CN113284883A

CN113284883A - Display module and electronic equipment

Info

Publication number: CN113284883A
Application number: CN202110350643.9A
Authority: CN
Inventors: 龙浩晖; 张立; 周洋
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-03-31
Filing date: 2021-03-31
Publication date: 2021-08-20
Also published as: WO2022206692A1

Abstract

The embodiment of the application provides a display module assembly and electronic equipment, relates to the technical field of display, and is used for solving the problems of low integration level and large thickness of the electronic equipment. The display module assembly includes: the light-emitting device comprises a carrier plate, a plurality of functional devices and a plurality of light-emitting components. The carrier plate is provided with a first surface. And the functional devices are borne on the carrier plate and used for realizing functions except for light emission. The light-emitting components are arranged on the first surface of the carrier plate; the light-emitting component comprises a light-emitting chip and a first circuit, wherein the light-emitting chip is coupled with the first circuit and is used for emitting light under the driving of the first circuit.

Description

Display module and electronic equipment

Technical Field

The application relates to the technical field of display, in particular to a display module and electronic equipment.

Background

With the development of display technology, electronic devices (e.g., mobile phones, tablets, etc.) have become an important tool for obtaining information and interconnecting interaction in the present era.

The electronic equipment mainly comprises a display module and other functional devices (such as a camera, a receiver, a fingerprint identification module, an antenna module, a memory, a sensor, a radio frequency device and the like). In the existing electronic equipment, functional devices are usually integrated on a main board, and a display module is assembled with the main board with various functional devices to realize related display and interaction functions.

However, in such a structure, on one hand, the display module needs to be assembled with the main board, which results in a low integration level of the electronic device. On the other hand, because a large number of functional devices need to be integrated on the main board, the integrated thickness of the functional devices is thicker, so that the thickness of the electronic equipment is larger, and the user experience and the perception requirements are influenced.

Disclosure of Invention

The embodiment of the application provides a display module and electronic equipment for solve the problems of low integration level and large thickness of the electronic equipment.

In order to achieve the purpose, the technical scheme is as follows:

in a first aspect of the embodiments of the present application, a display module is provided, which includes: a carrier plate having a first surface; the functional devices are borne on the carrier plate; the light-emitting components are arranged on the first surface of the carrier plate; the light-emitting component comprises a light-emitting chip and a first circuit, wherein the light-emitting chip is coupled with the first circuit and is used for emitting light under the driving of the first circuit.

The display module comprises functional devices and light-emitting components which are arranged on the carrier plate, and space and thickness on the carrier plate are fully utilized to perform ultra-thinning and high-performance integration. Through the integration, the area of the PCBA mainboard can be further reduced, even the PCBA mainboard is completely removed (no PCB is required to be arranged), the display module is a heterogeneous integrated full-display system framework, and all devices and modules in the display module can be integrated in the display. The integrated level of display module assembly is high, can leave bigger space like this and give the battery, perhaps reduces display module assembly's thickness and weight, promotes human-computer interaction and experiences, promotes product competitiveness. In addition, all devices and modules in the display module are integrated in the display, so that the interconnection and assembly processes of main units in the display module can be removed, the function integration of the display module is realized, the process of the whole machine is simplified, and the assembly cost is saved.

Optionally, the display module further includes an insulating layer covering the surfaces of the plurality of light emitting elements for spacing the plurality of light emitting elements apart from each other. Each light-emitting component is an independent light-emitting unit, and a plurality of light-emitting components are directly connected to the carrier plate in the preparation process of the display module. Therefore, when the circuit layout design is carried out on the carrier plate, the layout of the first wiring for communicating the first circuit with the light-emitting chip signals does not need to be considered, and the layout of the second wiring for communicating the first circuit with the main board is mainly considered, so that the flexibility of the circuit layout on the carrier plate is higher.

Optionally, the light emitting assembly further comprises a chip element, and the first circuit is integrated in the chip element. The light-emitting component comprises a light-emitting chip and a chip element, wherein the chip element comprises a first circuit, the first circuit is equivalent to the integrated design of the light-emitting chip and the first circuit for driving the light-emitting chip to emit light, and each light-emitting component is an independent light-emitting unit. In the preparation process of the display module, when the circuit layout design is carried out on the carrier plate, the layout of the first circuit does not need to be considered, so that the flexibility of the circuit layout on the carrier plate is higher.

Optionally, the display module further includes a second circuit, and at least a part of the plurality of chip elements is integrated with the second circuit, and the second circuit is used for realizing functions other than driving the light emitting chip to emit light. By integrating part of the circuits (the second circuit for realizing the functions except for driving the light-emitting chip to emit light) in the display module with the first circuit on the same chip element, the integration level of the circuits in the display module can be improved to a certain extent, and a HiSID integrated system is realized.

Optionally, each light emitting assembly includes a plurality of light emitting chips, and the plurality of light emitting chips are insulated from each other. On one hand, the area of the light-emitting component can be increased, and the assembly operation is convenient. On the other hand, the integration of the plurality of first circuits in the chip element can be further improved.

Optionally, the first circuit is disposed on the first surface, and the first circuits in the plurality of light emitting assemblies are disposed on the same layer. The plurality of first circuits are arranged on the same layer, and when the first circuits are prepared, all film layers with the same function in a plurality of circuit structures in the display module can be synchronously formed and arranged on the same layer, so that the occupied area of a circuit packaging area is reduced, and the integration level of the display module can be improved.

Optionally, the display module further includes a second circuit, and the second circuit is used for implementing functions other than driving the light emitting chip to emit light; the second circuit is arranged in the same layer as the first circuit. The first circuits and the second circuits are arranged on the same layer, and when the first circuits and the second circuits are prepared, the film layers with the same function in the circuit structures in the display module can be synchronously formed and arranged on the same layer, so that the occupied area of a circuit packaging area is reduced, and the integration level of the display module is further improved.

Optionally, the display module comprises a display area; the display area comprises a plurality of sub-pixel areas; the light emitting chip is positioned in the sub-pixel area; at least part of the plurality of functional devices is arranged on the first surface and is positioned in the sub-pixel area. The functional device and the light-emitting component are arranged on the first surface of the carrier plate, the functional device is arranged in the blank area in the sub-pixel area, the whole area of the display module is fully utilized, the structure is simple, and the thickness of the display module is small.

Optionally, the carrier further includes a second surface, and the second surface is disposed opposite to the first surface; at least part of the plurality of functional devices is disposed on the second surface. In the scheme, the light-emitting component and the functional device are respectively arranged on the first surface and the second surface of the carrier plate, the process is simple, the implementation is easy, the size of the sub-pixel area of the display module is not required, and the pixel density (PPI) of the display module can be improved.

Optionally, the display module comprises a display area; at least part of the functional devices are embedded in the carrier plate and are positioned in the display area. In this scheme, with in the function device embedding support plate, the function device need not to occupy the ascending space of thickness side, can improve display module assembly's integrated level, reduces display module assembly's thickness. In addition, the functional device is arranged in the display area, so that the area of the peripheral area is not increased, and the screen occupation ratio of the display module can be improved.

Optionally, a wiring layer is disposed on the carrier, and the functional device and the light emitting assembly are coupled to the wiring layer respectively. The wiring layer is directly arranged on the carrier plate, the process is simple, components such as a temporary carrier plate are not needed, and the implementation is easy.

Optionally, the carrier plate is a wiring layer; the functional device and the light emitting assembly are coupled to the wiring layers, respectively. The carrier plate can be omitted, so that the display module is light and thin.

Optionally, the functional device is coupled to the wiring layer by one of a eutectic bonding process, a low temperature bonding process, an anisotropic conductive film coupling, or a direct contact coupling. The eutectic bonding process is mature and simple, and the environmental reliability is high. The low temperature bonding process may be applied to coupling of a plurality of pads of a smaller pitch (pitch) to other components. Due to the coupling of the anisotropic conductive film, the realization is simple and the cost is low. Direct contact coupling enables repeated use of semiconductor processes to achieve coupling of smaller pitch pads to other components.

Optionally, the light emitting element is coupled to the wiring layer by one of a eutectic bonding process, a low temperature bonding process, an anisotropic conductive film coupling, or a direct contact coupling.

Optionally, the functional device includes one of a power management module, an image processor, a central processing unit, a flash memory, a double data rate memory, a system-on-chip, a radio frequency module, a photosensitive chip, a fingerprint recognition chip, an iris recognition chip, a face recognition chip, a sensor chip, a power manager, an antenna module, a receiver, a microphone, a timing controller, a touch sensing chip, a wireless controller, a bluetooth module, an inertial sensor, or a pressure gauge.

Optionally, the second circuit includes one of a power management circuit, an image processing circuit, a fingerprint recognition circuit, an iris recognition circuit, a face recognition circuit, a power management circuit, a processor circuit, or a memory circuit.

In a second aspect of the embodiments of the present application, a display module is provided, which includes: a circuit board having third and fourth opposing surfaces; the functional device is arranged on the third surface and is coupled with the circuit board; and the light-emitting element is arranged on the fourth surface and is coupled with the circuit board. The functional device and the light-emitting element are arranged on two opposite sides of the circuit board, the substrate in the TFT backboard is removed, and the circuit board is directly used as the substrate to form board-level heterogeneous integration. Compared with the traditional AMOLED display module, the substrate is not needed, the functional device and the screen on the PCB are integrated, and the thickness and the weight of the display module can be effectively reduced. In addition, because the functional device and the light-emitting element are integrated on the circuit board, the TFT backboard and the circuit board do not need to be interconnected and assembled, the thickness of the display module can be reduced, and the integration level of the display module is improved.

Optionally, the display module further includes a first circuit disposed on the third surface, and the light emitting element is coupled to the first circuit and is driven by the first circuit to emit light.

Optionally, the circuit board is a hard circuit board.

In a third aspect of the embodiments of the present application, an electronic device is provided, which includes a battery and the display module according to any one of the first aspect, wherein the battery is located on a back surface of the display module.

The electronic device includes the display module of any one of the first aspect, and the advantageous effects thereof are the same as those of the display module, and are not repeated herein.

In a fourth aspect of the embodiments of the present application, an electronic device is provided, which includes a battery and the display module of the second aspect, wherein the battery is located on a back surface of the display module.

The electronic device comprises the display module of any one of the second aspect, and the beneficial effects thereof are the same as those of the display module, and are not repeated herein.

Drawings

Fig. 1A is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

fig. 1B is a schematic structural diagram of a display module according to an embodiment of the present disclosure;

fig. 1C is a schematic structural diagram of another display module provided in the embodiment of the present application;

fig. 2A is a schematic structural diagram of another display module provided in the embodiment of the present application;

fig. 2B is a schematic structural diagram of a light emitting device according to an embodiment of the present disclosure;

fig. 2C is a schematic layout diagram of a light emitting chip according to an embodiment of the present disclosure;

fig. 2D is a schematic structural diagram of another light emitting device provided in the present embodiment;

fig. 2E is a schematic structural diagram of another display module provided in the embodiment of the present application;

fig. 2F is a schematic structural diagram of another light emitting device provided in the present embodiment;

fig. 2G is a schematic structural diagram of another light emitting device provided in the present embodiment;

fig. 2H is a schematic view illustrating a manufacturing process of a display module according to an embodiment of the disclosure;

fig. 3A is a schematic diagram illustrating an arrangement position of a functional device according to an embodiment of the present disclosure;

fig. 3B is a schematic diagram of an arrangement position of another functional device provided in the embodiment of the present application;

fig. 3C is a schematic diagram illustrating an arrangement position of another functional device according to an embodiment of the present application;

fig. 3D is a schematic diagram illustrating an arrangement position of another functional device provided in the embodiment of the present application;

fig. 3E is a schematic diagram illustrating an arrangement position of another functional device according to an embodiment of the present application;

fig. 3F is a schematic diagram illustrating an arrangement position of another functional device according to an embodiment of the present application;

fig. 3G is a schematic diagram of a position where another functional device is disposed according to an embodiment of the present application;

fig. 3H is a top view of a display module according to an embodiment of the disclosure;

fig. 4A is a schematic diagram of a layout position of a wiring layer according to an embodiment of the present application;

fig. 4B is a schematic diagram of a placement position of another wiring layer according to an embodiment of the present application;

fig. 4C is a schematic diagram of a disposition position of another wiring layer according to an embodiment of the present application;

fig. 4D is a schematic diagram of a setting position of another wiring layer according to an embodiment of the present application;

fig. 4E is a schematic diagram of a setting position of another wiring layer according to an embodiment of the present application;

fig. 4F is a schematic diagram of a disposition position of another wiring layer according to an embodiment of the present application;

fig. 5A is a schematic view illustrating a manufacturing process of another display module according to an embodiment of the disclosure;

fig. 5B is a schematic diagram illustrating a process for manufacturing a wiring layer according to an embodiment of the present disclosure;

fig. 6A is a schematic diagram of a disposition position of another wiring layer according to an embodiment of the present application;

fig. 6B is a schematic diagram of a disposition position of another wiring layer according to an embodiment of the present application;

fig. 7A is a schematic diagram illustrating an arrangement position of another functional device according to an embodiment of the present application;

fig. 7B is a schematic diagram illustrating an arrangement position of another functional device according to an embodiment of the present application;

fig. 7C is a schematic diagram illustrating an arrangement position of another functional device according to an embodiment of the present application;

fig. 8A is a schematic view illustrating a coupling manner of a light emitting device and a wiring layer according to an embodiment of the present disclosure;

fig. 8B is a schematic view illustrating another coupling manner of the light emitting device and the wiring layer according to the embodiment of the present application;

fig. 8C is a schematic view illustrating a coupling manner of a light emitting device and a wiring layer according to an embodiment of the disclosure;

fig. 8D is a schematic view illustrating a coupling manner of a light emitting device and a wiring layer according to another embodiment of the present disclosure;

fig. 9A is a schematic structural diagram of another display module provided in the embodiment of the present application;

fig. 9B is a schematic structural diagram of another display module provided in the embodiment of the present application;

fig. 9C is a schematic layout view of traces on a carrier provided in the related art;

fig. 10A is a schematic structural diagram of another light emitting device provided in this embodiment of the present application;

fig. 10B is a schematic structural diagram of a TFT according to an embodiment of the present application;

fig. 10C is a schematic structural diagram of another light emitting device provided in the present embodiment;

fig. 11 is a schematic structural diagram of another display module according to an embodiment of the present application.

Drawings

01-a display module; 02-a battery; 03-a substrate; 04-a circuit board; 05-a light-emitting element; 10-a carrier plate; 11-a conductive via; 20-a functional device; 30-a light emitting component; 31-a light emitting chip; 31 a-a first light emitting chip; 31 b-a second light emitting chip; 31 c-a third light emitting chip; 32-chip elements; 321-a first circuit; 322-a second circuit; 40-a wiring layer; 50-an insulating layer.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.

Hereinafter, the terms "second", "first", and the like are used for descriptive convenience only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "second," "first," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

In addition, in the embodiments of the present application, the directional terms "upper", "lower", "left", "right", etc. may include, but are not limited to, being defined relative to the schematically-placed orientation of the components in the drawings, it being understood that these directional terms may be relative concepts that are used for descriptive and clarity purposes relative to the components, and that they may vary accordingly depending on the orientation of the components in the drawings.

In the embodiments of the present application, unless otherwise explicitly specified or limited, the term "connected" is to be understood broadly, for example, "connected" may be a fixed connection, a detachable connection, or an integral body; may be directly connected or indirectly connected through an intermediate. In addition, the term "coupled" may be directly electrically connected or indirectly electrically connected through an intermediate. The term "contacting" may be either direct or indirect through an intermediary.

In the embodiment of the present application, "and/or" describes an association relationship of associated objects, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist simultaneously, and B exists alone, wherein A and B can be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.

The embodiment of the application provides an electronic device, and the electronic device can include mobile phones (mobile phones), tablet computers (pads), televisions, intelligent wearable products (for example, smart watches and smart bracelets), Virtual Reality (VR) terminal devices, Augmented Reality (AR) terminal devices and other electronic products with a display function. The embodiment of the present application does not specifically limit the specific form of the electronic device. For convenience of description, the electronic device is a mobile phone as shown in fig. 1A.

The electronic device may include a display module 01 for displaying an image, and a battery 02 located at a back of the display module 01, the battery 02 being used for supplying power to the display module 01.

The back of the display module 01 is opposite to the light-emitting surface of the display module 01.

Currently, a display module capable of self-emitting light, for example, a display module using an Active Matrix Organic Light Emitting Diode (AMOLED) technology, has an Organic Light Emitting Diode (OLED) disposed in a sub-pixel. Gray scale display can be realized by controlling the brightness of different OLEDs. Therefore, a backlight unit (BLU) for providing a backlight source is not required, so that the thickness of the display module can be reduced.

As shown in fig. 1B, a Thin Film Transistor (TFT) backplane and a Printed Circuit Board (PCB) for carrying the functional device 20 are disposed in the AMOLED display module.

The functional device 20 may be, for example, a Power Management Unit (PMU), a Graphics Processing Unit (GPU), a Central Processing Unit (CPU), a flash memory (UFS), a Double Data Rate (DDR) memory, a System On Chip (SOC), a radio frequency unit (RRU), or the like.

The TFT backboard comprises a substrate 03 and a driving circuit which is arranged on the substrate 03 and mainly consists of TFTs, wherein the driving circuit is used for driving the OLED device positioned above the TFT backboard to emit light. The TFT back plate is coupled with the PCB through the FPC to receive a driving signal transmitted by the PCB. The FPC and the PCB may be connected by a Board To Board (BTB) connector, for example.

In order to increase the integration of the display module, as shown in fig. 1B, the functional devices 20 on the PCB are stacked and assembled (POP) to form a System In Package (SIP), so as to reduce the layout area of the PCB, increase the integration of the display module, and reduce the overall size.

The scheme of stacking and assembling may be, for example, to integrate and package a switch, a filter, and a Power Amplifier (PA) in a radio frequency front end into a single-sided SIP module, and to integrate and package a wireless network (wifi) module into a double-sided SIP module. Alternatively, as shown in FIG. 1B, a stack of DDR and SOC is assembled.

However, although the above solution is intended to reduce the area of a Printed Circuit Board Assembly (PCBA) to improve the integration of the display module 01. However, since the TFT backplane and the PCB are separated, the system integration level is limited by the area and thickness of the PCB, which is not favorable for the light and thin design of the electronic device. In addition, the discrete architecture of the PCB and the TFT backplane also increases the process steps and cost for interconnection and assembly of the PCB and the TFT backplane, and the whole cannot meet the current trend of ultra-thin and high-performance development of the whole machine.

Based on this, the embodiment of the present application further provides a display module 01, as shown in fig. 1C, the display module 01 includes a circuit board 04, a functional device 20, and a light emitting element 05 (e.g., an OLED).

The circuit board 04 has a third surface A3 and a fourth surface a4, the third surface A3 and the fourth surface a4 being disposed opposite to each other. The functional device 20 is disposed on the third surface a3 of the circuit board 04 and coupled to the circuit board 04. The light emitting element 05 is disposed on the fourth surface a4 of the circuit board 04 and coupled to the circuit board 04.

In some embodiments of the present application, as shown in fig. 1C, a driving circuit mainly composed of TFTs is disposed on the fourth surface a4 of the circuit board 04, and is coupled to the light emitting element 05, for driving the light emitting element 05 to emit light. Based on this, the driving circuit is coupled to the circuit board 04, and the light emitting element 05 is coupled to the circuit board 04 through the driving circuit.

In the embodiment of the application, the functional device 20 and the light-emitting element 05 are arranged on two opposite sides of the circuit board 04, the substrate 03 in the TFT backplane is removed, and the circuit board 04 is directly used as a substrate, so that board-level heterogeneous integration is formed. Therefore, compared with the AMOLED display module shown in fig. 1B, the display module 01 provided in the embodiment of the present application does not need to use the substrate 03, and integrates the functional device 20 on the PCB and the screen into a whole, so that the thickness and the weight of the display module 01 can be effectively reduced. In addition, because the functional device 20 and the light-emitting element 05 are integrated on the circuit board 04, the TFT backplane and the circuit board 04 do not need to be interconnected and assembled, the thickness of the display module 01 can be reduced, and the integration level of the display module 01 is improved.

The embodiment of the present application further provides a display module 01, and the structure of the display module 01 is described in detail through different examples below.

Example 1

In this example, as shown in fig. 2A, a display module 01 in an electronic device may include a carrier 10, and a plurality of functional devices 20 and a plurality of light emitting assemblies 30 carried on the carrier 10.

The carrier 10 is not limited in the embodiments of the present application, and in some embodiments of the present application, the carrier 10 is a carrier substrate made of a flexible material or a rigid material. For example, the carrier 10 may be a flexible carrier, for example, a material constituting the carrier is Polyimide (PI). The carrier 10 may also be a rigid carrier, for example, the material constituting the carrier 10 is glass, monocrystalline silicon or silicon dioxide.

Alternatively, in other embodiments of the present application, the carrier board 10 is a carrier board formed by a wiring layer. I.e. the wiring layer directly acts as a carrier board 10 in this example. The wiring layer may include a single metal wire layer or a plurality of metal wire layers as needed, and an example is a re-distribution layer (RDL). For convenience of description, the following description will be given by taking an example in which the wiring layer includes a plurality of metal wiring layers.

As shown in fig. 2A, the carrier board 10 may have a first surface a1 and a second surface a2 disposed oppositely, and the plurality of light emitting assemblies 30 are disposed on the first surface a1 of the carrier board 10.

The arrangement of the light emitting assemblies 30 is not limited, and in some embodiments, the light emitting assemblies 30 are arranged in an array.

As shown in fig. 2B, the light emitting assembly 30 may include a light emitting chip 31 and a chip element 32, a first circuit 321 (or a driving circuit) is integrated in the chip element 32, the light emitting chip 31 is coupled to the first circuit 321, and the light emitting chip 31 is configured to emit light under the driving of the first circuit 321.

The light emitting chip 31 is formed by a semiconductor chip manufacturing process, and crystal grains arranged in an array are formed on a wafer (wafer), and each crystal grain has a light emitting layer. Then, the wafer on which the dies are formed is diced so that the dies are independent from each other, and each of the independent dies after dicing is used as the light emitting chip 31.

In some embodiments of the present application, the light emitting chip 31 may be a micro Light Emitting Diode (LED) with a grain size of several tens of micrometers. Alternatively, the light emitting chip 31 may be a small (mini) LED having a crystal grain size of 100 μm or more. The light emitting chip 31 is a current driving device.

In this case, each light emitting chip 31 may serve as a sub-pixel of the display module 01. The plurality of light emitting chips 31 form one pixel (pixel) of the display module 01, the plurality of light emitting chips 31 located in the same pixel are referred to as a light emitting group, and the plurality of light emitting chips 31 in the same light emitting group can emit at least three primary colors (red, green, and blue), so that the display module 01 can display an image.

For example, as shown in fig. 2C, the plurality of light emitting chips 31 in the same light emitting group may include a first light emitting chip 31a, a second light emitting chip 31b, and a third light emitting chip 31C. The first light emitting chip 31a, the second light emitting chip 31b and the third light emitting chip 31c may be respectively configured to emit light of three primary colors. For example, the first, second, and third light-emitting

chips

31a, 31B, and 31c may be used to emit red (red, R), blue (B), and green (G) light, respectively. In this way, the first light emitting chip 31a, the second light emitting chip 31b, and the third light emitting chip 31c in the same light emitting group may constitute one pixel (pixel). By adjusting the respective light emitting brightness of the first light emitting chip 31a, the second light emitting chip 31b and the third light emitting chip 31c in the same light emitting group, the purpose of displaying the pixel gray scale of the image when the display module 01 performs color display can be achieved.

Taking the light emitting chip 31 as a micro LED as an example, the micro LED has lower power consumption compared with an OLED, and is beneficial to reducing the volume of a battery in the display module 01. In addition, micro LEDs have higher brightness and smaller size and thus have a smaller aperture ratio than OLEDs. Therefore, the component space in the display module 01 can be effectively saved, and more electronic components can be integrated.

Based on this, in order to be able to drive the light emitting chip 31 in the light emitting assembly 30 to emit light, as shown in fig. 2B, a first circuit 321 is integrated in the chip element 32. For example, the first circuit 321 is fabricated by a Complementary Metal Oxide Semiconductor (CMOS) process. The light emitting chip 31 is coupled to the first circuit 321, and the first circuit 321 is used for driving the light emitting chip 31 to emit light.

It should be noted that the first circuit 321 may include a plurality of transistors formed by a CMOS process. The first circuit 321 described above may include a driving transistor and a plurality of switching transistors. The data voltage associated with the display data may be written to the driving transistor by controlling the switching transistor to be turned on and off. The driving transistor may generate a driving current matched to the data voltage according to the data voltage. Since the light emitting chip 31 is a current driving device, when the driving current flows through the light emitting chip 31, the light emitting chip 31 can be driven to emit light. By controlling the magnitude of the driving current, the light emission luminance of the light emitting chip 31 can be controlled. The present application does not limit the connection manner of the plurality of transistors in the first circuit 321, as long as the purpose of driving the light emitting chip 31 electrically connected thereto to emit light can be achieved.

Based on the above, in some embodiments of the present application, as shown in fig. 2B, each light emitting assembly 30 may include one light emitting chip 31 and one chip element 32, and the first circuit 321 is integrated in the chip element 32. One light emitting device 30 is used as a sub-pixel of the display module 01 for realizing the display function.

In other embodiments of the present application, as shown in fig. 2D, each light emitting assembly 30 includes a plurality of light emitting chips 31 and a chip element 32, and the chip element 32 has a first circuit 321 integrated therein for driving the plurality of light emitting chips 31 to emit light. Illustratively, a plurality of light emitting chips 31 form one of the light emitting groups, and one light emitting assembly 30 is used as one pixel of the display module 01 for implementing the display function.

In either configuration, the plurality of light emitting elements 30 are independent of each other, and each light emitting element 30 is an independent component. When the display module 01 is manufactured, the light emitting elements 30 are coupled to the carrier 10.

It is understood that the plurality of light emitting chips 31 may be independent dies or dies connected together. Of course, in any configuration, the plurality of light emitting chips 31 in the same light emitting module 30 are insulated from each other.

In addition, the transistors included in the plurality of first circuits 321 in the chip element 32 may be formed simultaneously to simplify the manufacturing process.

In some embodiments of the present application, as shown in fig. 2E, the chip element 32 is disposed between the light emitting chip 31 and the carrier board 10, i.e., the light emitting chip 31 and the chip element 32 are stacked.

Thus, the area occupied by each light emitting element 30 in the lateral direction can be reduced to improve the integration of the light emitting elements 30.

Regarding the structural design of the light emitting chip 31 and the chip element 32, in some embodiments of the present application, as shown in fig. 2F, the active surface C1 of the chip element 32 faces the light emitting chip 31 and is directly coupled to the light emitting chip 31. The chip element 32 is provided therein with a TSV, one end of which is coupled to the active surface C1 of the chip element 32, and the other end is used for coupling the light emitting assembly 30 to other components. The surface of the chip element 32 on which the transistor is provided is referred to as an active surface C1.

In other embodiments of the present application, as shown in fig. 2G, the active surface C1 of the chip element 32 faces away from the light emitting chip 31. The chip element 32 is provided therein with a TSV, two ends of the TSV are respectively coupled to the active surface C1 of the chip element 32 and the light emitting chip 31, and the active surface C1 of the chip element 32 is directly coupled to other components.

Taking the light emitting assembly 30 shown in fig. 2G as an example, the display module 01 may be prepared as shown in fig. 2H, for example, a plurality of light emitting chips 31 may be bonded on a wafer, the wafer includes a plurality of chip elements 32, and one chip element 32 corresponds to one light emitting chip 31. The bonding process may be, for example, a chip to wafer (C2W) process. The wafer is then diced to form a plurality of light emitting elements 30. The light emitting assembly 30 and the functional device 20 are subsequently soldered to the carrier plate 10, for example by means of a eutectic bonding process.

In addition, the embodiment of the present application does not limit the specific type of the functional device 20, and devices for enriching the functions of the electronic device are all suitable for the present application. The functional device 20 may be, for example, a power management module, an image processor, a central processing unit, a flash memory, a double data rate memory, a system on chip, a radio frequency module, a light sensing chip, a fingerprint recognition chip, an iris recognition chip, a face recognition chip, a sensor chip, a power manager, an antenna module, a Microphone (MIC), a timing controller, a touch sensing chip, a wireless controller, a bluetooth module, an inertial sensor, a pressure gauge, etc.

As can be seen from the above description, the functional device 20 is carried on the carrier 10, and the embodiment of the present application does not limit the arrangement position of the functional device 20 on the carrier 10, and does not need to separately provide a support plate, and the carrier 10 is used as the support plate.

As shown in fig. 2F, a first possible arrangement of the functional device 20 is as follows: the functional device 20 may be disposed on the first surface a1 of the carrier board 10.

As shown in fig. 3A, the display module 01 includes a display area (AA, alternatively referred to as an effective display area), where the display area AA includes a plurality of sub-pixel areas B arranged in an array, and each sub-pixel area B is provided with a sub-pixel, that is, each sub-pixel area B is provided with a light emitting chip 31.

In some embodiments of the present application, the functional device 20 is located in the sub-pixel region B, as shown in fig. 3A.

Based on the structure shown in fig. 2F, the carrier board 10 may be the carrier substrate or the wiring layer.

In this embodiment, the functional device 20 and the light emitting element 30 are both disposed on the first surface a1 of the carrier 10, and the functional device 20 is disposed in the blank area of the sub-pixel region B, so that the whole area of the display module 01 is fully utilized, the structure is simple, and the thickness of the display module 01 is relatively small.

As shown in fig. 3B, a second possible arrangement of the functional device 20 is as follows: the functional device 20 may be disposed on the second surface a2 of the carrier board 10.

That is, the light emitting assembly 30 is disposed on the first surface a1 of the carrier 10, and the functional device 20 is disposed on the second surface a2 of the carrier 10.

Based on the structure shown in fig. 3B, the carrier board 10 may be the carrier substrate or the wiring layer.

In the present embodiment, the light emitting device 30 and the functional device 20 are respectively disposed on the first surface a1 and the second surface a2 of the carrier 10, which is simple in process and easy to implement, has no requirement on the size of the sub-pixel region of the display module 01, and can improve the pixel density (PPI) of the display module 01.

As shown in fig. 3C, a third possible arrangement of the functional device 20 is as follows: the functional device 20 is embedded in the carrier plate 10.

Embedding is to be understood as meaning fixing or erecting firmly or deeply, and is to be understood as embedding or embedding.

Regarding the way of embedding the functional device 20 into the carrier board 10, in some embodiments of the present application, a groove is formed at the second surface a2 of the carrier board 10, and the functional device 20 is embedded into the groove.

In further embodiments of the present application, the functional device 20 is supported by a temporary carrier plate, and then the functional device 20 is encapsulated to form a structure in which the functional device 20 is embedded in the carrier plate 10.

The transfer surface (i.e., the surface provided with the pads) of the functional device 20 for signal transfer with other components may face the first surface a1 of the carrier board 10 or face the second surface a2 of the carrier board 10.

Based on the structure shown in fig. 3C, the structure of the carrier 10 may be the above-mentioned carrier substrate, such as a glass substrate or a PI substrate. Or the structure of the carrier board 10 may be a rewiring layer.

In this scheme, with in the functional device 20 embedding support plate 10, functional device 20 need not to occupy the ascending space of thickness direction, can improve display module assembly 01's integrated level, reduces display module assembly 01's thickness.

It is understood that the display module 01 includes a plurality of functional devices 20, and the plurality of functional devices 20 may adopt any one of the three arrangements. That is, the plurality of functional devices 20 in the display module 01 may be arranged in any combination of the three manners.

In some embodiments of the present application, as shown in fig. 2E, the functional devices 20 in the display module 01 are all arranged in the first manner. That is, the functional device 20 is disposed on the first surface a1 of the carrier 10.

In other embodiments of the present application, as shown in fig. 3B, the plurality of functional devices 20 in the display module 01 are all arranged in the second manner. That is, the functional device 20 is disposed on the second surface a2 of the carrier board 10.

In other embodiments of the present application, as shown in fig. 3C, the functional devices 20 in the display module 01 are all arranged in the third manner. I.e. the functional device 20 is embedded in the carrier plate 10.

In other embodiments of the present application, as shown in fig. 3D, some of the functional devices 20 in the display module 01 adopt the first arrangement mode, and some of the functional devices 20 adopt the second arrangement mode.

In other embodiments of the present application, as shown in fig. 3E, some of the functional devices 20 in the display module 01 adopt the first arrangement mode, and some of the functional devices 20 adopt the third arrangement mode.

In other embodiments of the present application, as shown in fig. 3F, some of the functional devices 20 in the display module 01 adopt the second arrangement mode, and some of the functional devices 20 adopt the third arrangement mode.

In other embodiments of the present application, as shown in fig. 3G, in the display module 01, a plurality of functional devices 20, a part of the functional devices 20 adopt the first arrangement, a part of the functional devices 20 adopt the second arrangement, and a part of the functional devices 20 adopt the third arrangement.

In this way, in any of the above-mentioned arrangements, the functional device 20 and the light emitting element 30 in the display module 01 are integrated on the carrier 10. As shown in fig. 3H, the display module 01 includes a display area (AA, alternatively referred to as an effective display area) and a peripheral area located at the periphery of the display area. In this example, no matter where the functional device 20 is disposed on the carrier 10, the functional device 20 can be located in the display area AA of the display module 01, so as to reduce the area of the peripheral area and improve the screen area ratio of the display module 01.

In addition, by flexibly laying out the functional device 20, a part of the functional device 20 (for example, a radio frequency unit) which is affected by the interference of the light emitting chip 31 to the performance can be arranged at a position far away from the light emitting chip 31, so that the functional device 20 is far away from the interference of the light emitting chip 31 to ensure the performance of the functional device 20.

In some embodiments of the present application, as shown in fig. 4A, the display module 01 further includes a wiring layer 40, and the light emitting assembly 30 and the functional device 20 are respectively coupled to the wiring layer 40.

The metal traces in the wiring layer 40 transmit the driving signal to the first circuit 321 in the light emitting assembly 30 to drive the light emitting chip 31 to emit light. The metal traces in the wiring layer 40 are also used for transmitting the working signals corresponding to the functional devices 20, so that the functional devices 20 realize the corresponding functions.

It is understood that the wiring layer 40 is used for transmitting signals to the light emitting assemblies 30 and the functional devices 20, and therefore, the arrangement position of the wiring layer 40 is related to the arrangement positions of the light emitting assemblies 30 and the functional devices 20, but in any arrangement, the wiring layer 40, the light emitting assemblies 30 and the functional devices 20 are all carried by the carrier board 10.

The wiring layer 40 may include a single metal wire layer or a plurality of metal wire layers according to the wiring in the display module 01. For convenience of description, the embodiments of the present application will be described with reference to a wiring layer and a multilayer metal wire layer as an example.

The relative positional relationship between the functional device 20 and the wiring layer 40 will be described first, and then the coupling manner of the light emitting element 30 and the functional device 20 to the wiring layer 40 will be described.

As regards the location of the wiring layer 40, in a possible embodiment, the wiring layer 40 may be provided on the carrier board 10.

The wiring layer 40 is directly arranged on the carrier plate 10, so that the process is simple, components such as a temporary carrier plate are not needed, and the implementation is easy.

Regarding the relative positional relationship of the functional device 20 and the wiring layer 40, in some embodiments of the present application, as shown in fig. 4A, the light emitting assembly 30 and the functional device 20 are both disposed on the first surface a1 of the carrier board 10, and the wiring layer 40 may be disposed between the light emitting assembly 30 and the functional device 20 and the carrier board 10. Illustratively, the wiring layer 40 is disposed on the first surface a1 of the carrier board 10.

In other embodiments of the present application, as shown in fig. 4B, the light emitting assembly 30 is disposed on the first surface a1 of the carrier board 10, the functional device 20 is disposed on the second surface a2 of the carrier board 10, and the wiring layer 40 is disposed between the light emitting assembly 30 and the carrier board 10 and between the functional device 20 and the carrier board 10. As an example, the carrier board 10 is provided with the wiring layer 40 on both the first surface a1 and the second surface a 2. The light emitting assembly 30 is coupled with the wiring layer 40 disposed on the first surface a1, and the functional device 20 is coupled with the wiring layer 40 disposed on the second surface a 2.

It is understood that, in the case that a plurality of wiring layers 40 are disposed on the carrier 10, the structure of the plurality of wiring layers 40 is not limited to be the same, and the specific structure of each wiring layer 40 is designed and adjusted according to the distribution of the light emitting assemblies 30 and the functional devices 20.

By providing the wiring layers 40 for coupling with the functional device 20 and the light emitting assembly 30 on both sides of the carrier board 10, respectively, there is no need to provide conductive through holes in the carrier board 10, and the structure is simple.

In other embodiments of the present application, as shown in fig. 4C, the light emitting assembly 30 is disposed on the first surface a1 of the carrier board 10, the functional device 20 is disposed on the second surface a2 of the carrier board 10, the wiring layer 40 is disposed between the light emitting assembly 30 and the carrier board 10, the carrier board 10 is disposed with the conductive through hole 11, and two ends of the conductive through hole 11 are coupled to the wiring layer 40 and the functional device 20, respectively. Illustratively, the carrier board 10 has a wiring layer 40 disposed on the first surface a 1.

Regarding the structure of the conductive through holes 11, the carrier 10 is a glass carrier, and the conductive through holes 11 may be Through Glass Vias (TGV), for example. Alternatively, the carrier 10 is a silicon-based carrier, and the conductive vias 11 may be Through Silicon Vias (TSVs), for example. Or, for example, the carrier 10 is a PI carrier, and the conductive through holes 11 may be conductive pillars disposed in the PI carrier.

By providing the wiring layer 40 on one side of the carrier 10 and transferring the signal on the wiring layer 40 to the functional device 20 through the conductive via 11, the number of the wiring layers 40 can be reduced, and the display module 01 can be made thinner.

In other embodiments of the present application, as shown in fig. 4D, the light emitting module 30 is disposed on the first surface a1 of the carrier board 10, the functional device 20 is embedded in the carrier board 10, the interposer B1 of the functional device 20 faces the first surface a1 of the carrier board 10, and the wiring layer 40 is disposed between the light emitting module 30 and the carrier board 10. Illustratively, the carrier board 10 has a wiring layer 40 disposed on the first surface a 1.

In this case, according to different manufacturing processes, for example, as shown in fig. 4D, a conductive via 11 may be disposed in the carrier board 10, and both ends of the conductive via 11 are coupled to the wiring layer 40 and the functional device 20, respectively.

Alternatively, as shown in fig. 4E, the pads on the transfer surface B1 of the functional device 20 are directly exposed on the first surface a1 of the carrier board 10. That is, the interposer B1 of the functional device 20 is flush with the first surface a1 of the carrier board 10, and the pads are directly coupled to the wiring layer 40.

Alternatively, as shown in fig. 4F, for example, the back surface B2 (the surface opposite to the transfer surface B1) of the functional device 20 is flush with the second surface a2 of the carrier board 10.

As for the preparation process of the display module 01 shown in fig. 4F, as shown in fig. 5A, the preparation process mainly includes: mounting the functional device 20 on the temporary carrier plate, with the transfer surface B1 of the functional device 20 facing away from the temporary carrier plate; then coating PI to form an encapsulation layer; then, exposing and developing the packaging layer to form a via hole on the packaging layer so as to form the carrier plate 10 exposing the pad on the transfer surface B1 of the functional device 20; wiring layer 40 is then formed, wiring layer 40 coupled to interposer B1, with conductive material within the vias as conductive vias 11; the light emitting assembly 30 is then coupled with the wiring layer 40; and then removing the temporary carrier to prepare the display module 01 shown in fig. 4F.

The coupling manner between the wiring layer 40 and the interposer B1 may be that when a metal wire layer closest to the carrier 10 in the wiring layer 40 is formed, a part of the conductive material directly fills the via, the conductive material in the via serves as the conductive through hole 11, and the wiring layer 40 is directly coupled to the pad on the interposer B1 of the functional device 20. Alternatively, the conductive via 11 is formed before the wiring layer 40 is formed.

As for the manner of forming the wiring layer 40, as shown in fig. 5B, a seed layer may be formed, for example, by using a Physical Vapor Deposition (PVD) technique; then, photoetching and developing the seed layer to expose the pattern of the metal wire to be formed (for convenience of illustration, the seed layer after patterning is referred to as a patterned seed layer); electroplating to form a metal wire and filling the via hole on the packaging layer; removing the excess seed layer to form metal lines in wiring layer 40; the metal lines are encapsulated to expose pads to be coupled with the light emitting device 30. Where wiring layer 40 includes multiple layers of metal lines, the above-described steps of forming the metal lines may be repeated without refilling the vias.

In other embodiments of the present application, as shown in fig. 6A, the light emitting assembly 30 is disposed on the first surface a1 of the carrier board 10, the functional device 20 is embedded in the carrier board 10, the interposer B1 of the functional device 20 faces the second surface a2 of the carrier board 10, and the first surface a1 and the second surface a2 of the carrier board 10 are respectively provided with the wiring layers 40.

According to the difference of the manufacturing process, as shown in fig. 6A, the pads on the transfer surface B1 of the functional device 20 are directly exposed on the second surface a2 of the carrier board 10. That is, the interposer B1 of the functional device 20 is flush with the second surface a2 of the carrier board 10, and the pads are directly coupled to the wiring layer 40 on the second surface a 2.

Alternatively, as shown in fig. 6B, the carrier board 10 may be provided with a conductive via 11 therein, and two ends of the conductive via 11 are coupled to the wiring layer 40 and the functional device 20 on the second surface a2, respectively.

In the case that the interposer B1 of the functional device 20 faces the second surface a2 of the carrier board 10, the first surface a1 and the second surface a2 of the carrier board 10 are respectively provided with the wiring layers 40, which may facilitate coupling of the wiring layers 40 with the functional device 20.

It is understood that the arrangement position of the wiring layer 40 is related to the arrangement position of the functional device 20, and the above is only illustrative of the possible position relationship between the functional device 20 and the wiring layer 40, and any combination of the above modes falls within the scope of the present application.

In other embodiments of the present application, as shown in fig. 7A, the carrier board 10 has a structure of the wiring layer 40, or it is understood that the wiring layer 40 directly serves as the carrier board 10 of the display module 01.

Based on this, as shown in fig. 7A, the functional device 20 and the light emitting assembly 30 may be located on the same side of the wiring layer 40. Alternatively, as shown in fig. 7B, the functional device 20 and the light emitting assembly 30 may be located on opposite sides of the wiring layer 40. Alternatively, as shown in fig. 7C, part of the functional device 20 is located on the same side of the wiring layer 40 as the light emitting assembly 30, and part of the functional device 20 is located on the opposite side of the wiring layer 40 from the light emitting assembly 30.

The coupling manner of the light emitting assembly 30 and the functional device 20 to the wiring layer 40 is not limited in the embodiments of the present application, and the coupling manner of the light emitting assembly 30 and the functional device 20 to the wiring layer 40 may be the same regardless of the structure of the carrier 10 on which the wiring layer 40 is disposed or the structure of the carrier 10 on which the wiring layer 40 is disposed. For convenience of description, the carrier board 10 is provided with the wiring layer 40, and the coupling manner of the light emitting assembly 30 and the functional device 20 to the wiring layer 40 is schematically described below.

Regarding the coupling manner of the light emitting assembly 30 and the wiring layer 40, since the eutectic bonding process is mature and simple and the environmental reliability is high, in some embodiments of the present application, as shown in fig. 8A, the light emitting assembly 30 is coupled with the wiring layer 40 through the eutectic bonding process.

Eutectic bonding is a low melting point alloy solder, which refers to the phenomenon of eutectic fusion at relatively low temperatures with eutectic solders. The eutectic solder joint may be made of Au-In (gold-indium), Au-Ge (gold-germanium), Au-Sn (gold-tin), Au-Si (gold-silicon), Sn-In (tin-indium), Sn-Ag (tin-silver), Sn-Bi (tin-bismuth), or the like.

In other embodiments of the present application, since a low temperature bonding process may be applied to coupling of a plurality of pads of a smaller pitch (pitch) with other components, as shown in fig. 8B, the light emitting assembly 30 is coupled with the wiring layer 40 through the low temperature bonding process.

Low temperature bonding is relative to high temperature bonding and generally refers to die bonding performed at temperatures below 100 c or even at room temperature. The low-temperature bonding utilizes the great category gorgeous adsorption effect of two close clean surfaces, and realizes the combination of the surfaces of heterogeneous materials which are not limited by lattice mismatch and thermal mismatch.

In addition, since the low temperature bonding process is direct contact bonding (e.g., Cu — Cu bonding) of the light emitting assembly 30 and the wiring layer 40, interdiffusion of impurities, thermal stress between heterogeneous materials, and generation of voids and defects can be prevented by using the low temperature bonding process.

In other embodiments of the present application, the implementation is simple and low-cost due to the anisotropic conductive film coupling, as shown in fig. 8C, the light emitting element 30 is coupled to the wiring layer 40 through an Anisotropic Conductive Film (ACF).

The ACF is a special coating substance which is coated and attached between the substrate a and the substrate b, limits current to flow between the substrates a and b only in the direction of a vertical axis z, and has the functions of unidirectional conduction and gluing fixation. The light emitting element 30 is coupled to the wiring layer 40 through the ACF, but the conductive particles in the ACF are used to connect the pads between the light emitting element 30 and the wiring layer 40 to make them conductive, and at the same time, the conductive short circuit between two adjacent pads can be avoided, so as to achieve the purpose of conduction only in the z-axis direction.

In other embodiments of the present application, as shown in fig. 8D, light emitting assembly 30 is directly coupled to wiring layer 40.

As for the manner of implementing the direct coupling of the light emitting package 30 and the wiring layer 40, it is exemplified that the light emitting package 30 is mounted on a temporary carrier board, and then the wiring layer 40 is directly formed on the surface of the light emitting package 30, so that the light emitting package 30 and the wiring layer 40 are directly coupled. In this way, the semiconductor process can be reused to couple a plurality of pads of a smaller pitch (pitch) to other components.

Fig. 8A to 8D schematically illustrate the coupling manner between the light emitting element 30 and the wiring layer 40, the coupling manner between the functional device 20 and the wiring layer 40 may be the same as the coupling manner between the light emitting element 30 and the wiring layer 40, and the coupling manner may be selected reasonably according to the different arrangement positions of the functional device 20, which is not described herein again.

On the basis of the above structure, as shown in fig. 9A, the display module 01 further includes an insulating layer 50, the insulating layer 50 covers the functional device 20 and the light emitting assembly 30, the plurality of light emitting assemblies 30 and the functional device 20 are spaced apart from each other, and the insulating layer serves as an encapsulation film layer of the display module 01, so as to protect the functional device 20 and the light emitting assembly 30 and prevent water and oxygen from corroding the functional device 20 and the light emitting assembly 30.

The insulating layer 50 covers the surface of the light emitting element 30, and the light emitting elements 30 are spaced apart from each other, that is, the light emitting elements 30 are spaced apart from each other by the insulating layer 50, adjacent light emitting elements 30 do not share a film layer or are communicated with the film layer, and the light emitting elements 30 are independent units and are respectively connected to the carrier 10.

It is understood that, as shown in fig. 9A, when the functional device 20 and the light emitting assembly 30 are both disposed on the first surface a1 of the carrier board 10, the first surface a1 side of the carrier board 10 is provided with the insulating layer 50. As shown in fig. 9B, when the second surface a2 of the carrier board 10 is provided with the functional device 20, the first surface a1 side and the second surface a2 side of the carrier board 10 are both provided with the insulating layer 50.

Compared with a thin film encapsulation (AMOLED) process adopted by the AMOLED display module, the structure and the manufacturing process of the insulating layer 50 of the display module 01 provided by the embodiment of the application as an encapsulation film layer are simpler in terms of forming the encapsulation structure formed by the organic thin film layers and the inorganic thin film layers which are alternately arranged in a multi-layer mode.

In this example, the functional device 20 and the light emitting element 30 included in the display module 01 are both disposed on the carrier 10, and the space and the thickness on the carrier 10 are fully utilized to perform ultra-thin and high performance integration. Through the integration, the area of the PCBA mainboard can be further reduced, even the PCBA mainboard is completely removed (no PCB is needed to be arranged), the display module is a heterogeneous integrated full display system (HiSID), and all devices and modules in the display module 01 can be integrated in the display. The integrated level of display module assembly 01 is high, can leave bigger space like this and give battery 02, perhaps reduces display module assembly 01's thickness and weight, promotes human-computer interaction and experiences, promotes product competitiveness. In addition, all devices and modules in the display module 01 are integrated in the display, so that the interconnection and assembly process of main units in the display module 01 can be removed, the function integration of the display module 01 is realized, the process of the whole machine is simplified, and the assembly cost is saved.

In addition, the light emitting assembly 30 includes a light emitting chip 31 and a chip element 32, the chip element 32 includes a first circuit 321 therein, which is equivalent to the light emitting chip 31 and the first circuit 321 for driving the light emitting chip 31 to emit light are integrally designed, and each light emitting assembly 30 is an independent light emitting unit. Compared with the related art in which the first circuit 321 is not integrated with the light emitting chip 31, the layout of the traces on the carrier board 10 in the related art needs to consider the layout of the traces for communicating the first circuit 321 with the light emitting chip 31 and the traces for communicating the first circuit 321 with the main board and other traces. In general, in order to meet the requirement of high resolution, the number of the light emitting chips 31 included in the display module 01 is usually large (e.g., 2772 × 1344), which results in a large number of wires on the carrier 10 and a complicated layout. However, after the display module 01 provided in this example integrates the first circuit 321 and the light emitting chip 31, as shown in fig. 9C, when designing the circuit layout on the carrier board 10, the layout of the wires for signal communication between the first circuit 321 and the light emitting chip 31 does not need to be considered, which reduces the number of wires on the carrier board 10 to a certain extent, so that the flexibility of the circuit layout on the carrier board 10 is relatively high.

Example two

Example two differs from example one in the structure of the light emitting assembly 30.

The display module 01 includes a carrier 10, a functional device 20, a light emitting device 30, and a wiring layer 40.

The structure of the carrier board 10, the structure and the arrangement position of the functional device 20, and the arrangement position of the wiring layer 40 may be the same as those in the first example, and reference may be made to the description related to the carrier board 10 and the functional device 20 in the first example, which is not described herein again.

As shown in fig. 10A, the light emitting assembly 30 includes a light emitting chip 31 and a chip element 32. The chip element 32 has a first circuit 321 integrated therein, and the plurality of light emitting elements 30 include a plurality of chip elements 32, at least some (or all) of the chip elements 32 have a second circuit 322 integrated therein, and the second circuit 322 is formed in synchronization with the first circuit 321 and disposed on the same layer.

The first circuit 321 and the second circuit 322 include a plurality of TFTs and the like. As for the structure of the TFT, as illustrated in fig. 10B, the TFT includes a gate electrode layer, a gate insulating layer, a semiconductor active layer, and a source drain electrode layer.

The TFT may be an amorphous silicon TFT, a polycrystalline silicon TFT, a metal oxide TFT, an organic thin film TFT, or the like, according to the material of the semiconductor active layer. In addition, the TFT may be a top gate type TFT, a bottom gate type TFT, or a double gate type TFT, depending on the position of the gate layer. The bottom gate type TFT in fig. 10B is merely illustrative. The first circuit 321 and the second circuit 322 are formed synchronously, it is understood that the TFT included in the first circuit 321 and the TFT included in the second circuit 322 are formed synchronously, the TFT of the first circuit 321 and the gate insulating layer in the TFT of the second circuit 322 are in the same layer structure, and the conductive layers (e.g., the gate layer, the source drain layer and the drain layer) and the semiconductor active layer in the TFT of the first circuit 321 and the TFT of the second circuit 322 are prepared synchronously by the same preparation process and are made of the same material in the same layer.

The first circuit 321 and the second circuit 322 are disposed in the same layer, and it is understood that the layers (the gate layer, the gate insulating layer, the semiconductor active layer, and the source/drain layer) in the TFT of the first circuit 321 and the TFT of the second circuit 322 are disposed in the same layer.

The "same layer" refers to a layer structure formed by forming a film layer for forming a specific pattern by the same film formation process and then forming the same pattern by the same patterning process using the same mask plate. Depending on the specific pattern, the same patterning process may include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure may be continuous or discontinuous, and the specific patterns may be at different heights or have different thicknesses. The plurality of light emitting assemblies 30 includes a plurality of chip elements 32, at least some or all of the chip elements 32 having a second circuit 322 integrated therein, it being understood that in one case, of the plurality of chip elements 32, only a first circuit 321 is integrated in some of the chip elements 32, and the first circuit 321 and the second circuit 322 are integrated in some of the chip elements 322. In another case, the first circuit 321 and the second circuit 322 are integrated in each of the plurality of chip elements 32. Of course, in any case, the structure of the second circuit 322 integrated in each chip element 32 is not limited to be the same, and may be different.

Regarding the number of light emitting chips 31 included in the light emitting assembly 30, in some embodiments of the present application, as shown in fig. 10A, each light emitting assembly 30 may include one light emitting chip 31 and one chip element 32, and the first circuit 321 and the second circuit 322 are integrated in the chip element 32. One light emitting device 30 is used as a sub-pixel of the display module 01 for realizing the display function.

In other embodiments of the present application, as shown in fig. 10C, each of the light emitting assemblies 30 includes a plurality of light emitting chips 31 and a chip element 32, and the chip element 32 has a second circuit 322 and a first circuit 321 for driving the plurality of light emitting chips 31 to emit light integrated therein. Illustratively, a plurality of light emitting chips 31 form one of the light emitting groups, and one light emitting assembly 30 is used as one pixel of the display module 01 for implementing the display function.

Regarding the relative position relationship between the light emitting chip 31 and the chip element 32, in this example, only the active surface C1 of the chip element 32 faces the light emitting chip 31 is taken as an example for illustration, and the active surface C1 of the chip element 32 may also face away from the light emitting chip 31, and reference may be made to the description related to the example.

In some embodiments of the present application, the second circuit 322 may be at least one of a power management circuit, an image processing circuit, a fingerprint recognition circuit, an iris recognition circuit, a face recognition circuit, a power management circuit, a processor circuit, or a memory circuit.

Illustratively, the second circuit 322 may be any of the circuits described above. Alternatively, the second circuit 322 illustratively includes a variety of circuits as described above.

In this example, by integrating part of the circuits (the second circuit 322) in the display module 01 and the first circuit 321 in the same chip element 32, the integration level of the circuits in the display module 01 can be improved to some extent, and a HiSID integrated system can be realized. In addition, each light emitting element 30 is an independent light emitting unit, and a plurality of light emitting elements 30 are directly connected to the carrier 10 during the manufacturing process of the display module 01.

Furthermore, the first circuit 321 and the second circuit 322 are integrated on the same chip element 32, while some of the second circuit 322 (e.g. power management circuits) require signal communication with the first circuit 32. Thus, when the traces are laid out on the carrier board 10, the layout of the traces for signal communication between the first circuit 321 and the second circuit 322 does not need to be considered, and the number of the traces on the carrier board 10 is small, so that the flexibility of the layout of the traces on the carrier board 10 is high.

Example three

Example three differs from example one in the structure of the light emitting assembly 30.

As shown in fig. 11, the light emitting device 30 includes a light emitting chip 31 and a first circuit 321, the first circuit 321 is formed on the first surface a1 of the carrier board 10, and the first circuits 321 in the plurality of light emitting devices 30 are formed simultaneously and disposed in the same layer.

The first circuits 321 in the plurality of light emitting devices 30 are formed simultaneously and disposed in the same layer, and it is understood that the layers (the gate layer, the gate insulating layer, the semiconductor active layer, and the source drain layer) in the TFTs included in the first circuits 321 in the plurality of light emitting devices 30 are respectively prepared by the same patterning process and disposed in the same layer.

That is, the first circuit 321 is directly formed on the surface of the wiring layer 40, and the first circuits 321 corresponding to the plurality of light emitting chips 31 are simultaneously formed, so that the process is simple and the integration level is high.

In some embodiments of the present application, as shown in fig. 11, the display module 01 further includes a second circuit 322, and the second circuit 322 and the first circuit 321 are formed simultaneously and disposed in the same layer.

Regarding the structure of the second circuit 322, reference may be made to the description of the second circuit 322 in example two, and details are not repeated here.

In this example, a plurality of first circuits 321 are formed in synchronization, and the second circuit 322 may be formed in synchronization with the first circuits 321. Thus, when the first circuit 321 is prepared, a plurality of circuit structures in the display module 01 can be formed simultaneously, the occupied area of the circuit packaging area is reduced, and the integration level of the display module 01 can be improved.

The above description is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A display module, comprising:

a carrier plate having a first surface;

the functional devices are borne on the carrier plate and used for realizing functions except for light emission;

a plurality of light emitting components arranged on the first surface of the carrier plate;

the light-emitting component comprises a light-emitting chip and a first circuit, wherein the light-emitting chip is coupled with the first circuit and is used for emitting light under the driving of the first circuit.

2. The display module according to claim 1, further comprising an insulating layer covering the surfaces of the light emitting elements for spacing the light emitting elements apart from each other.

3. The display module of claim 2, wherein the light assembly further comprises a chip element, the first circuit being integrated in the chip element.

4. The display module of claim 3, further comprising a second circuit, the second circuit further integrated into at least some of the plurality of chip components; the second circuit is used for realizing functions except for driving the light-emitting chip to emit light.

5. The display module according to claim 3 or 4, wherein each of the light emitting assemblies comprises a plurality of light emitting chips, and the plurality of light emitting chips are insulated from each other.

6. The display module of claim 1, wherein the first circuit is disposed on the first surface, and the first circuits of the plurality of light emitting elements are disposed on a same layer.

7. The display module according to claim 6, further comprising a second circuit for performing a function other than driving the light emitting chip to emit light;

the second circuit is arranged in the same layer as the first circuit.

8. The display module according to claim 1, wherein the display module comprises a display area; the display area comprises a plurality of sub-pixel areas; the light emitting chip is positioned in the sub-pixel area; at least part of the plurality of functional devices is arranged on the first surface and is positioned in the sub-pixel area.

9. The display module according to claim 1 or 8, wherein the display module comprises a display area; at least part of the functional devices are embedded in the carrier plate and are positioned in the display area.

10. The display module according to claim 1, 8 or 9, wherein the carrier further comprises a second surface, and the second surface is disposed opposite to the first surface; at least a portion of the plurality of functional devices is disposed on the second surface.

11. The display module according to claim 1, wherein a wiring layer is disposed on the carrier or the carrier is a wiring layer;

the functional device and the light emitting component are coupled to the wiring layers, respectively.

12. The display module of claim 11, wherein the functional device or the light emitting element is coupled to the wiring layer by one of a eutectic bonding process, a low temperature bonding process, an anisotropic conductive film coupling, or a direct contact coupling.

13. The display module of claim 1, wherein the functional device comprises one of a power management module, an image processor, a central processing unit, a flash memory, a double data rate memory, a system-on-chip, a radio frequency module, a light sensing chip, a fingerprint recognition chip, an iris recognition chip, a face recognition chip, a sensor chip, a power manager, an antenna module, a receiver, a microphone, a timing controller, a touch sensing chip, a wireless controller, a bluetooth module, an inertial sensor, or a pressure gauge.

14. The display module of claim 4 or 7, wherein the second circuit comprises one of a power management circuit, an image processing circuit, a fingerprint recognition circuit, an iris recognition circuit, a face recognition circuit, a power management circuit, a processor circuit, or a memory circuit.

15. A display module, comprising:

a circuit board having third and fourth opposing surfaces;

the functional device is arranged on the third surface and is coupled with the circuit board;

and the light-emitting element is arranged on the fourth surface and is coupled with the circuit board.

16. An electronic device comprising a battery and a display module according to any one of claims 1-14 or 15, wherein the battery is located on the back of the display module.