CN113175785A - Liquid cooling circulation cold and hot dual-purpose container - Google Patents
Liquid cooling circulation cold and hot dual-purpose container Download PDFInfo
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- CN113175785A CN113175785A CN202110479213.7A CN202110479213A CN113175785A CN 113175785 A CN113175785 A CN 113175785A CN 202110479213 A CN202110479213 A CN 202110479213A CN 113175785 A CN113175785 A CN 113175785A
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- hot
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- cold side
- heat exchanger
- spiral pipe
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D31/00—Other cooling or freezing apparatus
- F25D31/005—Combined cooling and heating devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention relates to the technical field of cold and hot double-purpose containers, in particular to a liquid-cooling circulation cold and hot double-purpose container which comprises a shell, a hot side inner container and a cold side inner container, wherein the hot side inner container and the cold side inner container are fixed in the shell; semiconductor refrigeration piece during operation, the hot side working medium passes through the hot side circulating pump and circulates between hot side heat exchanger and hot side spiral pipe and flows, with this even transmission of heat to the heat preservation chamber that is carried the hot side working medium by the hot side spiral pipe, the cold side working medium passes through the cold side circulating pump and circulates between cold side heat exchanger and cold side spiral pipe and flows, with this even transmission of cold volume that is carried the cold side working medium by the cold side spiral pipe to the refrigeration chamber, can not produce local overheat in the heat preservation chamber, the refrigeration chamber can not produce local supercooling yet, thereby realize cold and hot two operating modes and use, and temperature distribution is even, heat exchange efficiency is high.
Description
Technical Field
The invention relates to the technical field of cold and hot dual-purpose containers, in particular to a liquid cooling circulation cold and hot dual-purpose container.
Background
The semiconductor refrigerating sheet has two effects of refrigeration and heating after being electrified, and a plurality of household electrical appliances are developed according to the characteristic of double effects of cold and heat. For example, a household cold water drinking machine, a dual-purpose heat preservation tableware, and the like.
Although many semiconductor cooling and heating products have appeared, the prior art still faces many drawbacks;
for example, a semiconductor cold and warm water cup disclosed in chinese patent application No. CN03139973.8 only allows two functions of cold and heat to operate in a single working condition, and it uses air to bring the cold or heat generated by the cooling fins to the articles in the container cavity, although the temperature in the container may be uniformly distributed, the heat exchange efficiency is extremely low, the cooling and heating effects are poor, and the semiconductor cold and warm water cup has a complex structure and is not suitable for many occasions with large volume;
the semiconductor multifunctional cold-hot food all-in-one machine disclosed in the chinese patent with the application number CN201811504279.1 utilizes a water-cooled heat exchanger, but it is not used for transferring the heat of the semiconductor to the article to be heated, but only for dissipating the heat, and the temperature distribution in the container is not uniform, and in addition, it can only provide the operation of cold-hot single working condition;
the chinese patent with application number CN201822115192.7 discloses a high-power high-temperature semiconductor cold and hot thermos flask, which only replaces the heating device of the traditional electric kettle with a semiconductor wafer capable of refrigerating and heating to realize the functions of heating water and cooling water under single working condition.
In summary, the small-sized household electrical appliance adopting semiconductor refrigeration and heating in the prior art has the following defects: firstly, the cold and hot functions cannot be realized at the same time, which causes the waste of electric energy; secondly, the temperature distribution in the container is not uniform, and local supercooling or overheating is easy to occur; thirdly, the heat exchange efficiency is low, and the refrigerating and heating speed is low; fourth, the structural design is not reasonable, and the volume is too large due to the redundancy of the auxiliary heat dissipation components.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: in order to solve the defects in the prior art, a liquid cooling circulation cold and hot dual-purpose container is provided.
