CN113223985A - Shape memory polymer transfer printing stamp with air pressure regulation and control and transfer printing method - Google Patents
Shape memory polymer transfer printing stamp with air pressure regulation and control and transfer printing method Download PDFInfo
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- CN113223985A CN113223985A CN202110468106.4A CN202110468106A CN113223985A CN 113223985 A CN113223985 A CN 113223985A CN 202110468106 A CN202110468106 A CN 202110468106A CN 113223985 A CN113223985 A CN 113223985A
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- seal
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- heating
- transfer
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- 238000010023 transfer printing Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 21
- 229920000431 shape-memory polymer Polymers 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims description 37
- 238000007639 printing Methods 0.000 claims description 14
- 238000004093 laser heating Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 3
- 238000004146 energy storage Methods 0.000 claims description 2
- 230000003746 surface roughness Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 9
- 230000001105 regulatory effect Effects 0.000 description 7
- 238000002508 contact lithography Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000001464 adherent effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000007777 multifunctional material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Abstract
The invention discloses a shape memory polymer transfer-printing stamp with air pressure regulation and a transfer-printing method, wherein the stamp is composed of a stamp main body and a cavity array arranged on the stamp main body, and the cavity array penetrates through the bottom of the stamp; the stamp main body is made of shape memory polymer. The seal has simple structure and low cost; the method can provide greater pick-up force, and can pick up smooth or rough surface objects from donor substrates with strong adhesion; the method can realize high-efficiency global transfer printing and also can realize accurate selective transfer printing.
Description
Technical Field
The invention relates to a transfer printing technology, in particular to a shape memory polymer transfer printing stamp with air pressure regulation and a transfer printing method, which can be used for transfer printing of devices with any patterned smooth or rough surfaces.
Background
The transfer printing technology is a multifunctional material assembly technology, can utilize a high polymer seal to carry out large-scale integration on discrete elements which are different in type and are independently prepared on the same substrate so as to form a functional system with ordered space, has the advantages of low cost, convenience in operation, high transfer printing efficiency and the like, and is often applied to integrated preparation of electronic devices. Such as solar cells, Micro LED display screens, thin film transistors and the like.
Generally, the transfer printing technology utilizes the adjustment of strong and weak adhesion force of an elastic stamp and a device interface to realize the picking and releasing of the stamp on different substrates. Therefore, the key to the success of transfer printing is the adhesion control at the stamp/device interface.
The adhesion regulation and control principle of the prior transfer printing technology comprises dynamic adhesion regulation and control, direction-related adhesion regulation and control, laser thermal mismatch adhesion regulation and control, contact area adhesion regulation and control and the like, and the regulation and control technologies have limited adhesion regulation and control range, insufficient adhesion pick-up force and difficulty in picking up devices on a strong adhesion substrate.
The transfer technology based on air pressure regulation can enhance the picking force of the device by regulating the air pressure. However, the existing seal designed based on the air pressure regulation principle is difficult to pick up the device with the rough surface because of the problem of insufficient sealing property between the seal and the device, and the application range of the seal is limited.
Previously, transfer stamps of similar construction were proposed: a thermal control programmable air pressure type transfer stamp and a transfer method (application number: CN 202010264723.8). The method is characterized in that the volume of gas in a seal cavity is expanded and contracted through thermal driving, so that the air pressure in the cavity is adjusted, and the pressure change between the seal and a device at different temperatures is realized. The invention adopts a thermally-driven shape memory polymer material as the seal main body material, and through two-stage regulation and control of temperature, the volume of gas in the cavity can be changed, and the volume of the cavity of the shape memory seal can be changed through the change of temperature, so that the regulation and control range of air pressure is further enlarged. The present invention enables greater pick-up force and better sealing due to material changes.
Disclosure of Invention
The invention provides a shape memory polymer transfer printing stamp with air pressure regulation and control and a transfer printing method aiming at the defects of the existing air pressure drive transfer printing technology. The transfer stamp can provide stronger pick-up forces, enabling the stamp to pick up smooth or rough-surfaced devices from strongly adherent donor substrates. The transfer seal is composed of a seal main body and a cavity array, and the cavity array penetrates through the bottom of the seal. When the temperature of the shape memory polymer is higher than 80 ℃, the storage modulus is lower than 4 MPa; when the temperature is lower than 30 ℃, the energy storage modulus is higher than 1 GPa.
The specific transfer printing method comprises the following steps: 1) when the device is picked up, firstly, external thermal drive higher than 80 ℃ is applied to the seal, after the modulus of the seal is reduced, the seal is pressed on the device to form a closed cavity, the temperature is further raised and heated to expand air in the cavity, the volume of the cavity is enlarged, then the seal is cooled to room temperature, the shape of the cavity is fixed, meanwhile, negative pressure is formed in the cavity, the interface of the seal/device is in a strong adhesion state, and the device is successfully picked up;
2) when printing, the seal/device is moved above the main substrate, and is driven by the heat with the same or higher temperature than the heating temperature in the picking process, the seal is restored to the original shape, the gas in the cavity is heated and expanded to generate a downward positive pressure, the interface of the seal/device is in a weak adhesion state, and the device is printed successfully.
