CN113203084A - Rotatable heat abstractor and have desk lamp of this structure - Google Patents
Rotatable heat abstractor and have desk lamp of this structure Download PDFInfo
- Publication number
- CN113203084A CN113203084A CN202110481214.5A CN202110481214A CN113203084A CN 113203084 A CN113203084 A CN 113203084A CN 202110481214 A CN202110481214 A CN 202110481214A CN 113203084 A CN113203084 A CN 113203084A
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- Prior art keywords
- heat
- rotatable
- heat dissipation
- heat sink
- dissipation device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/73—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements being adjustable with respect to each other, e.g. hinged
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a rotatable heat dissipation device which comprises a first heat dissipation device and a second heat dissipation device, wherein the first heat dissipation device is provided with a first heat conduction piece, the second heat dissipation device is provided with a second heat conduction piece, and when the first heat dissipation device and the second heat dissipation device rotate relatively, heat exchange is carried out through the first heat conduction piece and the second heat conduction piece. In the embodiment of the invention, the relative rotation between the heat dissipation devices can be realized through the connection between the heat conduction pieces, the requirement of a rotation function is met, the rotation angle and the number of cycles are not limited, and meanwhile, the heat transfer between the heat dissipation devices is high in efficiency through the high heat transfer efficiency between the heat conduction pieces, so that the heat dissipation requirement of a high-power-consumption device is met.
Description
Technical Field
The invention belongs to the field of heat dissipation devices, and particularly relates to a rotatable heat dissipation device and a desk lamp with the structure.
Background
With the development of the technology, more and more products with high power consumption and small volume are produced, and the requirement on heat dissipation is sharply improved. The existing heat dissipation structures with higher efficiency are all metal pieces, and can not rotate relatively due to the limitation of rigid structures of the heat dissipation structures, and parts in the heat dissipation structures need to be welded or bonded to ensure higher heat transfer efficiency, so that a common heat dissipation module can not rotate relatively.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a rotatable heat dissipation device and a desk lamp with the structure, so that the relative rotation between heat dissipation parts is realized, higher heat transfer efficiency is ensured, the heat dissipation requirement is met, and the technical problem that the conventional heat dissipation structure cannot rotate relatively is solved.
The invention provides a rotatable heat dissipation device, comprising:
a first heat dissipating device having a first heat conductive member;
and the second heat dissipation device is provided with a second heat conduction piece, the second heat conduction piece is rotationally connected to the first heat conduction piece, and when the first heat dissipation device and/or the second heat dissipation device rotate, heat is transferred between the first heat dissipation device and the second heat dissipation device through the second heat conduction piece and the first heat conduction piece.
According to the technical scheme, the heat conducting pieces connected in a rotating mode achieve relative rotation between the heat radiating devices, and meanwhile the heat radiating devices have high heat conduction efficiency.
In some embodiments, the first heat conducting member is a cylinder, the second heat conducting member has a connecting hole, and the cylinder is inserted into the connecting hole, so that the first heat conducting member and the second heat conducting member can rotate 360 degrees. According to the technical scheme, the relative rotation of the heat dissipation device is realized through the matching of the column body and the connecting hole.
In some embodiments, the rotatable heat sink further comprises: and the thermal interface material is filled in the gap between the connecting hole and the column body. This technical scheme has realized the higher heat transfer efficiency between the heat conduction spare through thermal interface material.
In some embodiments, the rotatable heat sink further comprises: and the sealing piece is sleeved on the column body and encapsulates the thermal interface material in the connecting hole. According to the technical scheme, the thermal interface material is packaged through the sealing element, and high heat transfer efficiency between the heat conducting elements is guaranteed.
In some embodiments, the first thermally conductive member is provided with an end cap that is disposed over the open end of the attachment aperture. According to the technical scheme, the connecting hole is sealed through the end cover.
