CN113245466B - Full-automatic blanking and bending feeding mechanism for IC (integrated circuit) belt - Google Patents
Full-automatic blanking and bending feeding mechanism for IC (integrated circuit) belt Download PDFInfo
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- CN113245466B CN113245466B CN202110478456.9A CN202110478456A CN113245466B CN 113245466 B CN113245466 B CN 113245466B CN 202110478456 A CN202110478456 A CN 202110478456A CN 113245466 B CN113245466 B CN 113245466B
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- assembly
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- 238000005452 bending Methods 0.000 title claims abstract description 73
- 238000012545 processing Methods 0.000 claims abstract description 71
- 238000003754 machining Methods 0.000 claims abstract description 17
- 230000005540 biological transmission Effects 0.000 claims description 35
- 239000002699 waste material Substances 0.000 claims description 21
- 238000005520 cutting process Methods 0.000 claims description 11
- 238000001179 sorption measurement Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F11/00—Cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F23/00—Feeding wire in wire-working machines or apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Abstract
The invention discloses a full-automatic blanking, bending and feeding mechanism for an IC (integrated circuit) belt, which comprises a processing frame and a feeding assembly arranged on the processing frame and used for feeding the IC belt, wherein a processing table is arranged on one side of the processing frame, a blanking assembly used for blanking the IC belt and a bending assembly used for bending the IC belt are sequentially arranged on the processing table, a feeding assembly arranged on the processing frame is further arranged on one side of the bending assembly and one side of the blanking assembly, and a clamping piece used for clamping a terminal on the feeding assembly onto the feeding assembly is further arranged between the feeding assembly and the feeding assembly. The invention has the following beneficial effects: the mechanism is high in automation degree, full-automatic blanking, bending and blanking are achieved, manual operation is not needed in the whole process, machining efficiency is improved when mass production is achieved, meanwhile, the technical effects of labor cost, machining cost and labor intensity are reduced, manpower resources can be effectively utilized by enterprises, and collection is convenient.
Description
Technical Field
The invention relates to the field of automation equipment, in particular to a full-automatic blanking, bending and feeding mechanism for an IC belt.
Background
With the development of science and technology, a large amount of IC belts are required to be used in production, at present, the IC belts are generally punched, bent and blanked one by one manually in the industry, and the method wastes a large amount of manpower, is low in efficiency and has high working strength.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a full-automatic blanking, bending and feeding mechanism for an IC tape.
The purpose of the invention is realized by the following technical scheme:
the utility model provides a full-automatic blanking of IC area feed mechanism of bending, includes the processing frame and sets up the material loading subassembly that is used for taking the IC to take the material loading on it, one side of processing frame is equipped with a processing platform, the processing bench be equipped with in proper order be used for with the blanking subassembly of IC area blanking and the subassembly of bending that is used for taking the IC to bend, one side of bending subassembly and blanking subassembly still is equipped with the setting and is in pay-off subassembly on the processing frame, still be equipped with between pay-off subassembly and the material loading subassembly and be used for with terminal centre gripping on the material loading subassembly extremely holder on the pay-off subassembly.
Preferably, the blanking assembly comprises a fixed block I fixedly arranged on the processing table, and a blanking hole is formed in the fixed block I; the top of processing platform is equipped with a push plate that can reciprocate, a propelling movement piece I has set firmly on the push plate, set firmly one on the propelling movement piece I and be used for cutting the waste material end in IC area cuts cut the sword, it can run through to cut the hole.
Preferably, the processing table is further fixedly provided with a waste pipe, the waste pipe is communicated with a waste discharge hole formed in the processing table, and the waste discharge hole is located below the blanking hole.
Preferably, the bending assembly comprises a fixed block II fixedly arranged on the processing table, and a bending hole is formed in the fixed block II; the pushing plate is fixedly provided with a pushing block II, the pushing block II is fixedly provided with a bending knife used for bending the pin end of the IC strip, and the bending knife can penetrate through the bending hole and abut against the pin end.
Preferably, the machining table is further fixedly provided with a bending cylinder, a bending plate is fixedly arranged on a cylinder shaft of the bending cylinder, and the bending plate is located in the bending groove of the machining table and can abut against the pin end.