Besides the picking mode, the local position of the seal can be heated, then the seal is pressed on the device to form a closed cavity, the temperature is further locally increased and heated to expand air in the cavity, the volume of the cavity is increased, the seal is deformed, the shape of the seal is fixed after cooling, negative pressure is formed in the cavity, the interface of the seal/device is in a strong adhesion state, the device at the designated position is successfully picked, and selective picking is realized;
the external heating drive may be global hotplate heating or local laser heating. Large-scale high-efficiency transfer printing is realized under global heating; programmable patterned transfer is achieved under laser localized heating.
The stamp material is a thermally driven shape memory polymer, and can show different moduli at different temperatures so as to control the shape.
The invention has the beneficial effects that: the preparation cost of the seal is low; compared with the prior transfer technology of air pressure regulation, the transfer printing device can provide larger pick-up force; the rough surface device can be picked up and released; under the action of laser, high-efficiency global transfer printing can be realized, and accurate selective transfer printing can also be realized.
Drawings
FIG. 1 is a schematic diagram of a transfer printing of a shape memory polymer transfer stamp using air pressure regulation according to the present invention.
FIG. 2 is a flow chart of the present invention for picking up a device using a shape memory polymer transfer stamp with air pressure regulation.
FIG. 3 is a flow chart of non-contact printing using an air pressure controlled SMP transfer stamp according to the present invention.
FIG. 4 is a flow chart of the present invention for applying global heating to a shape memory polymer transfer stamp with controlled air pressure to achieve large-scale high-efficiency transfer.
FIG. 5 is a flow chart of the present invention for applying selective laser heating to an air pressure regulated SMP transfer stamp to achieve programmable selective pickup.
FIG. 6 is a flow chart of the present invention for applying selective laser heating to an air pressure regulated SMP transfer stamp for programmable selective printing.
In the figure: 1-stamp body 2-closed cavity 3-device 4-donor substrate 5-receptor substrate 6-heating before picking 7-heating again at picking 8-heating at printing 9-global heating before picking 10-heating again at global heating at picking 11-global heating at printing 12-selective heating before picking 13-heating again at selective heating at picking 14-selective heating at printing
Detailed Description
The invention is further described with reference to the following figures and examples.
As an example, but not limiting the scope of the present invention, a-f in FIG. 1 are schematic diagrams of the transfer using a pressure-controlled SMP transfer stamp as set forth in the present invention. A-c in fig. 2, the device is picked up under external heat drive. D-f in FIG. 1-the device is printed under external heat drive.
Firstly, applying heat drive to the stamp (heating 6 before picking up, a in figure 1), then pressing the stamp main body 1 on the device 3 to form a closed cavity 2, further heating up (heating up 7 again during picking up) to expand air in the closed cavity 2, enlarging the cavity volume, deforming the stamp (b in figure 1), fixing the shape of the stamp after cooling, forming negative pressure in the closed cavity 2, enabling the stamp/device interface to be in a strong adhesion state, moving the stamp upwards, and successfully picking up the device from the donor substrate 4 (c in figure 1);
the stamp with the device 3 attached is then moved over the receptor substrate 5 (d in fig. 1), and driven by the application of heat at the same or higher temperature (heating 8 during printing), the stamp returns to its original shape (e in fig. 1), the gas in the cavity expands due to heating, a downward positive pressure is generated, the stamp/device interface is in a weakly adherent state, and the device is successfully printed (f in fig. 1).
As an example, and not to limit the scope of the invention, FIG. 2 is a flow chart of the present invention for picking up a device using a gas pressure regulated SMP transfer stamp. Firstly, heating a stamp main body 1 (heating 6 before picking up, a in figure 2), then pressing the stamp main body 1 on a device 3 to ensure that the closed cavity 2 is airtight, further raising the temperature (heating 7 again during picking up) to expand the air in the closed cavity 2, so that the volume of the cavity is enlarged and the stamp is deformed (b in figure 2); after cooling, the stamp is fixed in shape, negative pressure is formed in the closed cavity 2, the stamp is moved upwards, and the device 3 is successfully peeled off from the donor substrate 4 under the combined action of the negative pressure and the stamp adhesion, so that the picking process is realized (c in fig. 2).
By way of example, and not by way of limitation, FIG. 3 is a flow chart illustrating non-contact printing using a pressure-regulated SMP transfer stamp in accordance with the teachings of the present invention. First the stamp that successfully picks up the device 3 is moved over the recipient substrate 5 (a in fig. 3); the stamp is heated and expanded by applying a thermal drive (heating 8 during printing) with the same or higher temperature to the stamp, the stamp is restored to the original shape (b in fig. 3), the gas in the cavity is heated and expanded to generate a downward positive pressure, the stamp/device interface is in a weak adhesion state, the device is extruded by the air in the closed cavity 2, is separated from the stamp main body 1 and is retained on the receiver substrate 5, and non-contact printing is realized (c in fig. 3).
As an example and not to limit the scope of the present invention, FIG. 4 is a flow chart illustrating the global heating of a pneumatically controlled SMP transfer stamp for mass transfer efficiency. The pick-up process (a-c in fig. 4) is the same as in fig. 2, and the printing process (d-f in fig. 4) is the same as in fig. 3, except that the entire transfer process uses a wide range of global temperature fields to pick up and print devices on a large scale, improving the efficiency of transfer.
As an example and not to limit the scope of the present invention, FIG. 5 is a flow chart illustrating the application of selective laser heating to an air pressure regulated SMP transfer stamp to achieve programmable selective pickup. Firstly, laser is applied to a stamp area at a designated position for heating (selective heating 12 before picking up, a in figure 5), then a stamp is pressed on a device 3 to form a closed cavity 2, the volume of the cavity is increased (b in figure 5) by further heating (selective heating 13 again during picking up), and negative pressure is formed in the cavity after cooling; the stamp is then moved upwards and the device 3 at the specified position is successfully picked (c in fig. 5).
By way of example, and not by way of limitation, FIG. 6 is a flow chart illustrating the application of selective laser heating to an air pressure regulated SMP transfer stamp to achieve programmable selective printing in accordance with the present invention. The local laser heating is rotated during printing so as to realize selective printing. First the stamp with the picked up device 3 is moved over the recipient substrate 5 (a in fig. 6); applying local laser heating (selective heating 14 during printing) to the area to be printed, the stamp at the printing position returns to the original shape, and the air in the closed cavity 2 is thermally expanded to press the device 3 (fig. 6 b); the device 3 in the designated position is subjected to pressure, separates from stamp body 1, remains on the receptor substrate 5 and is successfully printed (c in fig. 6).
As an example, but not limiting the scope of the present invention, the shape memory polymer material proposed by the present invention can be obtained by mixing and stirring the epoxy resin and the polyetheramine D-230 at a weight ratio of 1.76087:1, and sequentially heating at 100 ℃ and 130 ℃ for one hour each.
Claims (6)
1. A shape memory polymer transfer seal with air pressure regulation and control is characterized in that a seal main body is provided with a cavity array, and the cavity array penetrates through the bottom of the seal; the stamp main body is made of shape memory polymer.
2. The air pressure-controlled shape memory polymer transfer stamp according to claim 1, wherein the shape memory polymer has a storage modulus of less than 4MPa at a temperature of more than 80 ℃; when the temperature is lower than 30 ℃, the energy storage modulus is higher than 1 GPa.
3. A large-scale programmable transfer method, realized on the basis of the stamp according to claim 1 or 2, comprising the steps of:
when the device is picked up, firstly, external thermal drive is applied to the seal, after the modulus of the seal is reduced, the seal is pressed on the device to form a closed cavity, the temperature is further raised and heated to expand air in the cavity, the volume of the cavity is enlarged, then the seal is cooled to room temperature, the shape of the cavity is fixed, meanwhile, negative pressure is formed in the cavity, the interface of the seal/device is in a strong adhesion state, and the device is successfully picked up;
when printing, the seal/device is moved above the main substrate, and is driven by the heat with the same or higher temperature than the heating temperature in the picking process, the seal is restored to the original shape, the gas in the cavity is heated and expanded to generate a downward positive pressure, the interface of the seal/device is in a weak adhesion state, and the device is printed successfully.
4. The large-scale programmable transfer printing method according to claim 3, wherein when the external heating drive is global laser heating, the stamp is driven to realize large-scale efficient transfer printing; when the external drive is local laser heating, the stamp is driven to realize programmable patterned transfer printing.
5. The mass programmable transfer method according to claim 4, wherein when the external thermal drive is local laser heating, the pickup mode is: the method comprises the steps of firstly heating a local position of a seal, pressing the seal on a device to form a closed cavity after the modulus of the local position is reduced, further heating the local position to expand air in the cavity, increasing the volume of the cavity, deforming the seal, cooling to fix the shape of the seal, forming negative pressure in the cavity, enabling the interface of the seal/the device to be in a strong adhesion state, successfully picking up the device at a specified position, and realizing selective picking up.
6. The mass programmable transfer method of claim 3, wherein the picked device surface roughness is less than 15um enabling the picking of rough surface objects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110468106.4A CN113223985A (en) | 2021-04-28 | 2021-04-28 | Shape memory polymer transfer printing stamp with air pressure regulation and control and transfer printing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110468106.4A CN113223985A (en) | 2021-04-28 | 2021-04-28 | Shape memory polymer transfer printing stamp with air pressure regulation and control and transfer printing method |
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| CN113223985A true CN113223985A (en) | 2021-08-06 |
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| CN202110468106.4A Pending CN113223985A (en) | 2021-04-28 | 2021-04-28 | Shape memory polymer transfer printing stamp with air pressure regulation and control and transfer printing method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114103501A (en) * | 2021-11-19 | 2022-03-01 | 大连理工大学 | Flexible electronic transfer printing method driven by dual-material rigidity regulation |
| CN115209691A (en) * | 2022-06-16 | 2022-10-18 | 南京艾科美热能科技有限公司 | Phase change heat storage fin and self-adaptive flexible radiating fin |
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