In some of these embodiments, the first heat-dissipating device comprises: superconductive heat radiation structure and first heat exchanger, first heat-conducting member connect in the body of first heat exchanger. According to the technical scheme, the heat dissipation performance is enhanced through the superconducting heat dissipation device.
In some of these embodiments, the second heat dissipating device comprises: the heat pipe and the second heat exchanger, the second heat exchanger is installed on the heat pipe, and the second heat conducting piece is connected to the body of the second heat exchanger. This technical scheme makes radiator part and heat-conducting member realize quick heat exchange.
In some of these embodiments, the body of the first heat exchanger is integral with the first heat transfer member. This technical scheme makes heat exchanger and heat-conducting member realize quick heat exchange.
In some of these embodiments, the body of the second heat exchanger is integral with the second heat transfer member. This technical scheme makes heat exchanger and heat-conducting member realize quick heat exchange.
In some embodiments, the thermal interface material is a thermally conductive silicone grease or a liquid metal. According to the technical scheme, the liquid material with high heat conduction performance is used as a thermal interface material, and high heat conduction efficiency between the heat conduction pieces is realized.
In some of these embodiments, the superconducting heat dissipation structure is at least one of a thermal column, a VC thermal spreader, a TEC semiconductor cooler, and a heat pipe filled with a thermal phase change material.
The invention also provides a desk lamp, which comprises a lamp arm, a lamp cap and the rotatable heat dissipation device, wherein the lamp cap is provided with a first heat dissipation device, the lamp arm is provided with a second heat dissipation device, and when the lamp cap and/or the lamp arm rotate, heat is transferred between the lamp cap and the lamp arm through the rotatable heat dissipation device. This technical scheme is realizing that the lamp holder rotates for the arm through rotatable heat radiation structure, and the reinforcing is to the heat dissipation of lamp holder.
Based on the technical scheme, relative rotation between the heat dissipation devices can be achieved through connection between the heat conduction pieces, the requirement of a rotation function is met, the rotation angle and the number of cycles are not limited, and meanwhile, the heat conduction pieces have high heat conduction efficiency through the heat conduction parts, so that heat between the heat dissipation devices is efficiently transferred, and the heat dissipation requirement of a high-power-consumption device is met.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:
FIG. 1 is a front view of a rotatable heat sink of the present invention;
FIG. 2 is a side view of the rotatable heat sink of the present invention;
FIG. 3 is a cross-sectional view of the rotatable heat sink of the present invention;
in the figure:
1. a first heat dissipation device; 11. a first heat exchanger;
2. a first heat dissipation device; 21. a second heat exchanger; 22. a heat pipe;
3. a first heat-conducting member; 4. a second heat-conducting member;
51. a thermal interface material; 52. a seal member;
6. a cylinder; 7. connecting holes; 8. an end cap; 9. provided is a superconductive heat dissipation device.
Detailed Description
The technical solutions in the embodiments will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely a few embodiments of the invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "central," "lateral," "longitudinal," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting.
The terms "first", "second" and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", "third" may explicitly or implicitly include one or more of the features.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1 to 2, in an exemplary embodiment of the rotatable heat sink of the present invention, the rotatable heat sink includes a first heat dissipating device 1 and a second heat dissipating device 2. The first heat sink device 1 has a first heat-conducting member 3, and the second heat sink device 2 has a second heat-conducting member 4. The second heat-conducting member 4 is rotatably connected to the first heat-conducting member 3 and can rotate relative to the first heat-conducting member 3. Through the first heat-conducting member 3 and the second heat-conducting member 4 which are connected in a rotating manner, the first heat-radiating device 1 can rotate relative to the second heat-radiating device 2, and heat transfer is performed between the first heat-radiating device 1 and the second heat-radiating device 2 through the first heat-conducting member 3 and the second heat-conducting member 4, namely, the first heat-radiating device 1 sequentially passes through the first heat-conducting member 3, the heat-transferring member 5 and the second heat-conducting member 4 to perform heat exchange with the second heat-radiating device 2.
