CN113177492A - Ultrasonic fingerprint identification assembly and intelligent terminal - Google Patents
Ultrasonic fingerprint identification assembly and intelligent terminal Download PDFInfo
- Publication number
- CN113177492A CN113177492A CN202110498744.0A CN202110498744A CN113177492A CN 113177492 A CN113177492 A CN 113177492A CN 202110498744 A CN202110498744 A CN 202110498744A CN 113177492 A CN113177492 A CN 113177492A
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- conductive adhesive
- circuit board
- adhesive layer
- fingerprint identification
- conductive
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
- G06F21/31—User authentication
- G06F21/32—User authentication using biometric data, e.g. fingerprints, iris scans or voiceprints
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/147—Details of sensors, e.g. sensor lenses
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1347—Preprocessing; Feature extraction
- G06V40/1359—Extracting features related to ridge properties; Determining the fingerprint type, e.g. whorl or loop
Abstract
The invention relates to an ultrasonic fingerprint identification module and an intelligent terminal, wherein the ultrasonic fingerprint identification module comprises a cover plate, an ultrasonic fingerprint identification assembly and a conductive adhesive layer arranged between the cover plate and the ultrasonic fingerprint identification assembly, wherein: ultrasonic fingerprint identification subassembly includes fingerprint sensor, circuit board and the driver chip of setting on the circuit board, fingerprint sensor passes through conductive adhesive layer and laminates in the apron, the circuit board respectively with fingerprint sensor, driver chip, conductive adhesive layer electricity is connected, driver chip is used for monitoring conductive adhesive layer's electric capacity through the circuit board, and start ultrasonic wave fingerprint sensing through circuit board control fingerprint sensor when conductive adhesive layer's electric capacity changes, the user points and makes conductive adhesive layer's electric capacity change, driver chip passes through the electric capacity change production start signal of circuit board control to conductive adhesive layer, fingerprint sensor starts ultrasonic wave fingerprint sensing after receiving start signal, realize the fingerprint unblock and awaken the screen up, need not to continuously transmit the ultrasonic wave, reduce the consumption.
Description
Technical Field
The invention relates to the technical field of display, in particular to an ultrasonic fingerprint identification assembly and an intelligent terminal.
Background
With the improvement of the information security protection consciousness of people, more and more display devices adopt a fingerprint identification technology, and in order to pursue a better visual effect, a comprehensive screen with the function of fingerprint identification under the screen is produced. The ultrasonic fingerprint identification becomes an important development direction of the fingerprint identification under the full-screen by the characteristics of strong penetrability and good identification effect.
Present ultrasonic fingerprint identification subassembly is including the TFT (Thin Film Transistor) base plate that stacks gradually the setting, the piezoelectric layer, the electrode layer, DAF (Die Attach Film), the cementing layer, the laminating of ultrasonic fingerprint identification subassembly is under glass cover plate, the driver chip of ultrasonic fingerprint identification subassembly all exports discontinuous sine wave voltage at any moment and applys to TFT base plate and electrode layer on, the piezoelectric layer converts the signal of telecommunication into discontinuous ultrasonic signal transmission, under the intelligent terminal black screen state, the long fingerprint chip induction zone of pressing of user finger, the screen is awaken up successfully in the fingerprint unblock, but because ultrasonic fingerprint identification subassembly needs continuously to transmit the ultrasonic wave, lead to the consumption of ultrasonic fingerprint identification subassembly great.
Disclosure of Invention
Based on this, it is necessary to provide an ultrasonic fingerprint identification module and intelligent terminal to the great problem of consumption of above-mentioned ultrasonic fingerprint identification subassembly.
The invention provides an ultrasonic fingerprint identification module, which comprises a cover plate, an ultrasonic fingerprint identification assembly and a conductive adhesive layer arranged between the cover plate and the ultrasonic fingerprint identification assembly, wherein:
ultrasonic fingerprint identification subassembly includes fingerprint sensor, circuit board and sets up driver chip on the circuit board, fingerprint sensor passes through conductive adhesive layer laminate in the apron, the circuit board respectively with fingerprint sensor driver chip the conductive adhesive layer electricity is connected, driver chip is used for passing through the circuit board control conductive adhesive layer's electric capacity, and pass through when conductive adhesive layer's electric capacity changes circuit board control fingerprint sensor starts ultrasonic fingerprint sensing.
Above-mentioned ultrasonic fingerprint identification module, when the fingerprint response zone of user touch cover board, the user indicates to make conductive adhesive layer's electric capacity change as conductive medium, transmission driver chip through the circuit board produces actuating signal after monitoring conductive adhesive layer's electric capacity change, actuating signal transmits to fingerprint sensor through the circuit board, fingerprint sensor starts ultrasonic fingerprint sensing after receiving actuating signal, fingerprint sensor converts the signal of telecommunication into discontinuous ultrasonic signal transmission and goes out, ultrasonic signal pierces through and is reflected back behind the millet of apron contact user finger fingerprint and the spine, because the signal strength of finger millet and spine reflection is inconsistent, fingerprint sensor converts the fingerprint image into according to the signal strength of received different positions and realizes the fingerprint unblock, and awaken the screen after the fingerprint unblock succeeds. The fingerprint of above-mentioned ultrasonic wave fingerprint identification module awakens up and only need start ultrasonic wave fingerprint sensing when user's finger contacts fingerprint induction zone time, need not to continuously launch the ultrasonic wave, and then the consumption that can greatly reduced ultrasonic wave fingerprint identification subassembly.
