CN113199556A

CN113199556A - Multilayer material die cutting processing method

Info

Publication number: CN113199556A
Application number: CN202110416911.2A
Authority: CN
Inventors: 尉晓东; 杨权平; 赖焜
Original assignee: Emicore Corp
Current assignee: Emicore Corp
Priority date: 2021-04-19
Filing date: 2021-04-19
Publication date: 2021-08-03
Anticipated expiration: 2041-04-19
Also published as: CN113199556B

Abstract

The invention provides a processing method for preventing a lower layer material from generating cutter marks during local die cutting of a multilayer material. The invention provides a die cutting processing method of a multilayer material, which comprises the following steps: adding a separating strip between the first material layer and a second material layer needing local die cutting; carrying out local die cutting on an area to be processed, and removing processing waste; and removing the separating strips to ensure that the first material layer is completely attached to the second material layer. The invention has the advantages that when the second material layer is subjected to local die cutting, the cutter mark can be formed on the separating strip, and the cutter mark cannot be generated on the first material layer, so that the structural performance of the multilayer material cannot be influenced by the local die cutting.

Description

Multilayer material die cutting processing method

Technical Field

The invention belongs to the field of composite processing of multilayer materials, and particularly relates to a die cutting processing method of a multilayer material.

Background

With the development of manufacturing industries such as electronic communication and the like, a plurality of layers of materials are often required to be compounded together for processing, and the sizes of the layers are required to be strictly aligned during processing, so that the outer contour of the multi-layer materials is mostly processed by adopting a die cutting method. When die cutting is carried out, single-layer or multi-layer stacked flat materials are cut along a required outline by utilizing a preset blade die, and waste materials are removed to obtain a sheet product with a required outline shape.

In the production process, the situation that some layer in the multi-layer material needs to be cut off to form a local structure, and other layers do not need to be cut off occurs. When the situation is met, 2 processing modes are generally adopted: the first is to process each layer of material separately and then paste; the second is that the high-low cutter die is utilized to carry out flat-pressing die cutting, and the outline of each layer of material is die-cut while the local structure of the upper layer of material is die-cut. The first processing mode has the disadvantages of low production efficiency and poor alignment effect due to the fact that the outer contours are processed respectively. The second processing method is shown in fig. 1, the cutting die a1 has two cutters a1, a2 with different blade heights, wherein the high cutter a1 is used for die cutting the outer contour to remove C1 from the multilayer materials B1, B2, the low cutter a2 is used for local die cutting, and C2 is removed from the upper material B1 of the multilayer materials, and the two blades with different heights are used for die cutting at the same time, but this processing method often has a problem of knife marks, that is, the low cutter a2 cannot cut just the upper material B1 during die cutting, and the blade more or less forms an indentation, that is, a knife mark, on the lower material B2. Such a knife mark not only affects the appearance of the product, but also more likely the functional properties of the adjacent layers. This problem is not easily avoided because if the lower knife is adjusted lower, the partial die cut B1 may not completely cut the layer of material, which is also not allowed.

Disclosure of Invention

The invention mainly aims to provide a processing method for preventing knife marks from being generated on lower-layer materials when multilayer materials are subjected to partial die cutting.

In order to achieve the main purpose, the invention provides a die cutting processing method of a multilayer material, which comprises the following steps: adding a separation strip: adding a separating strip between a first material layer and a second material layer needing local die cutting, wherein one end of the separating strip extends inwards from one side edge of the second material layer to cover and exceed an area to be processed, a clamping end is formed by the part of the separating strip clamped between the first material layer and the second material layer, and an extending end is formed by the part positioned outside the first material layer; local die cutting: processing and die-cutting the second material layer in the area to be processed, and removing processing waste; and separating the clamping end from the first material layer and the second material layer by using the extending end through external force so as to remove the separating strips and completely attach the first material layer and the second material layer.