One of the two heat dissipation devices is connected with the heating device, and heat generated by the heating device during operation can be dissipated by the other heat dissipation device through heat transfer of the heat conduction member, so that heat dissipation of the heating device is realized. The heat dissipation device and the heat conduction piece are fixedly connected, high heat conduction efficiency is achieved between the heat dissipation device and the heat conduction piece, efficient heat transfer can be achieved between the heat conduction pieces, accordingly, heat of the heating device can be efficiently transferred and dissipated, the heat dissipation requirement of the high-power-consumption device can be met, the heat dissipation device can rotate relatively, the rotation function requirement is met, the rotating angle and the frequency are not limited, and the technical problem that an existing heat dissipation structure cannot rotate relatively is solved.
In some embodiments, the first heat dissipating device 1 comprises a superconducting heat dissipating structure 9 and a first heat exchanger 11, the first heat conducting member 3 being connected to the body of the first heat exchanger 11. The first heat dissipation device 1 is connected with the heating device, so that the first heat dissipation device 1 can more quickly receive heat generated by the heating device through the superconducting heat dissipation device 9, and the heat is transmitted to the second heat dissipation device 2 through the first heat conduction piece and the second heat conduction piece to be dissipated, and the heat dissipation performance is enhanced.
In some embodiments, the superconducting heat dissipation structure 9 is at least one of a thermal column, a VC thermal spreader, a TEC semiconductor refrigerator, and a heat pipe filled with a thermal phase change material. The superconductive heat dissipation structure 9 accelerates the heat exchange efficiency of the first heat exchanger 11 by at least one structure mode, thereby improving the heat dissipation efficiency.
In some embodiments, the body of the first heat exchanger 11 is in one piece with the first heat-conducting member 3. The integral structure makes the heat transfer between the first heat exchanger 11 and the first heat-conducting member 3 more direct, thereby improving the heat transfer efficiency.
In some embodiments, the second heat sink 2 includes a heat pipe 22 and a second heat exchanger 21, the second heat exchanger 21 is mounted on the heat pipe 22, and the second heat conduction member 4 is connected to the body of the second heat exchanger 21. The heat pipe 22 accelerates the heat radiation speed of the second heat exchanger 21, and improves the heat radiation performance.
In some embodiments, the body of the second heat exchanger 21 is in one piece with the second heat-conducting member 4. The integral structure makes the heat transfer between the second heat exchanger 21 and the second heat conduction member 4 more direct, thereby improving the heat transfer efficiency.
In some embodiments, as shown in fig. 3, the first heat-conducting member 3 is a cylinder, and the second heat-conducting member 4 has a connecting hole 7. The column 6 is inserted into the connecting hole 7, so that the column can rotate 360 degrees in the connecting hole 7, and the first heat conducting member 3 and the second heat conducting member 4 can rotate relatively, so that the first heat dissipation device 1 and the second heat dissipation device 2 can rotate relatively.
In some embodiments, as shown in fig. 3, the rotatable heat sink further comprises a thermal interface material 51, and the thermal interface material 51 is filled in the gap between the connection hole 7 and the column 6. Thermal interface material 51 is full of connecting hole 7, contacts with connecting hole 7 inner wall and 6 outer walls of cylinder fully to can high-efficient heat transfer, can carry out the heat exchange fast between the heat conduction piece, guarantee heat transfer efficiency, make the heat of the device that generates heat can fast transfer and give off, realize high-efficient radiating effect. In order to more easily fill the gap between the connection hole 7 and the column 6, a thermal interface material 51 in a fluid state may be used.
In some embodiments, as shown in fig. 3, the rotatable heat sink further comprises a sealing member 52, wherein the sealing member 52 is disposed on the column 6 and contacts the inner wall of the connecting hole 7, thereby sealing the connecting hole 7 and enclosing the filled thermal interface material 51 in the connecting hole 7. When only one end of the connecting hole 7 is an open end, only one sealing member 52 is provided for sealing. The sealing member 52 may be a conventional sealing member such as a gasket, and the present invention is not limited to the selection of the kind of the sealing member.