In one embodiment, the conductive adhesive layer comprises a working area and a connecting area, the fingerprint sensor is attached to the cover plate through the working area, and the connecting area extends and protrudes relative to the fingerprint sensor; one side of the circuit board, which faces the conductive adhesive layer, is provided with a first bare copper area, and the first bare copper area and the connecting area are electrically connected through an electric connector.
Above-mentioned ultrasonic fingerprint identification module sets up electric connector through setting up between the conductive adhesive layer that sets up at the interval and the first naked copper district of circuit board to can realize circuit board and conductive adhesive layer's electricity comparatively conveniently and connect.
In one embodiment, the electrical connector is a conductive double-sided tape, and the conductive double-sided tape is attached between the first bare copper area and the conductive adhesive layer.
Above-mentioned ultrasonic fingerprint identification module is electrically conductive double-sided tape through injecing the electric connector to comparatively convenient and reliable realizes circuit board and conductive adhesive layer's electricity and connects.
In one embodiment, the circuit board includes a board body and at least one lug, the lug protrudes from a side surface of the board body and correspondingly extends to the connection area, and a surface of the at least one lug facing the connection area forms the first bare copper area.
Above-mentioned ultrasonic fingerprint identification module is through setting up the lug on the circuit board to inject the lug and form first naked copper district towards the surface of joining region, with the area in increase first naked copper district, and then make the area of conducting of joining region and circuit board great, can make circuit board and joining region fix together betterly on the one hand, on the other hand can also ensure that the impedance between circuit board and the joining region is less.
In one embodiment, at least one through hole is formed in at least one of the lugs, the through hole penetrates through the lug along the lamination direction of the lug and the conductive adhesive layer, a conductive material is filled in the through hole, and the conductive material extends to the electric connector.
Above-mentioned ultrasonic fingerprint identification module is through setting up the through-hole on the lug to set up conducting material on through-hole and electrically conductive double faced adhesive tape, can improve the connection stability between conducting adhesive layer and the circuit board, the phenomenon that appears conducting adhesive layer and circuit board separation under the high temperature and high humidity environment is avoided.
In one embodiment, a second bare copper area is formed on a side of the bump facing away from the conductive adhesive layer, the via is opened in the second bare copper area, and the conductive material overflows to the second bare copper area.
Above-mentioned ultrasonic fingerprint identification module sets up first naked copper district and second naked copper district through the both sides that back of the body mutually at the lug to inject conducting material and spill over to the naked copper district of second, can ensure that the impedance between circuit board and the conducting glue layer is little enough.
In one embodiment, the ultrasonic fingerprint identification module further comprises a conductive cloth arranged on one side of the circuit board, which is far away from the conductive adhesive layer, and the conductive cloth covers an area, which is opposite to the electric connector, on the circuit board and extends to the conductive adhesive layer on the outer side of the circuit board.
Above-mentioned ultrasonic fingerprint identification module sets up electrically conductive cloth through deviating from conductive adhesive layer one side at the circuit board, prescribes simultaneously that electrically conductive cloth covers on the circuit board just to electric connector's region and extend to conductive adhesive layer on to further reduce the impedance between circuit board and the conductive adhesive layer.
In one embodiment, the ultrasonic fingerprint identification module further comprises an insulating film layer, wherein the insulating film layer is arranged on one side of the conductive cloth, which deviates from the circuit board, and covers the conductive cloth.
Above-mentioned ultrasonic wave fingerprint identification module sets up the insulating film layer that covers electrically conductive cloth through the one side that deviates from the circuit board at electrically conductive cloth, can carry out insulation protection to electrically conductive cloth on the one hand, and on the other hand can compress tightly electrically conductive glue film and circuit board, improves the stability of connecting, prevents to electrically conductive cloth bounce-back.
In one embodiment, the conductive adhesive layer comprises a copper foil, and a first conductive adhesive and a second conductive adhesive which are arranged on the two opposite surfaces of the copper foil, wherein one side of the copper foil is attached to the cover plate through the first conductive adhesive, and the other side of the copper foil is attached to the sensor and the electric connector through the second conductive adhesive.
Above-mentioned ultrasonic fingerprint identification module, the structure through injecing conductive adhesive layer is the copper foil and sets up the first conductive adhesive and the second conductive adhesive on the two surfaces of the back of the body of copper foil mutually, can make more ground ultrasonic waves pass on the one hand, obtains more fingerprint scanning information for the fingerprint identification effect is better, and on the other hand makes the connection between apron and the ultrasonic fingerprint identification subassembly can be reprocessed, improves the product yield greatly, reduce cost.
In one embodiment, the copper foil has a thickness of 4 to 10 μm, and the conductive adhesive has a thickness of 3 to 10 μm.
