CN113224544B - Housing assembly and electronic device - Google Patents
Housing assembly and electronic device Download PDFInfo
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- CN113224544B CN113224544B CN202110544587.2A CN202110544587A CN113224544B CN 113224544 B CN113224544 B CN 113224544B CN 202110544587 A CN202110544587 A CN 202110544587A CN 113224544 B CN113224544 B CN 113224544B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention relates to a shell component and electronic equipment, wherein the shell component comprises a shell, a functional layer and a wave-transmitting layer which are arranged in a stacked mode, the functional layer comprises at least one of an adhesive layer and a decorative layer, the wave-transmitting layer is connected with the functional layer, and the wave-transmitting layer is provided with a frequency selective surface structure which is used for enabling the shell to transmit millimeter waves with the frequency of 24.25 GHz-52.6 GHz. The shell component has a special frequency selective surface structure, and can generate frequency selectivity for electromagnetic waves, so that the shell component has high-efficiency wave transmission characteristics for millimeter wave frequency bands, and the influence on the radiation performance of the millimeter wave antenna module is obviously reduced.
Description
Technical Field
The present invention relates to the field of wireless communications technologies, and in particular, to a housing assembly and an electronic device.
Background
According to the 3gpp TS 38.101 protocol provision, 5G NR mainly uses two-segment frequencies: FR1 band and FR2 band. The frequency range of the FR1 frequency band is 450 MHz-6 GHz, which is also called sub-6GHz frequency band; the frequency range of the FR2 band is 24.25 GHz-52.6 GHz, commonly referred to as millimeter Wave (mm Wave). Millimeter waves have the characteristics of high carrier frequency, large bandwidth and the like, and provide guarantee for high-speed transmission. Currently, two millimeter wave antenna modules, namely a QTM052 module and a QTM525 module, are published by the high-pass, wherein the QTM052 module covers 3GPP n261 and n260 band, and the QTM525 module covers 3GPP n258 and n261 band.
However, the existing millimeter wave antenna module is generally only suitable for free space environment, if the existing millimeter wave antenna module is directly placed in the whole electronic equipment, the radiation performance of the millimeter wave antenna can be affected due to the covering effect of the equipment rear cover, the antenna efficiency is reduced, and the like, so that the existing millimeter wave antenna module cannot meet the practical application.
Disclosure of Invention
Based on this, it is necessary to aim at providing a housing assembly that enhances the radiation performance of a millimeter wave antenna.
The shell assembly comprises a shell, a functional layer and a wave-transmitting layer, wherein the shell, the functional layer and the wave-transmitting layer are arranged in a stacked mode, the functional layer comprises at least one of an adhesive layer and a decorative layer, the wave-transmitting layer is connected with the functional layer, the wave-transmitting layer is provided with a frequency selective surface structure, and the frequency selective surface structure is used for enabling the shell to transmit millimeter waves with the frequency of 24.25 GHz-52.6 GHz.
The shell component is provided with the wave-transmitting layer, and the special frequency selective surface structure of the wave-transmitting layer can generate special frequency selectivity for electromagnetic waves, so that the shell component has high-efficiency wave-transmitting characteristics for millimeter wave frequency bands, and the influence on the radiation performance of the millimeter wave antenna module is obviously reduced. The wave-transmitting layer is bonded on the needed position of the shell through the bonding layer, so that the device is convenient to use, can be attached at any time, is beneficial to covering the millimeter wave antenna module on the whole surface, and achieves the optimal frequency selection effect. Through with the integration of wave-transparent layer on the housing component decorative layer, when guaranteeing the wave-transparent function, satisfied housing component's visual effect, avoid the outward appearance defect. The shell assembly has the advantages of small processing difficulty, high design flexibility, no influence on the visual effect of the shell assembly, better frequency selectivity, larger bandwidth, small signal loss, contribution to forming stable frequency response, avoidance of a series of problems of pattern distortion, impedance mismatch, frequency offset, gain reduction, antenna efficiency reduction and the like, and higher practical application value.
There is also provided an electronic device including:
the housing assembly;
the display module is connected with the shell assembly and is enclosed with the shell assembly to form a containing cavity;
the millimeter wave antenna module is arranged in the accommodating cavity and is covered by the shell component; a kind of electronic device with high-pressure air-conditioning system
The circuit board is arranged in the accommodating cavity.
The electronic equipment adopts the shell assembly with the wave-transmitting layer, so that the covering effect of the shell assembly on the millimeter wave antenna module is minimized, the lossless transmission of 5G signals is facilitated, and the communication effect is ensured.
Drawings
FIG. 1 is a cross-sectional view of a housing assembly of an embodiment;
FIG. 2 is a cross-sectional view of a housing assembly of yet another embodiment;
FIG. 3 is a cross-sectional view of a housing assembly of yet another embodiment;
FIG. 4 is a cross-sectional view of a housing assembly of yet another embodiment;
FIG. 5 is a cross-sectional view of a housing assembly of yet another embodiment;
FIG. 6 is a cross-sectional view of a housing assembly of yet another embodiment;
FIG. 7 is a cross-sectional view of a housing assembly of yet another embodiment;
FIG. 8 is a cross-sectional view of a housing assembly of yet another embodiment;
FIG. 9 is a cross-sectional view of a housing assembly of yet another embodiment;
FIG. 10 is a cross-sectional view of a housing assembly of yet another embodiment;
FIG. 11 is a partial schematic view of a frequency selective surface structure in a housing assembly according to an embodiment;
fig. 12 to 27 are schematic structural diagrams of structural units in the frequency selective surface structure;
fig. 28 to 29 are schematic views showing an array pattern of structural units in the frequency selective surface structure.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1 to 10, the housing assembly according to an embodiment includes a housing 11, a functional layer 12, and a wave-transparent layer 13 stacked together, where the wave-transparent layer 13 has a frequency selective surface structure 131, and the frequency selective surface structure 131 is used to transmit millimeter waves with frequencies of 24.25GHz to 52.6GHz through the housing 11.
The frequency selective surface structure (Frequency Selective Surface, FSS) is a periodic array structure formed by a plurality of passive resonant structure elements arranged according to a certain rule, which has a selective transmission or reflection effect on an incident wave of a specific frequency. The efficient wave transmission characteristic presented by the frequency selective surface structure 131 enables the housing 11 to transmit millimeter waves in the 5G frequency band, thereby significantly reducing the influence on the radiation performance of the millimeter wave antenna module.
The wave-transparent layer 13 is connected to the functional layer 12. The wave-transparent layer 13 may be located on the side of the functional layer 12 remote from the housing 11, i.e. the wave-transparent layer 13 is not connected to the housing 11, as is the case in fig. 1 to 6; and/or the wave-transparent layer 13 may be connected to the housing 11, i.e. the wave-transparent layer 13 is located between the housing 11 and the functional layer 12, as is the case in fig. 7 to 10. The number of the wave-transmitting layers 13 can be one or more, and when the shell component is provided with one wave-transmitting layer 13, the shell component has a thinner thickness; and when the casing component is provided with a plurality of wave-transmitting layers 13, the wave-transmitting effect is further enhanced.
The functional layer 12 includes at least one of an adhesive layer 121 and a decorative layer 122. The adhesive layer 121 is used to bond the wave-transparent layer 13 to the housing 11 (for bonding the wave-transparent layer 13 to the decorative layer 122 when the functional layer 12 further includes the decorative layer 122), i.e., when the functional layer 12 includes the adhesive layer 121, the wave-transparent layer 13 is provided on the side of the adhesive layer 121 remote from the housing 11. At this time, the wave-transparent layer 13 can be made into a detachable independent layered component, and is adhered to a required position of the housing 11 through the adhesive layer 121 according to the placement area of the millimeter wave antenna module in the electronic device, so that the device is convenient to use, can be attached at any time, is beneficial to covering the millimeter wave antenna module in the whole area, and achieves the optimal frequency selection effect. For example, the wave-transparent layer 13 may include a substrate 132, and the frequency selective surface structure 131 is formed on the substrate 132. Further, the substrate 132 has a first surface 132a and a second surface 132b opposite the first surface 132a, the first surface 132a being proximate to the adhesive layer 12, the second surface 132b being distal to the adhesive layer 121, and the frequency selective surface structure 131 may be formed on at least one of the first surface 132a and the second surface 132 b. In other words, the frequency selective surface structure 131 may be disposed on a single side of the substrate 132 (refer to fig. 1 and 2), and in this case, the adhesive layer 12 may be connected to the frequency selective surface structure 131 or may be connected to the substrate 132; alternatively, in order to further enhance the wave-transmitting effect, the frequency-selective surface structures 131 may be provided on both sides of the substrate 132 (refer to fig. 3). The frequency selective surface structure 131 may be processed on the substrate 132 by screen printing or the like. Further, the substrate 132 may be a PET film, a PEN film, or a PI film. The adhesive layer 121 may be a back adhesive.
