CN113253819A - Waste heat recovery type submergence formula phase transition cooling system - Google Patents

Waste heat recovery type submergence formula phase transition cooling system Download PDF

Info

Publication number
CN113253819A
CN113253819A CN202110536782.0A CN202110536782A CN113253819A CN 113253819 A CN113253819 A CN 113253819A CN 202110536782 A CN202110536782 A CN 202110536782A CN 113253819 A CN113253819 A CN 113253819A
Authority
CN
China
Prior art keywords
heat
cooling device
cooling
recovery type
waste heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110536782.0A
Other languages
Chinese (zh)
Inventor
刘秀芳
侯予
李佳靖
王宇涛
钟富豪
杨朔
陈佳军
苗庆硕
刘一鸣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xian Jiaotong University
Original Assignee
Xian Jiaotong University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xian Jiaotong University filed Critical Xian Jiaotong University
Priority to CN202110536782.0A priority Critical patent/CN113253819A/en
Publication of CN113253819A publication Critical patent/CN113253819A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a waste heat recovery type immersed phase-change cooling system combined with a heat pipe. A waste heat recovery type immersed phase change cooling system comprises a first cooling device, a second cooling device, an energy recovery device and a third cooling device; the first cooling device is used for carrying out heat exchange on the heating member; the second cooling device is used for enhancing heat dissipation of the first cooling device, the energy recovery device provides a power source for the third cooling device after recovering heat absorbed by the first cooling device, and the third cooling device is used for enhancing heat dissipation of the first cooling device and the second cooling device. The invention provides a waste heat recovery type immersed phase change cooling system which has the advantages of small volume, good temperature uniformity, high-efficiency heat dissipation, graded cooling, waste heat recovery, low energy consumption and the like, and is suitable for cooling electronic devices, in particular small electronic equipment, such as heating parts in a computer system.

