CN113185544A - Compound for packaging film, ink composition containing compound and packaging structure - Google Patents
Compound for packaging film, ink composition containing compound and packaging structure Download PDFInfo
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- CN113185544A CN113185544A CN202110573186.XA CN202110573186A CN113185544A CN 113185544 A CN113185544 A CN 113185544A CN 202110573186 A CN202110573186 A CN 202110573186A CN 113185544 A CN113185544 A CN 113185544A
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- ink composition
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- 150000001875 compounds Chemical class 0.000 title claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 title claims description 27
- 239000000203 mixture Substances 0.000 title claims description 24
- 229920006280 packaging film Polymers 0.000 title abstract description 9
- 239000012785 packaging film Substances 0.000 title abstract description 9
- 239000000178 monomer Substances 0.000 claims abstract description 22
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 10
- 239000010703 silicon Substances 0.000 claims abstract description 10
- 238000000016 photochemical curing Methods 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 38
- 239000012044 organic layer Substances 0.000 claims description 32
- 125000004432 carbon atom Chemical group C* 0.000 claims description 28
- 239000010408 film Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 20
- 229910052799 carbon Inorganic materials 0.000 claims description 14
- 238000005538 encapsulation Methods 0.000 claims description 12
- 239000003999 initiator Substances 0.000 claims description 9
- 125000006615 aromatic heterocyclic group Chemical group 0.000 claims description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 6
- 238000004132 cross linking Methods 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 5
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 229920005862 polyol Polymers 0.000 claims description 5
- 150000003077 polyols Chemical class 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 238000005303 weighing Methods 0.000 claims description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 125000003107 substituted aryl group Chemical group 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 claims description 2
- 239000012957 2-hydroxy-2-methyl-1-phenylpropanone Substances 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 125000003709 fluoroalkyl group Chemical group 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 2
- NWWQVENFTIRUMF-UHFFFAOYSA-N diphenylphosphanyl 2,4,6-trimethylbenzoate Chemical compound CC1=CC(C)=CC(C)=C1C(=O)OP(C=1C=CC=CC=1)C1=CC=CC=C1 NWWQVENFTIRUMF-UHFFFAOYSA-N 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 8
- 238000002834 transmittance Methods 0.000 abstract description 7
- 238000001723 curing Methods 0.000 abstract description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract description 3
- 239000004593 Epoxy Substances 0.000 abstract description 2
- 239000003085 diluting agent Substances 0.000 abstract description 2
- 125000003700 epoxy group Chemical group 0.000 abstract description 2
- 238000001020 plasma etching Methods 0.000 abstract description 2
- 229920006254 polymer film Polymers 0.000 abstract description 2
- -1 moisture Substances 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- VFZKVQVQOMDJEG-UHFFFAOYSA-N 2-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(=O)C=C VFZKVQVQOMDJEG-UHFFFAOYSA-N 0.000 description 5
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 4
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 4
- HMYYRTZLKNGGSN-UHFFFAOYSA-N [3,3,3-trihydroxy-2-methyl-1,1-di(prop-2-enoyloxy)propyl] prop-2-enoate Chemical compound C(C=C)(=O)OC(C(C(O)(O)O)C)(OC(C=C)=O)OC(C=C)=O HMYYRTZLKNGGSN-UHFFFAOYSA-N 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 150000005846 sugar alcohols Polymers 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- NBTQSAHFCNTNFP-UHFFFAOYSA-N [4-hydroxy-3,3-bis(hydroxymethyl)-1,1-di(prop-2-enoyloxy)butyl] prop-2-enoate Chemical compound C(C=C)(=O)OC(CC(CO)(CO)CO)(OC(C=C)=O)OC(C=C)=O NBTQSAHFCNTNFP-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 125000004386 diacrylate group Chemical group 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- IGGZRGUPRFINQE-UHFFFAOYSA-N (2,2-dimethyl-3-prop-2-enoyloxy-3-propoxypropyl) prop-2-enoate Chemical compound CCCOC(OC(=O)C=C)C(C)(C)COC(=O)C=C IGGZRGUPRFINQE-UHFFFAOYSA-N 0.000 description 1
