CN113231757A - Tin-based soldering paste and preparation method thereof - Google Patents
Tin-based soldering paste and preparation method thereof Download PDFInfo
- Publication number
- CN113231757A CN113231757A CN202110688529.7A CN202110688529A CN113231757A CN 113231757 A CN113231757 A CN 113231757A CN 202110688529 A CN202110688529 A CN 202110688529A CN 113231757 A CN113231757 A CN 113231757A
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- Prior art keywords
- tin
- powder
- block
- soldering
- weighing
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
Abstract
The invention relates to the technical field of welding, in particular to a tin-based soldering paste, which consists of soldering powder and soldering flux, wherein the soldering powder consists of Sn, Bi and Cu, and the weight ratio of the Sn, the Bi and the Cu is 70: 29: 1. the invention also provides a preparation method of the tin-based soldering paste, which comprises the following steps: s1, weighing, namely weighing a tin block, a bismuth block and a copper block, removing the outer layers of the tin block and the copper block, and then weighing and proportioning the tin block, the bismuth block and the copper block; s2, crushing, namely crushing the weighed tin blocks, bismuth blocks and copper blocks; s3, mixing, namely stirring the powder subjected to surface treatment and the soldering flux for 6-8min at the stirring speed of 3-5 r/S; s4, storing, sealing the mixed tin-based soldering paste, and then putting the tin-based soldering paste into a constant temperature and humidity freezer, wherein the temperature is 0-10 ℃. The invention ensures the coverage of the welding position, thereby ensuring the welding effect.
Description
Technical Field
The invention relates to the technical field of welding, in particular to tin-based soldering paste and a preparation method thereof.
Background
The solder paste is a homogeneous mixture of alloy solder powder, pasty flux and some additives, and has certain viscosity and good thixotropy. At normal temperature, the soldering paste can initially stick the electronic component to a given position, when the soldering paste is heated to a certain temperature, the alloy powder is melted along with the volatilization of the solvent and part of the additives, so that the welded component and the welding pad are mutually connected, and the welding point which is permanently connected is formed by cooling. When soldering, the alloy powder is melted and then solidified to perform the soldering function, and since the conventional tin-based solder paste is melted and solidified, the solder powder is solidified and contracted, the solidified volume is reduced compared with the volume when melting, and the soldering effect is affected because some parts are not covered after soldering.
Disclosure of Invention
The invention aims to solve the defect that the welding effect is influenced in the prior art, and provides tin-based soldering paste and a preparation method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
designing a tin-based soldering paste, wherein the tin-based soldering paste consists of soldering powder and soldering flux, the soldering powder consists of Sn, Bi and Cu, and the weight ratio of Sn to Bi to Cu is 70: 29: 1.
preferably, the soldering flux consists of alkali metal and alkaline earth metal chlorides, fluorides and an active agent.
Preferably, among them, the alkali metal and alkaline earth metal chlorides are lithium and magnesium oxide.
Preferably, the diameter of the welding powder is 80-100 um.
The invention also provides a preparation method of the tin-based soldering paste, which comprises the following steps:
s1, weighing, namely weighing a tin block, a bismuth block and a copper block, removing the outer layers of the tin block and the copper block, and then weighing and proportioning the tin block, the bismuth block and the copper block;
s2, crushing, namely crushing the weighed tin blocks, bismuth blocks and copper blocks, filtering the scraps through a filter screen, crushing the scraps which cannot pass through the filter screen for the second time, then grinding, and performing surface treatment on the ground powder;
s3, mixing, namely stirring the powder subjected to surface treatment and the soldering flux for 6-8min at the stirring speed of 3-5 r/S;
s4, storing, sealing the mixed tin-based soldering paste, and then putting the tin-based soldering paste into a constant temperature and humidity freezer, wherein the temperature is 0-10 ℃.
Preferably, the surface treatment comprises the following steps:
a1, weighing the high polymer resin according to the amount of the ground powder;
a2, pouring the high polymer resin into the powder, stirring clockwise for 3-5min, standing for 2-3min, stirring counterclockwise for 3-5min, and finally inverting the powder and stirring for 5-8 min.
Preferably, the mass ratio of the high polymer resin to the powder is 1: 10.
The tin-based soldering paste and the preparation method thereof provided by the invention have the beneficial effects that: by adding bismuth into the tin-based soldering paste, the volume of the soldering powder is not solidified and shrunk after melting and solidification, and the covering of a welding position is ensured, so that the welding effect is ensured, and the wettability of the tin-based soldering paste is ensured by adding copper.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example 1
A tin-based solder paste comprising the steps of: the tin-based soldering paste consists of soldering powder and soldering flux, wherein the soldering powder consists of Sn, Bi and Cu, and the weight ratio of Sn to Bi to Cu is 70: 29: 1, bismuth has been added to the tin-based soldering paste, makes the welding powder volume not take place to solidify the shrink after melting and solidifying, has guaranteed the cover to welding department to guaranteed the welded effect, and through the joining of copper, guaranteed the wettability of tin-based soldering paste, it is tiny to produce Cu6Sn5 particle during the reaction simultaneously, and this sliding mechanism that helps the grain boundary has consequently prolonged the fatigue life under the promotion temperature.