According to the scheme, after the separating strip with the clamping end extending inwards to the area to be processed covering and exceeding the second material layer is added between the first material layer and the second material layer to be processed, the cutter mark can be formed on the clamping end of the separating strip during die cutting of the second material layer, so that the cutter mark cannot be generated on the first material layer, after the local die cutting is completed, the separating strip can be conveniently removed through the extending end of the separating strip arranged outside the material layer, and the structural performance of the multilayer material cannot be influenced.

According to a particular embodiment of the invention, the separator strip is a PET film. Because the PET film has excellent mechanical property and high toughness, tensile strength and impact strength, the PET film can provide better protection for lower-layer materials during local die cutting, can be conveniently removed when the PET film is removed, and cannot have the phenomenon of residue among the materials.

According to one embodiment of the invention, the side of the separating strip facing the second material layer is coated with a release agent. According to the scheme, the parting strips are coated with the release agent, so that the second material layer is not easy to adhere the parting strips together when die cutting is carried out under pressure, and the parting strips can be removed conveniently.

According to a specific embodiment of the invention, the protruding end protrudes from the side edge of the first material layer by a length of 2mm to 10 mm. As can be seen in the scheme, the protruding end has a certain protruding length, thereby facilitating the clamping of the separator strip during removal.

According to an embodiment of the invention, the method further comprises, after removing the separating strips, die cutting the first and second layers of material to form the outer contour of the product. According to the scheme, when the partial die cutting and the removal of the separating strips are carried out, the positions of the multilayer materials are not affected and can be kept unchanged or moved for a specific distance, so that the die cutting of the outer contour of the multilayer materials can be carried out without repositioning.

According to a specific embodiment of the present invention, the method further includes placing the first material layer and the second material layer on a bottom film, wherein the width of the bottom film is greater than the width of the material layers, that is, both sides of the first material layer and both sides of the second material layer are located in the bottom film, and before the partial die cutting, positioning holes are formed in the bottom film. It is seen from above scheme that through placing the multilayer material on the basement membrane, can set up location structure through the basement membrane that has the broad width, and need not to set up on the multilayer material, and the basement membrane can be continuous strip membrane, can realize the accurate removal of multilayer material through the basement membrane.

According to a specific embodiment of the present invention, the positioning holes are formed on both sides of the base film. According to the scheme, the positioning holes are formed in the two sides of the bottom film, so that the multilayer materials can be accurately positioned, and die cutting is facilitated.

According to a specific embodiment of the present invention, the base film is a PET film on which an adhesive is coated, and the protruding end is attached to the base film. According to the scheme, the adhesive is arranged on the bottom film, so that the multilayer materials and the extending ends of the separating strips can be adhered to the bottom film without displacement, the multilayer materials are accurately positioned, the processing is convenient, and the separating strips can protect the lower-layer materials from generating tool marks.

According to an embodiment of the invention, the method further comprises, after completing the partial die cutting of the second layer of material and removing the separating strips, the step of covering the second layer of material with a third layer of material is continued. According to the scheme, after the local die cutting of the second material layer is completed, the materials can be continuously stacked on the multiple layers of materials so as to process the multiple layers of materials.

According to a specific embodiment of the present invention, the third material layer includes a material layer to be die-cut locally, a second separating strip is added between the material layer to be die-cut locally and the material layer below the material layer, such that one end of the second separating strip extends inward from one side of the material layer to cover and exceed a region to be die-cut locally, a portion of the second separating strip clamped between the material layer to be die-cut locally and the material layer below the second separating strip forms a clamping end, and a portion located outside the material layer below the second separating strip forms an extending end; processing and die-cutting the material layer needing partial die cutting, and removing processing waste; and removing the second separating strips by utilizing the extending ends of the second separating strips to ensure that the material layer subjected to local die cutting is completely attached to the material layer on the lower layer.

According to the scheme, when the third material layer is provided with the material layer needing local die cutting, the second separating strip can be used for protecting the material layer below the third material layer from generating knife marks. When the third material layer is one layer or a plurality of layers need local die cutting, the second separating strip can be arranged between the second material layer and the third material layer; when the third material layer is multilayer and only one layer or partial layers need to be die-cut locally, the second separating strip is arranged between the material layer needing to be die-cut locally and the material layer below the material layer. This step may be continued when a multilayer material is desired with more material layers, i.e. covering the fourth and fifth material layers and adding the dividing strip for partial die cutting.