- LGPAKRMZNPYPMG-UHFFFAOYSA-N (3-hydroxy-2-prop-2-enoyloxypropyl) prop-2-enoate Chemical compound C=CC(=O)OC(CO)COC(=O)C=C LGPAKRMZNPYPMG-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- JOWLLZXFBDTISW-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol methyl prop-2-eneperoxoate Chemical class C(C=C)(=O)OOC.OCC(C)(CO)C JOWLLZXFBDTISW-UHFFFAOYSA-N 0.000 description 1
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 description 1
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- VALXVSHDOMUUIC-UHFFFAOYSA-N 2-methylprop-2-enoic acid;phosphoric acid Chemical compound OP(O)(O)=O.CC(=C)C(O)=O VALXVSHDOMUUIC-UHFFFAOYSA-N 0.000 description 1
- GFLJTEHFZZNCTR-UHFFFAOYSA-N 3-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OCCCOC(=O)C=C GFLJTEHFZZNCTR-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- VSYDLUXFKAXBBY-UHFFFAOYSA-N C(C=1C(C(=O)O)=CC=CC1)(=O)O.C(C=C)(=O)O.C(C=C)(=O)O.C(COCCO)O Chemical compound C(C=1C(C(=O)O)=CC=CC1)(=O)O.C(C=C)(=O)O.C(C=C)(=O)O.C(COCCO)O VSYDLUXFKAXBBY-UHFFFAOYSA-N 0.000 description 1
- 241000948268 Meda Species 0.000 description 1
- 229920000604 Polyethylene Glycol 200 Polymers 0.000 description 1
- 229920002565 Polyethylene Glycol 400 Polymers 0.000 description 1
- 229920002582 Polyethylene Glycol 600 Polymers 0.000 description 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 1
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- JRWNODXPDGNUPO-UHFFFAOYSA-N oxolane;prop-2-enoic acid Chemical class C1CCOC1.OC(=O)C=C JRWNODXPDGNUPO-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000371 poly(diallyldimethylammonium chloride) polymer Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N tetrahydrofuran Substances C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Wrappers (AREA)
Abstract
The invention discloses a compound for a packaging film, which has a structural general formula as follows, wherein the structural general formula of the compound for the packaging film is as follows:
Description
Technical Field
The invention relates to the technical field of packaging films, in particular to a compound for a packaging film, an ink composition containing the compound and a packaging structure.
Background
Organic Light-Emitting Diodes (OLEDs for short) have the characteristics of all solid-state, active Light emission, high brightness, high contrast, ultra-thin and ultra-Light, low cost, low power consumption, no view angle limitation, wide working temperature range and the like, can be manufactured on a flexible, Light and durable plastic substrate, can realize flexible display in the true sense, and is a technology which can best meet the requirements of people on future displays.
For OLED devices, if the lifetime of the device is longer than 1 ten thousand hours, the Water Vapor Transmission Rate (WVTR) of the device needs to be less than 10 < -6 > g/m2(ii)/day, oxygen permeability (OTR) less than 10-5 g/(m)2D), which is a great challenge for the sealing structure of display devices, and therefore suitable OLED encapsulation technologies need to be developed.
The OLED packaging aims to isolate the light-emitting device from the environment, prevent invasion of undesirable substances such as moisture, oxygen and the like, prevent external force damage, stabilize various parameters of the device and further prolong the service life of the OLED. The OLED packaging mainly comprises cover plate packaging, filler packaging, laser packaging, film packaging and the like.
In the traditional cover plate packaging, the prepared substrate and the cover plate are bonded together by using epoxy resin in a glove box filled with inert gas to form a closed space to isolate the device from the external environment, and components such as water and oxygen in the air can only permeate into the device through the epoxy resin, so that the contact of the water and the oxygen in the air of each functional layer of the OLED is effectively prevented. The material of the package cover plate is generally glass or metal, but the light-tight property of the metal cover plate causes the application of the metal cover plate in the device package to be limited. Although the glass cover plate package has no light transmission problem, the toughness is poor and the glass cover plate package is fragile.
Therefore, how to provide a compound for an encapsulation film capable of providing the encapsulation film with high heat resistance and high light transmittance is a problem that needs to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, the present invention provides a compound for an encapsulation film having high heat resistance and high light transmittance, and an ink composition and an encapsulation structure comprising the same.