Preferably, a guide post is fixedly arranged on the processing table, and the other end of the guide post is connected with the pushing plate through a shaft sleeve; and a guide spring sleeved on the guide post is further arranged between the pushing plate and the processing table.
Preferably, a cylinder frame is fixedly arranged on the processing table, a processing cylinder is fixedly arranged on the cylinder frame, and the pushing plate is fixedly arranged on a cylinder shaft of the processing cylinder.
Preferably, the feeding assembly comprises a feeding plate fixedly arranged on the processing table, a pushing plate is arranged on the feeding plate, and a group of clamping grooves which are arranged at equal intervals and can contain the IC belt are formed in the pushing plate; the processing table is fixedly provided with a pushing cylinder, a pushing block is fixedly arranged on a cylinder shaft of the pushing cylinder, and the pushing block is fixedly connected to the pushing plate.
Preferably, the feeding assembly comprises a feeding belt fixedly arranged on the processing frame, and a feeding groove matched with the IC belt is formed in the feeding belt; and a feeding wheel for accommodating the IC belt is fixedly arranged at one end of the feeding belt.
Preferably, a processing plate is arranged at one end, close to the bending assembly, of the processing table, a guide rail is fixedly arranged on the processing plate, a guide block matched with the guide rail is arranged on the guide rail, a rotary cylinder is fixedly arranged on the guide block, and a suction head used for sucking the IC tape is fixedly arranged on a cylinder shaft of the rotary cylinder; an adsorption frame is fixedly arranged above the processing plate, a transmission screw rod is fixedly arranged on the adsorption frame, and one end of the transmission screw rod is connected with a transmission motor; the IC belt clamping device is characterized in that a transmission nut which is in screw rod transmission with the transmission screw rod is arranged on the transmission screw rod, a transmission plate is fixedly arranged on the transmission nut, a transmission cylinder is fixedly arranged on the transmission plate, a clamping plate is fixedly arranged on a cylinder shaft of the transmission cylinder, and a suction nozzle and a guide column which are used for adsorbing the IC belt are arranged on the clamping plate.
The invention has the following beneficial effects:
1. the mechanism has high automation degree, realizes full-automatic blanking, bending and blanking, does not need manual operation in the whole process, thereby improving the processing efficiency in mass production, simultaneously, reducing the technical effects of labor cost, processing cost and labor intensity, effectively utilizing human resources for enterprises and being convenient to collect;
2. the cutting knife and the bending knife are arranged on the pushing plate and are driven by the processing cylinder simultaneously, so that the working efficiency can be improved, the cost can be reduced, and enterprise resources can be effectively utilized;
3. the bending cylinder drives the bending plate to bend the pin end for the second time, so that the verticality of the bent pin end is ensured, and the qualified rate is ensured.
Drawings
The technical scheme of the invention is further explained by combining the accompanying drawings as follows:
FIG. 1: a perspective view of a preferred embodiment of the present invention, with the clamping member removed;
FIG. 2: a partial enlarged view of portion B in fig. 1;
FIG. 3: a partial enlarged view of portion C in fig. 1;
FIG. 4: top view of the preferred embodiment of the present invention;
FIG. 5 is a schematic view of: in the preferred embodiment of the invention, the machining table, the bending assembly and the blanking assembly are arranged in a three-dimensional view;
FIG. 6: a partial enlarged view of portion D in fig. 5;
FIG. 7: in the preferred embodiment of the invention, the front view of the processing table, the bending assembly and the blanking assembly;
FIG. 8: a cross-sectional view a-a in fig. 7;
FIG. 9: the cross-sectional view B-B in FIG. 7.
Detailed Description
The present invention will be described in detail below with reference to specific embodiments shown in the drawings. These embodiments are not intended to limit the present invention, and structural, methodical, or functional changes that may be made by one of ordinary skill in the art in light of these embodiments are intended to be within the scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1 to 9, the present invention discloses a full-automatic blanking and bending feeding mechanism for an IC tape, which includes a processing frame 51 and a feeding assembly 52 disposed thereon for feeding the IC tape, wherein the feeding assembly 52 includes a feeding belt 521 fixedly disposed on the processing frame 51, and the feeding belt 521 is provided with a feeding groove 522 adapted to the IC tape 300. A feeding wheel 523 for accommodating the IC tape 300 is further fixedly arranged at one end of the feeding belt 521. In the above, the feeding belt 521 may be wound around a rotating wheel, and the rotating wheel is driven by a driving motor, and certainly, may also be driven by other driving methods, which all belong to the protection scope of the present invention and are not described in detail herein.
