CN113305453A

CN113305453A - High-precision semiconductor frame cutting device and method thereof

Info

Publication number: CN113305453A
Application number: CN202110726899.5A
Authority: CN
Inventors: 刘江; 程勇; 方铭国; 彭博
Original assignee: Shenzhen Taiyan Semiconductor Equipment Co ltd
Current assignee: Shenzhen Taiyan Semiconductor Equipment Co ltd
Priority date: 2021-06-29
Filing date: 2021-06-29
Publication date: 2021-08-27

Abstract

The invention relates to a high-precision semiconductor frame cutting device and a method thereof.A frame assembly, an XYZ motion system, a positioning jig system, a laser and CCD positioning system and a dust removal system are arranged to realize the cutting operation of a product, wherein the XYZ motion system is used for driving the positioning jig system and the laser and CCD positioning system to move horizontally, vertically and vertically, when the product needs to be cut, the product is placed above the positioning jig system, the laser and CCD positioning system is used for carrying out accurate positioning and high-precision cutting on the product, waste materials and dust generated in the cutting process enter a waste material box and are collected by an industrial dust collector, and the high-precision cutting device is high in working efficiency, sanitary and environment-friendly.

Description

High-precision semiconductor frame cutting device and method thereof

Technical Field

The invention relates to the technical field of cutting equipment, in particular to a high-precision semiconductor frame cutting device and a method thereof.

Background

In the semiconductor industry, as semiconductor materials are widely applied in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power conversion and the like, for example, a diode is a device made of a semiconductor, and the importance of the semiconductor is very great from the viewpoint of technological or economic development, and the semiconductor needs to be cut into equal sizes according to the required size during processing, however, the existing semiconductor cutting device has some disadvantages in use, for example, the worker is required to manually move the semiconductor material to the lower part of the cutting knife for cutting, which not only reduces the cutting progress, but also increases the workload of the worker, thereby causing the use efficiency of the cutting device to be reduced, and in addition, the waste and dust generated in the cutting process need to be manually treated, so the working efficiency is low and the environment is not protected.

However, with the further improvement of the living standard of people, the requirements for various precision parts are higher and higher, and the requirements for production processes are also higher and higher, so that it is necessary to provide a high-precision semiconductor frame cutting device and method thereof with high precision to overcome the above defects.

Disclosure of Invention

The invention mainly aims to overcome the defects in the prior art, and provides a high-precision semiconductor frame cutting device which is high in precision, high in speed, small in heat affected zone, not easy to deform and stable in performance, and is used for solving the problems of insufficient precision, low working efficiency and no environmental protection.

In order to achieve the purpose, the technical scheme provided by the invention is as follows: the high-precision semiconductor frame cutting device comprises a rack assembly, an XYZ motion system, a positioning jig system, a laser and CCD positioning system and a dust removal system, wherein the rack assembly comprises a tri-color lamp arranged on the top surface of the rack assembly, a sliding door arranged on the front side surface of the rack assembly, a rack base assembly arranged at the bottom of the rack assembly, a control system arranged on the right side surface of the rack assembly and a driving module arranged above the rack assembly, the XYZ motion system is arranged above the rack base assembly and comprises an x shaft assembly, a Y shaft assembly and a Z shaft assembly, the positioning jig system is arranged on the Y shaft assembly and comprises a material pressing positioning assembly and a fixing frame, the laser and CCD positioning system is arranged on the Z shaft assembly and comprises a laser cutting assembly, a laser and CCD positioning system and a dust removal system, And the dust removal system comprises a waste material box and an industrial dust collector which are arranged below the fixing frame.