Above-mentioned ultrasonic fingerprint identification module can guarantee through the thickness of control copper foil and conducting resin that the ultrasonic wave is changeed and is penetrated, can avoid introducing of stacked structure to produce the influence to the thickness of ultrasonic fingerprint identification module simultaneously.
In one embodiment, the fingerprint sensor comprises a substrate, and a conductive circuit, a piezoelectric layer, a conductive layer and a protective layer which are sequentially stacked on the substrate, wherein the substrate is attached to the conductive adhesive layer, the conductive circuit is electrically connected with the circuit board, and the conductive layer is electrically connected with the circuit board.
Above-mentioned ultrasonic fingerprint identification module, through injecing fingerprint sensor's structure to on the basis of attenuate fingerprint sensor thickness, increase ultrasonic wave's penetration ability, be convenient for realize the frivolousization of ultrasonic fingerprint identification subassembly.
In addition, the invention also provides an intelligent terminal which comprises the ultrasonic fingerprint identification module and a shell according to any one of the technical schemes.
Among the above-mentioned intelligent terminal, because the fingerprint of ultrasonic wave fingerprint identification module awakens up and only need start ultrasonic wave fingerprint sensing when user's finger contact fingerprint induction zone, need not to continuously launch the ultrasonic wave, and then the consumption that can greatly reduced ultrasonic wave fingerprint identification subassembly, consequently, the intelligent terminal's that has this ultrasonic wave fingerprint identification module consumption is less.
Drawings
Fig. 1 is a schematic structural diagram of an ultrasonic fingerprint identification module according to the present invention;
FIG. 2 is a schematic structural diagram of a conductive adhesive layer in an ultrasonic fingerprint identification module according to the present invention;
fig. 3 is a schematic front partial structure diagram of an ultrasonic fingerprint identification module according to the present invention;
FIG. 4 is a schematic view of a reverse side partial structure of an ultrasonic fingerprint identification module according to the present invention;
FIG. 5 is a test image of the ultrasonic fingerprint identification module according to the present invention when the conductive adhesive layer has a thickness of sequence number 1;
FIG. 6 shows a test image of the ultrasonic fingerprint identification module according to the present invention when the conductive adhesive layer has a thickness of sequence number 2;
FIG. 7 is a test image of the ultrasonic fingerprint identification module according to the present invention when the conductive adhesive layer has a thickness of sequence number 3;
fig. 8 is a test image of the ultrasonic fingerprint identification module according to the present invention when the conductive adhesive layer has a thickness of sequence number 4.
Reference numerals:
10. an ultrasonic fingerprint identification module;
100. a cover plate; 110. a fingerprint sensing area;
200. an ultrasonic fingerprint identification component; 210. a fingerprint sensor; 211. a substrate; 212. a conductive circuit; 213. a piezoelectric layer; 214. a conductive layer; 215. a protective layer; 220. a circuit board; 221. a first bare copper region; 222. a plate body; 223. a lug; 224. a through hole; 225. a second bare copper region; 230. a driving chip;
300. a conductive adhesive layer; 310. copper foil; 320. a first conductive adhesive; 330. a second conductive adhesive; 300A, a working area; 300B, a connecting region;
400. an electrical connection;
500. a conductive material;
600. a conductive cloth;
700. an insulating film layer.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in an orientation or positional relationship based on the drawings, which are used for convenience of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
The technical scheme provided by the embodiment of the invention is described below by combining the accompanying drawings.
As shown in fig. 1 and 2, the present invention provides an ultrasonic fingerprint identification module 10, wherein the ultrasonic fingerprint identification module 10 can realize the identification of fingerprints under a screen, and comprises a cover plate 100, an ultrasonic fingerprint identification module 200 and a conductive adhesive layer 300. A display component is further arranged between the cover plate 100 and the ultrasonic fingerprint identification component 200 for realizing image display, when the display component is specifically arranged, the cover plate 100 can be made of glass, the thickness of the cover plate can be 450um-800um, the structural form of the cover plate 100 is not limited to the above, and other forms capable of meeting the requirements can be adopted. Conductive adhesive layer 300 sets up between apron 100 and ultrasonic fingerprint identification subassembly 200, and when specifically setting up, ultrasonic fingerprint identification subassembly 200 is located the one side that display element deviates from apron 100, and conductive adhesive layer 300 sets up between display element and ultrasonic fingerprint identification subassembly 200 for connect and bond apron 100 and ultrasonic fingerprint identification subassembly 200, cooperate with ultrasonic fingerprint identification subassembly 200 simultaneously and play the effect that the fingerprint awakened up.
Ultrasonic fingerprint identification subassembly 200 includes fingerprint sensor 210, circuit board 220 and driver chip 230, wherein: the fingerprint sensor 210 is attached to the cover plate 100 through the conductive adhesive layer 300, and when the fingerprint sensor 210 is specifically arranged, the fingerprint sensor is attached to the cover plate through the conductive adhesive layer 300. The circuit board 220 is electrically connected with the fingerprint sensor 210, the driving chip 230 and the conductive adhesive layer 300 respectively; the circuit board 220 may be a flexible circuit board so as to facilitate the layout of the components in the ultrasonic fingerprint identification module 10, and of course, the structural form of the circuit board 220 is not limited thereto, and may also be other forms capable of meeting the requirements. The driving chip 230 is disposed on the circuit board 220, the driving chip 230 is used for monitoring the capacitance of the conductive adhesive layer 300 through the circuit board 220, and the driving chip 230 controls the fingerprint sensor 210 to start ultrasonic fingerprint sensing through the circuit board 220 when monitoring the capacitance change of the conductive adhesive layer 300.