Description

Waste heat recovery type submergence formula phase transition cooling system
Technical Field
The invention relates to a waste heat recovery type immersed phase-change cooling system combined with a heat pipe.
Background
In recent years, with the rapid development of electronic technology, high performance chips and integrated circuits are used more and more widely, and the power of electronic chips is larger and the volume is reduced gradually. Under the condition, the unit area power consumption and the heat productivity of the electronic chip are increased sharply, and the heat flow density of the chip reaches 300W/cm at present2. If the large heat cannot be dissipated in time, the temperature of the electronic device is continuously increased, and the operation stability and the service life of the electronic device are seriously influenced. According to statistics, the failure modes of over 55 percent of electronic devices are caused by overhigh temperature, and the traditional air cooling and water cooling cannot meet the heat dissipation requirement of higher heating power and cannot solve the problem of local hot spots of chips, so that a more appropriate cooling technology is found, and the effective control on the operating temperature of electronic equipment is very important.
Immersion type phase change refrigeration is used as an efficient cooling technology, and through experimental analysis and comparison, cooling efficiency is obviously superior to traditional cooling modes such as air cooling and water cooling, and the immersion type phase change refrigeration cooling system has good temperature uniformity. The mode that traditional submergence formula phase transition cooling technology adopted pond boiling and water-cooling to combine together usually will generate heat the spare part and soak in electric insulation coolant liquid, makes electric insulation coolant liquid be heated the evaporation in the spare part department that generates heat, and the steam that is heated has the condensing coil pipe department that water passes through to release heat in the cavity top, and the heat is discharged to the environment by the cooling water circulation, and electric insulation coolant liquid steam liquefaction simultaneously gets back to the cavity again and accomplishes the circulation.
However, the immersed phase-change cooling system requires additional pumping power to drive water circulation, the cooling device is bulky, the cooling device occupies space, the investment cost is increased, and a large amount of heat energy generated by the phase change of the electrically insulated cooling liquid is wasted, so that the immersed phase-change cooling system also needs to be adapted to the development trend of miniaturization and integration of electronic devices, and respond to the calls of carbon neutralization and carbon peak reaching.
Disclosure of Invention
In order to solve the technical problems, the invention provides a waste heat recovery type immersed phase change cooling system which has the advantages of small volume, good temperature uniformity, high-efficiency heat dissipation, graded cooling, waste heat recovery, low energy consumption and the like, and is suitable for cooling electronic devices, particularly small electronic equipment, such as heating parts in a computer system.
The technical scheme adopted by the invention is as follows:
a waste heat recovery type immersed phase-change cooling system is characterized in that:
comprises a first cooling device and a second cooling device,
the system also comprises a second cooling device, an energy recovery device and a third cooling device;
the first cooling device is used for carrying out heat exchange on the heating member;
the second cooling device is used for enhancing heat dissipation of the first cooling device, the energy recovery device provides a power source for the third cooling device after recovering heat absorbed by the first cooling device, and the third cooling device is used for enhancing heat dissipation of the first cooling device and the second cooling device.
Preferably, the first cooling device includes a cavity, and the cavity is filled with a cooling liquid.
The heating element is placed in the cavity, and is partially or completely immersed in the cooling liquid, the cooling liquid absorbs heat generated by the heating element, the evaporation and the phase change occur, a large amount of bubbles emerge from the heating element, and the generated heat is taken away by cooling liquid steam. The steam after phase change is gathered in the upper space of the cavity.
Preferably, the second cooling device is a heat pipe, and the heat pipe is arranged at the upper part of the cavity.
Preferably, the evaporation section of the heat pipe extends into the cavity, and the condensation section of the heat pipe is exposed to the air.
In order to enhance the heat dissipation capability of the second cooling device, the heat pipes are preferably heat-conducting copper pipe heat pipes, and the number of the heat pipes is multiple.
In order to enhance the heat dissipation capability of the second cooling device, the heat pipe is vertically arranged.
In order to enhance the heat dissipation capability of the second cooling device, the plurality of heat pipes are distributed in an array, for example, the heat pipes are distributed in a plurality of rows, the heat pipes in each row are arranged at equal intervals, and the heat pipes in two adjacent rows are arranged in a staggered manner.
Preferably, the energy recovery device comprises a heat collecting device, an energy conversion device and a heat radiating member.
In some embodiments of the invention, the heat collecting device is a scale flat plate radiator, the scale flat plate radiator comprises a flat plate and a plurality of ribbed plates arranged on the flat plate, the ribbed plates are positioned in the cavity to collect heat, and the flat plate part leaks in the air; the energy conversion device is a semiconductor thermoelectric generation sheet which is arranged on a flat plate of the scale flat plate radiator; the heat dissipation part is a heat pipe radiator which is arranged on the semiconductor temperature difference power generation sheet. The cold surface of the thermoelectric generation piece is tightly attached to the heat pipe radiator, the hot surface of the thermoelectric generation piece is tightly attached to the scale flat plate radiator, and stable temperature difference is formed at the two ends of the thermoelectric generation piece through heat conduction silicone grease connection.
In some embodiments of the present invention, the heat pipe heat sink is comprised of heat pipes and fins.
Preferably, the third cooling device includes a fan.
In some embodiments of the present invention, the fan is composed of a motor, fan blades, and a metal bracket for cooling the heat pipe radiator and the condenser of the copper heat pipe.
Preferably, the cavity is a box body with an open top, the open top has edges, and the top is covered and sealed by a metal cover plate.
Preferably, the metal cover plate is composed of an upper cover plate and a lower cover plate.
The upper cover plate is provided with a large round hole, a plurality of small round holes and a plurality of rectangular holes, the lower cover plate is processed into a shape like a Chinese character 'hui', and the inner side size of the lower cover plate is the same as the outer side size of the cavity.
Preferably, the above-mentioned big round hole is used for the power cord of the piece that generates heat in the cavity connects out, several little round holes are used for the installation heat conduction copper pipe heat pipe, the rectangular hole is used for the installation scale plate radiator.
Preferably, the above-mentioned big round hole is sealed with the aviation plug, electron device spare part power cord that generates heat passes through the aviation plug switching, right heat conduction copper pipe heat pipe scale plate heat sink with little round hole, rectangular hole adopt welded connection to guarantee that the cavity leakproofness is good.
Preferably, the fan is installed in front of the heatpipe radiator and faces the heatpipe radiator.
Preferably, the metal bracket is fixed in front of the heat pipe radiator, the motor is connected with the semiconductor thermoelectric generation piece, and the semiconductor thermoelectric generation piece provides electric energy for the motor.
Compared with the prior art, the method has the advantages that,
1) the problem that an immersed phase-change cooling system in the market is large in size is solved. The invention adopts a method of combining pool boiling and a heat pipe, abandons a water circulation cooling system, greatly reduces the volume of an immersed cooling system, reduces the installation cost and saves the space;
2) the problem that a large amount of heat energy released by phase change of a traditional immersed phase change cooling system is wasted is solved. The invention combines the thermoelectric power generation technology, converts the heat energy into the electric energy, supplies power to the fan, enables the fan to work to cool the heat pipe radiator and the heat conduction copper pipe heat pipe condensation section, and dissipates the heat through forced convection heat exchange, and can realize the recovery and utilization of waste heat;
3) the invention can realize the function of graded cooling. When the heat flow density is low, the output voltage of the temperature difference power generation sheet is not enough to maintain the fan to operate, the fan stops working, natural convection of the condensation section of the heat pipe can meet the heat dissipation requirement, under the high heat flow density, enough stable temperature difference is formed at two ends of the temperature difference power generation sheet to supply power to the fan, the fan works to cool the heat pipe radiator and the heat conduction copper pipe condensation section, and heat is dissipated by forced convection heat transfer;
4) the invention combines two efficient cooling modes of pool boiling and heat pipe, the temperature uniformity is good, the thermal resistance is 1/10 of traditional air cooling, and the cooling efficiency is higher;
5) the invention uses the heat pipe to replace the traditional immersed phase-change cooling circulating water system, saves the pump work of the water pump, and combines the thermoelectric power generation technology to recover the waste heat, and can greatly reduce the energy consumption of the immersed phase-change cooling system if being popularized and used.
Drawings
FIG. 1 is a perspective view of the present invention (without electronic heating components, only replaced by a simulated heat source);
FIG. 2 is a front view of FIG. 1;
FIG. 3 is a left side view of FIG. 1;
FIG. 4 is a right side view of FIG. 1;
FIG. 5 is a schematic diagram of a chamber structure;
FIG. 6 is a structural diagram of a semiconductor thermoelectric generation chip;
FIG. 7 is a view showing the structure of a heat pipe radiator;
FIG. 8 is a view of a scale plate radiator
FIG. 9 is a schematic view of the upper and lower cover plates;
FIG. 10 is a connecting view of the cavity and the metal cover plate;
FIG. 11 is a schematic view of a simulated heat source surface finish configuration;
FIG. 12 is a schematic diagram of a simulated heat source composition;
FIG. 13 is an assembly diagram of a semiconductor thermoelectric generation chip, a scale flat plate radiator and a heat pipe radiator.
Wherein 1-a cavity; 2-simulating a heat source; 3-electrically insulating coolant; 4-a metal cover plate; 5-lower cover plate; 6-upper cover plate; 7-heat pipe radiator; 8-scale flat plate radiator; 9-an electric motor; 10-a metal stent; 11-fan blades; 12-semiconductor thermoelectric power generation sheet; 13-heat conducting copper pipe heat pipe; 14-a fan; 15-wooden container; 16-an electrically heated membrane; 17-copper sheet.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "vertical", "lateral", "longitudinal", "front", "rear", "left", "right", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description of the present invention, and do not mean that the device or member to which the present invention is directed must have a specific orientation or position, and thus, cannot be construed as limiting the present invention.
A waste heat recovery type immersed phase change cooling system comprises a first cooling device, a second cooling device, an energy recovery device and a third cooling device.
The first cooling device is used for carrying out heat exchange on the heating member; the second cooling device is used for enhancing heat dissipation of the first cooling device, the energy recovery device provides a power source for the third cooling device after recovering heat absorbed by the first cooling device, and the third cooling device is used for enhancing heat dissipation of the first cooling device and/or the second cooling device.
The heating part comprises a computer mainboard, a data center server and other small electronic equipment. The heating element may be any one of a processor and a memory on the motherboard.
As a preferred embodiment of the present invention, the first cooling device includes a cavity 1, and a cooling liquid is disposed in the cavity 1. The cavity 1 is not completely filled with the cooling liquid. The heating element is placed in the cavity 1, and is partially or completely immersed in the cooling liquid, the cooling liquid absorbs heat generated by the heating element, evaporation and phase change occur, a large amount of bubbles emerge from the heating element, and the generated heat is taken away by cooling liquid steam. The phase-changed steam is collected in the upper space of the cavity 1.
As a preferred embodiment of the present invention, the second cooling device is a heat pipe, and the heat pipe is disposed at an upper portion of the cavity 1.
As a preferred embodiment of the present invention, the evaporation section of the heat pipe extends into the cavity 1, and the condensation section of the heat pipe is exposed to the air.
In order to enhance the heat dissipation capability of the second cooling device, the heat pipe is preferably a plurality of heat pipes 13 made of heat conducting copper pipes.
In order to enhance the heat dissipation capability of the second cooling device, the heat pipes are arranged in a vertical manner.
In order to enhance the heat dissipation capability of the second cooling device, the plurality of heat pipes are distributed in an array, for example, the heat pipes are distributed in a plurality of rows, the heat pipes in each row are arranged at equal intervals, and the heat pipes in two adjacent rows are arranged in a staggered manner.
As a preferred embodiment of the present invention, the energy recovery device includes a heat collecting device, an energy conversion device, and a heat sink.
In some embodiments of the invention, the heat collecting device is a scale flat plate radiator 8, the scale flat plate radiator 8 comprises a flat plate and a plurality of rib plates arranged on the flat plate, the rib plates are positioned in the cavity 1 for heat collection, and the flat plate is partially exposed in the air; the energy conversion device is a semiconductor thermoelectric generation piece 12, and the semiconductor thermoelectric generation piece 12 is arranged on a flat plate of the scale flat plate radiator 8; the heat dissipation piece is a heat pipe radiator 7, and the heat pipe radiator 7 is arranged on the semiconductor thermoelectric generation piece 12. The cold surface of the thermoelectric power generation piece is tightly attached to the heat pipe radiator 7, the hot surface of the thermoelectric power generation piece is tightly attached to the scale flat plate radiator 8, and stable temperature difference is formed at two ends of the thermoelectric power generation piece through heat conduction silicone grease connection.
In some embodiments of the present invention, the heat pipe heat sink 7 is composed of heat pipes and fins.
As a preferred embodiment of the present invention, the third cooling device includes a fan 14.
The fan 14 may be composed of a motor 9, fan blades 14, and metal bracket 10, and is used for cooling the heat pipe radiator 7 and the condensation section of the copper heat pipe 13.
In some embodiments of the present invention, the chamber 1 is an open-topped box, the open top has edges, and the top is covered and sealed by a metal cover plate 4.
Preferably, the metal cover plate 4 is composed of an upper cover plate and a lower cover plate. The upper cover plate 6 is processed into a large round hole with the diameter of 8mm, a plurality of small round holes with the diameter of 6mm and a plurality of rectangular holes, the lower cover plate 5 is processed into a shape like a Chinese character 'hui', and the inner side size of the lower cover plate 5 is the same as the outer side size of the cavity 1.
Preferably, the above-mentioned big round hole is used for the power cord of the heating element in the cavity 1 to connect out, several little round holes are used for installing the heat conduction copper pipe heat pipe 13, the rectangular hole is used for installing the scale flat plate radiator 8.
Preferably, the above-mentioned big round hole is sealed with the aviation plug, electron device heating spare part power cord passes through the aviation plug switching, right heat conduction copper pipe heat pipe 13 scale plate heat sink 8 with little round hole, rectangular hole adopt welded connection to guarantee that cavity 1 leakproofness is good.
Preferably, the fan 14 is installed in front of the heatpipe heatsink 7 and faces the heatpipe heatsink 7, so as to facilitate better heat dissipation.
Preferably, the metal bracket 10 is fixed in front of the heat pipe radiator 7, the motor 9 is connected with the semiconductor thermoelectric generation piece 12, and the semiconductor thermoelectric generation piece 12 provides electric energy for the motor 9.
Examples
Referring to fig. 1 to 4, the waste heat recovery type immersed phase-change cooling system comprises a cavity 1, a simulated heat source 2, an electrically insulating cooling liquid 3, a metal cover plate 4, a heat pipe radiator 7, a scale flat plate radiator 8, a motor 9, a metal support 10, fan blades 11 and a semiconductor thermoelectric generation sheet 12.
Wherein, the simulation heat source 2 is a heating element, and the simulation heat source 2 is arranged inside the cavity 1 and is completely immersed in the electrically insulating cooling liquid 3. The metal cover plate 4 covers the cavity 1, and the periphery of the connection part is strictly sealed. The scale flat plate radiator 8 is fixedly arranged on the metal cover plate 4, the fin parts are positioned in the cavity 1 to collect heat, and the flat plate part is positioned outside the cavity 1. The heat pipe radiator 7 is placed above the scale flat plate radiator 8. The semiconductor thermoelectric power generation sheet 12 is placed between the heat pipe radiator 7 and the scale flat plate radiator 8, the hot surface is tightly attached to the scale flat plate radiator 8, the cold surface is tightly attached to the heat pipe radiator, and the three are bonded and fixed by heat-conducting silicone grease. A plurality of heat conducting copper pipe heat pipes 13 are vertically arranged on the metal cover plate 4. The fan 14 is fixedly arranged in front of the heat pipe radiator for cooling the heat pipe radiator and the cold end of the heat conducting copper pipe.
Referring to fig. 5, the cavity 1 is in an opening form, and a 3cm wide edge is left at the opening of the cavity.
Referring to fig. 1 to 4, an analog heat source 2 is shown placed inside a chamber 1. The system uses an electrically insulating cooling liquid 3 to completely submerge the simulated heat source 2 in direct contact therewith. Electrically insulating coolants that can be used in the system include, but are not limited to, the following:
1. similar to 3MTMCompany NovecTMAn engineering liquid of the type; 2. mineral oil; 3. a natural ester oil; 4. a silicone oil.
The electrical insulation coolant 3 of the illustrated embodiment was 3M, which was comprehensively analyzed from the viewpoints of thermal physical properties, physical and chemical properties, environmental safety, and the likeTMNovec7100 engineering liquid, computer components are immersed in an electrically insulating cooling liquid, so that the risk of fire caused by the failure of the components can be reduced.
Referring to fig. 11 and 12, the simulated heat source 2 is shown to comprise an electric heating film 16, a red copper sheet 17 and a wooden container 15, wherein the electric heating film 16 is attached to the red copper sheet 17 and placed in the wooden container 15, and a hole is formed in the wooden container, so that a lead of the electric heating film extends out of the hole. Fig. 10 is a schematic view of the surface structure of the simulated heat source 2, and a honeycomb porous or boss structure is processed on the surface of the red copper sheet 17 in the simulated heat source 2 by an electrochemical corrosion method or a mechanical processing method, so that a large number of vaporization cores can be formed, and heat transfer can be enhanced.
Referring to fig. 9, the metal cover plate 4 is composed of a lower cover plate 5 and an upper cover plate 6, the lower cover plate 5 is processed into a square-shaped structure, the inner side size of the lower cover plate is the same as the outer side size of the cavity 1, a plurality of rectangular holes, a plurality of small round holes and a large round hole are processed above the upper cover plate 6, the size of the rectangular holes is matched with the size of fins of the scale flat plate radiator, the scale flat plate radiator shown in fig. 8 is installed on the metal cover plate 4 through the rectangular holes, the scale flat plate radiator is made of red copper with higher heat conductivity, the large round hole is used for extending out a heat source lead in the cavity, one small round hole is connected with a liquid inlet pipe, a valve is installed on the pipe, when the electrically insulating cooling liquid needs to be injected, the valve is opened, the liquid is injected, and the other small round holes are arranged in a cross mode and used for installing the heat conducting copper pipe 13. The heat conduction copper pipe heat pipe, the scale flat plate radiator and the metal cover plate can be installed and fixed in a welding mode, good sealing performance is guaranteed, the large round hole is sealed through the aviation plug, the conducting wire is connected out through the aviation plug, and steam leakage after phase change is avoided.
Referring to fig. 10, in the method for connecting the metal cover plate 4 with the cavity 1, symmetrical screw holes are formed in the edges of the upper plate and the lower plate, the lower plate is sleeved on the cavity, the upper plate covers the opening of the cavity, the edge of the opening of the cavity is clamped between the two plates, the upper plate and the lower plate are fixedly connected through screws, so that the metal cover plate 4 is fixedly matched with the cavity 1, and a silicon rubber pad can be added at the contact joint for strictly sealing to prevent gas leakage after phase change.
Referring to fig. 1, the fan 14 is shown comprised of a metal bracket 10, fan blades 11 and a motor 9. The fan blade 11 is connected and fixed on the rotor of the motor 9, the motor 9 provides power for the fan 14, and the connected motor 9 and fan blade 11 are fixedly arranged on the metal bracket 10. The assembled fan 14 is fixed at the front end of the heat pipe radiator 7, so that the fan is opposite to an air supply channel formed by the fins of the radiator.
Referring to fig. 1 and 13, the semiconductor thermoelectric generation sheet 12 is installed between the scale-shaped flat plate radiator 8 and the heat pipe radiator 7, the cold surface of the semiconductor thermoelectric generation sheet 12 is tightly attached to the heat pipe radiator 7, the hot surface is tightly attached to the scale-shaped flat plate radiator 8, and the semiconductor thermoelectric generation sheet, the scale-shaped flat plate radiator 8, the semiconductor thermoelectric generation sheet and the heat pipe radiator are bonded through heat-conducting silicone grease. The semiconductor thermoelectric generation piece 12 forms enough temperature difference on two sides, so that power generation is realized by the temperature difference. The semiconductor thermoelectric generation piece 12 is connected with the motor 9, and the output voltage of the semiconductor thermoelectric generation piece 12 is used for supplying power to the motor 9.
The above-described embodiment is a simplified way of using simulated heat sources instead of electronic heating components for clarity of operation of the present invention, and another embodiment is to use the present invention to cool a data center server, which will be briefly described below.
The server is vertically placed in the cavity 1, is completely immersed by the electrically insulating cooling liquid 3 and is in direct contact with the electrically insulating cooling liquid, the large round hole in the metal cover plate 4 is strictly sealed by the aviation plug, and a circuit of the server is connected out of the cavity through the aviation plug. The processed micro-channel heat sink structure is placed on the surface of the chip to strengthen heat exchange.
The rest of the embodiments are the same as the embodiments replaced by the simulated heat source
The working principle of the invention is as follows:
in the waste heat recovery type immersed phase change cooling system, the electrically insulating cooling liquid 3 is heated and evaporated at the heating parts of the electronic equipment, phase change occurs, a large amount of bubbles emerge from the heating parts, and the generated heat is taken away by cooling liquid steam. The phase-changed steam is collected in the upper space of the cavity 1. The scale flat plate radiator 8 plays a heat collecting role, temperature difference is generated at two ends of the semiconductor thermoelectric generation piece 12, when the heating power of a simulation heat source is small, the output voltage of the semiconductor thermoelectric generation piece 12 is not enough to drive the fan 14 to work, and heat can be dissipated into the environment only through the condensation section of the heat conducting copper pipe 13 through natural convection, so that the temperature of heating parts is maintained within a safe range. When the heating power of the heating parts is large, the two ends of the semiconductor thermoelectric generation piece 12 generate enough temperature difference, the output voltage of the Seebeck effect is utilized to supply power to the fan 14, the fan 14 works to cool the heat pipe radiator 7, so that stable temperature difference always exists on the two sides of the semiconductor thermoelectric generation piece 12, meanwhile, steam heat is taken away from the condensation section of the heat conduction copper pipe 13 through forced convection cooling, and the heat is dissipated into the environment, so that the heating parts are maintained at a proper working temperature, the grading cooling function under different heat flux densities is realized, the waste heat is recovered, the pump power of a water circulation system is saved, and the energy is saved.
When the temperature of the electronic heating part is reduced to a certain degree and reaches a safety range, the generated temperature difference is not enough to enable the semiconductor temperature difference power generation sheet 12 to output enough voltage to maintain the fan 14 to operate, the fan 14 stops working, and when the temperature of the electronic heating part is raised again to reach a certain temperature difference, the fan 14 works again to dissipate heat, so that the temperature of the electronic heating part is maintained to be proper.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. The utility model provides a waste heat recovery type submergence formula phase transition cooling system which characterized in that:
comprises a first cooling device and a second cooling device,
the system also comprises a second cooling device, an energy recovery device and a third cooling device;
the first cooling device is used for carrying out heat exchange on the heating member;
the second cooling device is used for enhancing heat dissipation of the first cooling device, the energy recovery device provides a power source for the third cooling device after recovering heat absorbed by the first cooling device, and the third cooling device is used for enhancing heat dissipation of the first cooling device and the second cooling device.
2. The utility model provides a waste heat recovery type submergence formula phase transition cooling system which characterized in that:
the first cooling device comprises a cavity, and cooling liquid is arranged in the cavity.
3. A waste heat recovery type submerged phase change cooling system as claimed in claim 2, wherein:
the second cooling device is a heat pipe, the heat pipe is arranged on the upper portion of the cavity, and an evaporation section of the heat pipe extends into the cavity.
4. A waste heat recovery type submerged phase change cooling system as claimed in claim 3, wherein:
the heat pipes are heat conducting copper pipe heat pipes, and the number of the heat pipes is multiple.
5. The waste heat recovery type submerged phase-change cooling system according to claim 4, wherein:
the heat pipes are vertically arranged and distributed in an array.
6. A waste heat recovery type submerged phase change cooling system as claimed in claim 2, wherein:
the energy recovery device comprises a heat collection device, an energy conversion device and a heat dissipation piece.
7. The waste heat recovery type submerged phase-change cooling system of claim 6, wherein:
the heat collecting device is a scale flat plate radiator, the scale flat plate radiator comprises a flat plate and a plurality of rib plates arranged on the flat plate, the rib plates are positioned in the cavity to collect heat, and the flat plate is partially exposed in the air; the energy conversion device is a semiconductor thermoelectric generation sheet which is arranged on a flat plate of the scale flat plate radiator; the heat dissipation part is a heat pipe radiator which is arranged on the semiconductor temperature difference power generation sheet.
8. The waste heat recovery type submerged phase-change cooling system of claim 7, wherein:
the heat pipe radiator consists of heat pipes and fins.
9. A waste heat recovery type immersion phase change cooling system as claimed in any one of claims 1 to 8, wherein:
the third cooling device includes a fan.
10. A waste heat recovery type immersion phase change cooling system as claimed in any one of claims 1 to 8, wherein:
the cavity is a box body with an opening at the top, and the top of the box body is covered and sealed by a metal cover plate; the metal cover plate consists of an upper cover plate and a lower cover plate.
CN202110536782.0A 2021-05-17 2021-05-17 Waste heat recovery type submergence formula phase transition cooling system Pending CN113253819A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110536782.0A CN113253819A (en) 2021-05-17 2021-05-17 Waste heat recovery type submergence formula phase transition cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110536782.0A CN113253819A (en) 2021-05-17 2021-05-17 Waste heat recovery type submergence formula phase transition cooling system

Publications (1)

Publication Number Publication Date
CN113253819A true CN113253819A (en) 2021-08-13

Family

ID=77182396

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110536782.0A Pending CN113253819A (en) 2021-05-17 2021-05-17 Waste heat recovery type submergence formula phase transition cooling system

Country Status (1)

Country Link
CN (1) CN113253819A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114554804A (en) * 2022-03-09 2022-05-27 联想(北京)有限公司 Heat dissipation system and electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114554804A (en) * 2022-03-09 2022-05-27 联想(北京)有限公司 Heat dissipation system and electronic equipment

Similar Documents

Publication Publication Date Title
CN107979962B (en) Water-cooled circuit board heat abstractor
JP4551261B2 (en) Cooling jacket
US11137175B2 (en) Composite water-cooling radiator structure
CN112885798A (en) Integrated phase change heat transfer element liquid cooling heat radiation module for server
CN104518255A (en) Battery module
CN113253819A (en) Waste heat recovery type submergence formula phase transition cooling system
CN113410538B (en) Liquid cooling battery package structure of trompil foamed aluminum heat dissipation runner
CN116780038B (en) Lithium battery protection board and lithium battery device with same
CN215494900U (en) Waste heat recovery type submergence formula phase transition cooling system
CN108024488B (en) Water jacket type circuit board heat abstractor
CN216905720U (en) Cooling device and electronic equipment
CN207820432U (en) Water-cooled circuit plate heat dissipating device
CN114340332B (en) Submerged cooling system
CN217064199U (en) Heat radiation structure of motor controller
CN209929439U (en) Power battery water-cooling module assembly
CN108419416A (en) A kind of high heat dissipation capacity heat-pipe radiator of IGBT
CN212970511U (en) Electrical equipment applying heat dissipation device
CN114449841A (en) Radiator cabinet
KR102540540B1 (en) Boiling cooling system
JP3212912U (en) Interface card staggered heat dissipation structure
CN217685509U (en) Radiator and air condensing units
CN211745110U (en) Electrical apparatus box heat radiation structure and air conditioner
CN219266882U (en) Heat pipe radiator for processor
CN216928704U (en) Heat dissipation assembly for installing battery module and battery pack
CN220796732U (en) TEC ion wind heat dissipation assembly for chip

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination