CN113203797B - Diamond piece crack detection method and device - Google Patents
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Abstract
The invention aims to provide a method and a device for detecting cracks of a diamond wafer, which reduce the dependence of the traditional crack detection method on the experience of practitioners and professional technology, improve the detection efficiency of industrial production and the accuracy of crack detection, carry out time sequence analysis to establish an ARMA model according to a vibration response signal of a CVD diamond wafer to be detected under the excitation of white noise, wherein the time sequence ARMA model parameter comprises the inherent characteristics of a structural system, can identify the first-order or multi-order inherent frequency of the diamond wafer to be detected through a computer algorithm, identify the first-order inherent frequency of the diamond wafer to be detected and construct a diamond crack degree identification index by adopting a time sequence analysis method, calculate the difference of the crack degree identification index of the diamond wafer to be detected and the crack-free diamond wafer, and further judge the crack degree of the diamond wafer.
Description
Technical Field
The invention belongs to the technical field of detection of diamond damage layers, and particularly relates to a method and a device for detecting cracks of a diamond sheet.
Background
The existing semiconductor integrated circuit industry is rapidly developed in recent years, ultra-wide bandgap semiconductor-diamond integrates the advantages of electricity, optics, mechanics, acoustics, heat and the like, and the revolution of a new generation of semiconductor technology is initiated, while a CVD diamond film has the characteristics of strong chemical inertness, large brittleness, high hardness, thin thickness and the like, so that defects are easily generated in crystal growth and subsequent liner processing, once the defects which are random, large in size and deep in influence are generated, a diamond substrate and a chip manufactured subsequently have the hidden danger of fragments, and huge waste is caused, and the detection of the cracks of the diamond sheet is very important.
The existing substrate crack detection methods are generally detected by means of a microscope in the scientific research field, and are classified into destructive detection and nondestructive detection according to the damage degree of a substrate wafer. Secondary damage is generally introduced in the damage detection, and a detected sample cannot be reused; the nondestructive detection is generally to analyze vibration signals, optical signals, electric signals and the like of an object to be detected through instrument collection, and the nondestructive detection has no contact with a sample, does not introduce new defects, and has relatively high crack detection effectiveness. However, in the conventional nondestructive testing, there is a contradiction between the field of view and the accuracy. In production applications, conventional defect detection methods rely on manual labor. Because the defects of high labor intensity, low working efficiency, low detection accuracy, excessive dependence on personal experience, easy influence by subjective factors and the like exist in the manual defect detection, how to rapidly detect the cracks in the whole field and with high precision and evaluate and analyze the cracks is an urgent problem to be solved.
Disclosure of Invention
The invention aims to provide a method and a device for detecting cracks of a diamond chip, which reduce the dependence on the experience of practitioners and professional techniques in the traditional crack detection method and improve the detection efficiency of industrial production and the accuracy of crack detection.
The technical scheme for solving the technical problem of the invention is as follows: a diamond chip crack detection method comprises the following steps:
s1: fixing the CVD diamond sheet to be detected on a piezoelectric ceramic excitation base, and generating a white noise electric excitation signal by using a white noise generator to drive the piezoelectric ceramic excitation base to generate a vibration signal;
s2: measuring a vibration response signal of the CVD diamond chip to be detected by using a laser Doppler vibration meter, carrying out time sequence analysis on the vibration response signal, establishing an ARMA model and extracting characteristic parameters;
s3: calculating the first-order or multi-order natural frequency omega of the CVD diamond chip to be detected according to the characteristic parameters obtained in the step S2 i First order or multiple order natural frequency omega of crack-free CVD diamond piece 0 Comparing, judging whether the CVD diamond sheet to be detected has cracks, and if not, finishing the detection; if the crack exists, executing the step S4;
s4: constructing a CVD diamond sheet crack degree identification index DF to be detected through the characteristic parameters obtained in the step S2 i ；
S5: selecting a crack-free CVD diamond sheet, and collecting crack-free CVD diamond according to the steps S1, S2 and S4Carrying out time sequence analysis on the vibration response signal of the diamond sheet to establish an ARMA model, and extracting the feature parameter structure crack degree identification index number DF of the crack-free CVD diamond sheet 0 ；
S6: identifying index DF for crack degree of CVD diamond sheet to be detected i Identification index number DF for crack degree of crack-free CVD diamond sheet 0 Division operation is carried out, namely:
when the CVD diamond chip has cracks, the H value deviates from 1, the larger the crack degree is, the larger the H value deviates from 1, and the crack damage degree is analyzed and quantified, so that the crack size of the CVD diamond chip is judged, and whether the CVD diamond chip participates in the subsequent lining body processing or not is determined.
