CN113199837A - Preparation method of high-performance heat-conducting wave-absorbing composite material - Google Patents

Preparation method of high-performance heat-conducting wave-absorbing composite material Download PDF

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CN113199837A
CN113199837A CN202110518919.XA CN202110518919A CN113199837A CN 113199837 A CN113199837 A CN 113199837A CN 202110518919 A CN202110518919 A CN 202110518919A CN 113199837 A CN113199837 A CN 113199837A
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heat
conducting
wave
composite material
preparation
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毛向华
衡小燕
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Shenzhen Hechang Electromagnetic Materials Co ltd
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Shenzhen Hechang Electromagnetic Materials Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
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    • C08K2003/2272—Ferric oxide (Fe2O3)
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    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
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    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
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    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
    • C08K5/526—Esters of phosphorous acids, e.g. of H3PO3 with hydroxyaryl compounds

Abstract

The invention discloses a preparation method of a high-performance heat-conducting wave-absorbing composite material, and relates to the technical field of wave-absorbing materials and heat-conducting materials. The preparation method of the high-performance heat-conducting wave-absorbing composite material comprises the following steps: the material screening, the heat conduction layer preparation, the wave absorbing layer preparation, the multilayer preparation, the laminating treatment and the material test, wherein the heat conduction filler comprises one or more of aluminum oxide, silicon oxide, zinc oxide, magnesium oxide, calcium oxide, aluminum nitride, boron nitride and silicon carbide, the single-layer thickness of the heat conduction material is 0.08-0.14MM, the single-layer thickness of the electromagnetic wave absorption material is 0.08-0.14MM, and the wave absorbing agent comprises stone ferrite: for example, Mn-Zn, Ni-Zn, Li-Ti and other series are subjected to laminating heat treatment on a plurality of layers of heat-conducting materials and a plurality of layers of electromagnetic wave absorption type materials to finally obtain the heat-conducting wave-absorbing composite material, so that the service life of the heat-conducting wave-absorbing composite material can be effectively prolonged, and the heat-conducting wave-absorbing composite material can be adapted to electronic products with different thicknesses.