In order to achieve the purpose, the invention adopts the following technical scheme: a compound for an encapsulation film, the compound for an encapsulation film having a general structural formula as shown in chemical formula 1:
wherein R is1-R4Each independently selected from H, alkyl with carbon atom less than 30, alkoxy with carbon atom less than 30, fluorine-containing alkyl with carbon atom less than 30, aryl with carbon atom less than 30, substituted aryl with carbon atom less than 30, aromatic heterocyclic group with carbon atom less than 30, and substituted aromatic heterocyclic group with carbon atom less than 30;
X1-X2 are each independently selected from the group consisting of alkyl groups having less than 30 carbon atoms, alkoxy groups having less than 30 carbon atoms, fluoroalkyl groups having less than 30 carbon atoms, aryl groups having less than 30 carbon atoms, substituted aryl groups having less than 30 carbon atoms, aromatic heterocyclic groups having less than 30 carbon atoms, substituted aromatic heterocyclic groups having less than 30 carbon atoms,
or, each is independently selected from the following structures:
Y1-Y2 are each independently selected from a substituted acrylate group or an unsubstituted acrylate group.
Preferably, each of said Y1-Y2 is independently selected from the following structures:
Y3-Y10 are independently selected from any one of hydrogen or substituted or unsubstituted C1-C50 alkyl.
Wherein, is the bonding position of the element.
Preferably, the compound for encapsulating the thin film is selected from the following chemical formula 001-:
the invention also provides an ink composition, which comprises the following raw materials in percentage by weight: 15-80% of compound for packaging the film, 1-10% of photo-crosslinking initiator and 15-75% of photo-curing monomer.
The invention has the beneficial effects that: the invention has the beneficial effects that: the curable silicon-containing monomer of chemical formula 1 is used as a polymerized monomer, and because the benzene ring and the epoxy group are contained in the curable silicon-containing monomer, when the curable silicon-containing monomer is matched with a photocuring epoxy alkyl-containing diluent monomer, the formed polymer film has higher light transmittance, higher curing speed and lower plasma etching rate, thereby better meeting the requirements of packaging films in the prior art.
Preferably, the light-cured monomer is one or a combination of more of monofunctional methacrylate ester of C1-C30 monohydric alcohol or polyhydric alcohol, difunctional methacrylate ester of C2-C30 monohydric alcohol or polyhydric alcohol and multifunctional methacrylate ester of C3-C30 monohydric alcohol or polyhydric alcohol.
Preferably, the monofunctional methacrylate of the C1-C30 mono-or polyol is one or a combination of Lauryl Acrylate (LA), ethoxyethoxyethyl acrylate (EOEOEA) -KPX A007, Butyl Acrylate (BA), hydroxyethyl acrylate and isobornyl acrylate, ethoxylated tetrahydrofuran acrylate (THF (EO) A) -KPX A015, methacrylate phosphate and isobornyl methacrylate.
Preferably, the difunctional methacrylate of the C2-C30 mono-or polyol is one or a combination of two or more of diethylene glycol diacrylate (DEGDA), triethylene glycol diacrylate (TEGDA), ethylene glycol diacrylate, polyethylene glycol (200) diacrylate [ PEG (200) DA ], polyethylene glycol (400) diacrylate [ PEG (400) DA ], polyethylene glycol (600) diacrylate [ PEG (600) DA ], neopentyl glycol diacrylate and propoxy neopentyl glycol diacrylate, 1, 6-hexanediol diacrylate (HDDA), 1, 4-butanediol diacrylate (BDDA), 20 (ethoxy) bisphenol a diacrylate [ bpa (eo)20DA ], and glycerol diacrylate (TPGDA).
Preferably, the multifunctional methacrylate of the C3-C30 mono-or polyhydric alcohol is trimethylolpropane triacrylate (TMPTA), pentaerythritol triacrylate (PETA), trimethylolpropane triol triacrylate (TMPTMA), trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, pentaerythritol triallyl alcohol, propoxylated pentaerythritol allyl alcohol, ditrimethylolpropane tetraacrylate, triethylene glycol dimethacrylate, long chain aliphatic hydrocarbon glycidyl ether acrylate, dipentaerythritol hexaacrylate, tripropylene glycol diacrylate, diethylene glycol diacrylate Phthalate (PDDA), ethoxylated trimethylolpropane triol triacrylate [ TMP (EO) TMA ], propoxylated trimethylolpropane triol triacrylate [ TMP (PO) TMA ]), Propoxylated glycerol triacrylate [ G (PO) TA ], tris (2-hydroxyethyl) isocyanurate triacrylate and ethoxylated neopentyl glycol methoxy monoacrylate [ TMP (PO) MEDA ].
