CN113242642B - Backlight monitoring structure for optical module - Google Patents
Backlight monitoring structure for optical module Download PDFInfo
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- CN113242642B CN113242642B CN202110340028.XA CN202110340028A CN113242642B CN 113242642 B CN113242642 B CN 113242642B CN 202110340028 A CN202110340028 A CN 202110340028A CN 113242642 B CN113242642 B CN 113242642B
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- photodiode
- photoelectric
- resistor
- mpd
- capacitor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/25—Arrangements specific to fibre transmission
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention provides a backlight monitoring structure for an optical module, which comprises a PCB (printed circuit board) and an MPD (metal-oxide-semiconductor) backlight monitoring platelet, wherein the MPD backlight monitoring platelet is arranged on the PCB, an MPD backlight monitoring circuit is laid on the MPD backlight monitoring platelet, the MPD backlight monitoring circuit comprises an external power supply VCC _ IN and a photoelectric circuit, the photoelectric circuit comprises a plurality of photoelectric branches, and each photoelectric branch is electrically connected with the external power supply VCC _ IN. The invention adopts a mode of independent MPD backlight monitoring platelet, realizes MPD backlight monitoring, solves the problems of difficult layout, difficult wiring and difficult matching of the PCB and effectively utilizes the module space.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to a backlight monitoring structure for an optical module.
Background
With the popularization of the application of the 100G optical module, more application environments require monitoring of MPD backlight monitoring of the photodiode, increasing the MPD backlight monitoring inevitably leads to more difficult layout of a PCB with tense layout, and increasing the MPD simultaneously leads to more difficult matching of high-speed signals and more difficult wiring.
Therefore, it is necessary to design a new backlight monitoring structure for an optical module to solve the problems of difficult PCB layout, difficult wiring and difficult matching.
Disclosure of Invention
The present invention is directed to overcome the drawbacks of the prior art, and provides a backlight monitoring structure for an optical module, which solves at least some of the problems in the prior art.
The invention is realized by the following steps:
the invention provides a backlight monitoring structure for an optical module, which comprises a PCB (printed circuit board) and an MPD (metal-oxide-semiconductor) backlight monitoring platelet, wherein the MPD backlight monitoring platelet is arranged on the PCB, an MPD backlight monitoring circuit is laid on the MPD backlight monitoring platelet, the MPD backlight monitoring circuit comprises an external power supply VCC _ IN and a photoelectric circuit, the photoelectric circuit comprises a plurality of photoelectric branches, and each photoelectric branch is electrically connected with the external power supply VCC _ IN.
Preferably, the optoelectronic circuit includes a first optoelectronic branch, a second optoelectronic branch, a third optoelectronic branch and a fourth optoelectronic branch, the first optoelectronic branch includes a first photodiode, a resistor R1 and a capacitor C1, the anode P4 of the first photodiode is grounded through a resistor R1, the capacitor C1 is connected in parallel with a resistor R1, the second optoelectronic branch includes a second photodiode, a resistor R2 and a capacitor C2, the anode P3 of the second photodiode is grounded through a resistor R2, the capacitor C2 is connected in parallel with a resistor R2, the third optoelectronic branch includes a third photodiode, a resistor R3 and a capacitor C5, the anode P84 of the third photodiode is grounded through a resistor R3, the capacitor C5 is connected in parallel with a resistor R3, the fourth optoelectronic branch includes a fourth photodiode, a resistor R4 and a capacitor C365, the anode P3724 of the fourth photodiode is grounded through a resistor R583723, and the capacitor C6 is connected IN parallel with the resistor R4, and the cathode N4 of the first photodiode, the cathode N3 of the second photodiode, the cathode N2 of the third photodiode and the cathode N1 of the fourth photodiode are all electrically connected with the external power supply VCC _ IN.
Preferably, the first photodiode, the second photodiode, the third photodiode and the fourth photodiode are all integrated on a chip U1.
Preferably, the backlight monitoring structure for the optical module further includes an inductor L1, and the cathode N4 of the first photodiode, the cathode N3 of the second photodiode, the cathode N2 of the third photodiode, and the cathode N1 of the fourth photodiode are all electrically connected to the external power supply VCC _ IN through an inductor L1.