The soldering flux consists of alkali metal and alkaline earth metal chlorides, fluoride and an active agent, wherein the alkali metal and alkaline earth metal chlorides are lithium and magnesium oxide, and the diameter of the welding powder is 80 microns.
The invention also provides a preparation method of the tin-based soldering paste, which comprises the following steps:
s1, weighing, namely weighing a tin block, a bismuth block and a copper block, removing the outer layers of the tin block and the copper block, and then weighing and proportioning the tin block, the bismuth block and the copper block;
s2, crushing, namely crushing the weighed tin blocks, bismuth blocks and copper blocks, filtering the scraps through a filter screen, crushing the scraps which cannot pass through the filter screen for the second time, then grinding, and performing surface treatment on the ground powder;
s3, mixing, namely stirring the powder subjected to surface treatment and the soldering flux for 6min at the stirring speed of 3 r/S;
s4, storing, namely sealing the mixed tin-based soldering paste, and then putting the sealed tin-based soldering paste into a constant-temperature constant-humidity freezer, wherein the temperature is 0 ℃, and performing heat preservation treatment to prevent the excessive temperature and prevent the soldering powder from generating chemical reaction with the soldering flux, so that the viscosity is reduced to influence the performance of the soldering powder; meanwhile, the condition that the high polymer resin is crystallized due to too low temperature is avoided, and the form of the tin-based soldering paste is deteriorated.
The surface treatment comprises the following steps:
a1, weighing the high polymer resin according to the amount of the ground powder;
a2, pouring the high polymer resin into the powder, stirring clockwise for 3min, standing for 2min, stirring counterclockwise for 3min, and finally inverting the powder and stirring for 5 min.
The mass ratio of the high polymer resin to the powder is 1:10, and the high polymer resin is adopted to wrap the outer surface of the powder, so that a protective film is formed on the surface of the powder, the tin-based soldering paste is prevented from being oxidized, the oxygen content of the tin-based soldering paste is in a normal range, and the effect after soldering is facilitated.
Example 2
A tin-based solder paste comprising the steps of: the tin-based soldering paste consists of soldering powder and soldering flux, wherein the soldering powder consists of Sn, Bi and Cu, and the weight ratio of Sn to Bi to Cu is 70: 29: 1, bismuth has been added to the tin-based soldering paste, makes the welding powder volume not take place to solidify the shrink after melting and solidifying, has guaranteed the cover to welding department to guaranteed the welded effect, and through the joining of copper, guaranteed the wettability of tin-based soldering paste, it is tiny to produce Cu6Sn5 particle during the reaction simultaneously, and this sliding mechanism that helps the grain boundary has consequently prolonged the fatigue life under the promotion temperature.
The soldering flux consists of alkali metal and alkaline earth metal chlorides, fluoride and an active agent, wherein the alkali metal and alkaline earth metal chlorides are lithium and magnesium oxide, and the diameter of the welding powder is 90 microns.
The invention also provides a preparation method of the tin-based soldering paste, which comprises the following steps:
s1, weighing, namely weighing a tin block, a bismuth block and a copper block, removing the outer layers of the tin block and the copper block, and then weighing and proportioning the tin block, the bismuth block and the copper block;
s2, crushing, namely crushing the weighed tin blocks, bismuth blocks and copper blocks, filtering the scraps through a filter screen, crushing the scraps which cannot pass through the filter screen for the second time, then grinding, and performing surface treatment on the ground powder;
s3, mixing, namely stirring the powder subjected to surface treatment and the soldering flux for 7min at the stirring speed of 4 r/S;
s4, storing, namely sealing the mixed tin-based soldering paste, and then putting the sealed tin-based soldering paste into a constant-temperature constant-humidity freezer, wherein the temperature is 5 ℃, and performing heat preservation treatment to prevent the excessive temperature and prevent the soldering powder from generating chemical reaction with the soldering flux, so that the viscosity is reduced to influence the performance of the soldering powder; meanwhile, the condition that the high polymer resin is crystallized due to too low temperature is avoided, and the form of the tin-based soldering paste is deteriorated.
The surface treatment comprises the following steps:
a1, weighing the high polymer resin according to the amount of the ground powder;
a2, pouring the high polymer resin into the powder, stirring clockwise for 4min, standing for 2.5min, stirring counterclockwise for 4min, and finally inverting the powder and stirring for 6 min.
The mass ratio of the high polymer resin to the powder is 1:10, and the high polymer resin is adopted to wrap the outer surface of the powder, so that a protective film is formed on the surface of the powder, the tin-based soldering paste is prevented from being oxidized, the oxygen content of the tin-based soldering paste is in a normal range, and the effect after soldering is facilitated.