In one embodiment, as shown in fig. 1, the functional layer 12 is an adhesive layer 121, and the wave-transparent layer 13 includes a first wave-transparent unit 13a, where the first wave-transparent unit 13a is connected to the housing 11 through the adhesive layer 121, that is, the first wave-transparent unit 13a is disposed on a side of the adhesive layer 121 away from the housing 11. The first wave-transmitting unit 13a includes a frequency selective surface structure 131 and a substrate 132, the frequency selective surface structure 131 being formed on the substrate 132. In the embodiment shown in fig. 1, the frequency selective surface structure 131 is formed on the second surface 132b of the substrate 132, the substrate 132 being connected to the adhesive layer 121. In the embodiment shown in fig. 2, the frequency selective surface structure 131 is formed on the first surface 132a of the substrate 132, the frequency selective surface structure 131 being connected to the adhesive layer 121. In the embodiment shown in fig. 3, the frequency selective surface structure 131 is formed on the first surface 132a and the second surface 132b of the substrate 132, and the frequency selective surface structure 131 formed on the first surface 132a is connected to the adhesive layer 121.
In order to improve the wave-transmitting effect to obtain a stable frequency response, a plurality of wave-transmitting layers 13 may be provided and laminated on the housing 11 through adhesive layers 121, respectively. Referring to fig. 4, the number of layers of the adhesive layer 121 and the wave-transparent layer 13 are respectively multiple, each wave-transparent layer 13 includes the above-described first wave-transparent unit 13a, and the multiple first wave-transparent units 13a and the multiple adhesive layers 121 are alternately laminated to form a laminate, and at both ends of the laminate in the lamination direction, one wave-transparent layer 13 and one adhesive layer 121 are respectively provided, and the adhesive layer 121 at one end of the laminate is fixedly adhered to the case 11. The location of the frequency selective surface structure 131 in the multilayer first wave-transparent unit 13a on the substrate 132 may be in any of the arrangements described above.
The decorative layer 122 is generally connected to the housing 11 for decorating the housing 11 to provide a pleasing appearance to the housing 11. The decorative layer 122 may be, for example, a CMF film or the like, and the specific structure thereof is not limited by the present invention.
When the functional layer 12 includes the decorative layer 122, the wave-transmitting layer 13 may be disposed on a side of the decorative layer 122 close to the housing 11 and/or a side remote from the housing 11. Through directly integrating the preparation on the decorative layer 122 of casing subassembly with the wave-transmitting layer 13, can satisfy the visual effect of casing subassembly when guaranteeing the wave-transmitting function, avoid the outward appearance defect, in addition still be favorable to omitting the thickness that additionally uses tie layer 121 to increase, namely, when setting up wave-transmitting layer 13 on decorative layer 122, wave-transmitting layer 13 need not the base structure. In this case, the method for preparing the frequency selective surface structure 131 may be, for example, a screen printing process, a PDS (Print Direct Structuring) process, or a LDS (Laser Direct Structuring) process, which may prepare a thinner frequency selective surface structure.
In the embodiment shown in fig. 5, the functional layer 12 comprises a decorative layer 122, the wave-transparent layer 13 comprises a second wave-transparent unit 13b, the second wave-transparent unit 13b has a frequency selective surface structure 131, and the second wave-transparent unit 13b is arranged at a side of the decorative layer 122 remote from the housing 11.
Further, the functional layer 12 may have both the adhesive layer 121 and the decorative layer 122, in which case the adhesive layer 121 is disposed on the side of the wave-transparent layer 13 remote from the decorative layer 122, i.e., the wave-transparent layer 13 is connected to the decorative layer 122 by the adhesive layer 121. Specifically, as shown in fig. 6, the functional layer 12 includes a decorative layer 122 and an adhesive layer 121, the adhesive layer 121 is disposed on a side of the second wave-transmitting unit 13b away from the decorative layer 122, the wave-transmitting layer 13 includes a second wave-transmitting unit 13b and a third wave-transmitting unit 13c, and the third wave-transmitting unit 13c is connected to the second wave-transmitting unit 13b on the decorative layer 122 through the adhesive layer 121. At this time, the third wave-transmitting unit 13c includes a frequency selective surface structure 131 and a substrate 132, the frequency selective surface structure 131 being formed on the substrate 132. Similarly, in order to improve the wave-transmitting effect, the number of the adhesive layers 121 and the wave-transmitting layers 13 is multiple, each wave-transmitting layer 13 includes the third wave-transmitting units 13c, the multiple third wave-transmitting units 13c and the multiple adhesive layers 121 are alternately laminated to form a laminate, one wave-transmitting layer 13 and one adhesive layer 121 are respectively disposed at two ends of the laminate in the lamination direction, and the adhesive layer 121 disposed at one end of the laminate is fixedly bonded to the second wave-transmitting unit 13b on the decorative layer 122.