In the present invention, the terms "first", "second", and the like are used for distinguishing or referring to the same or similar components or structures, and do not necessarily limit the sequence of the components or structures in space or time, and there is no necessity that only one of the components or structures is provided, for example, the first material layer may have multiple layers of materials.

To more clearly illustrate the objects, technical solutions and advantages of the present invention, the present invention will be further described in detail with reference to the accompanying drawings and detailed description.

Drawings

FIG. 1 is a schematic diagram of a prior art flat-bed die-cutting operation using a high-low knife;

FIG. 2a is a schematic structural view of a product that can be processed using an embodiment of the present invention, wherein FIG. 2b is an exploded structural view thereof;

FIG. 3 is a process flow diagram of an embodiment of the invention;

fig. 4a is a schematic view of a product according to an embodiment of the invention, with a first material layer placed on a carrier film, and fig. 4b is a schematic cross-sectional view of fig. 4 a;

fig. 5a is a schematic structural view of a product after a separation strip is placed on a first material layer and a positioning hole is machined according to an embodiment of the invention, fig. 5b is a schematic sectional view of fig. 5a, and fig. 5c is a schematic structural view of a cutting die for machining the positioning hole;

FIG. 6a is a schematic view of a product after a second layer of material is placed on the separator strip according to an embodiment of the invention, and FIG. 6b is a schematic cross-sectional view of FIG. 6 a;

FIG. 7a is a schematic diagram of a product structure with a second layer of material partially die cut according to an embodiment of the invention, FIG. 7b is a schematic cross-sectional view of FIG. 7a, and FIG. 7c is a schematic structural diagram of a knife blade partially die cut;

FIG. 8a is a schematic view of a product structure after partial die cutting and removal of scrap material according to an embodiment of the present invention, and FIG. 8b is a schematic cross-sectional view of FIG. 8 a;

FIG. 9a is a schematic view of a product structure after removal of the separator strip according to an embodiment of the invention, and FIG. 9b is a schematic cross-sectional view of FIG. 9 a;

FIG. 10a is a schematic view of a product structure when performing outer contour die cutting according to an embodiment of the present invention, FIG. 10b is a schematic view of a cross section of FIG. 10a, and FIG. 10c is a schematic view of a cutter performing outer contour die cutting;

fig. 11a is a schematic view of a product structure after outline die cutting and scrap removal according to an embodiment of the present invention, and fig. 11b is a schematic cross-sectional view of fig. 11 a.

Detailed Description

Fig. 2 is a schematic structural view of a product that can be processed using an embodiment of the present invention, in which fig. 2a is a front view thereof and fig. 2b is an exploded structural view thereof. As shown in fig. 2, the product P is formed by three material layers P1, P2 and P3 bonded together, wherein the material layer P3 has a partial cut-away portion P31. The following describes the process of the embodiment of the present invention by taking the processed product P as an example.

As shown in fig. 3, the present embodiment includes the following steps: 1. placing a first material layer on a bottom film; 2. processing a positioning hole on the bottom film, and placing a separating strip on the first material layer; 3. placing a second material layer; 4. locally die-cutting a second material layer; 5. removing processing waste; 6. removing the parting strips; 7. die cutting the outer contour; 8. removing the processing waste to obtain the required product.

It will be appreciated that in other embodiments, it may not be necessary to replace all of the steps or sequences described above, such as when the layer of material is not provided on the carrier film and is processed directly, when die cutting is performed with the waste removed, when sprocket holes are processed before the first layer of material is placed on the carrier film, etc.

Fig. 4a and 4b show a schematic representation of the structure of the product after the first material layer has been placed on the carrier film. As shown in fig. 4a and 4b, the first material layer comprises material layers M1, M2 and is placed in the middle of the carrier film D, the width of the carrier film is larger than the width of the material layers M1, M2, the material layers M1, M2 are substantially the same width and fit together, wherein the carrier film D can be coated with an adhesive to fix the material layers M1, M2 on the carrier film for easy processing and positioning. The bottom film D can be a PET film with the thickness of 20-130 μm as a base material, and when the first material has no viscosity towards one side of the bottom film, the base material is coated with adhesive such as silica gel or acrylic gel; when the first material has viscosity towards the bottom film, the substrate is coated with silicone oil or the like as a release agent. The embodiment is mainly used for processing sheet products with multiple layers of materials, and each material layer M1 and M2 can be made of materials such as PET, PE, foam, copper foil, graphite sheets and the like, and generally has a thinner thickness.

Fig. 5a and 5b show the product structure after the separation strip is placed on the first material layer and the positioning hole is machined, and fig. 5c shows the structure of the cutting die for machining the positioning hole. As shown in fig. 5a, 5b and 5c, a part of the separator F is placed on the material layer M2, a part of the separator F is placed on the material layer M2 to form a protruding end of the separator, the protruding length of the protruding end beyond the edge of the material layer M2 is preferably 2mm to 10mm, and the protruding end is preferably located inside the positioning hole D1, that is, when the separator is placed and the positioning hole is reworked, the separator is not processed, and when the separator is placed after the positioning hole is processed, the separator does not cover the positioning hole. The separating strip can be a PET substrate release film (one side of the PET film is coated with a release agent) with the thickness of 20-90 μm, a PET original film (two sides are not coated with adhesives or release agents and the like) or a PET substrate protective film (one side is coated with silica gel, the peeling force is less than 10g/25mm, and the separating strip is fixed better and has a certain viscosity, but the peeling force is smaller so as to be convenient to remove the separating strip). When the separator strip is a PET release film, its release-agent-free side is placed down on the layer of material M2 so that the separator strip can be partially bonded to the carrier film to fix the position of the separator strip. The cutter die K1 for forming the positioning holes has a cutter K11 to form the positioning holes D1 on both sides of the bottom die.

Fig. 6a and 6b show a schematic view of the product after placing a second layer of material on the separator strip and layer of material M2. As shown in fig. 6a and 6b, the material layer M3 as the second material layer is placed above the separating strip F and the material layer M2, and the material layer M3 may also be made of PET, PE, foam, copper foil, graphite sheet, etc., and has a small thickness. Since the separating strip F and the material layer M3 are both thin films, when covering the material layer M3, the other parts of the material layer 3 except the positions on the separating strip F can be attached to the material layer M2. When the separating strip adopts the PET release film, the surface with the release agent faces the material layer M3, but the position of the material layer M3 can also be fixed because the material layer M3 is partially attached with the material layer M2. The separator strip is partially clamped between the material layers M2 and M3, forming a clamping end of the separator strip.

Fig. 7a and 7b show schematic views of the product structure when the second material layer is partially die-cut, and fig. 7c shows the structure of the partially die-cut knife. As shown in fig. 7a, 7b and 7c, the extension of the clamping end of the dividing strip F between the material layers M2, M3 exceeds the area to be partially die-cut formed by the die-cutting outline J1 of the material layer M3, so that when the material layer M3 is partially die-cut, the knife mark falls on the dividing strip. A cutting die K2 of the partial die cutting M3 is provided with a cutting knife K21 and a positioning column K22, and during processing, the positioning column K22 penetrates into a positioning hole D1, and waste G1 is formed after processing.

Fig. 8a and 8b show a schematic view of the product after partial die cutting and removal of waste material. As shown in fig. 8a and 8b, die cut openings M31 are formed in the layer of material M3.

Fig. 9a and 9b show a schematic view of the product after removal of the separator strip. As shown in fig. 9a and 9b, the material layers M2, M3 are completely attached.

Fig. 10a and 10b show schematic views of a product structure when outer contour die cutting is performed, and fig. 10c shows a structure of a cutter for outer contour die cutting. As shown in fig. 10a, 10b and 10c, the layers of material M1, M2, M3 have an outer profile J2 to be processed, which after die cutting forms scrap G2. The cutter die K3 has a cutter K31 and a positioning post K32, and the positioning post K32 penetrates into the positioning hole D1 during processing. During two times of die cutting, the positioning column K22 and the positioning column K32 penetrate into the positioning hole D1, so that the accuracy of the local die cutting position relative to the outer contour can be guaranteed.

