CN113305734A - Flexible grinding head suitable for single-side polishing of silicon wafer - Google Patents
Flexible grinding head suitable for single-side polishing of silicon wafer Download PDFInfo
- Publication number
- CN113305734A CN113305734A CN202110614400.1A CN202110614400A CN113305734A CN 113305734 A CN113305734 A CN 113305734A CN 202110614400 A CN202110614400 A CN 202110614400A CN 113305734 A CN113305734 A CN 113305734A
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- China
- Prior art keywords
- disc
- transition
- main shaft
- flexible
- grinding head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention relates to the technical field of grinding. A flexible grinding head suitable for single-side polishing of a silicon wafer comprises a driving disc, wherein the center of the driving disc is provided with a mounting hole connected with a rotating main shaft; the transition disc is connected with the rotating main shaft through a bearing, the transition disc is in transmission connection with the driving disc, and springs which are circumferentially distributed are arranged between the transition disc and the driving disc; still include the abrasive disc, the outward flange of abrasive disc links to each other through the flexible band with the outward flange of transition dish, and the centre of abrasive disc passes through joint bearing and links to each other with rotatory main shaft. This patent is through increasing the transition dish to use flexible material, connect the transmission, avoided traditional hard connected mode, to the influence of processing product, improve the quality of product. In the rotating process, the rotating main shaft drives the driving disc to rotate, the driving disc drives the transition disc to rotate, and the transition disc drives the grinding disc to rotate through the flexible belt.
Description
Technical Field
The invention relates to the technical field of grinding, in particular to a flexible grinding head.
Background
The grinding head of the single-side polishing machine is in hard connection with the rotating pin through the turntable to carry out transmission, and the mode easily generates impact during operation and has great influence on precision machining products requiring flatness of 2 microns.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a flexible grinding head suitable for single-side polishing of a silicon wafer, so as to solve at least one technical problem.
In order to achieve the aim, the invention provides a flexible grinding head suitable for polishing the single surface of a silicon wafer, which is characterized by comprising a driving disc, wherein the center of the driving disc is provided with a mounting hole connected with a rotating main shaft;
the transition disc is connected with the rotating main shaft through a self-aligning bearing, the transition disc is in transmission connection with the driving disc, and springs which are circumferentially distributed are arranged between the transition disc and the driving disc;
the grinding device is characterized by further comprising a grinding disc, the outer edge of the grinding disc is connected with the outer edge of the transition disc through a flexible belt, and the center of the grinding disc is connected with the rotating main shaft through a joint bearing.
This patent is through increasing the transition dish to use flexible material, connect the transmission, avoided traditional hard connected mode, to the influence of processing product, improve the quality of product.
In the rotating process, the rotating main shaft drives the driving disc to rotate, the driving disc drives the transition disc to rotate, and the transition disc drives the grinding disc to rotate through the flexible belt.
Further preferably, the flexible belt type transition piece further comprises an adjusting handle, the adjusting handle is in threaded connection with the transition plate, and the end portion of the adjusting handle is connected with the flexible belt.
The tension of the flexible belt can be adjusted conveniently by rotating the adjusting handle.
Preferably, the transition disc is provided with at least eight circumferentially arranged threaded holes, and the threaded holes are in threaded connection with the adjusting handle.
The transmission effect of the grinding disc is convenient to ensure.
Further preferably, 12 threaded holes are provided.
Further preferably, a guide sleeve is fixed on the transition disc and fixed on the periphery of the lower end of the threaded hole.
The outer wrapping protection of the top of the flexible belt is realized, and the abrasion of the top of the flexible belt is avoided.
Further preferably, the inner wall of the guide sleeve is in a conical shape with a narrow top and a wide bottom.
Preferably, at least eight jacks which are circumferentially arranged are formed in the transition disc;
the driving disc is connected with positioning rods matched with the jacks in number, and the positioning rods are inserted into the jacks.
The transmission connection between the driving disc and the transition disc is convenient to realize.
Preferably, the center of the grinding disc is provided with an installation groove for installing a joint bearing;
the opening of the mounting groove faces upwards.
The installation of joint bearing is convenient to realize.
Preferably, the center of the driving disk is provided with a bearing installation groove for embedding the self-aligning bearing, and the top of the bearing installation groove is provided with a through hole for the rotating spindle to pass through;
the bearing mounting groove is used for limiting the adjusting bearing.