In some embodiments, the first heat-conducting member 3 is provided with the end cap 8, and the end cap 8 is fitted over the open end of the attachment hole 7, thereby sealing the opening of the attachment hole 7, further improving the sealing performance, and enabling the thermal interface material 51 to be sealed in the attachment hole 7 in cooperation with the sealing member 52. Meanwhile, the end cover can play a limiting role, and the phenomenon that the cylinder axially moves in the rotating process to occupy the space in the connecting hole in an extruding mode is avoided, so that the thermal interface material is prevented from being extruded.
In some embodiments, the thermal interface material 51 is a thermally conductive silicone grease or a liquid metal. The thermal interface material 51 fills the gap between the cylinder 6 and the connecting hole 7 by the fluid state property, and fully contacts with the cylinder 6 and the connecting hole 7, and the property of high heat transfer efficiency is utilized to improve the heat transfer efficiency between the cylinder 6 and the connecting hole 7, so that heat exchange can be rapidly carried out between the heat conducting pieces, and the effect of high-efficiency heat dissipation is realized. In addition, the thermal interface material 51 is a fluid material, and can be used as a lubricating fluid, so that the rotation of the cylinder 6 in the connecting hole 7 is kept flexible and smooth, and the abrasion is avoided, so that the service life is prolonged.
Based on the rotatable heat dissipation device, the invention also provides a desk lamp, which comprises a lamp arm, a lamp cap and a rotatable heat dissipation device. The first heat sink element is mounted on the lamp cap and the second heat sink element is mounted on the lamp arm, and since the first heat sink element 1 can be rotated relative to the second heat sink element 2, the lamp cap can be rotated relative to the lamp arm. When lamp holder and arm take place relative rotation, carry out the heat transfer through rotatable heat abstractor between lamp holder and the arm, give off the heat transfer that luminous component work produced on the lamp holder to the arm, improve the desk lamp radiating effect.
Through the description of the embodiments of the rotatable heat sink and the desk lamp with the structure, it can be seen that the embodiments of the rotatable heat sink and the desk lamp with the structure of the invention have at least one or more of the following advantages:
1. the heat dissipation device can realize relative rotation between the heat dissipation devices through the connection between the heat conduction pieces, meets the requirement of a rotation function, is not limited in rotation angle and cycle number, and has high heat transfer efficiency through the heat conduction pieces, so that the heat transfer between the heat dissipation devices is efficient, and the heat dissipation requirement of a high-power-consumption device is met;
2. the invention adopts thermal interface materials to realize efficient heat transfer between the heat conducting fins, ensures the heat dissipation effect, and simultaneously plays a role in lubrication, so that the rotation is smooth and the service life is longer;
3. the end cover is arranged to enhance the sealing performance, and meanwhile, the position can be limited, so that the thermal interface material is prevented from being extruded out by the cylinder.
Finally, it should be noted that: the embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The above examples are only intended to illustrate the technical solution of the present invention and not to limit it; although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art will understand that: modifications to the specific embodiments of the invention or equivalent substitutions for parts of the technical features may be made; without departing from the spirit of the present invention, it is intended to cover all aspects of the invention as defined by the appended claims.
Claims (12)
1. A rotatable heat sink, comprising:
a first heat dissipating device having a first heat conductive member;
and the second heat dissipation device is provided with a second heat conduction piece, the second heat conduction piece is rotationally connected to the first heat conduction piece, and when the first heat dissipation device and/or the second heat dissipation device rotate, heat is transferred between the first heat dissipation device and the second heat dissipation device through the second heat conduction piece and the first heat conduction piece.