Fig. 11a and 11b show a schematic view of the product after outer profile die cutting and scrap removal. As shown in fig. 11a and 11b, the finished product P has material layers P1, P2 and P3, wherein the P3 has a partial cut-away portion P31.

When the required product has multiple material layers needing local die cutting, the material layers which are subjected to local die cutting and are attached to the lower material layers can be continuously covered, the separation strips are added between the material layers needing the local die cutting and the lower material layers, the clamping ends of the separation strips extend to cover and exceed the area to be subjected to the local die cutting, then the local die cutting is carried out, the separation strips are removed by utilizing the extending ends of the separation strips after the local die cutting is finished, and the die cutting of the outer contour is carried out until all the material layers are covered, so that the required product with accurate local die cutting positions of all the layers and no knife marks can be obtained.

Although the invention has been described with respect to preferred embodiments, it will be understood by those skilled in the art that various changes may be made without departing from the scope of the invention, and equivalents may be substituted for elements thereof without departing from the scope of the invention.

Claims

1. The die cutting processing method of the multilayer material comprises the following steps:

adding a separation strip: adding a separating strip between a first material layer and a second material layer needing local die cutting, wherein one end of the separating strip extends inwards from one side edge of the second material layer to cover and exceed an area to be processed, a clamping end is formed by the part of the separating strip clamped between the first material layer and the second material layer, and an extending end is formed by the part positioned outside the first material layer;

local die cutting: processing and die-cutting the second material layer in the area to be processed, and removing processing waste;

removing the separating strips: and separating the clamping end from the first material layer and the second material layer by using the extending end through external force so as to remove the separating strips and completely attach the first material layer and the second material layer.

2. The die cutting process for multilayer materials according to claim 1, wherein:

the separation strip is a PET film.

3. The die cutting process for multilayer materials according to claim 2, wherein:

and a release agent is coated on one surface of the separation strip facing the second material layer.

4. The die cutting process for multilayer materials according to claim 1, wherein:

the extension length of the extension end extending outwards from the side edge of the first material layer is 2mm to 10 mm.

5. The die cutting process for multilayer materials according to claim 1, wherein:

the method further includes die cutting the first and second plies of material to form the outer contour of the product after removing the separator strip.

6. The die cutting process of multi-layer material according to any one of claims 1 to 5, wherein:

the method further comprises the steps of placing the first material layer and the second material layer on a bottom film, wherein the width of the bottom film is larger than that of the material layers, namely, two side edges of the first material layer and two side edges of the second material layer are both located in the bottom film, and positioning holes are machined in the bottom film before local die cutting.

7. The die cutting process for multilayer materials according to claim 6, wherein:

the locating holes are formed in the two sides of the bottom film.

8. The die cutting process for multilayer materials according to claim 6, wherein:

the bottom film is a PET film coated with an adhesive, and the extending end is adhered to the bottom film.

9. The die cutting process for multilayer materials according to claim 1, wherein:

the method further includes the step of continuing to cover a third layer of material on the second layer of material after the partial die cutting of the second layer of material and the removal of the separator strip is completed.

10. The multilayer material die cutting process of claim 9, wherein;

the third material layer also comprises a material layer needing local die cutting, a second separating strip is added between the material layer needing local die cutting and the material layer below the material layer, one end of the second separating strip extends inwards from one side of the material layer needing local die cutting to cover and exceed an area to be locally die cut, the part of the second separating strip clamped between the material layer needing local die cutting and the material layer below the material layer forms a clamping end, and the part positioned outside the material layer below the material layer forms an extending end;

processing and die-cutting the material layer needing partial die cutting, and removing processing waste;

and removing the second separating strips by utilizing the extending ends of the second separating strips to ensure that the material layer subjected to local die cutting is completely attached to the material layer on the lower layer.