Example 3
A tin-based solder paste comprising the steps of: the tin-based soldering paste consists of soldering powder and soldering flux, wherein the soldering powder consists of Sn, Bi and Cu, and the weight ratio of Sn to Bi to Cu is 70: 29: 1, bismuth has been added to the tin-based soldering paste, makes the welding powder volume not take place to solidify the shrink after melting and solidifying, has guaranteed the cover to welding department to guaranteed the welded effect, and through the joining of copper, guaranteed the wettability of tin-based soldering paste, it is tiny to produce Cu6Sn5 particle during the reaction simultaneously, and this sliding mechanism that helps the grain boundary has consequently prolonged the fatigue life under the promotion temperature.
The soldering flux consists of alkali metal and alkaline earth metal chlorides, fluoride and an active agent, wherein the alkali metal and alkaline earth metal chlorides are lithium and magnesium oxide, and the diameter of the welding powder is 100 microns.
The invention also provides a preparation method of the tin-based soldering paste, which comprises the following steps:
s1, weighing, namely weighing a tin block, a bismuth block and a copper block, removing the outer layers of the tin block and the copper block, and then weighing and proportioning the tin block, the bismuth block and the copper block;
s2, crushing, namely crushing the weighed tin blocks, bismuth blocks and copper blocks, filtering the scraps through a filter screen, crushing the scraps which cannot pass through the filter screen for the second time, then grinding, and performing surface treatment on the ground powder;
s3, mixing, namely stirring the powder subjected to surface treatment and the soldering flux for 8min at the stirring speed of 5 r/S;
s4, storing, namely sealing the mixed tin-based soldering paste, and then putting the sealed tin-based soldering paste into a constant-temperature constant-humidity freezer, wherein the temperature is 10 ℃, and performing heat preservation treatment to prevent the excessive temperature and prevent the soldering powder from generating chemical reaction with the soldering flux, so that the viscosity is reduced to influence the performance of the soldering powder; meanwhile, the condition that the high polymer resin is crystallized due to too low temperature is avoided, and the form of the tin-based soldering paste is deteriorated.
The surface treatment comprises the following steps:
a1, weighing the high polymer resin according to the amount of the ground powder;
a2, pouring the high polymer resin into the powder, stirring clockwise for 5min, standing for 3min, stirring counterclockwise for 5min, and finally inverting the powder and stirring for 8 min.
The mass ratio of the high polymer resin to the powder is 1:10, and the high polymer resin is adopted to wrap the outer surface of the powder, so that a protective film is formed on the surface of the powder, the tin-based soldering paste is prevented from being oxidized, the oxygen content of the tin-based soldering paste is in a normal range, and the effect after soldering is facilitated.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (7)
1. The tin-based soldering paste is characterized by comprising soldering powder and soldering flux, wherein the soldering powder comprises Sn, Bi and Cu, and the weight ratio of Sn, Bi and Cu is 70: 29: 1.
2. a tin-based solder paste according to claim 1, wherein said flux is comprised of alkali and alkaline earth chlorides, fluorides, and activators.
3. A tin-based solder paste according to claim 2, wherein the alkali metal and alkaline earth metal chlorides are lithium and magnesium oxide.
4. A tin-based solder paste according to claim 1, wherein the diameter of the solder powder is 80-100 um.
5. A method of preparing a tin-based solder paste according to any one of claims 1 to 4, characterized by comprising the steps of:
s1, weighing, namely weighing a tin block, a bismuth block and a copper block, removing the outer layers of the tin block and the copper block, and then weighing and proportioning the tin block, the bismuth block and the copper block;
s2, crushing, namely crushing the weighed tin blocks, bismuth blocks and copper blocks, filtering the scraps through a filter screen, crushing the scraps which cannot pass through the filter screen for the second time, then grinding, and performing surface treatment on the ground powder;
s3, mixing, namely stirring the powder subjected to surface treatment and the soldering flux for 6-8min at the stirring speed of 3-5 r/S;
s4, storing, sealing the mixed tin-based soldering paste, and then putting the tin-based soldering paste into a constant temperature and humidity freezer, wherein the temperature is 0-10 ℃.
6. A method for preparing a tin-based solder paste according to claim 5, characterized by comprising the steps of, in carrying out the surface treatment:
a1, weighing the high polymer resin according to the amount of the ground powder;
a2, pouring the high polymer resin into the powder, stirring clockwise for 3-5min, standing for 2-3min, stirring counterclockwise for 3-5min, and finally inverting the powder and stirring for 5-8 min.
7. The method of claim 6, wherein the mass ratio of the high polymer resin to the powder is 1: 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110688529.7A CN113231757A (en) | 2021-06-22 | 2021-06-22 | Tin-based soldering paste and preparation method thereof |
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| CN202110688529.7A CN113231757A (en) | 2021-06-22 | 2021-06-22 | Tin-based soldering paste and preparation method thereof |
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Application publication date: 20210810 |
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