The technical scheme adopted by the invention for solving the technical problems is as follows: a liquid cooling circulation cold and hot dual-purpose container comprises a shell, a hot side inner container and a cold side inner container, wherein the hot side inner container and the cold side inner container are fixed in the shell, a heat preservation cavity with an upward opening is formed in the hot side inner container, a hot side cavity cover is covered at the opening at the upper end of the heat preservation cavity, a refrigeration cavity with an upward opening is formed in the cold side inner container, a cold side cavity cover is covered at the opening at the upper end of the refrigeration cavity, and a semiconductor refrigeration piece is arranged between the hot side inner container and the cold side inner container;
the hot end of the semiconductor refrigeration piece is attached with a hot side heat exchanger with a hot side working medium inside, a hot side spiral pipe is wound on the inner peripheral wall of the heat preservation cavity, an upper end outlet of the hot side heat exchanger is communicated with an upper end inlet of the hot side spiral pipe, a lower end outlet of the hot side spiral pipe is communicated with a lower end inlet of the hot side heat exchanger through a hot side pipeline, and a hot side circulating pump is arranged on the hot side pipeline;
the cold junction laminating of semiconductor refrigeration piece has the inside cold side heat exchanger that has the cold side working medium, around being equipped with the cold side spiral pipe on the internal perisporium in refrigeration chamber, the upper end import of cold side heat exchanger and the upper end export intercommunication of cold side spiral pipe, the lower extreme import of cold side spiral pipe passes through the lower extreme export intercommunication of cold side pipeline and cold side heat exchanger, be provided with the cold side circulating pump on the cold side pipeline.
Semiconductor refrigeration piece during operation in this scheme, the hot side working medium passes through the hot side circulating pump and circulates between hot side heat exchanger and hot side spiral pipe and flows, with this even transmission of heat to the heat preservation chamber that is carried the hot side working medium by the hot side spiral pipe, the cold side working medium passes through the cold side circulating pump and circulates between cold side heat exchanger and cold side spiral pipe and flows, with this even transmission of cold volume to the refrigeration chamber that the cold side working medium carried by the cold side spiral pipe, can not produce local overheat in the heat preservation chamber, scald one's hand when preventing to take article, the refrigeration chamber can not produce local supercooling yet and separate out the moisture condensation in the air and lead to out water and freezing problem, thereby realize cold and hot double duty and use, and temperature distribution is even, and heat exchange efficiency is high.
Furthermore, the hot side inner container and the hot end of the semiconductor refrigeration piece are located on the same side, and the cold side inner container and the cold end of the semiconductor refrigeration piece are located on the same side.
Furthermore, the inner peripheral wall of the shell, the outer peripheral wall of the hot-side inner container and the outer peripheral wall of the cold-side inner container are not in contact with each other, heat insulation layers are arranged among the inner peripheral wall of the shell, the outer peripheral wall of the hot-side inner container and the outer peripheral wall of the cold-side inner container, and the semiconductor refrigeration sheet, the hot-side heat exchanger and the cold-side heat exchanger are all located in the heat insulation layers; thereby prevent that the heat direct transfer of hot side heat exchanger from to the heat preservation chamber, make the even transmission of heat to the heat preservation intracavity, avoid the heat preservation chamber local overheated situation to appear, equally, prevent that the heat direct transfer of cold side heat exchanger from to the refrigeration chamber, make the even transmission of heat to the refrigeration intracavity, avoid the refrigeration chamber local supercooled situation to appear, and overall structure is compact.
Furthermore, the heat insulation layer is made of polyurethane foam.
Furthermore, a sealing cover is fixed at the bottom of the shell, an installation cavity is formed between the heat insulation layer and the sealing cover, through holes communicated with the outside are formed in two ends of the installation cavity, and the hot-side circulating pump and the cold-side circulating pump are both located in the installation cavity; the heat generated by the hot side circulating pump and the cold side circulating pump can be dissipated to the outside air from the through holes in a natural convection mode.
Furthermore, the shell, the hot side liner and the cold side liner are integrally formed.
The invention has the beneficial effects that: when the semiconductor refrigerating sheet of the liquid cooling circulation cold and hot dual-purpose container works, a hot side working medium circularly flows between the hot side heat exchanger and the hot side spiral pipe through the hot side circulating pump, so that heat carried by the hot side working medium is uniformly transferred to the heat preservation cavity through the hot side spiral pipe, a cold side working medium circularly flows between the cold side heat exchanger and the cold side spiral pipe through the cold side circulating pump, so that cold carried by the cold side working medium is uniformly transferred to the refrigerating cavity through the cold side spiral pipe, local overheating cannot occur in the heat preservation cavity, hands are prevented from being scalded when articles are taken, the refrigerating cavity cannot generate local supercooling, moisture in air is condensed and separated out to cause water outlet and icing problems, and therefore the cold and hot dual-working condition use is realized, the temperature distribution is uniform, and the heat exchange efficiency is high.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic cross-sectional view of a liquid-cooled circulating cold and hot dual-purpose container according to the present invention;
FIG. 2 is a schematic cross-sectional view of a liquid-cooled cyclic cold and hot dual-use container of the present invention.