In the step S1, an oscilloscope is used to display the waveform of the excitation signal generated by the white noise signal generator.
And in the step S2, the vibration response signals of the CVD diamond sheet to be detected are collected for multiple times, so that the accuracy of the collected data is improved.
In the step S2, in order to avoid the problem that cracks cannot be identified due to the existence of cracks at the fixed positions of the to-be-detected CVD diamond sheets, the same to-be-detected CVD diamond sheet is detected once and then is rotated by 180 degrees up and down, and then is detected once again.
In the step S3, the crack-free CVD diamond chips are measured and averaged to obtain the first-order or multi-order natural frequency omega of the crack-free CVD diamond chips 0 A range value.
The utility model provides a diamond piece crack detection device, includes piezoceramics excitation base, white noise signal generator, is used for fixing the fixing device on piezoceramics excitation base surface, laser Doppler vibrometer and waveform display and signal processing analytic system with one side of CVD diamond piece, white noise signal generator is used for producing white noise electric excitation signal drive piezoceramics excitation base and produces vibration signal, white noise signal generator's signal output part and piezoceramics excitation base's signal input part are connected, laser Doppler vibrometer is used for detecting the vibration response signal of CVD diamond piece, the sense terminal of laser Doppler vibrometer is connected with the non-stationary side of CVD diamond piece, the signal output part and the waveform display of laser Doppler vibrometer and the signal processing analytic system's signal input part are connected.
The white noise generator is characterized by further comprising an oscilloscope, wherein the oscilloscope is used for displaying the waveform of an excitation signal generated by the white noise signal generator, and the signal input end of the oscilloscope is connected with the signal output end of the piezoelectric ceramic excitation base.
The piezoelectric ceramic vibration isolation device is characterized by further comprising an elastic vibration isolation device, wherein the piezoelectric ceramic vibration excitation base is arranged on the elastic vibration isolation device.
The invention has the beneficial effects that:
(1) The natural frequency is calculated by using the vibration response signal of the diamond sheet based on time sequence analysis, and whether the diamond sheet has cracks or not is further identified. The detection method has learning ability, and if a certain CVD diamond piece is detected to have no crack, the analysis result can be used as the basis of subsequent crack detection, so that the detection accuracy is improved.
(2) According to the collected vibration response signal of the CVD diamond chip to be detected, the first-order or multi-order natural frequency of the CVD diamond chip is analyzed and identified by using the time sequence, whether cracks exist can be rapidly judged, and if the cracks exist in the diamond chip, the crack degree identification index DF is calculated i And crack degree identification index DF of crack-free diamond sheet 0 By contrast, the extent of cracking can be quantified.
(3) According to the method, the crack is automatically detected and identified on the diamond sheet by adopting a computer data processing method, the dependence on the experience of practitioners and professional techniques of the traditional crack detection method is reduced, and the detection efficiency of industrial production and the crack detection accuracy are greatly improved.
Drawings
FIG. 1 is a flow chart of the method of the present invention.
Fig. 2 is a schematic block diagram of the structure of the device of the present invention.
FIG. 3 is a schematic view showing the fixing mode and vibration direction of the CVD diamond sheet and the piezoelectric ceramic excitation base according to the present invention.
FIG. 4 is a white noise excitation signal plot generated by the white noise signal generator of the present invention.
Fig. 5 is a waveform diagram of a vibration signal of a crack-free CVD diamond wafer according to the present invention.
Fig. 6 is a graph of the first order natural frequency range of a crack-free CVD diamond wafer of the invention and the first order natural frequency of a wafer of cracked CVD diamond.
FIG. 7 shows the crack level identification index DF of CVD diamond plate with three crack levels according to the present invention i And a schematic diagram of the variation trend of the difference value H.
In FIG. 1: 1. the device comprises a white noise signal generator, a white noise signal generator 2, an oscilloscope 3, a waveform display and signal processing analysis system 4, a laser Doppler vibration meter 5, a CVD diamond sheet 6, a fixing device 7, a piezoelectric ceramic excitation base 8 and an elastic vibration isolation device.