When the user touches the fingerprint sensing area 110 of the cover plate 100, the capacitance of the conductive adhesive layer 300 changes by using a user's finger as a conductive medium, the transmission driving chip 230 of the circuit board 220 monitors the capacitance change of the conductive adhesive layer 300 to generate a start signal, the start signal is transmitted to the fingerprint sensor 210 through the circuit board 220, the fingerprint sensor 210 starts ultrasonic fingerprint sensing after receiving the start signal, the fingerprint sensor 210 converts an electrical signal into a discontinuous ultrasonic signal to be emitted, the ultrasonic signal penetrates through the cover plate 100 to contact the valleys and ridges of the user's finger fingerprint and then is reflected back, because the signal strength reflected by the finger valleys and the ridges is inconsistent, the fingerprint sensor 210 converts the received signal strength of different positions into a fingerprint image to realize fingerprint unlocking, and wakes up the screen after the fingerprint unlocking is successful. Above-mentioned ultrasonic fingerprint identification module 10's fingerprint awakens up and only needs start ultrasonic fingerprint sensing when user's finger contacts fingerprint induction zone 110, need not to continuously transmit the ultrasonic wave, and then can greatly reduced ultrasonic fingerprint identification subassembly 200's consumption.
In order to facilitate the electrical connection between the circuit board 220 and the conductive adhesive layer 300, as shown in fig. 2, in a preferred embodiment, the conductive adhesive layer 300 includes an active area 300A and a connection area 300B, the fingerprint sensor 210 is attached to the cover plate 100 through the active area 300A, and the connection area 300B extends and protrudes relative to the fingerprint sensor 210; the side of the circuit board 220 facing the conductive adhesive layer 300 has a first bare copper area 221, and the first bare copper area 221 and the connection area 300B are electrically connected by an electrical connector 400. In a specific arrangement, the circuit board 220 is disposed at a certain distance from the conductive adhesive layer 300, and a side of the circuit board 220 facing the conductive adhesive layer 300 has a first bare copper region 221, an electrical connector 400 is disposed between the first bare copper region 221 and the conductive adhesive layer 300, one end of the electrical connector 400 is electrically connected to the first bare copper region 221, and the other end of the electrical connector 400 is electrically connected to the connection region 300B.
Above-mentioned ultrasonic fingerprint identification module 10, through being provided with work area 300A with conductive adhesive layer 300, when the user touched fingerprint induction zone 110, the user's finger made work area 300A's electric capacity change as conductive medium, be provided with joining region 300B through conductive adhesive layer 300, set up electric connector 400 between the first naked copper district 221 of conductive adhesive layer 300 and circuit board 220 that the interval set up, first naked copper district 221 and joining region 300B carry out the electricity through electric connector 400 and connect, the electric signal is at joining region 300B, electric connector 400, transmit between circuit board 220, with the electricity that can realize circuit board 220 and conductive adhesive layer 300 comparatively conveniently is connected, and driver chip 230 is used for monitoring the electric capacity of conductive adhesive layer 300 through circuit board 220. In a specific arrangement, the electrical connection between the circuit board 220 and the connection area 300B can be achieved by a single component, an electrical connector 400, cooperating with the first bare copper area 221, to achieve a fixed connection between the circuit board 220 and the connection area 300B, to achieve an electrical connection between the circuit board 220 and the connection area 300B, or to achieve an electrical connection in other ways.
The structure of the electrical connector 400 can be various, and in a preferred embodiment, the electrical connector 400 can be a conductive double-sided tape, and the conductive double-sided tape is attached between the first bare copper area 221 and the conductive adhesive layer 300.
Above-mentioned ultrasonic fingerprint identification module 10 is electrically conductive double-sided tape through injecing electric connector 400, and the glue film of electrically conductive double-sided tape's protection film back both sides of getting rid of laminates with first naked copper district 221 and conductive adhesive layer 300 mutually respectively to realize the electricity of circuit board 220 and conductive adhesive layer 300 more conveniently reliably. In a specific arrangement, the electrical connector 400 may be a conductive double-sided tape, the conductive double-sided tape is attached between the first bare copper area 221 and the conductive adhesive layer 300 to achieve the functions of adhesion and conduction, and the electrical connector 400 may also be in other structural forms, for example, the electrical connector 400 may be a single-sided conductive adhesive material.
The circuit board 220 has a plurality of structural forms, as shown in fig. 2 and fig. 3, in a preferred embodiment, the circuit board 220 includes a board body 222 and at least one lug 223, the number of the lugs 223 may be one, two or more, the lug 223 protrudes from a side surface of the board body 222, the lug 223 correspondingly extends to the connection area 300B, and a surface of the two lugs 223 facing the connection area 300B forms a first bare copper area 221. In a specific arrangement, when the number of the lugs 223 is two, the two lugs 223 are symmetrically arranged on two sides of the plate body 222.