Preferably, the photo-crosslinking initiator is one or a combination of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide, 2-hydroxy-2-methyl-1-phenylpropanone and 2,4, 6-trimethylbenzoyl diphenyl phosphonite.
The invention also provides a preparation method of the ink composition, which comprises the following steps:
(1) weighing the raw materials according to the weight percentage of the ink composition for later use;
(2) and (3) uniformly stirring and mixing the compound for packaging the film, the photocrosslinking initiator and the photocuring monomer in vacuum, and filtering to obtain the ink composition.
Preferably, the vacuum stirring temperature is 40-60 ℃ and the time is 80-100 h.
The invention also provides a packaging structure, which is formed by alternately laminating the organic layer and the inorganic layer for more than 1 time, wherein the outermost layer is the inorganic layer;
the material of the organic layer is the ink composition, and the material of the inorganic layer is selected from any one or a combination of several of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, zirconium oxide, titanium oxide and zinc oxide.
The invention also provides a semiconductor device which comprises a functional structure and the packaging structure.
Preferably, the semiconductor device is any one of an electroluminescent device, a photoluminescent device, a lighting device, a light emitting diode, a solar cell, a thin film transistor, and a photodetector.
According to the technical scheme, compared with the prior art, the invention discloses and provides the compound for packaging the film, the ink composition containing the compound and the packaging structure, the ink composition prepared by the invention is prepared from the silicon-containing monomer, the photocuring monomer and the photoinitiator, and the silicon-containing monomer contains the aromatic ring and the Si atom of the rigid group in the molecular structure, so that compared with the ink composition without benzene ring and silicon atom, the ink composition has better heat resistance, transparency and lower water vapor transmission rate and oxygen transmission rate, and on the other hand, the excessive shrinkage volume generated during curing of the ink composition is reduced, and the prepared packaging structure is used for film packaging of an OLED device, can effectively block water and oxygen, improves the reliability and further prolongs the service life of the OLED device.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The preparation method of the packaging structure comprises the following steps:
step S1: treatment of organic layer materials
A compound for encapsulating a film (chemical formula 001), a photo-curing monomer (propylene glycol diacrylate), a crosslinking initiator (2,4, 6-trimethylbenzoyl-diphenylphosphine oxide);
weighing 20g of 001, 75g of propylene glycol diacrylate and 5g of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide, mixing together, stirring for 80h at 50 ℃ under vacuum, filtering by using a syringe filter, detecting by using a particle counter, and obtaining an organic layer material when the number of particles with the particle size of more than 0.5 mu m is detected to be not more than 50;
step S2: preparation of the inorganic layer
Selecting silicon nitride as an inorganic layer material, and coating the inorganic layer material on the surface of an object to be packaged by a CVD method to form an inorganic layer;
step S3: preparation of organic layer
Spraying the organic layer material on the surface of the inorganic layer by an ink-jet printer to form an organic layer, and adopting 100mW/cm2Ultraviolet light irradiation for 10 seconds each time causes the organic layer to harden;
step S4: formation of package structure
And depositing and coating the surface of the object to be packaged according to the alternating form of the inorganic layer and the organic layer to form a structure of a plurality of alternately formed inorganic layers and organic layers, ensuring that the outermost layer is the inorganic layer, and finally, depositing and coating the inorganic layer and the organic layer on the surface of the object to be packaged in an alternating and laminated structure to form the packaging structure.