In FIG. 2: the direction of the arrow is the vibration direction of the CVD diamond sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, 2 and 3, a method for detecting cracks on a diamond sheet comprises the following steps:
s1: fixing the CVD diamond sheet to be detected on a piezoelectric ceramic excitation base, and generating a white noise electric excitation signal by using a white noise generator to drive the piezoelectric ceramic excitation base to generate a vibration signal;
s2: measuring a vibration response signal of the CVD diamond chip to be detected by using a laser Doppler vibration meter, carrying out time sequence analysis on the vibration response signal, establishing an ARMA model and extracting characteristic parameters;
s3: calculating the first-order or multi-order natural frequency omega of the CVD diamond wafer to be detected according to the characteristic parameters obtained in the step S2 i With crack-free CVD diamond wafer first or multi-order natural frequency omega 0 Comparing, judging whether the CVD diamond sheet to be detected has cracks, and if not, finishing the detection; if the crack exists, executing the step S4;
s4: constructing a CVD diamond sheet crack degree identification index DF to be detected through the characteristic parameters obtained in the step S2 i ；
S5: selecting a crack-free CVD diamond sheet, collecting a vibration response signal of the crack-free CVD diamond sheet according to the steps S1, S2 and S4, carrying out time sequence analysis to establish an ARMA model, extracting a characteristic parameter structure crack degree identification index number DF of the crack-free CVD diamond sheet 0 ；
S6: identifying index DF for crack degree of CVD diamond sheet to be detected i Identification index number DF for crack degree of crack-free CVD diamond sheet 0 Division operation is carried out, namely:
when the CVD diamond sheet has cracks, the H value deviates from 1, the larger the crack degree is, the larger the H value deviates from 1, and the crack damage degree is analyzed and quantified, so that the crack size of the CVD diamond sheet is judged, and whether the CVD diamond sheet participates in the subsequent lining body processing or not is determined.
In the step S1, an oscilloscope is used to display the waveform of the excitation signal generated by the white noise signal generator.
And in the step S2, the vibration response signals of the CVD diamond sheet to be detected are acquired for multiple times, so that the accuracy of the acquired data is improved.
In the step S2, in order to avoid the problem that cracks cannot be identified due to the existence of cracks at the fixed positions of the to-be-detected CVD diamond sheets, the same to-be-detected CVD diamond sheet is detected once and then is rotated by 180 degrees up and down, and then is detected once again.
In the step S3, the plurality of crack-free CVD diamond chips are measured and averaged to obtain the first-order or multi-order natural frequency omega of the crack-free CVD diamond chips 0 A range value.
The utility model provides a diamond piece crack detection device, includes piezoceramics excitation base 7, white noise signal generator 1, is used for fixing one side of CVD diamond piece 5 at the surperficial fixing device 6 of piezoceramics excitation base 7, laser Doppler vibrometer 4 and waveform display and signal processing analytic system 3, white noise signal generator 1 is used for producing white noise electric excitation signal drive piezoceramics excitation base 7 and produces vibration signal, the signal output part of white noise signal generator 1 is connected with the signal input part of piezoceramics excitation base 7, laser Doppler vibrometer 4 is used for detecting CVD diamond piece 5's vibration response signal, the sense terminal of laser Doppler vibrometer 4 is connected with CVD diamond piece 5's non-stationary side, the signal output part of laser Doppler vibrometer 4 is connected with the signal input part of waveform display and signal processing analytic system 3.
The white noise excitation device is characterized by further comprising an oscilloscope 2, wherein the oscilloscope 2 is used for displaying the excitation signal waveform generated by the white noise signal generator 1, and the signal input end of the oscilloscope 2 is connected with the signal output end of the piezoelectric ceramic excitation base 7.
The piezoelectric ceramic vibration isolation device is characterized by further comprising an elastic vibration isolation device 8, wherein the piezoelectric ceramic vibration excitation base 7 is arranged on the elastic vibration isolation device 8.
The invention principle is as follows: according to the vibration response signal of the CVD diamond wafer to be detected under the excitation of white noise, time sequence analysis is carried out on the vibration response signal to establish an ARMA model, the time sequence ARMA model parameters comprise the inherent characteristics of a structural system, and the first-order or multi-order inherent frequency of the diamond wafer to be detected can be identified through a computer algorithm. The natural frequency is a function of the rigidity and the mass of the object, a certain part of the object has defects (such as CVD diamond sheet crack defects) and then will cause the change of the first-order natural frequency, the change of the mass of the diamond crack defects is generally ignored, the change of the natural frequency is usually caused by the change of the rigidity of the diamond sheet, the crack degree is larger, and the difference between the time series ARMA model and the crack-free ARMA model of the diamond sheet vibration response signal is larger. The invention adopts a time sequence analysis method to identify the first-order natural frequency and the structure of the diamond wafer to be detected based on the vibration response signal of the CVD diamond waferDiamond crack degree identification index DF i Calculating the crack degree identification index DF of the diamond sheet to be detected and the crack-free diamond sheet 0 And the difference H is used for further judging the crack degree of the diamond sheet.
In this example, the sizes of the diamond wafer to be measured and the crack-free diamond wafer were 10 × 2mm
The CVD diamond piece to be detected is placed on the fixing device, a white noise signal generator is arranged to send out a white noise excitation electric signal, the oscilloscope is used for displaying a waveform diagram of the white noise excitation electric signal, the excitation signal is transmitted to the piezoelectric ceramic excitation base to generate vibration, the vibration of the piezoelectric ceramic excitation base is transmitted to the CVD diamond piece, the CVD diamond piece is subjected to vibration excitation of the piezoelectric ceramic excitation base to generate a vibration response signal, the laser Doppler vibration meter is used for collecting the vibration response signal of the CVD diamond piece, and the signal is filtered and amplified and then output to the waveform display and signal processing analysis system.
The white noise signal generator is used for generating a Gaussian white noise electric excitation signal, and can output sine waves, square waves, triangular waves, gaussian white noise, sawtooth waves, sin (x)/x, negative sawtooth waves, exponential rise waves, exponential fall waves and other signals by adopting an AFG3051C arbitrary waveform function signal generator of Tack science and technology Limited. The frequency range of the sine wave and the square wave is 1 mu Hz-10 MHz, and the bandwidth of Gaussian white noise is 50MHz.
The piezoelectric ceramic excitation base is made of NAC2403 type piezoelectric ceramic manufactured by Noliac of Denmark, the size is 10mmx10mmx3.4mm, and the first-order inherent frequency is larger than 300kHz.
The laser Doppler vibrometer is used for collecting CVD diamond chip vibration response signals, a VFX-F-110 single-point laser vibrometer of the Baolitai company is selected, three vibration response signals of displacement, speed and acceleration can be output simultaneously, the laser wavelength is 633nm, the maximum measuring speed is +/-30 m/s, and the upper limit of the bandwidth frequency is 12MHz. In order to avoid the interference of the environmental vibration on the laminated chip to be tested, the piezoelectric ceramic adhered with the laminated chip is fixed on the piezoelectric ceramic excitation base, and an elastic vibration isolation device is used between the piezoelectric ceramic excitation base and the test platform.
In the embodiment, a piezoelectric ceramic excitation base is used as excitation equipment to excite the inherent vibration characteristic of the CVD diamond piece, a laser Doppler vibration meter is used as vibration pickup equipment to study the dynamic characteristic of the CVD diamond piece and judge the damage state of the diamond piece.
In the embodiment, the horizontal distance between the VFX-F-110 single-point laser vibration meter and the CVD diamond sheet to be measured is adjusted to be 200mm-700mm, the quotation mark acquisition point is positioned on the side surface of the CVD diamond sheet close to the top part, and in order to ensure that a stable and ideal vibration response signal can be acquired, the sampling theorem is stipulated, and the sampling frequency F is s Must be higher than twice the highest frequency of the signal components, i.e.:
as shown in fig. 4 and 5, the AFG3051C arbitrary wave function signal generator is adjusted to generate a gaussian white noise electric excitation signal, the center frequency of the signal is between 0kHz and 400kHz, in this embodiment, the sampling frequency of the VFX-F-110 single-point laser vibration meter is set to be 2MHz, the output response signal of the CVD diamond chip with sufficient duration is collected, and the output response signal is recorded as a time sequence x according to the time sequence t And a time sequence ARMA model is established in a limited sampling time period, and Hanning window processing is carried out on the vibration signal in order to reduce energy leakage caused by data truncation.
1) Preprocessing the acquired signals:
(1) And removing the trend item in order to eliminate the phenomena of zero drift and temperature drift of the sensor.
(2) And (6) carrying out data standardization processing.
2) Establishing a time series analysis ARMA model:
(1) Determining the order of the model, and determining the proper ARMA model order for the data subsections by utilizing an Akaichi pool information criterion (AIC); and after the model order is determined, adopting the same model order for all CVD diamond vibration response signals.
(2) Estimating model parameters;
(3) And (5) carrying out model residual error test.
The model order-fixing criterion uses an akabane information criterion, and the formula is as follows:
AIC＝-ln(L)+2k
where L is the maximum likelihood function and k is the number of model parameters, the model order at which the AIC value is the smallest is usually selected when selecting the best model from a set of available models.
ARMA model expression:
in the formula a t Excited by white noise, theta i 、
The partial coefficients of the ARMA model AR and the partial coefficients of the model MA to be estimated are respectively, and p and q are positive integers.
Introducing a backward shift operator B to obtain an impulse response function, wherein the molecular part of the impulse response function comprises the inherent characteristics of the structure, namely:
in the formula of i Is the characteristic root of the AR part of the model.
3) Calculating the first-order natural frequency of the CVD diamond wafer to be detected
The first order natural frequency omega of the vibration can be obtained according to the vibration mode theory i ：
Wherein h = delta t is the sampling time interval of the time sequence, and the first-order natural frequency omega of the crack-free CVD diamond sheet is calculated by the same method 0 And selecting a plurality of crack-free CVD diamond sheets to obtain a first-order natural frequency range of the crack-free CVD diamond sheets. Comparing the first-order natural frequency of the diamond sheet to be detected with that of the crack-free diamond sheet to judge whether the diamond sheet has cracks or not, as shown in fig. 6.
In order to avoid the problem that cracks cannot be identified due to the fact that cracks exist at the fixed position of the diamond piece to be detected, the diamond piece is rotated by 180 degrees up and down once again after once detection.
4) And (3) calculating a crack degree index:
establishing a time sequence model for the vibration response signal of the CVD diamond sheet to be detected, estimating the model parameters, and extracting the first three-order coefficient of the AR part of the model to construct the crack degree index DF i The following:
further calculating crack degree identification index DF of crack-free CVD diamond 0 And dividing the two to calculate a difference value H:
when the CVD diamond piece has cracks, the H value deviates from 1, the larger the crack degree is, the larger the H value deviates from 1, the crack damage degree can be quantified through analysis, so as to judge the crack size of the CVD diamond piece, and as shown in FIG. 7, the crack degree identification index DF of the CVD diamond piece with three degrees of cracks is provided i And a schematic diagram of the variation trend of the difference value H.
The invention has the beneficial effects that:
(1) The natural frequency is calculated by using the vibration response signal of the diamond sheet based on time sequence analysis, and whether the diamond sheet has cracks or not is further identified. The detection method has learning ability, and if a certain CVD diamond piece is detected to have no crack, the analysis result can be used as the basis of subsequent crack detection, so that the detection accuracy is improved.
(2) According to the collected vibration response signal of the CVD diamond chip to be detected, the first-order or multi-order natural frequency is analyzed and identified by using the time sequence, whether cracks exist or not can be judged rapidly, and if cracks exist in the diamond chip, the crack degree is calculatedIdentification index DF i And crack degree identification index DF of crack-free diamond sheet 0 By contrast, the extent of cracking can be quantified.
(3) According to the method, the crack is automatically detected and identified on the diamond sheet by adopting a computer data processing method, the dependence on the experience of personnel and professional technology of the traditional crack detection method is reduced, and the detection efficiency of industrial production and the crack detection accuracy are greatly improved.
Claims (8)
1. A diamond chip crack detection method is characterized in that: the method comprises the following steps:
s1: fixing the CVD diamond sheet to be detected on a piezoelectric ceramic excitation base, and generating a white noise electric excitation signal by using a white noise generator to drive the piezoelectric ceramic excitation base to generate a vibration signal;
s2: measuring a vibration response signal of the CVD diamond wafer to be detected by using a laser Doppler vibration meter, carrying out time sequence analysis on the vibration response signal, establishing an ARMA model and extracting characteristic parameters, wherein the established ARMA model expression is as follows:
in the formula a t Excited by white noise, theta i 、
Respectively an ARMA model AR partial coefficient and a model MA partial coefficient to be estimated, wherein p and q are positive integers;
s3: calculating the first-order or multi-order natural frequency omega of the CVD diamond wafer to be detected according to the characteristic parameters obtained in the step S2 i First order or multiple order natural frequency omega of crack-free CVD diamond piece 0 Comparing, judging whether the CVD diamond sheet to be detected has cracks, and if not, finishing the detection; if the crack exists, executing the step S4;
s4: constructing a CVD diamond piece crack degree identification index DFi to be detected according to the characteristic parameters obtained in the step S2, wherein the expression is as follows:
in the formula (I), the compound is shown in the specification,
respectively a first order coefficient, a second order coefficient and a third order coefficient of the model AR;
s5: selecting a crack-free CVD diamond sheet, collecting a vibration response signal of the crack-free CVD diamond sheet according to the steps S1, S2 and S4, carrying out time sequence analysis to establish an ARMA model, extracting characteristic parameters to construct a crack degree identification index number DF of the crack-free CVD diamond sheet 0 ；
S6: identifying index DF for crack degree of CVD diamond sheet to be detected i Identification index number DF for crack degree of crack-free CVD diamond sheet 0 Performing division operation, namely:
when the CVD diamond sheet has cracks, the H value deviates from 1, the larger the crack degree is, the larger the H value deviates from 1, and the crack damage degree is analyzed and quantified, so that the crack size of the CVD diamond sheet is judged, and whether the CVD diamond sheet participates in the subsequent lining body processing or not is determined.
2. A diamond wafer crack detection method as claimed in claim 1, wherein: in the step S1, an oscilloscope is used to display the waveform of the excitation signal generated by the white noise signal generator.
3. A diamond blade crack detection method as claimed in claim 1, wherein: and in the step S2, the vibration response signals of the CVD diamond sheet to be detected are collected for multiple times, so that the accuracy of the collected data is improved.
4. A diamond wafer crack detection method as claimed in claim 1, wherein: in the step S2, in order to avoid the problem that cracks cannot be identified due to the existence of cracks at the fixed positions of the to-be-detected CVD diamond sheets, the same to-be-detected CVD diamond sheet is detected once and then is rotated by 180 degrees up and down, and then is detected once again.
5. A diamond blade crack detection method as claimed in claim 1, wherein: in the step S3, the plurality of crack-free CVD diamond chips are measured and averaged to obtain the first-order or multi-order natural frequency omega of the crack-free CVD diamond chips 0 A range value.
6. The utility model provides a diamond piece crack detection device which characterized in that: the device comprises a piezoelectric ceramic excitation base, a white noise signal generator, a fixing device, a laser Doppler vibration meter and a waveform display and signal processing analysis system, wherein the fixing device is used for fixing one side of a CVD diamond sheet on the surface of the piezoelectric ceramic excitation base, the white noise signal generator is used for generating a white noise electric excitation signal to drive the piezoelectric ceramic excitation base to generate a vibration signal, the signal output end of the white noise signal generator is connected with the signal input end of the piezoelectric ceramic excitation base, the detection end of the laser Doppler vibration meter is connected with the non-fixed side of the CVD diamond sheet, the signal output end of the laser Doppler vibration meter is connected with the signal input end of the waveform display and signal processing analysis system, the laser Doppler vibration meter is used for detecting the vibration response signal of the CVD diamond sheet and carrying out time sequence analysis on the vibration response signal to establish an ARMA model and extract characteristic parameters, and the established ARMA model expression is as follows:
in the formula a t Excited by white noise, theta i 、
Respectively an ARMA model AR partial coefficient and a model MA partial coefficient to be estimated, wherein p and q are positive integers;
constructing a CVD diamond piece crack degree identification index DFi to be detected according to the extracted characteristic parameters, wherein the expression is as follows:
in the formula (I), the compound is shown in the specification,
the first order coefficient, the second order coefficient and the third order coefficient of the model AR part are respectively.
7. A diamond chip crack detection device as claimed in claim 6, wherein: the white noise generator is characterized by further comprising an oscilloscope, wherein the oscilloscope is used for displaying the waveform of an excitation signal generated by the white noise signal generator, and the signal input end of the oscilloscope is connected with the signal output end of the piezoelectric ceramic excitation base.
8. A diamond chip crack detection device as claimed in claim 6, wherein: the piezoelectric ceramic vibration excitation device is characterized by further comprising an elastic vibration isolation device, and the piezoelectric ceramic vibration excitation base is arranged on the elastic vibration isolation device.
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