In the ultrasonic fingerprint identification module 10, the lug 223 is arranged on the circuit board 220, and the surface of the lug 223 facing the connection area 300B is limited to form the first bare copper area 221, so as to increase the area of the first bare copper area 221, and further, the conduction area between the connection area 300B and the circuit board 220 is larger, on one hand, the area for fixed connection between the circuit board 220 and the conductive adhesive layer 300 is larger, more conductive double-sided tapes are arranged between the circuit board 220 and the connection area 300B, and further, the adhesion force between the circuit board 220 and the connection area 300B is larger, the circuit board 220 and the connection area 300B can be better fixed together, on the other hand, the conduction area between the connection area 300B and the circuit board 220 is increased, so that the impedance between the circuit board 220 and the connection area 300B is reduced, and the impedance between the circuit board 220 and the conductive adhesive layer 300 is smaller. In a specific arrangement, the circuit board 220 may be in the form of a plate 222 and a protrusion 223, or may be in other forms that can meet the requirement, for example, the circuit board 220 may be in the form of a plate 222 and two protrusions 223, and for example, an end of the circuit board 220 has a cross-shaped structure that is matched with the conductive adhesive layer 300.
In order to improve connection stability, as shown in fig. 2 and 3, specifically, at least one through hole 224 is provided on at least one of the lugs 223, the through hole 224 penetrates the lug 223 along a lamination direction of the lug 223 and the conductive adhesive layer 300, and the through hole 224 is filled with a conductive material 500, and the conductive material 500 extends to the electrical connector 400. When the ultrasonic fingerprint identification module 10 is specifically arranged, the number of the lugs 223 provided with the through holes 224 can be one or two, the number of the through holes 224 on the lugs 223 can be one, two or more, and the specific arrangement positions and the number of the through holes 224 can be determined according to the actual situation of the ultrasonic fingerprint identification module 10.
Above-mentioned ultrasonic fingerprint identification module 10, through set up through-hole 224 on lug 223, and set up conducting material 500 on through-hole 224 and electrically conductive double faced adhesive tape, conducting material 500 in through-hole 224 extends to on electric connector 400, conducting material 500 further fixes lug 223 on electric connector 400, with the stability of being connected between conducting resin layer 300 and circuit board 220 that can improve, and because conducting material 500's stability is better, can avoid the expanding deformation of conducting resin layer 300 and circuit board 220 under the high temperature and high humidity environment to lead to the phenomenon of conducting resin layer 300 and the separation of circuit board 220 to take place, thereby make the stability of being connected between conducting resin layer 300 and the circuit board 220 and the stability of electric conduction all better. In a specific arrangement, the conductive material 500 may be silver paste, or may be other materials capable of meeting the requirements; electrical connector 400 corresponding to via 224 may have a notch to facilitate overflow of conductive material 500, the area of conductive material 500 extending onto electrical connector 400 may be the same as the cross-sectional area of via 224, and the area of conductive material 500 extending onto electrical connector 400 may be slightly larger than the cross-sectional area of via 224. In order to improve the connection stability between the conductive adhesive layer 300 and the circuit board 220, the area of the conductive material 500 extending to the electrical connector 400 may be 1/4, 1/3, 1/2 and 3/4 of the area of the lug 223, the area of the conductive material 500 extending to the electrical connector 400 may be the same as the area of the lug 223, and the area of the conductive material 500 extending to the electrical connector 400 may be slightly larger than the area of the lug 223. In order to avoid the short circuit phenomenon, the conductive material 500 is spaced apart from the plate body 222.
In a preferred embodiment, as shown in fig. 2 and fig. 3, a second bare copper region 225 is formed on a side of the bump 223 away from the conductive adhesive layer 300, the via 224 is opened in the second bare copper region 225, and the conductive material 500 overflows to the second bare copper region 225.
Above-mentioned ultrasonic fingerprint identification module 10 sets up first naked copper district 221 and second naked copper district 225 through the both sides that back on the back at lug 223 for the two-sided naked copper of lug 223, and it overflows to second naked copper district 225 to restrict conducting material 500, so that conducting material 500 communicates second naked copper district 225 and first naked copper district 221, and then make conducting area of conducting resin layer 300 and circuit board 220 great, can ensure that the impedance between circuit board 220 and the conducting resin layer 300 is enough little, and the impedance fluctuation between circuit board 220 and the conducting resin layer 300 is less, impedance stability is better. In a specific arrangement, when one through hole 224 is formed in one lug 223 and the conductive material 500 in the through hole 224 is communicated with the second bare copper region 225 and the first bare copper region 221, the impedance between the circuit board 220 and the conductive adhesive layer 300 can be less than < 1 Ω, and after 240H of a high temperature and high humidity (85 ℃/85% RH) test, the impedance between the circuit board 220 and the conductive adhesive layer 300 is still less than 2 Ω, so that the impedance stability is good.
