CN113181680A - Extraction proportion blending equipment for preparing new semiconductor material - Google Patents
Extraction proportion blending equipment for preparing new semiconductor material Download PDFInfo
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- CN113181680A CN113181680A CN202110457896.6A CN202110457896A CN113181680A CN 113181680 A CN113181680 A CN 113181680A CN 202110457896 A CN202110457896 A CN 202110457896A CN 113181680 A CN113181680 A CN 113181680A
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- 238000002156 mixing Methods 0.000 title claims abstract description 40
- 239000000463 material Substances 0.000 title claims abstract description 32
- 239000004065 semiconductor Substances 0.000 title claims abstract description 30
- 238000000605 extraction Methods 0.000 title claims abstract description 29
- 238000003756 stirring Methods 0.000 claims abstract description 24
- 230000000694 effects Effects 0.000 claims abstract description 9
- 229920001821 foam rubber Polymers 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000001179 sorption measurement Methods 0.000 claims description 24
- 238000005192 partition Methods 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 230000000994 depressogenic effect Effects 0.000 abstract description 5
- 239000011229 interlayer Substances 0.000 abstract description 4
- 208000004350 Strabismus Diseases 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract description 2
- 239000007787 solid Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- 239000010410 layer Substances 0.000 description 11
- 230000005484 gravity Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 238000009825 accumulation Methods 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D11/00—Solvent extraction
- B01D11/02—Solvent extraction of solids
- B01D11/0215—Solid material in other stationary receptacles
- B01D11/0253—Fluidised bed of solid materials
- B01D11/0257—Fluidised bed of solid materials using mixing mechanisms, e.g. stirrers, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2221/00—Applications of separation devices
- B01D2221/14—Separation devices for workshops, car or semiconductor industry, e.g. for separating chips and other machining residues
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Extraction Or Liquid Replacement (AREA)
Abstract
The invention discloses extraction proportion blending equipment for preparing a new semiconductor material, which structurally comprises a motor, a blending tank, supports and a discharge pipe, wherein the motor is vertically connected to the upper end of the blending tank; the allotment jar is by the heater, the stirring cabinet, the puddler, the bulkhead is constituteed, the heater inlays solid connection in both sides about the stirring cabinet top, puddler activity block in the stirring cabinet middle part, bulkhead and heater integrated structure, can contact intercepting device when heating in-process steam rises, its inflation piece is heated and can be expanded to the left and right sides, the kicking block can be contacted to the protruding piece when the inflation, and then be close to slowly to depressed groove department, make the spherical end laminating of kicking block in inboard slowly squint, can drive the foam-rubber cushion and slide under the injecing of spout along with the in-process of kicking block skew, outwards expand into plane, absorb steam, prevent to enter into and connect interlayer department.
Description
Technical Field
The invention belongs to the field of new semiconductor material preparation, and particularly relates to extraction proportion blending equipment for preparing a new semiconductor material.
Background
The extraction proportion blending equipment is mass transfer equipment for extraction operation, can realize perfect separation of components contained in a material liquid, and achieves the effects of separation and purification by putting raw materials into the equipment and continuously overturning and separating impurities in the materials in the heating process in the preparation process of a new semiconductor material.
Based on the findings of the inventor, the following defects mainly exist in the prior art, such as: when equipment extracts new semiconductor materials, because when the equipment heats and evaporates the material solution through the heating device, part of steam of the equipment can enter the connecting interlayer in the heating device in the rising process and is continuously converged into water drops to be attached to the connecting interlayer, so that the water drops in the heating device can slowly slide into the equipment along the gap and are mixed with the solution again when the equipment is cooled at low temperature after extraction is finished, and the purity of the extracted materials can be influenced.
Therefore, it is necessary to provide an apparatus for adjusting the specific gravity for preparing a new semiconductor material.
Disclosure of Invention
To solve the problems of the above-described technology.
The invention relates to a purpose and an effect of extraction proportion blending equipment for preparing a new semiconductor material, which are achieved by the following specific technical means: the structure of the device comprises a motor, a blending tank, a bracket and a discharge pipe, wherein the motor is vertically connected to the upper end of the blending tank, the blending tank is welded between the brackets, and the discharge pipe is fixedly connected to the lower end of the blending tank; the blending tank is composed of a heater, a stirring cabin, a stirring rod and a partition frame, the heater is fixedly embedded in the left side and the right side above the stirring cabin, the stirring rod is movably clamped in the middle of the stirring cabin, and the partition frame and the heater are of an integrated structure.
The partition frame is composed of a collecting device, an outer frame, a connecting layer and an intercepting device, the collecting device is fixedly connected to the lower end of the outer frame in an embedded mode, the connecting layer is located at the upper end of the intercepting device, the intercepting device is movably clamped above the collecting device and is in a triangular shape, and meanwhile sponge cushions are distributed on the inner side of the intercepting device.
The intercepting device comprises an embedded plate, a flowing frame, an adsorption plate and a guide block, wherein the embedded plate is connected to the inner side of the flowing frame in a riveting mode, the adsorption plate is movably clamped to the outer side of the embedded plate, the guide block is located at the lower end of the adsorption plate, the adsorption plate is provided with six adsorption plates, the adsorption plates are installed at different positions in the embedded plate, and holes are formed in the surface of the adsorption plate.
Wherein, the adsorption plate comprises foam-rubber cushion, kicking block, semicircle board, inflation piece, spout, the foam-rubber cushion activity card fits the spout inboardly, the kicking block is located the inflation piece left and right sides, the vertical connection in semicircle board upper end middle part of inflation piece, the spout inlays to be connected in the semicircle inboard, the kicking block is equipped with two, and the symmetry is installed in the inflation piece left and right sides, and the texture is comparatively hard.
Wherein, the inflation piece comprises depressed groove, expansion piece, protruding block, the depressed groove is embedded and is connected in the expansion piece left and right sides, protruding piece activity block in the depressed groove outside, protruding piece surface is comparatively crude, and the inboard fretwork form that is.
The collecting device is composed of a partition piece, supporting blocks, an accumulation groove and a collection block, the partition piece is fixedly embedded between the supporting blocks, the supporting blocks are located at the upper end of the accumulation groove, the collection block is connected to the upper end of the supporting blocks in a welding mode, the collection block inclines at a certain angle and gathers towards the middle, and the surface of the collection block is smooth.
The baffle piece comprises a swing plate, an inner layer, two sticking blocks and two springs, wherein the swing plate is movably clamped on the inner side of the inner layer, the sticking blocks are positioned at the lower end of the swing plate, the springs are in threaded connection with the outer side of the swing plate, and the swing plate is arranged on the inner side of the inner layer in a triangular shape.
The sticking block is composed of an embedded and fixed frame, a triangular block and a magnetic block, the embedded and fixed frame and the triangular block are of an integrated structure, the magnetic block is movably clamped on the inner side of the embedded and fixed frame, the surface of the magnetic block is relatively protruded, and the magnetic block is made of magnetic materials.
Compared with the prior art, the invention has the following beneficial effects:
1. can contact intercepting device when heating process steam rises, its inflation piece is heated and can be expanded to the left and right sides, and the kicking block can be contacted to the protruding piece when the inflation, and then slowly is close to depressed groove department, makes the spherical end laminating of kicking block in inboard slowly squint, and the in-process along with the kicking block skew can drive the foam-rubber cushion and slide under the injecing of spout, outwards expandes into plane, absorbs steam, prevents to enter into and connects interlayer department.
2. The water drops falling from the intercepting device can flow to the baffle part at the middle part along the inclined outer contour under the guiding of the baffle of the collecting block, then the plate is swung to separate the magnetic blocks adsorbed at the tail ends of the plate, and then the plate swings to the left side and the right side under the control of the spring, the middle part is opened for a certain distance to ensure that the water drops are completely collected to the accumulation groove to be collected, and accumulation is avoided.
Drawings
FIG. 1 is a schematic structural diagram of an apparatus for adjusting an extraction specific gravity for manufacturing a new semiconductor material according to the present invention.
FIG. 2 is a schematic structural diagram of a blending tank of an extraction specific gravity blending device for preparing a new semiconductor material according to the present invention.
FIG. 3 is a schematic structural diagram of a spacer frame of an extraction specific gravity blending device for preparing a new semiconductor material according to the present invention.
Fig. 4 is a schematic structural diagram of an interception device of an extraction specific gravity blending device for preparing a new semiconductor material according to the present invention.
Fig. 5 is a schematic structural diagram of an adsorption plate of an extraction specific gravity adjusting device for preparing a new semiconductor material according to the present invention.
Fig. 6 is a schematic structural diagram of an expansion block of an extraction specific gravity blending device for preparing a new semiconductor material.
Fig. 7 is a schematic structural diagram of a collecting device of an extraction specific gravity blending device for preparing a new semiconductor material according to the present invention.
FIG. 8 is a schematic structural diagram of a barrier of an apparatus for adjusting an extraction specific gravity for preparing a new semiconductor material according to the present invention.
Fig. 9 is a schematic structural diagram of an extraction specific gravity adjusting device pasting block for new semiconductor material preparation according to the present invention.
In the figure: the device comprises a motor-1, a blending tank-2, a bracket-3, a discharge pipe-4, a heater-21, a stirring cabin-22, a stirring rod-23, a partition frame-24, a collecting device-241, an outer frame-242, a connecting layer-243, an intercepting device-244, an embedded connecting plate-441, a flowing frame-442, an adsorption plate-443, a guide block-444, a sponge cushion-431, a top block-432, a semicircular plate-433, an expansion block-434, a sliding groove-435, a concave groove-341, an expansion sheet-342, a convex block-343, a partition piece-411, a supporting block-412, a stacking groove-413, a collection block-414, a swinging plate-111, an inner layer-112, an adhesive block-113, a spring-114, an embedded frame-131, a triangular block-132 and a magnetic block-133.
Detailed Description
The invention is further described below with reference to the accompanying drawings:
example 1:
as shown in figures 1 to 6:
the invention provides extraction proportion blending equipment for preparing a new semiconductor material, which structurally comprises a motor 1, a blending tank 2, supports 3 and a discharge pipe 4, wherein the motor 1 is vertically connected to the upper end of the blending tank 2, the blending tank 2 is connected between the supports 3 in a welding manner, and the discharge pipe 4 is fixedly connected to the lower end of the blending tank 2 in an embedding manner; the blending tank 2 is composed of a heater 21, a stirring cabin 22, a stirring rod 23 and a partition frame 24, the heater 21 is fixedly embedded in the left side and the right side above the stirring cabin 22, the stirring rod 23 is movably clamped in the middle of the stirring cabin 22, and the partition frame 24 and the heater 21 are of an integrated structure.
The bulkhead 24 is composed of a collecting device 241, an outer frame 242, a connecting layer 243 and an intercepting device 244, the collecting device 241 is fixedly embedded at the lower end of the outer frame 242, the connecting layer 243 is located at the upper end of the intercepting device 244, the intercepting device 244 is movably clamped above the collecting device 241, the intercepting device 244 is triangular, and sponge pads are distributed on the inner side of the intercepting device 244, so that water vapor can be effectively absorbed when rising, and can be isolated from the outer side to prevent the water vapor from entering the heater.
The intercepting device 244 is composed of an embedded plate 441, a flow frame 442, an adsorption plate 443, and a guide block 444, the embedded plate 441 is riveted on the inner side of the flow frame 442, the adsorption plate 443 is movably clamped on the outer side of the embedded plate 441, the guide block 444 is located at the lower end of the adsorption plate 443, six adsorption plates 443 are arranged on the surface of the adsorption plate 443, the adsorption plates are mounted at different positions in the embedded plate 441, and the adsorption plates 443 can be used for intercepting when water vapor rises, so that the water vapor is prevented from being accumulated in a connection partition layer.
Wherein, adsorption plate 443 comprises foam-rubber cushion 431, kicking block 432, semicircle board 433, inflation piece 434, spout 435, foam-rubber cushion 431 activity block is inboard in spout 435, kicking block 432 is located the inflation piece 434 left and right sides, the vertical connection in semicircle board 433 of inflation piece 434 is middle part, spout 435 is embedded to be connected in semicircle board 433 inboardly, kicking block 432 is equipped with two, and the symmetry is installed in the inflation piece 434 left and right sides, and the texture is comparatively hard, is convenient for be heated when expanding block 434 and expanding to the left and right sides, through kicking block 432 control foam-rubber cushion 431's expansion degree, is convenient for absorb moisture.
The expansion block 434 is composed of a concave groove 341, an expansion piece 342 and a convex block 343, the concave groove 341 is fixedly embedded in the left side and the right side of the expansion piece 342, the convex block 343 is movably clamped outside the concave groove 341, the surface of the convex block 343 is rough, and the inner side of the convex block 343 is hollow, so that certain friction force can be increased conveniently, and the separation and the offset during contact can be avoided.
The specific use mode and function of the embodiment are as follows:
when the semiconductor device is used, a new semiconductor material is placed into the stirring cabin 22 in the blending tank 2, the heater 21 is prompted to heat under the power action of the motor 1 to extract a solution in the stirring cabin 22, the stirring rod 23 is simultaneously matched to rotate at a constant speed in the stirring cabin 22 to accelerate the extraction speed, the lower end of the heater 21 is provided with the partition frame 24, the outer frame 242 is connected with the heater 21, water vapor in the heating process of the semiconductor device rises and contacts the intercepting device 244 in the partition frame 24, then the intercepting device 244 is internally distributed with the adsorption plates 443, the expansion blocks 434 in the semicircular plates 433 expand towards the left and right sides under the heating, the expansion blocks 343 in the expansion blocks 434 contact the top block 432 and then approach the concave groove 341 slowly to prompt the spherical end of the top block 432 to be attached to the inner side to slowly deviate, and the sponge pad 431 is driven to slide under the limitation of the sliding groove 435 in the deviation process of the top block 432, the sponge pad 431 is expanded to be flat, water vapor is absorbed, when the sponge pad is cooled after extraction is completed, the expansion block 434 is contracted to promote the sponge pad 431 to be reduced to be triangular, absorbed water is extruded in the reduction and contraction process, the absorbed water is promoted to flow along the outline of the flow frame 442 to be discharged into the collecting device 241 under the baffle of the guide block 444, the collection is convenient, and finally the solution is discharged from the discharge pipe 4 after extraction.
Example 2:
as shown in fig. 7 to 9:
the collecting device 241 is composed of a partition 411, a supporting block 412, a stacking groove 413 and a collecting block 414, the partition 411 is fixedly embedded between the supporting blocks 412, the supporting block 412 is positioned at the upper end of the stacking groove 413, the collecting block 414 is welded and connected to the upper end of the supporting block 412, the collecting block 414 inclines at a certain angle and gathers towards the middle, the surface is smooth, water drops can slide along the surface, and then the water drops are collected at the partition 411, so that a guiding effect is achieved.
The blocking member 411 is composed of a swing plate 111, an inner layer 112, an adhesive block 113 and springs 114, the swing plate 111 is movably clamped inside the inner layer 112, the adhesive block 113 is located at the lower end of the swing plate 111, the springs 114 are in threaded connection with the outer side of the swing plate 111, two swing plates 111 are arranged inside the inner layer 112 in a triangular shape, so that the openings of the two swing plates are closed after collected water drops flow in, and the overflow caused by vibration during processing is prevented.
The sticking block 113 is composed of an embedded frame 131, a triangular block 132 and a magnetic block 133, the embedded frame 131 and the triangular block 132 are of an integrated structure, the magnetic block 133 is movably clamped inside the embedded frame 131, the surface of the magnetic block 133 is relatively protruded and made of a magnetic material, so that the opening position of the device can be conveniently controlled to be closed, and water drops collected by the device can be prevented from being discharged again.
The specific use mode and function of the embodiment are as follows:
the water drops falling from the interception device 244 flow to the middle barrier 411 along the inclined outer profile under the guidance of the barrier of the collection block 414 in the collection device 241, then the water drops can press the swing plate 111 in the barrier 411 to separate the magnetic blocks 133 in the adhesive blocks 113 adsorbed at the tail ends of the water drops, then the water drops swing to the left and right sides under the control of the spring 114, the middle part of the water drops is opened for a certain distance to be completely collected to the accumulation groove 413 for collection, when the water drops completely flow in, the swing plate 111 can swing to the middle part under the action of the elastic force of the spring 114, and the magnetic blocks 133 wrapped on the inner side of the embedding frame 131 can be contacted again when the water drops swing to a certain distance, the adsorption is closed, so that the barrier 411 is in a closed state, and the water drops collected in the accumulation groove 413 are prevented from being discharged again.
The technical solutions of the present invention or similar technical solutions designed by those skilled in the art based on the teachings of the technical solutions of the present invention are all within the scope of the present invention to achieve the above technical effects.
Claims (8)
1. The extraction proportion blending device for preparing the new semiconductor material structurally comprises a motor (1), a blending tank (2), supports (3) and a discharge pipe (4), wherein the motor (1) is vertically connected to the upper ends of the blending tank (2), the blending tank (2) is connected between the supports (3) in a welding mode, and the discharge pipe (4) is fixedly connected to the lower end of the blending tank (2); the method is characterized in that:
the blending tank (2) is composed of a heater (21), a stirring cabin (22), a stirring rod (23) and a partition frame (24), the heater (21) is fixedly connected to the left side and the right side above the stirring cabin (22), the stirring rod (23) is movably clamped in the middle of the stirring cabin (22), and the partition frame (24) and the heater (21) are of an integrated structure.
2. The extraction proportion blending device for preparing the new semiconductor material as claimed in claim 1, wherein: the separation frame (24) is composed of a collecting device (241), an outer frame (242), a connecting layer (243) and an intercepting device (244), the collecting device (241) is fixedly embedded at the lower end of the outer frame (242), the connecting layer (243) is located at the upper end of the intercepting device (244), and the intercepting device (244) is movably clamped above the collecting device (241).
3. The extraction proportion blending device for preparing the new semiconductor material as claimed in claim 2, wherein: the intercepting device (244) is composed of an embedding plate (441), a flowing frame (442), an adsorption plate (443) and a guide block (444), the embedding plate (441) is connected to the inner side of the flowing frame (442) in a riveting mode, the adsorption plate (443) is movably clamped to the outer side of the embedding plate (441), and the guide block (444) is located at the lower end of the adsorption plate (443).
4. The extraction proportion blending device for preparing the new semiconductor material as claimed in claim 3, wherein: adsorption plate (443) comprises foam-rubber cushion (431), kicking block (432), semicircle board (433), inflation piece (434), spout (435), activity block in spout (435) of foam-rubber cushion (431) is inboard, kicking block (432) are located inflation piece (434) left and right sides, inflation piece (434) are vertical to be connected in semicircle board (433) upper end middle part, spout (435) are embedded to be fixed and are connected in semicircle board (433) inboard.
5. The extraction proportion blending device for preparing the new semiconductor material as claimed in claim 4, wherein: the expansion block (434) is composed of a concave groove (341), an expansion piece (342) and a convex block (343), the concave groove (341) is fixedly connected with the left side and the right side of the expansion piece (342), and the convex block (343) is movably clamped outside the concave groove (341).
6. The extraction proportion blending device for preparing the new semiconductor material as claimed in claim 2, wherein: the collecting device (241) is composed of blocking pieces (411), supporting blocks (412), a stacking groove (413) and a collecting block (414), the blocking pieces (411) are fixedly embedded between the supporting blocks (412), the supporting blocks (412) are located at the upper end of the stacking groove (413), and the collecting block (414) is connected to the upper end of the supporting blocks (412) in a welding mode.
7. The extraction proportion blending device for preparing the new semiconductor material as claimed in claim 6, wherein: the baffle piece (411) is composed of a swing plate (111), an inner layer (112), an adhesive block (113) and a spring (114), the swing plate (111) is movably clamped at the inner side of the inner layer (112), the adhesive block (113) is positioned at the lower end of the swing plate (111), and the spring (114) is in threaded connection with the outer side of the swing plate (111).
8. The extraction proportion blending device for preparing the new semiconductor material as claimed in claim 7, wherein: the sticking block (113) is composed of an embedding and fixing frame (131), a triangular block (132) and a magnetic block (133), the embedding and fixing frame (131) and the triangular block (132) are of an integrated structure, and the magnetic block (133) is movably clamped on the inner side of the embedding and fixing frame (131).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110457896.6A CN113181680A (en) | 2021-04-27 | 2021-04-27 | Extraction proportion blending equipment for preparing new semiconductor material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110457896.6A CN113181680A (en) | 2021-04-27 | 2021-04-27 | Extraction proportion blending equipment for preparing new semiconductor material |
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| Publication Number | Publication Date |
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| CN113181680A true CN113181680A (en) | 2021-07-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110457896.6A Pending CN113181680A (en) | 2021-04-27 | 2021-04-27 | Extraction proportion blending equipment for preparing new semiconductor material |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1391972A (en) * | 2002-05-10 | 2003-01-22 | 国家中药制药工程技术研究中心 | Microwave extracting device for Chinese medicine |
| CN208465245U (en) * | 2018-05-29 | 2019-02-05 | 深圳市永沣香料有限公司 | A kind of flavouring essence for tobacco processing extraction equipment |
| CN209123399U (en) * | 2018-06-30 | 2019-07-19 | 潍坊新绿化工有限公司 | A kind of chemical industry mixed solution extraction equipment |
| CN209809567U (en) * | 2018-12-25 | 2019-12-20 | 广西硕果农业开发有限公司 | Pineapple sakyamuni extraction tank |
| CN212818259U (en) * | 2020-07-30 | 2021-03-30 | 安徽聚丰检验检测有限公司 | Ultrasonic extraction equipment for food pesticide residue detection pretreatment |
-
2021
- 2021-04-27 CN CN202110457896.6A patent/CN113181680A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1391972A (en) * | 2002-05-10 | 2003-01-22 | 国家中药制药工程技术研究中心 | Microwave extracting device for Chinese medicine |
| CN208465245U (en) * | 2018-05-29 | 2019-02-05 | 深圳市永沣香料有限公司 | A kind of flavouring essence for tobacco processing extraction equipment |
| CN209123399U (en) * | 2018-06-30 | 2019-07-19 | 潍坊新绿化工有限公司 | A kind of chemical industry mixed solution extraction equipment |
| CN209809567U (en) * | 2018-12-25 | 2019-12-20 | 广西硕果农业开发有限公司 | Pineapple sakyamuni extraction tank |
| CN212818259U (en) * | 2020-07-30 | 2021-03-30 | 安徽聚丰检验检测有限公司 | Ultrasonic extraction equipment for food pesticide residue detection pretreatment |
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Application publication date: 20210730 |
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