2. The rotatable heat sink of claim 1, wherein the first heat conducting member is a cylinder, the second heat conducting member has a connecting hole, and the cylinder is inserted into the connecting hole, such that the first heat conducting member and the second heat conducting member can rotate 360 degrees.
3. The rotatable heat sink of claim 2, further comprising: and the thermal interface material is filled in a gap between the connecting hole and the column body.
4. The rotatable heat sink of claim 3, further comprising: and the sealing piece is sleeved on the cylinder and encapsulates the thermal interface material in the connecting hole.
5. The rotatable heat sink of claim 3, wherein the first thermally conductive member is provided with an end cap, the end cap being provided on an open end of the attachment hole.
6. The rotatable heat sink of claim 1, wherein the first heat dissipating device comprises: the superconducting heat dissipation structure comprises a superconducting heat dissipation structure and a first heat exchanger, wherein the first heat conducting piece is connected to the body of the first heat exchanger.
7. The rotatable heat sink of claim 1, wherein the second heat dissipating device comprises: the heat pipe comprises a heat pipe and a second heat exchanger, wherein the second heat exchanger is arranged on the heat pipe, and the second heat conducting piece is connected to the body of the second heat exchanger.
8. The rotatable heat sink of claim 6, wherein the body of the first heat exchanger and the first thermally conductive member are a unitary piece.
9. The rotatable heat sink of claim 7, wherein the body of the second heat exchanger is integral with the second thermally conductive member.
10. The rotatable heat sink device of claim 3, wherein the thermal interface material is a thermally conductive silicone grease or a liquid metal.
11. The rotatable heat sink of claim 6 wherein the superconducting heat dissipating structure is at least one of a thermal column, a VC soaking plate, a TEC semiconductor refrigerator, and a heat pipe filled with a thermal phase change material.
12. A desk lamp comprising a lamp arm, a lamp cap, and the rotatable heat sink of any one of claims 1-11, wherein the lamp cap mounts the first heat sink, the lamp arm mounts the second heat sink, and the lamp cap and/or the lamp arm rotate to transfer heat between the lamp cap and the lamp arm through the rotatable heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110481214.5A CN113203084A (en) | 2021-04-30 | 2021-04-30 | Rotatable heat abstractor and have desk lamp of this structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110481214.5A CN113203084A (en) | 2021-04-30 | 2021-04-30 | Rotatable heat abstractor and have desk lamp of this structure |
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| Publication Number | Publication Date |
|---|---|
| CN113203084A true CN113203084A (en) | 2021-08-03 |
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| CN202110481214.5A Pending CN113203084A (en) | 2021-04-30 | 2021-04-30 | Rotatable heat abstractor and have desk lamp of this structure |
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| CN111140799A (en) * | 2020-01-14 | 2020-05-12 | 众普森科技（株洲）有限公司 | Lamp set |
| CN211090362U (en) * | 2019-07-31 | 2020-07-24 | 联想(北京)有限公司 | Heat dissipation device and electronic equipment |
| CN214536077U (en) * | 2021-04-30 | 2021-10-29 | 青岛易来智能科技股份有限公司 | Rotatable heat abstractor and have desk lamp of this structure |
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2021
- 2021-04-30 CN CN202110481214.5A patent/CN113203084A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101018463A (en) * | 2006-02-08 | 2007-08-15 | 富准精密工业(深圳)有限公司 | Electronic device combination |
| CN101242732A (en) * | 2007-02-08 | 2008-08-13 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator combination |
| US20120086321A1 (en) * | 2010-10-12 | 2012-04-12 | Wen-Ji Lan | Rotatable heat dissipating device |
| US20120168129A1 (en) * | 2010-12-30 | 2012-07-05 | Tsang-Ju Chiang | Adaptive heat dissipating device |
| CN102332437A (en) * | 2011-10-25 | 2012-01-25 | 四川长虹电器股份有限公司 | Heat pipe radiating device and installation method thereof |
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