In order to further reduce the impedance between the circuit board 220 and the conductive adhesive layer 300, as shown in fig. 3, in a preferred embodiment, the ultrasonic fingerprint identification module 10 further includes a conductive cloth 600, the conductive cloth 600 is disposed on a side of the circuit board 220 away from the conductive adhesive layer 300, the conductive cloth 600 covers an area of the circuit board 220 facing the electrical connector 400, and the conductive cloth 600 extends to the conductive adhesive layer 300 outside the circuit board 220.
Above-mentioned ultrasonic fingerprint identification module 10, through deviating from conductive adhesive layer 300 one side at circuit board 220 and setting up conductive cloth 600, inject conductive cloth 600 cover on circuit board 220 just to electric connector 400 the region and extend to the conductive adhesive layer 300 in the circuit board 220 outside simultaneously, conductive cloth 600 can increase the conduction area between conductive adhesive layer 300 and the circuit board 220, with the impedance between further reduction circuit board 220 and conductive adhesive layer 300, can ensure that the impedance between circuit board 220 and the conductive adhesive layer 300 is enough little. In a specific arrangement, the conductive cloth 600 may just cover the two lugs 223 and a portion of the plate body 222 between the lugs 223, the conductive cloth 600 may also cover a portion of the conductive adhesive layer 300 beyond the lugs 223, and the conductive cloth 600 may also just extend to an edge of the conductive adhesive layer 300, and of course, a specific size of the conductive cloth 600 may be determined according to the actual condition of the ultrasonic fingerprint identification module 10.
In order to protect the conductive cloth 600, as shown in fig. 3, in particular, the ultrasonic fingerprint identification module 10 further includes an insulating film layer 700, the insulating film layer 700 is disposed on a side of the conductive cloth 600 away from the circuit board 220, and the insulating film layer 700 covers the conductive cloth 600.
Above-mentioned ultrasonic fingerprint identification module 10, one side through deviating from circuit board 220 at conductive cloth 600 sets up the insulating film layer 700 that covers conductive cloth 600, on the one hand insulating film layer 700 can keep apart conductive cloth 600 and other structures, in order to carry out insulation protection to conductive cloth 600, make electrical insulation between conductive cloth 600 and other structures, on the other hand insulating film layer 700 can compress tightly conductive adhesive layer 300 and circuit board 220, in order to increase the adhesion force between conductive adhesive layer 300 and the circuit board 220, in order to improve the stability of being connected between conductive adhesive layer and the circuit board 220, prevent conductive cloth 600 bounce-back. When the ultrasonic fingerprint identification module 10 is specifically arranged, the insulating film 700 may coincide with the edge of the conductive cloth 600, the insulating film 700 may be slightly larger than the conductive cloth 600, and the specific size of the insulating film 700 may be determined according to the actual condition of the ultrasonic fingerprint identification module 10.
The structure of the conductive adhesive layer 300 has various forms, as shown in fig. 4, in a preferred embodiment, the conductive adhesive layer 300 includes a copper foil 310 and a first conductive adhesive 320 and a second conductive adhesive 330 disposed on opposite surfaces of the copper foil 310, the first conductive adhesive 320 is attached to one side of the copper foil 310 and the cover plate 100 to fix the cover plate 100 to the copper foil 310, and the second conductive adhesive 330 is attached to the other side of the copper foil 310 and the fingerprint sensor 210 and the electrical connector 400 to fix the fingerprint sensor 210 and the electrical connector 400 to the copper foil 310.
Above-mentioned ultrasonic fingerprint identification module 10, be copper foil 310 and set up at the first conductive adhesive 320 and the second conductive adhesive 330 of the two surfaces of carrying on the back of the body of copper foil 310 through the structure of injecing conductive adhesive layer 300, fix apron 100 and ultrasonic fingerprint identification subassembly 200 in an organic whole, because the young modulus of copper foil 310 is higher, up to 110GPa-128 GPa, it pierces through to change the ultrasonic wave more, on the one hand can make the ultrasonic wave that fingerprint sensor 210 sent can see through conductive adhesive layer 300 more, obtain more fingerprint scanning information, and then make more ultrasonic waves enter into the fingerprint induction zone 110 of apron 100, and the ultrasonic wave of following user's finger reflection can see through conductive adhesive layer 300 more and get into fingerprint sensor 210, thereby obtain more fingerprint scanning information, make the fingerprint identification effect better. On the other hand makes the ultrasonic fingerprint identification module 10 that adopts this conductive adhesive layer 300 fixed connection apron 100 and ultrasonic fingerprint identification subassembly 200 to form laminate simple and can do a job again, can demolish when the laminating is bad and laminate again to can change when one of them part goes wrong, avoided a part bad to lead to the condemned condition of ultrasonic fingerprint identification module 10 to take place, improve the product yield, reduce manufacturing cost loss. In a specific arrangement, the conductive adhesive layer 300 may be a laminated structure of a copper foil 310 and two layers of conductive adhesives, and the conductive adhesive layer 300 may also be a structure of a copper foil 310 and one layer of conductive adhesive, and the one layer of conductive adhesive is located between the copper foil 310 and the ultrasonic fingerprint recognition assembly 200.