Description

Preparation method of high-performance heat-conducting wave-absorbing composite material
Technical Field
The invention relates to the technical field of wave-absorbing materials and heat-conducting materials, in particular to a preparation method of a high-performance heat-conducting wave-absorbing composite material.
Background
As electronic devices are becoming thinner, faster, higher frequency and more highly integrated, heat dissipation may occur at any position of the electronic devices, which may affect the working stability, reliability and service life of the electronic devices, and even damage the devices. The heat conducting gasket is a heat conducting medium material which is synthesized by taking rubber as a base material, taking metal oxide and the like as heat conducting agents and adopting a special process. Because the heat-conducting gasket contains a large amount of rubber polymer materials (generally, the mass fraction is not less than 10, even higher), the heat-conducting performance of the heat-conducting gasket is poor, the heat-conducting coefficient is 0.7-4.0W/(m.K), and the preparation process has high control requirement, time-consuming operation and great difficulty. In addition, people find that the electromagnetic interference problem still exists while solving the heat dissipation problem through the heat conduction gasket, so when the heat conduction gasket is attached to the surface of the chip, the heat conduction gasket is required to have good heat conduction characteristics and good wave absorption characteristics. However, most of the conventional heat conducting gaskets have low magnetic permeability and do not have good wave absorption characteristics.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a preparation method of a high-performance heat-conducting wave-absorbing composite material, and solves the problems in the background art.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a preparation method of a high-performance heat-conducting wave-absorbing composite material comprises the following steps:
s1, screening materials, and preparing silicone oil, heat-conducting filler, coupling agent, wave absorbing agent, curing agent, catalyst, binder, heat-conducting agent, solvent and accelerator;
s2, preparing a heat conduction layer, namely uniformly mixing the binder, the heat conduction agent, the solvent, the curing agent, the catalyst and the accelerator according to the required weight percentage, and preparing the mixture into a single-layer heat conduction material by a casting process;
s3, preparing a wave absorbing layer, namely uniformly mixing a binder, a wave absorbing agent, a solvent, a curing agent, a catalyst and an accelerant according to the required weight percentage, and preparing the mixture into a single-layer electromagnetic wave absorbing material by a casting process;
s4, multilayer preparation, preparing a multilayer heat conductive material and a multilayer electromagnetic wave absorption material according to the steps S2 and S3;
s5, laminating, namely laminating the multiple layers of heat-conducting materials and the multiple layers of electromagnetic wave absorption materials, putting the materials into a rolling machine, and curing at constant temperature of 100 ℃ for 5-15 minutes to finally obtain the heat-conducting wave-absorbing composite material;
and S6, testing materials, performing professional multi-group tests on the obtained multi-group heat-conducting wave-absorbing composite materials, and comparing the final data.
Preferably, the heat-conducting filler comprises one or more of aluminum oxide, silicon oxide, zinc oxide, magnesium oxide, calcium oxide, aluminum nitride, boron nitride and silicon carbide.
Preferably, the thickness of the single layer of the heat-conducting material is 0.08-0.14 MM.
Preferably, the thickness of the single layer of the electromagnetic wave absorption material is 0.08-0.14 MM.
Preferably, the wave absorbing agent comprises a stone ferrite: such as Mn-Zn, Ni-Zn, Li-Ti, etc., or large-sized divalent metal ion ferrite, such as one of hexagonal crystal structures of barium, strontium, calcium, lead, etc.
Preferably, the coupling agent comprises one of silanes, phthalates and aluminates.
Preferably, the accelerant is triphenyl phosphite, the curing agent is hydrogen-containing silicone oil, and the catalyst is a platinum catalyst.
Preferably, the heat-conducting material is prepared into 4-5 layers, and the electromagnetic wave absorption material is prepared into 5-6 layers.
Preferably, the calendering roller body on the calender is in a magnetized state.
(III) advantageous effects
The invention provides a preparation method of a high-performance heat-conducting wave-absorbing composite material. The method has the following beneficial effects:
(1) according to the preparation method of the high-performance heat-conduction wave-absorbing composite material, the heat-conduction wave-absorbing composite material is finally obtained by laminating the multiple layers of heat-conduction materials and the multiple layers of electromagnetic wave-absorbing materials, the service life of the heat-conduction wave-absorbing composite material can be effectively prolonged, and the heat-conduction wave-absorbing composite material can be adapted to electronic products with different thicknesses.
(2) According to the preparation method of the high-performance heat-conduction wave-absorbing composite material, the finally obtained heat-conduction wave-absorbing composite material is tested for many times, test data are obtained and compared, and the accuracy of the final data can be effectively guaranteed.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a technical scheme that: a preparation method of a high-performance heat-conducting wave-absorbing composite material comprises the following steps:
s1, screening materials, and preparing silicone oil, heat-conducting filler, coupling agent, wave absorbing agent, curing agent, catalyst, binder, heat-conducting agent, solvent and accelerator;
s2, preparing a heat conduction layer, namely uniformly mixing the binder, the heat conduction agent, the solvent, the curing agent, the catalyst and the accelerator according to the required weight percentage, and preparing the mixture into a single-layer heat conduction material by a casting process;
s3, preparing a wave absorbing layer, namely uniformly mixing a binder, a wave absorbing agent, a solvent, a curing agent, a catalyst and an accelerant according to the required weight percentage, and preparing the mixture into a single-layer electromagnetic wave absorbing material by a casting process;
s4, preparing multiple layers, namely preparing multiple layers of heat-conducting materials and multiple layers of electromagnetic wave absorption materials according to the step S2 and the step S3, and finally laminating the two materials to obtain the heat-conducting wave-absorbing composite material;
s5, laminating, namely laminating the multiple layers of heat-conducting materials and the multiple layers of electromagnetic wave absorption materials, putting the materials into a rolling machine, and curing at constant temperature of 100 ℃ for 5-15 minutes to finally obtain the heat-conducting wave-absorbing composite material, wherein the service life of the heat-conducting wave-absorbing composite material can be effectively prolonged;
