a graphene plate to 70 ℃ by using a heating table;
(9) uniformly spraying a thermal radiation coating on the surface of the graphene plate by using a spray gun, wherein the thickness is controlled to be 3-5 μm; the radiation coating comprises: zirconium dioxide, ferric oxide, chromium oxide, silicon dioxide and graphene powder are mixed according to the ratio of 2:1:1.5:1: 1.5.
(10) And curing the sprayed graphene plate at room temperature for 30min, and then curing at 250 ℃ for 30 min.
(11) Testing the thermal emissivity: and measuring the thermal emissivity of the graphene plate sprayed with the thermal radiation coating by using an infrared thermal imager under the condition that the temperature of the sample is 400 ℃. The thermal emissivity of the graphene sheet coated with the thermal radiation coating was measured to be 0.40 higher than that of the uncoated graphene sheet, as shown in fig. 3.
Example 3:
(1) carrying out vacuum freezing treatment on the graphene slurry at the temperature of-45 ℃, and gradually heating at the heating rate of 1-2 ℃/h;
(2) pre-pressing the frozen and dried graphene block body for 0t to 10t, gradually increasing the pressure, wherein the pressure increasing rate is 1 t/h;
(3) carrying out vacuum degreasing treatment on the graphene pre-pressed block, heating the temperature to 1100 ℃ at a heating rate of 15 ℃/min;
(4) carrying out vacuum hot-pressing sintering treatment on the degreased graphene pre-pressed block at 2000 ℃ to 2600 ℃, wherein the heating rate is 10 ℃/min;
(5) carrying out high-temperature graphitization treatment on the graphene plate subjected to vacuum hot pressing sintering at 2500 ℃ to 2900 ℃, wherein the heating rate is 10 ℃/min;
(6) machining a graphene plate in a machining center, wherein the thickness is controlled to be 2-3mm, the length is controlled to be 75mm +/-0.2 mm, the width is controlled to be 25 +/-0.25 mm, and the surface thickness and the surface super-roughness are controlled to be Ra1.6;
(7) polishing the surface of the graphene plate by using a mechanical flat grinder, wherein the roughness is Ra 12.5;
(8) preheating a graphene plate to 65 ℃ by using a heating table;
(9) uniformly spraying a thermal radiation coating on the surface of the graphene plate by using a spray gun, wherein the thickness is controlled to be 3-5 μm; the radiation coating comprises: the zirconium dioxide, the ferric oxide, the chromium oxide, the silicon dioxide and the graphene powder are mixed according to the ratio of 2:1:2:1: 2.
(10) And curing the sprayed graphene plate at room temperature for 30min, and then curing at 250 ℃ for 30 min.
(11) Testing the thermal emissivity: and measuring the thermal emissivity of the graphene plate sprayed with the thermal radiation coating by using an infrared thermal imager under the condition that the temperature of the sample is 400 ℃. The thermal emissivity of the graphene sheet coated with the thermal radiation coating was measured to be 0.43 higher than that of the uncoated graphene sheet, as shown in fig. 4.
Claims (10)
1. A preparation method of a graphene heat dissipation material with high infrared emissivity is characterized by comprising the following steps: the method specifically comprises the following steps:
the method comprises the following steps: carrying out vacuum freezing treatment on the graphene slurry;
step two: pre-pressing the graphene block after freeze drying;
step three: carrying out vacuum degreasing treatment on the graphene pre-pressed block;
step four: carrying out vacuum hot-pressing sintering treatment on the degreased graphene pre-pressed block;
step five: carrying out high-temperature graphitization treatment on the graphene plate after vacuum hot pressing sintering;
step six: machining the graphene plate in a machining center;
step seven: polishing the surface of the graphene plate by using a mechanical flat grinder;
step eight: preheating a graphene plate by using a heating table;
step nine: uniformly spraying a thermal radiation coating on the surface of the graphene plate by using a spray gun; the heat radiation coating layer includes: zirconium dioxide, ferric oxide, chromium oxide, silicon dioxide and graphene powder according to the ratio of 2-3: 1: 1-2: 1: 1-2, proportioning;
step ten: and curing the sprayed graphene plate.
2. The preparation method of the graphene heat dissipation material with high infrared emissivity as claimed in claim 1, wherein the preparation method comprises the following steps: in the first step, the vacuum freezing treatment is to gradually increase the temperature from-45 ℃ to 45 ℃, and the temperature increase rate is 1-2 ℃/h.