Preferably, the backlight monitoring structure for the light module further includes a capacitor C3 and a capacitor C4, one end of the capacitor C3 is electrically connected to the input end of the inductor L1, the other end of the capacitor C3 is grounded, and the capacitor C4 is connected in parallel with the capacitor C3.
Preferably, the MPD backlight monitoring small board is welded to the PCB.
Preferably, the external power supply VCC _ IN is 3.3V.
The invention has the following beneficial effects:
the invention realizes MPD backlight monitoring by using an independent MPD backlight monitoring platelet mode, solves the problems of difficult PCB layout, difficult wiring and difficult matching, and effectively utilizes the module space.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a circuit diagram of MPD backlight monitoring according to an embodiment of the present disclosure;
fig. 2 is a side view of an MPD backlight monitoring PCB layout structure according to an embodiment of the present invention;
fig. 3 is another side view of an MPD backlight monitoring PCB layout structure according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown IN fig. 1 to fig. 3, an embodiment of the present invention provides a backlight monitoring structure for an optical module, including a PCB 1 and an MPD backlight monitoring platelet 2, where the MPD backlight monitoring platelet 2 is installed on the PCB 1, the MPD backlight monitoring platelet 2 is welded to the PCB 1, an MPD backlight monitoring circuit is laid on the MPD backlight monitoring platelet 2, the MPD backlight monitoring circuit includes an external power supply VCC _ IN and a photoelectric circuit, the photoelectric circuit includes a plurality of photoelectric branches, each of the photoelectric branches is electrically connected to the external power supply VCC _ IN, and the external power supply VCC _ IN is 3.3V.
The invention adopts a mode of independent MPD backlight monitoring platelet, realizes MPD backlight monitoring, solves the problems of difficult layout, difficult wiring and difficult matching of the PCB and effectively utilizes the module space.
The photoelectric circuit comprises a first photoelectric branch, a second photoelectric branch, a third photoelectric branch and a fourth photoelectric branch, wherein the first photoelectric branch comprises a first photodiode, a resistor R1 and a capacitor C1, the anode P4 of the first photodiode is grounded through the resistor R1, the capacitor C1 is connected in parallel with the resistor R1, the second photoelectric branch comprises a second photodiode, a resistor R2 and a capacitor C2, the anode P3 of the second photodiode is grounded through the resistor R2, the capacitor C2 is connected in parallel with the resistor R2, the third photoelectric branch comprises a third photodiode, a resistor R3 and a capacitor C5, the anode P2 of the third photodiode is grounded through the resistor R3, the capacitor C5 is connected in parallel with the resistor R3, the fourth photoelectric branch comprises a fourth photodiode, a resistor R4 and a capacitor C6, the anode P582 of the fourth photodiode is connected in parallel with the resistor R8653, the resistor P828653 is connected in parallel with the capacitor R865, and the cathode N4 of the first photodiode, the cathode N3 of the second photodiode, the cathode N2 of the third photodiode and the cathode N1 of the fourth photodiode are all electrically connected with the external power supply VCC _ IN.
The first photodiode, the second photodiode, the third photodiode and the fourth photodiode are all integrated on a chip U1.
The backlight monitoring structure for the optical module further comprises an inductor L1, and the cathode N4 of the first photodiode, the cathode N3 of the second photodiode, the cathode N2 of the third photodiode and the cathode N1 of the fourth photodiode are all electrically connected with the external power supply VCC _ IN through an inductor L1.
The backlight monitoring structure for the optical module further comprises a capacitor C3 and a capacitor C4, one end of the capacitor C3 is electrically connected with the input end of the inductor L1, the other end of the capacitor C3 is grounded, and the capacitor C4 is connected with the capacitor C3 in parallel.
The circuit is divided into two parts:
the first part is a common MPD backlight circuit, with VCC _ IN for external power, typically 3.3V.
The second part is MPD backlight monitoring scheme, and adopts independent MPD monitoring platelet, leads to soldering tin between MPD platelet and the PCB board and is connected.