In the figure: 1. the refrigerator comprises a shell, 101, a hot-side inner container, 1011, a heat preservation cavity, 102, a cold-side inner container, 1021, a refrigeration cavity, 103 and a through hole;
2. hot side chamber lid, 3, cold side chamber lid, 4, semiconductor refrigeration piece, 5, hot side heat exchanger, 6, hot side spiral pipe, 7, hot side pipeline, 8, hot side circulating pump, 9, cold side heat exchanger, 10, cold side spiral pipe, 11, cold side circulating pump, 12, insulating layer, 13, closing cap, 14, installation cavity, 15, cold side pipeline.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic diagrams illustrating the basic structure of the present invention only in a schematic manner, and thus show only the constitution related to the present invention, and directions and references (e.g., upper, lower, left, right, etc.) may be used only to help the description of the features in the drawings. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the claimed subject matter is defined only by the appended claims and equivalents thereof.
Example 1
As shown in fig. 1 and 2, a liquid cooling circulation cooling and heating dual-purpose container includes a housing 1, and a hot side inner container 101 and a cold side inner container 102 fixed in the housing 1, wherein a heat preservation cavity 1011 with an upward opening is formed in the hot side inner container 101, a hot side cavity cover 2 is covered at an opening at the upper end of the heat preservation cavity 1011, a refrigeration cavity 1021 with an upward opening is formed in the cold side inner container 102, a cold side cavity cover 3 is covered at an opening at the upper end of the refrigeration cavity 1021, and a semiconductor refrigeration sheet 4 is arranged between the hot side inner container 101 and the cold side inner container 102;
a hot-side heat exchanger 5 with a hot-side working medium inside is attached to the hot end of the semiconductor refrigeration sheet 4, a hot-side spiral pipe 6 is wound on the inner peripheral wall of the heat preservation cavity 1011, an upper-end outlet of the hot-side heat exchanger 5 is communicated with an upper-end inlet of the hot-side spiral pipe 6, a lower-end outlet of the hot-side spiral pipe 6 is communicated with a lower-end inlet of the hot-side heat exchanger 5 through a hot-side pipeline 7, and a hot-side circulating pump 8 is arranged on the hot-;
the cold junction laminating of semiconductor refrigeration piece 4 has inside cold side heat exchanger 9 that has the cold side working medium, around being equipped with cold side spiral pipe 10 on the internal perisporium of refrigeration chamber 1021, the upper end import of cold side heat exchanger 9 and the upper end export intercommunication of cold side spiral pipe 10, the lower extreme import of cold side spiral pipe 10 passes through the lower extreme export intercommunication of cold side pipeline 15 and cold side heat exchanger 9, be provided with cold side circulating pump 11 on the cold side pipeline 15.
The hot side liner 101 and the hot end of the semiconductor refrigeration piece 4 are located on the same side, and the cold side liner 102 and the cold end of the semiconductor refrigeration piece 4 are located on the same side.
The inner peripheral wall of the shell 1, the outer peripheral wall of the hot-side inner container 101 and the outer peripheral wall of the cold-side inner container 102 are not in contact with each other, a heat insulation layer 12 is arranged between the inner peripheral wall of the shell 1, the outer peripheral wall of the hot-side inner container 101 and the outer peripheral wall of the cold-side inner container 102, and the semiconductor refrigeration sheet 4, the hot-side heat exchanger 5 and the cold-side heat exchanger 9 are all located in the heat insulation layer 12; thereby prevent that the heat direct transfer of hot side heat exchanger 5 from to heat preservation chamber 1011, make the even transfer of heat to heat preservation chamber 1011 in, avoid heat preservation chamber 1011 to appear local overheated situation, equally, prevent that the heat direct transfer of cold side heat exchanger 9 from to refrigerating chamber 1021, make the even transfer of heat to refrigerating chamber 1021 in, avoid refrigerating chamber 1021 to appear the situation of local subcooling, and overall structure is compact.