In the present invention, a processing table 57 is provided at one side of the processing frame 51, a blanking assembly 54 for blanking the IC tape 300 and a bending assembly 53 for bending the IC tape 300 are sequentially provided on the processing table 57, and the blanking assembly 54 and the bending assembly 53 are integrated, so that the work efficiency can be improved, the cost can be reduced, and the enterprise resources can be effectively utilized. Simultaneously, realize full-automatic blanking and bend, whole journey need not manual operation to reach and improve machining efficiency when mass production, simultaneously, reduce cost of labor, processing cost and artifical intensity of labour's technological effect, can make the enterprise effectively utilize manpower resources, and it is convenient to collect.
The blanking assembly 54 comprises a fixed block i 541 fixedly arranged on the processing table 57, and a blanking hole 543 is formed in the fixed block i 541. A pushing plate 544 capable of moving up and down is arranged above the processing table 57, a pushing block i 545 is fixedly arranged on the pushing plate 544, a cutting knife 546 used for cutting the waste material end 301 of the IC tape 300 is fixedly arranged on the pushing block i 545, and the cutting knife 546 can penetrate through the blanking hole 543. The processing table 57 is further fixedly provided with a waste pipe 547, the waste pipe 547 is communicated with a waste discharge hole 542 formed in the processing table 57, and the waste discharge hole 542 is located below the blanking hole 543.
The bending assembly 53 comprises a fixing block II 531 fixedly arranged on the processing table 57, and a bending hole 532 is formed in the fixing block II 531. A pushing block ii 533 is fixedly arranged on the pushing plate 544, a bending knife 534 for bending the lead end 302 of the IC tape 300 is fixedly arranged on the pushing block ii 533, and the bending knife 534 can penetrate through the bending hole 532 and abut against the lead end 302. The machining table 57 is further fixedly provided with a bending cylinder 535, a cylinder shaft of the bending cylinder 535 is fixedly provided with a bending plate 536, and the bending plate 536 is positioned in a bending groove 537 of the machining table 57 and can abut against the pin end 302. The bending cylinder drives the bending plate to bend the pin end for the second time, so that the verticality of the bent pin end is ensured, and the qualification rate is ensured.
In the above, the processing table 57 is fixedly provided with a guide post 571, and the other end of the guide post 571 is connected with the pushing plate 544 through a shaft sleeve. A guide spring 572 sleeved on the guide post 571 is further disposed between the pushing plate 544 and the processing table 57. A cylinder frame 573 is further fixedly arranged on the machining table 57, a machining cylinder 574 is fixedly arranged on the cylinder frame 573, and the push plate 544 is fixedly arranged on a cylinder shaft of the machining cylinder 574.
A feeding assembly 55 arranged on the processing frame 51 is further arranged on one side of the bending assembly 53 and the blanking assembly 54, a clamping member 56 for clamping a terminal on the feeding assembly 52 onto the feeding assembly 55 is further arranged between the feeding assembly 55 and the feeding assembly 52, the structure of the clamping member is the prior art, such as a three-axis gripper, and the like, and the structure is not a protection point of the invention, and is not described in detail herein.
The feeding assembly 55 includes a feeding plate 551 fixed on the processing table 57, a pushing plate 552 is disposed on the feeding plate 551, and a set of slots 553 equally spaced and capable of accommodating the IC tape 300 is disposed on the pushing plate 552. A pushing cylinder 554 is fixedly arranged on the processing table 57, a pushing block 555 is fixedly arranged on a cylinder shaft of the pushing cylinder 554, and the pushing block 555 is fixedly connected to the pushing plate 552.
In the invention, a processing plate 58 is arranged at one end of the processing table 57 close to the bending assembly 53, a guide rail 581 is fixedly arranged on the processing plate 58, a guide block 582 matched with the guide rail 581 is arranged on the guide rail 581, a rotary cylinder 583 is fixedly arranged on the guide block 582, and a suction head 584 used for sucking the IC tape 300 is fixedly arranged on a cylinder shaft of the rotary cylinder 583. An adsorption frame 59 is fixedly arranged above the processing plate 58, a transmission screw rod is fixedly arranged on the adsorption frame 59, and one end of the transmission screw rod is connected with a transmission motor 591. The transmission screw rod is provided with a transmission nut which is in transmission with the transmission screw rod, the transmission nut is fixedly provided with a transmission plate 592, the transmission plate 592 is fixedly provided with a transmission cylinder 593, a cylinder shaft of the transmission cylinder 593 is fixedly provided with a clamping plate 594, and the clamping plate 594 is provided with a suction nozzle 595 and a guide column 596 which are used for sucking the IC belt 300.
The working process of the invention is briefly described as follows:
s1, starting the feeding belt 521, conveying the IC tape on the feeding wheel 523 to a corresponding position, and starting the clamping member 56 to clamp the IC tape on the feeding belt 521 into the clamping slot 553;
s2, starting the pushing cylinder 554, and driving the pushing plate 522 to push the IC belt to a corresponding position through the pushing block 555;
s3, the processing cylinder 574 is started to drive the pushing plate 544 to move until the cutting knife 546 finishes cutting the waste end 301, and after the cutting is finished, the waste end 301 flows into the waste pipe 547 through the waste discharge hole 542 until flowing out of the waste pipe 547. Meanwhile, the bending knife 534 abuts against the pin end 302, and primary bending of the pin end 302 is completed;
s4, starting the bending cylinder 535, and driving the bending plate 536 to press the pin end 302 again to complete the secondary bending;
and S5, the pushing cylinder 554 is started again, the pushing block 555 drives the pushing plate 522 to push the IC belt to the processing plate 58, the suction head 584 is started to complete the adsorption of the IC belt, after the adsorption is completed, the rotating cylinder 583 is started, the IC belt is rotated to a corresponding angle, the transmission cylinder 593 is started, and the adsorption of the IC belt is completed through the suction nozzle 595.
It should be understood that although the specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it will be appreciated by those skilled in the art that the specification as a whole may be appropriately combined to form other embodiments as will be apparent to those skilled in the art.
The above-listed detailed description is merely a detailed description of possible embodiments of the present invention, and it is not intended to limit the scope of the invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention are intended to be included within the scope of the present invention.
Claims (4)
- The utility model provides a full-automatic blanking of IC area feed mechanism of bending, including handling frame (51) and set up above that and be used for the material loading subassembly (52) with IC area material loading, its characterized in that: a processing table (57) is arranged on one side of the processing frame (51), a blanking assembly (54) for blanking the IC belt (300) and a bending assembly (53) for bending the IC belt (300) are sequentially arranged on the processing table (57), a feeding assembly (55) arranged on the processing frame (51) is further arranged on one side of the bending assembly (53) and one side of the blanking assembly (54), and a clamping piece (56) for clamping the IC belt on the feeding assembly (52) onto the feeding assembly (55) is further arranged between the feeding assembly (55) and the feeding assembly (52);The blanking assembly (54) comprises a fixed block I (541) fixedly arranged on the processing table (57), and a blanking hole (543) is formed in the fixed block I (541); a pushing plate (544) capable of moving up and down is arranged above the processing table (57), a pushing block I (545) is fixedly arranged on the pushing plate (544), a cutting knife (546) for cutting the waste end (301) of the IC tape (300) is fixedly arranged on the pushing block I (545), and the cutting knife (546) can penetrate through the blanking hole (543);the bending assembly (53) comprises a fixed block II (531) fixedly arranged on the processing table (57), and a bending hole (532) is formed in the fixed block II (531); a pushing block II (533) is fixedly arranged on the pushing plate (544), a bending knife (534) used for bending the pin end (302) of the IC tape (300) is fixedly arranged on the pushing block II (533), and the bending