s6, material testing, namely performing professional multi-group testing on the obtained multi-group heat-conducting wave-absorbing composite material, and comparing final data, so that the accuracy of the data can be effectively guaranteed, and the prepared heat-conducting wave-absorbing material has excellent performance.
The heat-conducting filler comprises one or more of aluminum oxide, silicon oxide, zinc oxide, magnesium oxide, calcium oxide, aluminum nitride, boron nitride and silicon carbide.
The single-layer thickness of the heat-conducting material is 0.08-0.14MM, so that the whole thickness of the heat-conducting wave-absorbing composite material can adapt to electronic products with different thicknesses.
The thickness of the single layer of the electromagnetic wave absorption material is 0.08-0.14MM, so that the whole thickness of the heat-conducting wave absorption composite material can adapt to electronic products with different thicknesses.
The wave absorbing agent comprises a stone ferrite: such as Mn-Zn, Ni-Zn, Li-Ti and other series or large-size divalent metal ion ferrites, such as barium, strontium, calcium, lead and other hexagonal crystal structures, the ferrite wave-absorbing material is a more researched and mature wave-absorbing material, and has high magnetic conductivity and high resistivity at high frequency, so that electromagnetic waves can easily enter and quickly attenuate. The main disadvantages are high density and poor temperature stability. For this reason, researchers in various countries desire to improve wear characteristics and reduce density by adjusting chemical composition, particle size and distribution thereof, particle morphology, dispersion technique, and the like of the material itself.
The coupling agent includes one of silanes, phthalates and aluminates, is an organosilicon compound having a specific structure, and has a reactive group capable of bonding to inorganic materials (such as glass, cement, metal, etc.) and a reactive group capable of bonding to organic materials (such as synthetic resin, etc.) in its molecule, and serves as a surface modifier to improve dispersibility and adhesiveness.
The catalyst is a platinum catalyst, the triphenyl phosphite is an auxiliary antioxidant with excellent performance, the additive flame-retardant plasticizer and the plastic product anti-aging agent can prolong the service life of the heat-conducting wave-absorbing composite material, the platinum catalyst has high catalytic activity and strong selectivity, the catalyst is convenient to manufacture and small in using amount, and can be compounded with other metal or cocatalyst active components and the like through the change and improvement of a manufacturing method, so that the catalytic performance is optimized, the heat-conducting wave-absorbing composite material is effectively improved, the hydrogen-containing silicone oil has particularly excellent hydrophobicity, and the heat-conducting wave-absorbing composite material can be effectively protected on a plurality of occasions such as surface treatment of glass, metal, fiber and powder.
4-5 layers of heat-conducting material and 5-6 layers of electromagnetic wave absorbing material are prepared, so that the performance of the heat-conducting wave absorbing composite material can be in the best state.
The calendering roller body on the calender is in a magnetizing state, so that the magnetic density is improved, and the magnetic conductivity and the heat conductivity coefficient are improved.
The second embodiment is a preparation method of a high-performance heat-conducting wave-absorbing composite material, which comprises the following steps:
s1, screening materials, and preparing silicone oil, heat-conducting filler, coupling agent, wave absorbing agent, curing agent, catalyst, binder, heat-conducting agent, solvent and accelerator;
s2, preparing a heat conduction layer, namely uniformly mixing the binder, the heat conduction agent, the solvent, the curing agent, the catalyst and the accelerator according to the required weight percentage, and preparing the mixture into a single-layer heat conduction material by a casting process;
s3, preparing a wave absorbing layer, namely uniformly mixing a binder, a wave absorbing agent, a solvent, a curing agent, a catalyst and an accelerant according to the required weight percentage, and preparing the mixture into a single-layer electromagnetic wave absorbing material by a casting process;
s4, multilayer preparation, preparing a multilayer heat conductive material and a multilayer electromagnetic wave absorption material according to the steps S2 and S3;
s5, laminating, namely laminating the multiple layers of heat-conducting materials and the multiple layers of electromagnetic wave absorption materials, putting the materials into a rolling machine, and curing at constant temperature of 100 ℃ for 5-15 minutes to finally obtain the heat-conducting wave-absorbing composite material;
and S6, testing materials, performing professional multi-group tests on the obtained multi-group heat-conducting wave-absorbing composite materials, and comparing the final data.
And S7, analyzing the data, comparing the tested data to obtain the optimal group, and repeatedly testing to obtain the optimal product.
In a third embodiment, the preparation method of the high-performance heat-conducting wave-absorbing composite material comprises the following steps:
s1, screening materials, and preparing silicone oil, heat-conducting filler, coupling agent, wave absorbing agent, curing agent, catalyst, binder, heat-conducting agent, solvent and accelerator;
s2, preparing a heat conduction layer, namely uniformly mixing the binder, the heat conduction agent, the solvent, the curing agent, the catalyst and the accelerator according to the required weight percentage, and preparing the mixture into a single-layer heat conduction material by a casting process;
s3, preparing a wave absorbing layer, namely uniformly mixing a binder, a wave absorbing agent, a solvent, a curing agent, a catalyst and an accelerant according to the required weight percentage, and preparing the mixture into a single-layer electromagnetic wave absorbing material by a casting process;
s4, multilayer preparation, preparing a multilayer heat conductive material and a multilayer electromagnetic wave absorption material according to the steps S2 and S3;
s5, laminating, namely laminating the multiple layers of heat-conducting materials and the multiple layers of electromagnetic wave absorption materials, putting the materials into a rolling machine, and curing at the constant temperature of 135 ℃ for 10 minutes to finally obtain the heat-conducting wave-absorbing composite material capable of being used on a tablet computer;
and S6, testing materials, performing professional multi-group tests on the obtained multi-group heat-conducting wave-absorbing composite materials, and comparing the final data.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (9)