Example 2:
the preparation method of the packaging structure comprises the following steps:
step S1: treatment of organic layer materials
A compound for encapsulating a film (chemical formula 002), a photocurable monomer (trihydroxymethyl propanetriol triacrylate), a crosslinking initiator (2,4, 6-trimethylbenzoyl diphenyl phosphonite);
weighing 20g of 002, 75g of trihydroxy methyl propanetriol triacrylate and 5g of 2,4, 6-trimethylbenzoyl diphenyl phosphonite, mixing together, stirring for 80 hours at 50 ℃ in vacuum, filtering by using a syringe filter, detecting by using a particle counter, and obtaining a treated organic layer material when the number of particles with the particle size of more than 0.5 mu m is detected to be not more than 50;
step S2: preparation of the inorganic layer
Selecting silicon nitride as an inorganic layer material, and coating the inorganic layer material on the surface of an object to be packaged by a CVD method to form an inorganic layer;
step S3: preparation of organic layer
Spraying the organic layer material on the surface of the inorganic layer by an ink-jet printer to form an organic layer, and adopting 100mW/cm2Ultraviolet light irradiation for 10 seconds each time causes the organic layer to harden;
step S4: formation of package structure
And depositing and coating the surface of the object to be packaged according to the alternating form of the inorganic layer and the organic layer to form a structure of a plurality of alternately formed inorganic layers and organic layers, ensuring that no more layers exist at the outermost side, and finally depositing and coating the alternately stacked inorganic layers and organic layers on the surface of the object to be packaged to obtain the packaging structure.
Example 3:
the preparation method of the packaging structure comprises the following steps:
step S1: treatment of organic layer materials
A compound for an encapsulation film (chemical formula 003), a photocurable monomer (dipentaerythritol hexaacrylate), a crosslinking initiator (2,4, 6-trimethylbenzoyl diphenyl phosphonite);
weighing 20g of 003, 75g of dipentaerythritol hexaacrylate and 5g of 2,4, 6-trimethylbenzoyl diphenyl phosphonite, mixing together, stirring for 80 hours at 50 ℃ under vacuum, filtering by using a syringe filter, detecting by using a particle counter, and obtaining an organic layer material when the number of particles with the particle size of more than 0.5 mu m is not more than 50;
step S2: preparation of the inorganic layer
Selecting silicon nitride as an inorganic layer material, and coating the inorganic layer material on the surface of an object to be packaged by a CVD method to form an inorganic layer;
step S3: preparation of organic layer
Spraying the organic layer material on the surface of the inorganic layer by using an ink-jet printer to form an organic layer, and adopting 100mW/cm2Ultraviolet light irradiation for 10 seconds each time causes the organic layer to harden;
step S4: formation of package structure
And depositing and coating the surface of the object to be packaged into a structure of a plurality of alternately formed inorganic layers and organic layers according to the alternating form of the inorganic layers and the organic layers, ensuring that the outermost layer is the inorganic layer, and finally depositing and coating the alternately stacked inorganic layers and organic layers on the surface of the object to be packaged to obtain the packaging structure.
Example 4:
the manufacturing method of the package structure is different from that of embodiment 1 in that, in step S1: 20g of formula 001 was replaced with 30g of formula 001, and 75g of propylene glycol diacrylate was replaced with 60g of propylene glycol diacrylate.
Example 5:
the manufacturing method of the package structure is different from that of embodiment 2 in that, in step S1: 20g of formula 002 was replaced with 30g of formula 002 and 75g of trihydroxy methyl propane triol triacrylate was replaced with 60g of trihydroxy methyl propane triol triacrylate.
Example 6:
a method for manufacturing a package structure,
the manufacturing method of the package structure is different from that of embodiment 3 in that, in step S1: 20g of formula 003 are replaced by 30g of formula 003, 75g of dipentaerythritol hexaacrylate are replaced by 60g of dipentaerythritol hexaacrylate.
Comparative example 1
The ink composition was different from example 1 in that 98g of propylene glycol diacrylate and 2g of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide were used instead of adding the compound for encapsulating the film.
Performance test experiment
The packaging structures of examples 1 to 6 and comparative example 1 were subjected to water vapor transmission rate detection by a detection apparatus: the manufacturer is a high-precision water vapor transmission rate tester with model number of AQUARAN2, manufactured by MOCON corporation (American Membrane health corporation); detection conditions are as follows: the temperature is 85 ℃, and the relative humidity is 85%; detection duration: 24 hours;
the light transmittance was measured for the package structures of examples 1 to 6 and comparative example 1, and the measurement instrument: a light transmittance tester; detection conditions are as follows: the temperature is 40 ℃, and the relative humidity is 85 percent;
the test results are given in table 1 below:
table 1 performance test structures of package structures of examples 1 to 6 and comparative example 1
| Group of | Water vapor transmission rate (g/m)2·d) | Light transmittance (%) |
| Example 1 | 4.0*10-4 | 85 |
| Example 2 | 3.8*10-4 | 87 |
| Example 3 | 3.9*10-4 | 85 |
| Example 4 | 4.0*10-4 | 86 |
| Example 5 | 4.1*10-4 | 86 |
| Example 6 | 3.8*10-4 | 87 |
| Comparative example 1 | 9.0*10-3 | 86 |
As can be seen from table 1 above, the water vapor transmission rate of the package structure added in the present invention is significantly lower than that of the package structure not added in the present invention; the organic light-emitting device is packaged by the packaging film, so that moisture can be effectively isolated, and the service life of the organic light-emitting device is prolonged.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A compound for an encapsulation film, wherein the compound for an encapsulation film has a general structural formula as shown in formula 1 below:
wherein R is1-R4Each independently selected from H, alkyl with carbon atom less than 30, alkoxy with carbon atom less than 30, fluorine-containing alkyl with carbon atom less than 30, aryl with carbon atom less than 30, substituted aryl with carbon atom less than 30, aromatic heterocyclic group with carbon atom less than 30, and substituted aromatic heterocyclic group with carbon atom less than 30;
X1-X2 are each independently selected from the group consisting of alkyl groups having less than 30 carbon atoms, alkoxy groups having less than 30 carbon atoms, fluoroalkyl groups having less than 30 carbon atoms, aryl groups having less than 30 carbon atoms, substituted aryl groups having less than 30 carbon atoms, aromatic heterocyclic groups having less than 30 carbon atoms, substituted aromatic heterocyclic groups having less than 30 carbon atoms,
or, each is independently selected from the following structures:
Y1-Y2 are each independently selected from a substituted acrylate group or an unsubstituted acrylate group.
2. A compound for encapsulating films as claimed in claim 1 wherein each of Y1-Y2 is independently selected from the following structures:
Y3-Y10 are independently selected from any one of hydrogen or substituted or unsubstituted C1-C50 alkyl.
Wherein, is the bonding position of the element.
3. The compound for encapsulating film as claimed in claim 1, wherein the compound for encapsulating film is selected from the group consisting of formula 001-:
4. the ink composition is characterized by comprising the following raw materials in percentage by weight: 15-80% of the compound for encapsulating films as claimed in any one of claims 1-3, 1-10% of a photocrosslinking initiator, and 15-75% of a photocurable monomer.
5. The ink composition of claim 4, wherein the photo-curable monomer is one or more of a monofunctional methacrylate of C1-C30 mono-or polyol, a difunctional methacrylate of C2-C30 mono-or polyol, and a multifunctional methacrylate of C3-C30 mono-or polyol.
6. The ink composition of claim 4, wherein the photo-crosslinking initiator is one or more of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide, 2-hydroxy-2-methyl-1-phenylpropanone, and 2,4, 6-trimethylbenzoyl diphenylphosphinite.
7. A method of preparing an ink composition, comprising the steps of:
(1) weighing the raw materials according to the weight percentage of the ink composition of any one of claims 4 to 6 for later use;
(2) the compound for encapsulating films, the photocrosslinking initiator and the photocuring monomer according to claim 1 or 2 are stirred and mixed uniformly in vacuum, and then the mixture is filtered to obtain the ink composition.
8. The method of claim 7, wherein the vacuum stirring temperature is 40-60 ℃ and the time is 80-100 h.
9. The packaging structure is characterized in that the packaging structure is formed by alternately laminating an inorganic layer and an organic layer for more than 1 time, and the outermost layer is an inorganic layer;
wherein, the material of the organic layer is the ink composition as defined in any one of claims 4 to 6 or the ink composition prepared in claim 7 or 8, and the material of the inorganic layer is selected from any one or combination of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, zirconium oxide, titanium oxide and zinc oxide.
10. The thin film encapsulation structure according to claim 9, wherein the thickness of the thin film encapsulation structure is 0.3-20 μm, and the thickness of the organic layer is greater than the thickness of the inorganic layer.
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Application publication date: 20210730 |