3. The preparation method of the graphene heat dissipation material with high infrared emissivity as claimed in claim 1, wherein the preparation method comprises the following steps: in the second step, the pre-pressing treatment is to gradually increase the pressure from 0t to 10t, and the pressure increasing rate is 1t-1.5 t/h.
4. The preparation method of the graphene heat dissipation material with high infrared emissivity as claimed in claim 1, wherein the preparation method comprises the following steps: in the third step, the temperature of the vacuum degreasing is gradually increased from 600 ℃ to 1100 ℃, and the temperature increasing rate is 10-15 ℃/min.
5. The preparation method of the graphene heat dissipation material with high infrared emissivity as claimed in claim 1, wherein the preparation method comprises the following steps: in the fourth step, the sintering temperature is gradually increased from 2000 ℃ to 2600 ℃, and the temperature increasing rate is 7-10 ℃/min.
6. The preparation method of the graphene heat dissipation material with high infrared emissivity as claimed in claim 1, wherein the preparation method comprises the following steps: in the fifth step, the temperature is gradually increased from 2500 ℃ to 2900 ℃, and the temperature increasing rate is 5-10 ℃/min.
7. The preparation method of the graphene heat dissipation material with high infrared emissivity as claimed in claim 1, wherein the preparation method comprises the following steps: in the sixth step, the thickness of the processed graphene plate is controlled to be 2-3mm, the length is controlled to be 75mm +/-0.2 mm, the width is controlled to be 25 +/-0.25 mm, and the surface roughness is controlled to be Ra1.6.
8. The preparation method of the graphene heat dissipation material with high infrared emissivity as claimed in claim 1, wherein the preparation method comprises the following steps: step seven, the rough excess Ra 12.5 after polishing; in the eighth step, the preheating temperature is 60-70 ℃.
9. The preparation method of the graphene heat dissipation material with high infrared emissivity as claimed in claim 1, wherein the preparation method comprises the following steps: in the ninth step, the thickness of the coating is 3 μm to 5 μm.
10. The preparation method of the graphene heat dissipation material with high infrared emissivity as claimed in claim 1, wherein the preparation method comprises the following steps: in the step ten, the curing is specifically room temperature curing for 30min, and then curing at 250 ℃ for 30 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110647291.3A CN113307626A (en) | 2021-06-10 | 2021-06-10 | Preparation method of graphene heat dissipation material with high infrared emissivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110647291.3A CN113307626A (en) | 2021-06-10 | 2021-06-10 | Preparation method of graphene heat dissipation material with high infrared emissivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113307626A true CN113307626A (en) | 2021-08-27 |
Family
ID=77378039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110647291.3A Pending CN113307626A (en) | 2021-06-10 | 2021-06-10 | Preparation method of graphene heat dissipation material with high infrared emissivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113307626A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105514066A (en) * | 2016-01-19 | 2016-04-20 | 合肥微晶材料科技有限公司 | Composite graphene infrared radiation and heat conduction film and manufacturing method thereof |
| US20170015092A1 (en) * | 2014-04-04 | 2017-01-19 | Avic Beijing Institute Of Aeronautical Materials | Preparation method of graphene/metal composite board |
| CN106629675A (en) * | 2016-09-28 | 2017-05-10 | 上海理工大学 | Preparation method of high-heat-conduction flexible graphene film |
| CN106967392A (en) * | 2017-04-28 | 2017-07-21 | 哈尔滨赫兹新材料科技有限公司 | The hot three-dimensional grapheme heat sink material of high-strength highly-conductive and its construction method |
| CN107010618A (en) * | 2017-04-28 | 2017-08-04 | 哈尔滨工业大学 | The preparation method and radiating film of a kind of high starch breeding alkene radiating film |
| CN108172554A (en) * | 2018-03-27 | 2018-06-15 | 梧州三和新材料科技有限公司 | A kind of high heat conduction and high-heating radiation piece and preparation method thereof |
