CN113285307B

CN113285307B - Interlayer connector

Info

Publication number: CN113285307B
Application number: CN202110550099.2A
Authority: CN
Inventors: 尹新剑; 马陆飞
Original assignee: China Aviation Optical Electrical Technology Co Ltd
Current assignee: China Aviation Optical Electrical Technology Co Ltd
Priority date: 2021-05-18
Filing date: 2021-05-18
Publication date: 2022-05-13
Anticipated expiration: 2041-05-18
Also published as: CN113285307A

Abstract

The utility model provides a sandwich connector, includes insulator, signal needle, earth pin, and signal needle, earth pin cartridge are on the insulator, still install common ground piece on the insulator, are equipped with a plurality of contact sites on the common ground piece, and every contact site is connected as whole with the earth pin turn-on that corresponds, and a plurality of contact sites pass through connecting portion to connect, thereby make all earth pins common ground. Compared with the prior art, the invention has the advantages that: after the common ground plate is added to the interlayer connector, the signal is less interfered.

Description

Interlayer connector

Technical Field

The invention belongs to the technical field of connectors, and particularly relates to an interlayer connector.

Background

With the development of technology, the speed requirement of high-speed connectors is higher and higher, and in order to improve the product performance of the connectors at high frequency, it is often used to connect all grounding pins (abbreviated as "G"), as shown in fig. 1-1 to fig. 1-2, to the existing backplane-type connector product. The common ground can optimize the return path on one hand and play a role in shielding on the other hand, and mutual interference between differential pairs is reduced. The shielding plate can be added to the backplane connector to achieve the effect of common grounding, but due to the structural limitation, the above "common grounding" method is not suitable for the interlayer connector.

Disclosure of Invention

The invention provides a sandwich connector, aiming at the technical problem that the common ground mode is not suitable for the sandwich connector.

The purpose of the invention is realized by adopting the following technical scheme. The interlayer connector provided by the invention comprises an insulator, a signal pin and a grounding pin, wherein the signal pin and the grounding pin are inserted in the insulator, the insulator is also provided with a common grounding sheet, the common grounding sheet is provided with a plurality of contact parts, each contact part is in conduction connection with the corresponding grounding pin, and the contact parts are connected into a whole through a connecting part, so that all the grounding pins are grounded.

Furthermore, the signal pins and the grounding pins are arranged on the insulator into a plurality of rows of arrays, and the signal pins and the grounding pins of each row of arrays are distributed at intervals.

Further, the signal pin comprises a contact area I, a linear area I and a pin area I; the grounding pin comprises a contact area II, a linear area II and a pin area II; the front surface of the insulator is provided with a plurality of convex ribs, two sides of each rib are provided with a groove I for accommodating the contact area I and a groove II for accommodating the contact area II, the grooves I correspond to the contact areas I one by one, and the grooves II correspond to the contact areas II one by one; a linear area I arranged at the tail end of the contact area I and a linear area II arranged at the tail end of the contact area II extend towards the back of the insulator, and a pin area I at the tail end of the linear area I and a pin area II at the tail end of the linear area II are inserted into corresponding insertion holes in the insulator; the interference points I and II on the two sides of the pin area I and the pin area II are clamped in corresponding inserting holes on the insulator.

Further, the maximum width of the outer sides of the contact areas I of the differential pairs formed by two adjacent signal pins in the first direction is smaller than the maximum width of the outer sides of the contact areas II of two adjacent grounding pins in the partition wall row in the first direction, and the projection of the outer sides of the contact areas I of the two adjacent signal pins in the second direction falls within the range of the outer sides of the contact areas II of the two adjacent grounding pins in the partition wall row.

Further, the maximum width in the first direction of the outer side of the linear region II of the differential pair composed of two adjacent signal pins is L1, the width in the first direction of the gap between the linear regions II of two adjacent ground pins in the partition row is L2, and the width in the first direction of the outer side of the linear region II of two adjacent ground pins is L3, and the relationship among the three is: l2 is more than or equal to 2T and less than L1, L3 is more than L1, the projection of L1 in the second direction falls into the range of L3, and T is the material thickness of the signal pin and the grounding pin.