As a further aspect of the present invention, there is provided: the three-color lamp is arranged at the upper right corner of the top surface of the frame component, the sliding door is symmetrically provided with two fans along the central axis of the front side surface of the frame component in a reverse direction, the control system is arranged at the right side surface of the frame component through the upper spindle assembly and the lower spindle assembly, the control system is provided with a display, an operating button, a mouse and keyboard and a control system handle, the right side surface of the frame component is provided with a first accommodating groove for fixing and accommodating the control system, the control system is provided with a second accommodating groove for fixing and accommodating the mouse and keyboard, the drive module is provided with a drive module fixing frame, the drive module fixing frame is fixedly provided with a servo motor, a switching power supply and a motion controller, the frame base component comprises a side panel, a square tube, a ground foot, a base and an XZ-axis fixing frame, the side panel, the square tube and the ground foot are respectively provided with 4 blocks, and the side panels are connected through the square tube, be provided with the recess that holds Y axle subassembly on the base, marble slab has all been erect on base and the XZ axle mount, the lower margin is the shock attenuation lower margin.

As a further aspect of the present invention, there is provided: the Y axle subassembly is fixed in the middle of the recess, X axle subassembly and Z axle subassembly are fixed in on the XZ axle mount, be provided with X axle guide rail on the X axle subassembly, be provided with Y axle guide rail on the Y axle subassembly, be provided with Z axle lead screw module on the Z axle subassembly, be provided with left stand, right stand and crossbeam on the XZ axle mount, both ends are fixed in left stand and right stand top surface respectively about the crossbeam bottom surface.

As a further aspect of the present invention, there is provided: the material pressing and positioning assembly comprises a material pressing module and a vacuum chuck module, the material pressing module comprises two material pressing plates and a rotating motor which are arranged in bilateral symmetry, the vacuum chuck module comprises a sucker and two sucker fixing seats which are arranged in bilateral symmetry, a holding tank used for mounting the sucker fixing seats is arranged in the fixing frame, an extending surface is arranged at the periphery of the holding tank, an inclined surface is arranged on the inner side of the extending surface, and a guide groove is formed between the inclined surface and the sucker fixing seats.

As a further aspect of the present invention, there is provided: the number of the suckers is 8.

As a further aspect of the present invention, there is provided: the laser cutting assembly comprises a cutting head and a cutting head fixing assembly, and the CCD positioning system comprises a CCD and a CCD fixing assembly.

As a further aspect of the present invention, there is provided: the utility model discloses a waste material box, including the mount, the mount bottom surface is provided with two mount backup pads and a curb plate that are bilateral symmetry design, the curb plate left and right sides is connected with two mount backup pads respectively, form an open cavity that is used for holding waste material box after two mount backup pads, curb plate and mount are connected, be provided with the handle on waste material box's the panel, be provided with the bin outlet on waste material box's backplate and the curb plate.

As a further aspect of the present invention, there is provided: the bin outlet passes through the blast pipe and sets up the garbage collection mouth on industrial dust collector and be connected with industrial dust collector.

The invention also provides a use method of the high-precision semiconductor frame cutting device, which comprises the following steps:

s1: preparation before operation: checking whether the equipment power supply voltage conforms to the rated voltage of the high-precision semiconductor frame cutting device or not; checking whether the exhaust pipe is normally connected; checking whether other foreign matters exist on the table top of the machine; checking whether the cutting head, the servo motor and the guide rail are abnormal or not;

s2: setting technological parameters: adjusting parameters according to the material to be cut and the thickness, and setting cutting speed, cutting power, cutting frequency, cutting air pressure and cutting gas;

s3: feeding: four corners of the product are placed above a sucker in the vacuum sucker module along the direction of the guide groove, and then the material pressing plate is driven by the rotating motor, so that the product is pressed flat and then is tightly sucked and fixed by the sucker;

s4: initial positioning of products: firstly, setting a cutting head at an end point position to be cut, starting a servo motor, enabling the servo motor to drive the cutting head to move in an accelerating way for a distance in a direction opposite to the cutting direction, continuing to move in a decelerating way for a distance in the direction opposite to the cutting direction until the servo motor stops, then driving the cutting head to move back in the accelerating way for a distance in the cutting direction to the end point position to be cut, and in the process of the distance, not starting CCD (charge coupled device) positioning and not emitting laser;