The heat insulation layer 12 is made of polyurethane foam.
A sealing cover 13 is fixed at the bottom of the shell 1, an installation cavity 14 is formed between the heat insulation layer 12 and the sealing cover 13, through holes 103 communicated with the outside are formed at two ends of the installation cavity 14, and the hot-side circulating pump 8 and the cold-side circulating pump 11 are both positioned in the installation cavity 14; so that the heat generated by the hot-side circulation pump 8 and the cold-side circulation pump 11 can be dissipated from the through-holes 103 to the outside air by natural convection.
The shell 1, the hot side liner 101 and the cold side liner 102 are integrally formed.
In the embodiment, the shell 1 is made of stainless steel; the working medium at the hot side adopts purified water circulation; a working medium at the cold side is used for preventing freezing under special conditions, and ethylene glycol antifreeze solution is adopted for circulation;
liquid cooling circulation:
in order to reduce the power consumption of the circulating pump, the flow of the liquid conforms to the basic principle of heat, cold and cold reduction as much as possible; therefore, the working medium at the hot side moves upwards after being heated by the heat exchanger 5 at the hot side; the cold side working medium moves downwards after being subjected to cold exchange of the cold side heat exchanger 9;
the working principle of the liquid cooling circulation cold and hot dual-purpose container in the embodiment is as follows:
the semiconductor refrigerating sheet 4, the hot side circulating pump 8 and the cold side circulating pump 11 work simultaneously;
a hot-side working medium in the hot-side heat exchanger 5 absorbs heat at the hot end of the semiconductor refrigerating sheet 4, then enters the hot-side spiral pipe 6 from an upper-end outlet of the hot-side heat exchanger 5 through an upper-end inlet of the hot-side spiral pipe 6, so that the heat carried by the hot-side working medium is uniformly transferred to the heat preservation cavity 1011 by the hot-side spiral pipe 6, and then the hot-side working medium in the hot-side spiral pipe 6 reaches a hot-side pipeline 7 from a lower-end outlet of the hot-side spiral pipe 6 and is pumped to the hot-side heat exchanger 5 through a hot-side circulating pump 8;
the cold side working medium in the cold side heat exchanger 9 absorbs cold energy of the cold end of the semiconductor refrigerating sheet 4, then reaches the cold side pipeline 15 from the lower end outlet of the cold side heat exchanger 9, and is pumped into the cold side spiral pipe 10 through the cold side circulating pump 11, so that the cold energy carried by the cold side working medium is uniformly transmitted to the refrigerating chamber 1021 by the cold side spiral pipe 10, and then the cold side working medium of the cold side spiral pipe 10 returns to the cold side heat exchanger 9 from the upper end outlet of the cold side spiral pipe 10.
Can not produce local overheat in the heat preservation chamber 1011 in this embodiment, scald one's hand when preventing to take article, refrigeration chamber 1021 also can not produce local supercooling and separate out the moisture condensation in the air and lead to out water and icing problem to realize cold and hot double-duty use, and temperature distribution is even, and heat exchange efficiency is high.