1. A preparation method of a high-performance heat-conducting wave-absorbing composite material is characterized by comprising the following steps: the preparation method of the high-performance heat-conducting wave-absorbing composite material comprises the following steps:
s1, screening materials, and preparing silicone oil, heat-conducting filler, coupling agent, wave absorbing agent, curing agent, catalyst, binder, heat-conducting agent, solvent and accelerator;
s2, preparing a heat conduction layer, namely uniformly mixing the binder, the heat conduction agent, the solvent, the curing agent, the catalyst and the accelerator according to the required weight percentage, and preparing the mixture into a single-layer heat conduction material by a casting process;
s3, preparing a wave absorbing layer, namely uniformly mixing a binder, a wave absorbing agent, a solvent, a curing agent, a catalyst and an accelerant according to the required weight percentage, and preparing the mixture into a single-layer electromagnetic wave absorbing material by a casting process;
s4, multilayer preparation, preparing a multilayer heat conductive material and a multilayer electromagnetic wave absorption material according to the steps S2 and S3;
s5, laminating, namely laminating the multiple layers of heat-conducting materials and the multiple layers of electromagnetic wave absorption materials, putting the materials into a rolling machine, and curing at constant temperature of 100 ℃ for 5-15 minutes to finally obtain the heat-conducting wave-absorbing composite material;
and S6, testing materials, performing professional multi-group tests on the obtained multi-group heat-conducting wave-absorbing composite materials, and comparing the final data.
2. The preparation method of the high-performance heat-conducting wave-absorbing composite material according to claim 1, characterized in that: the heat-conducting filler comprises one or more of aluminum oxide, silicon oxide, zinc oxide, magnesium oxide, calcium oxide, aluminum nitride, boron nitride and silicon carbide.
3. The preparation method of the high-performance heat-conducting wave-absorbing composite material according to claim 1, characterized in that: the thickness of the single layer of the heat-conducting material is 0.08-0.14 MM.
4. The preparation method of the high-performance heat-conducting wave-absorbing composite material according to claim 1, characterized in that: the thickness of the single layer of the electromagnetic wave absorption material is 0.08-0.14 MM.
5. The preparation method of the high-performance heat-conducting wave-absorbing composite material according to claim 1, characterized in that: the wave absorbing agent comprises a stone ferrite: such as Mn-Zn, Ni-Zn, Li-Ti, etc., or large-sized divalent metal ion ferrite, such as one of hexagonal crystal structures of barium, strontium, calcium, lead, etc.
6. The preparation method of the high-performance heat-conducting wave-absorbing composite material according to claim 1, characterized in that: the coupling agent comprises one of silanes, phthalates and aluminates.
7. The preparation method of the high-performance heat-conducting wave-absorbing composite material according to claim 1, characterized in that: the accelerant is triphenyl phosphite, the curing agent is hydrogen-containing silicone oil, and the catalyst is a platinum catalyst.
8. The preparation method of the high-performance heat-conducting wave-absorbing composite material according to claim 1, characterized in that: 4-5 layers of the heat-conducting material and 5-6 layers of the electromagnetic wave absorption material are prepared.
9. The preparation method of the high-performance heat-conducting wave-absorbing composite material according to claim 1, characterized in that: and the calendering roller body on the calender is in a magnetizing state.
CN202110518919.XA 2021-05-12 2021-05-12 Preparation method of high-performance heat-conducting wave-absorbing composite material Pending CN113199837A (en)

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CN114197242A (en) * 2021-12-23 2022-03-18 清远高新华园科技协同创新研究院有限公司 Wave-absorbing heat-conducting composite material and preparation method and application thereof
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