In the embodiment shown in fig. 7, the functional layer 12 comprises a decorative layer 122 and the wave-transparent layer 13 comprises a fourth wave-transparent unit 13d, the fourth wave-transparent unit 13d having a frequency selective surface structure 131. The fourth wave-transmitting unit 13d is provided on the side of the decorative layer 122 close to the housing 11. At this time, since the fourth wave-transmitting unit 13d is close to the housing 11 and cannot be shielded by other structures, it is preferable to use a frequency selective surface structure 131 capable of exhibiting a transparent effect in the fourth wave-transmitting unit 13d in order to avoid affecting the external visual appearance of the housing assembly. Further, an additional wave-transmitting layer 13 may be connected to the adhesive layer 121, as shown in fig. 8, the adhesive layer 121 is disposed on a side of the decorative layer 122 away from the housing 11, and at this time, the wave-transmitting layer 13 further includes a fifth wave-transmitting unit 13e, and the fifth wave-transmitting unit 13e is connected to the decorative layer 122 through the adhesive layer 121. The fifth wave-transmitting unit 13e includes a frequency selective surface structure 131 and a substrate 132, the frequency selective surface structure 131 being formed on the substrate 132. Similarly, in order to improve the wave-transmitting effect, the number of the adhesive layers 121 and the wave-transmitting layers 13 is multiple, each wave-transmitting layer 13 includes the fifth wave-transmitting unit 13e, the multiple fifth wave-transmitting units 13e and the multiple adhesive layers 121 are alternately laminated to form a laminate, and one wave-transmitting layer 13 and one adhesive layer 121 are respectively disposed at two ends of the laminate in the lamination direction, and the adhesive layer 121 disposed at one end of the laminate is fixedly bonded with the decorative layer 122.
In the embodiment shown in fig. 9, the functional layer 12 includes a decorative layer 122, and the wave-transmitting layer 13 is disposed on both a side of the decorative layer 122 close to the housing 11 and a side of the decorative layer 122 remote from the housing 11, and the decorative layer 13 includes the fourth wave-transmitting unit 13d and the sixth wave-transmitting unit 13f described above, and the sixth wave-transmitting unit 13f has the frequency selective surface structure 131. As described above, it is preferable to employ the frequency selective surface structure 131 that can exhibit a transparent effect in the fourth wave-transmitting unit 13d, while the visual effect of the frequency selective surface structure 131 in the sixth wave-transmitting unit 13f is not limited. Further, the wave-transmitting layer 13 may be further laminated via an adhesive layer 121, and referring to fig. 10, at this time, the adhesive layer 121 is provided on the side of the sixth wave-transmitting unit 13f away from the housing 11. In the embodiment shown in fig. 10, the functional layer 12 includes an adhesive layer 121 and a decorative layer 122, the adhesive layer 121 being disposed on a side of the decorative layer 122 remote from the housing 11. The wave-transmitting layer 13 includes the fourth wave-transmitting unit 13d, the sixth wave-transmitting unit 13f, and the seventh wave-transmitting unit 13g is connected to the sixth wave-transmitting unit 13f on the decorative layer 122 through the adhesive layer 121. The seventh wave-transmitting unit 13g includes a frequency selective surface structure 131 and a substrate 132, the frequency selective surface structure 131 being formed on the substrate 132. Similarly, in order to improve the wave-transmitting effect, the number of the adhesive layers 121 and the wave-transmitting layers 13 is multiple, each wave-transmitting layer 13 includes the seventh wave-transmitting unit 13g, the seventh wave-transmitting units 13g and the adhesive layers 121 are alternately laminated to form a laminate, and the wave-transmitting layers 13 and the adhesive layers 121 are respectively positioned at two ends of the laminate in the lamination direction, and the adhesive layers 121 positioned at one end of the laminate are fixedly bonded with the decorative layers 122.
In the wave-transparent layer 13, the frequency selective surface structure 131 includes a plurality of structural units distributed in an array. In particular, the structural unit of the frequency selective surface structure 131 may be a mesh unit, a center connection type unit, a ring type unit, a solid type unit, or a combination type unit.
The structure of the grid cell may be referred to in fig. 11. Fig. 11 is a partial schematic view of the frequency selective surface structure 131, wherein 4 grid cells are arranged in a rectangular array. Since the grid cells have a small line width, a substantially transparent effect can be visually exhibited, particularly in the case where the functional layer 12 includes the decorative layer 122, especially in the case where the frequency selective surface structure 131 is provided on the side of the decorative layer 122 close to the case 11. Thus, in one embodiment, the cell structure of the frequency selective surface structure 131 is a grid cell with a line width of no more than 2 μm, achieving a visual effect of transparent appearance. In this case, in order to improve the frequency selectivity, the frequency selective surface structure 131 may further include a nanomaterial layer, and a plurality of grid cells are distributed on the nanomaterial layer in an array, and the nanomaterial layer may be made of nano silver wires or carbon nanotubes.