knife (534) can penetrate through the bending hole (532) and abut against the pin end (302);the processing table (57) is further fixedly provided with a bending air cylinder (535), an air cylinder shaft of the bending air cylinder (535) is fixedly provided with a bending plate (536), and the bending plate (536) is positioned in a bending groove (537) of the processing table (57) and can abut against the pin end (302);The feeding assembly (55) comprises a feeding plate (551) fixedly arranged on the processing table (57), a pushing plate (552) is arranged on the feeding plate (551), and a group of clamping grooves (553) which are arranged at equal intervals and can contain the IC belt (300) are formed in the pushing plate (552); a pushing cylinder (554) is fixedly arranged on the processing table (57), a pushing block (555) is fixedly arranged on a cylinder shaft of the pushing cylinder (554), and the pushing block (555) is fixedly connected to the pushing plate (552);the feeding assembly (52) comprises a feeding belt (521) fixedly arranged on the processing frame (51), and a feeding groove (522) matched with the IC belt (300) is formed in the feeding belt (521); a feeding wheel (523) for accommodating the IC belt (300) is fixedly arranged at one end of the feeding belt (521);one end, close to the bending assembly (53), of the machining table (57) is provided with a machining plate (58), a guide rail (581) is fixedly arranged on the machining plate (58), a guide block (582) matched with the guide rail (581) is arranged on the guide rail (581), a rotary air cylinder (583) is fixedly arranged on the guide block (582), and an air cylinder shaft of the rotary air cylinder (583) is fixedly provided with a suction head (584) used for adsorbing the IC belt (300); an adsorption frame (59) is fixedly arranged above the processing plate (58), a transmission screw rod is fixedly arranged on the adsorption frame (59), and one end of the transmission screw rod is connected with a transmission motor (591); the transmission screw rod is provided with a transmission nut, the transmission nut is fixedly provided with a transmission plate (592), the transmission plate (592) is fixedly provided with a transmission cylinder (593), a cylinder shaft of the transmission cylinder (593) is fixedly provided with a clamping plate (594), and the clamping plate (594) is provided with a suction nozzle (595) used for adsorbing the IC belt (300).
- 2. The full-automatic blanking, bending and feeding mechanism for the IC belt as claimed in claim 1, wherein: the processing table (57) is further fixedly provided with a waste pipe (547), the waste pipe (547) is communicated with a waste discharge hole (542) formed in the processing table (57), and the waste discharge hole (542) is located below the blanking hole (543).
- 3. The IC strip full-automatic blanking, bending and feeding mechanism of claim 2, characterized in that: a guide column (571) is fixedly arranged on the processing table (57), and the upper end of the guide column (571) is connected with the push plate (544) through a shaft sleeve; a guide spring (572) sleeved on the guide column (571) is further arranged between the push plate (544) and the processing table (57).
- 4. The IC strip full-automatic blanking, bending and feeding mechanism according to claim 3, characterized in that: the machining table (57) is further fixedly provided with a cylinder frame (573), the cylinder frame (573) is fixedly provided with a machining cylinder (574), and a cylinder shaft of the machining cylinder (574) is fixedly provided with the push plate (544).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110478456.9A CN113245466B (en) | 2021-04-30 | 2021-04-30 | Full-automatic blanking and bending feeding mechanism for IC (integrated circuit) belt |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110478456.9A CN113245466B (en) | 2021-04-30 | 2021-04-30 | Full-automatic blanking and bending feeding mechanism for IC (integrated circuit) belt |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113245466A CN113245466A (en) | 2021-08-13 |
| CN113245466B true CN113245466B (en) | 2022-07-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110478456.9A Active CN113245466B (en) | 2021-04-30 | 2021-04-30 | Full-automatic blanking and bending feeding mechanism for IC (integrated circuit) belt |
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| CN (1) | CN113245466B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113858642A (en) * | 2021-09-15 | 2021-12-31 | 苏州瀚川智能科技股份有限公司 | Multifunctional special machine |
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| CN111283433A (en) * | 2020-03-05 | 2020-06-16 | 吉门保险丝制造(厦门)有限公司 | Copper strip cutting and forming device and method |
| CN211965713U (en) * | 2020-03-31 | 2020-11-20 | 苏州瀚川智能科技股份有限公司 | IC bending mechanism |
| CN112207580A (en) * | 2020-10-28 | 2021-01-12 | 昆山大拇指自动化设备科技有限公司 | Automatic change resistance material all in one piece feed mechanism |
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