s5: CCD positioning: starting CCD positioning to enable the CCD to grab Mark points on the product, calculating the position of the product and conveying the product to a PC (personal computer), and finishing accurate positioning of the product;

s6: laser cutting and dust collection: starting laser cutting and industrial dust collector at the same time, the horizontal laser beam emitted by the laser connected with the cutting head is changed into a vertically downward laser beam by a 45-degree total reflection mirror, then is focused by a lens, and is converged into a tiny light spot at a focus, when the light spot is irradiated on the material, the material is heated to vaporization temperature quickly, and is evaporated to form a hole, the hole continuously forms a narrow kerf by blowing away molten waste slag along with the movement of the light beam to the material and matching with auxiliary gas, so that the high precision cutting of the material is completed, dust generated in the cutting process falls into a waste material box and enters the industrial dust collector through an exhaust pipe, and the collection of waste materials is completed.

S7: blanking: after cutting, stopping emitting laser, driving the cutting head to continue to operate at a certain speed reduction distance by the servo motor, and then closing the auxiliary cutting gas; the servo motor drives the cutting head to continuously operate at a certain distance in a speed reducing mode, and the certain distance is not less than the movement distance of the servo motor when the servo motor is decelerated from a constant speed state to zero. The sucking disc top of placing in the vacuum chuck module four angles of product along the direction of guide way drives the pressure flitch through the rotating electrical machines and upwards and rotate certain angle and keep away from the product, loosens the sucking disc, takes off the product, stops industrial dust collector's collection dirt.

As a further aspect of the method for using a high-precision semiconductor frame cutting apparatus according to the present invention, the method is characterized in that: in the step S6, the auxiliary gas is carbon dioxide gas, oxygen, helium, nitrogen or any combination thereof, the width of the cutting seam is 0.05-0.15 mm, and the technological parameters of the laser are set as follows: the cutting speed is 4-8 m/min, the cutting power is 800-12000W, the cutting frequency is 4000-5000 Hz, and the cutting air pressure is 6-10 Bar.

Compared with the prior art, the invention has the beneficial effects that:

this high accuracy semiconductor frame cutting device is through setting up the rack subassembly, XYZ moving system, the positioning jig system, laser and CCD positioning system, dust pelletizing system, and make the rack subassembly top surface be provided with the tristimulus lamp, the leading flank is provided with the push-and-pull door, the bottom is provided with rack base subassembly and right flank and is provided with control system, make the XYZ moving system set up in the top of rack base subassembly, XYZ moving system includes the X axle subassembly, Y axle subassembly and Z axle subassembly, the positioning jig system sets up on the Y axle subassembly, the positioning jig system is including pressing material locating component and mount, laser and CCD positioning system set up on the Z axle subassembly, laser and CCD positioning system include the laser cutting subassembly, CCD positioning system, dust pelletizing system is including setting up waste material box and the industry dust arrester in the mount below. The precision is high, fast, the heat affected zone is little, non-deformable, stable performance, has solved the current problem that conductor frame cutting device solves the precision not enough, has reached the beneficial effect that work efficiency is high, health environmental protection.

Drawings

FIG. 1 is a schematic view of a three-dimensional structure of a high-precision semiconductor frame cutting device according to the present invention;

FIG. 2 is a schematic view of a three-dimensional structure inside a high-precision semiconductor frame cutting device according to the present invention;

FIG. 3 is a second schematic view of the internal three-dimensional structure of a high-precision semiconductor frame cutting device according to the present invention;

FIG. 4 is a schematic perspective view of an XYZ motion system of a high precision semiconductor frame cutting apparatus according to the present invention;

FIG. 5 is a schematic perspective view of a frame base assembly of a high precision semiconductor frame cutting apparatus according to the present invention;

FIG. 6 is a schematic perspective view of an industrial dust collector of a high precision semiconductor frame cutting apparatus according to the present invention;

FIG. 7 is a schematic perspective view of a control system of a high precision semiconductor frame cutting apparatus according to the present invention;

FIG. 8 is a schematic perspective view of a positioning fixture system of a high-precision semiconductor frame cutting device according to the present invention;

FIG. 9 is a schematic perspective view of a pressing and positioning assembly of the high-precision semiconductor frame cutting device according to the present invention;

FIG. 10 is a schematic perspective view of a holder of a high-precision semiconductor frame cutting device according to the present invention;

description of elements in the drawings: 1-a rack assembly; 11-a three-color lamp; 12-a sliding door; 13-a chassis base assembly; 131-side panels; 132-square tube; 133-ground margin; 134-a base; 135-a groove; 136-XZ axis fixing frame; 137-left upright post; 138-right upright post; 139-beam; 14-a control system; 141-an upper shaft assembly; 142-a lower spindle assembly; 143-a display; 144-operating buttons; 145-mouse keyboard; 146-a first receiving groove; 147-a second receiving groove; 148-control system handle; 15-a drive module; 151-drive module fixing frame; 152-a servo motor; 153-switching power supply; 154-a motion controller; 2-XYZ motion systems; 21-X axis assembly; 211-X axis guide rails; 22-Y shaft assembly; 221-Y-axis guide rails; 23-Z shaft assembly; 231-Z axis screw rod module; 3-positioning a jig system; 31-a material pressing positioning component; 311-a pressing module; 312-vacuum chuck module; 314-a nip plate; 315-rotating electrical machine; 316-suction cup; 317-a sucker fixing seat; 32-a fixed mount; 321-accommodating grooves; 322-an extension plane; 323-inclined plane; 324-a guide slot; 4-laser and CCD positioning system; 41-laser cutting assembly; 411-a cutting head; 412-a cutting head fixation assembly; 42-CCD positioning system; 421-CCD; 422-CCD fixing component; 5-a dust removal system; 51-waste cartridge; 511-a mount support plate; 512-side plate; 513 — an open cavity; 514-panel; 515-a handle; 516-a discharge outlet; 52-industrial dust collector; 521-waste collection port.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-10, in an embodiment of the present invention, a high-precision semiconductor frame cutting device includes a rack assembly 1, an XYZ movement system 2, a positioning fixture system 3, a laser and CCD positioning system 4, and a dust removal system 5, where the rack assembly 1 includes a tri-color lamp 11 disposed on a top surface of the rack assembly 1, a sliding door 12 disposed on a front side surface of the rack assembly 1, a rack base assembly 13 disposed at a bottom of the rack assembly 1, a control system 14 disposed on a right side surface of the rack assembly 1, and a driving module 15 disposed above the rack assembly 1, the XYZ movement system 2 is disposed above the rack base assembly 13, the XYZ movement system 2 includes an X shaft assembly 21, a Y shaft assembly 22, and a Z shaft assembly 23, the positioning fixture system 3 is disposed on the Y shaft assembly 22, the positioning fixture system 3 includes a pressing positioning assembly 31 and a fixing frame 32, the laser and CCD positioning system 4 is arranged on the Z-axis assembly 23, the laser and CCD positioning system 4 comprises a laser cutting assembly 41 and a CCD positioning system 42, and the dust removal system 5 comprises a waste material box 51 and an industrial dust collector 52 which are arranged below the fixing frame 32. Wherein XYZ motion system is used for driving positioning jig system 3, and laser and CCD positioning system 4 do level, perpendicular and vertical motion, when needs cut the product, places the product in positioning jig system 3 top, carries out accurate location and high-accuracy close cutting to the product through laser and CCD positioning system again, and waste material and dust that the cutting process produced get into waste material box 51 are collected by industry dust arrester again, reach the effect of removing dust.

Preferably, in the above-mentioned high-precision semiconductor frame cutting device, the three-color lamp 11 is disposed at the upper right corner of the top surface of the frame assembly 1, the sliding door 12 is symmetrically disposed with two fans along the central axis of the front side surface of the frame assembly 1 in the opposite direction, the control system 14 is disposed at the right side surface of the frame assembly 1 through the upper spindle assembly 141 and the lower spindle assembly 142, the control system 14 is provided with the display 143, the operation button 144, the mouse and keyboard 145 and the control system handle 148, the right side surface of the frame assembly 1 is provided with the first accommodating groove 146 for fixing and accommodating the control system 14, the control system 14 is provided with the second accommodating groove 147 for fixing and accommodating the mouse and keyboard 145, the driving module 15 is provided with the driving module fixing frame 151, the driving module fixing frame 151 is fixedly provided with the servo motor 152, the switching power supply 153 and the motion controller, and the frame base assembly 13 includes the side panel 131, Square tube 132, lower margin 133, base 134 and XZ axle mount 136, side board 131, square tube 132, lower margin 133 are provided with 4 respectively, side board 131 passes through square tube 132 and connects, be provided with the recess 135 that holds Y axle subassembly 22 on the base 134, marble slab has all been erect on base 134 and the XZ axle mount 136, lower margin 133 is the shock attenuation lower margin. 1. The marble plates are erected on the base 134 and the XZ shaft fixing frame 136, flatness of the workbench is guaranteed to be more than 0.003mm, precision of the machine is increased on the basis, meanwhile, the weight of the whole machine is heavier than that of ordinary machinery, and the machine can work more stably, in addition, the square tube 132 uses a 100 x 5cm square tube, so that the machine frame has better strength and rigidity, and in addition, damping feet are arranged, and the machine can work more stably.

Preferably, in the above-mentioned high-precision semiconductor frame cutting device, the Y shaft assembly 22 is fixed in the middle of the groove 135, the X shaft assembly 21 and the Z shaft assembly 23 are fixed on an XZ shaft fixing frame 136, the X shaft assembly 21 is provided with an X shaft guide rail 211, the Y shaft assembly 22 is provided with a Y shaft guide rail 221, the Z shaft assembly 23 is provided with a Z shaft lead screw assembly 231, the XZ shaft fixing frame 136 is provided with a left upright post 137, a right upright post 138 and a cross beam 139, and the left and right ends of the bottom surface of the cross beam 139 are respectively fixed on the top surfaces of the left upright post 137 and the right upright post 138. The X-axis assembly 21 and the Y-axis assembly 22 both use Akribis import linear motors, the precision of the Akribis import linear motors reaches more than + -0.0015mm, and the motion of the Akribis import linear motors is more stable and the precision is higher due to the staggered design of the XY axes.

Preferably, foretell high accuracy semiconductor frame cutting device, press material locating component 31 including pressing material module 311, vacuum chuck module 312, press material module 311 including setting up to two pressure flitchs 314 and the rotating electrical machines 315 of bilateral symmetry, vacuum chuck module 312 includes sucking disc 316 and sets up to two sucking disc fixing bases 317 of bilateral symmetry, be provided with the holding tank 321 that is used for installing sucking disc fixing base 317 in the mount 32, holding tank 321 periphery is provided with extends the face 322, it is provided with inclined plane 323 to extend the face 322 inboard, guide way 324 has been formed between inclined plane 323 and the sucking disc fixing base 317. The design of the guide groove 324 enables the product to fall onto the jig more easily, and the equipped pressing module 311 and the vacuum chuck module 312 firstly flatten the product and then suck the product, so as to ensure better cutting flatness.

As a further aspect of the present invention, there is provided: the number of the suction cups 316 is 8. Every four are set up respectively in four angles of sucking disc fixing base 317, satisfy the cutting plane degree of product and can also cut two products simultaneously.

Preferably, in the above-mentioned high-precision semiconductor frame cutting device, the laser cutting assembly 41 includes a cutting head 411 and a cutting head fixing assembly 412, and the CCD positioning system 42 includes a CCD421 and a CCD fixing assembly 422. The use of the side-axis CCD positioning system enables the positioning and cutting to be carried out simultaneously, the productivity is greatly improved, and the QCW cutting head is used in the cutting head 411, so that the laser power is high and the efficiency is high.

Preferably, above-mentioned high accuracy semiconductor frame cutting device, mount 32 bottom surface is provided with two mount backup pads 511 and a curb plate 512 that are bilateral symmetry design, the curb plate 512 left and right sides is connected with two mount backup pads 511 respectively, form an open cavity 513 that is used for holding waste material box 51 after two mount backup pads 511, curb plate 512 and mount 32 are connected, be provided with handle 515 on waste material box 51's the panel 514, be provided with bin outlet 516 on waste material box 51's backplate and the curb plate 512. The large-capacity intelligent waste material box reduces the time for cleaning waste materials and improves the production efficiency.

Preferably, in the above-described high-precision semiconductor frame cutting apparatus, the discharge opening 516 is connected to the industrial dust collector 52 through an exhaust pipe and a scrap collecting opening 521 provided in the industrial dust collector 52. The dust collector generates negative pressure, and dust particles are sucked into the dust collector through hydrodynamics, so that the dust removal effect is achieved.

s1: preparation before operation: checking whether the equipment power supply voltage conforms to the rated voltage of the high-precision semiconductor frame cutting device or not; checking whether the exhaust pipe is normally connected; checking whether other foreign matters exist on the table top of the machine; checking whether the cutting head 411, the servo motor and the guide rail are abnormal;

s3: feeding: four corners of the product are placed above the suction cup 316 in the vacuum suction cup module 312 along the direction of the guide groove 324, and then the material pressing plate 314 is driven by the rotating motor 315, so that the product is pressed flat and then is tightly sucked and fixed by the suction cup 316;

s6: laser cutting and dust collection: starting the laser cutting and industrial dust collector at the same time, changing the horizontal laser beam emitted by the laser connected with the cutting head 411 into a vertically downward laser beam through a 45-degree total reflector, focusing the laser beam through a lens, and gathering the laser beam into a tiny light spot at a focal point, wherein the light spot irradiates on the material to quickly heat the material to a vaporization temperature, and the material is vaporized to form a hole, and the hole continuously forms a narrow kerf by blowing away the molten waste slag along with the movement of the light beam and the auxiliary gas, so that the high precision cutting of the material is completed, and the dust generated in the cutting process falls into a waste material box and enters the industrial dust collector through an exhaust pipe, thereby completing the collection of the waste material.

S7: blanking: after cutting, stopping emitting laser, driving the cutting head to continue to operate at a certain speed reduction distance by the servo motor, and then closing the auxiliary cutting gas; the servo motor drives the cutting head to continuously operate at a certain distance in a speed reducing mode, and the certain distance is not less than the movement distance of the servo motor when the servo motor is decelerated from a constant speed state to zero. Four corners of the product are placed above the suction cup 316 in the vacuum suction cup module 312 along the direction of the guide groove 324, the material pressing plate 314 is driven by the rotating motor 315 to move upwards and rotate for a certain angle to be away from the product, the suction cup is loosened, the product is taken down, and the dust collection of the industrial dust collector is stopped.

Preferably, in the above method for using the high-precision semiconductor frame cutting device, in step S6, the auxiliary gas is carbon dioxide gas, oxygen gas, helium gas, nitrogen gas, or any combination thereof, the kerf width is 0.1mm, and the process parameters of the laser are set as: the cutting speed is 6m/min, the cutting power is 1000W, the cutting frequency is 4500Hz, and the cutting air pressure is 8 Bar.

Preferably, in the above method for using a high-precision semiconductor frame cutting device, in step S6, the auxiliary gas is carbon dioxide gas, oxygen gas, helium gas, nitrogen gas, or any combination thereof, the kerf width is 0.15mm, and the process parameters of the laser are set as: the cutting speed is 8m/min, the cutting power is 12000W, the cutting frequency is 5000Hz, and the cutting air pressure is 10 Bar.

Preferably, in the above method for using the high-precision semiconductor frame cutting device, in step S6, the auxiliary gas is carbon dioxide gas, oxygen gas, helium gas, nitrogen gas, or any combination thereof, the kerf width is 0.05mm, and the process parameters of the laser are set as: the cutting speed is 4m/min, the cutting power is 800W, the cutting frequency is 4000Hz, and the cutting air pressure is 6 Bar.

Preferably, in the above method for using a high-precision semiconductor frame cutting device, in step S6, the auxiliary gas is carbon dioxide gas, oxygen gas, helium gas, nitrogen gas, or any combination thereof, the kerf width is 0.12mm, and the process parameters of the laser are set as: the cutting speed is 5m/min, the cutting power is 900W, the cutting frequency is 4200Hz, and the cutting air pressure is 7 Bar.

The working principle is as follows: this high accuracy semiconductor frame cutting device through by frame subassembly 1, XYZ motion system 2, positioning jig system 3, laser and CCD positioning system 4, dust pelletizing system 5 totally five modules constitute, realizes the cutting operation of product. Wherein the XYZ motion system is used for driving the positioning fixture system 3 and the laser and CCD positioning system 4 to move horizontally, vertically and vertically, when a product is required to be cut, four corners of the product are placed above a sucker 316 in a vacuum sucker module 312 along the direction of a guide groove 324, a material pressing plate 314 is driven by a rotating motor 315, the product is pressed to be flat and then is sucked tightly by the sucker 316, a Mark point on the product is grabbed by a CCD, the position of the product is calculated and is conveyed to a PC, the accurate positioning of the product is completed, finally, a horizontal laser beam emitted by a laser is changed into a vertical downward laser beam through a 45-degree total reflection mirror, the laser beam is focused through a lens, a tiny light spot is converged at a focus, when the light spot is irradiated on the material, the material is quickly heated to a vaporization temperature, a hole is formed by evaporation, the material is moved along with the light beam, and is matched with auxiliary gas (carbon dioxide gas, oxygen, nitrogen and the like) to continuously form a narrow (such as about 0.1 mm) cutting slit, so as to finish high-precision cutting of the material, waste materials and dust generated in the cutting process enter the waste material box 51 through the guide groove 324, and dust particles are sucked into the dust collector through the industrial dust collector through fluid mechanics, so that the working efficiency is high, and the dust collector is sanitary and environment-friendly.

The above detailed description is specific to a possible embodiment of the present invention, but the embodiment is not intended to limit the scope of the present invention, and equivalent implementations or modifications without departing from the technical spirit of the present invention should be included in the scope of the present invention.

Claims

1. The utility model provides a high accuracy semiconductor frame cutting device, includes frame subassembly (1), XYZ moving system (2), positioning jig system (3), laser and CCD positioning system (4), dust pelletizing system (5), its characterized in that: the frame assembly (1) comprises a three-color lamp (11) arranged on the top surface of the frame assembly (1), a sliding door (12) arranged on the front side surface of the frame assembly (1), a frame base assembly (13) arranged at the bottom of the frame assembly (1), a control system (14) arranged on the right side surface of the frame assembly (1) and a driving module (15) arranged above the frame assembly (1), the XYZ motion system (2) is arranged above the frame base assembly (13), the XYZ motion system (2) comprises an X shaft assembly (21), a Y shaft assembly (22) and a Z shaft assembly (23), the positioning jig system (3) is arranged on the Y shaft assembly (22), the positioning jig system (3) comprises a pressing positioning assembly (31) and a fixing frame (32), and the laser and CCD positioning system (4) is arranged on the Z shaft assembly (23), the laser and CCD positioning system (4) comprises a laser cutting assembly (41) and a CCD positioning system (42), and the dust removal system (5) comprises a waste material box (51) and an industrial dust collector (52) which are arranged below the fixing frame (32).

2. The high-precision semiconductor frame cutting device according to claim 1, wherein: the three-color lamp (11) is arranged at the upper right corner of the top surface of the frame assembly (1), two fans are symmetrically arranged on the sliding door (12) along the central axis of the front side surface of the frame assembly (1) in a reverse direction, the control system (14) is arranged on the right side surface of the frame assembly (1) through the upper spindle assembly (141) and the lower spindle assembly (142), the control system (14) is provided with a display (143), an operating button (144), a mouse and keyboard (145) and a control system handle (148), the right side surface of the frame assembly (1) is provided with a first accommodating groove (146) for fixing and accommodating the control system (14), the control system (14) is provided with a second accommodating groove (147) for fixing and accommodating the mouse and keyboard (145), the drive module (15) is provided with a drive module fixing frame (151), and the drive module fixing frame (151) is fixedly provided with a servo motor (152), Switching power supply (153) and motion control ware (154), frame base subassembly (13) are including side board (131), square tube (132), lower margin (133), base (134) and XZ axle mount (136), side board (131), square tube (132), lower margin (133) are provided with 4 respectively, side board (131) are connected through square tube (132), be provided with recess (135) that hold Y axle subassembly (22) on base (134), all erect marble slab on base (134) and XZ axle mount (136), lower margin (133) are the shock attenuation lower margin.

3. The high-precision semiconductor frame cutting device according to claim 1, wherein: y axle subassembly (22) are fixed in the middle of recess (135), X axle subassembly (21) and Z axle subassembly (23) are fixed in on XZ axle mount (136), be provided with X axle guide rail (211) on X axle subassembly (21), be provided with Y axle guide rail (221) on Y axle subassembly (22), be provided with Z axle lead screw module (231) on Z axle subassembly (23), be provided with left stand (137), right stand (138) and crossbeam (139) on XZ axle mount (136), both ends are fixed in left stand (137) and right stand (138) top surface respectively about crossbeam (139) bottom surface.

4. The high-precision semiconductor frame cutting device according to claim 1, wherein: pressing material locating component (31) including pressing material module (311), vacuum chuck module (312), press material module (311) including setting up to two pressure flitches (314) and rotating electrical machines (315) of bilateral symmetry, vacuum chuck module (312) include sucking disc (316) and set up to two sucking disc fixing bases (317) of bilateral symmetry, be provided with holding tank (321) that are used for installing sucking disc fixing base (317) in mount (32), holding tank (321) periphery is provided with extends face (322), it is provided with inclined plane (323) to extend face (322) inboard, guide way (324) have been formed between inclined plane (323) and sucking disc fixing base (317).

5. The high-precision semiconductor frame cutting device according to claim 4, wherein: the number of the suckers (316) is 8.

6. The high-precision semiconductor frame cutting device according to claim 1, wherein: the laser cutting assembly (41) comprises a cutting head (411) and a cutting head fixing assembly (412), and the CCD positioning system (42) comprises a CCD (421) and a CCD fixing assembly (422).

7. The high-precision semiconductor frame cutting device according to claim 1, wherein: mount (32) bottom surface is provided with two mount backup pads (511) and a curb plate (512) that are bilateral symmetry design, the curb plate (512) left and right sides is connected with two mount backup pads (511) respectively, form an open cavity (513) that are used for holding waste material box (51) after two mount backup pads (511), curb plate (512) and mount (32) are connected, be provided with handle (515) on panel (514) of waste material box (51), be provided with bin outlet (516) on backplate and curb plate (512) of waste material box (51).

8. The high-precision semiconductor frame cutting device according to claim 7, wherein: the discharge opening (516) is connected with the industrial dust collector (52) through an exhaust pipe and a waste collecting opening (521) arranged on the industrial dust collector (52).

9. A use method of a high-precision semiconductor frame cutting device comprises the following steps:

10. The use method of the high-precision semiconductor frame cutting device according to claim 9, wherein the method comprises the following steps: in the step S6, the auxiliary gas is carbon dioxide gas, oxygen, helium, nitrogen or any combination thereof, the width of the cutting seam is 0.05-0.15 mm, and the technological parameters of the laser are set as follows: the cutting speed is 4-8 m/min, the cutting power is 800-12000W, the cutting frequency is 4000-5000 Hz, and the cutting air pressure is 6-10 Bar.