The central connection unit is a unit having a center, and the center extends outwards to form a plurality of extension parts, that is, the plurality of extension parts are connected together at the center, and refer to fig. 11 to 15. The central connection type unit is centrally symmetrical, a plurality of extension parts are uniformly distributed along the circumferential direction, a fixed included angle alpha is formed between every two adjacent extension parts, the number of the extension parts is 360 degrees/alpha, the shape of the extension parts can be designed according to the requirement of frequency selection, and the extension parts can be in a straight line shape, an arrow shape, a T shape, a folded line shape and the like. Further, the center-connected units are in-line units (fig. 12), Y-shaped units (fig. 13), anchor-shaped units (fig. 14), jessay cross-shaped units (fig. 15), or cross S-shaped units (fig. 16).
Here, the ring-shaped unit means that the unit is formed in a hollow ring shape, referring to fig. 17 to 21. The ring-shaped units can be axisymmetric or centrosymmetric, and the shape of the ring can be designed according to the requirement of frequency selection, such as a circular ring, a polygonal ring or other special shapes. Further, the ring-shaped units are cross-shaped ring-shaped units (such as fig. 17), Y-shaped ring-shaped units (such as fig. 18), circular ring-shaped units (such as fig. 19) or polygonal ring-shaped units (such as fig. 20 and 21). The size and the ring width of the ring-shaped unit have a certain influence on the frequency selectivity, and in order to achieve a better frequency selection effect, the ring width of the ring-shaped unit can be 0.05 mm-0.5 mm, and the maximum width of the ring-shaped unit can be 1 mm-4 mm, wherein the maximum width refers to the maximum linear distance between two points on the ring-shaped unit.
Wherein, the solid type unit means that the unit is in a non-hollow shape, refer to fig. 22 to 24. Further, the solid units are polygonal units (fig. 22, 23) or circular units (fig. 24). The size of the solid unit has a certain influence on the frequency selectivity, and in order to achieve a better frequency selection effect, the maximum width of the solid unit can be 0.2-0.84 mm, wherein the maximum width refers to the maximum linear distance between two points on the solid unit.
The combination type unit is a shape obtained by combining the patterns of the above type units, and referring to fig. 25 to 27, the shape of the combination type unit may be designed according to the frequency selection requirement, and the present invention is not particularly limited.
In the frequency selective surface structure 131, the arrangement of a plurality of structural units has a certain influence on the frequency selectivity. In the present invention, the structural units in the frequency selective surface structure 131 may be formed in a rectangular array or a triangular array to maximize the utilization of space and achieve better resonance characteristics. The rectangular array is shown in fig. 28, wherein the connecting lines of the centers of a plurality of structural units are formed into a rectangle, and the distance p between the centers of two adjacent structural units can be 1 mm-4 mm; further, when the structural units are in a central symmetrical structure (such as circular units), rectangular arrays are preferably adopted, so that the effective area can be utilized maximally, and gaps among the units can be reduced. As shown in fig. 29, the connection lines of the centers of the plurality of structural units are formed into a triangle, and the distance p between the centers of two adjacent structural units can be 1 mm-4 mm; furthermore, when the structural unit is of a polygonal structure, a triangular array is preferably adopted, so that the purposes of reducing the structure of the resonant unit and enhancing mutual coupling can be achieved, and the bandwidth is favorably increased.
The material of the frequency selective surface structure 131 may be a conventional conductive material, such as various metals (specifically, silver, copper or aluminum, etc.), and in practical preparation, the material may be in a form that is beneficial to processing, for example, conductive silver paste, and is prepared by screen printing, etc. Preferably, fang Zuxiao of the frequency selective surface structure 131 is at 1 Ω, which is advantageous for achieving a better wave-transparent effect.
The wave-transmitting layer 13 can realize wave-transmitting effect on various existing material shells. For example, the material of the housing 11 may be glass, ceramic, sapphire, or the like.
In the shell component, the wave-transmitting layer can be manufactured into a detachable layered component to be attached to the shell, or can be directly integrated on the shell component decorative layer, and the two modes can be combined for use, so that the shell component capable of transmitting millimeter waves in the 5G frequency range is obtained. The frequency selective surface structure has the advantages of small processing difficulty, high design flexibility, no influence on the visual effect of the shell component, better frequency selectivity, larger bandwidth, small signal loss, contribution to forming stable frequency response, capability of enabling the shell component to present high-wave-transmission characteristics to millimeter wave frequency bands, capability of obviously reducing influence on radiation performance of the millimeter wave antenna module, capability of avoiding a series of problems of pattern distortion, impedance mismatch, frequency offset, gain reduction, antenna efficiency reduction and the like, and higher practical application value.
An electronic device of an embodiment includes the above-mentioned housing assembly, a display module, a millimeter wave antenna module, and a circuit board. The display module is connected with the shell assembly and encloses a containing cavity with the shell assembly. The millimeter wave antenna module is arranged in the accommodating cavity and covered by the shell component. The circuit board is arranged in the accommodating cavity and is electrically connected with the display module.
In one embodiment, the electronic device is a mobile phone or tablet computer, and the housing assembly is a rear cover.
Above-mentioned electronic equipment has adopted the casing subassembly that has the wave-transparent layer, makes its effect to millimeter wave antenna module's cover minimum, is favorable to the harmless transmission of 5G signal, guarantees communication effect, and the outside visual impression of equipment is better, is favorable to promoting user's use experience.
It should be noted that the above-mentioned housing assembly is not limited to the housing assembly of the electronic device, and may be applied to other terminal devices.
The invention is further illustrated by the following specific examples, which are not intended to limit the invention.
In an embodiment, the method for testing the reflection coefficient and the transmission coefficient of the shell assembly in 20-34 GHz comprises the following steps: the vector network analyzer adopts Agilent N5227A, and the frequency range is covered to be 10 MHz-67 GHz; the measuring antenna adopts a pair of HD-320 linear polarization standard gain horn antennas, and the frequency range is covered to 26.5 GHz-40 GHz; the coaxial cable is a precise flexible cable, the length is 1m, the attenuation is 3dB within the range of 18 GHz-40 GHz, the standing wave ratio is better than 1.3, and the connector is a 2.92 male connector; the measurement of the reflectance and transmittance is performed by placing the housing assembly around the instrument.
Example 1
The structure of the housing assembly of this embodiment is shown in fig. 1. Wherein, the material of the shell 11 is glass, the bonding layer 121 is back adhesive, and the substrate 132 is PET film. The frequency selective surface structure 131 composed of a plurality of circular units is printed on the substrate 132 by a screen printing process using conductive silver paste, the plurality of circular units are arranged in a rectangular array as shown in fig. 28, the diameter of each circular unit is 0.5mm, and the distance between the centers of the circles of two adjacent circular units is 1mm, so that the wave-transmitting layer 13a is obtained. The wave-transmitting layer 13a was adhered to the housing 11 through the adhesive layer 121, to obtain a housing assembly having a total thickness of 0.7mm.
The reflection coefficient and the transmission coefficient of the shell component in 20-34 GHz are tested, and the test result is as follows: after the millimeter wave passes through the shell component, the scattering coefficient at 22.4 GHz-29.5 GHz only loses 1.2dB energy, the reflection coefficient of the millimeter wave at 21.8 GHz-30.8 GHz is not more than-10 dB, and the millimeter wave can cover 3GPP n257, n258 and n261 band.
Example 2
The housing assembly structure of this embodiment is shown in fig. 9. Wherein, the material of the shell 11 is glass, and the decorative layer 122 is a CMF film. Printing a frequency selective surface structure formed by a plurality of square units on one side of the decorative layer 122 far from the shell 11 by adopting conductive silver paste through a screen printing process, wherein the arrangement mode of the square units is a rectangular array, the radius of each square unit is 1mm, and the distance between two adjacent square units is 2mm, so as to obtain a wave-transmitting layer 13f; and printing a frequency selective surface structure formed by a plurality of grid cells on one side of the decorative layer 122 close to the shell 11 by adopting conductive silver paste through a screen printing process, wherein the grid cells are arranged in a rectangular array as shown in fig. 11, the line width of each grid cell is 1.5 mu m, and the wave-transmitting layer 13d with a transparent visual effect is obtained, so that the CMF membrane integrated with two wave-transmitting layers is obtained. The decorative layer 122 was processed on the housing 11 to obtain a housing assembly having a total thickness of 0.7mm.
The reflection coefficient and the transmission coefficient of the shell component in 20-34 GHz are tested, and the test result is as follows: after the millimeter wave passes through the shell component, the scattering coefficient at 22.4 GHz-29.5 GHz only loses 1.5dB energy, the reflection coefficient of millimeter wave at 21.8 GHz-30.8 GHz frequency band does not exceed-10 dB, and the millimeter wave can cover 3GPP n257, n258 and n261 band.
Comparative example 1
The housing assembly of this comparative example was a glass housing with a thickness of 0.7mm, i.e. no functional layer and no wave-transparent layer were present.
The reflection coefficient and the transmission coefficient of the shell component in 20-34 GHz are tested, and the test result is as follows: after passing through the shell component, the millimeter wave antenna loses 2.5-3.2 dB of energy at the scattering coefficient of 22.4 GHz-29.5 GHz, the reflection coefficient of the millimeter wave antenna on plane waves is more than-7 dB at 21.8 GHz-30.8 GHz, the transmission loss of the millimeter wave frequency band antenna through a glass rear shell is more than 50%, and the antenna efficiency is poor.
As can be seen from comparison between examples 1 to 2 and comparative example 1, the housing assembly of the present invention can exhibit high-efficiency wave transmission characteristics for the millimeter wave frequency band, thereby significantly reducing the influence on the radiation performance of the millimeter wave antenna module.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (13)
1. The shell assembly is characterized by comprising a shell, a functional layer and a wave-transmitting layer, wherein the shell, the functional layer and the wave-transmitting layer are arranged in a stacked mode, the functional layer comprises a decorative layer and an adhesive layer, the adhesive layer is arranged on one side, far away from the shell, of the decorative layer, and the wave-transmitting layer is connected with the functional layer;
the wave-transmitting layer comprises a fourth wave-transmitting unit, the fourth wave-transmitting unit is provided with a frequency selective surface structure, the fourth wave-transmitting unit is arranged on one side of the decorative layer, which is close to the shell, and the frequency selective surface structure in the fourth wave-transmitting unit is used for enabling the shell to transmit millimeter waves with the frequency of 24.25 GHz-52.6 GHz;
the frequency selective surface structure in the fourth wave-transparent unit comprises a plurality of structural units, the structural units are distributed in an array, the structural units are grid units, and the line width of each grid unit is not more than 2 mu m;
the wave-transmitting layer further comprises a fifth wave-transmitting unit, and the fifth wave-transmitting unit is connected with the decorative layer through the bonding layer; the fifth wave-transmitting unit is provided with a frequency selective surface structure, and the frequency selective surface structure in the fifth wave-transmitting unit is used for enabling the shell to transmit millimeter waves with the frequency of 24.25 GHz-52.6 GHz; or the wave-transmitting layer further comprises a sixth wave-transmitting unit, and the sixth wave-transmitting unit is arranged at one side of the decorative layer far away from the shell; the sixth wave-transmitting unit is provided with a frequency selective surface structure, and the frequency selective surface structure in the sixth wave-transmitting unit is used for enabling the shell to transmit millimeter waves with the frequency of 24.25 GHz-52.6 GHz.
2. The housing assembly of claim 1, wherein the fifth wave-transparent unit further comprises a substrate, the frequency selective surface structure of the fifth wave-transparent unit being formed on the substrate.
3. The housing assembly of claim 2, wherein the substrate has a first surface and a second surface opposite the first surface, the first surface being proximate the adhesive layer, the frequency selective surface structure being formed on at least one of the first surface and the second surface.
4. The housing assembly according to claim 1, wherein the number of layers of the adhesive layer and the fifth wave-transmitting unit is plural, respectively, the plural layers of the fifth wave-transmitting unit and the plural layers of the adhesive layer are alternately laminated to form a laminate, one layer of the fifth wave-transmitting unit and one layer of the adhesive layer are respectively provided at both ends in the lamination direction of the laminate, and the adhesive layer at one end of the laminate is fixedly bonded to the decorative layer.
5. The housing assembly of claim 1, wherein the frequency selective surface structure in the fifth wave-transparent unit comprises a plurality of structural units, a plurality of the structural units being distributed in an array, the structural units being grid units, center-connected units, ring units, solid units, or combination units; the combined unit is a shape obtained by combining the graphics of the units of the type; the line width of the grid unit is not more than 2 mu m; the central connection type unit is a straight unit, a Y-shaped unit, an anchor-shaped unit, a jerusalem-cold cross-shaped unit or a crossed S-shaped unit; the annular units are cross annular units, Y annular units, annular units or polygonal annular units, the annular width of each annular unit is 0.05-0.5 mm, and the maximum width of each annular unit is 1-4 mm; the solid type unit is a polygonal unit or a round unit, and the maximum width of the solid type unit is 0.2 mm-0.84 mm.
6. The housing assembly of claim 1, wherein the frequency selective surface structure in the sixth wave-transparent unit comprises a plurality of structural units, a plurality of the structural units being distributed in an array, the structural units being grid units, center-connected units, ring units, solid units, or combination units; the combined unit is a shape obtained by combining the graphics of the units of the type; the line width of the grid unit is not more than 2 mu m; the central connection type unit is a straight unit, a Y-shaped unit, an anchor-shaped unit, a jerusalem-cold cross-shaped unit or a crossed S-shaped unit; the annular units are cross annular units, Y annular units, annular units or polygonal annular units, the annular width of each annular unit is 0.05-0.5 mm, and the maximum width of each annular unit is 1-4 mm; the solid type unit is a polygonal unit or a round unit, and the maximum width of the solid type unit is 0.2 mm-0.84 mm.
7. The housing assembly of claim 1, wherein the wave-transparent layer is composed of the fourth wave-transparent unit, the sixth wave-transparent unit and a seventh wave-transparent unit, the seventh wave-transparent unit is connected to the sixth wave-transparent unit through an adhesive layer, the seventh wave-transparent unit has a frequency selective surface structure, and the frequency selective surface structure in the seventh wave-transparent unit is used for enabling the housing to transmit millimeter waves with a frequency of 24.25 ghz-52.6 ghz.
8. The housing assembly of claim 7, wherein the seventh wave-transparent unit further comprises a substrate, the frequency selective surface structure of the seventh wave-transparent unit being formed on the substrate.
9. The housing assembly of claim 8, wherein the substrate has a first surface and a second surface opposite the first surface, the first surface being proximate the adhesive layer, the frequency selective surface structure being formed on at least one of the first surface and the second surface.
10. The housing assembly of claim 7, wherein the frequency selective surface structure in the seventh wave-transparent unit comprises a plurality of structural units, a plurality of the structural units being distributed in an array, the structural units being grid units, center-connected units, ring units, solid units, or combination units; the combined unit is a shape obtained by combining the graphics of the units of the type; the line width of the grid unit is not more than 2 mu m; the central connection type unit is a straight unit, a Y-shaped unit, an anchor-shaped unit, a jerusalem-cold cross-shaped unit or a crossed S-shaped unit; the annular units are cross annular units, Y annular units, annular units or polygonal annular units, the annular width of each annular unit is 0.05-0.5 mm, and the maximum width of each annular unit is 1-4 mm; the solid type unit is a polygonal unit or a round unit, and the maximum width of the solid type unit is 0.2 mm-0.84 mm.
11. The housing assembly of claim 1, wherein the decorative layer is a CMF film.
12. The housing assembly of claim 1, wherein the frequency selective surface structures of the fourth wave-transparent unit, the fifth wave-transparent unit, and the sixth wave-transparent unit further comprise a nanomaterial layer, a plurality of grid units are distributed on the nanomaterial layer in an array, and the nanomaterial layer is made of nano silver wires or carbon nanotubes.
13. An electronic device, comprising:
the housing assembly of any one of claims 1-12;
the display module is connected with the shell assembly and is enclosed with the shell assembly to form a containing cavity;
the millimeter wave antenna module is arranged in the accommodating cavity and is covered by the shell component; a kind of electronic device with high-pressure air-conditioning system
The circuit board is arranged in the accommodating cavity.
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| CN202110544587.2A CN113224544B (en) | 2019-09-10 | 2019-09-10 | Housing assembly and electronic device |
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| CN201910851639.3A CN110650603B (en) | 2019-09-10 | 2019-09-10 | Housing assembly and electronic device |
| CN202110544587.2A CN113224544B (en) | 2019-09-10 | 2019-09-10 | Housing assembly and electronic device |
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| CN201910851639.3A Division CN110650603B (en) | 2019-09-10 | 2019-09-10 | Housing assembly and electronic device |
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| CN110708406B (en) * | 2019-10-09 | 2021-05-18 | Oppo广东移动通信有限公司 | Shell, preparation method thereof and electronic equipment |
| CN111129719A (en) * | 2020-01-16 | 2020-05-08 | Oppo广东移动通信有限公司 | Electronic device |
| CN111180865B (en) * | 2020-02-17 | 2021-08-31 | Oppo广东移动通信有限公司 | Electronic device |
| CN111509397B (en) * | 2020-04-23 | 2022-01-11 | Oppo广东移动通信有限公司 | Shell assembly, antenna assembly and electronic equipment |
| CN114002874A (en) | 2020-07-28 | 2022-02-01 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN114274608A (en) * | 2021-12-29 | 2022-04-05 | 江苏领瑞新材料科技有限公司 | Wave-absorbing stealth material capable of resisting radar scanning and application thereof |
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| CN110650603A (en) | 2020-01-03 |
| CN113224544A (en) | 2021-08-06 |
| CN110650603B (en) | 2021-06-08 |
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