| CN109880408A (en) * | 2019-01-19 | 2019-06-14 | 深圳市国创珈伟石墨烯科技有限公司 | A kind of inorganic modified high temperature resistant high emissivity graphene coating and preparation method thereof |
| CN110550956A (en) * | 2019-09-25 | 2019-12-10 | 深圳烯创先进材料研究院有限公司 | preparation method of graphene-polyimide-based composite sponge precursor heat-conducting film |
-
2021
- 2021-06-10 CN CN202110647291.3A patent/CN113307626A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170015092A1 (en) * | 2014-04-04 | 2017-01-19 | Avic Beijing Institute Of Aeronautical Materials | Preparation method of graphene/metal composite board |
| CN105514066A (en) * | 2016-01-19 | 2016-04-20 | 合肥微晶材料科技有限公司 | Composite graphene infrared radiation and heat conduction film and manufacturing method thereof |
| CN106629675A (en) * | 2016-09-28 | 2017-05-10 | 上海理工大学 | Preparation method of high-heat-conduction flexible graphene film |
| CN106967392A (en) * | 2017-04-28 | 2017-07-21 | 哈尔滨赫兹新材料科技有限公司 | The hot three-dimensional grapheme heat sink material of high-strength highly-conductive and its construction method |
| CN107010618A (en) * | 2017-04-28 | 2017-08-04 | 哈尔滨工业大学 | The preparation method and radiating film of a kind of high starch breeding alkene radiating film |
| CN108172554A (en) * | 2018-03-27 | 2018-06-15 | 梧州三和新材料科技有限公司 | A kind of high heat conduction and high-heating radiation piece and preparation method thereof |
| CN109880408A (en) * | 2019-01-19 | 2019-06-14 | 深圳市国创珈伟石墨烯科技有限公司 | A kind of inorganic modified high temperature resistant high emissivity graphene coating and preparation method thereof |
| CN110550956A (en) * | 2019-09-25 | 2019-12-10 | 深圳烯创先进材料研究院有限公司 | preparation method of graphene-polyimide-based composite sponge precursor heat-conducting film |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108242312B (en) | Iron-based soft magnetic composite material and preparation method thereof | |
| CN108329037A (en) | A kind of SiC/Si3N4The preparation method of composite wave-absorbing ceramics | |
| WO2021135681A1 (en) | Method for preparing nitride target material | |
| CN115028460B (en) | Preparation method of high-heat-conductivity silicon nitride ceramic substrate | |
| CN105692601A (en) | Method for preparing graphene blocks and graphene blocks prepared by same | |
| CN104961463A (en) | Niobium oxide rotating target and preparing method of niobium oxide rotating target | |
| CN103204682B (en) | High thermal conductive aluminum nitride ceramic heat dissipation substrate and preparation method thereof | |
| JP2020521712A (en) | High thermal conductivity polyimide-based composite carbon film and method for producing the same | |
| CN113307626A (en) | Preparation method of graphene heat dissipation material with high infrared emissivity | |
| CN107500794A (en) | A kind of in-situ preparation silicon carbide fibre silicon carbide high-abrasive material and preparation method thereof | |
| CN105777081B (en) | A kind of preparation process of heat transmission electronic ceramics substrate | |
| CN103253939B (en) | Preparation method of carbon-silicon carbide composite material | |
| CN113122189A (en) | Heat-conducting composite material, preparation method and application thereof | |
| CN115583835B (en) | Low-porosity high-mechanical-strength carbon graphite material and preparation method thereof | |
| CN115504787A (en) | Preparation method of graphene/artificial graphite composite heat-conducting film | |
| CN106179923B (en) | The preparation method of graphene metallic composite | |
| CN115028466A (en) | Carbon fiber composite material and preparation method thereof | |
| CN113122188A (en) | Heat-conducting composite material, preparation method and application thereof | |
| CN103011821B (en) | Preparation method of h-BN/TiC machinable ceramics | |
| CN102976761B (en) | Preparation method of h-BN (hexagonal boron nitride)/ZrC machinable ceramics | |
| CN111916694A (en) | Preparation method of graphene iron-based composite material | |
| CN102992769B (en) | Preparation method of h-BN/TaC machinable ceramic | |
| CN110004442A (en) | A kind of superconduction composite plate and its manufacturing method | |
| CN113666363A (en) | Preparation method of graphene oxide material with high thermal radiation coefficient and high electromagnetic shielding | |
| CN103011826A (en) | Preparation method of h-BN/ZrB2 machinable ceramics |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |