CN113299586A - 一种芯片晶圆暂存装置及芯片晶圆暂存取件方法 - Google Patents
一种芯片晶圆暂存装置及芯片晶圆暂存取件方法 Download PDFInfo
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Abstract
一种芯片晶圆暂存装置及芯片晶圆暂存取件方法,其中芯片晶圆暂存装置包括箱体、存取单元。箱体包括底壳和顶板。存取单元,设于底壳内底壁上端面,存取单元包括运送机构和存放机构;运送机构包括第一晶圆固定器,存放机构包括多个存放层,存放层上端面阵列有多个夹持机构,存放机构还包括第二晶圆固定器。采用芯片晶圆暂存装置的芯片晶圆暂存取件方法包括暂存晶圆步骤、获取晶圆步骤等步骤。本发明的芯片晶圆暂存装置能适用于不同直径的芯片晶圆,可单独监控并调节芯片晶圆暂存距离较近区域的环境,尽可能减少了箱外环境对箱内的影响,结构简单,功能灵活;采用该芯片晶圆暂存装置的芯片晶圆暂存取件方法较为简单,操作方便且实现自动化。
Description
技术领域
本发明涉及芯片晶圆暂存,尤其涉及一种芯片晶圆暂存装置及芯片晶圆暂存取件方法。
背景技术
常见的芯片晶圆有12英寸、8英寸等不同规格,在生产完成后一般都需要暂存,暂存的晶圆需要在一段时间后取出,现有的芯片晶圆生产完成后通常暂存在竖直堆放的芯片堆叠箱中,然后放在库房内,将芯片晶圆直接装箱暂存的方式,在堆叠箱受到震动时,不易对晶圆进行固定,且暂存和取用晶圆时,易于造成破损。另外,晶圆存取也不方便。
芯片晶圆暂存对环境要求较高,包括气压、湿度、温度等,现有的芯片暂存技术通过对库房的气压、湿度、温度进行整体控制,试图满足芯片晶圆暂存的环境要求,然而,库房面积通常较大,难以保证各位置的气压、湿度、温度都满足要求,且由于库房内的芯片晶圆装箱保存,堆叠箱内的气压、湿度、温度等与库房内环境可能不一致,监测的库房内环境数据与晶圆所处环境可能不一致,会对晶圆质量产生影响,甚至损坏。
发明内容
针对上述缺陷,本发明提供一种芯片晶圆暂存装置及芯片晶圆暂存取件方法,存取箱能适用于不同直径的芯片晶圆,可单独监控并调节芯片晶圆暂存距离较近区域的环境,尽可能减少了箱外环境对箱内的影响,结构简单,功能灵活;采用该芯片晶圆暂存装置的芯片晶圆暂存取件方法较为简单,操作方便且实现自动化。
为了实现本发明的目的,拟采用以下技术:
芯片晶圆暂存装置,包括:
箱体,箱体包括底壳和顶板;顶板上端面贯穿开设有多个晶圆口,顶板上端面设有第一单轴直线气缸,第一单轴直线气缸输出轴一端设有挡板,挡板底端面与晶圆口匹配;
存取单元,设于底壳内底壁上端面,存取单元包括运送机构和存放机构;运送机构包括一对车体,车体底端面设有多组滚轮,车体上端面还设有一对无杆直线气缸,无杆直线气缸一端设有延伸板,运送机构还包括一对连接框,每个连接框两端分别架设于两个车体上方的延伸板上端,连接框上端阵列有多个第三单轴直线气缸,第三单轴直线气缸输出轴一端设有穿管,穿管一端面设有第一晶圆固定器,第一晶圆固定器一端面开设有第一弧形凹槽;存放机构包括多个存放层,存放层一端固定于底壳一内侧壁,存放层的长度从下到上递减,递减长度大于车体长度,存放层上端面阵列有多个夹持机构,夹持机构包括固定台,固定台一端预定距离设有一对旋转电机,旋转电机输出轴一端设有旋转板,固定台上端面阵列有多个第二晶圆固定器,旋转板一侧面也阵列有多个第二晶圆固定器,第二晶圆固定器一端面开设有第二弧形凹槽。
进一步,底壳内底壁上端面设有多条导槽,底壳外壁一端面设有多个氮气输入口,氮气输入口用于连接氮气输入管,底壳一侧面设有若干空气干燥器,空气干燥器的输入导管和输出导管都穿设于底壳一侧面,底壳另一侧面设有若干超声波加湿器,超声波加湿器输出口一端连接有转接管,转接管穿设于底壳另一侧面。
进一步,顶板底端面开设有一对移动槽,移动槽上端面凸起到超过顶板上端预定距离,顶板底端面还依次设有内循环空调、气压传感器、湿度传感器、温度传感器。
进一步,每组滚轮配合于导槽,车体底端面还贯穿开设有开口,车体上端面设有竖直设置的第二单轴直线气缸,第二单轴直线气缸的输出轴穿设于车体底端面开口,第二单轴直线气缸的输出轴一端设有固定块。
进一步,无杆直线气缸上端与移动槽匹配,无杆直线气缸一侧面滑动配合有滑块,延伸板设于滑块一端,延伸板上端面开设有螺孔,连接框两端的上端面分别贯穿开设有通孔,一通孔与一车体上方延伸板的螺孔匹配,另一通孔与另一车体上方延伸板的螺孔匹配,通孔与螺孔用于穿设螺杆,连接框一端延伸有穿板,穿板一侧面贯穿开设有阵列设置的穿孔,穿管穿设于穿孔。
进一步,旋转电机输出轴一端设有旋转杆,旋转杆一端套设有旋转座,旋转座底端设于存放层上端面,旋转板套设于旋转杆外周侧。
进一步,第一晶圆固定器位置与晶圆口匹配,第一弧形凹槽的宽度与晶圆匹配,第二晶圆固定器位置与第一晶圆固定器匹配,第二弧形凹槽的宽度与晶圆匹配。
进一步,第一晶圆固定器和第二晶圆固定器均为橡胶材质。
进一步,采用芯片晶圆暂存装置的芯片晶圆暂存取件方法,包括步骤:
暂存晶圆时:启动第一单轴直线气缸,将挡板拉动到完全不阻挡晶圆口的位置,启动滚轮滚动,使车体移动到箱体内一端,启动无杆直线气缸,将滑块上升,带动延伸板上升,带动连接框上升,连接框上升到顶部后,启动所需存放晶圆位置对应的所有第三单轴直线气缸,拉动第一晶圆固定器收起,将晶圆放入对应的晶圆口,启动对应的所有第三单轴直线气缸,使第一弧形凹槽接触晶圆,夹紧晶圆,启动无杆直线气缸将滑块下降,带动延伸板下降,带动连接框下降,启动第一单轴直线气缸,将挡板推动到完全阻挡晶圆口的位置,连接框下降到预定存放层的高度位置后,启动滚轮滚动,使车体移动到预定夹持机构的位置,启动该夹持机构的旋转电机,将旋转板转动至水平,启动无杆直线气缸将滑块下降,带动延伸板下降,带动连接框下降,连接框下降到使晶圆接触对应的固定台上第二晶圆固定器的第二弧形凹槽时,启动第三单轴直线气缸,松开晶圆,启动无杆直线气缸,将滑块上升,带动延伸板上升,带动连接框上升到高于夹持机构的高度,启动旋转电机,使旋转板转动至竖直,将旋转板上第二晶圆固定器的第二弧形凹槽接触已放置的晶圆,固定晶圆,完成存放;
获取晶圆时:启动需要获取的晶圆存放夹持机构的旋转电机,将旋转板转动至水平,解除对晶圆的固定,启动所有第三单轴直线气缸,拉动第一晶圆固定器收起,启动滚轮滚动,使车体移动到预定夹持机构的位置,启动无杆直线气缸将滑块下降,带动延伸板下降,带动连接框下降,使第一晶圆固定器的高度与所需获取的晶圆相等,启动所需获取晶圆位置对应的所有第三单轴直线气缸,使第一弧形凹槽接触晶圆,夹紧晶圆,启动无杆直线气缸,将滑块上升,带动延伸板上升,带动连接框上升到高于夹持机构的高度,启动旋转电机,使旋转板转动至竖直,将旋转板上第二晶圆固定器的第二弧形凹槽接触已放置的晶圆,固定剩下的晶圆,启动滚轮滚动,使车体移动到箱体内一端,启动无杆直线气缸,将滑块上升,带动延伸板上升,带动连接框上升,同时启动第一单轴直线气缸,将挡板拉动到完全不阻挡晶圆口的位置,连接框上升到顶部后,获取全部晶圆,再启动第一单轴直线气缸,将挡板推动到完全阻挡晶圆口的位置。
进一步,进行存放晶圆、获取晶圆的步骤时,使用气压传感器监测箱体内的气压,气压过低时,通过外部氮气输入管从氮气输入口向箱体内充入氮气,气压过高时,启动第一单轴直线气缸,将挡板拉动到完全不阻挡晶圆口的位置,排出箱体内氮气;使用湿度传感器监测箱体内的湿度,湿度过高时,启动空气干燥器,湿度过低时,启动超声波加湿器;使用温度传感器监测箱体内的温度,温度异常时,启动内循环空调使箱体内温度恢复正常;车体处于静止状态时,启动第二单轴直线气缸,推动固定块接触底壳内底壁,车体处于移动状态时,启动第二单轴直线气缸,拉动固定块离开底壳内底壁。
本技术方案的有益效果在于:
1、存取单元的存放机构有多个存放层,每个存放层中使用的第二晶圆固定器规格不同,可用于暂存不同直径的晶圆,存取单元的运送机构中,第三单轴直线气缸可调整第一晶圆固定器的位置,在存、取晶圆的过程中,也可以匹配不同直径的晶圆,所以该存取箱能适用于不同直径的芯片晶圆。
2、存放机构的多个存放层中留有使运送机构通过的空间,充分利用了箱内空间,箱体的顶板上开有与晶圆宽度匹配的晶圆口,并且可通过第一单轴直线气缸推拉挡板进行开启和关闭,尽可能减少了箱外环境对箱内的影响。
3、第一晶圆固定器和第二晶圆固定器均为橡胶材质,每个夹持机构可对两排第二晶圆固定器进行旋转,旋转板旋转到水平状态时,可由运送机构对晶圆进行存放和取出,旋转板旋转到垂直状态时,可对已存放的晶圆进行稳定的固定,避免晶圆破损,该存取箱结构简单,功能灵活。
4、顶板底端面依次设有内循环空调、气压传感器、湿度传感器、温度传感器,气压过低时,通过外部氮气输入管从氮气输入口向箱体内充入氮气,气压过高时,启动第一单轴直线气缸,将挡板拉动到完全不阻挡晶圆口的位置,排出箱体内氮气,气压调节速度快;湿度过高时,启动空气干燥器,湿度过低时,启动超声波加湿器,湿度调节速度快;温度异常时,启动内循环空调使箱体内温度恢复正常,温度调节速度快,且使用内循环,仅调节内部氮气环境的温度,可防止外界空气污染物进入;该存取箱单独监控并调节芯片晶圆暂存距离较近区域的环境,效果较好。
5、采用该芯片晶圆暂存装置的芯片晶圆暂存取件方法较为简单,操作方便且实现自动化。
附图说明
图1示出了本申请实施例整体立体图一。
图2示出了本申请实施例整体立体图二。
图3示出了本申请实施例箱体的底壳和顶板分离立体图。
图4示出了本申请实施例对箱体顶板从底部观察的立体图。
图5示出了本申请实施例存取单元与底壳位置关系示意立体图。
图6示出了本申请实施例存取单元立体图。
图7示出了本申请实施例运送机构立体图。
图8示出了本申请实施例运送机构的水平移动部分立体图。
图9示出了本申请实施例运送机构的晶圆夹持部分立体图。
图10示出了本申请实施例运送机构的连接框立体图。
图11示出了本申请实施例第三单轴直线气缸及其连接部分的立体图。
图12示出了本申请实施例两个存放层示意立体图。
图13示出了本申请实施例夹持机构立体图。
图14示出了本申请实施例夹持机构展开状态立体图。
图15示出了本申请实施例不同规格第二晶圆固定器示意立体图。
图中:1、箱体;2、存取单元;11、底壳;111、导槽;112、氮气输入口;113、空气干燥器;114、超声波加湿器;1141、转接管;12、顶板;121、晶圆口;122、第一单轴直线气缸;1221、挡板;123、移动槽;124、内循环空调;125、气压传感器;126、湿度传感器;127、温度传感器;21、运送机构;211、车体;2111、滚轮;212、第二单轴直线气缸;2121、固定块;213、无杆直线气缸;2131、滑块;2132、延伸板;214、连接框;2141、通孔;2142、穿板;2143、穿孔;215、第三单轴直线气缸;2151、穿管;2152、第一晶圆固定器;2153、第一弧形凹槽;22、存放机构;221、存放层;222、固定台;223、夹持机构;224、旋转电机;2241、旋转杆;225、旋转座;226、旋转板;227、第二晶圆固定器;2271、第二弧形凹槽。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚,下面结合附图对本申请的实施方式进行详细说明,但本申请所描述的实施例是本申请一部分实施例,而不是全部的实施例。
实施例
如图1-图15所示的一种芯片晶圆暂存装置,包括箱体1、存取单元2。
箱体1包括底壳11和顶板12;底壳11内底壁上端面设有四条导槽111,底壳11外壁一端面设有九个氮气输入口112,氮气输入口112用于连接氮气输入管,底壳11一侧面设有两个空气干燥器113,空气干燥器113的输入导管和输出导管都穿设于底壳11一侧面,底壳11另一侧面设有一个超声波加湿器114,超声波加湿器114输出口一端连接有转接管1141,转接管1141穿设于底壳11另一侧面;顶板12上端面贯穿开设有二十五个晶圆口121,第一单轴直线气缸122输出轴一端设有挡板1221,挡板1221底端面与晶圆口121匹配,顶板12底端面开设有一对移动槽123,移动槽123上端面凸起到超过顶板12上端预定距离,顶板12底端面依次设有内循环空调124、气压传感器125、湿度传感器126、温度传感器127。
存取单元2设于底壳11内底壁上端面,存取单元2包括运送机构21和存放机构22;运送机构21包括一对车体211,车体211底端面设有两组滚轮2111,每组滚轮2111配合于导槽111,车体211底端面贯穿开设有开口,车体211上端面设有竖直设置的第二单轴直线气缸212,第二单轴直线气缸212的输出轴穿设于该开口,该输出轴一端设有固定块2121,车体211上端面设有一对无杆直线气缸213,无杆直线气缸213上端与移动槽123匹配,无杆直线气缸213一侧面滑动配合有滑块2131,滑块2131一端设有延伸板2132,延伸板2132上端面开设有螺孔,运送机构21包括一对连接框214,每个连接框214两端分别架设于两个车体211上方的延伸板2132上端,连接框214两端的上端面分别贯穿开设有通孔2141,一通孔2141与一车体211上方延伸板2132的螺孔匹配,另一通孔2141与另一车体211上方延伸板2132的螺孔匹配,通孔2141与螺孔用于穿设螺杆,连接框214一端延伸有穿板2142,穿板2142一侧面贯穿开设有阵列设置的穿孔2143,连接框214上端阵列有二十五个第三单轴直线气缸215,第三单轴直线气缸215输出轴一端设有穿设于穿孔2143的穿管2151,穿管2151一端面设有橡胶材质的第一晶圆固定器2152,第一晶圆固定器2152位置与晶圆口121匹配,第一晶圆固定器2152一端面开设有第一弧形凹槽2153,第一弧形凹槽2153的宽度与晶圆3匹配;存放机构22包括两个存放层221,存放层221一端固定于底壳11一内侧壁,存放层221的长度从下到上递减,递减长度大于车体211长度,存放层221上端面阵列有三个夹持机构223,夹持机构223包括固定台222,固定台222一端预定距离设有一对旋转电机224,旋转电机224输出轴一端设有旋转杆2241,旋转杆2241一端套设有旋转座225,旋转座225底端设于存放层221上端面,旋转杆2241外周侧套设有旋转板226,固定台222上端面阵列有二十五个第二晶圆固定器227,旋转板226一侧面也阵列有二十五个橡胶材质的第二晶圆固定器227,第二晶圆固定器227位置与第一晶圆固定器2152匹配,第二晶圆固定器227一端面开设有第二弧形凹槽2271,第二弧形凹槽2271的宽度与晶圆3匹配。每个存放层221上的第二晶圆固定器227规格不同,用于不同直径的晶圆3,具体地,第二晶圆固定器227的高度和长度不同,第二弧形凹槽2271的弧度不同。
采用上述芯片晶圆暂存装置的一种芯片晶圆暂存取件方法,按以下步骤操作:
S1:存放晶圆3时:启动第一单轴直线气缸122,将挡板1221拉动到完全不阻挡晶圆口121的位置,启动滚轮2111滚动,使车体211移动到箱体1内一端,启动无杆直线气缸213,将滑块2131上升,带动延伸板2132上升,带动连接框214上升,连接框214上升到顶部后,启动所需存放晶圆3位置对应的所有第三单轴直线气缸215,拉动第一晶圆固定器2152收起,将晶圆3放入对应的晶圆口121,启动对应的所有第三单轴直线气缸215,使第一弧形凹槽2153接触晶圆3,夹紧晶圆3,启动无杆直线气缸213将滑块2131下降,带动延伸板2132下降,带动连接框214下降,启动第一单轴直线气缸122,将挡板1221推动到完全阻挡晶圆口121的位置,连接框214下降到预定存放层221的高度位置后,启动滚轮2111滚动,使车体211移动到预定夹持机构223的位置,启动该夹持机构223的旋转电机224,将旋转板226转动至水平,启动无杆直线气缸213将滑块2131下降,带动延伸板2132下降,带动连接框214下降,连接框214下降到使晶圆3接触对应的固定台222上第二晶圆固定器227的第二弧形凹槽2271时,启动第三单轴直线气缸215,松开晶圆3,启动无杆直线气缸213,将滑块2131上升,带动延伸板2132上升,带动连接框214上升到高于夹持机构223的高度,启动旋转电机224,使旋转板226转动至竖直,将旋转板226上第二晶圆固定器227的第二弧形凹槽2271接触已放置的晶圆3,固定晶圆3,完成存放;
S2:获取晶圆3时:启动需要获取的晶圆3存放夹持机构223的旋转电机224,将旋转板226转动至水平,解除对晶圆3的固定,启动所有第三单轴直线气缸215,拉动第一晶圆固定器2152收起,启动滚轮2111滚动,使车体211移动到预定夹持机构223的位置,启动无杆直线气缸213将滑块2131下降,带动延伸板2132下降,带动连接框214下降,使第一晶圆固定器2152的高度与所需获取的晶圆3相等,启动所需获取晶圆3位置对应的所有第三单轴直线气缸215,使第一弧形凹槽2153接触晶圆3,夹紧晶圆3,启动无杆直线气缸213,将滑块2131上升,带动延伸板2132上升,带动连接框214上升到高于夹持机构223的高度,启动旋转电机224,使旋转板226转动至竖直,将旋转板226上第二晶圆固定器227的第二弧形凹槽2271接触已放置的晶圆3,固定剩下的晶圆3,启动滚轮2111滚动,使车体211移动到箱体1内一端,启动无杆直线气缸213,将滑块2131上升,带动延伸板2132上升,带动连接框214上升,同时启动第一单轴直线气缸122,将挡板1221拉动到完全不阻挡晶圆口121的位置,连接框214上升到顶部后,获取全部晶圆3,再启动第一单轴直线气缸122,将挡板1221推动到完全阻挡晶圆口121的位置。
进行步骤S1、S2时,使用气压传感器125监测箱体1内的气压,气压低于1.01倍环境大气压时,通过外部氮气输入管从氮气输入口112向箱体1内充入氮气,气压高于1.2倍环境大气压时,启动第一单轴直线气缸122,将挡板1221拉动到完全不阻挡晶圆口121的位置,排出箱体1内氮气;使用湿度传感器126监测箱体1内的湿度,湿度高于23.5%时,启动空气干燥器113,湿度低于8.2%时,启动超声波加湿器114;使用温度传感器127监测箱体1内的温度,温度低于17.5℃或高于24.5℃时,启动内循环空调124使箱体1内温度恢复到17.5℃~24.5℃范围内;车体211处于静止状态时,启动第二单轴直线气缸212,推动固定块2121接触底壳11内底壁,车体211处于移动状态时,启动第二单轴直线气缸212,拉动固定块2121离开底壳11内底壁。
本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想。对于本技术领域的普通技术人员来说,在不脱离本申请原理的前提下,还可以对本申请进行若干改进和修饰,这些改进和修饰也落入本申请权利要求的保护范围内。
Claims (10)
1.一种芯片晶圆暂存装置,其特征在于,包括:
箱体(1),箱体(1)包括底壳(11)和顶板(12);顶板(12)上端面贯穿开设有多个晶圆口(121),顶板(12)上端面设有第一单轴直线气缸(122),第一单轴直线气缸(122)输出轴一端设有挡板(1221),挡板(1221)底端面与晶圆口(121)匹配;
存取单元(2),设于底壳(11)内底壁上端面,存取单元(2)包括运送机构(21)和存放机构(22);运送机构(21)包括一对车体(211),车体(211)底端面设有多组滚轮(2111),车体(211)上端面还设有一对无杆直线气缸(213),无杆直线气缸(213)一端设有延伸板(2132),运送机构(21)还包括一对连接框(214),每个连接框(214)两端分别架设于两个车体(211)上方的延伸板(2132)上端,连接框(214)上端阵列有多个第三单轴直线气缸(215),第三单轴直线气缸(215)输出轴一端设有穿管(2151),穿管(2151)一端面设有第一晶圆固定器(2152),第一晶圆固定器(2152)一端面开设有第一弧形凹槽(2153);存放机构(22)包括多个存放层(221),存放层(221)一端固定于底壳(11)一内侧壁,存放层(221)的长度从下到上递减,递减长度大于车体(211)长度,存放层(221)上端面阵列有多个夹持机构(223),夹持机构(223)包括固定台(222),固定台(222)一端预定距离设有一对旋转电机(224),旋转电机(224)输出轴一端设有旋转板(226),固定台(222)上端面阵列有多个第二晶圆固定器(227),旋转板(226)一侧面也阵列有多个第二晶圆固定器(227),第二晶圆固定器(227)一端面开设有第二弧形凹槽(2271)。
2.根据权利要求1所述的芯片晶圆暂存装置,其特征在于,底壳(11)内底壁上端面设有多条导槽(111),底壳(11)外壁一端面设有多个氮气输入口(112),氮气输入口(112)用于连接氮气输入管,底壳(11)一侧面设有若干空气干燥器(113),空气干燥器(113)的输入导管和输出导管都穿设于底壳(11)一侧面,底壳(11)另一侧面设有若干超声波加湿器(114),超声波加湿器(114)输出口一端连接有转接管(1141),转接管(1141)穿设于底壳(11)另一侧面。
3.根据权利要求1所述的芯片晶圆暂存装置,其特征在于,顶板(12)底端面开设有一对移动槽(123),移动槽(123)上端面凸起到超过顶板(12)上端预定距离,顶板(12)底端面还依次设有内循环空调(124)、气压传感器(125)、湿度传感器(126)、温度传感器(127)。
4.根据权利要求2所述的芯片晶圆暂存装置,其特征在于,每组滚轮(2111)配合于导槽(111),车体(211)底端面还贯穿开设有开口,车体(211)上端面设有竖直设置的第二单轴直线气缸(212),第二单轴直线气缸(212)的输出轴穿设于车体(211)底端面开口,第二单轴直线气缸(212)的输出轴一端设有固定块(2121)。
5.根据权利要求3所述的芯片晶圆暂存装置,其特征在于,无杆直线气缸(213)上端与移动槽(123)匹配,无杆直线气缸(213)一侧面滑动配合有滑块(2131),延伸板(2132)设于滑块(2131)一端,延伸板(2132)上端面开设有螺孔,连接框(214)两端的上端面分别贯穿开设有通孔(2141),一通孔(2141)与一车体(211)上方延伸板(2132)的螺孔匹配,另一通孔(2141)与另一车体(211)上方延伸板(2132)的螺孔匹配,通孔(2141)与螺孔用于穿设螺杆,连接框(214)一端延伸有穿板(2142),穿板(2142)一侧面贯穿开设有阵列设置的穿孔(2143),穿管(2151)穿设于穿孔(2143)。
6.根据权利要求1所述的芯片晶圆暂存装置,其特征在于,旋转电机(224)输出轴一端设有旋转杆(2241),旋转杆(2241)一端套设有旋转座(225),旋转座(225)底端设于存放层(221)上端面,旋转板(226)套设于旋转杆(2241)外周侧。
7.根据权利要求1所述的芯片晶圆暂存装置,其特征在于,第一晶圆固定器(2152)位置与晶圆口(121)匹配,第一弧形凹槽(2153)的宽度与晶圆(3)匹配,第二晶圆固定器(227)位置与第一晶圆固定器(2152)匹配,第二弧形凹槽(2271)的宽度与晶圆(3)匹配。
8.根据权利要求1所述的芯片晶圆暂存装置,其特征在于,第一晶圆固定器(2152)和第二晶圆固定器(227)均为橡胶材质。
9.一种芯片晶圆暂存取件方法,其特征在于,采用权利要求1~8中任意一项所述的芯片晶圆暂存装置,包括步骤:
S1:暂存晶圆(3)时:启动第一单轴直线气缸(122),将挡板(1221)拉动到完全不阻挡晶圆口(121)的位置,启动滚轮(2111)滚动,使车体(211)移动到箱体(1)内一端,启动无杆直线气缸(213),将滑块(2131)上升,带动延伸板(2132)上升,带动连接框(214)上升,连接框(214)上升到顶部后,启动所需存放晶圆(3)位置对应的所有第三单轴直线气缸(215),拉动第一晶圆固定器(2152)收起,将晶圆(3)放入对应的晶圆口(121),启动对应的所有第三单轴直线气缸(215),使第一弧形凹槽(2153)接触晶圆(3),夹紧晶圆(3),启动无杆直线气缸(213)将滑块(2131)下降,带动延伸板(2132)下降,带动连接框(214)下降,启动第一单轴直线气缸(122),将挡板(1221)推动到完全阻挡晶圆口(121)的位置,连接框(214)下降到预定存放层(221)的高度位置后,启动滚轮(2111)滚动,使车体(211)移动到预定夹持机构(223)的位置,启动所述夹持机构(223)的旋转电机(224),将旋转板(226)转动至水平,启动无杆直线气缸(213)将滑块(2131)下降,带动延伸板(2132)下降,带动连接框(214)下降,连接框(214)下降到使晶圆(3)接触对应的固定台(222)上第二晶圆固定器(227)的第二弧形凹槽(2271)时,启动第三单轴直线气缸(215),松开晶圆(3),启动无杆直线气缸(213),将滑块(2131)上升,带动延伸板(2132)上升,带动连接框(214)上升到高于夹持机构(223)的高度,启动旋转电机(224),使旋转板(226)转动至竖直,将旋转板(226)上第二晶圆固定器(227)的第二弧形凹槽(2271)接触已放置的晶圆(3),固定晶圆(3),完成存放;
S2:获取晶圆(3)时:启动需要获取的晶圆(3)存放夹持机构(223)的旋转电机(224),将旋转板(226)转动至水平,解除对晶圆(3)的固定,启动所有第三单轴直线气缸(215),拉动第一晶圆固定器(2152)收起,启动滚轮(2111)滚动,使车体(211)移动到预定夹持机构(223)的位置,启动无杆直线气缸(213)将滑块(2131)下降,带动延伸板(2132)下降,带动连接框(214)下降,使第一晶圆固定器(2152)的高度与所需获取的晶圆(3)相等,启动所需获取晶圆(3)位置对应的所有第三单轴直线气缸(215),使第一弧形凹槽(2153)接触晶圆(3),夹紧晶圆(3),启动无杆直线气缸(213),将滑块(2131)上升,带动延伸板(2132)上升,带动连接框(214)上升到高于夹持机构(223)的高度,启动旋转电机(224),使旋转板(226)转动至竖直,将旋转板(226)上第二晶圆固定器(227)的第二弧形凹槽(2271)接触已放置的晶圆(3),固定剩下的晶圆(3),启动滚轮(2111)滚动,使车体(211)移动到箱体(1)内一端,启动无杆直线气缸(213),将滑块(2131)上升,带动延伸板(2132)上升,带动连接框(214)上升,同时启动第一单轴直线气缸(122),将挡板(1221)拉动到完全不阻挡晶圆口(121)的位置,连接框(214)上升到顶部后,获取全部晶圆(3),再启动第一单轴直线气缸(122),将挡板(1221)推动到完全阻挡晶圆口(121)的位置。
10.根据权利要求9所述的芯片晶圆暂存取件方法,其特征在于,进行步骤S1、S2时,使用气压传感器(125)监测箱体(1)内的气压,气压过低时,通过外部氮气输入管从氮气输入口(112)向箱体(1)内充入氮气,气压过高时,启动第一单轴直线气缸(122),将挡板(1221)拉动到完全不阻挡晶圆口(121)的位置,排出箱体(1)内氮气;使用湿度传感器(126)监测箱体(1)内的湿度,湿度过高时,启动空气干燥器(113),湿度过低时,启动超声波加湿器(114);使用温度传感器(127)监测箱体(1)内的温度,温度异常时,启动内循环空调(124)使箱体(1)内温度恢复正常;车体(211)处于静止状态时,启动第二单轴直线气缸(212),推动固定块(2121)接触底壳(11)内底壁,车体(211)处于移动状态时,启动第二单轴直线气缸(212),拉动固定块(2121)离开底壳(11)内底壁。
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