In order to improve the fingerprint recognition effect, specifically, the thickness of the copper foil 310 may be 4 μm to 10 μm, although the thickness of the copper foil 310 is not limited to the above range, and may be other values that can satisfy the requirement, and the thickness of the conductive adhesive may be 3 μm to 10 μm, and of course, the thickness of the conductive adhesive is not limited to the above range, and may be other values that can satisfy the requirement.
Above-mentioned ultrasonic fingerprint identification module 10, with the thickness control of copper foil 310 in the within range of 4 mu m ~ 10 mu m, the thickness control of electrically conductive adhesive is in the within range of 3 mu m ~ 10 mu m, and the ultrasonic wave is changeed and is penetrated, and fingerprint identification signal intensity is bigger under the screen, and the fingerprint identification effect is better. Meanwhile, the thickness of the copper foil 310 is controlled within the range of 4-10 microns, the thickness of the conductive adhesive is controlled within the range of 3-10 microns, the whole thickness of the ultrasonic fingerprint identification module 10 can be guaranteed to be small, and the influence of the introduction of the conductive adhesive layer 300 on the thickness of the ultrasonic fingerprint identification module 10 is avoided. In a specific arrangement, the thickness of the copper foil 310 is 4 μm to 10 μm, and preferably, the thickness of the copper foil 310 may be 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 10 μm, but the thickness of the copper foil 310 is not limited to the above value, and may be other values within the range of 4 μm to 10 μm. The thickness of the conductive adhesive is 3 μm to 10 μm, and preferably, the thickness of the conductive adhesive may be 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, but the thickness of the conductive adhesive is not limited to the above value, and may be other values within the range of 3 μm to 10 μm. In order to facilitate the setting, the thickness of the conductive adhesive on the two opposite sides of the copper foil 310 can be the same, so that the structure of the conductive adhesive layer 300 has no difference between the front side and the back side, and the cover plate 100 can be directly pasted without considering which side is attached during the assembly, and the whole process is convenient and fast, so that the production efficiency is improved.
Because the ultrasonic fingerprint identification component 200 is attached to the surface of the cover plate through the conductive adhesive layer 300, the surface of the cover plate is provided with the silk-screen printing ink, and the surface of the printing ink is uneven, in order to improve the yield of the attaching process, according to the traditional experience, the thicker the thickness of the conductive adhesive layer 300 is, the better the bubble removal performance is, and the higher the yield of the attaching process is; however, if the thickness of the adhesive material of the conductive adhesive layer 300 is thicker, a large attenuation phenomenon occurs to the transmission of the ultrasonic signal, which results in the imaging of the fingerprint module, so that the conductive adhesive layers 300 with different thicknesses need to be verified, and for convenience of understanding, as shown in table 1, fig. 5, fig. 6, fig. 7, and fig. 8, a plurality of groups of verification comparisons are performed on the relationship between the thickness of each layer in the conductive adhesive layer 300 and the test image.
TABLE 1
As can be seen from table 1, the conductive adhesive layers 300 with the numbers 1 and 2 are attached to the ultrasonic fingerprint identification assembly 200, so that fingerprint imaging is seriously affected, and the images are blurred and do not meet the requirements; the test images of the conductive adhesive layers 300 with serial numbers 3 and 4 are clear after being attached to the ultrasonic fingerprint identification assembly 200, the SNR (signal strength) values meet the standard (the SNR is not less than 4), and there is no obvious difference between the two groups, but in order to improve the yield of the attaching process, a thicker sample of PSA adhesive material is preferably selected so that the bubble removal performance is better, the thickness of the conductive adhesive layer 300 which is currently preferred for mass production is 20, wherein the thickness of the copper foil 310 is 7 μm, and the thicknesses of the first conductive adhesive 320 and the first conductive adhesive 330 are 6 μm.
As shown in fig. 1, in a preferred embodiment, the fingerprint sensor 210 includes a substrate 211, a conductive circuit 212, a piezoelectric layer 213, a conductive layer 214, and a protective layer 215, wherein the conductive circuit 212, the piezoelectric layer 213, the conductive layer 214, and the protective layer 215 are sequentially stacked on the substrate 211, the substrate 211 is attached to the conductive adhesive layer 300, the conductive circuit 212 is electrically connected to the circuit board 220, and the conductive layer 214 is electrically connected to the circuit board 220.
Above-mentioned ultrasonic fingerprint identification module 10, through the structure of injecing fingerprint sensor 210 to the laminating of base plate 211 is on conducting resin layer 300, and after base plate 211 and conducting layer 214 exerted voltage, piezoelectric layer 213 between piezoelectric layer 213 and the base plate 211 upwards and send the ultrasonic wave downwards, with on the basis of attenuate fingerprint sensor 210 thickness, increases the penetrability of ultrasonic wave, is convenient for realize ultrasonic fingerprint identification subassembly 200's frivolousization. When specifically setting up, base plate 211 can be TFT (Thin Film Transistor) substrate, and the TFT substrate is used for receiving the signal of telecommunication of the optional position that the apron corresponds to transmit the signal of telecommunication to piezoelectric layer 213 on, when the thickness of base plate 211 is less than or equal to 110um, the ultrasonic wave can penetrate 450um-800 um's apron, can satisfy the screen fingerprint unblock of most ultrasonic fingerprint identification module 10 on the market. The piezoelectric layer 213 is used for converting electrical signals and mechanical properties into each other, and can emit and receive ultrasonic waves, the conductive layer 214 can be formed by depositing silver particles, and is matched with the substrate 211 to apply voltage to the piezoelectric layer 213, and the protective layer 215 can protect the conductive layer 214 from oxidizing the silver particles in the conductive layer 214.