In light of the foregoing description of the preferred embodiment of the present invention, it is to be understood that numerous changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (6)
1. A cold and hot double-purpose container of liquid cooling circulation which characterized in that: the refrigerator comprises a shell (1), and a hot side inner container (101) and a cold side inner container (102) which are fixed in the shell (1), wherein a heat preservation cavity (1011) with an upward opening is formed in the hot side inner container (101), a hot side cavity cover (2) is arranged at an opening at the upper end of the heat preservation cavity (1011) in a covering manner, a refrigeration cavity (1021) with an upward opening is formed in the cold side inner container (102), a cold side cavity cover (3) is arranged at an opening at the upper end of the refrigeration cavity (1021) in a covering manner, and a semiconductor refrigeration sheet (4) is arranged between the hot side inner container (101) and the cold side inner container (102);
a hot-side heat exchanger (5) with a hot-side working medium inside is attached to the hot end of the semiconductor refrigeration sheet (4), a hot-side spiral pipe (6) is wound on the inner peripheral wall of the heat preservation cavity (1011), an upper end outlet of the hot-side heat exchanger (5) is communicated with an upper end inlet of the hot-side spiral pipe (6), a lower end outlet of the hot-side spiral pipe (6) is communicated with a lower end inlet of the hot-side heat exchanger (5) through a hot-side pipeline (7), and a hot-side circulating pump (8) is arranged on the hot-side pipeline (7);
the cold junction laminating of semiconductor refrigeration piece (4) has inside cold side heat exchanger (9) that has the cold side working medium, around being equipped with cold side spiral pipe (10) on the internal perisporium in refrigeration chamber (1021), the upper end import of cold side heat exchanger (9) and the upper end export intercommunication of cold side spiral pipe (10), the lower extreme import of cold side spiral pipe (10) is through the lower extreme export intercommunication of cold side pipeline (15) and cold side heat exchanger (9), be provided with cold side circulating pump (11) on cold side pipeline (15).
2. The liquid-cooled cycle cold and hot dual-purpose container according to claim 1, wherein: the hot side inner container (101) and the hot end of the semiconductor refrigerating sheet (4) are located on the same side, and the cold side inner container (102) and the cold end of the semiconductor refrigerating sheet (4) are located on the same side.
3. The liquid-cooled cycle cold and hot dual-purpose container according to claim 2, wherein: the utility model discloses a semiconductor refrigeration piece, including shell (1), semiconductor refrigeration piece (4), hot side heat exchanger (5) and cold side heat exchanger (9), the internal perisporium of shell (1), the periphery wall of hot side inner bag (101) and the periphery wall of cold side inner bag (102) do not contact each other, and be equipped with insulating layer (12) between the internal perisporium of shell (1), the periphery wall of hot side inner bag (101) and the periphery wall of cold side inner bag (102), semiconductor refrigeration piece (4), hot side heat exchanger (5) and cold side heat exchanger (9) are all located insulating layer (12).
4. The liquid-cooled cycle cold and hot dual-purpose container according to claim 3, wherein: the heat insulation layer (12) is made of polyurethane foam.
5. The liquid-cooled cycle cold and hot dual-purpose container according to claim 3, wherein: the bottom of shell (1) is fixed with closing cap (13), form installation cavity (14) between insulating layer (12) and closing cap (13), through-hole (103) with external intercommunication are seted up to the both ends utensil of installation cavity (14), hot side circulating pump (8) and cold side circulating pump (11) all are located installation cavity (14).
6. The liquid-cooled cycle cold and hot dual-purpose container according to claim 1, wherein: the shell (1), the hot side liner (101) and the cold side liner (102) are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110479213.7A CN113175785A (en) | 2021-04-30 | 2021-04-30 | Liquid cooling circulation cold and hot dual-purpose container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110479213.7A CN113175785A (en) | 2021-04-30 | 2021-04-30 | Liquid cooling circulation cold and hot dual-purpose container |
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| Publication Number | Publication Date |
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| CN113175785A true CN113175785A (en) | 2021-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110479213.7A Pending CN113175785A (en) | 2021-04-30 | 2021-04-30 | Liquid cooling circulation cold and hot dual-purpose container |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115235143A (en) * | 2022-08-18 | 2022-10-25 | 世生万物(深圳)科技有限公司 | Utmost point ice utmost point hot body test system |
| CN115468377A (en) * | 2022-09-15 | 2022-12-13 | 洛阳大生新能源开发有限公司 | Cooling device is used in electrolyte preparation |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115235143A (en) * | 2022-08-18 | 2022-10-25 | 世生万物(深圳)科技有限公司 | Utmost point ice utmost point hot body test system |
| CN115468377A (en) * | 2022-09-15 | 2022-12-13 | 洛阳大生新能源开发有限公司 | Cooling device is used in electrolyte preparation |
| CN115468377B (en) * | 2022-09-15 | 2023-08-29 | 洛阳大生新能源开发有限公司 | Cooling device for electrolyte preparation |
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