CN113169076A - 电子器件及其制作方法 - Google Patents

电子器件及其制作方法 Download PDF

Info

Publication number
CN113169076A
CN113169076A CN201880097629.9A CN201880097629A CN113169076A CN 113169076 A CN113169076 A CN 113169076A CN 201880097629 A CN201880097629 A CN 201880097629A CN 113169076 A CN113169076 A CN 113169076A
Authority
CN
China
Prior art keywords
elastic layer
rigid substrate
electronic device
laser
functional units
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880097629.9A
Other languages
English (en)
Inventor
袁泽
康佳昊
魏鹏
管曦萌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Royole Technologies Co Ltd
Original Assignee
Shenzhen Royole Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Publication of CN113169076A publication Critical patent/CN113169076A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种电子器件及其制作方法。所述电子器件的制作方法包括如下步骤：提供刚性基板(10)(S101)；在所述刚性基板(10)上设置待剥离的电子器件(1)，所述电子器件(1)包括间隔排列的若干功能单元(20)和包覆若干所述功能单元(20)的弹性层(30)(S103)；以及进行离型处理，以使若干所述功能单元(20)与所述弹性层(30)一同从所述刚性基板(10)上分离(S105)。该电子器件的制作方法，可与现有的半导体、显示面板等制造技术兼容，提高了生产效率。

Description

PCT国内申请，说明书已公开。

Claims (20)

  1. PCT国内申请，权利要求书已公开。
CN201880097629.9A 2018-12-24 2018-12-24 电子器件及其制作方法 Pending CN113169076A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/123097 WO2020132801A1 (zh) 2018-12-24 2018-12-24 电子器件及其制作方法

Publications (1)

Publication Number Publication Date
CN113169076A true CN113169076A (zh) 2021-07-23

Family

ID=71127525

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880097629.9A Pending CN113169076A (zh) 2018-12-24 2018-12-24 电子器件及其制作方法

Country Status (2)

Country Link
CN (1) CN113169076A (zh)
WO (1) WO2020132801A1 (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1797728A (zh) * 2004-12-30 2006-07-05 育霈科技股份有限公司 晶圆级芯片尺寸封装的填胶结构及其方法
CN101996892A (zh) * 2009-08-17 2011-03-30 晶元光电股份有限公司 ***级光电结构及其制作方法
CN102097341A (zh) * 2009-12-10 2011-06-15 日东电工株式会社 半导体器件的制造方法
CN106449711A (zh) * 2016-10-24 2017-02-22 武汉华星光电技术有限公司 柔性amoled显示器的制作方法
CN106711355A (zh) * 2016-12-20 2017-05-24 武汉华星光电技术有限公司 柔性oled显示面板的制作方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6794273B2 (en) * 2002-05-24 2004-09-21 Fujitsu Limited Semiconductor device and manufacturing method thereof
JP2013084889A (ja) * 2011-09-30 2013-05-09 Toshiba Corp 半導体発光装置及びその製造方法
JP5937398B2 (ja) * 2012-03-26 2016-06-22 株式会社巴川製紙所 半導体装置製造用接着シート及び半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1797728A (zh) * 2004-12-30 2006-07-05 育霈科技股份有限公司 晶圆级芯片尺寸封装的填胶结构及其方法
CN101996892A (zh) * 2009-08-17 2011-03-30 晶元光电股份有限公司 ***级光电结构及其制作方法
CN102097341A (zh) * 2009-12-10 2011-06-15 日东电工株式会社 半导体器件的制造方法
CN106449711A (zh) * 2016-10-24 2017-02-22 武汉华星光电技术有限公司 柔性amoled显示器的制作方法
CN106711355A (zh) * 2016-12-20 2017-05-24 武汉华星光电技术有限公司 柔性oled显示面板的制作方法

Also Published As

Publication number Publication date
WO2020132801A1 (zh) 2020-07-02

Similar Documents

Publication Publication Date Title
KR102042137B1 (ko) 전자장치 및 그 제조 방법
KR101618157B1 (ko) 표시 장치 및 이의 제조 방법
CA2772110C (en) Thin-sheet glass substrate laminate and method of manufacturing the same
KR102017369B1 (ko) 가요성 터치 센서를 갖는 터치 패널 및 그 제조 방법
US8932804B1 (en) Method for patterning flexible substrate
US20140218872A1 (en) Electronic circuit and method of fabricating the same
CN104716081B (zh) 柔性装置及其制作方法
US20170004343A1 (en) Touch Panel with Fingerprint Identification Function and Method for Fabricating the Same
CN107797697B (zh) 柔性显示装置
KR20120050169A (ko) 터치패널 및 그 제조방법
CN102637575B (zh) 元件基板的制造方法
US20150253901A1 (en) Manufacturing method for single-sided multi-layer circuit pattern for touch panel
TW201535182A (zh) 可撓性元件與製作其之方法
KR20180060205A (ko) 가요성 표시장치를 지지하기 위한 가요성 표시장치 지지체 및 그의 제조방법
TWI464838B (zh) 觸控面板的製造方法
US9030447B2 (en) Surface acoustic wave touch panel and manufacturing method thereof
TWI550459B (zh) 觸控顯示裝置及其製造方法
CN113169076A (zh) 电子器件及其制作方法
KR102211774B1 (ko) 터치 스크린 패널의 제조 방법 및 이에 따라 제조된 터치 스크린 패널
CN113169033A (zh) 电子器件及其制作方法
CN110783253B (zh) 一种显示基板的制作方法、显示基板和显示装置
US20150243925A1 (en) Organic light-emitting diode device
JP7110189B2 (ja) 電子素子の遅延ビア形成
US11966546B2 (en) Display device, fabrication method of display device, and fabrication method of light guide touch module
KR20150081568A (ko) 터치센서 모듈 및 그 제조방법

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20210723

WD01 Invention patent application deemed withdrawn after publication