CN113295283A - Infrared temperature measuring device for vacuum, low-temperature and strong electromagnetic field environment - Google Patents
Infrared temperature measuring device for vacuum, low-temperature and strong electromagnetic field environment Download PDFInfo
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- CN113295283A CN113295283A CN202110671861.2A CN202110671861A CN113295283A CN 113295283 A CN113295283 A CN 113295283A CN 202110671861 A CN202110671861 A CN 202110671861A CN 113295283 A CN113295283 A CN 113295283A
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- 229910052732 germanium Inorganic materials 0.000 claims description 9
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- 238000010438 heat treatment Methods 0.000 claims description 9
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 8
- 239000013307 optical fiber Substances 0.000 claims description 8
- 230000005669 field effect Effects 0.000 claims description 4
- 238000004861 thermometry Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 8
- 238000012360 testing method Methods 0.000 description 12
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/041—Mountings in enclosures or in a particular environment
- G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J2005/065—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by shielding
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Radiation Pyrometers (AREA)
Abstract
The application provides an infrared temperature measuring device for a vacuum, low-temperature and strong electromagnetic field environment, which comprises a box body and a temperature measuring assembly; the box body is of a closed structure, and microwave absorbing materials are arranged inside the box body; the temperature measuring component is positioned in the box body and comprises a thermal infrared imager; an observation window is arranged on the box body corresponding to the thermal infrared imager; the thermal infrared imager is connected with the observation window through a closed wave absorbing cover. According to the technical scheme provided by the embodiment of the application, the vacuum environment outside the box body is shielded by the closed box body, and the strong electromagnetic environment outside the box body is shielded by matching with the microwave absorption material, so that the thermal infrared imager is positioned in the environment with normal temperature, normal pressure and weak field intensity; and the thermal infrared imager is connected with the observation window through the wave absorbing cover, so that the electromagnetic waves entering through the observation window can be absorbed.
Description
Technical Field
The application relates to the technical field of special tests, in particular to an infrared temperature measuring device for vacuum, low-temperature and strong electromagnetic field environments.
Background
The surface of the spacecraft is generally paved with a large number of multilayer heat insulation assemblies (MLI), the multilayer heat insulation assemblies generally consist of a plurality of layers of aluminizers and spacing layers (generally 5-20 layers), wherein the base material of the aluminizer at the inner part is generally a polyester film, the spacing layer is generally a polyester wire, a flame-retardant wire and the like, the base material of the outer film is generally a polyimide material, and meanwhile, in order to enhance the surface adaptability of the spacecraft, the multilayer heat insulation assemblies adopting the processes of surface carburization, ITO plating and the like are also provided. Under the coupling action of vacuum and strong electromagnetic fields, secondary electron multiplication effect, low-pressure discharge and other phenomena may occur on the surface of the multilayer heat insulation assembly, so that the surface and even the interior of the multilayer heat insulation assembly are damaged, adverse effects on the thermal control performance and the shielding efficiency of the spacecraft may be caused, and even further damage to internal materials is caused under the action of the strong field. The damage mechanism is very complex, and the coupling effect of micro discharge and low-pressure discharge often exists.
In addition, similar damage phenomena may occur with other overlay materials on the surface of the spacecraft. Therefore, in order to evaluate the damage mechanism of the spacecraft surface material under the coupling action of vacuum, low temperature and strong field, a test is generally carried out in a ground simulation environment, the surface temperature of the test piece can be visually represented by observing the surface of the test piece by a thermal infrared imager, and the region of the surface of the test piece where dielectric breakdown occurs is rapidly positioned.
However, the detection equipment is often out of the use temperature range due to low temperature under vacuum, so that the problems of material freezing, lubrication failure and the like are caused; strong fields up to hundreds to thousands of V/m cause interference, degradation and even damage to electronic devices, and this problem is urgently needed to be solved.
Disclosure of Invention
In view of the above-mentioned shortcomings or drawbacks of the prior art, it is desirable to provide an infrared thermometry device for use in vacuum, low temperature, and strong electromagnetic field environments.
The application provides an infrared temperature measuring device for a vacuum, low-temperature and strong electromagnetic field environment, which comprises a box body and a temperature measuring assembly; the box body is of a closed structure, and microwave absorbing materials are arranged inside the box body; the temperature measuring component is positioned in the box body and comprises a thermal infrared imager; an observation window is arranged on the box body corresponding to the thermal infrared imager; the thermal infrared imager is connected with the observation window through a closed wave absorbing cover.
Furthermore, germanium glass for electromagnetic shielding is arranged at the observation window; the germanium glass is pressed on the box body through the flange.
Further, a control system is also arranged in the box body; the box body is provided with an airtight electric connector and an airtight optical fiber connector corresponding to the control system.
Further, the control system comprises a controller, a power supply module and a switch; the power supply module is connected with the airtight electric connector and used for supplying power to the system; the switch is connected with the airtight optical fiber connector and used for providing connection between the controller and the thermal imager and the Ethernet.
Further, the device also comprises a heating module; the heating module is electrically connected with the controller and used for controlling the temperature in the box body; the heating module comprises a temperature sensor, a heater and a field effect tube; the field effect transistor is electrically connected with the heater and is in signal connection with the temperature sensor through the controller.
Further, the device also comprises a relay module; the relay module is connected between the power supply module and the thermal infrared imager, is controlled by the controller and is used for controlling the on-off of the power supply.
Further, the system also comprises a fiber switch; the optical fiber switch is positioned outside the box body and electrically connected with the computer; the switch is connected with the optical fiber switch through an airtight optical fiber connector.
The application has the advantages and positive effects that:
according to the technical scheme, a vacuum environment outside a box body is shielded through a closed box body, and a strong electromagnetic environment outside the box body is shielded by matching with a microwave absorbing material, so that the thermal infrared imager is in an environment with normal temperature, normal pressure and weak field intensity; and the thermal infrared imager is connected with the observation window through the wave absorbing cover, so that the electromagnetic waves entering through the observation window can be absorbed.
Drawings
FIG. 1 is a schematic structural diagram of an infrared temperature measuring device for use in a vacuum, low-temperature, and strong electromagnetic field environment according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram illustrating an appearance of an infrared temperature measuring device for use in a vacuum, low-temperature, and strong electromagnetic field environment according to an embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of a control system of an infrared temperature measuring device for use in a vacuum, low-temperature, and strong electromagnetic field environment according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of an application environment of the infrared temperature measuring device for a vacuum, low-temperature, and strong electromagnetic field environment according to the embodiment of the present application.
The text labels in the figures are represented as: 100-a box body; 110-germanium glass; 120-a flange; 130-a gas tight electrical connector; 140-hermetic fiber optic connectors; 200-infrared thermal imaging system; 210-a wave absorbing cover; 300-a control system; 310-a controller; 320-a power supply module; 330-a switch; 340-a temperature sensor; 341-a heater; 342-field effect transistor; 350-a relay module; 400-a fiber switch; 410-a computer; 500-a simulated container; 510-main microwave lobe; 520-microwave side lobe; 530-test piece.
Detailed Description
The following detailed description of the present application is given for the purpose of enabling those skilled in the art to better understand the technical solutions of the present application, and the description in this section is only exemplary and explanatory, and should not be taken as limiting the scope of the present application in any way.
Referring to fig. 1-3, the present embodiment provides an infrared temperature measuring device for use in vacuum, low temperature, and strong electromagnetic field environments, which includes a box 100; the box body 100 is of a closed structure, microwave absorbing materials are adhered inside the box body and are used for providing an environment with normal temperature, normal pressure and weak field intensity for the temperature measuring assembly arranged inside the box body; still correspond temperature measuring component on the box 100 and be equipped with the observation window, install germanium glass 110 that is used for electromagnetic shield on the observation window, both ensured that temperature measuring component can normally detect the outside, can effectively shield the electromagnetism again, ensured the inside weak field intensity environment of box 100.
Preferably, the box body 100 is made of metal, and the surface of the box body is provided with a reinforcing rib which can bear the pressure difference of more than 1.0 atmosphere; the observation window is positioned at one side of the box body 100; mounting the germanium glass 110 through a flange 120; the flange 120 is fixedly installed on the case 100 by bolts; germanium glass 110 is located between flange 120 and tank 100.
Preferably, the box body 100 is provided with corresponding blind holes corresponding to the bolts, and by arranging the blind holes to be abutted to the bolts, normal installation of the flange 120 can be ensured, continuity of an electromagnetic shielding interface can be ensured, possibility that electromagnetic waves enter the box body 100 through bolt coupling is reduced, and a pressure sealing boundary is provided.
In a preferred embodiment, the thermometric assembly comprises thermal infrared imager 200; the thermal infrared imager 200 is fixedly arranged in the box body 100, and a closed wave absorbing cover 210 is connected between the thermal infrared imager and the observation window; the wave-absorbing cover 210 can absorb electromagnetic waves that enter through the observation window.
In a preferred embodiment, a control system 300 is further disposed in the box 100; the control system 300 includes a controller 310, a power module 320, and a switch 330; the power module 320 is used for supplying power to the system and is connected with the outside for charging through the airtight electric connector 130 on the box body 100; the box 100 is also provided with an airtight fiber connector 140 corresponding to the switch 330, and all video and control signals are transmitted through optical fibers during testing, so as to prevent interference of a strong electromagnetic field environment.
In a preferred embodiment, the control system 300 further includes a heating module; the heating module is connected to a controller 130 for controlling the temperature inside the case 100.
Preferably, the heating module includes a temperature sensor 340, a heater 341 and a temperature control assembly; the fet 342 is electrically connected to the heater 341 and is in signal connection with the temperature sensor 340 via the controller 320.
Preferably, the temperature control component can be a field effect transistor 342.
In a preferred embodiment, the control system 300 further includes a relay module 350; the relay module 350 is connected between the power module 320 and the thermal infrared imager 200, and is controlled by the controller 310 to control the power on/off.
In a preferred embodiment, the switch 330 is connected to the fiber switch 400 outside the enclosure 100 by a hermetic fiber optic connector 140; the fabric switch 400 is electrically connected to a computer 410.
The application environment is as follows:
the box body 100 is placed in a simulation container 500, the simulation container 500 is generally a large and medium vacuum container, the vacuum of the spacecraft in on-orbit operation can be simulated, and the simulated vacuum degree can reach 1.0 multiplied by 10-3And below Pa, a heat sink is arranged to simulate a low-temperature boundary, and a wave-absorbing material is arranged in the heat sink and is used for absorbing the microwaves of the strong electromagnetic field environment test.
A transmitting antenna is arranged in the simulation container 500 and used for simulating a strong electromagnetic field environment; the microwave beam emitted by the transmitting antenna comprises a microwave main lobe 510, a microwave side lobe 520 and the like; a main microwave lobe 510, which is the strongest direction of antenna beam irradiation; the microwave sidelobes 520 are generally distributed on both sides of the microwave main lobe 510.
During testing, microwaves are transmitted to the surface of the test piece 530 through the transmitting antenna, and the infrared temperature measuring device is used for measuring the surface temperature field of the test piece 530; as shown in fig. 4, the visual angle range of the thermal infrared imager 200 avoids the microwave main lobe 510 and the microwave auxiliary lobe 520, so as to avoid stronger microwave irradiation, and at the same time, an included angle exists between the visual angle range of the thermal infrared imager 200 and the microwave irradiation direction, so that the possibility that the microwave irradiation enters the device through the reflection of the test piece 530 is reduced, and the microwave entering through the germanium glass 110 is absorbed by matching the wave absorbing cover 210, so that the thermal infrared imager 200 and the control system 300 inside can be effectively prevented from being damaged.
The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. The foregoing is only a preferred embodiment of the present application, and it should be noted that there are objectively infinite specific structures due to the limited character expressions, and it will be apparent to those skilled in the art that a plurality of modifications, decorations or changes may be made without departing from the principle of the present invention, and the technical features described above may be combined in a suitable manner; such modifications, variations, combinations, or adaptations of the invention in other contexts without modification may be viewed as within the scope of the present application.
Claims (7)
1. An infrared temperature measuring device for vacuum, low-temperature and strong electromagnetic field environments is characterized by comprising a box body (100) and a temperature measuring component; the box body (100) is of a closed structure, and microwave absorbing materials are arranged inside the box body; the temperature measuring assembly is positioned in the box body (100) and comprises a thermal infrared imager (200); an observation window is arranged on the box body (100) corresponding to the thermal infrared imager (200); the thermal infrared imager (200) is connected with the observation window through a closed wave absorption cover (210).
2. The infrared temperature measuring device for vacuum, low-temperature and strong electromagnetic field environment according to claim 1, wherein germanium glass (110) for electromagnetic shielding is arranged at the observation window; the germanium glass (110) is pressed on the box body (100) through a flange (120).
3. The infrared temperature measuring device for vacuum, low-temperature and strong electromagnetic field environment according to claim 1, characterized in that a control system (300) is further arranged in the box body (100); the box body (100) is provided with an airtight electric connector (130) and an airtight optical fiber connector (140) corresponding to the control system (300).
4. The infrared thermometry apparatus according to claim 3, wherein the control system comprises a controller (310), a power module (320) and a switch (330); the power supply module (320) is connected with the airtight electric connector (130) and used for supplying power to the system; the switch (330) is connected to a hermetic fiber optic connector (140) for providing the controller (310) and thermal imager (200) with an ethernet connection.
5. The infrared temperature measuring device for vacuum, low-temperature and strong electromagnetic field environment according to claim 4, further comprising a heating module; the heating module is electrically connected with a controller (310) and is used for controlling the temperature in the box body (100); the heating module comprises a temperature sensor (340), a heater (341) and a temperature control component; the field effect transistor (342) is electrically connected with the heater (341) and is in signal connection with the temperature sensor (340) through the controller (320).
6. The infrared thermometry apparatus for vacuum, cryogenic, high electromagnetic field environment of claim 4, further comprising a relay module (350); the relay module (350) is connected between the power supply module (320) and the thermal infrared imager (200), and is controlled by the controller (310) to control the on-off of the power supply.
7. The infrared thermometry apparatus according to claim 4, further comprising a fiber optic switch (400); the fiber switch (400) is positioned outside the box body (100) and is electrically connected with a computer (410); the switch (330) is connected with the fiber switch (400) through the airtight optical fiber connector (140).
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CN202110671861.2A CN113295283A (en) | 2021-06-17 | 2021-06-17 | Infrared temperature measuring device for vacuum, low-temperature and strong electromagnetic field environment |
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CN202110671861.2A CN113295283A (en) | 2021-06-17 | 2021-06-17 | Infrared temperature measuring device for vacuum, low-temperature and strong electromagnetic field environment |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114018436A (en) * | 2021-11-08 | 2022-02-08 | 北京卫星环境工程研究所 | Spacecraft material space strong electromagnetic environment effect test system |
CN114325172A (en) * | 2021-12-06 | 2022-04-12 | 北京卫星环境工程研究所 | Strong electromagnetic field irradiation type test method for spacecraft surface covering material |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102564595A (en) * | 2011-12-14 | 2012-07-11 | 北京卫星环境工程研究所 | Infrared thermal-wave detecting system for vacuum low-temperature environment |
US20140267763A1 (en) * | 2013-03-14 | 2014-09-18 | Drs Rsta, Inc. | Integrated radiation shield and radiation stop |
CN105136314A (en) * | 2015-08-24 | 2015-12-09 | 北京环境特性研究所 | Infrared thermal imaging system realization method under vacuum low temperature environment and device |
CN205374636U (en) * | 2016-02-02 | 2016-07-06 | 航天科工防御技术研究试验中心 | A combined test device for environmental test |
CN206695912U (en) * | 2017-05-11 | 2017-12-01 | 三河市戎邦光电设备股份有限公司 | A kind of shielding protective cover for infrared thermal imager |
CN111929510A (en) * | 2020-08-21 | 2020-11-13 | 国网江苏省电力有限公司盐城供电分公司 | Power equipment electromagnetic radiation detection system |
CN111998951A (en) * | 2020-08-19 | 2020-11-27 | 北京卫星环境工程研究所 | Non-contact temperature measuring device |
-
2021
- 2021-06-17 CN CN202110671861.2A patent/CN113295283A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102564595A (en) * | 2011-12-14 | 2012-07-11 | 北京卫星环境工程研究所 | Infrared thermal-wave detecting system for vacuum low-temperature environment |
US20140267763A1 (en) * | 2013-03-14 | 2014-09-18 | Drs Rsta, Inc. | Integrated radiation shield and radiation stop |
CN105136314A (en) * | 2015-08-24 | 2015-12-09 | 北京环境特性研究所 | Infrared thermal imaging system realization method under vacuum low temperature environment and device |
CN205374636U (en) * | 2016-02-02 | 2016-07-06 | 航天科工防御技术研究试验中心 | A combined test device for environmental test |
CN206695912U (en) * | 2017-05-11 | 2017-12-01 | 三河市戎邦光电设备股份有限公司 | A kind of shielding protective cover for infrared thermal imager |
CN111998951A (en) * | 2020-08-19 | 2020-11-27 | 北京卫星环境工程研究所 | Non-contact temperature measuring device |
CN111929510A (en) * | 2020-08-21 | 2020-11-13 | 国网江苏省电力有限公司盐城供电分公司 | Power equipment electromagnetic radiation detection system |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114018436A (en) * | 2021-11-08 | 2022-02-08 | 北京卫星环境工程研究所 | Spacecraft material space strong electromagnetic environment effect test system |
CN114018436B (en) * | 2021-11-08 | 2023-11-10 | 北京卫星环境工程研究所 | Spacecraft material space strong electromagnetic environment effect test system |
CN114325172A (en) * | 2021-12-06 | 2022-04-12 | 北京卫星环境工程研究所 | Strong electromagnetic field irradiation type test method for spacecraft surface covering material |
CN114325172B (en) * | 2021-12-06 | 2023-09-15 | 北京卫星环境工程研究所 | Strong electromagnetic field irradiation type test method for spacecraft surface coating material |
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