The relative spacing between self-aligning bearing and the driving disk is convenient to realize.
Further preferably, the outer diameter of the rotating main shaft decreases in a stepped manner from top to bottom;
the rotating main shaft comprises an upper part, a middle part and a lower part which are sequentially connected from top to bottom;
the lower end face of the lower part is abutted against the upper end face of the driving disc;
the top of the middle part is connected with the driving disc;
the lower portion is connected to the joint bearing.
Drawings
FIG. 1 is a cross-sectional view of the present invention;
FIG. 2 is a top view of the present invention;
FIG. 3 is a schematic view of a combined run-out measuring mechanism according to the present invention.
Wherein, 1 is the rotating main shaft, 2 is the initiative dish, 3 is balance spring, 4 is adjustment handle, 5 is the transition dish, 6 is the flexible band, 7 is self-aligning bearing, 8 is joint bearing, 9 is the abrasive disc, 10 is the installing support, 11 is infrared distance meter, 12 is the slide bar.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
Referring to fig. 1 to 2, embodiment 1: a flexible grinding head suitable for single-side polishing of a silicon wafer comprises a driving disc 2, wherein the center of the driving disc 2 is provided with a mounting hole connected with a rotating main shaft 1; the transition disc 5 is connected with the rotating main shaft 1 through a self-aligning bearing 7 in the center, the transition disc 5 is in transmission connection with the driving disc 2, and springs 3 which are circumferentially distributed are arranged between the transition disc 5 and the driving disc 2; and the grinding disc 9 is further included, the outer edge of the grinding disc 9 is connected with the outer edge of the transition disc 5 through the flexible belt 6, and the center of the grinding disc 9 is connected with the rotating main shaft 1 through the joint bearing 8. This patent is through increasing transition dish 5 to use flexible material, connect the transmission, avoided traditional hard connected mode, to the influence of processing product, improve the quality of product.
In the rotation process, the rotating main shaft 1 drives the driving disc 2 to rotate, the driving disc 2 drives the transition disc 5 to rotate, and the transition disc 5 drives the grinding disc 9 to rotate through the flexible belt 6.
Still include adjustment handle 4, adjustment handle 4 and transition dish 5 threaded connection, the tip of adjustment handle 4 links to each other with flexible area 6. The tension of the flexible belt 6 can be conveniently adjusted by rotating the adjusting handle 4.
At least eight circumferentially arranged threaded holes are formed in the transition disc 5 and are in threaded connection with the adjusting handle 4. The transmission effect of the grinding disc 9 is convenient to ensure.
12 threaded holes are provided.
A guide sleeve is fixed on the transition disc 5 and fixed at the periphery of the lower end of the threaded hole. The outsourcing protection of the top of the flexible belt 6 is realized, and the abrasion of the top of the flexible belt 6 is avoided. The inner wall of the guide sleeve is in a conical shape with a narrow top and a wide bottom.
At least eight jacks which are circumferentially arranged are formed in the transition disc 5; the driving disc 2 is connected with positioning rods matched with the number of the jacks, and the positioning rods are inserted into the jacks. The transmission connection between the driving disk 2 and the transition disk 5 is convenient to realize. The external diameter of jack is greater than the external diameter of locating lever.
The center of the grinding disc 9 is provided with a mounting groove for mounting the joint bearing 8; the opening of the mounting groove faces upwards. The installation of the oscillating bearing 8 is facilitated.
A bearing installation groove for embedding the self-aligning bearing is formed in the center of the driving disc 2, and a through hole for the rotating main shaft 1 to pass through is formed in the top of the bearing installation groove; the bearing mounting groove is used for limiting the adjusting bearing. The relative spacing between the self-aligning bearing and the driving disk 2 is convenient to realize.
The outer diameter of the rotating main shaft 1 is gradually reduced from top to bottom in a step shape; the rotating main shaft 1 comprises an upper part, a middle part and a lower part which are sequentially connected from top to bottom; the lower end surface of the lower part is abutted against the upper end surface of the driving disc 2; the top of the middle part is connected with the driving disc 2; the lower part is connected with a joint bearing 8.
Referring to fig. 3, in order to detect the rotation of the grinding disc, the polishing apparatus further includes a run-out measuring mechanism, the run-out measuring mechanism is fixedly mounted beside the grinding disc, the run-out detecting mechanism includes a mounting bracket 10 and a slide bar 12 slidably connected to the mounting bracket 10, a nut is detachably connected to the top of the slide bar, and the lower end of the nut abuts against the mounting bracket. The periphery of the sliding rod 12 is sleeved with a spring, the upper end of the spring is abutted against the mounting bracket, and the sliding rod is provided with an annular bulge abutting against the lower end of the spring. Still install infrared distance meter 11 on the installing support, infrared distance meter and slide bar set up from top to bottom, infrared distance meter 11 is used for measuring the slide bar up-and-down motion condition. Thereby realizing the jumping condition of the grinding disc in the rotating process. The run-out measuring devices are preferably provided in two, the two run-out measuring devices being arranged mirror-symmetrically.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that it is obvious to those skilled in the art that various modifications and improvements can be made without departing from the principle of the present invention, and these modifications and improvements should also be considered as the protection scope of the present invention.
Claims (10)
1. The flexible grinding head is suitable for polishing the single surface of a silicon wafer and is characterized by comprising a driving disc, wherein the center of the driving disc is provided with a mounting hole connected with a rotating main shaft;
the transition disc is connected with the rotating main shaft through a self-aligning bearing, the transition disc is in transmission connection with the driving disc, and springs which are circumferentially distributed are arranged between the transition disc and the driving disc;
the grinding device is characterized by further comprising a grinding disc, the outer edge of the grinding disc is connected with the outer edge of the transition disc through a flexible belt, and the center of the grinding disc is connected with the rotating main shaft through a joint bearing.
2. The flexible grinding head suitable for single-side polishing of silicon wafers as claimed in claim 1, wherein: still include adjustment handle, adjustment handle with transition dish threaded connection, adjustment handle's tip with flexible area links to each other.
3. The flexible grinding head suitable for single-side polishing of silicon wafers as claimed in claim 2, wherein: at least eight threaded holes which are circumferentially arranged are formed in the transition disc and are in threaded connection with the adjusting handle.
4. The flexible grinding head suitable for single-sided polishing of silicon wafers as recited in claim 3, wherein: the threaded holes are provided with 12.
5. The flexible grinding head suitable for single-side polishing of silicon wafers as claimed in claim 1, wherein: and a guide sleeve is fixed on the transition disc and is fixed on the periphery of the lower end of the threaded hole.
6. The flexible grinding head suitable for single-sided polishing of silicon wafers as recited in claim 5, wherein: the inner wall of the guide sleeve is in a conical shape with a narrow top and a wide bottom.
7. The flexible grinding head suitable for single-side polishing of silicon wafers as claimed in claim 1, wherein: at least eight jacks which are circumferentially arranged are formed in the transition disc;
the driving disc is connected with positioning rods matched with the jacks in number, and the positioning rods are inserted into the jacks.
8. The flexible grinding head suitable for single-side polishing of silicon wafers as claimed in claim 1, wherein: the center of the grinding disc is provided with an installation groove for installing a joint bearing;
the opening of the mounting groove faces upwards.
9. The flexible grinding head suitable for single-side polishing of silicon wafers as claimed in claim 1, wherein: the center of the driving disc is provided with a bearing installation groove for embedding the self-aligning bearing, and the top of the bearing installation groove is provided with a through hole for the rotating main shaft to pass through;
the bearing mounting groove is used for limiting the adjusting bearing.
10. The flexible grinding head suitable for single-side polishing of silicon wafers as claimed in claim 1, wherein: the outer diameter of the rotating main shaft is gradually reduced from top to bottom in a step shape;
the rotating main shaft comprises an upper part, a middle part and a lower part which are sequentially connected from top to bottom;
the lower end face of the lower part is abutted against the upper end face of the driving disc;
the top of the middle part is connected with the driving disc;
the lower portion is connected to the joint bearing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110614400.1A CN113305734A (en) | 2021-06-02 | 2021-06-02 | Flexible grinding head suitable for single-side polishing of silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110614400.1A CN113305734A (en) | 2021-06-02 | 2021-06-02 | Flexible grinding head suitable for single-side polishing of silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113305734A true CN113305734A (en) | 2021-08-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110614400.1A Pending CN113305734A (en) | 2021-06-02 | 2021-06-02 | Flexible grinding head suitable for single-side polishing of silicon wafer |
Country Status (1)
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| CN (1) | CN113305734A (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060025054A1 (en) * | 2004-08-02 | 2006-02-02 | Mayes Brett A | Systems and methods for actuating end effectors to condition polishing pads used for polishing microfeature workpieces |
| CN202062286U (en) * | 2011-05-14 | 2011-12-07 | 湖南省古丈惠闽石业有限公司 | Novel grinding head |
| CN103506904A (en) * | 2013-09-17 | 2014-01-15 | 洛阳轴研科技股份有限公司 | Improved structure and using method of device for two end face grinding of thin-wall bearing ring |
| CN103949448A (en) * | 2014-04-15 | 2014-07-30 | 临沂鑫盛利机械有限公司 | Environment-friendly efficient cement bin cleaning equipment |
| CN104772701A (en) * | 2015-03-27 | 2015-07-15 | 苏州赫瑞特电子专用设备科技有限公司 | Universal aligning and loading mechanism for upper plate of double-sided polishing machine |
| CN206952756U (en) * | 2017-06-07 | 2018-02-02 | 上海汉虹精密机械有限公司 | Disk transmission device on single-sided lapping machine |
| WO2018050168A1 (en) * | 2016-09-14 | 2018-03-22 | Ergo-Fit Gmbh & Co. Kg | Device for producing a resisting force on training appliances with ventilated brake device |
| CN108890408A (en) * | 2018-09-27 | 2018-11-27 | 吉林大学 | A kind of device of ultrasonic wave added grinding and polishing silicon carbide wafer |
| CN110561408A (en) * | 2019-10-17 | 2019-12-13 | 盐城瑞力达科技有限公司 | Robot system |
| CN210650078U (en) * | 2019-07-25 | 2020-06-02 | 南通环宇体育用品有限公司 | Body-building apparatus lag epidermis grinding device |
| CN212553323U (en) * | 2020-04-29 | 2021-02-19 | 宝山钢铁股份有限公司 | Polishing head for strip steel polisher |
-
2021
- 2021-06-02 CN CN202110614400.1A patent/CN113305734A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060025054A1 (en) * | 2004-08-02 | 2006-02-02 | Mayes Brett A | Systems and methods for actuating end effectors to condition polishing pads used for polishing microfeature workpieces |
| CN202062286U (en) * | 2011-05-14 | 2011-12-07 | 湖南省古丈惠闽石业有限公司 | Novel grinding head |
| CN103506904A (en) * | 2013-09-17 | 2014-01-15 | 洛阳轴研科技股份有限公司 | Improved structure and using method of device for two end face grinding of thin-wall bearing ring |
| CN103949448A (en) * | 2014-04-15 | 2014-07-30 | 临沂鑫盛利机械有限公司 | Environment-friendly efficient cement bin cleaning equipment |
| CN104772701A (en) * | 2015-03-27 | 2015-07-15 | 苏州赫瑞特电子专用设备科技有限公司 | Universal aligning and loading mechanism for upper plate of double-sided polishing machine |
| WO2018050168A1 (en) * | 2016-09-14 | 2018-03-22 | Ergo-Fit Gmbh & Co. Kg | Device for producing a resisting force on training appliances with ventilated brake device |
| CN206952756U (en) * | 2017-06-07 | 2018-02-02 | 上海汉虹精密机械有限公司 | Disk transmission device on single-sided lapping machine |
| CN108890408A (en) * | 2018-09-27 | 2018-11-27 | 吉林大学 | A kind of device of ultrasonic wave added grinding and polishing silicon carbide wafer |
| CN210650078U (en) * | 2019-07-25 | 2020-06-02 | 南通环宇体育用品有限公司 | Body-building apparatus lag epidermis grinding device |
| CN110561408A (en) * | 2019-10-17 | 2019-12-13 | 盐城瑞力达科技有限公司 | Robot system |
| CN212553323U (en) * | 2020-04-29 | 2021-02-19 | 宝山钢铁股份有限公司 | Polishing head for strip steel polisher |
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Application publication date: 20210827 |