In addition, the invention also provides an intelligent terminal which comprises the ultrasonic fingerprint identification module 10 and a shell in any one of the technical schemes. The ultrasonic fingerprint identification module 10 can be used for various intelligent terminals, the intelligent terminals can be smart phones, smart bracelets and the like, limitation is not made here, and in the intelligent terminals, the ultrasonic fingerprint identification module 10 is arranged in a shell.
Among the above-mentioned intelligent terminal, because ultrasonic fingerprint identification module 10's fingerprint awakens up and only needs to start ultrasonic fingerprint sensing when user's finger contacts fingerprint induction zone 110, need not to continuously launch the ultrasonic wave, and then can greatly reduced ultrasonic fingerprint identification module 200's consumption, consequently, the intelligent terminal's that has this ultrasonic fingerprint identification module 10 consumption is less.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (12)
1. The utility model provides an ultrasonic fingerprint identification subassembly, its characterized in that is in including apron, ultrasonic fingerprint identification subassembly and setting the apron with conductive adhesive layer between the ultrasonic fingerprint identification subassembly, wherein:
ultrasonic fingerprint identification subassembly includes fingerprint sensor, circuit board and sets up driver chip on the circuit board, fingerprint sensor passes through conductive adhesive layer laminate in the apron, the circuit board respectively with fingerprint sensor driver chip the conductive adhesive layer electricity is connected, driver chip is used for passing through the circuit board control conductive adhesive layer's electric capacity, and pass through when conductive adhesive layer's electric capacity changes circuit board control fingerprint sensor starts ultrasonic fingerprint sensing.
2. The ultrasonic fingerprint identification assembly of claim 1, wherein the conductive adhesive layer comprises a working area and a connecting area, the fingerprint sensor is attached to the cover plate through the working area, and the connecting area extends and protrudes relative to the fingerprint sensor; one side of the circuit board, which faces the conductive adhesive layer, is provided with a first bare copper area, and the first bare copper area and the connecting area are electrically connected through an electric connector.
3. The ultrasonic fingerprint identification assembly of claim 2, wherein the electrical connection is a conductive double-sided tape attached between the first bare copper area and the conductive adhesive layer.
4. The ultrasonic fingerprint identification assembly of claim 2, wherein the circuit board comprises a board body and at least one lug protruding from a side surface of the board body and extending to the connection area, wherein a surface of the at least one lug facing the connection area forms the first bare copper area.
5. The ultrasonic fingerprint identification assembly of claim 4, wherein at least one of the lugs is provided with at least one through hole, the through hole penetrates through the lug along a lamination direction of the lug and the conductive adhesive layer, and the through hole is filled with a conductive material, and the conductive material extends to the electric connector.
6. The ultrasonic fingerprint identification assembly of claim 5, wherein a second bare copper area is formed on a side of the lug facing away from the conductive adhesive layer, the via opening is formed in the second bare copper area, and the conductive material overflows to the second bare copper area.
7. The ultrasonic fingerprint identification assembly of claim 5, further comprising a conductive cloth disposed on a side of the circuit board facing away from the conductive adhesive layer, wherein the conductive cloth covers an area of the circuit board facing the electrical connector and extends onto the conductive adhesive layer outside the circuit board.
8. The ultrasonic fingerprint identification assembly of claim 7, further comprising an insulating film layer disposed on a side of the conductive cloth facing away from the circuit board and covering the conductive cloth.
9. The ultrasonic fingerprint identification assembly of claim 1, wherein the conductive adhesive layer comprises a copper foil and a first conductive adhesive and a second conductive adhesive disposed on opposite surfaces of the copper foil, one side of the copper foil is attached to the cover plate by the first conductive adhesive, and the other side of the copper foil is attached to the sensor and the electrical connector by the second conductive adhesive.
10. The ultrasonic fingerprint identification assembly of claim 9, wherein the copper foil has a thickness of 4 μm to 10 μm, and the conductive adhesive has a thickness of 3 μm to 10 μm.
11. The ultrasonic fingerprint identification assembly of claim 1, wherein the fingerprint sensor comprises a substrate, and a conductive circuit, a piezoelectric layer, a conductive layer and a protective layer sequentially stacked on the substrate, wherein the substrate is attached to the conductive adhesive layer, the conductive circuit is electrically connected with the circuit board, and the conductive layer is electrically connected with the circuit board.
12. An intelligent terminal, characterized in that it comprises an ultrasonic fingerprint identification component according to any one of claims 1 to 11.
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| CN202110498744.0A CN113177492A (en) | 2021-05-08 | 2021-05-08 | Ultrasonic fingerprint identification assembly and intelligent terminal |
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| CN202110498744.0A CN113177492A (en) | 2021-05-08 | 2021-05-08 | Ultrasonic fingerprint identification assembly and intelligent terminal |
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