The implementation steps of the invention are as follows:
designing an MPD backlight monitoring platelet according to the scheme of FIG. 1;
pasting the piece according to the design file;
the MPD platelet was connected to the PCB by soldering.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention, which is intended to cover any modifications, equivalents, improvements, etc. within the spirit and scope of the present invention.
Claims (1)
1. A backlight monitoring structure for an optical module is characterized in that: the MPD backlight monitoring platelet is installed on the PCB and welded with the PCB, an MPD backlight monitoring circuit is laid on the MPD backlight monitoring platelet and comprises an external power supply VCC _ IN and a photoelectric circuit, the photoelectric circuit comprises a plurality of photoelectric branches, each photoelectric branch is electrically connected with the external power supply VCC _ IN, the photoelectric circuit comprises a first photoelectric branch, a second photoelectric branch, a third photoelectric branch and a fourth photoelectric branch, the first photoelectric branch comprises a first photodiode, a resistor R1 and a capacitor C1, the anode P4 of the first photodiode is grounded through a resistor R1, the capacitor C1 is connected with a resistor R1 IN parallel, the second photoelectric branch comprises a second photodiode, a resistor R2 and a capacitor C2, and the anode P3 of the second photodiode is grounded through a resistor R2, a capacitor C2 is connected IN parallel with the resistor R2, the third photoelectric branch comprises a third photodiode, a resistor R3 and a capacitor C5, an anode P2 of the third photodiode is grounded through a resistor R3, a capacitor C5 is connected IN parallel with a resistor R3, the fourth photoelectric branch comprises a fourth photodiode, a resistor R4 and a capacitor C6, an anode P1 of the fourth photodiode is grounded through a resistor R4, a capacitor C6 is connected IN parallel with a resistor R4, a cathode N4 of the first photodiode, a cathode N3 of the second photodiode, a cathode N2 of the third photodiode and a cathode N1 of the fourth photodiode are all electrically connected with the external power supply VCC _ IN, the external power supply VCC _ IN is 3.3V, the first photodiode, the second photodiode, the third photodiode and the fourth photodiode are all integrated on the U1, and the monitoring structure for the backlight module for the U1 further comprises an inductor L1, negative pole N4 of first photodiode, negative pole N3 of second photodiode, negative pole N2 of third photodiode and negative pole N1 of fourth photodiode all through inductance L1 with external power supply VCC _ IN electricity is connected, the backlight monitoring structure that the optical module was used still includes electric capacity C3 and electric capacity C4, the one end of electric capacity C3 is connected with inductance L1's input electricity, the other end ground connection of electric capacity C3, electric capacity C4 with electric capacity C3 is parallelly connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110340028.XA CN113242642B (en) | 2021-03-30 | 2021-03-30 | Backlight monitoring structure for optical module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110340028.XA CN113242642B (en) | 2021-03-30 | 2021-03-30 | Backlight monitoring structure for optical module |
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| Publication Number | Publication Date |
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| CN113242642A CN113242642A (en) | 2021-08-10 |
| CN113242642B true CN113242642B (en) | 2022-09-06 |
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| CN202110340028.XA Active CN113242642B (en) | 2021-03-30 | 2021-03-30 | Backlight monitoring structure for optical module |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3636313B2 (en) * | 2001-09-07 | 2005-04-06 | 松下電器産業株式会社 | Digital burst optical transmitter circuit |
| CN102281102B (en) * | 2011-08-01 | 2014-07-30 | 成都优博创技术有限公司 | Open loop debugging method for optical power and extinction ratio of transmit terminal of optical module |
| CN103682980A (en) * | 2013-12-17 | 2014-03-26 | 昂纳信息技术（深圳）有限公司 | Output control method for laser signals |
| CN203618087U (en) * | 2013-12-30 | 2014-05-28 | 宁波环球广电科技有限公司 | Wide-range optical monitoring circuit of optical receiver |
| CN204442810U (en) * | 2015-04-13 | 2015-07-01 | 安徽康佳绿色照明技术有限公司 | A kind of compact type multifunctional intellectual dimming LED drive circuit |
| CN108391343B (en) * | 2018-03-02 | 2021-01-22 | 京东方科技集团股份有限公司 | LED detection device, detection system and detection method |
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