Furthermore, the maximum width of the outer sides of the pin areas I of the differential pairs formed by the two adjacent signal pins in the first direction is smaller than the maximum width of the outer sides of the pin areas II of the two adjacent grounding pins in the partition row in the first direction, and the projection of the outer sides of the pin areas I of the two adjacent signal pins in the second direction falls into the range of the outer sides of the pin areas II of the two adjacent grounding pins in the partition row.

Furthermore, the back surface of the insulator is provided with a groove for mounting the common ground plate, and the groove penetrates through the insertion holes of all the grounding pins; after the common grounding plate is arranged in the groove, the contact part is contacted with the pin area II at the tail part of the grounding pin, and the contact part is fixedly connected with the corresponding pin area II by using a solder ball.

Furthermore, a solder ball is arranged in the pin area I of the signal pin.

Furthermore, the edge of the front side of the insulator is provided with a guide groove and a guide post which are convenient for positioning and inserting with another connector.

Furthermore, a positioning column for mounting the connector is arranged on the back surface of the insulator.

Compared with the prior art, the invention has the advantages that: after the interlayer connector is added with the common ground plate, the signal is interfered less.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.

Drawings

FIG. 1-1 is a schematic view of a prior art backplane bend-like plug assembly;

FIG. 1-2 is a schematic view of the common ground of FIG. 1-1;

FIG. 2-1 is a front view of an embodiment of a mezzanine connector of the present invention;

FIG. 2-2 is a side view of FIG. 2-1;

FIG. 2-3 is a partial cross-sectional view of FIG. 2-1;

fig. 2-4 is a perspective view of the signal pin of fig. 2-1;

fig. 2-5 are perspective views of the grounding pin of fig. 2-1;

FIG. 2-6-1 is a perspective view of the insulator of FIG. 2-1;

fig. 2-6-2 is a perspective view of the insulator of fig. 2-1 from another perspective;

2-6-3 are cross-sectional views of the insulator of FIG. 2-1;

2-6-4 are partial views of the insulator of FIG. 2-1;

FIG. 2-7-1 is a rear view of FIG. 2-1;

FIG. 2-7-2 is a schematic view of the common ground slice of FIG. 2-7-1;

2-7-3 are enlarged schematic views at A in FIGS. 2-7-2;

fig. 2-7-4 is a schematic view of the back side of the insulator of fig. 2-1;

FIGS. 2-7-5 are enlarged schematic views B of FIGS. 2-7-4;

FIGS. 2-8 are partial views of FIG. 2-1;

2-9 are contact distance diagrams of FIG. 2-1;

2-10 are schematic views of the contact member of FIG. 2-1 positioned on a web;

fig. 2-11 are schematic diagrams illustrating cross-talk comparisons between connectors of the present invention and connectors that do not use a common ground plane.

[ reference numerals ]

101-primary injection molding, 102-secondary injection molding, 2-shielding sheet, 3-contact piece, 301-differential signal pair, 4-grounding, 5-insulator, 501-guide groove, 502-guide post, 503-rib, 504-groove I, 505-groove II, 506-positioning post, 507-protrusion, 508-limiting area I, 509-limiting area II, 510-fixing area, 511-avoiding area I, 512-avoiding area II, 513-boss I, 514-boss II, 515-plug hole, 516-guide structure I, 517-groove, 6-signal pin, 601-contact area I, 602-linear area I, 603-pin area I, 604-interference point I, 7-contact pin, 701-contact area II, 702-linear area II, 703-pin area II, 704-interference point II, 8-solder ball, 9-material belt, 10-common ground plate, 1001-contact part, 1002-connection part, 1003-guide structure II.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

One embodiment of a mezzanine connector of the present invention is shown in fig. 2-1 through 2-11, which is inserted onto a PCB board in use. The electric connector comprises an insulator 5, a contact, a solder ball 8 and a common ground plate 10, wherein the contact comprises a signal pin 6 and a ground pin 7.

The insulator 5 is a rectangular plate, the extending direction of the longer side of the insulator 5 is taken as the first direction, the extending direction of the shorter side is taken as the second direction, the plugging surface of the connector is taken as the front surface, the other surface of the connector is taken as the back surface, one end of the contact which is in contact fit with the contact of the other electric connector is taken as the head, and the other end of the contact is taken as the tail.

The insulator 5 is fixed with a signal pin 6 and a ground pin 7, the signal pin 6 and the ground pin 7 form a multi-row queue, each row of queue is parallel to the first direction, the signal pin 6 and the ground pin 7 of each row of queue are distributed at intervals, at least 5 rows of queues are arranged in the second direction of the insulator 5, and in the embodiment, 7 rows of queues are arranged. S represents the signal pin 6, G represents the ground pin 7, and the distribution rule of the signal pin 6 and the ground pin 7 in each row queue is as follows: G-G-S-S-G-G- … …, which can realize the demand of high density and miniaturization, thereby realizing higher transmission rate. Solder balls 8 are welded at the tail parts of the signal pins 6 and the grounding pins 7, the signal pins 6 are in conductive connection with the PCB after the solder balls 8 are in contact with the PCB and heated and cooled, and the solder balls 8 are in conductive connection with a common grounding plate 10 arranged at the back of the insulator 5 at the tail parts of the grounding pins 7.

The insulator 5 is provided with a boss I513 at each of both edges of the longer side, the boss I513 is elongated and has a length equal to that of the insulator 5, and the boss I513 is provided on the front surface of the insulator 5. A guide groove 501 is formed in the middle of the boss I513 on one side of the insulator 5, the guide groove 501 is a rectangular groove, one side of the guide groove 501 is communicated with the outer surface of the boss I513 facing the inner side, and the other side of the guide groove 501 is communicated with the upper surface of the boss I513; the positions of the boss I513 on the same side, which are close to the two ends, are respectively provided with a guide column 502, the guide columns 502 are cuboid, the lower surfaces of the guide columns are fixed on the insulator 5, and one side surface of the guide columns is fixed on the inner side surface of the boss I513. The position of boss I513 on the other side of insulator 5 near both ends is opened with guide way 501, one side of guide way 501 here is through with the lateral surface of boss I513, the intermediate position of boss I513 here is provided with guide post 502, guide post 502 sets up on the lateral surface of boss I513, its bottom surface is fixed on the outside surface that extends of insulator 5, when this connector is inserted with another electric connector, guide post 502 and guide way 501 with the corresponding guide way of another electric connector, guide post are pegged graft, play the effect of location direction. The edge of the longer side of the back of the insulator 5 is provided with two positioning columns 506, the two positioning columns 506 are respectively close to the two ends of the longer side of the insulator 5, the positioning columns 506 are cylinders perpendicular to the insulator 5, and the positioning columns 506 play a positioning role in mounting the electric connector on a PCB. The tail end of the positioning column 506 is provided with a guide structure I516, and the guide structure I516 is positioned at the tail end of the guide column 506 and is a gradually narrowed circular table which is convenient for insertion.

Bosses II514 are respectively arranged at two edges of the shorter side of the insulator 5, and the bosses I513 and the bosses II514 around the insulator 5 enclose the middle position of the front side of the insulator 5 into a groove. A plurality of ribs 503 extending in the first direction are provided in the groove at the center of the front surface of the insulator 5, and in the present embodiment, there are four ribs 503 in total. Two ends of each rib 503 are in contact with bosses II514 at two sides, the rib 503 at one edge is in contact with a boss I513 at the edge of the insulator 5, the cross section of the rib 503 is in a convex shape, two sides of the rib 503 along the first direction are both provided with a groove I504 for inserting the signal pin 6 and a groove II505 for inserting the grounding pin 7, the rib 503 at the edge in contact with the boss I513 is only provided with a groove I504 and a groove II505 at the inner side, and the width of the groove II505 is larger than that of the groove I504. The bottom of the groove I504 and the groove II505 and the insulator 5 at the corresponding position are provided with an insertion hole 515 penetrating through the insulator 5, the insertion hole 515 is divided into a fixed area 510, an avoiding area I511 and an avoiding area II512, the avoiding area I511 is positioned at the bottom of the groove I504 or the groove II505, the fixed area 510 and the avoiding area I511 are positioned on the insulator 5 between the rib 503 and the rib 503, the widths of the avoiding area I511 and the avoiding area II512 are equal in the first direction, the width of the fixed area 510 is greater than that of the avoiding area I511 and that of the avoiding area II512 and is slightly smaller than that of the corresponding groove I504 or groove II505, and the fixed area 510 is positioned between the avoiding area I511 and the avoiding area II 512. The avoiding region I511 and the avoiding region II512 on the slot II505 are close to the adjacent slot I504. Two side walls of the avoiding area II512 are limiting areas for limiting the position of the tail of the contact element, the limiting area for limiting the signal pin 6 is a limiting area I508, and the limiting area for limiting the grounding pin 7 is a limiting area II 509. Every four adjacent insertion holes 515 in the same row are divided into a group, the middle two adjacent insertion holes 515 in the group are used for inserting the signal pins 6, and the two insertion holes 515 on the outer side are respectively used for inserting the corresponding two ground pins 7.

On the back of the insulator 5, a protrusion 507 is provided between each row of insertion holes 515 in the second direction, and in the first direction, the protrusion 507 is located at the edge of the insulator 5. When the electric connector is pressed on the PCB, the protrusion 507 increases the distance between the electric connector and the PCB, ensures that the solder ball 8 is not flattened, and increases the strength of the insulator 5.

The back of the insulator 5 is further provided with a groove 508, the groove 508 is communicated with the insertion holes 515 of all the insertion grounding pins 7, and the common ground plate 10 is installed in the groove 508 and used for connecting all the grounding pins 7. In this embodiment, there are 7 rows of insertion holes 515, the grooves 508 are distributed between every two rows of insertion holes 515, the grooves 508 are distributed in the insertion holes 515 on the outermost side of one row, the grooves 508 are also distributed at both ends of the insertion holes 515, and the grooves 508 between the insertion holes 515 are connected into a whole. The groove 508 is communicated with an insertion hole 515 for inserting the grounding pin 7, and the corresponding insertion hole 515 and the groove 508 are connected into a whole.

The contour of the segment 10 mounted in the groove 508 is similar to the contour of the groove 508, with an outer diameter slightly smaller than the inner diameter of the groove 508. The common ground plate 10 comprises a connecting portion 1002, the connecting portion 1002 is shaped like a long strip like a Chinese character 'mu', a plurality of contact portions 1001 are distributed on the connecting portion 1002, and the front ends of the contact portions 1001 are provided with guide structures II1003 which are convenient to insert into the grooves 508. After the common ground plate 10 is mounted in the recess 508, it is conductively connected to the ground pin 7 through the solder ball 8. After using the common ground slice 10, the signal is transmitted with less crosstalk, as shown in fig. 2-11, and the signal fluctuation after using the common ground slice is less than that of the common ground slice.

The signal pin 6 includes a contact area I601, a straight area I602, and a pin area I603. The signal pin 6 is made of a strip-shaped plate, and the main body of the signal pin is a linear area I603. The contact area I601 is located at the head of the signal pin 6 in the extending direction of the linear area I602 and protrudes to one side. The other extending direction of the straight line region I602 is a pin region I603, the pin region I603 is located at the tail of the signal pin 6, and the end of the pin region is tilted, and the tilting direction is opposite to the protruding direction of the contact region I601. An interference point I604 is arranged at a position, close to the pin area I603, of the linear area I602, the interference point I604 is located on end surfaces of two sides of the linear area I602, and two small short strips which are flush with the linear area I602 are respectively arranged on two sides of the linear area I602 and used for being clamped at the fixing area 510, so that the position of the signal pin 6 is fixed.

The grounding pin 7 comprises a contact area II701, a straight line area II702 and a pin area II 703. The straight line area II702 is provided with an interference point II704 near the pin area II 703. The grounding pin 7 has the same structure as the signal pin 6, except that the width of the interference point II704 of the grounding pin 7 is greater than the width of the interference point II604 on the signal pin 6, so that the interference point II704 at the end of the grounding pin 7 is firmly inserted into the corresponding fixing area 510.

The signal pin 6 and the grounding pin 7 are inserted into the insulator 5 at the corresponding positions. The contact area II601 of the signal pin 6 is positioned in the groove I504, and the contact area II701 of the grounding pin 7 is positioned in the groove II505 and is used for being in contact conduction connection with the signal pin and the grounding pin of another electric connector. The interference point I604 on the signal pin 6 and the interference point II704 on the ground pin 7 are clamped in the corresponding fixing area 510, the protruding directions of the contact area II601 of the signal pin 6 and the contact area II701 of the ground pin 7 face outwards, the pin area II603 of the signal pin 6 and the pin area II703 of the ground pin 7 are located in the corresponding avoiding area I511 and the avoiding area II512, and then the solder balls 8 are soldered at the corresponding positions of the pin area II603 of the signal pin 6 and the pin area II703 of the ground pin 7.

Two adjacent signal pins 6 form a differential pair, the maximum width in the first direction between the outer sides of the contact areas I601 of one differential pair is smaller than the maximum width in the first direction of the outer sides of the contact areas of two adjacent grounding pins 7 of the adjacent group in the same row, and is smaller than the maximum width in the first direction of the outer sides of the contact areas of two adjacent grounding pins 7 of the adjacent group in the partition wall row, and the projection in the second direction of the outer sides of the contact areas II601 of two adjacent signal pins 6 falls within the range of the outer sides of the contact areas II701 of two grounding pins 7 in the partition wall row.

The maximum width in the first direction of the outer side of the straight section II602 of one differential pair is L1, the width in the first direction of the gap between the straight sections of two adjacent grounding pins 7 in the same row or the next-door row is L2, and the width in the first direction of the outer side of the straight sections of two adjacent grounding pins 7 is L3, and the relationship among the three is: l2 is more than or equal to 2T and less than L1, L3 is larger than L1, the projection of L1 in the second direction falls into the range of L3, and T is the contact piece material thickness.

The maximum width of the outer sides of the pin areas II603 of one differential pair in the first direction is smaller than the maximum width of the outer sides of the pin areas II703 of two adjacent ground pins 7 in the first direction, and is smaller than the maximum width of the outer sides of the pin areas II703 of two ground pins 7 in the partition row in the first direction, and the projection of the outer sides of the pin areas of two signal pins 6 in the second direction falls within the range of the outer sides of the pin areas 703 of two ground pins 7 in the partition row.

According to the position arrangement of the signal pins 6 and the grounding pins 7, the grounding pins 7 are arranged around each differential pair to shield interference signals. The distribution of the contact portions 1001 on the common ground plane 10 and the arrangement of the recesses 508 are adapted to the position of the grounding pin 7. The contact portion 1001 is electrically connected to the corresponding lead region 703 at the tail end of the ground pin 7 via a solder ball 8.

The width of two grounding pins 7 in the first direction not only ensures the requirements of high density and miniaturization, but also can realize higher transmission rate, and has good product performance.

Before the contact elements are inserted, the signal pins 6 and the grounding pins 7 used in one row are positioned on the same material belt 9, after the contact elements are machined, the tails of the contact elements needed in the same row are connected with the material belt 9 through connecting materials, and adjacent contact elements are also connected through connecting materials. The S-S spacing (A1), the S-G spacing (A2), the G-G spacing (A3) and the pitch (A4) of the finished connector are respectively kept the same as the S-S spacing (B1), the S-G spacing (B2), the G-G spacing (B3) and the pitch (B4) designed on the tape. During assembly, the material belt 9 is adopted for one-time whole-line assembly, and after the assembly is in place, the tail connecting material is shaken and broken off; the technology can finish product assembly by only assembling for a plurality of times, greatly improves the assembly efficiency and can also ensure the true position of the product. The contact elements are distributed on the material belt in a G-G-S-S-G-G-S-S arrangement, and in other connectors, the contact elements can also be arranged in a G-S-S-G-S-S arrangement so as to be suitable for a backplane connector or a sandwich connector or other connectors.

Taking the present invention as an example, if the conventional assembly is adopted, one grounding pin is installed at a time, or a pair of signal pins are installed at a time, the whole assembly needs 146 times to be completed. If the design that the space between the contact elements in the material belt 9 is the same as that between the contact elements in the connector is adopted, the assembly is carried out in one row at one time, after the assembly is in place, the broken tail part connecting material is shaken, the assembly can be completed only by 7 times of assembly, and the assembly time can be saved by about 95 percent. The technology can finish product assembly by only assembling for a plurality of times, greatly improves the assembly efficiency and can also ensure the true position of the product.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a sandwich connector, includes insulator (5), signal needle (6), earth pin (7), and signal needle (6), earth pin (7) cartridge are on insulator (5), its characterized in that: the common ground plate (10) is further installed on the insulator (5), a plurality of contact parts (1001) are arranged on the common ground plate (10), each contact part (1001) is in conduction connection with the corresponding grounding pin (7), and the plurality of contact parts (1001) are connected into a whole through a connecting part (1002), so that all the grounding pins (7) are grounded; the signal pins (6) and the grounding pins (7) are arranged on the insulator (5) to form a multi-row queue, the signal pins (6) are defined as S, the grounding pins (7) are defined as G, and the distribution rule of the signal pins (6) and the grounding pins (7) in each row queue is as follows: G-G-S-S-G-G- … …; the signal pin (6) comprises a contact area I (601), a linear area I (602) and a pin area I (603), and the grounding pin (7) comprises a contact area II (701), a linear area II (702) and a pin area II (703); the extension direction of the longer side of the insulator (5) is defined as a first direction, the extension direction of the shorter side of the insulator is defined as a second direction, the extension directions of the arrays are parallel to the first direction, the maximum width of the outer side of a contact area I (601) of a differential pair formed by two adjacent signal pins (6) in the first direction is smaller than the maximum width of the outer side of a contact area II (701) of two adjacent ground pins (7) in a partition wall row in the first direction, and the projection of the outer sides of the contact areas I (601) of the two adjacent signal pins (6) in the second direction falls within the range of the outer sides of the contact areas II (701) of the two adjacent ground pins (7) in the partition wall row.

2. A mezzanine connector as defined in claim 1, wherein: the front surface of the insulator (5) is provided with a plurality of convex ribs (503), two sides of each rib (503) are provided with a groove I (504) for accommodating the contact area I (601) and a groove II (505) for accommodating the contact area II (701), the grooves I (504) and the contact areas I (601) are in one-to-one correspondence, and the grooves II (505) and the contact areas II (701) are in one-to-one correspondence; a linear area I (602) arranged at the tail end of the contact area I (601) and a linear area II (702) arranged at the tail end of the contact area II (701) extend towards the back of the insulator (5), and a pin area I (603) at the tail end of the linear area I (602) and a pin area II (703) at the tail end of the linear area II (702) are inserted into corresponding insertion holes (515) in the insulator (5); the interference points I (604) on the two sides of the pin area I (603) and the interference points II (704) on the two sides of the pin area II (703) are clamped in the corresponding insertion holes (515) on the insulator (5).

3. A mezzanine connector as claimed in claim 2, characterized in that: the maximum width of the outer side of the linear area I (602) of the differential pair formed by two adjacent signal pins (6) in the first direction is L1, the width of the gap between the linear areas II (702) of two adjacent grounding pins (7) in the next row in the first direction is L2, the width of the outer side of the linear area II (702) of two adjacent grounding pins (7) in the first direction is L3, and the relationship among the three is that: l2 is more than or equal to 2T and less than L1, L3 is more than L1, the projection of L1 in the second direction falls into the range of L3, and T is the material thickness of the signal pin (6) and the grounding pin (7).

4. A mezzanine connector as claimed in claim 2, characterized in that: the maximum width of the outer sides of the pin areas I (603) of the differential pairs formed by two adjacent signal pins (6) in the first direction is smaller than the maximum width of the outer sides of the pin areas II (703) of two adjacent grounding pins (7) in the partition line in the first direction, and the projection of the outer sides of the pin areas I (603) of two adjacent signal pins (6) in the second direction falls within the range of the outer sides of the pin areas II (703) of two adjacent grounding pins (7) in the partition line.

5. A mezzanine connector as defined in claim 1, wherein: the back of the insulator (5) is provided with a groove (508) for mounting the common ground plate (10), and the groove (508) penetrates through the insertion holes of all the ground pins (7); after the common grounding sheet (10) is arranged in the groove (508), the contact part (1001) is contacted with the pin area II (703) at the tail part of the grounding pin (7), and the contact part (1001) is fixedly connected with the corresponding pin area II (703) by using a solder ball (8).

6. A mezzanine connector as defined in claim 1, wherein: and a solder ball (8) is arranged in a pin area I (603) of the signal pin (6).

7. A mezzanine connector as defined in claim 1, wherein: the edge of the front surface of the insulator (5) is provided with a guide groove (501) and a guide post (502) which are convenient for positioning and inserting with another connector.

8. A mezzanine connector as defined in claim 1, wherein: and a positioning column (506) for mounting the connector is arranged on the back surface of the insulator (5).